CN113035479A - Method for assembling chip resistor on metal wire frame and carrying out low-voltage packaging for mechanical switch type safety belt alarm sensor - Google Patents
Method for assembling chip resistor on metal wire frame and carrying out low-voltage packaging for mechanical switch type safety belt alarm sensor Download PDFInfo
- Publication number
- CN113035479A CN113035479A CN202110225989.6A CN202110225989A CN113035479A CN 113035479 A CN113035479 A CN 113035479A CN 202110225989 A CN202110225989 A CN 202110225989A CN 113035479 A CN113035479 A CN 113035479A
- Authority
- CN
- China
- Prior art keywords
- chip resistor
- wire frame
- metal wire
- mechanical switch
- safety belt
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Images
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01V—GEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
- G01V13/00—Manufacturing, calibrating, cleaning, or repairing instruments or devices covered by groups G01V1/00 – G01V11/00
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01C—RESISTORS
- H01C17/00—Apparatus or processes specially adapted for manufacturing resistors
- H01C17/02—Apparatus or processes specially adapted for manufacturing resistors adapted for manufacturing resistors with envelope or housing
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/303—Surface mounted components, e.g. affixing before soldering, aligning means, spacing means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/341—Surface mounted components
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Geophysics (AREA)
- Manufacture Of Switches (AREA)
Abstract
The utility model provides a method that is used for equipment chip resistor and carries out low pressure encapsulation on the wire frame of mechanical switch formula safety belt alarm sensor, relates to mechanical switch formula safety belt alarm sensor technical field to it is great to solve current mechanical switch formula safety belt sensor product structure usually, and the technology processing degree of difficulty is big, man-hour is longer, and dustproof and waterproof effect is not good technical problem. The invention provides a method for assembling a chip resistor on a metal wire frame and packaging the chip resistor at low voltage for a mechanical switch type safety belt alarm sensor, which comprises the following steps: step S1, after the metal wire frame is placed in an SMT fixture, the operation of brushing solder paste on the steel mesh is carried out at the corresponding position; step S2, carrying out surface mounting on the chip resistor and the printed solder paste; step S3, performing reflow soldering on the chip resistor; and step S4, performing low-voltage packaging on the chip resistor by using thermosetting epoxy resin.
Description
Technical Field
The invention relates to the technical field of mechanical switch type safety belt alarm sensors, in particular to a method for assembling a chip resistor on a metal wire frame and carrying out low-voltage packaging for the mechanical switch type safety belt alarm sensor.
Background
At present, a mechanical switch type safety belt sensor is used for detecting whether a safety belt is inserted into a safety belt buckle or not in the driving process of a vehicle, and if the safety belt is not inserted, a vehicle-mounted computer is informed to send an alarm prompt.
Specifically, the prior art mechanical switch type seat belt sensor usually uses a lead resistor, and the lead resistor is assembled into a product by resistance welding or soldering.
However, the inventor of the application finds that the existing design and process require a product with a larger structure, large processing difficulty and longer working hours; in addition, lead resistors are easily not completely packaged, so that the dustproof water discharging effect is poor.
Disclosure of Invention
The invention aims to provide a method for assembling a chip resistor on a metal wire frame and packaging the chip resistor at low voltage for a mechanical switch type safety belt alarm sensor, so as to solve the technical problems that the conventional mechanical switch type safety belt sensor is large in product structure, large in process processing difficulty, long in working time and poor in dustproof and waterproof effects.
These and other objects, features and advantages of the present invention will become more fully apparent from the following detailed description.
In order to achieve at least one of the above objects, the present invention provides a method for assembling a chip resistor on a metal wire frame and performing low voltage encapsulation for a mechanical switch type seat belt alarm sensor, comprising the steps of:
step S1, after the metal wire frame is placed in an SMT fixture, the operation of brushing solder paste on the steel mesh is carried out at the corresponding position;
step S2, carrying out surface mounting on the chip resistor and the printed solder paste;
step S3, performing reflow soldering on the chip resistor;
and step S4, performing low-voltage packaging on the chip resistor by using thermosetting epoxy resin.
Wherein, before the step S1, the method further includes: and step S10, distributing the metal wire frames at equal intervals and manufacturing a semi-finished product with a strip-shaped structure.
Wherein, after the step S3, the method further comprises: and step S30, sequentially shearing the semi-finished products of the strip-shaped structures according to the specific number of the metal wire frames so as to perform subsequent processing and/or assembly.
Specifically, the step S4 specifically includes: and placing the semi-finished product into a thermosetting epoxy resin low-pressure packaging mold, and performing injection molding on the chip resistor.
