CN113026059A - Electroforming process of 22K hard gold jewelry - Google Patents
Electroforming process of 22K hard gold jewelry Download PDFInfo
- Publication number
- CN113026059A CN113026059A CN202110228508.7A CN202110228508A CN113026059A CN 113026059 A CN113026059 A CN 113026059A CN 202110228508 A CN202110228508 A CN 202110228508A CN 113026059 A CN113026059 A CN 113026059A
- Authority
- CN
- China
- Prior art keywords
- gold
- electroforming
- metal blank
- jewelry
- hard gold
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910052737 gold Inorganic materials 0.000 title claims abstract description 34
- 239000010931 gold Substances 0.000 title claims abstract description 34
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 title claims abstract description 27
- 238000000034 method Methods 0.000 title claims abstract description 25
- 238000005323 electroforming Methods 0.000 title claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 15
- 239000002184 metal Substances 0.000 claims abstract description 15
- 238000004070 electrodeposition Methods 0.000 claims abstract description 8
- JPVYNHNXODAKFH-UHFFFAOYSA-N Cu2+ Chemical compound [Cu+2] JPVYNHNXODAKFH-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910001431 copper ion Inorganic materials 0.000 claims abstract description 7
- -1 gold ion Chemical class 0.000 claims abstract description 7
- 239000008139 complexing agent Substances 0.000 claims abstract description 5
- 229920000388 Polyphosphate Polymers 0.000 claims abstract description 4
- 230000000536 complexating effect Effects 0.000 claims abstract description 4
- UUWCBFKLGFQDME-UHFFFAOYSA-N platinum titanium Chemical compound [Ti].[Pt] UUWCBFKLGFQDME-UHFFFAOYSA-N 0.000 claims abstract description 4
- 239000001205 polyphosphate Substances 0.000 claims abstract description 4
- 235000011176 polyphosphates Nutrition 0.000 claims abstract description 4
- BDHFUVZGWQCTTF-UHFFFAOYSA-M sulfonate Chemical compound [O-]S(=O)=O BDHFUVZGWQCTTF-UHFFFAOYSA-M 0.000 claims abstract description 4
- JWVAUCBYEDDGAD-UHFFFAOYSA-N bismuth tin Chemical compound [Sn].[Bi] JWVAUCBYEDDGAD-UHFFFAOYSA-N 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 229910052802 copper Inorganic materials 0.000 description 2
- 239000010949 copper Substances 0.000 description 2
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000010947 jewellery metal Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D1/00—Electroforming
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Electrochemistry (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Adornments (AREA)
Abstract
The invention discloses an electroforming process of 22K hard gold jewelry, and relates to the technical field of jewelry manufacturing. The process comprises the following steps: a low temperature metal green body; preparing complexing agent sulfonate and polyphosphate, and complexing gold ion solution and copper ion solution; adjusting the output on-off ratio of the pulse rectifier; and (3) using a platinum titanium mesh as an anode and a metal blank as a cathode, and electroforming an electro-deposition layer on the metal blank by using a current density of 0.2-0.3 ampere/square decimeter. The invention produces 22K gold by an electroforming production method of electrodeposition, further saves the process, reduces the production cost and solves the problem that the 22K gold jewelry is too heavy in weight only by a film-reversing method.
Description
Technical Field
The invention belongs to the technical field of jewelry manufacturing, and particularly relates to an electroforming process for 22K hard gold jewelry.
Background
With the improvement of the life quality of people, people have more and more demands on jewelry, wherein gold jewelry is the most common jewelry type. Wherein 22k gold (22k gold) is the Chinese national standard GB 11887-2008 'Jewelry Metal purity stipulation and naming method' which is k gold with gold content more than or equal to 91.6%.
The existing 22K gold manufacturing process is to manufacture 22K jewelry by weighing and melting the ratio of gold and copper into 22K through film pouring, because the weight is multiple times of that of the electroforming method, the price of the product with the same volume is multiple times higher.
Disclosure of Invention
The invention aims to provide an electroforming process for 22K hard gold jewelry, which solves the existing problems: the weight is multiple times of that of the electroforming method, and the product price of the same volume is multiple times of that of the electroforming method.
In order to solve the technical problems, the invention is realized by the following technical scheme: a process for electroforming 22K hard gold jewelry, said process comprising the steps of:
a low temperature metal green body;
preparing complexing agent sulfonate and polyphosphate, and complexing gold ion solution and copper ion solution;
adjusting the output on-off ratio of the pulse rectifier;
and (3) using a platinum titanium mesh as an anode and a metal blank as a cathode, and electroforming an electro-deposition layer on the metal blank by using a current density of 0.2-0.3 ampere/square decimeter.
Further preferably, the low-temperature metal blank is a wax blank or a tin-bismuth low-temperature metal blank.
Further preferably, the concentration of the gold ions is 9.16 g/l; the copper ion concentration was 0.84 g/l.
Further preferably, the pulse rectifier has an output on-off ratio of 9: 1.
further preferably, the thickness of the electrodeposition layer is 100 to 200 micrometers.
