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CN113053861A - Packaging module, packaging process and electronic equipment - Google Patents

Packaging module, packaging process and electronic equipment Download PDF

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Publication number
CN113053861A
CN113053861A CN202110257461.7A CN202110257461A CN113053861A CN 113053861 A CN113053861 A CN 113053861A CN 202110257461 A CN202110257461 A CN 202110257461A CN 113053861 A CN113053861 A CN 113053861A
Authority
CN
China
Prior art keywords
chip
air hole
substrate
cavity
adhesive
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN202110257461.7A
Other languages
Chinese (zh)
Inventor
李向光
田峻瑜
方华斌
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Goertek Microelectronics Inc
Original Assignee
Goertek Microelectronics Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Goertek Microelectronics Inc filed Critical Goertek Microelectronics Inc
Priority to CN202110257461.7A priority Critical patent/CN113053861A/en
Publication of CN113053861A publication Critical patent/CN113053861A/en
Priority to PCT/CN2021/143213 priority patent/WO2022188524A1/en
Pending legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/03—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/07—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D
    • H01L25/072—Assemblies consisting of a plurality of semiconductor or other solid state devices all the devices being of a type provided for in a single subclass of subclasses H10B, H10F, H10H, H10K or H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group subclass H10D the devices being arranged next to each other
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01L—MEASURING FORCE, STRESS, TORQUE, WORK, MECHANICAL POWER, MECHANICAL EFFICIENCY, OR FLUID PRESSURE
    • G01L11/00—Measuring steady or quasi-steady pressure of a fluid or a fluent solid material by means not provided for in group G01L7/00 or G01L9/00
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/02—Containers; Seals
    • H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
    • H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
    • H01L23/3107—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed
    • H01L23/3121—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape the device being completely enclosed a substrate forming part of the encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of semiconductor or other solid state devices
    • H01L25/16—Assemblies consisting of a plurality of semiconductor or other solid state devices the devices being of types provided for in two or more different subclasses of H10B, H10D, H10F, H10H, H10K or H10N, e.g. forming hybrid circuits
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32225—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Power Engineering (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Computer Hardware Design (AREA)
  • Casings For Electric Apparatus (AREA)
  • Micromachines (AREA)

Abstract

The invention discloses a packaging module, a packaging process and electronic equipment, wherein the packaging module comprises a substrate, a shell, a chip assembly and a sealing gasket, wherein the substrate is provided with a first air hole; the shell is arranged on the substrate and encloses with the substrate to form a first containing cavity and a second containing cavity which are arranged at intervals, the first air hole is communicated with the first containing cavity, and the shell is provided with a second air hole communicated with the second containing cavity; the chip assembly comprises a first chip and a second chip, the first chip is arranged in the first containing cavity and is arranged at an interval with the first air hole, the second chip is arranged in the second containing cavity, and the first chip and the second chip are respectively and electrically connected with the substrate through gold wires; the sealing gasket is arranged on the shell and surrounds the second air hole, and the sealing gasket is used for being connected with the terminal system. The invention aims to provide the packaging module which effectively improves the sealing performance when being integrated with a terminal system, and the packaging module not only improves the sealing performance, but also improves the experience of users.

Description

Packaging module, packaging process and electronic equipment
Technical Field
The present invention relates to the field of package structures, and particularly to a package module, a package process of the package module, and an electronic device using the package module.
Background
The air pressure is a physical quantity closely related to daily life of people, and air pressure data can be used for detecting height change in the vertical direction to perform motion monitoring, indoor navigation and auxiliary weather forecast, so that the sensor is widely applied to the fields of intelligent wearing, intelligent home furnishing and the like.
As the requirement of waterproof property gradually becomes the standard of the terminal product (especially in wearable terminal), the application of the waterproof type air pressure sensor in the terminal and the air tightness test of the terminal before leaving factory to ensure the waterproof function are necessary. In the correlation technique, the problem of poor sealing performance exists when the air pressure sensor is integrated with the terminal equipment, the sealing performance of the air pressure sensor is reduced, and the user experience is poor.
Disclosure of Invention
The invention mainly aims to provide a packaging module, a packaging process and electronic equipment, and aims to provide a packaging module which effectively improves the sealing performance when being integrated with a terminal system.
In order to achieve the above object, the present invention provides a package module, which includes:
the substrate is provided with a first air hole;
the shell is arranged on the substrate and encloses with the substrate to form a first cavity and a second cavity which are arranged at intervals, the first air hole is communicated with the first cavity, and the shell is provided with a second air hole communicated with the second cavity;
the chip assembly comprises a first chip and a second chip, the first chip is arranged in the first containing cavity and is arranged at an interval with the first air hole, the second chip is arranged in the second containing cavity, and the first chip and the second chip are electrically connected with the substrate through gold wires respectively; and
and the sealing gasket is arranged on the shell and surrounds the second air hole, and the sealing gasket is used for being connected with a terminal system.
In an embodiment, the package module further includes a dust screen disposed between the sealing pad and the housing, and the dust screen covers the second air hole.
In an embodiment, the encapsulation module further includes a waterproof film disposed between the dust screen and the housing, and the waterproof film covers the second air hole;
or, the packaging module further comprises a protective adhesive, and the protective adhesive is filled in the second containing cavity and covers the second chip.
In one embodiment, the housing comprises:
the surrounding plate is arranged on the periphery of the substrate and surrounds the first chip, the second chip and the first air hole;
the baffle is arranged on the substrate and positioned between the first chip and the second chip, the baffle and the surrounding plate are encircled to form a first groove and a second groove which are arranged at intervals, so that the first chip is positioned in the first groove and is arranged at intervals with the first air hole, and the second chip is positioned in the second groove; and
the cover plate covers the notches of the first groove and the second groove and is enclosed to form the first containing cavity and the second containing cavity, the cover plate corresponds to the second groove and is provided with the second air hole, and the sealing gasket is arranged on one side, back to the base plate, of the cover plate through back glue.
In one embodiment, the cover plate, the surrounding plate and the partition plate are of an integrally formed structure;
and/or the coaming, the clapboard and the cover plate are made of metal, FR4, BT or ceramic;
and/or the substrate is FR4, BT or ceramic;
and/or the first chip and the second chip are ASIC chip + MEMS chip or integrated single chip;
and/or the coaming and the clapboard are connected with the substrate through solder paste, conductive adhesive or epoxy adhesive;
and/or the cover plate is connected with the coaming and the clapboard through solder paste, conductive adhesive or epoxy adhesive;
and/or the back adhesive is a hot-pressing adhesive or a pressure-sensitive adhesive.
