CN113153268B - Electronic system heat management packaging device for high-temperature environment - Google Patents
Electronic system heat management packaging device for high-temperature environment Download PDFInfo
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- CN113153268B CN113153268B CN202110348151.6A CN202110348151A CN113153268B CN 113153268 B CN113153268 B CN 113153268B CN 202110348151 A CN202110348151 A CN 202110348151A CN 113153268 B CN113153268 B CN 113153268B
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- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 239000004642 Polyimide Substances 0.000 claims description 9
- 229920001721 polyimide Polymers 0.000 claims description 9
- 239000004519 grease Substances 0.000 claims description 5
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Classifications
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- E—FIXED CONSTRUCTIONS
- E21—EARTH OR ROCK DRILLING; MINING
- E21B—EARTH OR ROCK DRILLING; OBTAINING OIL, GAS, WATER, SOLUBLE OR MELTABLE MATERIALS OR A SLURRY OF MINERALS FROM WELLS
- E21B7/00—Special methods or apparatus for drilling
- E21B7/04—Directional drilling
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- Life Sciences & Earth Sciences (AREA)
- Engineering & Computer Science (AREA)
- Geology (AREA)
- Mining & Mineral Resources (AREA)
- Physics & Mathematics (AREA)
- Environmental & Geological Engineering (AREA)
- Fluid Mechanics (AREA)
- General Life Sciences & Earth Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention relates to an electronic system thermal management packaging device for a high-temperature environment, which comprises a tool inner cylinder, a tool outer cylinder and an aerogel thermal insulation layer, wherein a channel for slurry circulation is formed in the tool inner cylinder; the outer side wall of the tool inner cylinder is provided with a bracket for mounting a circuit board, the circuit board is mounted on the bracket, and a heating element on the circuit board is arranged towards the tool inner cylinder. According to the environment characteristics and the structural characteristics of the device, the aerogel thermal insulation layer is adopted for carrying out thermal insulation design aiming at the high-temperature environment boundary, so that the adverse effect of the high-temperature environment on the interior of the device is prevented; the instrument inner tube can be used to the mud high-speed and flow through, utilizes the mud that flows at a high speed as the heat dissipation cold source of device, through arranging the heating element on the circuit board towards the instrument inner tube, the usable mud that flows in passing through the instrument inner tube of the heat that will generate heat the component production takes away.
Description
Technical Field
The invention relates to the technical field of drilling and logging, in particular to the technical field of rotary steering drilling and logging applied to high-temperature and high-pressure environments of oil and gas fields, and particularly relates to an electronic system thermal management packaging device applied to high-temperature environments.
Background
Rotary steerable and well logging technology is a new technology that represents the highest level of development in drilling technology. The research on the domestic rotary steering and well logging technology is late, and the development of the rotary steering well drilling and well logging technology with independent intellectual property rights can obviously improve the competitiveness of the oilfield service market and generate great economic benefit. Electronic components in the rotary steering and logging system can work smoothly, and whether the whole drilling and steering and logging system can work smoothly is determined. Therefore, the intelligent drilling and guiding and well logging system is subjected to electronic component thermal management design, the electronic components can be guaranteed to work normally under the given working condition, the problem to be solved urgently in the design of the intelligent drilling and guiding and well logging system is solved, and the intelligent drilling and guiding and well logging system has important significance for the development requirement of the special reservoir of the existing complex structure well. Therefore, the rotary guide mechanism is independently designed and researched, and the technical level of oilfield service in China can be obviously improved.
Many industries require electronic devices that can reliably operate in harsh environments such as extreme temperatures. The use of high temperature electronics in the underground drilling industry is quite complex. First, during the drilling operation, the electronics and sensors guide the drilling equipment and monitor its status. With the advent of directional drilling technology, high temperature geosteering instruments must accurately guide the borehole location to a geological target. While drilling or just after drilling, sophisticated downhole tools collect surrounding geological formation data. This practice, known as well logging, can measure resistivity, radioactivity, acoustic travel time, magnetic resonance, and other properties to determine geologic formation properties such as lithology, porosity, permeability, and water/hydrocarbon saturation. Finally, the electronic system monitors pressure, temperature, vibration and multiphase flow and actively controls the valves during the finishing and production phases. To meet these requirements, a complete high performance component signal chain is required.
