CN113121116A - Microcrystalline glass solder, preparation method thereof and method for connecting alumina ceramics - Google Patents
Microcrystalline glass solder, preparation method thereof and method for connecting alumina ceramics Download PDFInfo
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- CN113121116A CN113121116A CN202110513310.3A CN202110513310A CN113121116A CN 113121116 A CN113121116 A CN 113121116A CN 202110513310 A CN202110513310 A CN 202110513310A CN 113121116 A CN113121116 A CN 113121116A
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- alumina ceramics
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 56
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 title claims abstract description 48
- 239000000919 ceramic Substances 0.000 title claims abstract description 22
- 238000000034 method Methods 0.000 title claims abstract description 20
- 238000002360 preparation method Methods 0.000 title claims abstract description 11
- 239000011521 glass Substances 0.000 claims abstract description 24
- 239000002241 glass-ceramic Substances 0.000 claims abstract description 15
- 239000000463 material Substances 0.000 claims abstract description 15
- 239000000203 mixture Substances 0.000 claims abstract description 9
- 239000000126 substance Substances 0.000 claims abstract description 8
- 238000002844 melting Methods 0.000 claims description 13
- 230000008018 melting Effects 0.000 claims description 13
- 238000000227 grinding Methods 0.000 claims description 11
- 238000000498 ball milling Methods 0.000 claims description 10
- 238000001035 drying Methods 0.000 claims description 7
- 238000010438 heat treatment Methods 0.000 claims description 7
- 238000002156 mixing Methods 0.000 claims description 7
- 238000003466 welding Methods 0.000 claims description 7
- 239000004372 Polyvinyl alcohol Substances 0.000 claims description 6
- 239000007864 aqueous solution Substances 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 6
- 229920002451 polyvinyl alcohol Polymers 0.000 claims description 6
- 238000010791 quenching Methods 0.000 claims description 6
- 230000000171 quenching effect Effects 0.000 claims description 6
- 238000007873 sieving Methods 0.000 claims description 6
- 238000003825 pressing Methods 0.000 claims description 4
- 239000002994 raw material Substances 0.000 claims description 4
- 238000005498 polishing Methods 0.000 claims description 3
- 239000000843 powder Substances 0.000 claims description 3
- 238000005303 weighing Methods 0.000 claims description 3
- 229910018072 Al 2 O 3 Inorganic materials 0.000 claims 3
- 229910004298 SiO 2 Inorganic materials 0.000 claims 3
- 150000001875 compounds Chemical class 0.000 claims 1
- XLOMVQKBTHCTTD-UHFFFAOYSA-N zinc oxide Inorganic materials [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims 1
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 11
- 229910052681 coesite Inorganic materials 0.000 abstract description 8
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 8
- 239000000377 silicon dioxide Substances 0.000 abstract description 8
- 229910052682 stishovite Inorganic materials 0.000 abstract description 8
- 229910052905 tridymite Inorganic materials 0.000 abstract description 8
- 229910052593 corundum Inorganic materials 0.000 abstract description 6
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract description 6
- 230000007547 defect Effects 0.000 abstract description 4
- 239000011148 porous material Substances 0.000 abstract description 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract 1
- 238000001816 cooling Methods 0.000 description 5
- 229910052574 oxide ceramic Inorganic materials 0.000 description 4
- 239000011224 oxide ceramic Substances 0.000 description 4
- TWNQGVIAIRXVLR-UHFFFAOYSA-N oxo(oxoalumanyloxy)alumane Chemical compound O=[Al]O[Al]=O TWNQGVIAIRXVLR-UHFFFAOYSA-N 0.000 description 4
- OBNDGIHQAIXEAO-UHFFFAOYSA-N [O].[Si] Chemical compound [O].[Si] OBNDGIHQAIXEAO-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 229910010293 ceramic material Inorganic materials 0.000 description 2
- 238000000748 compression moulding Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OYPRJOBELJOOCE-UHFFFAOYSA-N Calcium Chemical compound [Ca] OYPRJOBELJOOCE-UHFFFAOYSA-N 0.000 description 1
- 239000004110 Zinc silicate Substances 0.000 description 1
- 229910052791 calcium Inorganic materials 0.000 description 1
- 239000011575 calcium Substances 0.000 description 1