The invention also provides a packaging process of the packaging module, which comprises the following steps:
manufacturing a first air hole on the substrate;
mounting a first chip and a second chip on a substrate at intervals, so that the first chip and the second chip are arranged at intervals with the first air hole;
manufacturing a second air hole on the shell, attaching the shell to the substrate, and enclosing the shell and the substrate to form a first cavity and a second cavity which are arranged at intervals, so that the first air hole is communicated with the first cavity, the second air hole is communicated with the second cavity, the first chip is accommodated in the first cavity, and the second chip is accommodated in the second cavity;
and attaching a sealing gasket to the shell and surrounding the second air hole.
In an embodiment, before the step of attaching the gasket to the housing and disposing around the second air hole, the method further includes:
coating back glue on the outer wall of the shell, and enabling the back glue to surround the second air hole;
sticking a dust screen on one side of the back adhesive, which is far away from the shell, so that the dust screen covers the second air hole;
and coating a back adhesive on one side of the dustproof net, which is back to the shell, so that the back adhesive is arranged around the second air hole.
In an embodiment, before the step of attaching the dust screen to the side of the back adhesive away from the housing to cover the second air hole, the method further includes:
adhering a waterproof membrane to one side of the back adhesive, which is far away from the shell, so that the waterproof membrane covers the second air hole;
and coating a back adhesive on one side of the waterproof membrane, which is back to the shell, so that the back adhesive is arranged around the second air hole.
In an embodiment, the housing includes a surrounding plate, a partition plate, and a cover plate, the second air hole is formed in the housing, the housing is attached to the substrate, and the housing and the substrate surround to form a first cavity and a second cavity which are arranged at an interval, so that the first air hole is communicated with the first cavity, the second air hole is communicated with the second cavity, the first chip is accommodated in the first cavity, and the second chip is accommodated in the second cavity by:
attaching the enclosing plate to the substrate, so that the enclosing plate surrounds the first chip, the second chip and the first air hole;
the partition board is attached to the substrate and positioned between the first chip and the second chip, so that the partition board and the surrounding plate are enclosed to form a first groove and a second groove which are arranged at intervals, the first chip is positioned in the first groove and is arranged at intervals with the first air hole, and the second chip is positioned in the second groove;
the cover plate is provided with a second air hole, the cover plate is attached to one end, far away from the base plate, of the enclosing plate and the partition plate, and the cover plate covers the notches of the first groove and the second groove, so that the cover plate, the enclosing plate, the partition plate and the base plate are enclosed to form the first containing cavity and the second containing cavity, the second air hole is communicated with the second containing cavity, and the first air hole is communicated with the first containing cavity.
In an embodiment, before the step of manufacturing the second air hole in the cover plate, attaching the cover plate to one end of the enclosing plate and the partition plate, which are away from the substrate, and sealing the notches of the first groove and the second groove, so that the cover plate, the enclosing plate, the partition plate, and the substrate enclose and form the first containing cavity and the second containing cavity, the second air hole communicates with the second containing cavity, and the first air hole communicates with the first containing cavity, the method further includes:
filling protective glue into the second groove through a glue dispensing valve so as to cover the second chip;
defoaming the protective adhesive in a vacuumizing mode;
and curing the protective adhesive by adopting a step-type heating process.
In one embodiment, the step of attaching the first chip and the second chip to the substrate at intervals includes:
coating adhesive on one side of the substrate;
adhering a first chip and a second chip to one side of the adhesive, which is far away from the substrate, so that the first chip and the second chip are arranged at intervals;
reflowing the adhesive to solidify the adhesive;
and respectively connecting the first chip and the second chip with the substrate by gold wires in a wire bonding mode.
The invention also provides electronic equipment which comprises an equipment shell and the packaging module, wherein the packaging module is arranged on the equipment shell.
According to the technical scheme, the shell is arranged on the substrate, the shell and the substrate are enclosed to form the first containing cavity and the second containing cavity which are arranged at intervals, the first air hole in the substrate is connected with the first containing cavity, the second air hole in the shell is communicated with the second containing cavity, the first chip of the chip assembly is arranged in the first containing cavity, the first chip is enabled to detect external environment data through the first air hole, the second chip of the chip assembly is arranged in the second containing cavity, the second chip is enabled to detect the external environment data through the second air hole, the sealing gasket is arranged on the shell and is enabled to surround the second air hole, the sealing gasket is connected with the terminal system, the sealing gasket and the terminal system are sealed and integrated, and the sealing performance of the packaging module is effectively improved. The packaging module provided by the invention not only improves the self-sealing performance, but also can be sealed and integrated with a terminal system through the sealing gasket to measure the external atmospheric pressure, and also has the function of measuring the internal atmospheric pressure value of the terminal, thereby effectively improving the experience of users.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
Fig. 1 is a schematic structural diagram of a package module according to an embodiment of the invention;
FIG. 2 is a schematic structural diagram of a package module according to another embodiment of the present invention;
FIG. 3 is a schematic flow chart illustrating a package process of the package module according to an embodiment of the invention;
FIG. 4 is a schematic flow chart illustrating a package process of a package module according to another embodiment of the present invention;
fig. 5 is a schematic structural diagram of a package module corresponding to steps 30 to 90 in fig. 4;
FIG. 6 is a schematic flow chart illustrating a package process of a package module according to another embodiment of the present invention;
fig. 7 is a schematic view of a package module corresponding to steps 31 to 33 in fig. 6;
FIG. 8 is a flowchart illustrating an embodiment of step S20 in FIGS. 4 and 6;
fig. 9 is a schematic view of a package module corresponding to steps 21 to 24 in fig. 8.
The reference numbers illustrate:
Figure BDA0002968409400000051
Figure BDA0002968409400000061
the implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
Also, the meaning of "and/or" and/or "appearing throughout is meant to encompass three scenarios, exemplified by" A and/or B "including scenario A, or scenario B, or scenarios where both A and B are satisfied.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The air pressure is a physical quantity closely related to daily life of people, and air pressure data can be used for detecting height change in the vertical direction to perform motion monitoring, indoor navigation and auxiliary weather forecast, so that the sensor is widely applied to the fields of intelligent wearing, intelligent home furnishing and the like.
As the requirement of waterproof property gradually becomes the standard of the terminal product (especially in wearable terminal), the application of the waterproof type air pressure sensor in the terminal and the air tightness test of the terminal before leaving factory to ensure the waterproof function are necessary. In the correlation technique, the problem of poor sealing performance exists when the air pressure sensor is integrated with the terminal equipment, the sealing performance of the air pressure sensor is reduced, and the user experience is poor.
Based on the above concept and problems, the present invention provides a package module 100, wherein the package module 100 may be a pressure sensor or other type of sensor, which is not limited herein. It is understood that the package module 100 may be applied to an electronic device, and the electronic device may be a smart wearable device, which is not limited herein.
