CN113053865A - LED chip assembly, LED device and manufacturing method thereof - Google Patents
LED chip assembly, LED device and manufacturing method thereof Download PDFInfo
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- CN113053865A CN113053865A CN202010128155.9A CN202010128155A CN113053865A CN 113053865 A CN113053865 A CN 113053865A CN 202010128155 A CN202010128155 A CN 202010128155A CN 113053865 A CN113053865 A CN 113053865A
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
- H01L25/167—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits comprising optoelectronic devices, e.g. LED, photodiodes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
- H01L25/50—Multistep manufacturing processes of assemblies consisting of devices, the devices being individual devices of subclass H10D or integrated devices of class H10
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/852—Encapsulations
- H10H20/854—Encapsulations characterised by their material, e.g. epoxy or silicone resins
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/855—Optical field-shaping means, e.g. lenses
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- Condensed Matter Physics & Semiconductors (AREA)
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- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Led Device Packages (AREA)
Abstract
The invention provides an LED chip assembly, an LED device and a manufacturing method thereof.A flip LED chip is arranged on the front surface of an adhesive film, and a positive electrode and a negative electrode of the flip LED chip are adhered on the front surface of the adhesive film; forming a first adhesive layer which covers and encapsulates the flip LED chips on the front surface of the adhesive film; then forming a second adhesive layer used for reducing light energy emitted from the light emitting surface on the front side of the LED chip on the first adhesive layer, wherein the second adhesive layer at least partially covers the light emitting surface on the front side of each LED chip and does not cover the first adhesive layer between the adjacent LED chips; then cut first glue film and obtain a plurality of LED chip subassemblies, because LED flip chip is formed with the second glue film that is used for reducing the light energy on openly to can reduce the difference between the light energy of flip LED chip forward normal direction light energy and four sides, promote luminous colour's homogeneity.
Description
Technical Field
The invention relates to the field of Light Emitting Diodes (LEDs), in particular to an LED chip assembly, an LED device and a method for manufacturing the same.
Background
The video quality directly influences the emotion and the life quality of people, and the ultra-high-definition video 8K is the future development direction. The Mini LED and the Micro LED can be used as backlight and direct display, and the development requirement of ultra-high definition video is met. Both backlight (blue or white) and direct display (RGB) require uniform light emission and consistent color. Currently, a Mini LED is adopted as a first backlight mode: the flip blue light chip with a certain distance is placed and fixed on the substrate, after a layer of transparent adhesive layer is molded, the blue light is emitted after the current is introduced to drive the blue light chip, the blue light is converted into white light after exciting a QD film (quantum dot film) and is used as a backlight source of the liquid crystal television, and the light intensity of the forward normal direction of the chip is far greater than the periphery of the chip, so the uniformity of the light emitting color is not ideal. Another way of using the Mini LED as a backlight is two: after a flip blue light chip with a certain distance is placed and fixed on a substrate, a layer of fluorescent adhesive layer (RG powder or YG powder and the like) is molded, current is introduced to drive the blue light chip to emit blue light, the blue light excites the fluorescent adhesive layer to mix light and then emits white light to serve as a backlight source of the liquid crystal television. Therefore, in both the first and second modes, the emission color of the backlight is not uniform enough, and the color uniformity is not good enough. The main reason is that the light energy in the forward normal direction of the blue light chip is much higher than the light energy of the four sides.
Disclosure of Invention
The invention provides an LED chip assembly, an LED device and a manufacturing method thereof, and solves the problem that the light energy of the conventional LED chip in the normal direction is much higher than that of four side surfaces, so that the luminous color is not uniform enough.
In order to solve the above technical problem, an embodiment of the present invention provides a method for manufacturing an LED chip assembly with uniform light emission, including:
arranging a flip LED chip on the front surface of the adhesive film, wherein a positive electrode and a negative electrode of the LED flip chip are adhered to the front surface of the adhesive film;
forming a first adhesive layer which covers and encapsulates the flip LED chips on the front surface of the adhesive film;
forming a second adhesive layer used for reducing light energy emitted from the light emitting surface on the front surface of the LED chip on the first adhesive layer, wherein the second adhesive layer at least partially covers the light emitting surface on the front surface of each LED chip and does not cover the first adhesive layer between the adjacent LED chips;
and cutting the first adhesive layer to obtain a plurality of LED chip assemblies, wherein each LED chip assembly comprises at least one LED flip chip.
Optionally, the second adhesive layer covers the front light-emitting surface of the LED chip, and the area of the second adhesive layer is matched with the area of the front light-emitting surface of the LED chip.
