CN113150501B - A kind of benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding and its preparation method - Google Patents
A kind of benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding and its preparation method Download PDFInfo
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- 239000003063 flame retardant Substances 0.000 title claims abstract description 80
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 title claims abstract description 68
- 239000003822 epoxy resin Substances 0.000 title claims abstract description 65
- 229920000647 polyepoxide Polymers 0.000 title claims abstract description 65
- CMLFRMDBDNHMRA-UHFFFAOYSA-N 2h-1,2-benzoxazine Chemical compound C1=CC=C2C=CNOC2=C1 CMLFRMDBDNHMRA-UHFFFAOYSA-N 0.000 title claims abstract description 63
- 238000009755 vacuum infusion Methods 0.000 title claims abstract description 34
- 238000000465 moulding Methods 0.000 title claims abstract description 27
- 238000002360 preparation method Methods 0.000 title claims abstract description 6
- 229920005989 resin Polymers 0.000 claims abstract description 41
- 239000011347 resin Substances 0.000 claims abstract description 41
- 239000000203 mixture Substances 0.000 claims abstract description 32
- 238000003756 stirring Methods 0.000 claims abstract description 30
- 238000000034 method Methods 0.000 claims abstract description 28
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- 239000003795 chemical substances by application Substances 0.000 claims abstract description 19
- 239000002994 raw material Substances 0.000 claims abstract description 11
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- 238000002156 mixing Methods 0.000 claims abstract description 6
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 5
- 238000001816 cooling Methods 0.000 claims abstract 2
- VONWDASPFIQPDY-UHFFFAOYSA-N dimethyl methylphosphonate Chemical compound COP(C)(=O)OC VONWDASPFIQPDY-UHFFFAOYSA-N 0.000 claims description 29
- NWYDEWXSKCTWMJ-UHFFFAOYSA-N 2-methylcyclohexane-1,1-diamine Chemical compound CC1CCCCC1(N)N NWYDEWXSKCTWMJ-UHFFFAOYSA-N 0.000 claims description 16
- AHDSRXYHVZECER-UHFFFAOYSA-N 2,4,6-tris[(dimethylamino)methyl]phenol Chemical group CN(C)CC1=CC(CN(C)C)=C(O)C(CN(C)C)=C1 AHDSRXYHVZECER-UHFFFAOYSA-N 0.000 claims description 14
- 239000004842 bisphenol F epoxy resin Substances 0.000 claims description 13
- 239000002131 composite material Substances 0.000 abstract description 6
- 150000001412 amines Chemical class 0.000 abstract description 4
- 229910019142 PO4 Inorganic materials 0.000 abstract description 3
- 239000010452 phosphate Substances 0.000 abstract description 3
- NBIIXXVUZAFLBC-UHFFFAOYSA-K phosphate Chemical compound [O-]P([O-])([O-])=O NBIIXXVUZAFLBC-UHFFFAOYSA-K 0.000 abstract description 3
- 239000000463 material Substances 0.000 abstract description 2
- 239000011342 resin composition Substances 0.000 abstract description 2
- 239000006082 mold release agent Substances 0.000 abstract 1
- 238000001723 curing Methods 0.000 description 53
- 238000012360 testing method Methods 0.000 description 23
- 239000000047 product Substances 0.000 description 12
- 238000001029 thermal curing Methods 0.000 description 12
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 10
- 238000004458 analytical method Methods 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 8
- 230000000694 effects Effects 0.000 description 7
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 7
- 238000001802 infusion Methods 0.000 description 6
- 239000007788 liquid Substances 0.000 description 6
- 238000012986 modification Methods 0.000 description 6
- 230000004048 modification Effects 0.000 description 6
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 5
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 5
- 238000000113 differential scanning calorimetry Methods 0.000 description 5
- 229910052757 nitrogen Inorganic materials 0.000 description 5
- 239000003921 oil Substances 0.000 description 5
- 229910052760 oxygen Inorganic materials 0.000 description 5
- 239000001301 oxygen Substances 0.000 description 5
- 229920001568 phenolic resin Polymers 0.000 description 5
- 239000005011 phenolic resin Substances 0.000 description 5
- 229910052698 phosphorus Inorganic materials 0.000 description 5
- 239000011574 phosphorus Substances 0.000 description 5
- 238000011056 performance test Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 4
- DXZMANYCMVCPIM-UHFFFAOYSA-L zinc;diethylphosphinate Chemical compound [Zn+2].CCP([O-])(=O)CC.CCP([O-])(=O)CC DXZMANYCMVCPIM-UHFFFAOYSA-L 0.000 description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 3
- 230000007423 decrease Effects 0.000 description 3
- 230000007613 environmental effect Effects 0.000 description 3
- 230000009477 glass transition Effects 0.000 description 3
- 229910052736 halogen Inorganic materials 0.000 description 3
- 150000002367 halogens Chemical class 0.000 description 3
- UEZVMMHDMIWARA-UHFFFAOYSA-M phosphonate Chemical compound [O-]P(=O)=O UEZVMMHDMIWARA-UHFFFAOYSA-M 0.000 description 3
- 239000000843 powder Substances 0.000 description 3
- 239000007787 solid Substances 0.000 description 3
- 239000000243 solution Substances 0.000 description 3
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910052799 carbon Inorganic materials 0.000 description 2
- 125000003700 epoxy group Chemical group 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000013001 point bending Methods 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 238000003860 storage Methods 0.000 description 2
- 230000002195 synergetic effect Effects 0.000 description 2
- 230000000930 thermomechanical effect Effects 0.000 description 2
- NFVPEIKDMMISQO-UHFFFAOYSA-N 4-[(dimethylamino)methyl]phenol Chemical compound CN(C)CC1=CC=C(O)C=C1 NFVPEIKDMMISQO-UHFFFAOYSA-N 0.000 description 1
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- OTMSDBZUPAUEDD-UHFFFAOYSA-N Ethane Chemical compound CC OTMSDBZUPAUEDD-UHFFFAOYSA-N 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- MKYBYDHXWVHEJW-UHFFFAOYSA-N N-[1-oxo-1-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propan-2-yl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(C(C)NC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 MKYBYDHXWVHEJW-UHFFFAOYSA-N 0.000 description 1
