CN113178403B - Wafer film attaching device and film attaching method - Google Patents
Wafer film attaching device and film attaching method Download PDFInfo
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- CN113178403B CN113178403B CN202110270908.4A CN202110270908A CN113178403B CN 113178403 B CN113178403 B CN 113178403B CN 202110270908 A CN202110270908 A CN 202110270908A CN 113178403 B CN113178403 B CN 113178403B
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- 238000000034 method Methods 0.000 title claims abstract description 23
- 239000007921 spray Substances 0.000 claims abstract description 46
- 230000007246 mechanism Effects 0.000 claims abstract description 29
- 230000001154 acute effect Effects 0.000 claims abstract description 4
- 235000012431 wafers Nutrition 0.000 claims description 127
- 238000010030 laminating Methods 0.000 claims description 32
- 238000005507 spraying Methods 0.000 claims description 8
- 230000001105 regulatory effect Effects 0.000 claims description 7
- 238000007664 blowing Methods 0.000 claims description 4
- 230000008602 contraction Effects 0.000 claims description 3
- 238000004891 communication Methods 0.000 claims description 2
- 230000008569 process Effects 0.000 description 8
- 238000003475 lamination Methods 0.000 description 7
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000003750 conditioning effect Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- JBRZTFJDHDCESZ-UHFFFAOYSA-N AsGa Chemical compound [As]#[Ga] JBRZTFJDHDCESZ-UHFFFAOYSA-N 0.000 description 1
- 229910002601 GaN Inorganic materials 0.000 description 1
- 229910001218 Gallium arsenide Inorganic materials 0.000 description 1
- JMASRVWKEDWRBT-UHFFFAOYSA-N Gallium nitride Chemical compound [Ga]#N JMASRVWKEDWRBT-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013467 fragmentation Methods 0.000 description 1
- 238000006062 fragmentation reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 238000013519 translation Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67132—Apparatus for placing on an insulating substrate, e.g. tape
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The wafer film pasting device comprises a placing table used for placing a wafer, a conveying unit used for conveying a pasting film to the upper side of the wafer, and a film pasting unit, wherein the film pasting unit comprises a lifting mechanism and a spray valve arranged on the lifting mechanism, the spray valve is located above the pasting film, the lifting mechanism can drive the spray valve to be close to and far away from the wafer, the spray valve comprises a first air outlet and a second air outlet, the air outlet direction of the first air outlet is coincident with the axis, the second air outlet is arranged around the periphery of the first air outlet, an included angle alpha is formed between the air outlet direction of the second air outlet and the axis, and the included angle alpha is an acute angle. According to the invention, the first air outlet can spray linear air flow to the center of the wafer, the second air outlet can spray annular air flow around the center of the circle, and when the lifting mechanism is gradually lifted, the radius of the annular air flow is gradually enlarged, so that the bonding film is bonded with the wafer in a way that the circle of the wafer gradually diffuses to the circumferential direction from the center of the circle, the wafer bonding film with a complex structure is satisfied, the tension is uniform after the bonding film is bonded, and the follow-up process steps are facilitated.
Description
[ Field of technology ]
The invention relates to the technical field of wafer film sticking, in particular to wafer film sticking equipment and a film sticking method.
[ Background Art ]
In the processing process of the wafer, a film is required to be adhered on one surface of the wafer with the circuit structure so as to protect the circuit structure. In the prior art, a film sticking machine is generally used for sticking films to wafers, and a roller pressing or a spray valve pressing mode is mainly used for sticking the sticking films to the wafers.
When a roller is used as a carrier for film pasting, a specific pattern exists on the surface of a wafer to be film-pasted or a multilayer structure exists, the roller is difficult to completely cover the concave surface due to the concave surface, so that bubbles are easy to generate between a pasting film and the wafer to cause poor pasting compactness, and partial stress is generated when the roller is pressed on the wafer, so that the wafer is damaged. In addition, in the film pasting process, there are forward stress and tangential stress along the running direction of the roller, and uneven stress can cause the increase of the warping degree of the wafer, especially for the thinned wafer, the subsequent pasting of the thinned wafer can cause the breakage or fragmentation of the wafer.
