CN113070644A - Microstructure array composite processing method - Google Patents
Microstructure array composite processing method Download PDFInfo
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- CN113070644A CN113070644A CN202110382294.9A CN202110382294A CN113070644A CN 113070644 A CN113070644 A CN 113070644A CN 202110382294 A CN202110382294 A CN 202110382294A CN 113070644 A CN113070644 A CN 113070644A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
- B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
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- B23Q—DETAILS, COMPONENTS, OR ACCESSORIES FOR MACHINE TOOLS, e.g. ARRANGEMENTS FOR COPYING OR CONTROLLING; MACHINE TOOLS IN GENERAL CHARACTERISED BY THE CONSTRUCTION OF PARTICULAR DETAILS OR COMPONENTS; COMBINATIONS OR ASSOCIATIONS OF METAL-WORKING MACHINES, NOT DIRECTED TO A PARTICULAR RESULT
- B23Q15/00—Automatic control or regulation of feed movement, cutting velocity or position of tool or work
- B23Q15/20—Automatic control or regulation of feed movement, cutting velocity or position of tool or work before or after the tool acts upon the workpiece
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- B—PERFORMING OPERATIONS; TRANSPORTING
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- B23Q17/20—Arrangements for observing, indicating or measuring on machine tools for indicating or measuring workpiece characteristics, e.g. contour, dimension, hardness
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Abstract
本发明涉及超精密加工技术领域，公开了一种微结构阵列复合加工方法，包括如下步骤：S1：对测量系统进行标定，测量系统包括接触式测量、白光干涉测量以及断层扫描三种测量方法；S2：分析待加工件并利用测量系统测量辅助调平与对刀，依据分析测量结果选择合适的加工方法对工件进行一次加工；S3：利用测量系统对加工后的工件进行测量，依据测量结果进行补偿加工至达到加工要求。本发明集成加工部分和测量部分，通过在加工过程中融入多种测量以辅助完成对刀，以及工件的高精度定位和调平，并实现对加工微结构阵列的实时监控，评价加工精度及加工质量并指导加工，形成闭环系统，有效地保证了加工精度的同时，提高了加工效率。
The invention relates to the technical field of ultra-precision machining, and discloses a composite machining method for a microstructure array, comprising the following steps: S1: calibrating a measurement system, where the measurement system includes three measurement methods: contact measurement, white light interferometry and tomography; S2: Analyze the workpiece to be processed and use the measuring system to measure the auxiliary leveling and tool setting, and select an appropriate processing method to process the workpiece once according to the analysis and measurement results; S3: Use the measuring system to measure the processed workpiece, and carry out processing according to the measurement results. Compensate processing to meet processing requirements. The invention integrates the machining part and the measuring part, and integrates various measurements in the machining process to assist in completing the tool setting, as well as the high-precision positioning and leveling of the workpiece, and realizes the real-time monitoring of the machining microstructure array, and evaluates the machining accuracy and machining accuracy. Quality and guide processing, forming a closed-loop system, effectively ensuring processing accuracy and improving processing efficiency.
Description
Technical Field
The invention relates to the technical field of ultra-precision machining, in particular to a microstructure array composite machining method.
Background
The microstructure array refers to a device with a certain regularity in surface distribution and a microscopic geometrical topological shape, and is widely applied to various fields such as optics, machinery, heat, biomedicine and the like due to the superior performance of the device. The microstructure array is often designed to have a specific shape and size according to specific application requirements, so that the surface quality and geometric dimension errors of the microstructure array directly affect the application performance. As the market demands for the functionality, precision and manufacturing efficiency of microstructure arrays are increasing, the machining precision and efficiency of the machining system also needs to be increased.
The existing micro-structure array processing method is still the main processing means of ultra-precision cutting at present, and at present, a composite processing method aiming at the micro-structure array is rarely available in the field of ultra-precision processing. Ultra-precision measurement is an important means for guaranteeing and checking the manufacturing precision of microstructures, common microstructure array measurement methods are mainly divided into contact measurement and non-contact measurement, and different measurement methods have different advantages and defects and are suitable for different product requirements.
However, in the existing microstructure processing and measuring method, the processing and measuring processes are relatively independent, the measuring result cannot be fed back to the processing process in time, a closed loop cannot be formed, and the links such as leveling and tool setting in the processing are difficult to guide in real time. Therefore, the geometric accuracy and surface quality of the microstructure array cannot be guaranteed.