- VTYYLEPIZMXCLO-UHFFFAOYSA-L calcium carbonate Substances [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000003889 chemical engineering Methods 0.000 description 1
- 230000001276 controlling effect Effects 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 239000008367 deionised water Substances 0.000 description 1
- 229910021641 deionized water Inorganic materials 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 238000005304 joining Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 239000000289 melt material Substances 0.000 description 1
- 239000012768 molten material Substances 0.000 description 1
- 239000003208 petroleum Substances 0.000 description 1
- -1 polytetrafluoroethylene Polymers 0.000 description 1
- 229920001343 polytetrafluoroethylene Polymers 0.000 description 1
- 239000004810 polytetrafluoroethylene Substances 0.000 description 1
- 239000002244 precipitate Substances 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 230000001105 regulatory effect Effects 0.000 description 1
- XSMMCTCMFDWXIX-UHFFFAOYSA-N zinc silicate Chemical compound [Zn+2].[O-][Si]([O-])=O XSMMCTCMFDWXIX-UHFFFAOYSA-N 0.000 description 1
- 235000019352 zinc silicate Nutrition 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C10/00—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition
- C03C10/0009—Devitrified glass ceramics, i.e. glass ceramics having a crystalline phase dispersed in a glassy phase and constituting at least 50% by weight of the total composition containing silica as main constituent
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C8/00—Enamels; Glazes; Fusion seal compositions being frit compositions having non-frit additions
- C03C8/24—Fusion seal compositions being frit compositions having non-frit additions, i.e. for use as seals between dissimilar materials, e.g. glass and metal; Glass solders
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B37/00—Joining burned ceramic articles with other burned ceramic articles or other articles by heating
- C04B37/003—Joining burned ceramic articles with other burned ceramic articles or other articles by heating by means of an interlayer consisting of a combination of materials selected from glass, or ceramic material with metals, metal oxides or metal salts
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/02—Aspects relating to interlayers, e.g. used to join ceramic articles with other articles by heating
- C04B2237/10—Glass interlayers, e.g. frit or flux
-
- C—CHEMISTRY; METALLURGY
- C04—CEMENTS; CONCRETE; ARTIFICIAL STONE; CERAMICS; REFRACTORIES
- C04B—LIME, MAGNESIA; SLAG; CEMENTS; COMPOSITIONS THEREOF, e.g. MORTARS, CONCRETE OR LIKE BUILDING MATERIALS; ARTIFICIAL STONE; CERAMICS; REFRACTORIES; TREATMENT OF NATURAL STONE
- C04B2237/00—Aspects relating to ceramic laminates or to joining of ceramic articles with other articles by heating
- C04B2237/50—Processing aspects relating to ceramic laminates or to the joining of ceramic articles with other articles by heating
- C04B2237/52—Pre-treatment of the joining surfaces, e.g. cleaning, machining
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Organic Chemistry (AREA)
- Ceramic Engineering (AREA)
- Materials Engineering (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Crystallography & Structural Chemistry (AREA)
- Dispersion Chemistry (AREA)
- Structural Engineering (AREA)
- Glass Compositions (AREA)
- Ceramic Products (AREA)
Abstract
本发明公开了一种微晶玻璃焊料，其化学组成为CaO 15～20wt％、Al2O3 10～25wt％、SiO2 50～55wt％、ZnO 5～10wt％、B2O3 5～10wt％；所述微晶玻璃焊料在25～700℃之间的玻璃热膨胀系数为5.9～6.5×10‑6/℃。此外，还公开了上述微晶玻璃焊料的制备方法和连接氧化铝陶瓷的方法。本发明微晶玻璃焊料与氧化铝陶瓷母材热膨胀系数相匹配、且具有适宜的连接温度，从而实现低温连接氧化铝陶瓷，降低了氧化铝陶瓷连接的工艺难度，并且提高了接头室温强度，无气孔裂纹等缺陷，有效提高了氧化铝陶瓷的连接质量。
The invention discloses a glass-ceramic solder whose chemical composition is CaO 15-20wt%, Al2O3 10-25wt%, SiO2 50-55wt %, ZnO 5-10wt %, B2O3 5-10wt % %; the glass thermal expansion coefficient of the glass-ceramic solder between 25 and 700° C. is 5.9 to 6.5×10 -6 /° C. In addition, a preparation method of the above-mentioned glass-ceramic solder and a method for connecting alumina ceramics are also disclosed. The glass-ceramic solder of the invention matches the thermal expansion coefficient of the alumina ceramic base material, and has a suitable connection temperature, so as to realize the low temperature connection of the alumina ceramic, reduce the technological difficulty of the alumina ceramic connection, and improve the room temperature strength of the joint. Defects such as pores and cracks effectively improve the connection quality of alumina ceramics.