Further, the corresponding positions include a first position and a second position, the first mounting position corresponds to the first chip resistor, and the resistance value of the first chip resistor is 300 Ω; the second mounting position corresponds to a second chip resistor, and the resistance value of the second chip resistor is 100 omega;
mechanical switch formula safety belt warning sensor includes: the metal wire frame and a push rod which can move relative to the metal wire frame; the metal wire frame is provided with a first contact piece and a second contact piece, and the first contact piece and the second contact piece can move relatively under the action of the push rod to be electrically connected or disconnected; when the push rod is located at the first position, the first contact piece is in contact with the second contact piece, and a circuit loop comprises the first chip resistor; when the push rod is located at the second position, the first contact piece is separated from the second contact piece, and at the moment, the circuit loop comprises the first chip resistor and the second chip resistor which are connected in series.
According to the method for assembling the chip resistor on the metal wire frame and packaging the chip resistor at low pressure for the mechanical switch type safety belt alarm sensor, the metal wire frame is firstly placed into an SMT (surface mount technology) jig, then the tin paste brushing operation of a steel mesh is carried out at the corresponding position, then the chip resistor and the printed tin paste are subjected to surface mounting, and finally the chip resistor is subjected to reflow soldering, so that the SMT chip resistor directly on the metal wire frame is adopted to replace the lead resistor in the prior art, the size, the weight and the complexity of a mechanical structure are effectively reduced, the processing technology difficulty is reduced, the processing efficiency is improved, and the cost is reduced; in addition, because the chip resistor is encapsulated by thermosetting epoxy resin at low pressure, the dustproof and waterproof effect is effectively improved, and the strength is increased.
Drawings
Fig. 1 is a first flow chart of a method for assembling a chip resistor on a metal wire frame and packaging the chip resistor at low voltage for a mechanical switch type safety belt alarm sensor in the invention;
fig. 2 is a second flow chart of the method for assembling the chip resistor on the metal wire frame and packaging the chip resistor at low voltage for the mechanical switch type safety belt alarm sensor in the invention;
fig. 3 is a schematic structural diagram illustrating a method for assembling a chip resistor on a metal wire frame and performing low-voltage packaging for a mechanical switch type seat belt alarm sensor according to the present invention;
fig. 4 shows a schematic structural diagram of a mechanical switch type seatbelt warning sensor according to the present invention.
In the figure, the position of the upper end of the main shaft,
1-a metal wire frame; 11-a first contact; 12-a second contact; 2-chip resistance; 21-a first chip resistor; 22-a second chip resistor; 3-a push rod; a-a first position; b-second position.
Detailed Description
The preferred embodiments in the following description are given by way of example only, and other obvious variations will occur to those skilled in the art. The basic principles of the invention, as defined in the following description, may be applied to other embodiments, variations, modifications, equivalents, and other technical solutions without departing from the spirit and scope of the invention.
It will be understood by those skilled in the art that in the present disclosure, the terms "longitudinal," "lateral," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," and the like are used in an orientation or positional relationship indicated in the drawings for ease of description and simplicity of description, and do not indicate or imply that the referenced devices or components must be in a particular orientation, constructed and operated in a particular orientation, and thus the above terms are not to be construed as limiting the present invention.
With reference to fig. 1 to 4 of the specification, a method for assembling a chip resistor on a metal wire frame and performing low-voltage packaging for a mechanical switch type seat belt alarm sensor according to a preferred embodiment of the present invention includes the following steps:
step S1, after the metal wire frame 1 is placed in an SMT fixture, the operation of brushing solder paste on the steel mesh is carried out at the corresponding position;
step S2, carrying out surface mounting on the chip resistor 2 and the printed solder paste;
step S3, performing reflow soldering on the chip resistor 2;
step S4, low-voltage packaging the chip resistor 2 with thermosetting epoxy resin.
According to the method for assembling the chip resistor on the metal wire frame and packaging the chip resistor at low pressure for the mechanical switch type safety belt alarm sensor, the metal wire frame 1 is firstly placed into an SMT (surface mount technology) jig, the operation of brushing tin paste on a steel mesh is carried out at a corresponding position, then the chip resistor 2 and the printed tin paste are subjected to surface mounting, and finally the chip resistor 2 is subjected to reflow soldering, so that the SMT chip resistor 2 directly on the metal wire frame 1 is adopted to replace a lead resistor in the prior art, the size, the weight and the complexity of a mechanical structure are effectively reduced, the difficulty of a processing process is reduced, the processing efficiency is improved, and the cost is reduced; in addition, because carry out low pressure encapsulation with chip resistor 2 with thermosetting epoxy, consequently effectively improved dustproof and waterproof effect, increased intensity simultaneously.
It should be added here that SMT is Surface mount Technology (Surface mount Technology) -an abbreviation of Surface Mounted Technology, which is the most popular Technology and process in the electronic assembly industry.