When the spray valve is used as a carrier for film pasting, the spray valve can blow out air flow perpendicular to the surface of the film so as to paste the film on the wafer. The air flow pressurizing mode is adopted to laminate the surface of the wafer depression, but in the actual working process, the spray valve moves from one side of the wafer to the other side in a translation mode, so that in the membrane laminating process, the tension is uneven, and bubbles are still generated with larger probability.
Accordingly, there is a need for an improvement over the prior art to overcome the deficiencies described in the prior art.
[ Invention ]
The invention aims to provide wafer film sticking equipment which is used for sticking films to wafers in an airflow pressure mode and has uniform tension in the sticking process.
The wafer film pasting device comprises a placing table, a conveying unit and a film pasting unit, wherein the placing table is used for placing a wafer, the wafer is provided with an axis, the conveying unit is used for conveying a pasting film to the upper side of the wafer, the film pasting unit comprises a lifting mechanism and a spray valve arranged on the lifting mechanism, the spray valve is located above the pasting film and can be driven by the lifting mechanism to be close to and far away from the wafer, the spray valve comprises a first air outlet and a second air outlet, the air outlet is used for spraying air flow to the wafer, the air outlet direction of the first air outlet coincides with the axis, the second air outlet is arranged around the periphery of the first air outlet, the air outlet direction of the second air outlet forms an included angle alpha with the axis, and the included angle alpha is an acute angle.
Further, the spray valve comprises a valve body and a piston cylinder arranged in the valve body, a first air passage is formed in the piston cylinder, a second air passage is formed between the valve body and the piston cylinder, the first air passage is provided with the first air outlet, and the second air passage is provided with the second air outlet.
Further, a first air inlet communicated with the first air passage and a second air inlet communicated with the second air passage are formed in the valve body.
Further, the piston cylinder can stretch and retract relative to the valve body along the axis so as to adjust the opening size of the second air outlet.
Further, a closed adjusting cavity is formed between the valve body and the piston cylinder, the piston cylinder can move along the axial direction to expand and contract the adjusting cavity, a third air inlet which is respectively communicated with the adjusting cavity and an external air passage is formed in the valve body, and air flow can enter and exit the adjusting cavity from the third air inlet so as to control the expansion or contraction of the adjusting cavity.
Further, an elastic member is provided between the piston cylinder and the valve body to restrict movement of the piston cylinder in the axial direction.
Further, the spray valve further comprises a first nozzle cap detachably connected to the end portion of the piston cylinder, the first air outlet is formed in the first nozzle cap, and a second nozzle cap detachably connected to the end portion of the valve body and corresponding to the first nozzle cap, and the second air outlet is formed between the second nozzle cap and the first nozzle cap.
Further, the conveying unit comprises a feeding reel and a collecting reel for conveying the laminating film, and the feeding reel and the collecting reel are matched to tension the laminating film and enable the laminating film to be parallel to the wafer.
In addition, the invention also provides a film sticking method, which comprises the following steps:
s1, conveying a wafer to a placing table, and fixing the wafer by the placing table;
s2, conveying the laminating film to a parallel position above the wafer by a conveying unit;
S3, the lifting mechanism drives the spray valve to descend to a position close to the position right above the wafer, and the first air outlet and the second air outlet respectively realize air supply through a first air channel and a second air channel;
S4, opening a first air passage, and blowing out linear air flow perpendicular to the wafer by a first air outlet so as to enable the attaching film to attach to the circle center of the wafer;
S5, opening a second air passage, wherein the second air outlet blows out annular air flow inclined towards the circumference of the wafer, the lifting mechanism drives the spray valve to gradually rise, and the first air passage is closed, and the bonding surface of the bonding film and the wafer diffuses from the circle center to the circumference of the wafer in a circular shape until the bonding film and the whole surface of the wafer are bonded to finish bonding.
Further, the method comprises the step of supplying air to the third air inlet before film pasting to adjust the relative position between the piston cylinder and the valve body, and further adjust the opening size of the second air outlet to adjust the pressure applied to the wafer so as to adapt to different types of wafers.