Referring to fig. 1, fig. 2, fig. 5, fig. 7 and fig. 9, in an embodiment of the present invention, the package module 100 includes a substrate 1, a housing 2, a chip module 3 and a gasket 5, wherein the substrate 1 is provided with a first air hole 11; the shell 2 is arranged on the substrate 1 and encloses with the substrate 1 to form a first containing cavity 232 and a second containing cavity 233 which are arranged at intervals, the first air hole 11 is communicated with the first containing cavity 232, and the shell 2 is provided with a second air hole 231 communicated with the second containing cavity 233; the chip assembly 3 comprises a first chip 31 and a second chip 32, the first chip 31 is arranged in the first cavity 232 and is spaced from the first air hole 11, the second chip 32 is arranged in the second cavity 233, and the first chip 31 and the second chip 32 are electrically connected with the substrate 1 through gold wires 4 respectively; a gasket 5 is provided in the housing 2 and around the second air hole 231, the gasket 5 being adapted to be connected to the end system.
In the present embodiment, the substrate 1 is used for mounting, fixing and supporting the components such as the housing 2, the gasket 5 and the chip assembly 3, and the structure of the substrate 1 may be a plate-like structure. It will be appreciated that the substrate 1 may alternatively be a circuit board. The substrate 1 is a PCB board, lines are printed on the PCB board, corresponding electrical functions are achieved, and the PCB board can be selectively designed according to actual needs. The PCB is formed by a multilayer structure, for example, the PCB comprises a substrate layer, one or more copper foil layers and one or more solder mask ink layers, and the selection is specifically carried out according to actual application scenes. Alternatively, the substrate 1 may be selected from FR4, BT, or ceramic, but is not limited thereto.
In order to attach the first chip 31 and the second chip 32 of the chip assembly 3 to the substrate 1 and to achieve electrical conduction with the circuit layer inside the substrate 1, in the present embodiment, a pad is disposed on one side surface of the substrate 1. It is understood that the pads are used for electrically connecting with the chip assembly 3, and the pads may have exposed copper, contacts, pins, or solder tails, which are not limited herein.
In this embodiment, the first cavity 232 and the second cavity 233 which are arranged at an interval are formed by enclosing the housing 2 and the substrate 1, so that the first chip 31 is arranged in the first cavity 232 and arranged at an interval with the first air hole 11, the second chip 32 is arranged in the second cavity 233 and arranged at an interval with the second air hole 231, thereby the first chip 31 and the second chip 32 are respectively installed by utilizing two spaced spaces, so that the first chip 31 and the second chip 32 are respectively spaced by different areas of the first air hole 11 and the second air hole 231, the problems of interference and the like between each other are avoided, and the detection accuracy of the packaging module 100 is improved.
Of course, the first chip 31 and the second chip 32 of the chip assembly 3 are integrated in one package module 100, thereby improving the integration performance and the versatility of the package module 100. It is understood that the first chip 31 and the second chip 32 of the chip assembly 3 can be mounted on the surface of the substrate 1 by using an SMT process, and is not limited herein.
In the present embodiment, the first chip 31 and the second chip 32 of the chip assembly 3 may be analysis chips or integrated single chips, and for discrete chips (i.e. ASIC chip + MEMS chip), the ASIC chip and the MEMS chip may be placed side by side; the ASIC chip and the MEMS chip may also be stacked, that is, the ASIC chip is firstly attached to the substrate 1, and then the MEMS chip is attached to the ASIC chip, which is not limited herein. For an integrated single chip, the chip only needs to be attached to the substrate 1, and is not limited herein.
It can be understood that, in order to enable the data signals detected by the first chip 31 and the second chip 32 of the chip assembly 3 to smoothly pass through the substrate 1 for transmission, the first chip 31 and the second chip 32 of the chip assembly 3 may implement wire bonding between the substrate 1 and the first chip 31/the second chip 32 by using gold wires to implement connection, or implement wire bonding between the first chip 31 and the second chip 32 by using gold wires to implement connection, which is not limited herein.
In the present embodiment, the housing 2 may be made of metal, plastic, or ceramic, but is not limited thereto.
The package module 100 of the present invention arranges the housing 2 on the substrate 1, so that the housing 2 and the substrate 1 enclose to form the first cavity 232 and the second cavity 233 arranged at an interval, so that the first air hole 11 of the substrate 1 is connected to the first cavity 232, the second air hole 231 of the housing 2 is communicated to the second cavity 233, and the first chip 31 of the chip assembly is disposed in the first cavity 232, so that the first chip 31 detects external environmental data through the first air hole 11, the second chip 32 of the chip assembly 3 is disposed in the second receiving cavity 233, so that the second chip 32 detects external environmental data through the second air hole 231, and further, by disposing the gasket 5 on the housing 1, so that the gasket 5 is disposed around the second air hole 231, therefore, the sealing gasket 5 is used for connecting with a terminal system, so that the sealing gasket 5 and the terminal system are used for sealing and integrating, and the sealing performance of the packaging module 100 is effectively improved. The packaging module 100 provided by the invention not only improves the self-sealing performance, but also can be sealed and integrated with a terminal system through the sealing gasket 5 to measure the external atmospheric pressure, and also has the function of measuring the internal atmospheric pressure value of the terminal, thereby effectively improving the experience of users.
In an embodiment, as shown in fig. 1, 2 and 5, the package module 100 further includes a dust screen 6 disposed between the sealing pad 5 and the housing 2, and the dust screen 6 covers the second air hole 231.
It can be understood that, by providing the dust-proof net 6, the second air hole 231 is covered by the dust-proof net 6, so that dust or impurities and the like can be effectively prevented from entering the second cavity 233 through the second air hole 231 to affect the performance of the second chip 32. In this embodiment, the dust screen 6 may be fixedly connected to the housing 2, for example, by welding or integrally forming, so as to improve the connection stability of the dust screen 6. The dust screen 6 can also be arranged on the shell 2 in a detachable connection mode such as buckle connection, plug-in fit, screw connection or pin connection, so that the convenience in dismounting and mounting of the dust screen 6 is improved.
In the present embodiment, the dust screen 6 may be connected to the housing 2 through a back adhesive, and optionally, the back adhesive may be a thermal pressure adhesive or a pressure sensitive adhesive, which is not limited herein. It is understood that the dust screen 6 may be disposed on an outer wall of the housing 2 opposite to the substrate 1, or may be disposed on a hole wall of the second air hole 231, or may be disposed on a side of the housing 2 facing the substrate 1 and covers the second air hole 231, which is not limited herein.
Of course, in other embodiments, the dust-proof net 6 may also be disposed at the first air hole 11, so as to effectively prevent dust or impurities from entering the first cavity 232 from the first air hole 11, which may affect the performance of the first chip 31.