- AFCARXCZXQIEQB-UHFFFAOYSA-N N-[3-oxo-3-(2,4,6,7-tetrahydrotriazolo[4,5-c]pyridin-5-yl)propyl]-2-[[3-(trifluoromethoxy)phenyl]methylamino]pyrimidine-5-carboxamide Chemical compound O=C(CCNC(=O)C=1C=NC(=NC=1)NCC1=CC(=CC=C1)OC(F)(F)F)N1CC2=C(CC1)NN=N2 AFCARXCZXQIEQB-UHFFFAOYSA-N 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- WNROFYMDJYEPJX-UHFFFAOYSA-K aluminium hydroxide Chemical compound [OH-].[OH-].[OH-].[Al+3] WNROFYMDJYEPJX-UHFFFAOYSA-K 0.000 description 1
- 230000000712 assembly Effects 0.000 description 1
- 238000000429 assembly Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000009838 combustion analysis Methods 0.000 description 1
- 238000002485 combustion reaction Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000004132 cross linking Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001938 differential scanning calorimetry curve Methods 0.000 description 1
- 239000003085 diluting agent Substances 0.000 description 1
- 150000002013 dioxins Chemical class 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 150000002391 heterocyclic compounds Chemical class 0.000 description 1
- 238000007731 hot pressing Methods 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- -1 hydrogen halides Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 229910052816 inorganic phosphate Inorganic materials 0.000 description 1
- VTHJTEIRLNZDEV-UHFFFAOYSA-L magnesium dihydroxide Chemical compound [OH-].[OH-].[Mg+2] VTHJTEIRLNZDEV-UHFFFAOYSA-L 0.000 description 1
- 229910001862 magnesium hydroxide Inorganic materials 0.000 description 1
- 239000000347 magnesium hydroxide Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000006533 methyl amino methyl group Chemical group [H]N(C([H])([H])[H])C([H])([H])* 0.000 description 1
- 125000004433 nitrogen atom Chemical group N* 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 235000021317 phosphate Nutrition 0.000 description 1
- 150000003008 phosphonic acid esters Chemical class 0.000 description 1
- 231100000614 poison Toxicity 0.000 description 1
- 229920000642 polymer Polymers 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 230000000750 progressive effect Effects 0.000 description 1
- 239000012783 reinforcing fiber Substances 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000003440 toxic substance Substances 0.000 description 1
- 230000001988 toxicity Effects 0.000 description 1
- 231100000419 toxicity Toxicity 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L63/00—Compositions of epoxy resins; Compositions of derivatives of epoxy resins
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/40—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the curing agents used
- C08G59/50—Amines
- C08G59/5026—Amines cycloaliphatic
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08G—MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
- C08G59/00—Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
- C08G59/18—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
- C08G59/68—Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the catalysts used
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- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L2201/00—Properties
- C08L2201/02—Flame or fire retardant/resistant
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- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Epoxy Resins (AREA)
Abstract
Description
技术领域technical field
本发明涉及高分子树脂组合物耐高温材料领域,尤其涉及一种用于真空灌注成型的苯并噁嗪阻燃改性环氧树脂及制备方法。The invention relates to the field of high-molecular resin composition high-temperature-resistant materials, in particular to a benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding and a preparation method.
背景技术Background technique
环氧树脂(EP)是一类重要的热固性树脂。它是指含有两个或者两个以上的环氧基团,能够通过环氧基团反应形成三维网状的热固性产物的高聚物。由于具有良好的物理化学特性,被广泛应用于国民经济中。然而,环氧树脂是高度可燃性树脂,限制了它们在有阻燃要求的场景应用,如交通工具内装件和电子组装件等,因此对其阻燃改性应运而生。Epoxy resin (EP) is an important class of thermosetting resins. It refers to a high polymer containing two or more epoxy groups that can form a three-dimensional network of thermosetting products through the reaction of epoxy groups. Due to its good physical and chemical properties, it is widely used in the national economy. However, epoxy resins are highly flammable resins, which limits their application in scenarios with flame retardant requirements, such as vehicle interior parts and electronic assemblies, etc., so their flame retardant modification came into being.
环氧树脂的改性初期大多使用含卤环氧树脂或含卤阻燃剂,但因其烟毒性,会产生卤化氢、二噁英等有毒物质,对人身健康以及环境保护都有极大损害,受到环保法规的严格限制,这种方法被逐渐摒弃,因而无卤阻燃成为发展方向。许多无卤阻燃剂已被用于提高环氧树脂的阻燃性,但大部分为固体粉末阻燃剂,如无机磷酸盐类、三聚氯胺及盐、氢氧化铝、氢氧化镁等,粒径通常在微米级,而在复合材料的灌注成型工艺中,由于固体阻燃剂会被增强纤维过滤,从而无法均匀分布于制件中,起不到良好阻燃作用,同时会出现表面发花现象,影响制件外观,因此固体粉末阻燃剂难以用于复合材料的真空灌注成型中。采用与环氧树脂相容的液体无卤阻燃剂是现有技术常用方法,但是要达到一定的阻燃效果,液体阻燃剂的添加量通常很大,副作用非常明显,比如带来固化物玻璃化温度(Tg)的降低,物理机械性能的损失以及阻燃耐久性的缺乏。Halogen-containing epoxy resins or halogen-containing flame retardants are mostly used in the initial modification of epoxy resins, but due to their smoke toxicity, hydrogen halides, dioxins and other toxic substances will be produced, which will greatly damage human health and environmental protection , subject to strict restrictions on environmental protection regulations, this method was gradually abandoned, so halogen-free flame retardant has become the development direction. Many halogen-free flame retardants have been used to improve the flame retardancy of epoxy resins, but most of them are solid powder flame retardants, such as inorganic phosphates, melamine and salt, aluminum hydroxide, magnesium hydroxide, etc. , the particle size is usually at the micron level, and in the infusion molding process of composite materials, since the solid flame retardant will be filtered by the reinforcing fiber, it cannot be evenly distributed in the part, and it will not have a good flame retardant effect, and at the same time there will be surface The blooming phenomenon affects the appearance of the part, so it is difficult for solid powder flame retardants to be used in vacuum infusion molding of composite materials. The use of liquid halogen-free flame retardants compatible with epoxy resins is a common method in the prior art, but to achieve a certain flame retardant effect, the amount of liquid flame retardants usually added is very large, and the side effects are very obvious, such as bringing cured products Decrease in glass transition temperature (T g ), loss of physical mechanical properties and lack of flame retardant durability.