Optionally, the arranging the flip LED chip on the front surface of the adhesive film includes:
arranging flip LED chips on the front surface of the adhesive film according to the distribution of the corresponding chip electrode pads on the substrate;
and cutting the first adhesive layer to obtain a plurality of LED chip assemblies, wherein each LED chip assembly comprises at least two LED chips.
Optionally, the at least two flip chips are distributed in an nxn matrix, where N is an integer greater than or equal to 2;
or, the at least two flip chips are distributed in an MxN matrix, wherein N is an integer greater than or equal to 2, M is an integer greater than or equal to 1, and the values of N and M are different.
Optionally, after forming a first adhesive layer on the front surface of the adhesive film to cover and encapsulate the flip-chip LED chips together, before cutting the first adhesive layer, or after cutting the first adhesive layer, the method further includes:
removing the adhesive film; and after the adhesive film is removed, the anode electrode and the cathode electrode of the flip LED chip are exposed outside the adhesive layer.
Optionally, the second adhesive layer is a white adhesive layer or a semi-transparent adhesive layer including scattering particles, or the second adhesive layer is a light-emitting conversion adhesive layer for absorbing light energy.
Optionally, the LED chip assembly is a blue LED chip assembly, and the first adhesive layer is a transparent adhesive layer, a white adhesive layer or a semi-transparent adhesive layer;
or the like, or, alternatively,
the LED chip assembly is a white light LED chip assembly, and the first adhesive layer is a white adhesive layer, a semitransparent adhesive layer or a light-emitting conversion adhesive layer.
In order to solve the problems, the invention also provides an LED chip assembly with uniform light emission, and the LED chip assembly is manufactured by the LED chip assembly manufacturing method.
In order to solve the above problems, the present invention further provides a method for manufacturing an LED device, including:
the LED chip assembly with uniform light emission is prepared by the LED chip assembly manufacturing method;
and transferring the LED chips onto the substrate, and electrically connecting the anode electrode and the cathode electrode of each LED chip in the LED chip assembly with the corresponding chip electrode bonding pads on the substrate respectively.
In order to solve the problems, the invention also provides an LED device which is manufactured by the manufacturing method of the LED device.
Advantageous effects
The invention provides an LED chip assembly, an LED device and a manufacturing method thereof.A flip LED chip is arranged on the front surface of an adhesive film, and a positive electrode and a negative electrode of the flip LED chip are adhered on the front surface of the adhesive film; forming a first adhesive layer which covers and encapsulates the flip LED chips on the front surface of the adhesive film; then forming a second adhesive layer used for reducing light energy emitted from the light emitting surface on the front side of the LED chip on the first adhesive layer, wherein the second adhesive layer at least partially covers the light emitting surface on the front side of each LED chip and does not cover the first adhesive layer between the adjacent LED chips; then cut first glue film and obtain a plurality of LED chip subassemblies, the LED chip subassembly that makes through above process has following advantage at least:
the second adhesive layer for reducing the light energy is formed on the front surface of the LED flip chip, so that the difference between the light energy in the normal direction of the flip LED chip and the light energy on the four side surfaces can be reduced, and the uniformity of the light emitting color is improved;
compared with the traditional LED lamp bead, the prepared LED chip component can not only omit the packaging process of an LED, but also omit the use of a traditional LED bracket, and can reduce the cost while improving the manufacturing efficiency;
the manufacturing process of the LED chip assembly is convenient and simple, batch manufacturing can be realized, the manufacturing efficiency is high, and the cost is low;
because the light emitting colors of the front surface and the side surface of each LED chip in the manufactured LED chip group are uniform, the whole light emitting color of the LED device manufactured by using the LED chip component is more uniform, and the quality of the LED device product and the user experience satisfaction degree are improved.
Furthermore, the manufactured LED chip assembly can comprise at least two LED chips which are distributed correspondingly according to the distribution of the corresponding chip electrode bonding pads on the substrate; when the LED chip assembly is used for manufacturing an LED device, the LED chip assembly comprising a plurality of LED chips can be transferred onto the substrate, and the anode electrode and the cathode electrode of each LED chip in the LED chip assembly are respectively and electrically connected with the corresponding chip electrode bonding pad on the substrate; compared with the existing die bonding mode of a single LED chip, the die bonding method can meet the requirement of small-space large-batch layout between Micro LED chips or Mini LED chips, can improve the die bonding efficiency of the LED chips in multiples, and avoids the deterioration of the viscosity and the conductivity of silver paste and tin paste printed on a substrate bonding pad due to long die bonding time, thereby further improving the quality and the reliability of LED device products.