As shown in fig. 2, before step S1, the method may further include: and step S10, distributing a plurality of metal wire frames 1 at equal intervals and manufacturing a semi-finished product with a strip-shaped structure.
As shown in fig. 2, after step S3, the method may further include: and step S30, sequentially shearing the semi-finished products of the strip-shaped structures according to the specific number of the metal wire frames 1 so as to perform subsequent processing and/or assembly.
Specifically, as shown in fig. 2, the step S4 may specifically include: and placing the semi-finished product into a thermosetting epoxy resin low-pressure packaging mold, and performing injection molding on the chip resistor 2.
Further, as shown in fig. 1 and 2 in conjunction with fig. 3 and 4, the corresponding positions may include a first mounting position and a second mounting position, the first mounting position corresponds to the first chip resistor 21, and the resistance of the first chip resistor 21 may preferably be 300 Ω; the second mounting position corresponds to the second chip resistor 22, and the resistance of the second chip resistor 22 may preferably be 100 Ω;
a mechanical switch-type seat belt warning sensor, may include: the wire frame 1, and a push rod 3 movable relative to the wire frame 1; the metal wire frame 1 is provided with a first contact piece 11 and a second contact piece 12, and the first contact piece 11 and the second contact piece 12 can move relatively under the action of the push rod 3 to be electrically connected or disconnected; when the push rod 3 is located at the first position A, the first contact piece 11 is contacted with the second contact piece 12, and at the moment, the circuit loop comprises the first chip resistor 21, so that the system detects that the safety belt is inserted, and does not need to start an alarm; when the push rod 3 is located at the second position B, the first contact piece 11 is separated from the second contact piece 12, and at this time, the circuit loop comprises the first chip resistor 21 and the second chip resistor 22 which are connected in series, so that the system detects that the safety belt is not inserted into the buckle, and the system gives an alarm.
In summary, the method for assembling the chip resistor on the metal wire frame and performing low-voltage packaging for the mechanical switch type safety belt alarm sensor provided by the embodiment of the invention adopts the process of directly performing the SMT chip resistor on the metal wire frame, thereby effectively solving the adverse factors of large structure, heavy weight, difficult processing process and long processing time of the early product; in addition, the technology of directly packaging the chip resistor with thermosetting epoxy resin at low pressure is adopted, so that the size and complexity of the structure are effectively reduced, the dustproof and waterproof effects are enhanced, and the strength is enhanced.
It will be appreciated by persons skilled in the art that the embodiments of the invention shown in the foregoing description are by way of example only and are not limiting of the invention. The objects of the invention have been fully and effectively accomplished. The functional and structural principles of the present invention have been shown and described in the examples, and any variations or modifications of the embodiments of the present invention may be made without departing from the principles.
Claims (5)
1. A method for assembling a chip resistor on a metal wire frame and packaging the chip resistor at low voltage for a mechanical switch type safety belt alarm sensor is characterized by comprising the following steps:
step S1, after the metal wire frame is placed in an SMT fixture, the operation of brushing solder paste on the steel mesh is carried out at the corresponding position;
step S2, carrying out surface mounting on the chip resistor and the printed solder paste;
step S3, performing reflow soldering on the chip resistor;
and step S4, performing low-voltage packaging on the chip resistor by using thermosetting epoxy resin.
2. The method for assembling a chip resistor on a wire frame and performing low voltage packaging for a mechanical switch type seatbelt alarm sensor as claimed in claim 1, wherein before said step S1, further comprising: and step S10, distributing the metal wire frames at equal intervals and manufacturing a semi-finished product with a strip-shaped structure.
3. The method for assembling a chip resistor on a wire frame and performing low voltage packaging for a mechanical switch type seatbelt alarm sensor according to claim 2, further comprising after said step S3: and step S30, sequentially shearing the semi-finished products of the strip-shaped structures according to the specific number of the metal wire frames so as to perform subsequent processing and/or assembly.
4. The method for assembling the chip resistor on the metal wire frame and performing the low voltage encapsulation for the mechanical switch type seat belt alarm sensor as claimed in claim 3, wherein the step S4 specifically comprises: and placing the semi-finished product into a thermosetting epoxy resin low-pressure packaging mold, and performing injection molding on the chip resistor.
