CN113026064A - Cyanide-free and lead-free cupronickel-tin electroplating process - Google Patents
Cyanide-free and lead-free cupronickel-tin electroplating process Download PDFInfo
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- 238000009713 electroplating Methods 0.000 title claims abstract description 63
- 238000000034 method Methods 0.000 title claims abstract description 34
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 claims abstract description 75
- KUNSUQLRTQLHQQ-UHFFFAOYSA-N copper tin Chemical compound [Cu].[Sn] KUNSUQLRTQLHQQ-UHFFFAOYSA-N 0.000 claims abstract description 41
- 229910000570 Cupronickel Inorganic materials 0.000 claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 38
- 239000002184 metal Substances 0.000 claims abstract description 38
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical class [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 29
- 239000008139 complexing agent Substances 0.000 claims abstract description 20
- 150000003839 salts Chemical class 0.000 claims abstract description 17
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011701 zinc Substances 0.000 claims abstract description 16
- 229910052725 zinc Inorganic materials 0.000 claims abstract description 16
- 150000001879 copper Chemical class 0.000 claims abstract description 13
- 239000000080 wetting agent Substances 0.000 claims abstract description 13
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 230000008021 deposition Effects 0.000 claims abstract description 10
- 229910021626 Tin(II) chloride Inorganic materials 0.000 claims abstract description 9
- XLOMVQKBTHCTTD-UHFFFAOYSA-N Zinc monoxide Chemical compound [Zn]=O XLOMVQKBTHCTTD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000011248 coating agent Substances 0.000 claims abstract description 8
- 238000000576 coating method Methods 0.000 claims abstract description 8
- BWHMMNNQKKPAPP-UHFFFAOYSA-L potassium carbonate Chemical compound [K+].[K+].[O-]C([O-])=O BWHMMNNQKKPAPP-UHFFFAOYSA-L 0.000 claims abstract description 8
- -1 lead and the like Chemical class 0.000 claims abstract description 5
- 229910000027 potassium carbonate Inorganic materials 0.000 claims abstract description 4
- 238000005096 rolling process Methods 0.000 claims abstract description 4
- 239000011787 zinc oxide Substances 0.000 claims abstract description 4
- ZLMJMSJWJFRBEC-UHFFFAOYSA-N Potassium Chemical compound [K] ZLMJMSJWJFRBEC-UHFFFAOYSA-N 0.000 claims description 12
- 229910052700 potassium Inorganic materials 0.000 claims description 12
- 239000011591 potassium Substances 0.000 claims description 12
- 238000001914 filtration Methods 0.000 claims description 10
- 239000002994 raw material Substances 0.000 claims description 7
- 239000004743 Polypropylene Substances 0.000 claims description 6
- 238000003756 stirring Methods 0.000 claims description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229910052799 carbon Inorganic materials 0.000 claims description 4
- 229910045601 alloy Inorganic materials 0.000 claims description 3
- 239000000956 alloy Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 238000010907 mechanical stirring Methods 0.000 claims description 3
- 229920001155 polypropylene Polymers 0.000 claims description 3
- GTLDTDOJJJZVBW-UHFFFAOYSA-N zinc cyanide Chemical compound [Zn+2].N#[C-].N#[C-] GTLDTDOJJJZVBW-UHFFFAOYSA-N 0.000 claims description 3
- 238000007747 plating Methods 0.000 abstract description 13
- JMANVNJQNLATNU-UHFFFAOYSA-N oxalonitrile Chemical compound N#CC#N JMANVNJQNLATNU-UHFFFAOYSA-N 0.000 abstract description 8
- 150000002739 metals Chemical class 0.000 abstract description 6
- 239000000654 additive Substances 0.000 abstract description 5
- 230000000996 additive effect Effects 0.000 abstract description 5
- 230000007797 corrosion Effects 0.000 abstract description 5
- 238000005260 corrosion Methods 0.000 abstract description 5
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 4
- 231100000331 toxic Toxicity 0.000 abstract description 4
- 230000002588 toxic effect Effects 0.000 abstract description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 abstract description 2
- 238000006073 displacement reaction Methods 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052763 palladium Inorganic materials 0.000 abstract description 2
- 229910052709 silver Inorganic materials 0.000 abstract description 2
- 239000004332 silver Substances 0.000 abstract description 2
- 239000002351 wastewater Substances 0.000 abstract description 2
- 230000005611 electricity Effects 0.000 abstract 2
- 239000003795 chemical substances by application Substances 0.000 description 5
- 239000013589 supplement Substances 0.000 description 4
- 238000004065 wastewater treatment Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 3
- 230000001502 supplementing effect Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 231100000419 toxicity Toxicity 0.000 description 2