How the downhole system electronics are packaged is important because the tools must be able to withstand high temperatures, vibration and impact after they are mounted on a drill bit. Typical molding compounds used to package standard semiconductors degrade and do not provide adequate operational reliability at high temperatures. Ceramic encapsulated packages or ceramic multi-chip packages silicon protect the most commonly used packages. When the ceramic multi-chip assembly is used and mixed packaging is carried out, the qualified high-quality chip is used, so that the space can be saved, and the integration level is improved. All active design components are integrated into a chip and mounted on a ceramic substrateA smaller volume solution can be achieved. The ceramic packaging substrate material mainly comprises Al2O3BeO, AlN and the like. At present, Al2O3Ceramics are the most well-established ceramic packaging materials, and are widely used due to good thermal shock resistance and electrical insulation, and mature manufacturing and processing technologies. The ceramic packaging material has the defects of high cost and high ceramic material density, and when the ceramic packaging material is used as the packaging material of the intelligent drilling and guiding mechanism, the ceramic packaging material has high quality, so that the driving cost of a drill bit is high, and how to select the packaging material with light weight and good heat insulation performance is an important problem in the heat management of electronic devices.
In the actual use process of the rotary guide system, the problems of efficient conversion, management and transmission of electric energy under an unstable input condition and super-stable electric energy output under a severe environment condition are solved, and a slurry medium is used as a ground simulation means for power supply and communication effects.
Disclosure of Invention
The technical problem to be solved by the present invention is to provide a thermal management packaging device for an electronic system in a high temperature environment, aiming at the defects of the prior art.
The technical scheme for solving the technical problems is as follows: an electronic system thermal management packaging device for a high-temperature environment comprises an inner tool cylinder, an outer tool cylinder and an aerogel heat insulation layer, wherein a channel for slurry circulation is formed in the inner tool cylinder; the outer side wall of the tool inner cylinder is provided with a bracket for mounting a circuit board, the circuit board is mounted on the bracket, and a heating element on the circuit board faces towards the tool inner cylinder.
The invention has the beneficial effects that: according to the environment characteristics and the structural characteristics of the device, the aerogel thermal insulation layer is adopted for carrying out thermal insulation design aiming at the high-temperature environment boundary, so that the adverse effect of the high-temperature environment on the interior of the device is prevented; the instrument inner tube can be used to the mud high-speed and flow through, utilizes the mud that flows at a high speed as the heat dissipation cold source of device, through arranging the heating element on the circuit board towards the instrument inner tube, the usable mud that flows in passing through the instrument inner tube of the heat that will generate heat the component production takes away. The present invention is primarily directed to thermal management of high power electronic devices in the field of non-permanent well completions or limited length of time operations. The invention solves the problem of reliability under extreme environment in the design process of a deep-drilling rotary guide system of petroleum by designing the high-power electronic system thermal management package of the high-temperature environment in the oil field well based on aerogel materials.
On the basis of the technical scheme, the invention can be further improved as follows.
Further, the material of the aerogel thermal insulation layer comprises silica aerogel and polyimide aerogel.
The beneficial effect of adopting the further scheme is that: the heat insulation layer comprises silicon dioxide aerogel and polyimide aerogel, wherein the aerogel has nanometer skeleton particles (4-10 nm), a nanometer porous structure (the porosity is 99.8%) and extremely low density (3 kg/m)3) The solid heat conduction and the gas heat conduction can be greatly reduced. The silica aerogel has the characteristics of light weight, low thermal conductivity, high temperature resistance, super hydrophobicity, heat insulation, shock resistance, natural fire resistance, environmental protection, no toxicity, corrosion resistance and the like. The polyimide aerogel not only has the characteristics shared by other aerogels, such as low density, high porosity, low dielectric constant, low thermal conductivity and high specific surface area, but also has the properties of good heat resistance, hydrophobicity, high mechanical strength, atomic oxidation resistance and the like through reaction route design, and is an ideal material for serving as an electronic device packaging structure. The thermal conductivity of the silica aerogel at room temperature is 0.018W/(m.K) to 0.040W/(m.K), and the use temperature is 650 ℃; the polyimide has room temperature thermal conductivity of 0.012W/(mK) to 0.030W/(mK), and the use temperature is 440 ℃. Two kinds of aerogels cooperation are used and can be effectively isolated external high temperature.
