CN113097528A - Electrode plate bonding device and electrode plate bonding method - Google Patents
Electrode plate bonding device and electrode plate bonding method Download PDFInfo
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- CN113097528A CN113097528A CN201911334872.0A CN201911334872A CN113097528A CN 113097528 A CN113097528 A CN 113097528A CN 201911334872 A CN201911334872 A CN 201911334872A CN 113097528 A CN113097528 A CN 113097528A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0297—Arrangements for joining electrodes, reservoir layers, heat exchange units or bipolar separators to each other
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01M—PROCESSES OR MEANS, e.g. BATTERIES, FOR THE DIRECT CONVERSION OF CHEMICAL ENERGY INTO ELECTRICAL ENERGY
- H01M8/00—Fuel cells; Manufacture thereof
- H01M8/02—Details
- H01M8/0202—Collectors; Separators, e.g. bipolar separators; Interconnectors
- H01M8/0267—Collectors; Separators, e.g. bipolar separators; Interconnectors having heating or cooling means, e.g. heaters or coolant flow channels
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02E—REDUCTION OF GREENHOUSE GAS [GHG] EMISSIONS, RELATED TO ENERGY GENERATION, TRANSMISSION OR DISTRIBUTION
- Y02E60/00—Enabling technologies; Technologies with a potential or indirect contribution to GHG emissions mitigation
- Y02E60/30—Hydrogen technology
- Y02E60/50—Fuel cells
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Abstract
The invention provides an electrode plate bonding device and an electrode plate bonding method, wherein the device comprises: a substrate for bonding the electrode plate through the upper surface; the positioning rod is vertically arranged on the substrate, and one end of the positioning rod extends out of the upper surface of the substrate and is used for penetrating through the electrode hole on the electrode plate so as to position the electrode plate; and the adjusting structure is arranged on the substrate and used for adjusting the position of the electrode plate. The contact ratio of the bonding surface is ensured, the pressure resistance of the bonded electrode plate is improved, and the pressure maintaining and leakage yield of the bonded electrode plate is increased.
Description
Technical Field
The invention relates to the technical field of proton exchange membrane fuel cells, in particular to an electrode plate bonding device and an electrode plate bonding method.
Background
A pem fuel cell is a power generation device that converts chemical energy present in a fuel and an oxidant directly into electrical energy. In a typical pem fuel cell, the membrane electrode is generally placed between two conductive plates, and the two unipolar plates are both provided with channels. The diversion grooves are arranged on the surface contacted with the membrane electrode and formed by die casting, stamping or mechanical milling and carving, and the number of the diversion grooves is more than one. The flow guide grooves on the inner side of the electrode plate are not only passages for fuel and oxidant to enter the surfaces of the anode and the cathode, but also water drainage passages for taking away water generated in the operation process of the battery. The antifreeze solution diversion trench on the outer side of the electrode plate is used for maintaining the temperature of the electrode plate and the surface of the membrane electrode not to be too high after the antifreeze solution is introduced.
However, in the conventional electrode plate, the adhesion of the electrode plate is realized by adopting a process edge positioning mode, due to the influences of precutting of a cutting die, molding of a die and the like, deviation and extension of a process edge and an adhesion position are caused, and the flow channel alignment of an antifreeze circulating cavity during the adhesion of a single plate is influenced, so that the flow channel of the cavity is blocked, heat generated in the conversion process of the battery cannot be effectively discharged, and when the heat is accumulated to a certain degree, a great safety accident is possibly caused.
Disclosure of Invention
In order to solve the above problems, the present invention provides an electrode plate bonding apparatus and an electrode plate bonding method, which overcome the above technical problems.
In order to achieve the above object, a first aspect of the present application provides an electrode plate bonding apparatus, the apparatus comprising: a substrate for bonding the electrode plate through the upper surface; the positioning rod is vertically arranged on the substrate, one end of the positioning rod extends out of the upper surface of the substrate, and the positioning rod is used for penetrating through the electrode hole in the electrode plate to position the electrode plate; and the adjusting structure is arranged on the substrate and used for adjusting the position of the electrode plate.