另一方面,作为真空灌注工艺使用的复合材料树脂,要求在灌注条件下树脂黏度适当,通常不高于800mpa·s。由于树脂黏度随温度升高而降低,因此许多灌注树脂必须在加热的条件下进行灌注,这又进一步增加了工艺难度和生产成本。由于常温灌注对树脂黏度要求更高,许多常用的环氧树脂都无法满足要求,对其进行阻燃改性受到的限制更多,难度更大。比如在采用六苯氧基环三磷腈阻燃剂时,若使阻燃级别达到UL 94V-0,则添加量需达到整体质量份数的四十份,且与环氧树脂相容性较差,易析出分层,黏度在25℃时,高达几千mpa.s,在此条件下灌注,阻燃剂无法均匀分散,会大幅度降低其阻燃性能。若仅仅保证其溶于环氧树脂后不析出,则添加量可以降低至10份左右,虽满足了灌注工艺,但其阻燃性能又会大大降低;又例如液体磷酸酯类阻燃剂中,磷含量高达25%,在满足UL94V-0级别时,固化树脂的Tg仅有33℃,力学性能的损耗又十分严重。而液体硅类阻燃剂(正硅酸四乙酯等)同样也无法达到既满足阻燃性能,又保证力学性能不受损耗的要求。因此目前没有满足低黏度高阻燃并可常温灌注的树脂体系,这无疑成为本领域研究人员亟需解决的技术问题。On the other hand, as a composite material resin used in a vacuum infusion process, it is required that the resin viscosity is appropriate under the infusion conditions, usually not higher than 800mpa·s. Because resin viscosity decreases with increasing temperature, many infusion resins must be infused under heated conditions, which further increases process difficulty and production costs. Due to higher requirements for resin viscosity in room temperature infusion, many commonly used epoxy resins cannot meet the requirements, and the flame retardant modification of them is more restricted and more difficult. For example, when using hexaphenoxycyclotriphosphazene flame retardant, if the flame retardant level reaches UL 94V-0, the addition amount needs to reach 40 parts by mass of the whole, and the compatibility with epoxy resin is poor. Poor, easy to separate out and stratify, and the viscosity is as high as several thousand mpa.s at 25°C. If poured under this condition, the flame retardant cannot be uniformly dispersed, which will greatly reduce its flame retardant performance. If it is only ensured that it does not precipitate after being dissolved in epoxy resin, the addition amount can be reduced to about 10 parts. Although the infusion process is satisfied, its flame retardant performance will be greatly reduced; another example is liquid phosphate flame retardants. The phosphorus content is as high as 25%. When the UL94V-0 level is met, the T g of the cured resin is only 33°C, and the loss of mechanical properties is very serious. However, liquid silicon-based flame retardants (tetraethyl orthosilicate, etc.) also cannot meet the requirements of not only meeting the flame retardant performance, but also ensuring that the mechanical properties are not lost. Therefore, there is currently no resin system that satisfies low viscosity, high flame retardancy and can be poured at room temperature, which undoubtedly becomes a technical problem that researchers in this field need to solve urgently.
在液体无卤阻燃剂无法有效满足常温灌注阻燃树脂要求的情况下,对本体树脂的阻燃改性成为一种斯的选项。但是受到树脂黏度和固化化学相容性的严重限制,可以选择的改性树脂非常有限。本体阻燃性能优良的酚醛树脂是选择之一,但是酚醛树脂固化过程中所产生的水分子会影响环氧树脂的固化,无法达到应有的效果。In the case that liquid halogen-free flame retardants cannot effectively meet the requirements of normal temperature pouring flame retardant resins, the flame retardant modification of bulk resins has become an option. However, due to severe limitations of resin viscosity and curing chemical compatibility, the choice of modified resins is very limited. Phenolic resin with excellent flame retardant properties is one of the choices, but the water molecules produced during the curing process of phenolic resin will affect the curing of epoxy resin, and the desired effect cannot be achieved.
苯并噁嗪是一种含氧原子和氮原子的六元杂环化合物,属于特殊结构的酚醛树脂。苯并噁嗪不仅保持了传统酚醛树脂所具有的优异的力学和阻燃性能,同时克服了传统酚醛树脂在固化过程中产生水分子的问题,使其与环氧树脂的固化化学有更好的相容性。另外一个特点是苯并噁嗪树脂的分子量较低,对环氧树脂的黏度贡献小,适合用于真空灌注工艺。其他优势包括聚苯并噁嗪高的玻璃化转变温度,以及几乎为零的固化收缩率,有利于保持制件的使用温度和力学性能。Benzoxazine is a six-membered heterocyclic compound containing oxygen and nitrogen atoms, belonging to a special structure of phenolic resin. Benzoxazine not only maintains the excellent mechanical and flame-retardant properties of traditional phenolic resins, but also overcomes the problem of water molecules generated during the curing process of traditional phenolic resins, making it more compatible with the curing chemistry of epoxy resins compatibility. Another feature is that the molecular weight of benzoxazine resin is low, which contributes little to the viscosity of epoxy resin and is suitable for vacuum infusion process. Other advantages include polybenzoxazine's high glass transition temperature and almost zero curing shrinkage, which is conducive to maintaining the service temperature and mechanical properties of the part.
CN 109705353B公开了一种无固化剂苯并噁嗪改性环氧树脂阻燃剂,其体系能够达到的最高的阻燃级别为UL94V-1,并不能达到UL94V-0,且不适用于真空灌注工艺;CN101914265B公开了用苯并噁嗪型环氧树脂、四酚基乙烷环氧树脂、无机填料等制备了绿色环保阻燃性能可以达到UL94V-0的树脂,但仅适用于印刷电路板粘结片采用的热压工艺,不能用于真空灌注。CN 109705353B discloses a non-curing agent benzoxazine modified epoxy resin flame retardant, the highest flame retardant level that the system can achieve is UL94V-1, which cannot reach UL94V-0, and is not suitable for vacuum infusion Technology; CN101914265B discloses that benzoxazine type epoxy resin, tetraphenol-based ethane epoxy resin, inorganic filler etc. have prepared the resin that green environmental protection flame retardancy can reach UL94V-0, but only be applicable to printed circuit board adhesive The hot-pressing process used in the sheet cannot be used for vacuum infusion.
因此,国内外目前的真空灌注专用树脂耐热的品种仍然缺失,所以高性能的真空灌注复合材料体系仍是研发热点。Therefore, the current heat-resistant varieties of vacuum infusion resins at home and abroad are still missing, so high-performance vacuum infusion composite material systems are still a research and development hotspot.
发明内容Contents of the invention
有鉴于此,本发明的目的在于提供一种用于真空灌注成型的苯并噁嗪阻燃改性环氧树脂及制备方法。本发明采用苯并噁嗪改性环氧树脂的树脂体系,黏度低,树脂流动性能好,操作期长,符合真空灌注工艺要求,在保证高玻璃化转变温度的同时,树脂本体可以达到UL94 V-0阻燃级别,所制备的固化物同时具有优良的机械性能。In view of this, the object of the present invention is to provide a benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding and a preparation method thereof. The invention adopts the resin system of benzoxazine-modified epoxy resin, which has low viscosity, good resin fluidity, long operation period, and meets the requirements of vacuum infusion process. While ensuring high glass transition temperature, the resin body can reach UL94 V -0 flame retardant level, the prepared cured product has excellent mechanical properties at the same time.