- 230000001988 toxicity Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- DOBRDRYODQBAMW-UHFFFAOYSA-N copper(i) cyanide Chemical compound [Cu+].N#[C-] DOBRDRYODQBAMW-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052703 rhodium Inorganic materials 0.000 description 1
- 239000010948 rhodium Substances 0.000 description 1
- MHOVAHRLVXNVSD-UHFFFAOYSA-N rhodium atom Chemical compound [Rh] MHOVAHRLVXNVSD-UHFFFAOYSA-N 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/30—Electroplating: Baths therefor from solutions of tin
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/06—Filtering particles other than ions
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
- C25D21/10—Agitating of electrolytes; Moving of racks
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electroplating And Plating Baths Therefor (AREA)
Abstract
The invention discloses a cyanide-free and lead-free cupronickel-tin electroplating process, which specifically comprises the following steps: the method comprises the steps of carrying out hanging electricity cylinder opening or rolling electricity cylinder opening according to the requirements of workpieces, putting cylinder opening salt FH-780D, potassium hydroxide, copper salt FH-780cu, tin salt, zinc oxide, potassium carbonate, lead-free white copper tin brightener 780A, lead-free white copper tin complexing agent 780B and lead-free white copper tin wetting agent 780C into a cylinder, and detecting the metal copper content, the metal tin content, the metal zinc content, the potassium hydroxide, the operation temperature and the PH value of the electroplating solution by using an external instrument, a tool and test paper. The cyanide-free and lead-free cupronickel-tin electroplating process has the advantages that the coating is silvery white and bright, the electroplating solution does not contain cyanogen, the content of components is low, the waste water is environment-friendly and easy to treat, the wear resistance and the corrosion resistance are good, the hardness is high, the brittleness is low, the displacement is good, the deposition speed is high, the operation range is wide, in addition, the additive and the coating do not contain toxic metals such as lead and the like, the environment is more environment-friendly and healthy, and the electroplating process can be used as bottom layer electroplating before surface color, gold plating, silver plating, palladium plating.
Description
Technical Field
The invention relates to the field of electroplating, in particular to a cyanide-free and lead-free cupronickel-tin electroplating process.
Background
The electroplating is a process of plating a thin layer of other metals on the surface of some metals by utilizing the electrolysis principle, is used for improving the wear resistance, the electrical conductivity, the light reflection and the corrosion resistance of the surface of the metal, and is mainly prepared by proportioning electroplating solution, wherein a workpiece is used as a cathode, an additional carbon plate is used as an anode, and after electrification, the metal in the electroplating solution can be deposited on the surface of the workpiece;
however, in the existing electroplating process, the electroplating solution has the defects of low plating layer, excessive cyanogen content of the electroplating solution, difficulty in wastewater treatment, serious environmental pollution, high wastewater treatment cost and increased enterprise expenditure; secondly, the electroplating solution has the phenomena of poor wear resistance and corrosion resistance, low hardness, high brittleness, poor walking position, slow deposition speed and small operation range, and in addition, the additive and the plating layer contain a large amount of toxic metals such as lead elements and the like, so that the workpiece has the phenomena of toxicity and harm to health.
Disclosure of Invention
The invention mainly aims to provide a cyanide-free and lead-free white copper-tin electroplating process, which can effectively solve the problems in the background technology that: in the existing electroplating process, the electroplating solution has the defects of low plating layer, excessive cyanogen content of the electroplating solution, difficult wastewater treatment, serious environmental pollution phenomenon, high wastewater treatment cost and increased enterprise expenditure; secondly, the electroplating solution has the phenomena of poor wear resistance and corrosion resistance, low hardness, high brittleness, poor walking position, slow deposition speed and small operation range, and in addition, the additive and the plating layer contain a large amount of toxic metals such as lead element and the like, so that the workpiece has the technical problems of toxicity and harm to health.