Optionally, the adjusting structure includes: a moving rod passing through the electrode hole; and the driving piece is arranged on the substrate, connected to the movable rod and used for driving the movable rod to move so as to drive the electrode plate to move.
Optionally, the driving member further includes: the threaded hole is formed in the moving rod; and the threaded rod is perpendicular to the moving rod and is in threaded connection with the threaded hole, and the length direction of the threaded rod is parallel to the moving path of the electrode plate.
Optionally, the adjusting structure further includes: the driving hole is formed in the base plate and used for placing the driving piece so that the threaded rod can rotate around the central axis of the threaded rod; and the moving hole is formed in the substrate, is communicated with the driving hole and is used for placing the moving rod, and the moving rod can freely move in a plane where the axial section of the moving hole is located.
Optionally, the adjusting structure further includes: the internal thread is arranged on the inner wall of the driving hole and is used for forming threaded connection with the threaded rod; and/or, the limiting ring groove is arranged on the inner wall of the driving hole; the limiting block is fixed on the threaded rod, winds the central axis of the threaded rod and rotates in the limiting ring groove, and the threaded rod is limited in movement in the length direction of the driving hole.
Optionally, the adjusting structure further includes: the driving motor is arranged at the end part, far away from the threaded hole, of the threaded rod and used for driving the threaded rod to rotate so that the threaded rod can drive the moving rod to move; and/or, the manual rotating piece is detachably fixed on the end part, far away from the threaded hole, of the threaded rod and is used for driving the threaded rod to rotate so that the threaded rod drives the moving rod to move.
Optionally, the driving hole is formed in the surface of the substrate, and the driving hole is arranged in a notch; moreover, the cross section of the driving hole is in a major arc arrangement.
Optionally, the number of the adjusting structures is set to be one or more; furthermore, the adjusting structure is used for adjusting the longitudinal position and/or the transverse position of the electrode plate.
Optionally, the apparatus further comprises: the side surface end plate is detachably fixed on the side surface of the base plate to be tightly attached to the electrode plate, one end of the side surface end plate extends out of the upper surface of the base plate, and the side surface, which is tightly attached to the electrode plate, in the side surface end plate is arranged in a smooth and flush manner and is used for limiting the electrode plate; the pressing plate is arranged above the substrate and used for pressurizing the bonded electrode plate, the pressing plate is parallel to the substrate, and the side surface of the pressing plate is tightly attached to the side surface of the side surface end plate which is tightly attached to the electrode plate; the handle is arranged on the side edge of the substrate.
The second aspect of the present application provides an electrode plate bonding method, which is applied to the above electrode plate bonding apparatus, and the method includes:
s11: brushing an adhesive on the upper surface of the substrate;
s12: after an electrode hole in a first electrode plate penetrates through a positioning rod and a moving rod, adhering the opposite side surface of the first electrode plate, which is provided with an anti-freezing groove, to the surface of the substrate, which is brushed with an adhesive;
s13: after an electrode hole of a second electrode plate penetrates through the positioning rod and the moving rod, adhering the side face, provided with the anti-freezing groove, of the second electrode plate to the surface, provided with the anti-freezing groove, of the first electrode plate; adjusting the position of the second electrode plate by rotating a threaded rod to drive a moving rod so as to adjust the second electrode plate to a preset position;
s14: after an electrode hole of a third electrode plate penetrates through the positioning rod and the moving rod, adhering the side face, provided with the anti-freezing groove, of the third electrode plate to the surface, provided with the anti-freezing groove, of the second electrode plate; adjusting the position of the third electrode plate by rotating a threaded rod to drive a moving rod so as to adjust the third electrode plate to a preset position;
s15: repeating the steps S13-S14 to position and bond a preset number of electrode plates;
s16: after the preset number of electrode plates are positioned and bonded, mounting side end plates, and limiting the electrode plates through the side end plates to position again;
s17: and covering a pressing plate to pressurize the positioned electrode plates so as to realize the bonding of the electrode plates.