5. The method for assembling and low-voltage packaging a chip resistor on a metal wire frame for a mechanical switch type safety belt alarm sensor according to any one of claims 1 to 4, wherein the corresponding positions comprise a first position and a second position, the first mounting position corresponds to a first chip resistor, and the resistance value of the first chip resistor is 300 Ω; the second mounting position corresponds to a second chip resistor, and the resistance value of the second chip resistor is 100 omega;
mechanical switch formula safety belt warning sensor includes: the metal wire frame and a push rod which can move relative to the metal wire frame; the metal wire frame is provided with a first contact piece and a second contact piece, and the first contact piece and the second contact piece can move relatively under the action of the push rod to be electrically connected or disconnected; when the push rod is located at the first position, the first contact piece is in contact with the second contact piece, and a circuit loop comprises the first chip resistor; when the push rod is located at the second position, the first contact piece is separated from the second contact piece, and at the moment, the circuit loop comprises the first chip resistor and the second chip resistor which are connected in series.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110225989.6A CN113035479A (en) | 2021-03-01 | 2021-03-01 | Method for assembling chip resistor on metal wire frame and carrying out low-voltage packaging for mechanical switch type safety belt alarm sensor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110225989.6A CN113035479A (en) | 2021-03-01 | 2021-03-01 | Method for assembling chip resistor on metal wire frame and carrying out low-voltage packaging for mechanical switch type safety belt alarm sensor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113035479A true CN113035479A (en) | 2021-06-25 |
Family
ID=76465020
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110225989.6A Pending CN113035479A (en) | 2021-03-01 | 2021-03-01 | Method for assembling chip resistor on metal wire frame and carrying out low-voltage packaging for mechanical switch type safety belt alarm sensor |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113035479A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110128066A1 (en) * | 2009-11-30 | 2011-06-02 | Hitachi Automotives Systems, Ltd. | Motor driving apparatus |
| CN105774747A (en) * | 2015-01-09 | 2016-07-20 | 保险丝公司 | Seat belt buckle |
| CN107979971A (en) * | 2017-11-22 | 2018-05-01 | 浙江东和电子科技有限公司 | The packaging technology of thin support plate integrated circuit |
| CN212447429U (en) * | 2020-04-30 | 2021-02-02 | 安费诺汽车连接系统（常州）有限公司 | Automobile safety belt detection switch with built-in circuit board |
-
2021
- 2021-03-01 CN CN202110225989.6A patent/CN113035479A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110128066A1 (en) * | 2009-11-30 | 2011-06-02 | Hitachi Automotives Systems, Ltd. | Motor driving apparatus |
| CN105774747A (en) * | 2015-01-09 | 2016-07-20 | 保险丝公司 | Seat belt buckle |
| CN107979971A (en) * | 2017-11-22 | 2018-05-01 | 浙江东和电子科技有限公司 | The packaging technology of thin support plate integrated circuit |
| CN212447429U (en) * | 2020-04-30 | 2021-02-02 | 安费诺汽车连接系统（常州）有限公司 | Automobile safety belt detection switch with built-in circuit board |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8966975B2 (en) | Method and apparatus for packaging crash sensors | |
| EP2538761B1 (en) | Intelligent Power Module and related assembling method | |
| US7352562B2 (en) | Surface-mount solid electrolytic capacitor and process for manufacturing same | |
| US20150357270A1 (en) | Integrated electronic package and method of fabrication | |
| KR102182947B1 (en) | Sensor with a single electrical carrier means | |
| CN113035479A (en) | Method for assembling chip resistor on metal wire frame and carrying out low-voltage packaging for mechanical switch type safety belt alarm sensor | |
| KR20160009033A (en) | Contacting part for a drive module, drive module, and method for producing a contacting part | |
| KR101890618B1 (en) | Clamp Terminal and Batter Sensor Module comprising the Clamp Terminal | |
| EP1261079A2 (en) | Functional connector | |
| CN113012881A (en) | Method for assembling chip resistor on metal wire frame for mechanical switch type safety belt alarm sensor | |
| CN218973692U (en) | Brake system pressure sensor based on digital output | |
| CN104850160B (en) | The manufacture method of voltage controller | |
| CN214585525U (en) | Double-output Hall revolution speed sensor | |
| JP3731511B2 (en) | Connector integrated power module | |
| JP3889690B2 (en) | Manufacturing method of electronic component built-in connector | |
| CN210604708U (en) | Leadframes and Sensor Modules | |
| CN112388100B (en) | Multi-dimensional layering circuit board integral type welding jig | |
| US6800813B2 (en) | Switch for power tools with integrated switch contacts | |
| CN218006649U (en) | Suction nozzle clamping jaw device for SMT (surface mount technology) mounting of plug-in unit | |
| KR100737135B1 (en) | Motor Control Electronic Control Unit of Vehicle | |
| US20250112387A1 (en) | Electrical assembly | |
| CN216982426U (en) | Electronic component production equipment with prevent maloperation | |
| CN220042329U (en) | Plug-in type flexible circuit board for intelligent robot | |
| CN214956858U (en) | Matrix type chip-on-diode connection wafer packaging structure | |
| CN216773073U (en) | Multi-functional film capacitor for new energy automobile |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210625 |