Disclosure of Invention
Aiming at the defects in the prior art, the invention aims to provide a composite processing method of a microstructure array, which integrates a composite processing method of in-situ measurement to realize the controllable processing of the microstructure array, improve the processing efficiency and ensure the processing precision and quality.
In order to achieve the above purpose, the invention provides the following technical scheme:
a composite processing method of a microstructure array comprises the following steps:
s1: calibrating a measuring system, wherein the measuring system comprises three measuring methods of contact measurement, white light interferometry and tomography;
s2: analyzing a workpiece to be machined, assisting leveling and tool setting by utilizing a contact measurement method and a tomography measurement method respectively, and selecting a machining method to machine the workpiece once according to an analysis measurement result;
s3: and measuring the machined workpiece by using the measuring system, and performing compensation machining according to a measuring result until the machining requirement is met.
Further, the analyzing the workpiece to be processed and using the measurement system to assist leveling and tool setting in step S2 includes:
s20: analyzing a workpiece to be processed, selecting at least one processing method, and designing a processing path and processing parameters; s21: measuring the surface profile of the workpiece to be processed by using a contact measurement method to finish high-precision leveling of the workpiece; s22: and (4) trial machining is carried out on the workpiece to be machined, and a trial machining result is measured by adopting a tomography measurement method, so that high-precision tool setting is completed.
In the present invention, preferably, the machining method includes ultra-precision milling, ultra-precision fly-cutting, and ultra-precision planing.
Further, in the process of finishing the high-precision leveling of the workpiece in step S21, the inclination angle of the workpiece to be processed needs to be adjusted for multiple times until a preset value is met.
Further, the step of adjusting the inclination angle of the workpiece to be processed for multiple times until the preset value is met is as follows:
s210: measuring the surface profile of the workpiece to be processed by using a contact measurement method to obtain measurement data;
s211: performing plane fitting on the measured data to obtain an included angle between a fitting plane and an XY axis;
s212: and correspondingly reducing the inclination angle of the workpiece according to the included angle, and repeating the steps until the inclination angle of the processed workpiece is smaller than a preset value.
In the present invention, further, the measuring of the trial machining result in the step S22 by the tomography measuring method includes acquiring a depth of the measuring structure, and acquiring a relative height of the tool to the surface of the workpiece according to the depth.
In the present invention, further, the step S1 includes:
s10: processing a small-range microstructure array on the trial cut piece;
s11: respectively measuring the small-range microstructure array by using three measuring methods;
s12: carrying out space matching on the measurement result and the ideal processing model;
s13: and acquiring the spatial position relations among different measuring heads and between the measuring heads and the cutter.
In the present invention, preferably, the step S3 includes:
s30: measuring the machined workpiece, acquiring surface roughness by adopting a tomography measuring method, and acquiring surface shape errors by adopting a white light interferometry method;
s31: compensating the machining path and the machining parameters according to the measurement result;
s32: performing compensation processing according to the processing path and the processing parameters in the S31;
s33: and repeating the steps S30 to S32 until the processed workpiece reaches the processing precision requirement.
In the present invention, further, the method further includes S4: and (5) replacing the machining method, and repeating the steps S2 and S3.
Compared with the prior art, the invention has the beneficial effects that:
(1) the invention integrates the processing part and the measuring part, and assists in finishing tool setting and high-precision positioning and leveling of workpieces by three different measuring methods in the measuring system, and selects different slave measuring methods for different processing by integrating different measurements in the processing process, thereby realizing real-time monitoring of the processed microstructure array, evaluating the processing precision and the processing quality and guiding the processing to form a closed-loop system, effectively ensuring the processing precision of the microstructure array and improving the processing efficiency.
(2) The measurement part of the invention integrates three measurement methods of contact measurement, white light interferometry and tomography, can realize the acquisition of microstructure array morphology and surface quality, can fuse high-frequency errors and medium-low frequency errors, and realizes the full-band error analysis of a processing structure.