Further, the bracket structure is designed for covering the heating element on the circuit board, and one side of the circuit board, which is provided with the heating element, is connected with the bracket through packaging glue.
The beneficial effect of adopting the further scheme is that: the outer wall of the inner cylinder of the tool is designed to cover the heating elements on the circuit board structurally, the packaging adhesive is coated on the surface of the circuit board when in use, and a layer of film can be formed after the packaging adhesive is solidified, so that the outer wall of the inner cylinder can be in good installation contact with each heating element, and the heat conduction is facilitated.
Furthermore, the bracket is provided with a boss or a groove matched with the circuit board structure.
The beneficial effect of adopting the further scheme is that: the bracket has compact structural design, and the parts such as the circuit board and the like are additionally provided with bosses or grooves which are matched with the structure of the circuit board, so that heat can be effectively transferred. When guaranteeing bracket self intensity, guarantee that the inside mud runner of bracket is smooth and easy, increase the radiating efficiency.
Further, the packaging adhesive is coated on one side face, provided with the heating element, of the circuit board.
The beneficial effect of adopting the further scheme is that: the circuit board is coated with the packaging adhesive, the packaging adhesive can play a certain role in heat insulation and electromagnetic shielding, when the pipeline is impacted, the packaging adhesive layer blocks the direct collision between the circuit board and the support, the impact load on the circuit board is effectively reduced, and the normal work of the circuit board is ensured.
Further, heat conducting grease is coated between the heating element on the circuit board and the bracket.
The beneficial effect of adopting the further scheme is that: in order to control the temperature level of the components, the heat conduction resistance between the components and the outer wall of the inner cylinder is ensured to be low enough, and the heat conduction resistance can be realized by coating heat conduction grease between the components and the heat conduction surface.
Furthermore, a channel is arranged on the bracket, the circuit board is installed in the channel, and a cover plate for packaging the circuit board in the channel is installed on the channel.
The beneficial effect of adopting the further scheme is that: through increasing the apron, the influence of the high temperature of further effective separation urceolus to the circuit board.
Further, a buffer ring is arranged between the bracket and the inner side wall of the outer tool barrel.
The beneficial effect of adopting the further scheme is that: rubber buffer rings can be added at the front end, the tail end and the middle part of the whole bracket, so that the electronic bin is prevented from impacting the shell to cause larger vibration. For example, a fluororubber material can be added on the bracket as a vibration isolation element, and the fluororubber material has superelasticity and excellent high-temperature resistance, can play a role in buffering under impact and vibration loads, effectively improves the vibration transmissibility of the whole device, and maintains the reliability of the system under extreme environments.
Furthermore, a plurality of brackets are formed on the outer side wall of the inner tool barrel, a plurality of circuit boards which are arranged along the circumferential direction are arranged on each bracket, and the circuit boards on the adjacent brackets are arranged in a staggered mode.
The beneficial effect of adopting the further scheme is that: the circuit boards are uniformly distributed on the outer side wall of the tool inner barrel, so that the tool inner barrel is uniform in heat dissipation and better in heat dissipation effect.
Furthermore, two oppositely arranged circuit boards are arranged on each bracket.
Drawings
FIG. 1 is a schematic diagram of the thermal management package device for an electronic system in a high temperature environment according to the present invention;
FIG. 2 is a schematic diagram of the heat dissipation of the thermal management package device for an electronic system in a high temperature environment according to the present invention;
FIG. 3 is a schematic side view of a thermal management package device for an electronic system in a high temperature environment according to the present invention;
FIG. 4 is a schematic view of the cross-sectional structure A-A of FIG. 3;
fig. 5 is a schematic perspective exploded view of the thermal management package device for an electronic system in a high temperature environment according to the present invention.