The invention has the beneficial effects that: brushing an adhesive on the side surface of a first plate electrode with a diversion trench, placing the side surface of the first plate electrode, which is brushed with the adhesive, on the upper surface of a substrate to bond the first plate electrode and the substrate after an electrode hole in the first plate electrode passes through a positioning rod, and enabling an anti-freezing trench of the first plate electrode to be away from the substrate; then, after the electrode plate of the second electrode plate passes through the positioning rod, the side surface of the second electrode plate, in which the anti-freezing groove is formed, is placed towards the substrate, so that the second electrode plate and the electrode plates which are attached to the substrate are sequentially stacked, then the position of the second electrode plate is adjusted through the adjusting structure, so that the two electrode plates are aligned and attached, and the anti-freezing grooves of the two electrode plates are adapted to form an anti-freezing groove cavity; then, the operation is repeated with above-mentioned in order to place all the other plate electrodes to can improve the bonding location precision between the plate electrode, in addition, guarantee the contact ratio of bonding face, improve the compressive capacity of the plate electrode after the bonding, still increased the pressurize of the plate electrode after the bonding and the yields of string leakage.
Drawings
The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the invention and, together with the description, serve to explain the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic view of a fitting structure of an electrode plate in an electrode plate bonding apparatus according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an electrode plate bonding apparatus according to an embodiment of the present invention;
FIG. 3 is a plan view of an electrode plate bonding apparatus according to an embodiment of the present invention;
FIG. 4 is an exploded view of an electrode plate bonding apparatus according to an embodiment of the present invention;
fig. 5 is an enlarged view of a portion a in fig. 4.
10, a substrate; 11. pressing a plate; 12. a side end plate; 13. a handle; 141. a threaded rod; 1411. a manual rotating member; 1412. a limiting block; 142. positioning a rod; 143. a travel bar; 144. a drive aperture; 145. moving the hole; 146. an adapter hole; 15. an electrode plate; 151. and (5) an anti-freezing groove.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. The following description of at least one exemplary embodiment is merely illustrative in nature and is in no way intended to limit the invention, its application, or uses. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, components, and/or combinations thereof, unless the context clearly indicates otherwise.
The relative arrangement of the components and steps, the numerical expressions and numerical values set forth in these embodiments do not limit the scope of the present invention unless specifically stated otherwise. Meanwhile, it should be understood that the sizes of the respective portions shown in the drawings are not drawn in an actual proportional relationship for the convenience of description. Techniques, methods, and apparatus known to those of ordinary skill in the relevant art may not be discussed in detail but are intended to be part of the specification where appropriate. In all examples shown and discussed herein, any particular value should be construed as merely illustrative, and not limiting. Thus, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, further discussion thereof is not required in subsequent figures.
In order to facilitate an understanding of the embodiments of the present invention, the structure of the present invention will be described in detail with reference to several specific embodiments.
According to an embodiment of the present invention, as shown in fig. 1 to 5, there is provided an electrode plate bonding apparatus including: a substrate 10 for bonding an electrode plate 15 through an upper surface; a positioning rod 142 vertically disposed on the substrate 10, and one end of the positioning rod extends out of the upper surface of the substrate 10, and is used for passing through an electrode hole on the electrode plate 15 to position the electrode plate 15; and the adjusting structure is arranged on the substrate 10 and is used for adjusting the position of the electrode plate 15.
In this regard, brushing an adhesive on the side surface of the first electrode plate 15 with the diversion trench, placing the side surface of the first electrode plate 15 brushed with the adhesive on the upper surface of the substrate 10 to bond the first electrode plate 15 and the substrate 10 after the electrode hole of the first electrode plate 15 passes through the positioning rod 142, and enabling the anti-freezing groove 151 of the first electrode plate 15 to be away from the substrate 10; then, after the electrode plate 15 of the second electrode plate 15 passes through the positioning rod 142, the side surface of the second electrode plate 15 with the anti-freezing groove 151 is placed towards the substrate 10, so that the second electrode plate 15 and the electrode plates 15 attached to the substrate 10 are sequentially stacked, then the position of the second electrode plate 15 is adjusted through an adjusting structure, so that the two electrode plates 15 are aligned and attached, and the anti-freezing grooves 151 of the two electrode plates 15 are adapted to form an anti-freezing groove 151 cavity; then, the operation is repeated with above-mentioned in order to place remaining plate electrode 15 to can improve the bonding location precision between the plate electrode 15, in addition, guarantee the contact ratio of bonding face, improve the compressive capacity of the plate electrode 15 after bonding, still increase the non-defective products rate of pressurize and string leakage of the plate electrode 15 after bonding.