(3) The processing part of the invention integrates three processing modes of ultra-precise milling, ultra-precise fly-cutting and ultra-precise planing, and avoids the defect of a single processing mode, so the invention can be suitable for processing microstructures with various shapes, and the processing precision and the processing efficiency can be effectively improved by the cooperation of a plurality of processing modes.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a flow chart of a method of composite fabrication of a microstructure array;
FIG. 2 is a schematic diagram of a micro-structured array composite processing system;
FIG. 3 is a flow chart of calibration of a measurement system in a microstructure array composite fabrication method;
fig. 4 is a flowchart of step S2 in the microstructure array composite processing method;
FIG. 5 is a flow chart of workpiece leveling in a micro-structure array composite processing method;
FIG. 6 is a flow chart of compensation processing in a microstructure array composite processing method;
FIG. 7 is a flowchart illustrating a method for fabricating a microlens array according to one embodiment;
FIG. 8 is a schematic structural diagram of a microlens array before processing according to one embodiment;
FIG. 9 is a schematic diagram of a microlens array structure after processing according to one embodiment;
FIG. 10 is a flow chart of a method for processing a microprism array of the second embodiment;
FIG. 11 is a schematic view of a microprism array structure of example two prior to processing;
fig. 12 is a schematic view of the structure of the microprism array of example two after processing.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, a preferred embodiment of the present invention provides a method for composite processing of a microstructure array, comprising the following steps:
s1: calibrating a measuring system, wherein the measuring system comprises three measuring methods of contact measurement, white light interferometry and tomography;
s2: analyzing a workpiece to be machined, assisting leveling and tool setting by utilizing a contact measurement method and a tomography measurement method respectively, and selecting a proper machining method to machine the workpiece once according to an analysis measurement result;
s3: and measuring the machined workpiece by using the measuring system, and performing compensation machining according to a measuring result until the machining requirement is met.
In the application, through the combination of hardware and software in a measuring system, the measuring system comprises three measuring methods of contact measurement, white light interferometry and tomography, and the measuring system is calibrated to obtain the transformation relation between multi-measuring-head measuring coordinate systems and a processing coordinate system, so that the path planning and the cutter positioning in the subsequent processing process are facilitated. Then, the workpiece to be processed is analyzed and measured, and the accuracy of the processing process is ensured. After the primary processing is finished, the workpiece is measured again, and the analysis and measurement result is fed back to the processing process, so that the processing path and parameters are changed, compensation processing is carried out, until the workpiece meets the processing requirement, the microstructure array processing and the measurement process are effectively integrated to form a closed-loop control system, the processing precision is guaranteed, and the processing efficiency is improved.
Specifically, as shown in fig. 2, the composite machining system constructed by the machining method includes a measurement system and a shafting motion system, the shafting motion system includes an X-axis guide rail 1, a Y-axis guide rail 2 and a Z-axis guide rail 3, the measurement system, the main shaft 4 and the tool holder 6 are adjusted in position by the shafting motion system, and the specific multi-axis linkage can refer to an implementation manner in the prior art, such as patent No. CN201911404095.2, and the invention is not further described. The inclination angle platform 9 is positioned on the upper side of the X guide rail 1, the objective table is fixed on the inclination angle platform 9, and workpieces to be processed and trial-cut workpieces are fixed on two sides of the objective table. The measuring system comprises a white light interference measuring head 5, a contact measuring head 7 and a tomography measuring head 8, the contact measuring head 7 is adopted to realize contact measurement, and the measuring system has the characteristics of high reliability, high longitudinal precision, simplicity and convenience in operation and the like. In the non-contact measurement method, the white light interference measuring head 5 can measure the surface quality of the microstructure array, but the conventional white light interference measurement equipment has larger size, and meanwhile, the white light interference requires that the measured surface gradient cannot be too large, otherwise, the problem of measurement data loss occurs; the tomography probe 8 is also a commonly used microstructure array measuring method, and has the advantages of high speed, high efficiency, capability of measuring a structure with a larger scale, and low measuring precision. Therefore, the invention adopts the combination of the three methods, effectively makes up the defects brought by each measuring method, and selects a proper processing method in different processing processes to improve the processing precision.
In addition, three different measuring methods are realized through three measuring heads, the microstructure array morphology and the surface quality are further obtained, high-frequency errors and medium-low frequency errors can be fused, and the full-band error analysis of the processing structure is realized.
In the embodiment, the cutter clamp 6 is provided with a milling cutter, and can also be provided with a planer cutter and a fly-cutting cutter according to needs, and the processing part integrates three processing methods of ultra-precision milling, ultra-precision fly-cutting and ultra-precision planing, so that the defect of a single processing mode is avoided, and the micro-structure processing tool can be suitable for processing micro-structures in various shapes, and the processing precision and the processing efficiency can be effectively improved by the cooperation of multiple processing modes.