In order to achieve the purpose, the invention adopts the technical scheme that:
a cyanide-free and lead-free cupronickel-tin electroplating process specifically comprises the following steps:
the method comprises the following steps: opening a cylinder, namely hanging or rolling the electric cylinder to open the cylinder according to the requirements of a workpiece, and putting cylinder opening salt FH-780D, potassium hydroxide, copper salt FH-780cu, tin salt, zinc oxide, potassium carbonate, a lead-free white copper tin brightener 780A, a lead-free white copper tin complexing agent 780B and a lead-free white copper tin wetting agent 780C into the cylinder;
step two: detecting, namely detecting the content of metal copper, the content of metal tin, the content of metal zinc, potassium hydroxide, the operating temperature and the pH value of the electroplating solution by using an external instrument, a tool and test paper;
step three: electroplating, the work piece that will electroplate is placed to the jar in, and the positive pole carbon plate circular telegram is electroplated, lasts the rotation through outside rotating machinery to the work piece, continues to filter and stir electroplating solution simultaneously.
As a further scheme of the invention, in the first step, the weight groups of the raw materials for hanging the electric cylinder are that the cylinder opening salt FH-780D-90 g/L, the potassium hydroxide-15 g/L, the copper salt FH-780cu-20 g/L, the tin salt-30 g/L, the zinc oxide-2 g/L, the potassium carbonate-10 g/L, the lead-free white copper tin brightener 780A-0.5 ml/L, the lead-free white copper tin complexing agent 780B-20 ml/L and the lead-free white copper tin wetting agent 780C-1 ml/L.
As a further scheme of the invention, in the first step, the weight groups of the raw materials for cylinder opening by the roll electrification are cylinder opening salt FH-780D-90 g/L, potassium hydroxide-15 g/L, copper salt FH-780cu-20 g/L, tin salt-25 g/L, zinc oxide-2 g/L, potassium carbonate-10 g/L, lead-free cupronickel tin brightener 780A-0.3-1 ml/L, lead-free cupronickel tin complexing agent 780B-10-30 ml/L and lead-free cupronickel tin wetting agent 780C-1-2 ml/L.
As a further scheme of the invention, in the second step, the metal copper content, the metal tin content, the metal zinc content and the potassium hydroxide of the electroplating solution are sequentially 6-15 g/L, 8-15 g/L, 0.5-1.5 g/L, 10-20 g/L, 40-45 ℃ and 12.
As a further scheme of the invention, in the second step, the metal copper content, the metal tin content, the metal zinc content and the potassium hydroxide of the roll electroplating solution are sequentially 5-12 g/L, 8-12 g/L, 0.5-2 g/L, 10-20 g/L, 40-45 ℃ and 12.
In the third step, the cylinder material is one of a PP cylinder, a PVC cylinder or a polypropylene cylinder, the stirring mode of the electroplating solution is mechanical stirring, the filtering mode is continuous filtering, the filter element is less than or equal to 10 micrometers, and the filtering is carried out for at least 2 to 3 times per hour.
In a further aspect of the invention, in the third step, the anode current density of the electroplating is 2.0 ampere/square decimeter, the electroplating deposition rate is 0.5 micrometer/minute at 2.0 ampere/square meter, the deposition amount is 1.5 micrometer/minute at 2.0 ampere/square meter, the coating density is 8.5 g/cubic centimeter, and the current load per liter is maximum under the continuous load.
As a further scheme of the invention, in the first step, every 6000 ampere minutes (the weight of the alloy is 128 mg), the cylinder opening salt FH-780D, the potassium hydroxide, the copper salt FH-780cu, the tin salt, the zinc cyanide, the lead-free white copper tin brightener 780A, the lead-free white copper tin complexing agent 780B and the lead-free white copper tin wetting agent 780C are required to be supplemented, and the parts are respectively 150 g, 20 g, 60 g, 100 g, 3 g, 100-300 ml, 200-400 ml and 100-300 ml.
Compared with the prior art, the invention has the following beneficial effects:
firstly, the coating is silvery white and snow bright, the plating solution does not contain cyanogen, the content of components is low, the waste water is environment-friendly and easy to treat, the cost is saved, and the wear resistance and the corrosion resistance are good;
secondly, the hardness is high (600HV0.05), the brittleness is low, the displacement is good, the deposition speed is high, and the operation range is wide;
in addition, the additive and the plating layer do not contain toxic metals such as lead and the like, are more environment-friendly and healthy, and can be used for bottom layer electroplating before being used for surface color, gold plating, silver, palladium and rhodium.