为了实现上述发明目的,本发明提供以下技术方案:In order to achieve the above-mentioned purpose of the invention, the present invention provides the following technical solutions:
一种用于真空灌注成型的苯并噁嗪阻燃改性环氧树脂,包括以下重量份数的原料:A benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding, comprising the following raw materials in parts by weight:
优选的,所述环氧树脂为双酚F环氧树脂,所述膦酸酯阻燃剂为甲基膦酸二甲酯,所述胺类固化剂为甲基环己二胺,所述促进剂为2,4,6-三(二甲氨基甲基)苯酚。Preferably, the epoxy resin is bisphenol F epoxy resin, the phosphonate flame retardant is dimethyl methyl phosphonate, the amine curing agent is methylcyclohexanediamine, and the accelerator The agent is 2,4,6-tris(dimethylaminomethyl)phenol.
式①双酚F环氧树脂分子结构式Formula ①Molecular structure of bisphenol F epoxy resin
双酚F型环氧树脂较双酚A型环氧树脂而言具有低黏度的特点,且固化后对金属的黏着力强、耐化学腐蚀性、力学强度高、电绝缘性好等优异物理化学性能,因此本发明选用的基础树脂为双酚F型环氧树脂。Compared with bisphenol A epoxy resin, bisphenol F epoxy resin has the characteristics of low viscosity, and after curing, it has excellent physical and chemical properties such as strong adhesion to metal, chemical corrosion resistance, high mechanical strength, and good electrical insulation. performance, so the basic resin selected by the present invention is bisphenol F type epoxy resin.
式②苯并噁嗪分子结构式Formula ② Molecular structure of benzoxazine
苯并噁嗪分子量较低,对整体树脂体系黏度贡献小,具有的一定阻燃性能,与环氧树脂也有很好的相容性,固化收缩率几乎为零,固化后制件尺寸形状良好,因此本发明选用苯并噁嗪树脂改性环氧树脂。The molecular weight of benzoxazine is low, which contributes little to the viscosity of the overall resin system. It has a certain flame retardant performance and good compatibility with epoxy resin. The curing shrinkage rate is almost zero, and the size and shape of the cured part are good. Therefore the present invention selects benzoxazine resin modified epoxy resin for use.
式③甲基膦酸二甲酯分子结构式Formula ③ Molecular structure of dimethyl methylphosphonate
甲基膦酸二甲酯(DMMP)不仅具有低黏度的特点,且磷含量高达25%,是膦酸酯类阻燃剂中最高的,因此本发明选用甲基膦酸二甲酯作为膦酸酯阻燃剂。Dimethyl methylphosphonate (DMMP) not only has the characteristics of low viscosity, but also has a phosphorus content of up to 25%, which is the highest among phosphonate flame retardants. Therefore, the present invention selects dimethyl methylphosphonate as the phosphonic acid Ester flame retardants.
式④甲基环己二胺分子结构式Formula ④Methylcyclohexanediamine Molecular Structural Formula
甲基环己二胺具有无色透明,不溶于水等特点,其在25℃下黏度仅为10-20mpa·s,因此本发明选用甲基环己二胺作为胺类固化剂。Methylcyclohexanediamine is colorless, transparent, and insoluble in water. Its viscosity at 25°C is only 10-20mpa·s. Therefore, the present invention uses methylcyclohexanediamine as the amine curing agent.
式⑤2,4,6-三(二甲氨基甲基)苯酚分子结构式Formula ⑤ Molecular structural formula of 2,4,6-tris(dimethylaminomethyl)phenol
2,4,6-三(二甲氨基甲基)苯酚同样具有黏度低的特点,使用该促进剂固化的树脂具有耐高温、耐燃等特性,因此本发明选用2,4,6-三(二甲氨基甲基)苯酚作为促进剂。2,4,6-three (dimethylaminomethyl) phenol has the characteristics of low viscosity equally, and the resin cured by this accelerator has characteristics such as high temperature resistance and flame resistance, so the present invention selects 2,4,6-three (two methylaminomethyl)phenol as accelerator.
本发明的另一目的是提供一种用于真空灌注成型的苯并噁嗪阻燃改性环氧树脂的制备方法,包括以下步骤:Another object of the present invention is to provide a method for preparing a benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding, comprising the following steps:
步骤(1):按照重量配比准备各原料;Step (1): preparing each raw material according to the weight ratio;
步骤(2):将苯并噁嗪树脂和环氧树脂升温搅拌,混合均匀后,取出冷却至室温;Step (2): Warm up the benzoxazine resin and epoxy resin and stir, mix well, take out and cool to room temperature;
步骤(3):向步骤(2)冷却后的混合物中依次加入膦酸酯阻燃剂、胺类固化剂、促进剂,搅拌至均匀;Step (3): adding a phosphonate flame retardant, an amine curing agent, and an accelerator in sequence to the cooled mixture in step (2), and stirring until uniform;
步骤(4):将步骤(3)所得混合物在室温进行真空脱泡,去除搅拌过程中混入的空气;Step (4): vacuum defoaming the mixture obtained in step (3) at room temperature to remove the air mixed in during the stirring process;
步骤(5):将真空脱泡后的混合物倒入经脱模剂处理过的模具中进行热固化,固化完成后进行脱模,得到所需用于真空灌注成型的苯并噁嗪阻燃改性环氧树脂。Step (5): Pour the mixture after vacuum defoaming into a mold treated with a release agent for thermal curing, and demould after curing to obtain the required benzoxazine flame-retardant modification for vacuum infusion molding. permanent epoxy resin.
优选的,步骤(2)中搅拌温度为80-100℃,搅拌时间为0.5-2h。Preferably, the stirring temperature in step (2) is 80-100°C, and the stirring time is 0.5-2h.
优选的,步骤(2)中苯并噁嗪树脂的加入量为25-35份,环氧树脂的加入量为65-75份。Preferably, the addition amount of benzoxazine resin in step (2) is 25-35 parts, and the addition amount of epoxy resin is 65-75 parts.
