CN1131616A - Stencil printing sheet - Google Patents
Stencil printing sheet Download PDFInfo
- Publication number
- CN1131616A CN1131616A CN95121691A CN95121691A CN1131616A CN 1131616 A CN1131616 A CN 1131616A CN 95121691 A CN95121691 A CN 95121691A CN 95121691 A CN95121691 A CN 95121691A CN 1131616 A CN1131616 A CN 1131616A
- Authority
- CN
- China
- Prior art keywords
- resin film
- plate
- stencilization
- stencil printing
- coating
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 229920005989 resin Polymers 0.000 claims abstract description 43
- 239000011347 resin Substances 0.000 claims abstract description 43
- -1 polyethylene Polymers 0.000 claims abstract description 9
- 239000004698 Polyethylene Substances 0.000 claims abstract description 7
- 229920000573 polyethylene Polymers 0.000 claims abstract description 7
- 239000000853 adhesive Substances 0.000 claims abstract 2
- 230000001070 adhesive effect Effects 0.000 claims abstract 2
- 230000004927 fusion Effects 0.000 claims abstract 2
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000011247 coating layer Substances 0.000 abstract 1
- 239000010410 layer Substances 0.000 abstract 1
- 238000000465 moulding Methods 0.000 description 21
- 239000012943 hotmelt Substances 0.000 description 18
- 238000000034 method Methods 0.000 description 16
- 230000000052 comparative effect Effects 0.000 description 10
- 239000001993 wax Substances 0.000 description 7
- 230000000694 effects Effects 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 229920002545 silicone oil Polymers 0.000 description 5
- 229920002050 silicone resin Polymers 0.000 description 4
- 239000004094 surface-active agent Substances 0.000 description 4
- 239000004753 textile Substances 0.000 description 4
- 239000002216 antistatic agent Substances 0.000 description 3
- 239000007767 bonding agent Substances 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 229920001328 Polyvinylidene chloride Polymers 0.000 description 2
- 230000000740 bleeding effect Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 229920000728 polyester Polymers 0.000 description 2
- 229920006267 polyester film Polymers 0.000 description 2
- 229920000642 polymer Polymers 0.000 description 2
- 239000005033 polyvinylidene chloride Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 229920003169 water-soluble polymer Polymers 0.000 description 2
- 239000004925 Acrylic resin Substances 0.000 description 1
- 240000006248 Broussonetia kazinoki Species 0.000 description 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 1
- 235000008708 Morus alba Nutrition 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 239000011668 ascorbic acid Substances 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 239000000839 emulsion Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 239000003112 inhibitor Substances 0.000 description 1
- 229960003511 macrogol Drugs 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000012170 montan wax Substances 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 150000003242 quaternary ammonium salts Chemical class 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 238000003892 spreading Methods 0.000 description 1
- 230000007480 spreading Effects 0.000 description 1
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B41—PRINTING; LINING MACHINES; TYPEWRITERS; STAMPS
- B41N—PRINTING PLATES OR FOILS; MATERIALS FOR SURFACES USED IN PRINTING MACHINES FOR PRINTING, INKING, DAMPING, OR THE LIKE; PREPARING SUCH SURFACES FOR USE AND CONSERVING THEM
- B41N1/00—Printing plates or foils; Materials therefor
- B41N1/24—Stencils; Stencil materials; Carriers therefor
- B41N1/245—Stencils; Stencil materials; Carriers therefor characterised by the thermo-perforable polymeric film heat absorbing means or release coating therefor
Landscapes
- Printing Plates And Materials Therefor (AREA)
- Laminated Bodies (AREA)
- Manufacture Or Reproduction Of Printing Formes (AREA)
Abstract
公开了一种包括树脂膜和该树脂膜的任选的支持物的模版印刷板，该支持物由粘接剂贴在树脂膜上，其特征在于，该树脂膜有一层用于防止热熔的涂层，该涂层包括聚乙烯蜡并且安排在树脂膜的一个表面上。该模版印刷板在穿孔过程中，甚至在使用热头高速印刷时，不引起树脂膜的破裂，该模版印刷板提供优异的穿孔图象并表现出长时间的优异的耐热熔性。Disclosed is a stencil printing plate comprising a resin film and an optional support of the resin film, the support being attached to the resin film by an adhesive, characterized in that the resin film has a layer for preventing heat fusion A coating layer includes polyethylene wax and is arranged on one surface of the resin film. The stencil printing plate does not cause rupture of the resin film during perforation even when printing at high speed using a thermal head, provides excellent perforated images and exhibits excellent heat-melt resistance for a long period of time.