In the drawings, the components represented by the respective reference numerals are listed below:
1. an inner tool barrel; 11. a channel; 2. a tool outer cylinder; 3. an aerogel thermal insulation layer; 4. a bracket; 41. a boss; 42. a channel; 5. a circuit board; 51. a heat generating element; 6. packaging glue; 7. a cover plate; 8. and a buffer ring.
Detailed Description
The principles and features of this invention are described below in conjunction with the following drawings, which are set forth by way of illustration only and are not intended to limit the scope of the invention.
Example 1
As shown in fig. 1 to 5, the electronic system thermal management packaging device for a high-temperature environment in the embodiment includes a tool inner cylinder 1, a tool outer cylinder 2, and an aerogel thermal insulation layer 3, a channel 11 for slurry to flow through is formed in the tool inner cylinder 1, the tool outer cylinder 2 is sleeved outside the tool inner cylinder 1 and is arranged at an interval with the tool inner cylinder 1, and the aerogel thermal insulation layer 3 is disposed in the interval; the outer side wall of the tool inner cylinder 1 is provided with a bracket 4 for mounting a circuit board 5, the circuit board 5 is mounted on the bracket 4, and a heating element 51 on the circuit board 5 faces the tool inner cylinder 1. The tool inner cylinder 1 of the embodiment adopts flowing mud as a heat dissipation medium, the drilling mud has strong anti-invasion capacity, stable performance, good fluidity and high drilling efficiency, can promote heat transfer in the flowing process, accelerates the cooling process of heating components on a circuit board, and is beneficial to heat dissipation of the heating components.
As shown in fig. 1 and 2, the sealing device of the present embodiment can be used in an intelligent drill guiding apparatus, and when in use, there are generally two thermal environment boundaries, i.e. a high temperature boundary and a low temperature boundary, respectively, where the high temperature boundary is a high-speed mud flow with the outside temperature of the tool outer cylinder 2 being 175 ℃, and the low temperature boundary is a high-speed mud flow with the center temperature of the tool inner cylinder being 150 ℃. Because the external environment of the packaging device is severe and the power consumption of the internal circuit board is high, the thermal control design is required, and the temperature of the chip on the circuit board is ensured to be within a reliable temperature range when the packaging device works. According to the environmental characteristics and structural characteristics of the packaging device, the thermal control design is carried out according to the following two principles, one is that the thermal insulation design is adopted for the boundary of the high-temperature environment, so that the adverse effect of the high-temperature environment on the interior of the device is prevented; the other point is that the slurry flowing at high speed is used as a heat dissipation cold source of the device, and the heating elements on the circuit board are led into the slurry through the inner cylinder of the tool to be taken away through the optimized structural design. The heat of the heating element is directly led into the tool inner cylinder in a heat conduction mode, and then the heat on the tool inner cylinder is taken away through the high-speed flowing slurry. The key of the thermal control design of the embodiment is that the sum of the heat conducted to the tool inner cylinder by the tool outer cylinder through the aerogel thermal insulation layer and the heat of the heating element on the circuit board is smaller than the heat taken away by the slurry from the inner wall of the tool inner cylinder. Firstly, the outer cylinder of the tool is in direct contact with the external severe environment, so that the temperature level is high, and the heat conduction between the inner cylinder and the outer cylinder of the tool is isolated as far as possible by arranging the aerogel heat insulation layer.