In one embodiment, as shown in fig. 2 and 5, the encapsulation module 100 further includes a waterproof film 7 disposed between the dust screen 6 and the housing 2, and the waterproof film 7 is disposed to cover the second air hole 231.
It can be understood that, by providing the waterproof film 7, the second air hole 231 is covered by the waterproof film 7, so that the influence of water vapor, water drops and the like entering the second cavity 233 from the second air hole 231 on the performance of the second chip 32 is effectively avoided. In this embodiment, the waterproof membrane 7 may be fixedly connected to the housing 2, for example, by welding or integrally molding, so as to improve the connection stability of the waterproof membrane 7. The waterproof membrane 7 can also be arranged on the shell 2 in a detachable connection mode such as a buckle connection mode, a plug-in fit mode, a screw connection mode or a pin connection mode, so that the disassembly and assembly convenience of the waterproof membrane 7 is improved.
In the present embodiment, the waterproof film 7 may be connected to the housing 2 through a back adhesive, and optionally, the back adhesive may be a thermal pressure adhesive or a pressure sensitive adhesive, which is not limited herein. It is understood that the waterproof membrane 7 may be disposed on an outer wall of the housing 2 opposite to the substrate 1, may also be disposed on a hole wall of the second air hole 231, and may also be disposed on a side of the housing 2 facing the substrate 1 and covers the second air hole 231, which is not limited herein.
Optionally, the waterproof membrane 7 is attached to the outer wall of the housing 2 through a back adhesive and covers the second air hole 231; the dustproof net 6 is attached to one side, back to the shell 2, of the waterproof film 7 through back glue and covers the second air hole 231; the sealing gasket 5 is attached to one side of the dustproof net 6, which faces away from the waterproof membrane 7, through the back adhesive, and is arranged around the second air hole 231, so that the sealing gasket 5 is conveniently connected with the terminal system, the packaging module 100 can check external atmospheric environmental data through the second air hole 231, the internal environmental data of the terminal system can also be checked, and limitation is not required here.
Of course, in other embodiments, the waterproof film 7 may also be disposed at the first air hole 11, so as to effectively prevent water vapor, water drops, and the like from entering the first cavity 232 from the first air hole 11, and affecting the performance of the first chip 31.
In the present embodiment, the sealing gasket 5 may be a sealing ring, or the like, and the sealing gasket 5 may be made of a rubber material having elasticity, which is not limited herein. It can be understood that, when the housing 2 is a metal housing, the housing 2 can be connected to the substrate 1 by solder paste or conductive adhesive; when the housing 2 is a plastic housing, the housing 2 may be connected to the substrate 1 by epoxy glue, which is not limited herein.
In an embodiment, as shown in fig. 1 and fig. 7, the package module 100 further includes a protective adhesive 8, and the protective adhesive 8 is filled in the second cavity 233 and covers the second chip 32.
It can be understood that, by providing the protective adhesive 8, the protective adhesive 8 is filled in the second cavity 233 and covers the second chip 32, so that the protective adhesive 8 is used to protect the second chip 32, thereby preventing the second chip 32 from being affected by air, humidity and other external influences, and thus affecting the performance of the second chip 32. Alternatively, the protective glue 8 may be a molding glue, a waterproof glue, or the like, which is not limited herein.
Of course, in other embodiments, the first cavity 232 may be filled with the protective glue 8, and the protective glue 8 covers the first chip 31, so that the performance of the first chip 31 is effectively prevented from being affected by air, humidity and other external factors, which is not limited herein.
In this embodiment, shell 2 can be selected to be the tubular structure of both ends open-ended, and the one end and the base plate 1 of shell 2 are connected to make the first appearance chamber 232 that forms and second appearance chamber 233 have an opening, so can make things convenient for the protection to glue 8 and realize filling through the opening of first appearance chamber 232 and second appearance chamber 233, improve the convenience. Of course, in other embodiments, the housing 2 may also adopt a cover body or a cylindrical structure with an opening at one end, and the first cavity 232 and the second cavity 233 that are formed by enclosing the housing 2 and the substrate 1 are sealed cavities, and the sealed cavities may be filled with the protective adhesive 8 or not filled with the protective adhesive 8, and are specifically selected according to actual needs, and are not limited herein.
In one embodiment, as shown in fig. 1, 2, 5 and 7, the housing 2 includes a surrounding plate 21, a partition plate 22 and a cover plate 23, wherein the surrounding plate 21 is disposed at the periphery of the substrate 1 and surrounds the first chip 31, the second chip 32 and the first air hole 11; the partition 22 is arranged on the substrate 1 and located between the first chip 31 and the second chip 32, the partition 22 and the surrounding plate 21 enclose to form a first groove 221 and a second groove 222 which are arranged at intervals, so that the first chip 31 is located in the first groove 221 and is arranged at intervals with the first air hole 11, and the second chip 32 is located in the second groove 222; the cover plate 23 covers the notches of the first groove 221 and the second groove 222 and encloses to form a first containing cavity 232 and a second containing cavity 233, the cover plate 23 is provided with a second air hole 231 corresponding to the second groove 222, and the sealing gasket 5 is arranged on one side of the cover plate 23 back to the substrate 1 through the back adhesive 9.
In the present embodiment, as shown in fig. 1 and 7, the enclosure 21 has a cylindrical structure with two open ends, and one end of the enclosure 21 is connected to the substrate 1, so that the enclosure 21 is disposed around the first chip 31, the second chip 32, and the first air hole 11. The partition 22 may be a plate-shaped structure, the partition 22 is disposed in a cavity formed by the enclosure 21 and the substrate 1, and is connected to the substrate 1, the partition 22 is located between the first chip 31 and the second chip 32, so that the partition 22 and the enclosure 21 enclose a first groove 221 and a second groove 222 which are disposed at an interval, at this time, the first chip 31 is located in the first groove 221 and disposed at an interval with the first air vent 11, and the second chip 32 is located in the second groove 222. The cover plate 23 covers the notches of the first groove 221 and the second groove 222 and encloses to form a first cavity 232 and a second cavity 233, that is, the cover plate 23 is connected with the end of the enclosing plate 21 and the partition plate 22 far away from the base plate 1.
It is understood that the shroud 21 is made of metal, FR4, BT or ceramic. The separator 22 is made of metal, FR4, BT or ceramic. The cover plate 23 is made of metal, FR4, BT or ceramic.