Compared with the prior art, the invention has the beneficial effects that the spray valve comprises the first air outlet and the second air outlet which is annularly arranged at the periphery of the first air outlet, wherein the first air outlet can spray linear air flow to the circle center of the wafer, the second air outlet can spray annular air flow which surrounds the circle center, and when the lifting mechanism gradually rises, the radius of the annular air flow which acts on the wafer is gradually enlarged, so that the bonding film is bonded with the wafer in a way that the circle center of the wafer gradually diffuses to the circumferential direction, the wafer bonding film with a complex structure can be met, the surface of the wafer is not damaged, and meanwhile, the post-bonding film tension is uniform, thereby facilitating the subsequent process steps.
[ Description of the drawings ]
Fig. 1 is a schematic structural view of a wafer film laminating apparatus according to the present invention.
Fig. 2 is a schematic structural view of the spray valve in the present invention.
FIG. 3 is a schematic view of the wafer bonding direction according to the present invention.
[ Detailed description ] of the invention
In order that the above objects, features and advantages of the application will be readily understood, a more particular description of the application will be rendered by reference to the appended drawings. It is to be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the scope of the application. It should be further noted that, for convenience of description, only some, but not all of the structures related to the present application are shown in the drawings. All other embodiments, which can be made by those skilled in the art based on the embodiments of the application without making any inventive effort, are intended to be within the scope of the application.
The terms "comprising" and "having" and any variations thereof herein are intended to cover a non-exclusive inclusion. For example, a process, method, system, article, or apparatus that comprises a list of steps or elements is not limited to only those listed steps or elements but may include other steps or elements not listed or inherent to such process, method, article, or apparatus.
Reference herein to "an embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of the application. The appearances of such phrases in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. Those of skill in the art will explicitly and implicitly appreciate that the embodiments described herein may be combined with other embodiments.
Referring to fig. 1 to 3, a wafer film laminating apparatus according to a preferred embodiment of the present invention includes a placement table 100 for placing a wafer 1, the wafer 1 having an axis 1a, a conveying unit 200 for conveying a laminating film 2 over the wafer 1, and a film laminating unit 300 including a lifting mechanism 3 and a spraying valve 4 disposed on the lifting mechanism 3, the spraying valve 4 being disposed over the wafer 1 and blowing the laminating film 2 onto the wafer 1, the lifting mechanism 3 being capable of driving the spraying valve 4 to approach and separate from the wafer 1, wherein the spraying valve 4 includes a first air outlet 451 for spraying an air flow onto the wafer 1 and a second air outlet 461, the air outlet direction of the first air outlet 451 coincides with the axis 1a, the second air outlet 461 is disposed around the periphery of the first air outlet 451, and the air outlet direction of the second air outlet 461 has an included angle α with the axis 1a, the included angle α being an acute angle.
The spray valve 4 in the invention comprises a first air outlet 451 and a second air outlet 461 annularly arranged on the periphery of the first air outlet 451, wherein the first air outlet 451 can spray linear air flow to the circle center of the wafer 1, the second air outlet 461 can spray annular air flow encircling the circle center of the wafer 1, and when the lifting mechanism 3 gradually rises, the radius of the annular air flow acted on the wafer 1 is gradually enlarged, so that the lamination film 2 is laminated with the wafer 1 in a way that the circle center of the wafer 1 gradually diffuses in the circumferential direction, the lamination film can meet the lamination requirement of the wafer 1 with a complex structure, the surface of the wafer 1 is not damaged, and meanwhile, the post-lamination tension is uniform, thereby facilitating the subsequent process steps.
Further, the spray valve 4 includes a valve body 41 and a piston cylinder 42 provided in the valve body 41, and in this embodiment, both the valve body 41 and the piston cylinder 42 have a cylindrical structure so as to be mutually coupled. A first air passage 43 is formed in the piston cylinder 42, and a second air passage 44 is formed between the valve body 41 and the piston cylinder 42, wherein the first air outlet 451 is positioned on the first air passage 43, the second air outlet 461 is positioned on the second air passage 44, and the first air outlet 451 and the second air outlet 461 are concentrically arranged.
The valve body 41 is provided with a first air inlet 411 and a second air inlet 412, the first air inlet 411 is communicated with the first air channel 43, the second air inlet 412 is communicated with the second air channel 44, the first air inlet 411 is used for being connected with an external first air channel (not shown), and the second air inlet 412 is used for being connected with an external second air channel (not shown) so as to supply air to the first air channel 43 and the second air channel 44 respectively.