Specifically, in the present embodiment, the embodiment provides an electrode plate bonding apparatus, including: base plate 10, positioning rod 142 and adjustment structure.
The upper surface of the substrate 10 is used for bonding an electrode plate 15, wherein the electrode plate 15 is a monopolar plate, and the electrode plate 15 may be an anode monopolar plate used for a fuel cell or a cathode monopolar plate used for a fuel cell.
Moreover, a diversion trench is formed on one side of the electrode plate 15, and an anti-freezing trench 151 is formed on the other opposite side of the electrode plate 15. The flow guide groove is a channel for fuel and oxidant to enter the anode and cathode surfaces, and is a drainage channel for taking away water generated in the operation process of the cell. The antifreeze tank 151 is used to maintain the temperature of the electrode plate 15 and the surface of the membrane electrode not too high after being filled with antifreeze.
Moreover, in this embodiment, the diversion trenches and the anti-freezing trenches 151 may be formed by die casting, stamping, or mechanical milling, and the number of the diversion trenches and the anti-freezing trenches is more than one.
In addition, the electrode plate 15 can be made of a metal material or a graphite material (e.g., a flexible graphite material), and in this embodiment, the material of the electrode plate 15 is not limited, and only needs to meet the requirements of this embodiment.
Optionally, in this embodiment, the side surface of the electrode plate 15 with the flow guiding groove is bonded to the upper surface of the substrate 10.
The positioning rod 142 is vertically disposed on the substrate 10, and preferably, one end of the positioning rod 142 is fixed on the upper surface of the substrate 10, and the other end of the positioning rod 142 extends out of the upper surface of the substrate 10, and the positioning rod 142 is vertical to the substrate 10.
The adjustment structure is also provided on the substrate 10 for adjusting the position of the electrode plate 15.
Specifically, brushing an adhesive on the side surface of the first electrode plate 15 with the diversion trench, placing the side surface of the first electrode plate 15, on which the adhesive is brushed, on the upper surface of the substrate 10 to bond the first electrode plate 15 and the substrate 10 after the electrode hole in the first electrode plate 15 passes through the positioning rod 142, and enabling the anti-freezing groove 151 of the first electrode plate 15 to be away from the substrate 10; then, after the electrode plate 15 of the second electrode plate 15 passes through the positioning rod 142, the side surface of the second electrode plate 15 with the anti-freezing groove 151 is placed towards the substrate 10, so that the second electrode plate 15 and the electrode plates 15 attached to the substrate 10 are sequentially stacked, then the position of the second electrode plate 15 is adjusted through an adjusting structure, so that the two electrode plates 15 are aligned and attached, and the anti-freezing grooves 151 of the two electrode plates 15 are adapted to form an anti-freezing groove 151 cavity; then, the operation is repeated with above-mentioned in order to place remaining plate electrode 15 to can improve the bonding location precision between the plate electrode 15, in addition, guarantee the contact ratio of bonding face, improve the compressive capacity of the plate electrode 15 after bonding, still increase the non-defective products rate of pressurize and string leakage of the plate electrode 15 after bonding.
In another embodiment, the adjusting structure comprises: a moving rod 143 and a driving member, wherein the moving rod 143 passes through the electrode hole, the driving member is disposed on the substrate 10, the driving member is connected to the moving rod 143, and the driving member drives the moving rod 143 to move, so that the moving rod 143 drives the electrode plate 15 to move.
In this embodiment, the driving member is not limited, and includes: a threaded hole and a threaded rod 141, wherein the threaded hole is opened on the moving rod 143, and optionally, the threaded hole is opened at one end of the moving rod 143. The screw rod 141 is perpendicular to the moving rod 143, the screw rod 141 is screwed into the screw hole, and a longitudinal direction of the screw rod 141 is parallel to a moving path of the electrode plate 15.