Drawings
Fig. 1 is a method for manufacturing an LED chip assembly according to an embodiment of the present invention;
fig. 2 is a first schematic diagram illustrating an LED chip arranged on an adhesive film according to an embodiment of the present invention;
fig. 3 is a second schematic diagram illustrating an LED chip arranged on an adhesive film according to an embodiment of the present invention;
FIG. 4 is a first schematic diagram illustrating a molding of an adhesive layer on an adhesive film according to an embodiment of the present invention;
FIG. 5 is a second schematic diagram of a method for molding a glue layer on a bonding film according to an embodiment of the present invention;
FIG. 6A is a third schematic view of a third exemplary embodiment of a method for molding a glue layer on a bonding film according to the present invention;
fig. 6B is a first schematic view illustrating a second adhesive layer formed on the first adhesive layer according to an embodiment of the present invention;
fig. 6C is a second schematic diagram illustrating a second adhesive layer formed on the first adhesive layer according to the embodiment of the invention;
fig. 6D is a third schematic view illustrating a second adhesive layer formed on the first adhesive layer according to the embodiment of the invention;
FIG. 7 is a schematic diagram of a dicing process according to an embodiment of the present invention;
FIG. 8 is a schematic diagram illustrating the removal of an adhesive film according to an embodiment of the present invention;
FIG. 9 is a first schematic structural diagram of an LED chip assembly according to an embodiment of the present invention;
FIG. 10 is a cross-sectional view A-A of FIG. 9;
FIG. 11 is a schematic structural diagram of an LED chip assembly according to an embodiment of the present invention;
FIG. 12 is a schematic view of the LED chip assembly of FIG. 9;
fig. 13 is a schematic structural diagram of an LED chip assembly according to an embodiment of the present invention;
FIG. 14 is a schematic structural diagram of an LED chip assembly according to an embodiment of the present invention;
fig. 15 is a schematic structural diagram of an LED chip assembly according to an embodiment of the present invention;
FIG. 16 is a schematic view of an embodiment of the present invention providing for transferring an LED chip assembly to a substrate;
fig. 17 is a schematic diagram of the LED chip assembly mounting in fig. 15.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, embodiments of the present invention are described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment provides a method for manufacturing an LED chip assembly, wherein the light emitting surface on the front surface of a flip LED chip of the manufactured LED chip assembly is at least partially covered with a second adhesive layer for reducing light energy, so that the difference between light energy in the normal direction of the flip LED chip and the light energy on four side surfaces is reduced, and the uniformity of light emitting color is improved.
For the convenience of understanding, the present embodiment will be described below with reference to the method for manufacturing the LED chip assembly shown in fig. 1 as an example.
Please refer to fig. 1, a method for manufacturing an LED chip assembly with uniform light emission includes:
s101: and the flip LED chip is arranged on the front surface of the adhesive film, and the positive electrode and the negative electrode of the LED flip chip are adhered to the front surface of the adhesive film.
It should be understood that the type of adhesive film in this embodiment can be flexibly selected, and can be, for example, but not limited to, a UV release adhesive film, or a thermal release adhesive film.
In some examples of the embodiment, the back surface of the adhesive film may also be provided with an adhesive layer, and the adhesive film may be adhered to the chip transfer platform through the adhesive layer on the back surface; then arranging flip LED chips on the front surface of the adhesive film through a chip transfer platform; the chip transfer platform may be, but is not limited to, a die bonder or a chip mounter.
In other examples of this embodiment, the adhesive layer may not be disposed on the back surface of the adhesive film, and the adhesive film may be fixed to the chip transfer platform by vacuum adsorption or the like; and then arranging the flip LED chips on the front surface of the adhesive film through a chip transfer platform.
The flip LED chip used in this step may be, but is not limited to, a Micro LED chip or a Mini LED chip.
An exemplary process of arranging the flip LED chips on the front surface of the adhesive film as shown in fig. 2 to 3, the flip LED chips 2 are sequentially arranged on the front surface of the adhesive film 4 according to the distribution of the corresponding chip electrode pads on the substrate.
S102: a first glue layer covering and packaging the flip LED chips is formed on the front surface of the adhesive film.
It should be understood that the manner of forming the first adhesive layer on the front surface of the adhesive film to cover and encapsulate the flip LED chips can be flexibly selected. For example, in one example, a molding press and a corresponding mold may be used to mold a gel around the flip-chip LED chips arranged on the front surface of the adhesive film, and the molded gel may be baked or not baked after the semi-finished product is taken out, depending on the characteristics of the gel used in particular. For another example, a first adhesive layer may be formed around the flip LED chips arranged on the front surface of the adhesive film by dispensing, and then the first adhesive layer may be obtained by baking.