In this embodiment, when the surrounding plate 21 is made of metal, the surrounding plate 21 is connected to the substrate 1 through solder paste or conductive adhesive, and when the surrounding plate 21 is made of nonmetal, the surrounding plate 21 is connected to the substrate 1 through epoxy adhesive. When the partition plate 22 is made of a metal material, the partition plate 22 is connected with the substrate 1 through solder paste or conductive adhesive, and when the partition plate 22 is made of a nonmetal material, the partition plate 22 is connected with the substrate 1 through epoxy adhesive. When the surrounding plate 21, the partition plate 22 and the cover plate 23 are made of metal materials, the cover plate 23 is connected with the surrounding plate 21 and the partition plate 22 through solder paste or conductive adhesive, and when the surrounding plate 21, the partition plate 22 and the cover plate 23 are made of nonmetal materials, the cover plate 23 is connected with the surrounding plate 21 and the partition plate 22 through epoxy adhesive, and limitation is not made here.
In one embodiment, as shown in fig. 2 and 5, the cover plate 23, the shroud 21 and the partition 22 are integrally formed. It will be appreciated that this arrangement improves the structural strength of the housing 2, whilst simplifying the manufacturing steps of the housing 2.
As shown in fig. 3, the present invention further provides a packaging process of the package module 100, which includes the following steps:
step S10: manufacturing a first air hole 11 on the substrate 1;
step S20: attaching the first chip 31 and the second chip 32 to the substrate 1 at intervals, so that the first chip 31 and the second chip 32 are both arranged at intervals with the first air hole 11;
step S30: a second air hole 231 is formed in the shell 2, the shell 2 is attached to the substrate 1, and the first air hole 232 and the second air hole 233 which are arranged at intervals are formed by enclosing the shell 2 and the substrate 1, so that the first air hole 11 is communicated with the first air hole 232, the second air hole 231 is communicated with the second air hole 233, the first chip 31 is accommodated in the first air hole 232, and the second chip 32 is accommodated in the second air hole 233;
step S90: the gasket 5 is attached to the case 2 and disposed around the second air hole 231.
In the present embodiment, the structure of the substrate 1 may be a plate-like structure, for example, the substrate 1 is FR4, BT or ceramic, which is not limited herein. It will be appreciated that the substrate 1 may alternatively be a circuit board. The substrate 1 is a PCB board, lines are printed on the PCB board, corresponding electrical functions are achieved, and the PCB board can be selectively designed according to actual needs. The PCB is formed by a multilayer structure, for example, the PCB comprises a substrate layer, one or more copper foil layers and one or more solder mask ink layers, and the selection is specifically carried out according to actual application scenes.
It is understood that the first air holes 11 are formed on the substrate 1 by a punching process. It is understood that the first air hole 11 is a through hole, i.e. the first air hole 11 is disposed through the substrate 1. In the present embodiment, the first chip 31 and the second chip 32 are attached to the substrate 1 with a space therebetween, so that both the first chip 31 and the second chip 32 are disposed with a space therebetween from the first air vent 11.
In the present embodiment, the first chip 31 and the second chip 32 may be mounted on the surface of the substrate 1 by using an SMT process, which is not limited herein. Alternatively, the first chip 31 and the second chip 32 may be analysis chips or integrated single chips, and for discrete chips (i.e. ASIC chip + MEMS chip), the ASIC chip and the MEMS chip may be placed side by side; the ASIC chip and the MEMS chip may also be stacked, that is, the ASIC chip is firstly attached to the substrate 1, and then the MEMS chip is attached to the ASIC chip, which is not limited herein. For an integrated single chip, the chip only needs to be attached to the substrate 1, and is not limited herein.
In one embodiment, as shown in fig. 8 and 9, step S20: the step of attaching the first chip 31 and the second chip 32 to the substrate 1 with a space therebetween includes:
step S21: coating adhesive on one side of the substrate 1;
step S22: adhering a first chip 31 and a second chip 32 on one side of the adhesive, which is far away from the substrate 1, so that the first chip 31 and the second chip 32 are arranged at intervals;
step S23: reflowing the adhesive to solidify the adhesive;
step S24: the first chip 31 and the second chip 32 are connected to the substrate 1 by gold wires 4 by wire bonding.
In this embodiment, an adhesive is provided, and the adhesive can be coated on one side of the substrate 1 through a coating process or a dispensing process, and then the first chip 31 and the second chip 32 are attached to one side of the adhesive, which is away from the substrate 1, and the first chip 31 and the second chip 32 are disposed at an interval. It is understood that the adhesive may be an adhesive for bonding the substrate 1 and the first chip 31 and the second chip 32, and the adhesive may also be a solder paste or a conductive adhesive.
It can be understood that, when the adhesive is solder paste or conductive adhesive, the first chip 31 and the second chip 32 are electrically connected to the substrate 1 through the solder paste or conductive adhesive. When the adhesive is only used to bond and fix the first chip 31 and the second chip 32, the first chip 31 and the second chip 32 can be connected to the substrate 1 by the gold wires 4 through the wire bonding method, so that the first chip 31 and the second chip 32 can be electrically connected to the substrate 1 by the gold wires 4.
In this embodiment, the viscose can be cured by heating, thereby strengthening the adhesive. And a backflow mode can be adopted to solidify the adhesive to realize the reinforcing effect, and the method is not limited herein.
In the present embodiment, the case 2 is perforated through a perforation process to manufacture the second air holes 231. As shown in fig. 2 and 5, the housing 2 is attached to the substrate 1 by an SMT process, so that the housing 2 and the substrate 1 enclose to form a first cavity 232 and a second cavity 233 which are arranged at an interval, at this time, the first air hole 11 is communicated with the first cavity 232, the second air hole 231 is communicated with the second cavity 233, the first chip 31 is accommodated in the first cavity 232, and the second chip 32 is accommodated in the second cavity 233.
It will be appreciated that the housing 2 may be connected to the substrate 1 by solder paste or conductive paste, in which case the housing 2 is a metal housing. Of course, in other embodiments, when the housing 2 is a plastic housing, the housing 2 is connected and fixed to the substrate 1 by epoxy glue. In the embodiment, two groove structures are formed in the housing 2 at intervals, and the housing 2 is inverted on the substrate 1, so that the two groove structures cover the first chip 31 and the second chip 32, respectively.
In one embodiment, as shown in fig. 1, 2, 5 and 7, the housing 2 includes a shroud 21, a baffle 22 and a cover plate 23.