Description
The present invention relates to a kind of stencilization plate.More particularly, the present invention relates to a kind of stencilization plate, have excellent heat-resisting fusibleness hot (heater element) that it is used in the equipment of preparation perforation stencilization plate.
In the preparation of perforation stencilization plate, use following two kinds of methods usually.In one approach, the processing drawing is fixed on the stencilization plate, they form onboard corresponding to the blacking of manuscript perforation partly with infrared radiation then.Other method is used hot head.In this method, be included in the information of processing in the drawing and be converted into the signal of telecommunication, and the predetermined total amount of heat that produces according to this signal by the heat head and on the stencilization plate, form perforation.In recent years, the ultrared method of preceding a kind of application had become not too popular.On the other hand, a kind of method of using heat head in back is then adopted in great majority prepare the equipment of perforated template printed panel now.Therefore, need suitably to be fit to the stencilization plate of heat head.
The speed of the heat head perforation stencilization plate that uses in the equipment of preparation perforation stencilization plate has become more and more higher.For example, in the past 5 years, the print throughput that is provided with of the thermal printer head by word processor is brought up near 4 to 5 times.This part ground is because the improvement of print speed printing speed.For high print speed printing speed, when perforated plate, because hot melt, heat head and stencilization plate film are bonded to each other, and the result is easy to take place the breaking of resin molding of stencilization plate.This phenomenon produces owing to this is true, that is, because fusing, film is bonded on the heater element, and wherein, when heating masterplate printing plate surface and when the stencilization plate moves, the heater element of heat head and the separation property on stencilization plate surface are poor.In addition, if heat head increases with respect to the transfer velocity of stencilization plate, cause the breaking of film of significant so.In addition, under these conditions, will not to form perforation on the part corresponding to the stencilization plate of the part of manuscript.As a result, reduced the quality of the image that on printing material, forms.
Usually, there have been many methods to be used for preventing the hot melt of stencilization plate.For example, Japanese patent application 48-30570,58-92595,61-295098,1-238992 and 5-64991 discloses the method that is coated with silicone resin and/or silicone oil on the film surface of stencilization plate.Japanese patent application 6-41234 also discloses the method that a surfactant layer is provided on the film surface of stencilization plate.In addition, Japanese patent application 60-19592 has disclosed the method that a wax layer is provided on the film surface of stencilization plate.
Yet in the method for the liquid substance of application examples such as silicone oil or surfactant, As time goes on, these components are transferred on the supporting layer of supporting resin molding, thereby destroy the effect that liquid substance prevents hot melt gradually.On the other hand, though the method for the thermosetting resin of application examples such as silicone resin is preventing that aspect the hot melt be good, and resin Composition is not become the shortcoming transfer on the supporting layer, these methods are defectiveness also, that is, this thermosetting resin has stoped the heater element membrana perforata.
In order to prevent these, applied in any combination silicone resin and silicone oil, or applied in any combination surfactant and water-soluble polymer.But even in these cases, the ability of perforation is owing to the existence of polymer reduces.In other words, As time goes on, the composition of mixing is separated from each other (causing the bleeding phenomenon), thereby has reduced to prevent the effect of hot melt.
If the wax layer is provided, wax will not transferred on the supporting layer of supporting resin molding, also will not reduce the perforate membrane ability of thermal element.Yet when forming perforation under high print speed printing speed, the effect that prevents hot melt not enough.
Therefore, even the good perforation image of hot melt and the stencilization plate that long heat-resisting fusibleness also is provided are not provided when an object of the present invention is to address the above problem and provide one the contact of heat head also can be provided under high print speed printing speed.