优选的,步骤(4)中添加甲基膦酸二甲酯(DMMP)20-25份;Preferably, 20-25 parts of dimethyl methylphosphonate (DMMP) are added in step (4);
优选的,步骤(5)中使用的脱模剂为水性脱模剂,在步骤(4)所制得的真空脱泡后的混合物进行热固化前,均匀滴加在固化模具上,用量为促进剂重量的0.5%-1%;Preferably, the release agent used in step (5) is a water-based release agent, and before the mixture after the vacuum defoaming obtained in step (4) is thermally cured, it is evenly added dropwise on the curing mold, and the consumption is to promote 0.5%-1% of the weight of the agent;
优选的,步骤(5)中所述热固化分为化两个阶段,所述第一阶段固化温度为80℃,固化时间为4-6h;所述第二阶段固化温度为190℃,固化时间为1-3h。Preferably, the thermal curing described in step (5) is divided into two stages, the curing temperature of the first stage is 80°C, and the curing time is 4-6h; the curing temperature of the second stage is 190°C, and the curing time 1-3h.
本发明提供的用于真空灌注成型苯并噁嗪阻燃改性环氧树脂,其结构包含如下成分:The benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding provided by the present invention has the following components in its structure:
式⑥苯并噁嗪自聚Formula ⑥ Benzoxazine self-polymerization
式⑦苯并噁嗪与环氧树脂开环聚合Formula ⑦ Ring-opening polymerization of benzoxazine and epoxy resin
式⑧环氧树脂与甲基环己二胺反应Formula ⑧ epoxy resin reacts with methylcyclohexanediamine
与现有技术相比,本发明具有以下优点:Compared with the prior art, the present invention has the following advantages:
1、本发明中的苯并噁嗪中的氮元素与DMMP中的磷元素,能起到良好的协同阻燃效应,本体阻燃效果可以达到UL94V-0级,且产物中不含卤素,符合RoHS指令的要求,对环境友好。1. The nitrogen element in the benzoxazine and the phosphorus element in the DMMP in the present invention can have a good synergistic flame retardant effect, and the body flame retardant effect can reach UL94V-0 level, and the product does not contain halogen, which meets the requirements of RoHS directive requirements, friendly to the environment.
2、本发明中不合粉末填料,不影响制件外观。且选用的液体阻燃剂添加量少,能够保证制件良好的机械性能。2. No powder filler is used in the present invention, which does not affect the appearance of the product. And the selected liquid flame retardant is added in a small amount, which can ensure good mechanical properties of the parts.
3、本发明的环氧树脂类组合物,应用到真空灌注成型复合材料中,具有良好的阻燃性能,可以满足使用要求。3. The epoxy resin composition of the present invention, when applied to vacuum infusion molding composite materials, has good flame retardancy and can meet the requirements of use.
附图说明Description of drawings
为了更清楚地说明本发明实施例或现有技术中的技术方案,下面对实施例或现有技术描述中所需要使用的附图作简单地介绍,显而易见地,下面描述中的附图仅仅是本发明的实施例,对于本领域普通技术人员来讲,在不付出创造性劳动的前提下,还可以根据提供的附图获得其他的附图。In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following briefly introduces the drawings that need to be used in the description of the embodiments or the prior art. Obviously, the drawings in the following description are only It is an embodiment of the present invention, and those skilled in the art can also obtain other drawings according to the provided drawings without creative work.
图1为本发明苯并噁嗪阻燃改性环氧树脂的黏度散点图;Fig. 1 is the viscosity scatter diagram of benzoxazine flame-retardant modified epoxy resin of the present invention;
图2为本发明苯并噁嗪阻燃改性环氧树脂的DSC曲线图。Fig. 2 is the DSC curve chart of the benzoxazine flame-retardant modified epoxy resin of the present invention.
具体实施方式Detailed ways
下面将对本发明实施例中的技术方案进行清楚、完整地描述,显然,所描述的实施例仅仅是本发明一部分实施例,而不是全部的实施例。基于本发明中的实施例,本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例,都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below. Obviously, the described embodiments are only some of the embodiments of the present invention, but not all of them. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.
本发明中的分析操作方法和流程均是常规技术,其中分析仪器及参数如下:Analytical operation method and flow process among the present invention are all conventional techniques, wherein analytical instrument and parameter are as follows:
黏度测试:仪器为Viscotester IQ旋转式流变仪,德国HAAKE公司。使用旋转黏度计测试黏度。称取样品搅拌均匀,缓慢倒入黏度测试的容器中,测试温度为25℃,连续测5次,得出平均值,即为混合物的黏度。Viscosity test: the instrument is Viscotester IQ rotary rheometer, Germany HAAKE company. Viscosity was measured using a rotational viscometer. Weigh the sample and stir it evenly, slowly pour it into the container for viscosity test, the test temperature is 25°C, measure 5 times continuously, and get the average value, which is the viscosity of the mixture.
固化行为的差示扫描量热(DSC)分析:采用NETZSCH DSC214差示扫描量热仪对树脂固化行为进行表征。样品质量样品5-10mg,测试温度范围为25-250℃,升温速率为10℃/min,氮气保护下测试。Differential scanning calorimetry (DSC) analysis of curing behavior: NETZSCH DSC214 differential scanning calorimeter was used to characterize the curing behavior of the resin. Sample quality The sample is 5-10mg, the test temperature range is 25-250°C, the heating rate is 10°C/min, and the test is carried out under nitrogen protection.
动态热机械分析(DMA):其固化物由TADMAQ800动态力学分析仪测试得到,测试温度范围为25-200℃,升温速率为3℃/min。测试模式为三点弯曲双悬臂梁模式,固化物样条放在两个距离为10mm的支点上,推杆从上方对样条施加载荷。Dynamic thermomechanical analysis (DMA): The cured product is tested by TADMAQ800 dynamic mechanical analyzer, the test temperature range is 25-200°C, and the heating rate is 3°C/min. The test mode is a three-point bending double cantilever beam mode. The cured spline is placed on two fulcrums with a distance of 10mm, and the push rod applies a load to the spline from above.
极限氧指数分析:本发明根据标准GB/T2406,采用氧指数仪测试阻燃固化物的氧指数,固化物的尺寸为100mm×10mm×4mm,测试试样10个。Limiting oxygen index analysis: According to the standard GB/T2406, this invention uses an oxygen index meter to test the oxygen index of the flame-retardant cured product. The size of the cured product is 100mm×10mm×4mm, and 10 test samples are used.
UL-94垂直燃烧测试:根据标准GB-2408进行测试,试样的规格为125mm×13mm×3mm,每种样品制备5个试样进行试验。UL-94 vertical burning test: test according to the standard GB-2408, the size of the sample is 125mm×13mm×3mm, and 5 samples are prepared for each sample for the test.
实施例1Example 1
步骤(1):按照重量配比准备各组分原料,65份双酚F型环氧树脂,35份苯并噁嗪树脂,25份甲基膦酸二甲酯(DMMP),13份甲基环己二胺,0.2份2,4,6-三(二甲氨基甲基)苯酚。Step (1): Prepare the raw materials of each component according to the weight ratio, 65 parts of bisphenol F epoxy resin, 35 parts of benzoxazine resin, 25 parts of dimethyl methylphosphonate (DMMP), 13 parts of methyl Cyclohexanediamine, 0.2 parts of 2,4,6-tris(dimethylaminomethyl)phenol.