An exemplary process of forming the first adhesive layer on the front surface of the adhesive film to cover and encapsulate the flip-chip LED chips is shown in fig. 4-6A, the first adhesive layer 5 may be molded on the front surface of the adhesive film 4 in the area corresponding to the flip-chip LED chips, and the formed first adhesive layer 5 is shown in fig. 5 and 6A.
S103: and forming a second adhesive layer for reducing light energy emitted from the light emitting surface on the front surface of the LED chip on the first adhesive layer, wherein the second adhesive layer at least partially covers the light emitting surface on the front surface of each inverted LED chip and does not cover the first adhesive layer between the adjacent LED chips.
It should be understood that the manner of forming the second adhesive layer for reducing light energy emitted from the light emitting surface on the front surface of the LED chip on the first adhesive layer in this step can be flexibly selected. For example, in one example, a second adhesive layer may be formed on the first adhesive layer directly above the LED chip (i.e., on the light exit surface on the front surface of the LED chip) by printing or dispensing, and then dried and formed. Optionally, testing can be performed after drying and forming, the subsequent steps are performed after the testing is passed, and reworking is performed if the testing is not passed. Fig. 6B shows a schematic structure of forming a second adhesive layer 8 on the first adhesive layer 5. In some application examples, the second adhesive layer covers the front light-emitting surface of the LED chip, and the area of the second adhesive layer is matched with the area of the front light-emitting surface of the LED chip. The area of the second adhesive layer is adaptive, which means that the area of the second adhesive layer may be equal to the area of the front light-emitting surface of the LED chip, for example, as shown in fig. 6C, or slightly larger than the area of the front light-emitting surface of the LED chip, for example, as shown in fig. 6B, or slightly smaller than the area of the front light-emitting surface of the LED chip, for example, as shown in fig. 6D.
In an example of the present embodiment, an upper surface of the second adhesive layer is a plane, for example, please refer to fig. 6C to 6D. When the upper surface of the second adhesive layer is a plane, the processing of the second adhesive layer is facilitated, and the subsequent mounting use of the LED chip assembly and the control of the consistency of the LED chip assembly are facilitated. Optionally, an interface between the second adhesive layer and the first adhesive layer may also be a plane, and in some application scenarios, the interface may also be set to be an arc surface or other irregular surfaces as required.
S104: and cutting the first adhesive layer to obtain a plurality of LED chip assemblies, wherein each LED chip assembly comprises at least one LED flip chip.
In this embodiment, when the first adhesive layer is cut, the number and arrangement of chips required to be included in the LED chip assembly obtained by cutting may be determined, and then the first adhesive layer is cut according to the determined LED chip assembly, at this time, the cutting is performed by cutting at least one flip LED chip as one assembly block to obtain a corresponding LED chip assembly, and at least a part of a light emitting surface on the front surface of the flip LED chip included in the obtained LED chip assembly is covered with the second adhesive layer for reducing light energy, so that a difference between light energy in a forward normal direction of the flip LED chip and light energy in four side surfaces is reduced, and uniformity of light emitting color is improved; in some examples of this embodiment, the second adhesive layer may reduce the difference between the light energy in the normal direction of the flip-chip LED chip and the light energy in the four side surfaces by, but not limited to, at least one of reflection, refraction, and scattering, so as to achieve the overall uniformity of the light emitted from the top of the chip and the light emitted from the side surfaces.
For example, in an application scenario, the first adhesive layer may be a first transparent adhesive layer, a first white adhesive layer, or a first translucent adhesive layer, the second adhesive layer may be a second translucent adhesive layer (the second translucent adhesive layer may have a different medium from the first translucent adhesive layer), light emitted from the front surface of the LED chip is incident into the second adhesive layer through the first adhesive layer, and at least one of refraction and reflection occurs at the second adhesive layer; optionally, scattering particles can be added into the second translucent adhesive layer according to requirements, and light emitted into the second translucent adhesive layer can be scattered; after the light is refracted or scattered in the second translucent adhesive, more light energy exists above the adjacent LED chips, and the light enters the first adhesive layer again after being reflected by the second translucent adhesive, so that the difference between the light energy of the LED chips in the normal direction and the light energy of the four side surfaces is reduced.
For another example, in another application scenario, the first glue layer may be a first transparent glue layer, a first white glue layer, or a first translucent glue layer, and the second glue layer may be a second white glue layer (the second white glue layer may have a different medium from the first white glue layer), after light is refracted by the second white glue layer, more light energy exists above between adjacent LED chips, and after light is reflected by the second white glue layer, the light enters the first glue layer again, so that a difference between light energy of the LED chips in the forward normal direction and light energy of four side surfaces is reduced.