Description
Technical Field
The invention relates to the technical field of alumina ceramic connection, in particular to a microcrystalline glass solder, a preparation method thereof and a method for connecting alumina ceramic.
Background
The alumina ceramic has the advantages of high mechanical strength, small dielectric loss, large insulation resistance, high hardness, wear resistance, corrosion resistance, high temperature resistance and the like, and is widely applied to various fields of aviation, military, machinery, petroleum, chemical engineering, electronics and the like. However, due to the intrinsic brittleness and difficulty in machining of ceramic materials, alumina ceramics are difficult to prepare into components with large size and complex shape, and thus the application range is greatly limited. In order to construct alumina ceramic parts with complex shapes and large sizes, a connection technology is needed, and simple structural parts are combined into a component with a complex shape, so that the method has important significance for reducing the production cost and expanding the application range of the component.
Among various techniques for connecting ceramic materials, the use of microcrystalline glass as a connecting material is a simple and easy and inexpensive connecting method. The microcrystalline glass connecting material has excellent chemical compatibility with ceramics, and the strength of the microcrystalline glass connecting material can be improved through certain crystallization. However, the microcrystalline glass solder in the prior art generally has the problems of higher melting point and poor matching property with the thermal expansion coefficient of the alumina ceramic, so that the process difficulty of ceramic connection is increased, defects of pore cracks and the like are caused, and the mechanical property of a joint and the connection quality of the alumina ceramic are greatly influenced. Therefore, it is necessary to prepare the microcrystalline glass solder which is suitable for connecting the alumina ceramics at low temperature and is matched with the thermal expansion coefficient of the alumina ceramics.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a microcrystalline glass solder which is matched with the thermal expansion coefficient of an alumina ceramic base material and has proper connection temperature through formula design, so that low-temperature connection of alumina ceramic is realized. The invention also aims to provide a preparation method of the microcrystalline glass solder and a method for connecting the alumina ceramics.
The purpose of the invention is realized by the following technical scheme:
the invention provides a microcrystalline glass solder, which comprises 15-20 wt% of CaO and Al2O310～25wt％、SiO250～55wt％、ZnO 5～10wt％、B2O35-10 wt%; the glass thermal expansion coefficient of the microcrystalline glass solder is 5.9-6.5 multiplied by 10 at the temperature of 25-700 DEG C-6/℃。
The other purpose of the invention is realized by the following technical scheme:
the preparation method of the microcrystalline glass solder provided by the invention comprises the following steps:
(1) ball milling mixing material
According to the chemical composition ratio, CaCO is used3、Al2O3、SiO2、ZnO、H3BO3Weighing raw materials, and mixing by wet ball milling to obtain a mixed material;
(2) melting and cold quenching
Drying, grinding and sieving the mixed material, then carrying out melting treatment, and immediately carrying out cold quenching treatment on the melted melt material to obtain glass frit;
(3) ball milling into powder
Crushing the glass frit by a dry ball mill, and sieving to obtain CaO-Al2O3-SiO2-ZnO-B2O3And (3) microcrystalline glass solder.
Further, in the preparation method, in the step (2), the drying temperature is 80-110 ℃, and the drying time is 6-12 hours; the melting temperature is 1400-1550 ℃, and the melting time is 1-3 h. The rotating speed of the dry ball mill in the step (3) is 1000-1400 r/min, and the ball milling time is 5-60 min.
The invention provides a method for connecting alumina ceramics by adopting the microcrystalline glass solder, which comprises the following steps:
(1) grinding and polishing the surfaces to be connected of the aluminum oxide ceramics to-be-welded pieces;
(2) mixing the microcrystalline glass solder with a polyvinyl alcohol aqueous solution with the concentration of 9 wt%, and then granulating and pressing to form a sheet solder blank;
(3) and adhering the solder blank body between the surfaces to be connected of the aluminum oxide ceramics to be welded, applying pressure to the parts to be welded, placing the parts in a brazing furnace for welding treatment, and cooling along with the furnace to complete the connection of the aluminum oxide ceramics.