In one aspect of the invention, a stencilization plate that comprises resin molding and be attached to the resin molding holder on the resin molding arbitrarily with bonding agent is provided, it is characterized in that, this resin molding have one prevent hot melt form by Tissuemat E and be arranged in lip-deep coating of resin molding.
The mean molecule quantity of Tissuemat E preferably is not more than 10000.
The coating that prevents hot melt preferably by on surface resin film with 0.01 to 5g/m
2Amount (on the basis of drying) coating Tissuemat E prepare.
Because compare with traditional hot melt layer that prevents, stencilization plate of the present invention is used has the Tissuemat E that well prevents the hot melt effect, even the reproduction of the manuscript that may obtain to provide good does not cause the perforation image that resin molding breaks yet under high print speed printing speed.In addition, As time goes on, Tissuemat E can not transferred on the supporting layer.In addition,, Tissuemat E forms because being single composition, thus do not produce the bleeding phenomenon, thereby showed the long duration of action that prevents hot melt.
The Tissuemat E of using among the present invention preferably is coated on the surface resin film of stencilization plate as the hot melt inhibitor.For the perforation quality that prevents resin molding reduces, the mean molecule quantity of Tissuemat E preferably is not more than 10000.Be more preferably in 500 to 5000 scope.
Hope is with 0.01-5g/m
2Amount coating Tissuemat E, and 0.1-2g/m preferably
2(on the basis of drying).If amount very little, prevent that the effect of hot melt from producing breaking of resin inadequately and easily.On the other hand, excessively then produce bad punching quality.
Tissuemat E can be used with the solid form of for example small pieces, or uses with the emulsion form of dispersing wax in water.According to the concrete form of suitably selecting Tissuemat E in the method for the surface applied wax of resin molding.In the Tissuemat E molecule carboxyl or hydroxyl can be arranged.Also can get and replace by other modification bases of for example methyl and phenolic group.
The coating that comprises Tissuemat E that prevents hot melt can at random contain antistatic agent and other additives.For example, antistatic agent comprises metal organic sulfonate, quaternary ammonium salt, alkylphosphonic and other antistatic agents commonly used.
The used resin molding of the present invention can be made up of polyethylene, polypropylene, polyvinyl chloride, polyvinylidene chloride, polyester, polystyrene, polyurethane, Merlon, polyacrylic resin or silicone resin.In the middle of them, polyvinylidene chloride and polyester are good especially.
Thickness of resin film is generally at 0.5 to 20 μ m, and 1 to 15 μ m preferably.
Stencilization plate of the present invention can be resin molding and support the holder of resin molding to stick together with bonding agent and the composite that obtains.In other words, can only form basically by resin molding.Support the holder of resin molding to be made up of the porous material that allows ink for stencilling to pass, perhaps this holder can be the plate of the deflection of oil-tight China ink.When will carry out printing through a holder time, use the porous support materials that comprises Tengjon (high-quality, their Japan paper comprises the paper mulberry tree), textile or non-textile etc. that allows ink for stencilling to pass through.Have in application under the situation of stencilization plate production perforation stencilization plate of holder, before printing, peel holder on the slave plate off, therefore, only carry out printing with resin molding, can application examples such as the plate of deflections such as resin plate, textile, non-textile, printing paper.In this connection, the stencilization plate of being made up of resin molding does not basically require any holder.
There is no particular restriction bonding agent that resin molding and holder stick together, as long as it can be attached to resin molding on the holder, thereby and can form perforation by the heat melts of coming from heater element.
Below, the present invention will be described by embodiment, and these embodiment should not be construed as limitation of the present invention.
Embodiment 1:
2.0 polyester film that μ m is thick and basic weight are 10g/m
2Porous Tengjon paper with vinyl acetate resin (with the following about 1.0g/m of drying condition
2Amount) stick together each other and dry.Then, with the Tissuemat E shown in the table 1 with 0.5g/m
2The amount on (on the dry basis) is coated on the surface of polyethylene film.