In some examples, at least two flip LED chips may be cut into one assembly block, in this example, the flip LED chips may be arranged on the front surface of the adhesive film in S101 specifically according to the distribution of the corresponding chip electrode pads on the substrate, and the positive electrode and the negative electrode of the LED flip chip are adhered to the front surface of the adhesive film. The LED chip assembly thus obtained comprises at least two Micro LED chips or Mini LED chips (it being understood that also common-sized LED chips, or large-sized LED chips are possible), in the die bonding process of the LED chips, a plurality of LED chips can be directly transferred to corresponding positions on the substrate at one time by taking the LED chip assembly as a unit, and since the flip-chip LED chips in the LED chip assembly are distributed correspondingly according to the distribution of the corresponding chip electrode pads on the substrate, after the LED chip assembly is transferred to the substrate, can ensure that the anode electrode and the cathode electrode of each LED chip in the LED chip assembly are respectively and electrically connected with the corresponding chip electrode bonding pad on the substrate, not only can improve the die bonding efficiency by times, but also can ensure the die bonding accuracy and reliability, therefore, the reliability of the quality of the LED device product manufactured by the LED chip assembly is ensured. Meanwhile, compared with the traditional LED lamp bead, the LED packaging process can be omitted, the use of the traditional LED support can be omitted, and the manufacturing efficiency is improved while the cost is reduced. In addition, the light emitting colors of the front surface and the side surface of each LED chip in the manufactured LED chip group are uniform, so that the whole light emitting color of an LED device manufactured by using the LED chip component is more uniform, and the quality of an LED device product and the user experience satisfaction degree are improved.
In this embodiment, the distribution of the corresponding chip electrode pads on the substrate includes, but is not limited to, the positions of the chip electrode pads, the spacing between adjacent chip electrode pads, and the like.
It should be understood that, in the present embodiment, the number of LED chips included in one LED chip assembly can be flexibly set according to a specific application scenario; accordingly, the specific distribution of the chip electrode pads on the substrate and the connection of the LED chips included in the LED chip assembly on the substrate can be flexibly set according to the specific application, such as but not limited to serial connection, parallel connection or combination of serial connection and parallel connection. In addition, the specific material of the substrate in this embodiment can also be flexibly set, and for example, but not limited to, glass, BT (thermosetting resin formed by adding epoxy resin, polyphenylene ether resin (PPE), allyl compound, or the like as a modifying component to Bismaleimide (BMI) and triazine as main resin components), glass fiber, or the like can be used. In some examples of the embodiment, the LED chip assembly may also be used for manufacturing lighting products such as a light bar, and the substrate in this case may be, but is not limited to, a flexible substrate of a flexible circuit board. In this embodiment, the chip electrode pads may be formed on the substrate in various manners, which are not described herein again.
As shown above, the number of LED chips included in one LED chip assembly can be flexibly set according to a specific application scenario. It should be understood that the number of the LED chips included in the plurality of LED chip assemblies disposed on one substrate may be the same, or at least some of the LED chip assemblies may include different numbers of the LED chips, or the number of the LED chips may be flexibly set according to the requirement. For ease of understanding, the present embodiment will be described below by way of example with respect to several cases of an LED chip included in one LED chip assembly.
In one example, the LED chip assembly includes N × N flip LED chips, and the N × N flip LED chips are distributed in an N × N matrix, where N is an integer greater than or equal to 2, and it should be understood that a value of N may be flexibly set according to specific requirements, for example, may be set to 2, 3, 4, 5, 6, and the like, and when the LED chip assembly is directly used for die attach, die attach efficiency is N times of that of an existing single LED chip. A block cutting schematic is shown with reference to fig. 7.
In another example, the LED chip assembly includes N × M flip LED chips, and the N × M flip LED chips are distributed in an mxn matrix, where N is an integer greater than or equal to 2, M is an integer greater than or equal to 1, and values of N and M are different. It should be understood that the values of N and M may also be flexibly set according to specific requirements, for example, N may be set to be 2, 3, 4, 5, 6, etc., and M may be set to be 1, 2, 3, 4, 5, 6, etc., according to specific requirements. When the LED chip assembly is directly used for die bonding, the die bonding efficiency is MxN times of that of the existing single LED chip.