The piston cylinder 42 includes a cylinder 421 and a boss 422 connected to an end of the cylinder 421 and protruding with respect to an outer edge of the cylinder 421, the outer edge of the boss 422 being in contact with an inner wall of the valve body 41 to support one end of the cylinder 421. The first air duct 43 extends from one end to the other end along the axial direction of the cylinder 421. The boss 422 and the cylinder 421 may be integrally formed or detachably connected. Preferably, the inner wall of the valve body 41 is convexly provided with a supporting part 413, the supporting part 413 is positioned at a position far away from the boss 422, and the supporting part 413 is contacted with the outer edge of the cylinder 421 so as to improve the supporting reliability of the piston cylinder 42 in the valve body 41. In the present embodiment, a plurality of abutments 413 may be provided and distributed at intervals along the circumferential direction of the valve body 41 to limit the radial direction of the cylinder 421, or a single annular abutment formed circumferentially around the valve body 41 may be provided.
Further, a first nozzle cap 45 communicating with the first air passage 43 is detachably connected to an end of the piston cylinder 42 remote from the boss 422, and a first air outlet 451 is formed on the first nozzle cap 45. The first nozzle cap 45 has an outer wall inclined to the axis 1 a. The end of the valve body 41 is detachably connected with a second nozzle cap 46, the second nozzle cap 46 has an inner wall corresponding to the outer wall of the first nozzle cap 45, the inner wall of the second nozzle cap 46 is parallel to the outer wall of the first nozzle cap 45, and a second air outlet 461 is formed between the second nozzle cap 46 and the first nozzle cap 45. By adopting the first nozzle cap 45 and the second nozzle cap 46 which are detachable, the first nozzle cap 45 and the second nozzle cap 46 which are different can be customized according to actual needs, so that the direction and the size of the first air outlet 451 and the second air outlet 461 of the spray valve 4 can be adjusted, and the universality of the spray valve 4 is greatly improved. The first nozzle cap 45 and the second nozzle cap 46 may be detachably fastened, screwed or directly sleeved, and in this embodiment, the nozzle caps are fixed to the valve body 41 and the piston cylinder 42 by a collar 47. Indeed, in other embodiments, the first air outlet 451 and the second air outlet 461 may be directly formed by the inner wall of the piston cylinder 42 and the valve body 41.
Further, the piston cylinder 42 may be fixedly coupled or slidably coupled with the valve body 41, and in this embodiment, since the materials of the surface of the wafer 1 and the lamination film 2 are different, the pressure required for lamination needs to be adaptively adjusted to achieve the best lamination effect. Preferably, in the present embodiment, the piston cylinder 42 is retractable along the axis 1a with respect to the valve body 41 to adjust the opening size of the second air outlet 461, thereby adjusting the pressure applied to the wafer 1.
Specifically, the boss 422 of the piston cylinder 42 is slidably coupled to the valve body 41, and the cylinder 421 of the piston cylinder 42 is slidably coupled to the abutting portion 413, and the abutting portion 413 partitions the interior of the valve body 41 into a first chamber and a second chamber. The second air channel 44 is formed by matching the inner wall of the first chamber with the cylinder 421, the inner wall of the second chamber, the cylinder 421 and the boss 422 are matched to form an adjusting cavity 48, the valve body 41 is further provided with a third air inlet 414, and the third air inlet 414 is respectively communicated with the adjusting cavity 48 and an external air channel. An elastic member 49 is provided between the boss 422 and the valve body 41, and both ends of the elastic member 49 are respectively connected with the boss 422 and the valve body 41, which can provide a reaction force to support the boss 422 to restrict upward movement, and simultaneously, the elastic member 49 can also restrict downward movement of the boss 422 to ensure that the third air inlet 414 is always in communication with the regulating chamber 48. Air flow may enter and exit the conditioning chamber 48 from the third air inlet 414 to control the expansion or contraction of the conditioning chamber 48.