Specifically, in this embodiment, after the electrode hole of the electrode plate 15 is sleeved on the outer circumference of the moving rod 143, by rotating the threaded rod 141, the moving rod 143 can be driven by the threaded rod 141 to move along the length direction of the threaded rod 141, so that the moving rod 143 drives the electrode plate 15 to move, that is: so that the moving rod 143 moves the electrode plate 15.
Of course, in another embodiment, the driving member may also be a straight rod, and an end of the straight rod is fixed to an end of the moving rod 143, so as to move the moving rod 143 by moving the straight rod back and forth.
Moreover, in another embodiment, the adjustment structure further includes: a driving hole 144 and a moving hole 145, wherein the driving hole 144 is opened on the substrate 10, and the driving hole 144 is used for placing the threaded rod 141 for the threaded rod 141 to rotate around the central axis of the threaded rod 141; and a moving hole 145 is opened on the substrate 10, the moving hole 145 communicates with the driving hole 144, in this embodiment, the moving hole 145 is used for placing the moving rod 143, and the moving rod 143 is freely moved in a plane where an axial section of the moving hole 145 is located.
Of course, in another embodiment, the adjusting structure further comprises: and an internal thread provided on an inner wall of the driving hole 144 and constituting a screw-coupling with the screw rod 141. In this embodiment, the female screw has the same thread direction as the threaded hole formed in the moving rod 143. The threaded rod 141 is restricted by the internal thread to prevent the threaded rod 141 from being dislocated.
Of course, in another embodiment, the following setting can be made for the adjusting structure: a limit ring groove is formed on an inner wall of the driving hole 144, and a limit block 1412 is provided on the threaded rod 141, wherein the limit block 1412 rotates in the limit ring groove around a central axis of the threaded rod 141 and limits movement of the threaded rod 141 in a length direction of the driving hole 144. In this embodiment, the screw rod 141 is threaded only at a portion contacting the moving rod 143, and the length of the thread is required to be adjustable for the electrode plate 15. The limiting block 1412 can be configured as an annular structure surrounding the outer periphery of the threaded rod 141, but the limiting block 1412 can also be configured in an arc shape.
In terms of power output for driving the threaded rod 141 to rotate, in another embodiment, the adjusting structure further includes: and a driving motor, which is arranged at the end of the threaded rod 141 far away from the threaded hole in the present embodiment, and is used for driving the threaded rod 141 to rotate so that the threaded rod 141 drives the moving rod 143 to move.
Of course, the adjustment structure includes: the manual rotating element 1411, wherein the manual rotating element 1411 is detachably fixed to an end portion, far away from the threaded hole, of the threaded rod 141, and a user only needs to rotate the manual rotating element 1411 to drive the threaded rod 141 to rotate so that the threaded rod 141 drives the moving rod 143 to move.
In another embodiment, the driving hole 144 is opened on the surface of the substrate 10, and the driving hole 144 is a notch; moreover, the cross section of the driving hole 144 is a major arc. In this case, since the driving hole 144 communicates with the moving hole 145 and the screw rod 141 drives the moving rod 143 to move, the moving hole 145 is also provided in a notch shape in the present embodiment. After the electrode plate 15 is placed, the electrode plate 15 is superimposed over the driving hole 144 and the moving hole 145.
In another embodiment, the number of the adjusting structures is set to one or more; also, the adjustment structure is used to adjust the longitudinal position and/or the lateral position of the electrode plate 15.
Such as: in the present embodiment, two adjustment structures are provided, namely: two threaded rods 141 and two moving rods 143 are provided, wherein the two threaded rods 141 are vertically disposed and distributed on both sides of the substrate 10, so that the longitudinal position and the transverse position of the electrode plate 15 can be adjusted by the two adjusting structures.
Furthermore, in another embodiment, the apparatus further comprises: side end plate 12, pressure plate 11 and handle 13.
In this embodiment, the side end plate 12 is detachably fixed to the side of the substrate 10 to closely attach to the electrode plate 15, one end of the side end plate 12 extends out of the upper surface of the substrate 10, and the side of the side end plate 12 closely attached to the electrode plate 15 is smoothly flush with the side of the electrode plate 15 for limiting the electrode plate 15. Therefore, in the present embodiment, the side end plate 12 is used to perform secondary alignment limitation on the stacked electrode plates 15 to ensure the bonding accuracy between the electrode plates 15.