Of course, it should be understood that the particular distribution of the flip LED chips (including the locations of the flip LED chips, the spacing between adjacent flip LED chips, etc.) whether the flip LED chips included in the LED chip assembly are distributed in an N x M matrix or an N x N matrix corresponds to the corresponding distribution of the chip electrode pads on the substrate. And it should be understood that, in the present embodiment, the distribution of the flip LED chips included in the LED chip assembly is not limited to a regular matrix distribution, and may be set to an irregular distribution according to a specific application scenario.
In addition, in some examples of this embodiment, the first adhesive layer and the second adhesive layer, which cover and encapsulate the flip-chip LED chips together, included in the LED chip assembly may directly serve as the encapsulation adhesive layer, so that after the die bonding of the LED chip assembly on the substrate is completed, the step of disposing the encapsulation adhesive may be omitted, the manufacturing efficiency of the product may be further improved, and the product manufacturing process may be simplified. In some specific examples, a surface of the first adhesive layer on the light emitting surface of the front surface of the flip LED chip may be a plane. In other examples, the face of the first adhesive layer on the light emitting face of the front surface of the flip LED chip may also be an arc face, and the corresponding second adhesive layer may also be an arc face, and the arc face may be set as an upward convex arc face or a downward concave arc face as required.
In addition, it should be understood that the specific material adopted by the first adhesive layer in the embodiment may also be flexibly selected. For example, epoxy, resin, silicone, UV gel, or the like can be used. And the arrangement of the first glue layer in the embodiment can be flexibly arranged according to the color of the light required to be emitted by the LED chip assembly. For example, in one example, when the LED chip assembly is a blue LED chip assembly, the first adhesive layer included therein may be, but is not limited to, a first transparent adhesive layer, a first white adhesive layer, or a first semi-transparent adhesive layer. In another example, when the LED chip assembly is a white LED chip assembly, the first adhesive layer included therein may be a first white adhesive layer, a first translucent adhesive layer, or a first light emitting conversion adhesive layer, wherein:
the white glue can be formed by adding white silicon dioxide or titanium dioxide and the like in a corresponding proportion to transparent glue (epoxy, resin, silica gel or UV glue); the translucent adhesive can be prepared by adding less than 1% white silicon dioxide or titanium dioxide in the transparent adhesive (which can be epoxy, resin, silica gel or UV adhesive); and the luminescence conversion glue layer can be a fluorescent glue layer or a quantum dot film glue layer.
In some examples of the present embodiment, the second adhesive layer may be a second white adhesive layer or a second translucent adhesive layer including scattering particles, or the second adhesive layer may be a second luminescence conversion adhesive layer for absorbing blue light. Wherein the scattering particles can be, but are not limited to, silica or titania. The luminescence conversion glue layer can also be, but is not limited to, a fluorescent glue layer or a quantum dot film glue layer.
In some examples of the embodiment, after the first glue layer covering and packaging the flip-chip LED chips is formed on the front surface of the adhesive film, the adhesive film can be removed to facilitate the use of the subsequent LED chip assembly. Of course, in some application scenarios, the adhesive film may not be removed, but rather, the LED chip assembly may be removed in real time when it is needed.
In this embodiment, when the adhesive film needs to be removed, the entire adhesive film may be directly removed before the first adhesive layer is cut after the first adhesive layer is formed on the front surface of the adhesive film to cover and encapsulate the flip-chip LED chips. Or the adhesive film can be removed after the first adhesive layer is cut; in this case, the adhesive film can be removed in one step without cutting the adhesive film when the first adhesive layer is cut; of course, the adhesive film may be cut at the same time and then removed one by one in units of the LED chip assemblies. And after the adhesive film is removed, the anode electrode and the cathode electrode of the inverted LED chip are exposed outside the first adhesive layer.
In one example, when the adhesive film is a UV release adhesive film, or a thermal release adhesive film, the adhesive film may be removed by, but not limited to: the adhesion of the adhesive film is removed by UV irradiation or baking, thereby separating the adhesive film from the flip LED chip and the colloidal layer. The removal mode is convenient and fast. A schematic diagram of the structure with the adhesive film removed is shown in fig. 8, which is compared with fig. 6B, in which the adhesive film 4 is removed.
The embodiment also provides a manufacturing method of the LED device, which includes: manufacturing an LED chip assembly by the manufacturing method of the LED chip assembly; and then transferring the LED chips onto the substrate, and electrically connecting the anode electrode and the cathode electrode of each LED chip in the LED chip assembly with the corresponding chip electrode bonding pads on the substrate respectively. In some examples of this embodiment, the LED chip assembly can still be placed on the substrate by, but not limited to, a die bonder or a bulk transfer machine function, with the electrodes of each flip LED chip in the LED chip assembly matching with the corresponding chip electrode pads of the substrate.