步骤(2):将苯并噁嗪树脂和双酚F型环氧树脂在油浴锅中升温至80℃搅拌0.5h,混合均匀后,取出冷却至室温;Step (2): Heat benzoxazine resin and bisphenol F epoxy resin in an oil bath to 80°C and stir for 0.5h. After mixing evenly, take out and cool to room temperature;
步骤(3):向冷却所得混合物中依次加入甲基膦酸二甲酯、甲基环己二胺以及2,4,6-三(二甲氨基甲基)苯酚,搅拌至均匀;Step (3): adding dimethyl methylphosphonate, methylcyclohexanediamine and 2,4,6-tris(dimethylaminomethyl)phenol to the cooled mixture in turn, stirring until uniform;
步骤(4):将步骤(3)所得混合物在室温进行真空脱泡,去除搅拌过程中混入的空气;Step (4): vacuum defoaming the mixture obtained in step (3) at room temperature to remove the air mixed in during the stirring process;
步骤(5):将真空脱泡后的混合物倒入经促进剂重量0.5%的迪瓦脱模剂处理过的模具中进行热固化,热固化分为两个阶段,第一阶段固化温度为80℃,固化时间为4h;第二阶段固化温度为190℃,固化时间为1h。固化完成后进行脱模,得到所需用于真空灌注成型的苯并噁嗪阻燃改性环氧树脂。Step (5): Pour the mixture after vacuum defoaming into a mold treated with 0.5% of accelerator weight Diwa release agent for thermal curing. Thermal curing is divided into two stages, and the first stage curing temperature is 80 °C, the curing time is 4h; the second stage curing temperature is 190°C, and the curing time is 1h. After the curing is completed, demoulding is carried out to obtain the required benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding.
实施例2Example 2
步骤(1):按照重量配比准备各组分原料,65份双酚F型环氧树脂,35份苯并噁嗪树脂,20份甲基膦酸二甲酯(DMMP),13份甲基环己二胺,0.2份2,4,6-三(二甲氨基甲基)苯酚。(油浴锅温度80℃,脱模剂加入量为促进剂的0.75%)Step (1): Prepare the raw materials of each component according to the weight ratio, 65 parts of bisphenol F epoxy resin, 35 parts of benzoxazine resin, 20 parts of dimethyl methylphosphonate (DMMP), 13 parts of methyl Cyclohexanediamine, 0.2 parts of 2,4,6-tris(dimethylaminomethyl)phenol. (The temperature of the oil bath is 80°C, and the amount of release agent added is 0.75% of that of the accelerator)
步骤(2):将苯并噁嗪树脂和双酚F型环氧树脂在油浴锅中升温至90℃搅拌1h,混合均匀后,取出冷却至室温;Step (2): Heat benzoxazine resin and bisphenol F epoxy resin to 90°C in an oil bath and stir for 1 hour. After mixing evenly, take out and cool to room temperature;
步骤(3):向冷却所得混合物中依次加入甲基膦酸二甲酯、甲基环己二胺以及2,4,6-三(二甲氨基甲基)苯酚,搅拌至均匀;Step (3): adding dimethyl methylphosphonate, methylcyclohexanediamine and 2,4,6-tris(dimethylaminomethyl)phenol to the cooled mixture in turn, stirring until uniform;
步骤(4):将步骤(3)所得混合物在室温进行真空脱泡,去除搅拌过程中混入的空气;Step (4): vacuum defoaming the mixture obtained in step (3) at room temperature to remove the air mixed in during the stirring process;
步骤(5):将真空脱泡后的混合物倒入经促进剂重量0.65%的迪瓦脱模剂处理过的模具中进行热固化,热固化分为两个阶段,第一阶段固化温度为80℃,固化时间为4.5h;第二阶段固化温度为190℃,固化时间为1.5h。固化完成后进行脱模,得到所需用于真空灌注成型的苯并噁嗪阻燃改性环氧树脂。Step (5): Pour the mixture after vacuum defoaming into a mold treated with 0.65% of accelerator weight Diwa release agent for thermal curing. Thermal curing is divided into two stages, and the first stage curing temperature is 80 °C, the curing time is 4.5h; the second stage curing temperature is 190°C, and the curing time is 1.5h. After the curing is completed, demoulding is carried out to obtain the required benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding.
实施例3Example 3
步骤(1):按照重量配比准备各组分原料,75份双酚F型环氧树脂,25份苯并噁嗪树脂,25份甲基膦酸二甲酯(DMMP),15份甲基环己二胺,0.2份2,4,6-三(二甲氨基甲基)苯酚。Step (1): Prepare the raw materials of each component according to the weight ratio, 75 parts of bisphenol F epoxy resin, 25 parts of benzoxazine resin, 25 parts of dimethyl methylphosphonate (DMMP), 15 parts of methyl Cyclohexanediamine, 0.2 parts of 2,4,6-tris(dimethylaminomethyl)phenol.
步骤(2):将苯并噁嗪树脂和双酚F型环氧树脂在油浴锅中升温至95℃搅拌1.5h,混合均匀后,取出冷却至室温;Step (2): Heat benzoxazine resin and bisphenol F epoxy resin to 95°C in an oil bath and stir for 1.5 hours. After mixing evenly, take out and cool to room temperature;
步骤(3):向冷却所得混合物中依次加入甲基膦酸二甲酯、甲基环己二胺以及2,4,6-三(二甲氨基甲基)苯酚,搅拌至均匀;Step (3): adding dimethyl methylphosphonate, methylcyclohexanediamine and 2,4,6-tris(dimethylaminomethyl)phenol to the cooled mixture in turn, stirring until uniform;
步骤(4):将步骤(3)所得混合物在室温进行真空脱泡,去除搅拌过程中混入的空气;Step (4): vacuum defoaming the mixture obtained in step (3) at room temperature to remove the air mixed in during the stirring process;
步骤(5):将真空脱泡后的混合物倒入经促进剂重量0.85%的迪瓦脱模剂处理过的模具中进行热固化,热固化分为两个阶段,第一阶段固化温度为80℃,固化时间为5h;第二阶段固化温度为190℃,固化时间为2h。固化完成后进行脱模,得到所需用于真空灌注成型的苯并噁嗪阻燃改性环氧树脂。Step (5): Pour the mixture after vacuum defoaming into a mold treated with 0.85% of accelerator weight Diwa release agent for thermal curing. Thermal curing is divided into two stages, and the first stage curing temperature is 80 °C, the curing time is 5h; the second stage curing temperature is 190°C, and the curing time is 2h. After the curing is completed, demoulding is carried out to obtain the required benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding.