The pressing plate 11 is disposed above the substrate 10, the pressing plate 11 is used for pressing the bonded electrode plate 15, the pressing plate 11 is parallel to the substrate 10, and the side surface of the pressing plate 11 is closely attached to the side surface of the side surface end plate 12 closely attached to the electrode plate 15.
In another embodiment, the pressing plate 11 is also provided with an adapting hole 146 corresponding to the positioning rod 142 and the moving rod 143, and the size and shape of the adapting hole 146 are adapted to the size and shape of the corresponding positioning rod 142 or moving rod 143. The pressing plate 11 is limited by the positioning rod 142 or the moving rod 143 in the pressurizing process, so that the pressing plate 11 is prevented from shifting and driving the electrode plate 15 to shift under the action of pressure, and the accuracy of positioning and bonding the electrode plate 15 is ensured.
And a handle 13 is provided at a side of the base plate 10 to facilitate transportation and stabilize the electrode plate bonding apparatus.
In another embodiment, there is provided an electrode plate bonding method, which is implemented by the above-mentioned electrode plate bonding apparatus, and which includes:
s11: brushing an adhesive on the upper surface of the substrate 10;
s12: after the electrode hole in the first electrode plate 15 passes through the positioning rod 142 and the moving rod 143, the opposite side surface of the first electrode plate 15, in which the anti-freezing groove 151 is formed, is adhered to the surface of the substrate 10, on which the adhesive is brushed;
s13: after an electrode hole of a second electrode plate passes through the positioning rod 142 and the moving rod 143, adhering the side surface of the second electrode plate 15 with the anti-freezing groove 151 to the surface of the first electrode plate 15 with the anti-freezing groove 151; adjusting the position of the second electrode plate 15 by rotating the threaded rod 141 to drive the moving rod 143, so as to adjust the second electrode plate 15 to a preset position;
s14: after an electrode hole of a third electrode plate passes through the positioning rod 142 and the moving rod 143, adhering the side surface of the third electrode plate with the anti-freezing groove 151 to the surface of the second electrode plate 15 with the anti-freezing groove 151; adjusting the position of the third electrode plate 15 by rotating the threaded rod 141 to drive the moving rod 143 to adjust the third electrode plate 15 to a preset position;
s15: repeating the steps S13-S14 to position and bond a preset number of electrode plates;
s16: after the preset number of electrode plates 15 are positioned and bonded, mounting the side end plates 12, and limiting the electrode plates 15 through the side end plates 12 to position again;
s17: and covering the pressing plate 11 to pressurize the electrode plates 15 after positioning is completed, so as to realize the bonding of the electrode plates 15.
In order to better explain the structure of the electrode plate bonding apparatus and the electrode plate bonding method in this embodiment, the apparatus and the method in this embodiment are described below with reference to a specific application example.
Specifically, according to fig. 1 and 2, the present embodiment provides an electrode plate bonding apparatus for positioning and bonding a flexible graphite bipolar plate, wherein the apparatus comprises: base plate 10, locating lever 142, clamp plate 11, side end plate 12, two handles 13 and two regulation structures.
The two handles 13 are detachably fixed to the two wide and high surfaces of the base plate 10 by screws, respectively, and the side end plate 12 is detachably fixed to the long and high surface of the base plate 10 by screws.
Also, the two positioning rods 142 are both vertically disposed on the substrate 10.
The base plate 10 and the pressing plate 11 have the same size and shape, and after all the electrode plates are bonded, the base plate 10 and the pressing plate 11 are aligned up and down.
In addition, each of the adjusting structures includes a threaded rod 141, a moving rod 143, a driving hole 144, and a moving hole 145, and in the present embodiment, the two driving holes 144 are vertically disposed and are disposed in the substrate 10. Of course, the two threaded rods 141 are also vertically disposed.
Further, a wing nut is provided on an end of each of the threaded rods 141 remote from the moving rod 143, and the wing nut is exposed to the base plate 10 and is rotated to drive the threaded rods 141 to rotate.