In some application scenarios, after the conductive adhesive such as silver adhesive or solder paste is printed on the chip electrode pad position on the substrate, the LED chip assembly is placed on the substrate by using the functions of a die bonder or a bulk transfer machine. In other application scenarios, if a flip-chip LED chip with solder is adopted, it is not necessary to print conductive materials such as silver paste or tin paste on the substrate at the position of the chip electrode pad.
In addition, it should be understood that the LED device in the present embodiment may be, but is not limited to, a COB lighting device (e.g., COB lamp bar, COB lamp, etc.) or a display screen light source device (e.g., backlight light source, or direct display screen light source device).
For the convenience of understanding, in the above examples, the present embodiment is described below with reference to several specific LED chip assembly structures given in the drawings as examples.
Fig. 9 shows an LED chip assembly, which includes 4 × 4 flip LED chips 2, and a first adhesive layer covering the flip LED chips 2. The LED chip assembly shown in fig. 9 may be an LED chip assembly emitting blue light, and includes a first adhesive layer, which may be a transparent first adhesive layer 1, and a second adhesive layer 8 on the first adhesive layer 1. Referring to fig. 10, which is a cross-sectional view of a position a-a in fig. 9, the arrangement of the flip LED chips 2 included in the LED chip assembly corresponds to the arrangement of the chip electrode pads on the substrate, and the positive electrodes and the negative electrodes of the LED chips 2 are exposed out of the first adhesive layer for connection with the corresponding chip motor pads on the substrate. When the LED chip assembly is used to manufacture an LED device, die bonding and mounting can be performed on a substrate by using the LED chip assembly as a unit, and an exemplary diagram of an effect after die bonding and mounting can be shown in fig. 12, where die bonding efficiency is 16 times that of an existing die bonding method using a single flip-chip LED chip. Of course, the transparent first glue layer 1 shown in fig. 9 can also be replaced by the white first glue layer 3 shown in fig. 11 according to requirements. It should be understood that, in the present embodiment, the transparent first adhesive layer 1 in the subsequent figures may also be replaced by a white first adhesive layer or a translucent first adhesive layer according to requirements. The LED chip assemblies shown in fig. 9 and 11 employ a 4 x 4, i.e., N x N matrix distribution.
Please refer to the LED chip assembly shown in fig. 13, which includes 2 × 4 flip LED chips 2, and a first adhesive layer covering the flip LED chips 2. The LED chip assembly shown in fig. 13 may be an LED chip assembly emitting blue light, the first adhesive layer included therein may be a transparent first adhesive layer 1, the arrangement of each flip LED chip 2 included in the LED chip assembly corresponds to the arrangement of the chip electrode pads on the substrate, and the positive electrode and the negative electrode of the LED chip 2 are exposed out of the first adhesive layer for connection with the corresponding chip motor pads on the substrate. When the LED chip assembly is used for manufacturing an LED device, the LED chip assembly can be used as a unit to carry out die bonding and mounting on a substrate, and the die bonding efficiency is 8 times that of the conventional mode of die bonding by using a single flip LED chip. The LED chip assembly shown in fig. 13 uses a 2 x 4, i.e. mxn matrix distribution. In some application scenarios, such as a light bar making application scenario, the LED chip assembly may also adopt a 1 × N matrix, for example, see the LED chip assembly shown in fig. 14.
In some application scenarios, the number of flip LED chips included in the LED chip assembly can also be increased according to the requirement. For example, fig. 15 shows that the LED package includes 4 × 8 flip LED chips 2 and a first adhesive layer covering the flip LED chips 2. The LED chip assembly shown in fig. 15 may be an LED chip assembly emitting blue light, the first adhesive layer included therein may be a transparent first adhesive layer 1, the arrangement of each flip LED chip 2 included in the LED chip assembly corresponds to the arrangement of the chip electrode pads on the substrate, and the positive electrode and the negative electrode of the LED chip 2 are exposed out of the first adhesive layer for connection with the corresponding chip motor pads on the substrate. When the LED chip assembly is used to manufacture an LED device, die attach may be performed on a substrate in units of the LED chip assembly, for example, please refer to fig. 16, in which the LED chip assembly 7 is transferred and attached to the substrate 6. The die bonding efficiency is 32 times that of the conventional single-chip flip LED die bonding method. An exemplary effect of the die attach process can be seen in fig. 17.