实施例4Example 4
步骤(1):按照重量配比准备各组分原料,75份双酚F型环氧树脂,25份苯并噁嗪树脂,20份甲基膦酸二甲酯(DMMP),15份甲基环己二胺,0.2份2,4,6-三(二甲氨基甲基)苯酚。Step (1): Prepare the raw materials of each component according to the weight ratio, 75 parts of bisphenol F epoxy resin, 25 parts of benzoxazine resin, 20 parts of dimethyl methylphosphonate (DMMP), 15 parts of methyl Cyclohexanediamine, 0.2 parts of 2,4,6-tris(dimethylaminomethyl)phenol.
步骤(2):将苯并噁嗪树脂和双酚F型环氧树脂在油浴锅中升温至100℃搅拌2h,混合均匀后,取出冷却至室温;Step (2): Heat benzoxazine resin and bisphenol F epoxy resin in an oil bath to 100°C and stir for 2 hours. After mixing evenly, take out and cool to room temperature;
步骤(3):向冷却所得混合物中依次加入甲基膦酸二甲酯、甲基环己二胺以及2,4,6-三(二甲氨基甲基)苯酚,搅拌至均匀;Step (3): adding dimethyl methylphosphonate, methylcyclohexanediamine and 2,4,6-tris(dimethylaminomethyl)phenol to the cooled mixture in turn, stirring until uniform;
步骤(4):将步骤(3)所得混合物在室温进行真空脱泡,去除搅拌过程中混入的空气;Step (4): vacuum defoaming the mixture obtained in step (3) at room temperature to remove the air mixed in during the stirring process;
步骤(5):将真空脱泡后的混合物例入经促进剂重量1%的迪瓦脱模剂处理过的模具中进行热固化,热固化分为两个阶段,第一阶段固化温度为80℃,固化时间为6h;第二阶段固化温度为190℃,固化时间为3h。固化完成后进行脱模,得到所需用于真空灌注成型的苯并噁嗪阻燃改性环氧树脂。Step (5): Put the mixture after vacuum defoaming into the mold processed by the Diwa release agent of 1% accelerator weight and carry out thermal curing. The thermal curing is divided into two stages, and the first stage curing temperature is 80 °C, the curing time is 6h; the second stage curing temperature is 190°C, and the curing time is 3h. After the curing is completed, demoulding is carried out to obtain the required benzoxazine flame-retardant modified epoxy resin for vacuum infusion molding.
对比例1Comparative example 1
将环氧树脂、甲基环己二胺、2,4,6-三(二甲氨基甲基)苯酚,质量比为100∶20∶0.4,混合后搅拌均匀。将所得混合物进行真空脱泡,去除搅拌过程中混入的空气,将真空脱泡后的混合物倒入经脱模剂处理过后的模具,放入烘箱中进行热固化,固化温度为80℃,时间为4h,固化完成后进行脱模,得到所需的共混固化产物对比样条。Mix epoxy resin, methylcyclohexanediamine, and 2,4,6-tris(dimethylaminomethyl)phenol in a mass ratio of 100:20:0.4, and then stir evenly. Vacuum defoaming of the obtained mixture to remove the air mixed in the stirring process, pour the vacuum defoamed mixture into a mold treated with a release agent, put it into an oven for thermal curing, the curing temperature is 80 ° C, and the time is After 4 hours, demoulding was carried out after the curing was completed, and the desired comparison sample of the blended cured product was obtained.
对比例2Comparative example 2
将环氧树脂、甲基膦酸二甲酯、甲基环己二胺、2,4,6-三(二甲氨基甲基)苯酚,质量比为100∶40.1∶20∶0.4,混合后搅拌均匀。将所得混合物在真空烘箱中进行真空脱泡,去除搅拌过程中混入的空气,将真空脱泡后的混合物倒入经脱模剂处理过后的模具,放入烘箱中进行热固化,固化温度为80℃,时间为4h,固化完成后进行脱模,得到所需的共混固化产物对比样条。Mix epoxy resin, dimethyl methylphosphonate, methylcyclohexanediamine, and 2,4,6-tris(dimethylaminomethyl)phenol in a mass ratio of 100:40.1:20:0.4 and stir uniform. The resulting mixture is vacuum defoamed in a vacuum oven to remove the air mixed in the stirring process, the mixture after vacuum defoaming is poured into a mold treated with a release agent, and put into an oven for thermal curing. The curing temperature is 80 ℃, the time is 4h, after the curing is completed, the demoulding is carried out to obtain the desired comparison sample of the blended cured product.
实施例1-4与对比例1-2组分原料选取详见表1。See Table 1 for the selection of raw materials for the components of Examples 1-4 and Comparative Example 1-2.
表1实施例与对比例组分原料选取表Table 1 embodiment and comparative example component raw material selection table
性能测试1:黏度分析Performance Test 1: Viscosity Analysis
图1为阻燃剂黏度数据,使用旋转黏度计测试。称取样品搅拌均匀,缓慢倒入黏度测试的容器中,测试温度为25℃,连续测5次,得出平均值,即为混合物的黏度。Figure 1 shows the viscosity data of the flame retardant, which was tested using a rotational viscometer. Weigh the sample and stir it evenly, slowly pour it into the container for viscosity test, the test temperature is 25°C, measure 5 times continuously, and get the average value, which is the viscosity of the mixture.
从图1中可知,DMMP不仅可以作为阻燃剂使用,也可因其黏度低作为稀释剂使用。真空灌注成型工艺要求黏度最好低于800mpa·s,根据所测得的数据可知所制体系在常温下均可符合灌注要求。It can be seen from Figure 1 that DMMP can be used not only as a flame retardant, but also as a diluent because of its low viscosity. The vacuum infusion molding process requires that the viscosity should be lower than 800mpa·s. According to the measured data, it can be known that the prepared system can meet the infusion requirements at room temperature.
性能测试2:DSC测试分析Performance test 2: DSC test analysis
采用差示扫描量热仪对树脂固化行为进行表征。样品质量样品5-10mg,测试温度范围为25-250℃,升温速率为10℃/min,氮气保护下测试。图2的DSC测试数据可以明确反映出各实施例和对比例固化所需温度以及放热值,图2中对比例1-2均为单峰,实施例1-4为双峰,固有两个起始温度、峰值温度、以及终止温度,因此对应的有两个放热焓。表2中用“/”隔开表示。The curing behavior of the resin was characterized by differential scanning calorimetry. Sample quality The sample is 5-10mg, the test temperature range is 25-250°C, the heating rate is 10°C/min, and the test is carried out under nitrogen protection. The DSC test data in Fig. 2 can clearly reflect the temperature required for curing and the exothermic value of each embodiment and comparative example. In Fig. 2, comparative examples 1-2 are all single peaks, and examples 1-4 are double peaks, inherently two Onset temperature, peak temperature, and end temperature, so there are two corresponding exothermic enthalpy. Separated by "/" in Table 2.