The invention has the following beneficial effects:
the invention produces 22K gold by an electroforming production method of electrodeposition, further saves the process, reduces the production cost and solves the problem that the 22K gold jewelry is too heavy in weight only by a film-reversing method.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention relates to an electroforming process of 22K hard gold jewelry.
Specifically, the method comprises the following steps:
step 1, firstly, using a wax blank or a tin bismuth low-temperature metal blank.
And 2, preparing complexing agent sulfonate and polyphosphate, and complexing gold ion and copper ion solutions, wherein the concentration of gold ions is 9.16 g/L, and the concentration of copper ions is 0.84 g/L.
And 3, adjusting the output on-off ratio of the pulse rectifier to be 9: 1.
step 4, a platinum titanium mesh is used as an anode, a wax part blank or a tin-bismuth low-temperature metal blank is used as a cathode, and the current density of 0.2-0.3 ampere/square decimeter is used, so that 22K gold can be accurately electrodeposited on the wax part blank or the low-temperature alloy blank according to the proportion that the gold content is 91.6% and the copper content is 8.4%
And the thickness of the electrodeposition layer is 100-200 microns.
Therefore, the invention has the effect that 22K gold is accurately electrodeposited by using a special complexing agent, and the method for producing the 22K gold jewelry by only adopting a film-reversing method is solved.
The preferred embodiments of the invention disclosed above are intended to be illustrative only. The preferred embodiments are not intended to be exhaustive or to limit the invention to the precise embodiments disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the invention and the practical application, to thereby enable others skilled in the art to best utilize the invention. The invention is limited only by the claims and their full scope and equivalents.
Claims (5)
1. An electroforming process of 22K hard gold jewelry, which is characterized in that: the process comprises the following steps:
a low temperature metal green body;
preparing complexing agent sulfonate and polyphosphate, and complexing gold ion solution and copper ion solution;
adjusting the output on-off ratio of the pulse rectifier;
and (3) using a platinum titanium mesh as an anode and a metal blank as a cathode, and electroforming an electro-deposition layer on the metal blank by using a current density of 0.2-0.3 ampere/square decimeter.
2. The electroforming process of 22K hard gold jewelry item according to claim 1, wherein: the low-temperature metal blank is a wax blank or a tin-bismuth low-temperature metal blank.
3. The electroforming process of 22K hard gold jewelry item according to claim 1, wherein: the concentration of the gold ions is 9.16 g/L; the copper ion concentration was 0.84 g/l. .
4. The electroforming process of 22K hard gold jewelry item according to claim 1, wherein: the output on-off ratio of the pulse rectifier is 9: 1.
5. the electroforming process of 22K hard gold jewelry item according to claim 1, wherein: the thickness of the electrodeposition layer is 100 to 200 microns.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110228508.7A CN113026059A (en) | 2021-03-02 | 2021-03-02 | Electroforming process of 22K hard gold jewelry |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110228508.7A CN113026059A (en) | 2021-03-02 | 2021-03-02 | Electroforming process of 22K hard gold jewelry |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113026059A true CN113026059A (en) | 2021-06-25 |
Family
ID=76465180
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110228508.7A Pending CN113026059A (en) | 2021-03-02 | 2021-03-02 | Electroforming process of 22K hard gold jewelry |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN113026059A (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103806053A (en) * | 2012-11-12 | 2014-05-21 | 无锡三洲冷轧硅钢有限公司 | Dual-pulse gold plating process |
| CN111850619A (en) * | 2020-07-27 | 2020-10-30 | 深圳市铭轩珠宝首饰有限公司 | Preparation method and application of hollow gold product |
| CN111893520A (en) * | 2020-07-24 | 2020-11-06 | 深圳市铭轩珠宝首饰有限公司 | Preparation method and application of gold-coated product |
| CN111962104A (en) * | 2020-08-21 | 2020-11-20 | 深圳国韵黄金文化有限公司 | 22K cyanide-free electroformed gold and preparation process thereof |
-
2021
- 2021-03-02 CN CN202110228508.7A patent/CN113026059A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103806053A (en) * | 2012-11-12 | 2014-05-21 | 无锡三洲冷轧硅钢有限公司 | Dual-pulse gold plating process |
| CN111893520A (en) * | 2020-07-24 | 2020-11-06 | 深圳市铭轩珠宝首饰有限公司 | Preparation method and application of gold-coated product |
| CN111850619A (en) * | 2020-07-27 | 2020-10-30 | 深圳市铭轩珠宝首饰有限公司 | Preparation method and application of hollow gold product |
| CN111962104A (en) * | 2020-08-21 | 2020-11-20 | 深圳国韵黄金文化有限公司 | 22K cyanide-free electroformed gold and preparation process thereof |
Non-Patent Citations (1)
| Title |
|---|
| 徐家文等: "《电化学加工技术——原理•工艺及应用》", 30 June 2008, 国防工业出版社 * |
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| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WD01 | Invention patent application deemed withdrawn after publication | ||
| WD01 | Invention patent application deemed withdrawn after publication |
Application publication date: 20210625 |