Embodiment 2-4:
Repeat the process of embodiment 1, different is to obtain the stencilization plate by those replacement Tissuemat Es shown in the table 1.
Embodiment 5:
With consistent Tissuemat E used among the embodiment 1 with 0.5g/m
2Amount (on the dry-basis) be coated on the surface of the thick polyester film of 2.0 μ m, thereby obtain the stencilization plate.
Comparative example 1-4:
Repeat the process of embodiment 1, different is with those replacement Tissuemat Es shown in the table 1, thereby obtains the stencilization plate.
Table 1
Name of product (manufactory) amount (wt%) mean molecule quantity embodiment 1 highwax 1120H 100 1200
(Mitsui?Petrochemical
Industries, Ltd) embodiment 2 Highwax 4051E 100 3200
(Mitsui?Petrochemical
Industries, Ltd) embodiment 3 Sunwax E-300 100 2000
(Sanyo?Chemical
Industries, Ltd) embodiment 4 PDX 6,641 100 5,000
(Johnson Polymer Co.) comparative example 1 LG wax (wax) [montan wax] 100 800
(BASF) comparative example 2 KF-96-100,000cp 100-
[silicone oil]
(Shin-etsu?Chemical
Co., Ltd.) comparative example 3 KS-770A[heat-curable silicones 50-
Resin]
KF-96-1,000CP 50 -
[silicone oil]
(Shin-etsu?Chemical
Co., Ltd) comparative example 4 Hostaphat KL340 50-
[phosphate surfactant active]
(Matsumoto?Kosho?Ltd.)
Macrogol 1540 50-
[water-soluble polymer]
(Wako?Pure?Chemical
Industries.Ltd)
The test example
Estimate heat-resisting fusibleness (Tissuemat E is in the effect that prevents on the hot melt), the variation of the heat-resisting fusibleness of passing in time and the perforation quality of stencilization plate of the stencilization plate of embodiment 1 to 5 and comparative example 1 to 4 acquisition.
(1) heat-resisting fusibleness:
Bore a hole each stencilization plate (by the Oa-sis30Ax301 that FujitsuLtd. produces, print speed printing speed: 190 character per seconds with word processor.(printing: 10.5 point character, line space: 3.6mm)).The perforation stencilization plate of Huo Deing is subjected to the printing (by RA-205 type of RisoKagakuKogyoK.K production) of stencil printing apparatus like this.But naked eyes confirm breaking of film on the printed matter of gained.Symbol " o " expression has obtained and the consistent best image of original manuscript, and symbol " X " expression has obtained the image different with original manuscript and film rupture takes place.
(2) As time goes on, the variation of heat-resisting fusibleness:
Allow each stencilization plate 50 ℃ of spreadings of bearing month, prevent that specifically hot melt layer from contacting with holder.After this, estimate each stencilization plate in the mode similar to above-mentioned (1).
(3) perforation quality:
With word processor of using in above-mentioned (1) each stencilization plate of boring a hole.Perusal perforation quality.Symbol " o " expression has obtained the image of the original manuscript of accurate reflection, and symbol " x " expression has obtained the image different with original manuscript and can not form enough perforation.
Table 2
Variation perforation quality embodiment 1 zero zero zero embodiment 2 zero zero zero embodiment 3 zero zero zero embodiment 4 zero zero zero embodiment 5 zero zero zero comparative examples 1 that heat-resisting fusibleness is passed in time * 00 comparative examples, 2 zero * zero comparative example 3 zero * * comparative example 4 zero * zero
Can understand from above-mentioned table 2: during boring a hole, each stencilization plate of the present invention with the coating that prevents hot melt does not cause breaking of film, and the printed image of faithful to original manuscript is provided, and shows permanent good heat-resisting fusibleness.
According to the present invention, can provide have permanent good heat-resisting fusibleness and the perforation The mould that breaks of generation tree adipose membrane not in the process even under the condition of the high speed printing of using the heat head The version printed panel. In addition, when take total amount as 0.01 to 5g/m2(on the dry basis) uses flat When average molecular weight is not more than 10000 Tissuemat E, when perforation, can obtain faithful to original The image of manuscript, and do not reduce the quality that resin molding is bored a hole.