Furthermore, in the connection method, in the step (2), the amount of the polyvinyl alcohol aqueous solution is 5-7 wt% of the microcrystalline glass solder, the pressure of the compression molding is 10-30 MPa, and the thickness of the sheet solder blank is 100-300 μm. The pressure applied in the step (3) is 0-15 KPa; the temperature schedule of the welding treatment in the brazing furnace is as follows: heating from room temperature to 350-400 ℃ at the speed of 5-10 ℃/min, preserving heat for 30-60 min, then continuously heating to 1150-1300 ℃ at the speed of 5-15 ℃/min, preserving heat for 20-40 min, then cooling to 700-900 ℃ at the speed of 10-20 ℃/min, and preserving heat for 1-2 h.
The invention has the following beneficial effects:
(1) CaO-Al of the invention2O3-SiO2-ZnO-B2O3The microcrystalline glass solder belongs to medium-temperature glass solder, and the glass thermal expansion coefficient between 25 and 700 ℃ is 5.9 to 6.5 multiplied by 10-6The temperature is matched with the thermal expansion coefficient of the connected alumina ceramic base material. CaO-Al2O3-SiO2Is a matrix composition of microcrystalline glass, in which SiO2Forming a glass network structure; al (Al)2O3The silicon-oxygen tetrahedron and the silicon-oxygen tetrahedron form a unified network; CaO belongs to the external network body and is CaCO3The form being introduced so as to precipitate a calcium-containing microcrystalline phase and thereby improve the glass-ceramicsAnd (4) performance.
(2) The microcrystalline glass solder of the invention contains a small amount of ZnO and B2O3(B2O3With H3BO3Formally introduced) with the purpose of: ZnO can reduce the melting temperature of the glass solder on one hand, and can precipitate crystalline phases such as zinc silicate and the like on the other hand, thereby being beneficial to regulating and controlling the thermal expansion coefficient of the solder; b is2O3To reduce the melting and welding temperatures.
(3) The microcrystalline glass solder can realize the connection between alumina ceramics at 1150-1300 ℃, reduces the process difficulty of the alumina ceramic connection, can ensure that the room temperature strength of the joint can reach 255-280 MPa, is improved by 19-30 percent compared with the common glass joint, and effectively improves the connection quality of the alumina ceramics because the thermal expansion coefficient of the joint is better matched with that of an alumina base material and the defects of air holes, cracks and the like do not exist.
Drawings
The invention will now be described in further detail with reference to the following examples and the accompanying drawings:
FIG. 1 is a schematic view of a solder joint for joining alumina ceramics using a microcrystalline glass solder according to an embodiment of the present invention;
FIG. 2 is a temperature profile for bonding alumina ceramics using a microcrystalline glass solder according to an embodiment of the present invention.
In the figure: alumina ceramic to-be-welded parts 1, a solder blank 2, and pressure P applied on the to-be-welded parts
Detailed Description
The first embodiment is as follows:
1. this example is a glass-ceramic solder having a chemical composition of CaO 15 wt% and Al2O315 wt％、SiO255 wt％、ZnO 5wt％、B2O310 wt%; the glass thermal expansion coefficient of the microcrystalline glass solder is 6.2 multiplied by 10 at the temperature of 25-700 DEG C-6/℃。
2. The preparation method of the microcrystalline glass solder comprises the following steps:
(1) ball milling mixing material
According to the chemical composition ratio, CaCO is used3、Al2O3、SiO2、ZnO、H3BO3Weighing raw materials, putting the raw materials, grinding balls and deionized water in a polytetrafluoroethylene ball milling tank according to the mass ratio of 1: 2: 1, and carrying out wet ball milling and mixing for 5 hours at the rotating speed of 300r/min to obtain a mixed material;
(2) melting and cold quenching
Drying the mixed material at 100 ℃ for 10h, grinding, sieving with a 200-mesh sieve, melting at 1450 ℃ for 1h, and then pouring the molten material into distilled water for cold quenching treatment to obtain glass frit;
(3) ball milling into powder
Pulverizing the glass frit by a dry ball mill at the rotating speed of 1200r/min for 30min, and sieving by a 250-mesh sieve to obtain CaO-Al2O3-SiO2-ZnO-B2O3And (3) microcrystalline glass solder.