The air pressure of the adjusting cavity 48 can be adjusted by controlling the air flow of the third air inlet 414 into the adjusting cavity 48, when the air pressure is higher than the threshold value of the adjusting cavity 48, the air pressure can overcome the reaction force of the elastic piece 49 and push the boss 422 to move upwards, so that the distance between the inner wall of the second nozzle cap 46 and the outer wall of the first nozzle cap 45 is reduced, the opening of the second air outlet 461 is reduced, the reduction of the opening of the second air outlet 461 is correspondingly adjusted according to the difference of the air pressure higher than the threshold value of the adjusting cavity 48, and when the air pressure is lower than the threshold value of the adjusting cavity 48, the piston cylinder 42 is reset to the initial position under the reaction force of the elastic piece 49.
Preferably, a sealing ring (not shown) may be provided between the valve body 41 and the piston cylinder 42 to achieve tightness, so as to ensure that the regulating chamber 48 and the second air passage 44 are separated from each other. In this embodiment, the air pressure of the spray valve 4 is in the range of 0 to 1000pa, the diameter of the spray range is in the range of 0 to 500mm, and the air flow temperature is in the range of 0 to 150 ℃.
Further, the placing table 100 may fix the wafer 1 by electrostatic adsorption, vacuum adsorption, mechanical fixing, or the like. It should be noted that the placement stage 100 is a prior art in the field, and the disclosure is not repeated here. The wafer 1 may be made of glass, silicon, gallium nitride, gallium arsenide, silicon carbide, aluminum oxide, metal, organic material, etc. The placing table 100 may take and place the wafer 1 manually or by a robot.
Further, the conveying unit 200 includes a feeding reel 5 and a collecting reel 6 for conveying the laminated film 2, and the feeding reel 5 and the collecting reel 6 cooperate to tension the laminated film 2 and make the laminated film 2 parallel to the wafer 1. Preferably, the conveying unit 200 is further provided with a tension controller (not shown) to make the tension of the attaching film 2 uniform and facilitate the attaching film.
Further, the lifting mechanism 3 is specifically a lifting mechanical arm, which can implement lifting motion by an electric or pneumatic mode, such as a servo module or an air cylinder. In the embodiment, the movement distance of the lifting mechanism 3 is 0-1000 mm, and the movement speed is 0-5 m/s. The valve body 41 is provided with screw holes 415 to be connected with the lifting mechanism 3.
Before film sticking, according to the actual structure of the wafer 1 and the film sticking 2, the third air inlet 414 is supplied to adjust the relative position between the piston cylinder 42 and the valve body 41, and then the opening size of the second air outlet 461 is adjusted to adjust the pressure applied to the wafer 1;
Placing the wafer 1 to be film-adhered into a placing table 100 by adopting a manual or mechanical arm, and fixing the wafer 1 by the placing table 100;
Then, starting a conveying unit 200, conveying the laminating film 2 to the wafer 1 from a feeding reel 5, and tensioning the laminating film 2 by matching with a material collecting reel 6 so that the laminating film 2 is uniformly and parallelly arranged right above the wafer 1, and preparing the laminating film at a height of 1-10 mm from the upper surface of the wafer 1;
Starting the lifting mechanism 3, driving the spray valve 4 to descend to a position close to the wafer 1 by the lifting mechanism 3, starting the first air passage, and spraying linear air flow from the first air outlet 451 so that the laminating film 2 is laminated with the circle center of the wafer 1;
Then, a second air passage is opened, the second air outlet 461 sprays annular air flow, so that the laminating film 2 is laminated around the circle center of the wafer 1, at the moment, the lifting mechanism 3 drives the spray valve 4 to vertically move upwards, the first air passage is closed, the upwards-moving spray valve 4 continuously expands the radius of the annular air flow acting on the laminating film 2, and meanwhile, the laminating surface of the laminating film 2 and the wafer 1 is gradually expanded in a circular mode until the laminating film 2 is laminated with the whole surface of the wafer 1;
finally, the second air path is closed, and a cutting mechanism (not shown) cuts the attaching film 2 along the edge of the wafer 1, and the wafer 1 after the film is attached is taken out of the placing table 100 by a manual or mechanical arm.
It should be noted that the film sticking equipment of the invention can also be applied to other special-shaped film sticking occasions, and the mode of jetting air flow by adopting the jet valve can meet the requirements of various shapes of special-shaped film sticking.