Drawings
FIG. 1 is a flow chart of a cyanide-free and lead-free cupronickel-tin electroplating process according to the present invention;
FIG. 2 is a structural diagram of various raw materials of an open cylinder of a cyanide-free and lead-free white copper-tin electroplating process of the invention;
FIG. 3 is an index diagram of various contents detected by the cyanide-free and lead-free white copper-tin electroplating process of the present invention;
FIG. 4 is an indication diagram of the fault phenomenon, the cause and the solution of the cyanide-free and lead-free white copper-tin electroplating process according to the present invention.
Detailed Description
In order to make the technical means, the creation characteristics, the achievement purposes and the effects of the invention easy to understand, the invention is further described with the specific embodiments.
Implementation scheme one
As shown in fig. 1-3, a cyanide-free and lead-free cupronickel-tin electroplating process specifically comprises the following steps:
the method comprises the following steps: opening a cylinder, namely hanging or rolling the electric cylinder to open the cylinder according to the requirements of a workpiece, and putting cylinder opening salt FH-780D, potassium hydroxide, copper salt FH-780cu, tin salt, zinc oxide, potassium carbonate, a lead-free white copper tin brightener 780A, a lead-free white copper tin complexing agent 780B and a lead-free white copper tin wetting agent 780C into the cylinder;
step two: detecting, namely detecting the content of metal copper, the content of metal tin, the content of metal zinc, potassium hydroxide, the operating temperature and the pH value of the electroplating solution by using an external instrument, a tool and test paper;
step three: electroplating, namely placing a workpiece to be electroplated into a cylinder, electrifying an anode carbon plate for electroplating, continuously rotating the workpiece through an external rotating machine, and continuously filtering and stirring electroplating solution;
in the first step, the weight groups of all raw materials for hanging the electric cylinder are that the cylinder opening salt FH-780D-90 g/L, potassium hydroxide-15 g/L, copper salt FH-780cu-20 g/L, tin salt-30 g/L, zinc oxide-2 g/L, potassium carbonate-10 g/L, lead-free white copper tin brightener 780A-0.5 ml/L, lead-free white copper tin complexing agent 780B-20 ml/L and lead-free white copper tin wetting agent 780C-1 ml/L.
In the first step, the weight groups of all raw materials for opening the cylinder by the roll-on method comprise cylinder opening salt FH-780D-90 g/L, potassium hydroxide-15 g/L, copper salt FH-780cu-20 g/L, tin salt-25 g/L, zinc oxide-2 g/L, potassium carbonate-10 g/L, lead-free white copper tin brightener 780A-0.3-1 ml/L, lead-free white copper tin complexing agent 780B-10-30 ml/L and lead-free white copper tin wetting agent 780C-1-2 ml/L.
In the second step, the metal copper content, the metal tin content, the metal zinc content, the potassium hydroxide, the operation temperature and the pH value of the electroplating solution are 8 g/L, 12 g/L, 1 g/L, 15 g/L, 40 ℃ and 12 in sequence.
In the second step, the metal copper content, the metal tin content, the metal zinc content, the potassium hydroxide, the operation temperature and the pH value of the roll electroplating solution are 5 g/L, 14 g/L, 1 g/L, 16 g/L, 40 ℃ and 12 in sequence.
In the third step, the cylinder material is one of a PP cylinder, a PVC cylinder or a polypropylene cylinder, the stirring mode of the electroplating solution is mechanical stirring, the filtering mode is continuous filtering, the filter element is less than or equal to 10 microns, and the filtering is carried out for at least 2 to 3 times per hour.
In the third step, the current density of the anode for electroplating is 2.0 ampere/square decimeter, the electroplating deposition rate is 0.5 micron/minute at 2.0 ampere/square meter, the deposition amount is 1.5 micron/minute at 2.0 ampere/square meter, the density of the coating is 8.5 g/cubic centimeter, and the current load per liter is maximum under the continuous load.
In the first step, the amounts of the cylinder opening salt FH-780D, the potassium hydroxide, the copper salt FH-780cu, the tin salt, the zinc cyanide, the lead-free white copper tin brightener 780A, the lead-free white copper tin complexing agent 780B and the lead-free white copper tin wetting agent 780C are 150 g, 20 g, 60 g, 100 g, 3 g, 100-300 ml, 200-400 ml and 100-300 ml respectively every 6000 ampere minutes (the weight of the alloy is 128 mg).