The material of the aerogel thermal insulation layer 3 of the present embodiment includes silica aerogel and polyimide aerogel. The heat insulation layer comprises silicon dioxide aerogel and polyimide aerogel, wherein the aerogel has nanometer skeleton particles (4-10 nm), a nanometer porous structure (the porosity is 99.8%) and extremely low density (3 kg/m)3) The solid heat conduction and the gas heat conduction can be greatly reduced. The silica aerogel has the characteristics of light weight, low thermal conductivity, high temperature resistance, super hydrophobicity, heat insulation, shock resistance, natural fire resistance, environmental protection, no toxicity, corrosion resistance and the like. The polyimide aerogel not only has the characteristics shared by other aerogels, such as low density, high porosity, low dielectric constant, low thermal conductivity and high specific surface area, but also has the properties of good heat resistance, hydrophobicity, high mechanical strength, atomic oxidation resistance and the like through reaction route design, and is an ideal material for serving as an electronic device packaging structure. The thermal conductivity of the silica aerogel at room temperature is 0.018W/(m.K) to 0.040W/(m.K), and the use temperature is 650 ℃; the polyimide has room temperature thermal conductivity of 0.012W/(mK) to 0.030W/(mK), and the use temperature is 440 ℃. Two kinds of aerogels cooperation are used and can be effectively isolated external high temperature.
As shown in fig. 4 and 5, the bracket 4 of the present embodiment is designed to cover the heat-generating component 51 on the circuit board 5, and one side of the circuit board 5 having the heat-generating component 51 is connected to the bracket 4 through the packaging adhesive 6. The outer wall of the inner cylinder of the tool is designed to cover the heating elements on the circuit board structurally, the packaging adhesive is coated on the surface of the circuit board when in use, and a layer of film can be formed after the packaging adhesive is solidified, so that the outer wall of the inner cylinder can be in good installation contact with each heating element, and the heat conduction is facilitated. The packaging adhesive 6 can also play a role in buffering while playing a role in heat insulation.
As shown in fig. 4 and 5, the bracket 4 of this embodiment is provided with a boss 41 or a groove structurally matched with the circuit board 5. The bracket has compact structural design, and the parts such as the circuit board and the like are additionally provided with bosses or grooves which are matched with the structure of the circuit board, so that heat can be effectively transferred. When guaranteeing bracket self intensity, guarantee that the inside mud runner of bracket is smooth and easy, increase the radiating efficiency.
As shown in fig. 4 and 5, the package adhesive 6 of the present embodiment is coated on a side surface of the circuit board 5 having the heat generating component 51. The circuit board is coated with the packaging adhesive, the packaging adhesive can play a certain role in heat insulation and electromagnetic shielding, when the pipeline is impacted, the packaging adhesive layer blocks the direct collision between the circuit board and the support, the impact load on the circuit board is effectively reduced, and the normal work of the circuit board is ensured.
In this embodiment, a thermal grease is applied between the heat generating component 51 on the circuit board 5 and the bracket 4. In order to control the temperature level of the components, the heat conduction resistance between the components and the outer wall of the inner cylinder is ensured to be low enough, and the heat conduction resistance can be realized by coating heat conduction grease between the components and the heat conduction surface.
As shown in fig. 4 and 5, the bracket 4 is provided with a channel 42, the circuit board 5 is mounted in the channel 42, and the channel 42 is provided with a cover plate 7 for enclosing the circuit board 5 in the channel 42. The cover plate can be a metal cover plate, and the influence of the high temperature of the outer barrel on the circuit board can be further effectively prevented by adding the cover plate, so that the magnetic shielding effect can be achieved.
As shown in fig. 4, a buffer ring 8 is provided between the bracket 4 and the inner side wall of the tool outer cylinder 2. Rubber buffer rings can be added at the front end, the tail end and the middle part of the whole bracket, so that the electronic bin is prevented from impacting the shell to cause larger vibration. For example, a fluororubber material can be added on the bracket as a vibration isolation element, and the fluororubber material has superelasticity and excellent high-temperature resistance, can play a role in buffering under impact and vibration loads, effectively improves the vibration transmissibility of the whole device, and maintains the reliability of the system under extreme environments.
As shown in fig. 4 and 5, a plurality of brackets 4 are formed on the outer side wall of the tool inner cylinder 1, a plurality of circuit boards 5 arranged along the circumferential direction are arranged on each bracket 4, and the circuit boards 5 on the adjacent brackets 4 are arranged in a staggered manner. The circuit boards are uniformly distributed on the outer side wall of the tool inner barrel, so that the tool inner barrel is uniform in heat dissipation and better in heat dissipation effect.