As shown in fig. 6 and 7, step S30: second air hole 231 is made on outer shell 2, outer shell 2 is attached to substrate 1, and first chamber 232 and second chamber 233 which are arranged at intervals are formed by enclosing with substrate 1, so that first air hole 11 is communicated with first chamber 232, second air hole 231 is communicated with second chamber 233, and first chip 31 is contained in first chamber 232, and second chip 32 is contained in second chamber 233 by the steps of:
step S31: attaching the surrounding plate 21 to the substrate 1 so that the surrounding plate 21 surrounds the first chip 31, the second chip 32 and the first air holes 11;
step S32: attaching the partition 22 to the substrate 1, and positioning the partition 22 between the first chip 31 and the second chip 32, so that the partition 22 and the surrounding plate 21 enclose to form a first groove 221 and a second groove 222 which are arranged at intervals, so that the first chip 31 is positioned in the first groove 221 and is arranged at intervals with the first air vent 11, and the second chip 32 is positioned in the second groove 222;
step S33: the second air hole 231 is formed in the cover plate 23, the cover plate 23 is attached to one end, far away from the substrate 1, of the enclosing plate 21 and the partition plate 22, and the cover plate 23 is covered on the notches of the first groove 221 and the second groove 222, so that the cover plate 23, the enclosing plate 21, the partition plate 22 and the substrate 1 are enclosed to form a first containing cavity 232 and a second containing cavity 233, the second air hole 231 is communicated with the second containing cavity 233, and the first air hole 11 is communicated with the first containing cavity 232.
In this embodiment, the surrounding plate 21, the partition 22 and the cover plate 23 of the housing 2 are separately disposed, the surrounding plate 21 is a cylindrical structure with two open ends, the surrounding plate 21 can be fixedly connected to the substrate 1 by solder paste or conductive adhesive, and at this time, the surrounding plate 21 is made of metal. Of course, when the surrounding plate 21 is made of plastic, the surrounding plate 21 can be connected to the substrate 1 through epoxy glue. It will be appreciated that the shroud 21 is disposed around the periphery of the substrate 1 so as to surround the first chip 31, the second chip 32 and the first air holes 11.
It is understood that the partition 22 may be a plate-shaped structure, and the partition 22 may be fixedly connected to the substrate 1 by solder paste or conductive adhesive, in which case the partition 22 is made of metal. Of course, when the partition 22 is made of plastic, the partition 22 can be connected to the substrate 1 by epoxy glue.
In the present embodiment, when the partition 22 is attached to the substrate 1, the partition 22 is located between the first chip 31 and the second chip 32, and at this time, the partition 22 and the surrounding plate 21 enclose to form the first groove 221 and the second groove 222 which are arranged at an interval, so that the first chip 31 is located in the first groove 221 and arranged at an interval from the first air hole 11, and the second chip 32 is located in the second groove 222.
Optionally, the cover plate 23 is made of metal, FR4, BT or ceramic. The cover plate 23 can be fixedly connected with the surrounding plate 21 and the partition plate 22 through solder paste or conductive adhesive, and at this time, the cover plate 23, the surrounding plate 21 and the partition plate 22 are all made of metal materials. Of course, when the cover plate 23, the surrounding plate 21 and the partition plate 22 are made of plastic, the cover plate 23 may be connected to the surrounding plate 21 and the partition plate 22 by epoxy glue. In this embodiment, the cover plate 23 is disposed opposite and parallel to the base plate 1, and the shroud 21 and the partition 22 are located between the cover plate 23 and the base plate 1.
In one embodiment, as shown in fig. 4, 5, 6 and 7, step S90: before the step of attaching the sealing gasket 5 to the housing 2 and disposing around the second air hole 231, the packaging process further includes:
step S40: coating the back adhesive 9 on the outer wall of the housing 2, so that the back adhesive 9 is arranged around the second air hole 231;
step S70: the dustproof net 6 is stuck on one side of the back adhesive 9, which is far away from the shell 2, so that the second air hole 231 is covered by the dustproof net 6;
step S80: the side of the dust screen 6 facing away from the housing 2 is coated with a backing adhesive 9, such that the backing adhesive 9 is disposed around the second air hole 231.
In the present embodiment, the back adhesive 9 may be coated on a side of the cover plate 23 of the housing 2 facing away from the substrate 1 through a coating process or a dispensing process, such that the back adhesive 9 is disposed around the second air hole 231. Optionally, the back adhesive 9 is a hot-pressed adhesive or a pressure-sensitive adhesive.
It can be understood that the dust screen 6 is attached to one side of the back adhesive 9 departing from the housing 2 by the SMT process, so that the second air hole 231 is covered by the dust screen 6, and therefore, the situation that impurities such as dust enter the second accommodating cavity 233 from the second air hole 231 to affect the performance of the second chip 32 can be effectively avoided.
In this embodiment, in order to facilitate the mounting of the sealing gasket 5, a coating process or a dispensing process may be adopted to further coat a layer of gum 9 on one side of the dust-proof screen 6, which is opposite to the housing 2, so that the gum 9 surrounds the second air hole 231, that is, the gum 9 is coated on the peripheral position of the dust-proof screen 6, so that the sealing gasket 5 is mounted on one side of the gum 9, which is opposite to the dust-proof screen 6, by the SMT process, so that the sealing gasket 5 is disposed around the second air hole 231, and thus the sealing gasket 5 and the terminal device are integrated in a sealing manner.
In one embodiment, as shown in fig. 4 and 5, step S70: before the step of adhering the dust screen 6 to the side of the back adhesive 9 away from the housing 2 to make the dust screen 6 cover the second air hole 231, the packaging process further includes:
step S50': adhering a waterproof membrane 7 on the side of the back adhesive 9 away from the shell 2, so that the waterproof membrane 7 covers the second air hole 231;
step S60': the waterproof membrane 7 is coated with a backing adhesive 9 on a side facing away from the housing 2 such that the backing adhesive 9 is disposed around the second air hole 231.
In this embodiment, the waterproof film 7 is attached to the side of the back adhesive 9 away from the housing 2 by the SMT process, so that the waterproof film 7 covers the second air hole 231, thereby effectively preventing water vapor, water drops and the like from entering the second cavity 233 from the second air hole 231 to affect the performance of the second chip 32.
It can be understood that, in order to facilitate the mounting of the dust screen 6, a coating process or a dispensing process may be adopted to further coat a layer of gum 9 on one side of the waterproof film 7, which is opposite to the housing 2, so that the gum 9 surrounds the second air hole 231, that is, the gum 9 is coated on the peripheral position of the waterproof film 7, so that the dust screen 6 is attached to one side of the gum 9, which is away from the waterproof film 7, by the SMT process, so that the dust screen covers the second air hole 231, so that the dust screen 6 and the waterproof film 7 are conveniently covered with the second air hole 231 at the same time, and the performance of the second chip 32 is prevented from being affected by dust or water vapor and the like entering the second accommodating cavity 233 through the second air hole 231.