Claims (4)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6318631A JPH08175045A (en) | 1994-12-21 | 1994-12-21 | Stencil printing base paper |
| JP318631/94 | 1994-12-21 | ||
| JP318631/1994 | 1994-12-21 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1131616A true CN1131616A (en) | 1996-09-25 |
| CN1075002C CN1075002C (en) | 2001-11-21 |
Family
ID=18101302
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN95121691A Expired - Fee Related CN1075002C (en) | 1994-12-21 | 1995-12-21 | Stencil printing sheet |
Country Status (7)
| Country | Link |
|---|---|
| EP (1) | EP0718120B1 (en) |
| JP (1) | JPH08175045A (en) |
| KR (1) | KR0178601B1 (en) |
| CN (1) | CN1075002C (en) |
| AU (1) | AU698100B2 (en) |
| DE (1) | DE69504288T2 (en) |
| TW (1) | TW303405B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114393912A (en) * | 2021-11-03 | 2022-04-26 | 浙江硕克科技有限公司 | Novel composite construction half tone |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5722053A (en) * | 1980-07-16 | 1982-02-04 | Ricoh Co Ltd | Electrographic mimeography |
| JPS5923719B2 (en) * | 1981-01-19 | 1984-06-04 | アジア原紙株式会社 | mimeograph paper |
| CN1008257B (en) * | 1985-07-03 | 1990-06-06 | 赫尔·亨利·谢韦特 | Method and apparatus for converting semi-rigid blanks into containers |
| JPH01135684A (en) * | 1987-11-24 | 1989-05-29 | Fuji Photo Film Co Ltd | Thermal recording material |
| JP2825830B2 (en) * | 1989-01-12 | 1998-11-18 | 旭化成工業株式会社 | High-sensitivity heat-sensitive multilayer film and method for producing stencil sheet using the same |
| DE69031619T2 (en) * | 1989-11-14 | 1998-03-12 | Toray Industries, Inc., Tokio/Tokyo | LAMINATED POLYESTER FILM |
| JPH06155906A (en) * | 1992-11-19 | 1994-06-03 | Ricoh Co Ltd | Reversible thermal recording method |
| JP3297712B2 (en) * | 1993-04-13 | 2002-07-02 | 株式会社リコー | Heat-sensitive stencil master supply cassette and its mounting / removing method |
-
1994
- 1994-12-21 JP JP6318631A patent/JPH08175045A/en active Pending
-
1995
- 1995-12-20 AU AU40594/95A patent/AU698100B2/en not_active Ceased
- 1995-12-20 EP EP95309298A patent/EP0718120B1/en not_active Expired - Lifetime
- 1995-12-20 DE DE69504288T patent/DE69504288T2/en not_active Expired - Fee Related
- 1995-12-21 KR KR1019950053304A patent/KR0178601B1/en not_active IP Right Cessation
- 1995-12-21 CN CN95121691A patent/CN1075002C/en not_active Expired - Fee Related
- 1995-12-29 TW TW084114150A patent/TW303405B/zh not_active IP Right Cessation
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114393912A (en) * | 2021-11-03 | 2022-04-26 | 浙江硕克科技有限公司 | Novel composite construction half tone |
| CN114393912B (en) * | 2021-11-03 | 2023-04-07 | 浙江硕克科技有限公司 | Composite construction half tone |
Also Published As
| Publication number | Publication date |
|---|---|
| DE69504288D1 (en) | 1998-10-01 |
| KR960021556A (en) | 1996-07-18 |
| JPH08175045A (en) | 1996-07-09 |
| AU698100B2 (en) | 1998-10-22 |
| TW303405B (en) | 1997-04-21 |
| AU4059495A (en) | 1996-06-27 |
| CN1075002C (en) | 2001-11-21 |
| EP0718120B1 (en) | 1998-08-26 |
| KR0178601B1 (en) | 1999-04-01 |
| EP0718120A1 (en) | 1996-06-26 |
| DE69504288T2 (en) | 1999-05-06 |
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| Date | Code | Title | Description |
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