In addition, the invention also provides a film sticking method, which comprises the following steps:
s1, conveying a wafer 1 to a placing table 100 by a manual or mechanical arm, and fixing the wafer by the placing table 100;
s2, conveying the laminating film 2 to a parallel position above the wafer 1 by a conveying unit 200;
s3, the lifting mechanism 3 drives the spray valve 4 to descend to a position close to the position right above the wafer 1, and the first air outlet 451 and the second air outlet 461 realize air supply through a first air passage and a second air passage respectively;
S4, opening a first air passage, and blowing out linear air flow perpendicular to the wafer 1 by the first air outlet 451 so as to enable the attaching film 2 to attach to the circle center of the wafer 1;
S5, opening a second air passage, wherein the second air outlet 461 blows out annular air flow inclined towards the circumference of the wafer 1, the lifting mechanism 3 drives the spray valve 4 to gradually rise, and the first air passage is closed, so that the bonding surface of the bonding film 2 and the wafer 1 spreads from the circle center to the circumference of the wafer 1 in a circular shape, and the film bonding is completed.
In addition, the film pasting method further comprises the following steps that before film pasting, air is supplied to the third air inlet 414 according to the actual structures of the wafer 1 and the pasting film 2, so that the relative position between the piston cylinder 42 and the valve body 41 is adjusted, and the opening size of the second air outlet 461 is further adjusted, so that the pressure applied to the wafer 1 is adjusted, and the optimal pasting effect is achieved.
In summary, the invention adopts an air flow film pasting mode, can be used for a wafer film pasting of a complex structure, does not damage the surface structure of a wafer, can cover a sunken wafer structure, does not generate bubbles after pasting, has good compatibility, can be compatible with wafer film pasting actions of 4 inch, 6 inch, 8 inch, 12 inch and the like, and is beneficial to the subsequent process steps by arranging a lifting mechanism and a spray valve, and the wafer realizes film pasting in a mode of diffusing from the center to the circumference in a circular manner;
The spray valve can automatically adjust the opening size of the second air outlet, so as to adjust the pressure intensity, so that different kinds of wafers and laminating films can achieve the best laminating effect, and the universality of the film laminating equipment is improved;
The spray valve adopts the detachable nozzle cap to form the first air outlet and the second air outlet, and can be replaced according to actual needs so as to adjust the directions of the first air outlet and the second air outlet and further adjust the direction of the air flow sprayed to the wafer, thereby further improving the adaptability of the film laminating equipment.
The foregoing description is only of embodiments of the present application, and is not intended to limit the scope of the application, and all equivalent structures or equivalent processes using the descriptions and the drawings of the present application or directly or indirectly applied to other related technical fields are included in the scope of the present application.
Claims (8)
1. The wafer film pasting device is characterized by comprising:
A placement stage (100) for placing a wafer (1), the wafer (1) having an axis (1 a);
a conveying unit (200) for conveying the laminating film (2) to the upper part of the wafer (1), and
The film pasting unit (300) comprises a lifting mechanism (3) and a spray valve (4) arranged on the lifting mechanism (3), wherein the spray valve (4) is positioned above the pasting film (2), and the lifting mechanism (3) can drive the spray valve (4) to be close to and far away from the wafer (1);
Wherein the spray valve (4) comprises a first air outlet (451) and a second air outlet (461) for spraying air flow to the wafer (1), a first nozzle cap (45) and a second nozzle cap (46), the air outlet direction of the first air outlet (451) coincides with the axis (1 a), the second air outlet (461) is arranged around the periphery of the first air outlet (451), the air outlet direction of the second air outlet (461) forms an included angle alpha with the axis (1 a), the included angle alpha is an acute angle, the spray valve (4) comprises a valve body (41) and a piston cylinder (42) arranged in the valve body (41), the piston cylinder (42) can stretch along the axis (1 a) relative to the valve body (41) to adjust the opening size of the second air outlet (461), the first nozzle cap (45) is detachably connected with the end part of the piston cylinder (42), the first air outlet (451) is formed on the first nozzle cap (45), the second nozzle (46) is detachably connected with the second nozzle cap (46) along the axis (41) and forms a corresponding air outlet (46) between the first nozzle cap (45) and the second nozzle cap (45), so that the bonding surface of the bonding film (2) and the wafer (1) spreads from the circle center to the circumference of the wafer (1) in a circular shape to finish the bonding film.