In another embodiment, as shown in fig. 6 and 7, step S33: the second air hole 231 is formed in the cover plate 23, the cover plate 23 is attached to one end, far away from the substrate 1, of the enclosing plate 21 and the partition plate 22, and is covered on the notches of the first groove 221 and the second groove 222, so that the cover plate 23, the enclosing plate 21, the partition plate 22 and the substrate 1 are enclosed to form a first containing cavity 232 and a second containing cavity 233, the second air hole 231 is communicated with the second containing cavity 233, and before the step of communicating the first containing cavity 232 with the first air hole 11, the packaging process further comprises the following steps:
step S51: filling the second groove 222 with the protective glue 8 through the dispensing valve to cover the second chip 32;
step S52: defoaming the protective adhesive 8 in a vacuum pumping mode;
step S53: the protective glue 8 is cured by adopting a step-type heating process.
In order to facilitate the filling of the protective adhesive 8 in the second cavity 233 to cover the second chip 32, in this embodiment, before the cover plate 23 is attached to one end of the enclosing plate 21 and the partition plate 22 away from the substrate 1 and covers the notches of the first groove 221 and the second groove 222, the protective adhesive 8 is filled into the second groove 222 through the dispensing valve, so that the protective adhesive 8 covers the second chip 32.
As can be understood, the dispensing valve adopts a piezoelectric ceramic valve, and can be selected from a piezoelectric valve of a full-automatic dispensing machine for bottom glue filling. The working principle of the piezoelectric valve of the full-automatic dispenser is as follows: a high speed piezoelectric ceramic is used to swing a striker to a valve seat (nozzle insert) and liquid (under pressure) flows into a cavity between the striker and the nozzle, where the striker impacts the nozzle to produce a droplet. At the initial moment of the piezoelectric valve of the full-automatic dispensing machine, the glue body is filled in the valve body channel, the upper part of the firing pin is pressed against the bottom of the nozzle by the weight of the glue body and seals the outlet of the nozzle, the piezoelectric brake is applied with high level, and the piezoelectric brake transversely extends to enable the firing pin of the piezoelectric valve to be lifted upwards.
Then the nozzle of the piezoelectric valve of the full-automatic dispensing machine is opened, the striker is filled by external air pressure driving liquid to move upwards, then a valve body gap is formed, a certain amount of glue liquid flows out of the nozzle, at the moment, the piezoelectric brake is applied with low level, and the piezoelectric brake and the rhombic amplification mechanism contract. Simultaneously under the effect of spring restoring force, the firing pin is downward high-speed striking nozzle inner chamber body and is sealed the spout, and the colloid is crowded cavity in the nozzle and under the effect of inertial force, and the firing pin constantly up-and-down reciprocating vibration to realize full-automatic point gum machine high-speed injection point is glued, can adjust firing pin amplitude, frequency through changing driving voltage amplitude, frequency, duty cycle etc. and adjust, and then realize the control to glue dripping ejection performance.
The full-automatic glue dispenser valve adopts non-contact type spraying glue dispensing, has high precision and stronger functions, and can spray glue dispensing in narrow gaps.
In order to avoid filling the protective glue 8 into the second groove 222 through the glue dispensing valve, air on the bottom wall of the second groove 222 cannot be discharged in time, and air bubbles float to the upper surface of the protective glue 8 when the protective glue 8 is solidified, so that defects are formed to influence the performance and the appearance attractiveness of the protective glue 8. In this embodiment, the filled protective paste 8 is subjected to a defoaming treatment in a vacuum-pumping manner, so that all the bubbles in the protective paste 8 are discharged. It can be understood that the protective adhesive 8 is further cured by a step-type heating manner, so as to ensure that the protective adhesive 8 completely covers the second chip 32.
In an embodiment, as shown in fig. 1, 6, and 7, in the packaging process of the package module 100 according to the present invention, the first chip 31 and the second chip 32 are attached to one side of the substrate 1 by attaching the chips, the first chip 31 and the second chip 32 are connected to the substrate by using the gold wires 4 through wire bonding, the enclosure plate 21 and the partition plate 22 are attached to the substrate 1, the first chip 31 is located in the first groove 221 formed by enclosing the partition plate 22 and the enclosure plate 21, the second chip 32 is located in the second groove 222 formed by enclosing the partition plate 22 and the enclosure plate 21, the protective adhesive 8 is poured into the second groove 222 through a dispensing valve process to protect the second chip 32, the gold wires 4, and the like, the protective adhesive 8 can be defoamed in a vacuum pumping manner before curing, and a step-type temperature raising process can be adopted during the curing process. Then, the cover plate 23 is adhered to the end of the enclosing plate 21 and the partition plate 22 away from the base plate 1 to cover the notches of the first groove 221 and the second groove 222 and enclose the first cavity 232 and the second cavity 233. Then, the dustproof net 6 is attached to one side, back to the substrate 1, of the cover plate 23 through the back adhesive 9, the second air hole 231 is covered, the sealing gasket 5 is attached to one side, back to the cover plate 23, of the dustproof net 6 through the back adhesive 9 and surrounds the second air hole 231, and therefore the sealing gasket 5 is conveniently used for being connected with terminal equipment.
In another embodiment, as shown in fig. 2, 4 and 3, in the packaging process of the package module 100 according to the present invention, the first chip 31 and the second chip 32 are attached to one side of the substrate 1 by attaching the chips, the first chip 31 and the second chip 32 are connected to the substrate by using the gold wires 4 by wire bonding, the housing 2 is attached to the substrate 1 and encloses with the substrate 1 to form the first cavity 232 and the second cavity 233 arranged at an interval, the first chip 31 is located in the first cavity 232, the second chip 32 is located in the second cavity 233, the waterproof film 7 is attached to one side of the cover plate 23 of the housing 2 facing away from the substrate 1 by the back adhesive 9, the second air hole 231 is covered by the back adhesive, the dustproof mesh 6 is attached to one side of the waterproof film 7 facing away from the cover plate 23 of the housing 2 by the back adhesive 9, the second air hole 231 is covered by the back adhesive 9, the sealing pad 5 is attached to one side of the dustproof mesh 6 facing away from the cover plate 23 by the back adhesive 9, and surrounds the second air hole 231 so as to facilitate the use of the gasket 5 for connection with the terminal equipment.
It can be understood that the encapsulation module 100 manufactured by adopting the two methods not only improves the waterproof performance of the encapsulation module, but also can be integrated with a terminal system in a sealing way through the sealing gasket 5 to measure the external atmospheric pressure, and has the function of measuring the internal atmospheric pressure value of the terminal. Therefore, by utilizing the function, a high-pressure air tightness test procedure can be added outside the terminal before the terminal leaves a factory, and whether the air tightness of the whole machine is good or not can be judged by reading the change of the air pressure value inside the terminal.
The invention further provides an electronic device, which includes a device housing and the encapsulation module 100, wherein the encapsulation module 100 is disposed on the device housing. The specific structure of the package module 100 refers to the foregoing embodiments, and since the electronic device adopts all the technical solutions of all the foregoing embodiments, at least all the beneficial effects brought by the technical solutions of the foregoing embodiments are achieved, and no further description is given here.