As shown in fig. 4 and 5, two oppositely arranged circuit boards 5 are provided on each of the brackets 4. The tool inner barrel 1 is provided with two brackets 4, each bracket 4 is provided with two channels 42, and a circuit board 5 can be arranged in each channel 42.
According to the environmental characteristics and the structural characteristics of the device, the aerogel thermal insulation layer is adopted for carrying out thermal insulation design aiming at the high-temperature environment boundary, so that the adverse effect of the high-temperature environment on the interior of the device is prevented; the instrument inner tube can be used to the mud high-speed and flow through, utilizes the mud that flows at a high speed as the heat dissipation cold source of device, through arranging the heating element on the circuit board towards the instrument inner tube, the usable mud that flows in passing through the instrument inner tube of the heat that will generate heat the component production takes away. The present embodiments are primarily directed to thermal management of high power electronics in non-permanent well completions or limited length of time operational fields. The problem of reliability under extreme environment in the oil deep drilling rotary steering system design process is solved through the high power electronic system thermal management encapsulation of the oil field high temperature environment in the pit of design based on aerogel material to this embodiment.
In the description of the present invention, it is to be understood that the terms "central," "longitudinal," "lateral," "length," "width," "thickness," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the invention and to simplify the description, and are not intended to indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and are therefore not to be considered limiting of the invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, the first feature "on" or "under" the second feature may be directly contacting the first and second features or indirectly contacting the first and second features through an intermediate. Also, a first feature "on," "over," and "above" a second feature may be directly or diagonally above the second feature, or may simply indicate that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature may be directly under or obliquely under the first feature, or may simply mean that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above are not necessarily intended to refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples and features of different embodiments or examples described in this specification can be combined and combined by one skilled in the art without contradiction.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (5)
1. The electronic system thermal management packaging device for the high-temperature environment is characterized by comprising a tool inner cylinder, a tool outer cylinder and an aerogel thermal insulation layer, wherein a channel for slurry circulation is formed in the tool inner cylinder, the tool outer cylinder is sleeved outside the tool inner cylinder and is arranged at intervals with the tool inner cylinder, and the aerogel thermal insulation layer is arranged in the intervals; a bracket for mounting a circuit board is arranged on the outer side wall of the tool inner cylinder, the circuit board is mounted on the bracket, and a heating element on the circuit board is arranged towards the tool inner cylinder; the material of the aerogel heat insulation layer comprises silicon dioxide aerogel and polyimide aerogel; the bracket structure is designed for covering the heating element on the circuit board, and one side surface of the circuit board, which is provided with the heating element, is connected with the bracket through packaging glue; a buffer ring is arranged between the bracket and the inner side wall of the outer tool barrel;
a plurality of brackets are formed on the outer side wall of the inner tool barrel, a plurality of circuit boards distributed along the circumferential direction are arranged on each bracket, and the circuit boards on the adjacent brackets are arranged in a staggered manner; two oppositely arranged circuit boards are arranged on each bracket;
the tool inner cylinder adopts flowing slurry as a heat dissipation medium, the packaging device is used for intelligent drill guiding equipment, when the packaging device is used, two thermal environment boundaries are provided, namely a high-temperature boundary and a low-temperature boundary, the high-temperature boundary is the temperature of the outer side of the tool outer cylinder, and the low-temperature boundary is the slurry at the central temperature of the tool inner cylinder.
2. The electronic system thermal management package device for high temperature environment as claimed in claim 1, wherein the bracket has a projection or a groove adapted to the circuit board structure.
3. The electronic system thermal management packaging device for high-temperature environments, according to claim 1, wherein the packaging adhesive is coated on one side surface of the circuit board, which is provided with the heat-generating components.
4. The electronic system thermal management package device for high temperature environment according to claim 1, wherein a thermal grease is coated between the heat generating components on the circuit board and the bracket.
5. The thermal management packaging apparatus for an electronic system in a high temperature environment according to claim 1, wherein the bracket is provided with a channel, the circuit board is mounted in the channel, and a cover plate for packaging the circuit board in the channel is mounted on the channel.
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