In a specific embodiment of the present invention, as shown in fig. 3, before the part is machined, the above-mentioned measuring system is calibrated, and the calibration steps are as follows:
s10: processing a small-range microstructure array on the trial cut piece;
specifically, one processing means in the processing selection processing part is selected to process a workpiece to be processed, a cutter is installed, the cutter is controlled by a shafting motion system to process a trial cut piece, the space coordinate of the cutter in a processing coordinate system at the moment is recorded, and the space coordinate of the cutter microstructure is calculated according to the space coordinate of the cutter.
S11: measuring the small-range microstructure array by three different measuring methods;
specifically, a contact probe 8, a white light interference probe 5 and a tomography probe 7 are respectively adopted to respectively measure the three-dimensional shape of the processed microstructure array.
S12: carrying out space matching on the measurement result and the ideal processing model;
s13: and acquiring the spatial position relations among different measuring heads and between the measuring heads and the cutter.
Specifically, the measurement data of the contact measuring head 8, the white light interference measuring head 5 and the tomography measuring head 7 are matched with an ideal processing array surface model, and the spatial coordinates of the contact measuring head 8, the white light interference measuring head 5 and the tomography measuring head 7 under a processing coordinate system are obtained according to the spatial relative position relationship between the measurement data and the microstructure array.
Therefore, the calibration of the measuring system is completed, the transformation relation between the measuring coordinate systems of the multiple measuring heads and the machining coordinate system is obtained through the calibration process, the three measuring heads are effectively positioned, so that the accurate measurement of the workpiece to be machined is realized in the subsequent machining process, and the precision of part machining is ensured.
Further, as shown in fig. 4, in a specific embodiment of the present invention, when a part is machined, the part to be machined is first analyzed, that is, step S20: analyzing the workpiece to be processed, selecting a proper processing mode and a proper cutter and designing a processing path and technological parameters according to the structural form and characteristics of the workpiece and the material to be processed. For example, for a microstructure array formed by a revolution surface, an ultra-precision milling method is adopted by taking a microlens array as an example; aiming at the microstructure array formed by the pyramid and the like, the machining efficiency and the machining precision are improved by adopting a planing and fly cutting method by taking the micro prism array as an example.
Due to the different processing methods used for different microarray structures, for example, the microlens array only needs a single processing method, i.e., only one processing mode is needed. Most microarray structures require multiple processing steps for complex processing. Therefore, in the present invention, for a microarray structure requiring a plurality of processing methods, after one processing method is completed, step S4 is performed: and (5) replacing the processing method, and continuing to the steps S2 and S3, so that the composite processing of the microarray structure is realized.
Further, after the machining route planning is completed, step S21 is performed: and (4) measuring the surface profile of the workpiece to be processed in situ to finish high-precision leveling of the workpiece. In order to realize high-precision leveling, in the process, the inclination angle of the workpiece to be machined needs to be adjusted for multiple times until a preset value is met, and as shown in fig. 5, the specific leveling process is as follows:
s210: placing the to-be-processed workpiece with a smooth surface on an objective table, and controlling a contact type measuring head 8 through a shafting motion system to measure the surface profile of the to-be-processed workpiece to obtain measurement data;
s211: performing plane fitting on the measured data to obtain an included angle between a fitting plane and an XY axis;
s212: and correspondingly adjusting the inclination angle platform 9 according to the included angle to reduce the inclination angle of the workpiece to be machined, and repeating the steps until the inclination angle of the workpiece to be machined is smaller than a preset value, so that the leveling precision of the workpiece to be machined is ensured, and the preset value is set differently according to the material property of the workpiece to be machined.
Therefore, the leveling process of the workpiece to be machined is realized, the in-situ measurement means is adopted for auxiliary leveling in the process, the high-precision leveling of the workpiece to be machined with the free-form surface is realized, the machining precision of the workpiece to be machined is further improved, and the method has important significance for improving the machining efficiency and realizing the high-precision machining process.