Example II
As shown in fig. 4, a cyanide-free and lead-free white copper tin electroplating process has the following failures in operation:
1. the coating is not bright or even grey and hazy, the failure is caused by insufficient main salt, insufficient additive and low potassium hydroxide, and the method for solving the failure is to analyze and add 1 ml/L of light-supplementing agent, 10 ml/L of complexing agent and 1-4 g/L of potassium hydroxide;
2. the fault is caused by potential difference of plating layer, the reason of the fault is that the salt is lower when the cylinder is opened, the content of copper and tin in the plating solution is lower, and the complexing agent is lower, and the method for solving the fault is supplement (1-10 g/L), analytical supplement and supplement with 5-10 ml/L of complexing agent;
3. the faults are caused by low tin salt, low cylinder salt and low temperature, and the method for solving the faults is to supplement 2-8 g/L of tin salt, 1-10 g/L of cylinder salt and raise the temperature to 30-40 ℃;
4. the faults are caused by low copper content, low potassium hydroxide and insufficient light-emitting agent, and the faults are solved by supplementing 1-4 g/L of cuprous cyanide, 1-4 g/L of potassium hydroxide and 0.5-1.5 ml/L of light-emitting agent;
5. the light is bright but turns black spots immediately after leaving water, the fault is caused by insufficient light-emitting agent, low potassium hydroxide and insufficient complexing agent, and the fault is solved by supplementing 0.5-1.5 ml/L of light-emitting agent, 1-4 g/L of potassium hydroxide and 5-10 ml/L of complexing agent;
6. the coating becomes turbid, the fault is caused by serious low potassium hydroxide and serious low complexing agent, and the fault is solved by supplementing 5-10 g/L potassium hydroxide and 2-5 ml/L complexing agent.
The foregoing shows and describes the general principles and broad features of the present invention and advantages thereof. It will be understood by those skilled in the art that the present invention is not limited to the embodiments described above, which are described in the specification and illustrated only to illustrate the principle of the present invention, but that various changes and modifications may be made therein without departing from the spirit and scope of the present invention, which fall within the scope of the invention as claimed. The scope of the invention is defined by the appended claims and equivalents thereof.
Claims (8)
1. A cyanide-free and lead-free cupronickel-tin electroplating process is characterized in that: the process specifically comprises the following steps:
the method comprises the following steps: opening a cylinder, namely hanging or rolling the electric cylinder to open the cylinder according to the requirements of a workpiece, and putting cylinder opening salt FH-780D, potassium hydroxide, copper salt FH-780cu, tin salt, zinc oxide, potassium carbonate, a lead-free white copper tin brightener 780A, a lead-free white copper tin complexing agent 780B and a lead-free white copper tin wetting agent 780C into the cylinder;
step two: detecting, namely detecting the content of metal copper, the content of metal tin, the content of metal zinc, potassium hydroxide, the operating temperature and the pH value of the electroplating solution by using an external instrument, a tool and test paper;
step three: electroplating, the work piece that will electroplate is placed to the jar in, and the positive pole carbon plate circular telegram is electroplated, lasts the rotation through outside rotating machinery to the work piece, continues to filter and stir electroplating solution simultaneously.
2. The cyanide-free and lead-free cupronickel-tin electroplating process according to claim 1, characterized in that: in the first step, the weight groups of all raw materials for hanging the electric cylinder are that the cylinder opening salt FH-780D-90 g/L, potassium hydroxide-15 g/L, copper salt FH-780cu-20 g/L, tin salt-30 g/L, zinc oxide-2 g/L, potassium carbonate-10 g/L, lead-free white copper tin brightener 780A-0.5 ml/L, lead-free white copper tin complexing agent 780B-20 ml/L and lead-free white copper tin wetting agent 780C-1 ml/L.
3. The cyanide-free and lead-free cupronickel-tin electroplating process according to claim 1, characterized in that: in the first step, the weight groups of all raw materials for opening the cylinder by the roll-on machine are cylinder opening salt FH-780D-90 g/L, potassium hydroxide-15 g/L, copper salt FH-780cu-20 g/L, tin salt-25 g/L, zinc oxide-2 g/L, potassium carbonate-10 g/L, lead-free white copper tin brightener 780A-0.3-1 ml/L, lead-free white copper tin complexing agent 780B-10-30 ml/L and lead-free white copper tin wetting agent 780C-1-2 ml/L.