Therefore, compared with the existing die bonding mode of a single LED chip, the die bonding efficiency of the LED chip can be improved by times, and the viscosity and conductivity of the silver paste and the solder paste printed on the bonding pad of the substrate are prevented from being deteriorated due to long die bonding time, so that the quality and reliability of the LED device product are improved.
The foregoing is a more detailed description of embodiments of the present invention, and the present invention is not to be considered limited to such descriptions. For those skilled in the art to which the invention pertains, several simple deductions or substitutions can be made without departing from the spirit of the invention, and all shall be considered as belonging to the protection scope of the invention.
Claims (10)
1. A manufacturing method of an LED chip assembly with uniform light emission is characterized by comprising the following steps:
arranging a flip LED chip on the front surface of the adhesive film, wherein a positive electrode and a negative electrode of the LED flip chip are adhered to the front surface of the adhesive film;
forming a first adhesive layer which covers and encapsulates the flip LED chips on the front surface of the adhesive film;
forming a second adhesive layer used for reducing light energy emitted from the light emitting surface on the front surface of the LED chip on the first adhesive layer, wherein the second adhesive layer at least partially covers the light emitting surface on the front surface of each LED chip and does not cover the first adhesive layer between the adjacent LED chips;
and cutting the first adhesive layer to obtain a plurality of LED chip assemblies, wherein each LED chip assembly comprises at least one LED flip chip.
2. The method according to claim 1, wherein the second adhesive layer covers the entire front light-emitting surface of the LED chip, and the area of the second adhesive layer is adapted to the area of the front light-emitting surface of the LED chip.
3. The method of claim 1, wherein the arranging the flip-chip LED chips on the front surface of the adhesive film comprises:
arranging flip LED chips on the front surface of the adhesive film according to the distribution of the corresponding chip electrode pads on the substrate;
and cutting the first adhesive layer to obtain a plurality of LED chip assemblies, wherein each LED chip assembly comprises at least two LED chips.
4. The LED chip assembly with uniform emission of light of claim 3, wherein said at least two flip chips are distributed in an nxn matrix, wherein N is an integer greater than or equal to 2;
or, the at least two flip chips are distributed in an MxN matrix, wherein N is an integer greater than or equal to 2, M is an integer greater than or equal to 1, and the values of N and M are different.
5. The method for manufacturing an LED chip assembly with uniform light emission according to any one of claims 1 to 4, wherein after forming the first adhesive layer on the front surface of the adhesive film to cover and encapsulate the flip LED chips together, before dicing the first adhesive layer, or after dicing the first adhesive layer, the method further comprises:
removing the adhesive film; and after the adhesive film is removed, the anode electrode and the cathode electrode of the flip LED chip are exposed outside the adhesive layer.
6. The method for manufacturing an LED chip assembly with uniform light emission according to any one of claims 1 to 4, wherein the second adhesive layer is a white adhesive layer or a semi-transparent adhesive layer containing scattering particles, or the second adhesive layer is a light emission conversion adhesive layer for absorbing blue light.
7. The method for manufacturing an LED chip assembly with uniform light emission according to any one of claims 1 to 4, wherein the LED chip assembly is a blue LED chip assembly, and the first adhesive layer is a transparent adhesive layer, a white adhesive layer or a semi-transparent adhesive layer;
or the like, or, alternatively,
the LED chip assembly is a white light LED chip assembly, and the first adhesive layer is a white adhesive layer, a semitransparent adhesive layer or a light-emitting conversion adhesive layer.
8. An LED chip assembly with uniform light emission, wherein the LED chip assembly is manufactured by the manufacturing method of the LED chip assembly as claimed in any one of claims 1 to 7.
9. A method for manufacturing an LED device is characterized by comprising the following steps:
an LED chip assembly with uniform light emission is prepared by the manufacturing method of the LED chip assembly as claimed in any one of claims 1 to 7;
and transferring the LED chips onto the substrate, and electrically connecting the anode electrode and the cathode electrode of each LED chip in the LED chip assembly with the corresponding chip electrode bonding pads on the substrate respectively.
10. An LED device produced by the method for producing an LED device according to claim 9.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010128155.9A CN113053865A (en) | 2020-02-28 | 2020-02-28 | LED chip assembly, LED device and manufacturing method thereof |
| PCT/CN2021/077672 WO2021169999A1 (en) | 2020-02-28 | 2021-02-24 | Led chip assembly, led device and manufacturing method therefor |
| US17/830,747 US20220293574A1 (en) | 2019-12-03 | 2022-06-02 | Led chip module and method for manufacturing led chip module |
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| CN202010128155.9A CN113053865A (en) | 2020-02-28 | 2020-02-28 | LED chip assembly, LED device and manufacturing method thereof |
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