Further, in an embodiment of the present invention, after the leveling of the workpiece is completed in step S21, the process proceeds to step S22: and (4) performing trial machining on the workpiece to be machined, and measuring a trial machining result by adopting a tomography measurement method to finish high-precision tool setting. Specifically, in the process, after the tool is mounted, the tool is controlled by the shafting motion system to perform trial machining on the workpiece to be machined, the depth of the measurement structure is obtained through the measurement part, and the relative height between the tool and the surface of the workpiece is obtained according to the depth, so that the tool setting process is completed. In the prior art, the tool setting accuracy is low through a trial machining mode, the surface of a workpiece is easy to damage, but the tool setting mode of the trial machining is low in cost and simple to operate, so that in order to make up for the defects caused by the tool setting mode of the trial machining, a measuring method of fault layer scanning is integrated in the tool setting process, the high-precision measuring and trial cutting processes can be directly completed through the integrated equipment, and the accuracy of the trial cutting process is improved.
Further, the machining path and the machining parameters of step S20 control the machining part to machine the workpiece through the shafting motion system.
Thus, the primary processing of the workpiece to be processed is completed, and because the primary processing has low precision and the processing path may have certain deviation, it is difficult to ensure the geometric precision and the surface quality of the microstructure array, in the invention, the secondary processing, i.e. the compensation processing, is designed, as shown in fig. 6, the specific steps are as follows:
s30: measuring the machined workpiece to obtain surface roughness and surface shape errors;
s31: compensating the machining path and the machining parameters according to the measurement result;
s32: the compensation processing is performed according to the processing path and the processing parameters in S31.
S33: and repeating the steps S30 to S32 until the processed workpiece reaches the processing precision requirement.
Specifically, the surface roughness and the surface shape error can be obtained by measuring and analyzing the white light interference measuring head 5 and the tomography measuring head 7, and if the measuring result does not meet the machining precision requirement, the secondary machining area is determined according to the measuring result, and corresponding machining parameters and machining paths are set. And repeating the steps S30 to S32 until the processed workpiece reaches the processing precision requirement, and until the array reaches the processing precision requirement.
Therefore, the compensation processing of the microstructure array is completed, the microstructure array after primary processing is measured by the measuring part to complete the planning of the path of the compensation processing area through the compensation processing process, and compared with a compensation processing method in the prior art in which a cutter is used as a sensor to scan the shape, the method has higher measurement precision, ensures the geometric precision and the surface quality of the microstructure array, is fully suitable for the processing of the optical microstructure array, and increases the application range.
In conclusion, the invention integrates processing and measurement, wherein the processing part integrates three processing modes of ultra-precise milling, ultra-precise fly cutting and ultra-precise planing, and the processing modes have diversity. The measurement part integrates three measurement modes of contact measurement, white light interferometry and tomography, links such as leveling and tool setting are assisted through multi-step in-situ measurement in the machining process, and the measurement result of the surface of the microstructure array is fed back to correct the machining path and improve the machining process, so that the machining precision and the surface quality are ensured. Therefore, the problems that the microstructure array in the prior art is single in processing mode, low in processing efficiency and difficult to ensure processing precision and surface quality are solved.
The first embodiment is as follows:
the embodiment is a further description of the above method, and specifically provides a method for processing a microlens array, where a calibration process of a measurement system is the same as that of the first embodiment, as shown in fig. 7, the specific implementation method is as follows:
(1) and analyzing the micro lens array, as shown in fig. 8, selecting an ultra-precision milling method for processing the micro lens array structure according to the structural property, selecting a proper cutter and designing a processing path and process parameters.
(2) And leveling the workpiece. Fixing the microlens array with a smooth surface on an objective table, controlling a contact type measuring head 8 through a shafting motion system to measure the surface profile of the microlens array, carrying out plane fitting on measured data, solving the included angle between a fitting plane and an XY axis, and correspondingly adjusting an inclination table 9 to reduce the workpiece inclination. And measuring the surface profile by using the contact measuring head 8 again, fitting a plane by using the measured data, and calculating and adjusting the included angle between the workpiece and the XY axis after the workpiece is adjusted again. And repeating the process until the surface inclination angle of the micro-lens array is smaller than a preset value, and finishing the leveling of the micro-lens array.
(3) And (5) installing the milling cutter. And controlling the milling cutter to perform trial machining on the micro-lens array through a shafting motion system, measuring a trial machining structure through a tomography measuring head 7, calculating the relative height between the cutter and the surface of the workpiece according to the depth of the measuring structure, and finishing the cutter setting process.