3. The method for connecting the alumina ceramics by adopting the microcrystalline glass solder comprises the following steps:
(1) step-by-step grinding and polishing treatment is carried out on the surfaces to be connected of the aluminum oxide ceramic parts to be welded 1 by using 500 # water-grinding abrasive paper, 800 # water-grinding abrasive paper, 1200 # water-grinding abrasive paper and 1600 # water-grinding abrasive paper;
(2) mixing the microcrystalline glass solder with 9 wt% polyvinyl alcohol aqueous solution (the dosage of the polyvinyl alcohol aqueous solution is 6 wt% of the microcrystalline glass solder), granulating, and performing compression molding under the pressure of 15MPa to obtain a sheet-shaped solder blank 2 with the thickness of 150 mu m;
(3) as shown in fig. 1, the above-mentioned solder green body 2 is adhered between the surfaces to be connected of the alumina ceramic pieces to be welded 1 by 502 glue, a pressure P of 10KPa is applied to the pieces to be welded, and the pieces are placed in a brazing furnace to perform the following welding process (see fig. 2): heating from room temperature to 400 deg.C at a rate of 5 deg.C/min, maintaining the temperature for 30min, then continuing heating to 1250 deg.C at a rate of 10 deg.C/min, maintaining the temperature for 30min, cooling to 750 deg.C at a rate of 10 deg.C/min, and maintaining the temperature for 1 h; and then cooling along with the furnace to finish the connection of the alumina ceramics.
The room temperature strength of the alumina joint connected with the microcrystalline glass prepared by the embodiment reaches 263MPa, and is improved by 22.3% compared with the common glass joint.
Example two:
the difference between the present embodiment and the first embodiment is:
the chemical composition of the microcrystalline glass solder is 10 wt% of CaO and Al2O320 wt％、SiO255 wt％、ZnO 10wt％、B2O35 wt%; the glass thermal expansion coefficient of the microcrystalline glass solder is 6.5 multiplied by 10 at the temperature of 25-700 DEG C-6/℃。
The room temperature strength of the alumina joint connected with the microcrystalline glass prepared by the embodiment reaches 280MPa, and is improved by 30 percent compared with the common glass joint.
Example three:
the difference between the present embodiment and the first embodiment is:
in the method for connecting the alumina ceramics by using the microcrystalline glass solder in the embodiment, the welding treatment system of the step (3) in the brazing furnace is as follows: heating from room temperature to 350 deg.C at a speed of 10 deg.C/min, maintaining for 60min, heating to 1200 deg.C at a speed of 5 deg.C/min, maintaining for 40min, cooling to 860 deg.C at a speed of 20 deg.C/min, and maintaining for 1 h.
The room temperature strength of the alumina joint connected with the microcrystalline glass prepared by the embodiment reaches 274MPa, and is improved by 27.5 percent compared with the common glass joint.
Claims (9)
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Cited By (6)
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|---|---|---|---|---|
| CN113732565A (en) * | 2021-09-23 | 2021-12-03 | 广东省科学院新材料研究所 | Solder, preparation method and application thereof, welding method and ceramic component |
| CN113880430A (en) * | 2021-10-29 | 2022-01-04 | 长春工业大学 | Glass solder for connecting transparent magnesia-aluminum spinel ceramics and method for connecting transparent magnesia-aluminum spinel ceramics |
| CN113880426A (en) * | 2021-11-11 | 2022-01-04 | 广东省科学院新材料研究所 | Microcrystalline glass brazing filler metal for ceramic connection, preparation method thereof and ceramic connection method |
| CN114315401A (en) * | 2021-11-15 | 2022-04-12 | 长春工业大学 | A kind of instantaneous liquid phase connection method of alumina ceramics |
| CN115784719A (en) * | 2022-11-29 | 2023-03-14 | 云南雷迅科技有限公司 | Preparation method of composite mirror blank of ceramic-based reflecting mirror |
| CN116514566A (en) * | 2023-03-23 | 2023-08-01 | 江西博鑫环保科技股份有限公司 | A special high-temperature inorganic glue for all-ceramic membrane element combination and its combination process method |
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