The above description is only an alternative embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.

Claims (12)

1. An encapsulated module, comprising:
the substrate is provided with a first air hole;
the shell is arranged on the substrate and encloses with the substrate to form a first cavity and a second cavity which are arranged at intervals, the first air hole is communicated with the first cavity, and the shell is provided with a second air hole communicated with the second cavity;
the chip assembly comprises a first chip and a second chip, the first chip is arranged in the first containing cavity and is arranged at an interval with the first air hole, the second chip is arranged in the second containing cavity, and the first chip and the second chip are electrically connected with the substrate through gold wires respectively; and
and the sealing gasket is arranged on the shell and surrounds the second air hole, and the sealing gasket is used for being connected with a terminal system.
2. The encapsulation module of claim 1, further comprising a dust screen disposed between the gasket and the housing, the dust screen covering the second air hole.
3. The encapsulation module of claim 2, further comprising a waterproof membrane disposed between the dust screen and the housing, the waterproof membrane covering the second air hole arrangement;
or, the packaging module further comprises a protective adhesive, and the protective adhesive is filled in the second containing cavity and covers the second chip.
4. The package module of any one of claims 1 to 3, wherein the housing comprises:
the surrounding plate is arranged on the periphery of the substrate and surrounds the first chip, the second chip and the first air hole;
the baffle is arranged on the substrate and positioned between the first chip and the second chip, the baffle and the surrounding plate are encircled to form a first groove and a second groove which are arranged at intervals, so that the first chip is positioned in the first groove and is arranged at intervals with the first air hole, and the second chip is positioned in the second groove; and
the cover plate covers the notches of the first groove and the second groove and is enclosed to form the first containing cavity and the second containing cavity, the cover plate corresponds to the second groove and is provided with the second air hole, and the sealing gasket is arranged on one side, back to the base plate, of the cover plate through back glue.
5. The package module of claim 4, wherein the cover plate, the enclosure plate, and the spacer are integrally formed;
and/or the coaming, the clapboard and the cover plate are made of metal, FR4, BT or ceramic;
and/or the substrate is FR4, BT or ceramic;
and/or the first chip and the second chip are ASIC chip + MEMS chip or integrated single chip;
and/or the coaming and the clapboard are connected with the substrate through solder paste, conductive adhesive or epoxy adhesive;
and/or the cover plate is connected with the coaming and the clapboard through solder paste, conductive adhesive or epoxy adhesive;
and/or the back adhesive is a hot-pressing adhesive or a pressure-sensitive adhesive.
6. A process for encapsulating a package module according to any of claims 1 to 5, characterized in that it comprises the following steps:
manufacturing a first air hole on the substrate;
mounting a first chip and a second chip on a substrate at intervals, so that the first chip and the second chip are arranged at intervals with the first air hole;
manufacturing a second air hole on the shell, attaching the shell to the substrate, and enclosing the shell and the substrate to form a first cavity and a second cavity which are arranged at intervals, so that the first air hole is communicated with the first cavity, the second air hole is communicated with the second cavity, the first chip is accommodated in the first cavity, and the second chip is accommodated in the second cavity;
and attaching a sealing gasket to the shell and surrounding the second air hole.
7. The process of claim 6, wherein said step of attaching a gasket to said housing and surrounding said second vent opening is preceded by the step of:
coating back glue on the outer wall of the shell, and enabling the back glue to surround the second air hole;
sticking a dust screen on one side of the back adhesive, which is far away from the shell, so that the dust screen covers the second air hole;
and coating a back adhesive on one side of the dustproof net, which is back to the shell, so that the back adhesive is arranged around the second air hole.
8. The packaging process according to claim 7, wherein before the step of attaching a dust screen to a side of the adhesive opposite to the housing, so that the dust screen covers the second air hole, the packaging process further comprises:
adhering a waterproof membrane to one side of the back adhesive, which is far away from the shell, so that the waterproof membrane covers the second air hole;
and coating a back adhesive on one side of the waterproof membrane, which is back to the shell, so that the back adhesive is arranged around the second air hole.
9. The packaging process according to claim 6, wherein the housing includes a surrounding plate, a partition plate and a cover plate, the second air hole is formed in the housing, the housing is attached to the substrate, and the housing and the substrate surround to form a first cavity and a second cavity which are arranged at an interval, so that the first air hole is communicated with the first cavity, the second air hole is communicated with the second cavity, the first chip is accommodated in the first cavity, and the second chip is accommodated in the second cavity, the step of manufacturing the second air hole includes:
attaching the enclosing plate to the substrate, so that the enclosing plate surrounds the first chip, the second chip and the first air hole;
the partition board is attached to the substrate and positioned between the first chip and the second chip, so that the partition board and the surrounding plate are enclosed to form a first groove and a second groove which are arranged at intervals, the first chip is positioned in the first groove and is arranged at intervals with the first air hole, and the second chip is positioned in the second groove;
the cover plate is provided with a second air hole, the cover plate is attached to one end, far away from the base plate, of the enclosing plate and the partition plate, and the cover plate covers the notches of the first groove and the second groove, so that the cover plate, the enclosing plate, the partition plate and the base plate are enclosed to form the first containing cavity and the second containing cavity, the second air hole is communicated with the second containing cavity, and the first air hole is communicated with the first containing cavity.
10. The package process according to claim 9, wherein before the step of forming the second air hole in the cover plate, attaching the cover plate to one end of the enclosing plate and the partition plate away from the substrate, and sealing the notches of the first groove and the second groove, so that the cover plate, the enclosing plate, the partition plate, and the substrate enclose the first cavity and the second cavity, the second air hole communicates with the second cavity, and the first air hole communicates with the first cavity, the method further comprises:
filling protective glue into the second groove through a glue dispensing valve so as to cover the second chip;
defoaming the protective adhesive in a vacuumizing mode;
and curing the protective adhesive by adopting a step-type heating process.
11. The packaging process of claim 6, wherein the step of attaching the first chip and the second chip to the substrate at intervals comprises:
coating adhesive on one side of the substrate;
adhering a first chip and a second chip to one side of the adhesive, which is far away from the substrate, so that the first chip and the second chip are arranged at intervals;
reflowing the adhesive to solidify the adhesive;
and respectively connecting the first chip and the second chip with the substrate by gold wires in a wire bonding mode.
12. An electronic device comprising a device housing and the package module of any one of claims 1-5, wherein the package module is disposed on the device housing.
CN202110257461.7A 2021-03-09 2021-03-09 Packaging module, packaging process and electronic equipment Pending CN113053861A (en)

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Application publication date: 20210629