(4) And controlling a milling cutter to process the micro-lens array through a shafting motion system according to the designed processing path.
(5) After one-time processing is finished, the surface shape profile of the micro lens array is measured by using the tomography measuring head 7, and the measured surface shape data is matched with the theoretical surface shape model of the micro lens array to obtain error information. And measuring high-frequency information such as surface quality and the like of the micro lens array by using the white light interference measuring head 5, and analyzing the measured data to obtain parameters such as surface roughness and the like of the micro lens array.
(6) And if the machining error and the surface roughness of the micro lens array do not meet the machining precision requirement, determining a secondary machining area according to the error distribution of the workpiece, and setting corresponding machining parameters and machining paths. And (5) repeating the steps (4), (5) and (6) until the array meets the processing precision requirement.
The high-precision machining of the micro lens array can be realized through the steps, the machining result refers to fig. 9, the high-precision machining of the micro lens array is a single machining method, and the machining mode does not need to be changed in the machining process.
Example two:
the difference between the present embodiment and the present embodiment is that the present embodiment provides a method for processing a micro prism array, where the processing of the micro prism array is a composite processing, and the processing mode needs to be changed in the processing process, as shown in fig. 10, the specific steps are as follows:
(1) the microprism array is analyzed, as shown in fig. 11, according to the structural form and characteristics thereof and the material to be processed, ultra-precise planing is selected for rough processing, ultra-precise fly-cutting is selected for fine processing, and processing paths and process parameters are respectively designed.
(2) The leveling process is the same as the micro-lens array processing leveling process.
(3) And adjusting the angle of the cutter and carrying out tool setting. Installing a planer tool for grinding a certain angle, adjusting the angle of the planer tool, controlling the planer tool to trial cut the microprism array by a shafting motion system, measuring a V-shaped groove formed by cutting by a tomography measuring head 7, obtaining the surface angle of the tool relative to a workpiece according to the measured groove angle, continuing to measure until the condition that the tool is perpendicular to the surface of the microprism array is met after adjusting the angle of the planer tool, calculating the relative height between the planing tool and the surface of the microprism array according to the groove depth, and finishing the planing tool setting process.
(4) And according to the designed rough machining path, controlling a planer tool to machine the microprism array by a shafting motion system.
(5) And after the primary rough machining is finished, measuring the microprism array by using a tomography measuring head, and matching the measured surface shape data with the theoretical model to obtain a machining error.
(6) And if the processing error of the array does not reach the requirement of rough processing precision, setting parameters and paths for compensation processing according to error distribution. And (5) repeating the steps (4), (5) and (6) until the array meets the requirement of rough machining precision.
(7) And (5) detaching the planer tool and installing the fly cutter.
(8) The flying cutter is controlled by a shafting motion system to trial cut the workpiece, a cutting V-shaped groove is measured by a tomography measuring head 7, the angle of the flying cutter relative to the surface of the workpiece is obtained according to the measured groove angle, the measurement is continued after the angle of the flying cutter is adjusted until the condition that the cutter is perpendicular to the surface of the workpiece to be machined is met, the relative height of the cutter and the surface of the workpiece is calculated according to the groove depth, and the tool setting process of the flying cutter is completed.
(9) And controlling the fly cutter to machine the workpiece through a shafting motion system according to the designed finish machining path.
(10) After one-time processing is finished, the surface profile of the microprism array is measured by using the tomography measuring head 7, and the measured surface profile data is matched with the theoretical surface profile model of the microprism array to obtain error information. And measuring high-frequency information such as surface quality and the like of the microprism array by using the white light interference measuring head 5, and analyzing the measured data to obtain parameters such as surface roughness and the like of the microprism array.
(11) And if the machining error and the surface roughness of the micro prism array do not meet the precision finishing requirement, setting parameters and paths for compensation machining according to error distribution. And (5) repeating the steps (9), (10) and (11) until the array meets the precision finishing requirement.
By adopting the planing, fly-cutting and combined machining mode in the steps, the high-efficiency and high-precision machining of the microprism array can be realized, and the machining result is shown in fig. 12.
The above description is intended to describe in detail the preferred embodiments of the present invention, but the embodiments are not intended to limit the scope of the claims of the present invention, and all equivalent changes and modifications made within the technical spirit of the present invention should fall within the scope of the claims of the present invention.
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