Further, the orifice of one driving hole 144 is opened on the wide high surface of the base plate 10, and the orifice of one driving hole 144 is opened on the long high surface. Moreover, the two moving rods 143 are perpendicular to the base plate 10, and a threaded hole is opened at an end of each moving rod 143, and the threaded hole is threadedly coupled with an end of the corresponding driving rod.
In the specific process of electrode plate bonding, firstly, brushing an adhesive on the side of a diversion trench of a first electrode plate 15, then, after an electrode hole of the first electrode plate 15 passes through a positioning rod 142 and a moving rod 143, fixing the side surface of the first electrode plate 15 brushed with the adhesive on the upper surface of a substrate 10, wherein the first electrode plate 15 is a cathode unipolar plate of a cathode oxidant in the electrode plate 15 or an anode unipolar plate for anode fuel;
the second step is that the anti-freezing groove 151 of the second electrode plate 15 faces the anti-freezing groove 151 of the first electrode plate 15 bonded on the substrate 10, and the second electrode plate 15 passes through the positioning rod 142 and the moving rod 143, and then the second electrode plate 15 is stacked on the first electrode plate 15;
thirdly, the butterfly nuts are adjusted to drive the two threaded rods 141 to rotate, so that the corresponding moving rods 143 are driven to adjust the longitudinal position and the transverse position of the second unipolar plate, and the second unipolar plate is aligned with the first electrode plate 15 bonded on the substrate 10;
a fourth step of repeating the second and third steps to sequentially stack the remaining electrode plates 15 on the substrate 10;
fifthly, fixing the side end plates 12 on the long and high surfaces of the base plate 10 through screws so as to align and limit the stacked electrode plates 15 again and ensure the alignment and bonding accuracy of each electrode plate 15;
and a sixth step: the pressing plate 11 is capped to press the stacked electrode plates 15, thereby completing the bonding positioning of the electrode plates 15.
In the description of the present invention, it is to be understood that the directions or positional relationships indicated by the directional terms such as "front, rear, upper, lower, left, right", "lateral, vertical, horizontal" and "top, lower", etc., are generally based on the directions or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and in the case of not making a reverse explanation, these directional terms do not indicate and imply that the device or element being referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore, should not be construed as limiting the scope of the present invention; the terms "inner and outer" refer to the inner and outer relative to the profile of the respective component itself.
Spatially relative terms, such as "above … …," "above … …," "above … …," "above," and the like, may be used herein for ease of description to describe one device or feature's spatial relationship to another device or feature as illustrated in the figures. It will be understood that the spatially relative terms are intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures. For example, if a device in the figures is turned over, devices described as "above" or "on" other devices or configurations would then be oriented "below" or "under" the other devices or configurations. Thus, the exemplary term "above … …" can include both an orientation of "above … …" and "below … …". The device may be otherwise variously oriented (rotated 90 degrees or at other orientations) and the spatially relative descriptors used herein interpreted accordingly.
It should be noted that the terms "first", "second", and the like are used to define the components, and are only used for convenience of distinguishing the corresponding components, and the terms have no special meanings unless otherwise stated, and therefore, the scope of the present invention should not be construed as being limited.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. An electrode plate bonding apparatus, comprising:
a substrate (10) for bonding an electrode plate (15) via the upper surface;
the positioning rod (142) is vertically arranged on the substrate (10), and one end of the positioning rod extends out of the upper surface of the substrate (10) and is used for penetrating through an electrode hole in the electrode plate (15) to position the electrode plate (15);
and the adjusting structure is arranged on the substrate (10) and is used for adjusting the position of the electrode plate (15).
2. The apparatus of claim 1, wherein the adjustment structure comprises:
a travel rod (143) passing through the electrode hole;
the driving piece is arranged on the substrate (10), connected to the moving rod (143) and used for driving the moving rod (143) to move so that the moving rod (143) can drive the electrode plate (15) to move.
3. The device of claim 2, wherein the drive member further comprises:
the threaded hole is formed in the moving rod (143);
and a threaded rod (141) perpendicular to the moving rod (143) and in threaded connection with the threaded hole, wherein the length direction of the threaded rod (141) is parallel to the moving path of the electrode plate (15).