4. The cyanide-free and lead-free cupronickel-tin electroplating process according to claim 1, characterized in that: in the second step, the content of metal copper, the content of metal tin, the content of metal zinc, potassium hydroxide, the operation temperature and the pH value of the electroplating solution are 6-15 g/L, 8-15 g/L, 0.5-1.5 g/L, 10-20 g/L, 40-45 ℃ and 12 in sequence.
5. The cyanide-free and lead-free cupronickel-tin electroplating process according to claim 1, characterized in that: in the second step, the metal copper content, the metal tin content, the metal zinc content, the potassium hydroxide, the operation temperature and the pH value of the roll electroplating solution are 5-12 g/L, 8-12 g/L, 0.5-2 g/L, 10-20 g/L, 40-45 ℃ and 12 in sequence.
6. The cyanide-free and lead-free cupronickel-tin electroplating process according to claim 1, characterized in that: in the third step, the cylinder material is one of a PP cylinder, a PVC cylinder or a polypropylene cylinder, the stirring mode of the electroplating solution is mechanical stirring, the filtering mode is continuous filtering, the filter element is less than or equal to 10 microns, and the filtering is carried out for at least 2 to 3 times per hour.
7. The cyanide-free and lead-free cupronickel-tin electroplating process according to claim 1, characterized in that: in the third step, the current density of the anode for electroplating is 2.0 ampere/square decimeter, the electroplating deposition rate is 0.5 micrometer/minute at 2.0 ampere/square meter, the deposition amount is 1.5 micrometer/minute at 2.0 ampere/square meter, the density of the coating is 8.5 g/cubic centimeter, and the current load per liter is the maximum under the continuous load.
8. The cyanide-free and lead-free cupronickel-tin electroplating process according to claim 1, characterized in that: in the first step, the amounts of the cylinder opening salt FH-780D, the potassium hydroxide, the copper salt FH-780cu, the tin salt, the zinc cyanide, the lead-free white copper tin brightener 780A, the lead-free white copper tin complexing agent 780B and the lead-free white copper tin wetting agent 780C which are required to be supplemented every 6000 ampere minutes (the weight of the alloy is 128 mg) are respectively 150 g, 20 g, 60 g, 100 g, 3 g, 100-300 ml, 200-400 ml and 100-300 ml.
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| CN (1) | CN113026064A (en) |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1302921A (en) * | 1999-12-22 | 2001-07-11 | 日本麦克德米德株式会社 | Bright tin-copper alloy electroplating liquid and its preparation method |
| CN101618616A (en) * | 2008-06-30 | 2010-01-06 | 比亚迪股份有限公司 | Zinc alloy product and preparation method thereof |
| CN103668359A (en) * | 2012-09-06 | 2014-03-26 | 上海造币有限公司 | Electroplating liquid of multi-layer cyanide-free electroplated copper-tin alloy coating, electroplating technology and coin thereof |
| CN104152955A (en) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution |
| CN108166029A (en) * | 2017-12-28 | 2018-06-15 | 广东达志环保科技股份有限公司 | Without cyamelide copper and tin electroplate liquid and electro-plating method |
-
2021
- 2021-02-26 CN CN202110216626.6A patent/CN113026064A/en active Pending
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1302921A (en) * | 1999-12-22 | 2001-07-11 | 日本麦克德米德株式会社 | Bright tin-copper alloy electroplating liquid and its preparation method |
| CN101618616A (en) * | 2008-06-30 | 2010-01-06 | 比亚迪股份有限公司 | Zinc alloy product and preparation method thereof |
| CN103668359A (en) * | 2012-09-06 | 2014-03-26 | 上海造币有限公司 | Electroplating liquid of multi-layer cyanide-free electroplated copper-tin alloy coating, electroplating technology and coin thereof |
| CN104152955A (en) * | 2014-07-17 | 2014-11-19 | 广东致卓精密金属科技有限公司 | Plating solution and process for electroplating and brightening white copper-tin by using alkaline solution |
| CN108166029A (en) * | 2017-12-28 | 2018-06-15 | 广东达志环保科技股份有限公司 | Without cyamelide copper and tin electroplate liquid and electro-plating method |
Non-Patent Citations (1)
| Title |
|---|
| 曾振欧等: "无氰电镀白铜锡工艺与镀层性能", 《电镀与涂布》 * |
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