2. The wafer film laminating apparatus according to claim 1, wherein said spray valve (4) comprises a valve body (41) and a piston cylinder (42) disposed in said valve body (41), a first air passage (43) is formed in said piston cylinder (42), a second air passage (44) is formed between said valve body (41) and said piston cylinder (42), said first air passage (43) has said first air outlet (451), and said second air passage (44) has said second air outlet (461).
3. The wafer film laminating apparatus according to claim 2, wherein said valve body (41) is provided with a first air inlet (411) communicating with said first air passage (43) and a second air inlet (412) communicating with said second air passage (44).
4. The wafer film laminating apparatus as set forth in claim 1, wherein a closed regulating chamber (48) is further formed between said valve body (41) and said piston cylinder (42), said piston cylinder (42) is movable along said axis (1 a) to expand and contract said regulating chamber (48), a third air inlet (414) is provided on said valve body (41) and is in communication with said regulating chamber (48) and an external air passage, respectively, and an air flow is allowed to enter and exit said regulating chamber (48) from said third air inlet (414) to control expansion or contraction of said regulating chamber (48).
5. A wafer film laminating apparatus as set forth in claim 4, wherein an elastic member (49) is provided between said piston cylinder (42) and said valve body (41) to restrict movement of said piston cylinder (42) in the direction of said axis (1 a).
6. The wafer film laminating apparatus according to claim 1, wherein said conveying unit (200) comprises a feeding reel (5) and a collecting reel (6) for conveying said laminated film (2), said feeding reel (5) and said collecting reel (6) cooperate to tension said laminated film (2) and to make said laminated film (2) parallel to said wafer (1).
7. A film sticking method based on the wafer film sticking equipment as set forth in any one of claims 1 to 6, characterized by comprising the following steps:
s1, conveying a wafer (1) to a placing table (100), and fixing the wafer (1) by the placing table (100);
S2, conveying the laminating film (2) to a parallel position above the wafer (1) by a conveying unit (200);
S3, the lifting mechanism (3) drives the spray valve (4) to descend to be close to the position right above the wafer (1), and the first air outlet (451) and the second air outlet (461) respectively realize air supply through a first air passage and a second air passage;
S4, opening a first air passage, and blowing out linear air flow perpendicular to the wafer (1) by a first air outlet (451) so as to enable the attaching film (2) to attach to the circle center of the wafer (1);
S5, opening a second air passage, wherein the second air outlet (461) blows out annular air flow inclined towards the circumference of the wafer (1), the lifting mechanism (3) drives the spray valve (4) to gradually rise, and closes the first air passage, the bonding surface of the bonding film (2) and the wafer (1) is diffused towards the circumference of the wafer (1) from the circle center to the circle, until the bonding film (2) and the whole surface of the wafer (1) are bonded to complete film bonding.
8. The method for sticking film according to claim 7, further comprising the steps of:
before film pasting, the third air inlet (414) is supplied with air to adjust the relative position between the piston cylinder (42) and the valve body (41), and then the opening size of the second air outlet (461) is adjusted to adjust the pressure applied to the wafer (1) so as to adapt to different types of wafers (1).
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| JP3916553B2 (en) * | 2002-12-04 | 2007-05-16 | 日東電工株式会社 | Thermal adhesive film sticking method and apparatus |
| JP5589045B2 (en) * | 2012-10-23 | 2014-09-10 | 日東電工株式会社 | Semiconductor wafer mounting method and semiconductor wafer mounting apparatus |
| CN203998938U (en) * | 2014-07-29 | 2014-12-10 | 中芯国际集成电路制造(北京)有限公司 | Wafer level packaging equipment |
| CN111710620A (en) * | 2019-03-18 | 2020-09-25 | 广东思沃精密机械有限公司 | Film sticking device |
| CN111192840A (en) * | 2020-01-09 | 2020-05-22 | 徐绪友 | Wafer thinning auxiliary machine for power electronic device chip production |
| CN212313979U (en) * | 2020-05-14 | 2021-01-08 | 湖南金宏光电有限公司 | Automatic sticking film machine of liquid crystal display |
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