4. The apparatus of claim 3, wherein the adjustment structure further comprises:
the driving hole (144) is formed in the base plate (10) and used for placing the driving piece so that the threaded rod (141) can rotate around the central axis of the threaded rod (141);
and a moving hole (145) which is opened on the substrate (10), is communicated with the driving hole (144), is used for placing the moving rod (143), and the moving rod (143) can freely move in the plane of the axial section of the moving hole (145).
5. The apparatus of claim 4, wherein the adjustment structure further comprises:
the internal thread is arranged on the inner wall of the driving hole (144) and is used for forming threaded connection with the threaded rod (141);
and/or, a limit ring groove is arranged on the inner wall of the driving hole (144);
and a limiting block (1412) fixed to the threaded rod (141), wherein the limiting block (1412) rotates around the central axis of the threaded rod (141) in the limiting ring groove and limits the movement of the threaded rod (141) in the length direction of the driving hole (144).
6. The apparatus of claim 3, wherein the adjustment structure further comprises:
the driving motor is arranged at the end part, far away from the threaded hole, of the threaded rod (141) and used for driving the threaded rod (141) to rotate so that the threaded rod (141) can drive the moving rod (143) to move;
and/or a manual rotating piece (1411) which is detachably fixed at the end part, far away from the threaded hole, of the threaded rod (141) and is used for driving the threaded rod (141) to rotate so that the threaded rod (141) drives the moving rod (143) to move.
7. The device according to claim 4, characterized in that the driving hole (144) opens on the surface of the base plate (10), and the driving hole (144) is arranged in a notch;
moreover, the cross section of the driving hole (144) is arranged in a major arc.
8. The device according to any one of claims 2 to 7, wherein the number of the adjusting structures is set to one or more;
furthermore, the adjustment structure is used for adjusting the longitudinal position and/or the transverse position of the electrode plate (15).
9. The apparatus of claim 2, further comprising:
the side surface end plate (12) is detachably fixed on the side surface of the base plate (10) to be tightly attached to the electrode plate (15), one end of the side surface end plate (12) extends out of the upper surface of the base plate (10), and the side surface, which is tightly attached to the electrode plate (15), in the side surface end plate (12) is arranged in a smooth and flush mode so as to be used for limiting the electrode plate (15);
the pressing plate (11) is arranged above the substrate (10) and used for pressing the bonded electrode plate (15), the pressing plate (11) is parallel to the substrate (10), and the side surface of the pressing plate (11) is tightly attached to the side surface of the side surface end plate (12) which is tightly attached to the electrode plate (15);
and the handle (13) is arranged on the side edge of the base plate (10).
10. An electrode plate bonding method applied to the electrode plate bonding apparatus according to any one of claims 1 to 9, the method comprising:
s11: brushing an adhesive on the upper surface of the substrate (10);
s12: after an electrode hole in a first electrode plate (15) passes through a positioning rod (142) and a moving rod (143), adhering the opposite side surface of the first electrode plate (15) with an anti-freezing groove (151) formed therein to the surface of the substrate brushed with the adhesive;
s13: after an electrode hole of a second electrode plate (15) penetrates through the positioning rod (142) and the moving rod (143), adhering the side surface of the second electrode plate (15) with the anti-freezing groove (151) to the surface of the first electrode plate (15) with the anti-freezing groove (151); adjusting the position of the second electrode plate (15) by rotating a threaded rod (141) to drive a moving rod (143) to adjust the second electrode plate (15) to a preset position;
s14: after an electrode hole of a third electrode plate (15) penetrates through the positioning rod (142) and the moving rod (143), adhering the side surface of the third electrode plate (15) with the anti-freezing groove (151) to the surface of the second electrode plate (15) with the anti-freezing groove (151); adjusting the position of the third electrode plate (15) by rotating a threaded rod (141) to drive a moving rod (143) to adjust the third electrode plate (15) to a preset position;
s15: repeating the operations S13-S14 to position and bond a preset number of electrode plates (15);
s16: after the preset number of electrode plates (15) are positioned and bonded, mounting the side end plates (12), and limiting the electrode plates (15) through the side end plates (12) to perform positioning again;
s17: and covering a pressing plate (11) to pressurize the electrode plates (15) after positioning is finished, so that the electrode plates (15) are bonded.
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