从图2可知起始放热在80℃左右,因此选择80℃作为第一阶段固化温度。苯并噁嗪不仅会和环氧树脂发生共聚反应,自身在高温下也会发生自聚反应,因此判断在190℃再次出现放热反应为苯并噁嗪自身的反应,为了使固化充分,实施例1-4的固化分为两个阶段:第一阶段固化温度为80℃,固化时间为4h;第二阶段固化温度为190℃,固化时间为1h。具体数据如表2所示:It can be seen from Figure 2 that the initial heat release is around 80°C, so 80°C is selected as the first stage curing temperature. Benzoxazine will not only undergo copolymerization reaction with epoxy resin, but also undergo self-polymerization reaction at high temperature. Therefore, it is judged that the exothermic reaction at 190°C is the reaction of benzoxazine itself. In order to fully cure, implement The curing of Example 1-4 is divided into two stages: the first stage curing temperature is 80°C and the curing time is 4h; the second stage curing temperature is 190°C and the curing time is 1h. The specific data are shown in Table 2:
表2无卤苯并噁嗪阻燃改性环氧树脂DSC分析Table 2 DSC analysis of halogen-free benzoxazine flame retardant modified epoxy resin
性能测试3:DMA测试分析Performance test 3: DMA test analysis
动态热机械分析(DMA):其固化物由TADMAQ800动态力学分析仪测试得到,测试温度范围为25-200℃,升温速率为3℃/min。测试模式为三点弯曲双悬臂梁模式,固化物样条放在两个距离为10mm的支点上,推杆从上方对样条施加载荷,测试结果如表3所示。Dynamic thermomechanical analysis (DMA): The cured product is tested by TADMAQ800 dynamic mechanical analyzer, the test temperature range is 25-200°C, and the heating rate is 3°C/min. The test mode is a three-point bending double cantilever beam mode. The cured spline is placed on two fulcrums with a distance of 10mm, and the push rod applies load to the spline from above. The test results are shown in Table 3.
表3无卤苯并噁嗪阻燃改性环氧树脂DMA分析Table 3 DMA analysis of halogen-free benzoxazine flame retardant modified epoxy resin
从表3数据中我们可知对比例1的储能模量Tg为109℃,而对比例2由于加入了DMMP,其Tg迅速下降至33℃,这是由于DMMP增塑严重,加剧了大分子链段运动,使得样条的Tg大幅度降低。而本发明加入苯并噁嗪后Tg有所上升,这说明加入苯并噁嗪后交联密度增大,且本发明实施例1-4的储能模量Tg均大于90℃,符合实际生产工艺要求。From the data in Table 3, we can see that the storage modulus T g of Comparative Example 1 is 109°C, while the T g of Comparative Example 2 dropped rapidly to 33°C due to the addition of DMMP. The movement of the molecular chain segment makes the T g of the spline decrease greatly. However, the Tg of the present invention increases after adding benzoxazine, which shows that the crosslinking density increases after adding benzoxazine, and the storage modulus Tg of Examples 1-4 of the present invention are all greater than 90 ° C, in line with actual production process requirements.
性能测试4:阻燃性能Performance Test 4: Flame Retardancy
表4为苯并噁嗪阻燃改性环氧树脂共混固化物的样品UL94垂直燃烧和极限氧指数测试数据,实验中得到的实验结果数据,包括垂直燃烧等级、第一次点燃后的平均持续燃烧时间t1、第二次点燃后的平均持续燃烧时间t2、有无熔滴、火焰是否至夹具以及垂直燃烧等级。Table 4 shows the UL94 vertical burning and limiting oxygen index test data of the benzoxazine flame-retardant modified epoxy resin blended cured product, the experimental result data obtained in the experiment, including the vertical burning level, the average duration after the first ignition Burning time t1, the average continuous burning time t2 after the second ignition, whether there is a droplet, whether the flame reaches the fixture, and the vertical burning level.
表4无卤苯并噁嗪阻燃改性环氧树脂垂直燃烧分析Table 4 Vertical combustion analysis of halogen-free benzoxazine flame retardant modified epoxy resin
从表4数据可知,加入苯并噁嗪和甲基膦酸二甲酯会提高环氧树脂的阻燃性,因此发明人认为甲基膦酸二甲酯中的磷元素以及苯并噁嗪的氮元素使得体系在燃烧时形成了致密的碳层,并且苯并噁嗪中的氮元素和甲基膦酸二甲酯中的磷元素起到了良好的协同作用,达到了良好的阻燃效果。As can be seen from the data in Table 4, adding benzoxazine and dimethyl methyl phosphonate can improve the flame retardancy of epoxy resin, so the inventors think that the phosphorus element in dimethyl methyl phosphonate and the content of benzoxazine The nitrogen element makes the system form a dense carbon layer during combustion, and the nitrogen element in benzoxazine and the phosphorus element in dimethyl methylphosphonate have a good synergistic effect, achieving a good flame retardant effect.
综上所述,将DMMP加入苯并噁嗪改性环氧树脂体系中,按照一定的固化工艺,可以很好地增加阻燃性能,使树脂本体阻燃级别可达UL94 V-0,并且得到黏度合适的树脂体系。To sum up, adding DMMP to the benzoxazine modified epoxy resin system, according to a certain curing process, can well increase the flame retardant performance, so that the flame retardant level of the resin body can reach UL94 V-0, and get Resin system with suitable viscosity.
本说明书中各个实施例采用递进的方式描述,每个实施例重点说明的都是与其他实施例的不同之处,各个实施例之间相同相似部分互相参见即可。Each embodiment in this specification is described in a progressive manner, each embodiment focuses on the difference from other embodiments, and the same and similar parts of each embodiment can be referred to each other.
对所公开的实施例的上述说明,使本领域专业技术人员能够实现或使用本发明。对这些实施例的多种修改对本领域的专业技术人员来说将是显而易见的,本文中所定义的一般原理可以在不脱离本发明的精神或范围的情况下,在其它实施例中实现。因此,本发明将不会被限制于本文所示的这些实施例,而是要符合与本文所公开的原理和新颖特点相一致的最宽的范围。The above description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the invention. Therefore, the present invention will not be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
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