CN113020821A - Device for preparing taper-controllable micropores by double-beam laser rotation and processing method - Google Patents
Device for preparing taper-controllable micropores by double-beam laser rotation and processing method Download PDFInfo
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- CN113020821A CN113020821A CN202110466702.9A CN202110466702A CN113020821A CN 113020821 A CN113020821 A CN 113020821A CN 202110466702 A CN202110466702 A CN 202110466702A CN 113020821 A CN113020821 A CN 113020821A
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
- B23K26/382—Removing material by boring or cutting by boring
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0643—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising mirrors
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/02—Positioning or observing the workpiece, e.g. with respect to the point of impact; Aligning, aiming or focusing the laser beam
- B23K26/06—Shaping the laser beam, e.g. by masks or multi-focusing
- B23K26/064—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms
- B23K26/0648—Shaping the laser beam, e.g. by masks or multi-focusing by means of optical elements, e.g. lenses, mirrors or prisms comprising lenses
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- Optics & Photonics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The embodiment of the invention discloses a device for preparing taper controllable micropores by rotating double-beam laser and a processing method. According to the embodiment of the invention, the light beam processing assembly, the beam splitting assembly and the lens are arranged, the laser light source emitted by the laser is vertically incident to the light beam processing assembly, after the light beam processing assembly processes the light beam, the beam splitting assembly performs beam splitting to form double beams, and after the double beams are focused by the lens, holes are processed on the surface of a sample.
Description
Technical Field
The invention relates to the technical field of micropore processing, in particular to a device for preparing a taper-controllable micropore by rotating double-beam laser and a processing method.
Background
Laser micropore processing has been widely applied to the preparation of high-end precision devices, in particular to the fields of high-efficiency engines, precision semiconductor etching, drug release in human body intervention devices and the like. High-end device pair requirements not only control quality, but also taper control, including positive taper, zero taper, negative taper. One of the causes of the taper is that the intensity of the laser beam is in a gaussian distribution, i.e. a distribution form with strong middle and weak edge, if the incident angle of the beam is 90 degrees, i.e. vertical incidence, the taper of the hole will present a positive taper, zero taper and negative taper are realized, the laser beam is incident to the sample in an inclined way, i.e. the incident angle of the beam is less than 90 degrees.
At present, the technology for realizing the taper controllable hole is relatively mature, the technology is converted into modules or subsystems, but the modules adopt single beam incidence when processing the taper hole, and the modules are complex in structure, high in cost, poor in universality and difficult to popularize when being obliquely arranged.
Therefore, it is necessary to design a new device for realizing the taper-controllable drilling with simple structure, low cost, strong universality and practicality and convenience.
Disclosure of Invention
The invention aims to provide a device for preparing a taper-controllable micropore by rotating double-beam laser and a processing method.
In order to solve the technical problems, the invention aims to realize the following technical scheme: the device for preparing the taper controllable micropores by rotating the double-beam laser comprises a beam processing assembly, a beam splitting assembly and a lens, wherein the beam processing assembly is connected with the beam splitting assembly, the beam splitting assembly and the beam processing assembly are respectively arranged above the lens, and the beam processing assembly is arranged above the beam splitting assembly.
The further technical scheme is as follows: the beam splitting assembly includes a beam splitter.
The further technical scheme is as follows: the beam splitting assembly further comprises a fourth reflecting mirror, the beam splitting mirror is connected with the light beam processing assembly, and the fourth reflecting mirror is connected with the beam splitting mirror.
The further technical scheme is as follows: the beam processing assembly includes a mirror assembly.
The further technical scheme is as follows: the reflecting mirror assembly comprises a first reflecting mirror, a second reflecting mirror and a third reflecting mirror which are connected in sequence, and the third reflecting mirror is connected with the beam splitter.
The further technical scheme is as follows: the light beam processing assembly comprises a first wedge-shaped mirror and a second wedge-shaped mirror which are connected in sequence, and the second wedge-shaped mirror is connected with the beam splitter.
The further technical scheme is as follows: still include the laser instrument, the laser instrument with beam processing subassembly is connected.
The further technical scheme is as follows: the infrared wavelength of a laser light source emitted by the laser is 1030nm to 1064nm.
The further technical scheme is as follows: the green light wavelength of the laser light source emitted by the laser is 515nm to 532 nm.
The further technical scheme is as follows: the ultraviolet wavelength of a laser light source emitted by the laser is 343 nm-355 nm.
In addition, the technical problem to be solved by the present invention is to provide a processing method of a device for preparing a taper controllable micropore by rotating a dual-beam laser, comprising:
after a laser light source vertically irradiates into the light beam processing assembly, light beam splitting is carried out through the light beam splitting assembly to form symmetrical double light beams, and holes are processed on a product after the symmetrical double light beams are focused through the lens.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, through arranging the light beam processing assembly, the beam splitting assembly and the lens, a laser light source emitted by a laser is vertically incident to the light beam processing assembly, after the light beam processing assembly processes the light beam, the beam splitting assembly performs beam splitting to form double beams, and after the double beams are focused by the lens, holes are processed on the surface of a sample.
The invention is further described below with reference to the accompanying drawings and specific embodiments.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
FIG. 1 is a schematic block diagram of an apparatus for preparing a taper-controllable micro via by rotating a dual-beam laser according to an embodiment of the present invention;
fig. 2 is a schematic block diagram of an apparatus for manufacturing a taper-controllable micro-hole by rotating a dual-beam laser according to a second embodiment of the present invention.
The labels in the figures illustrate:
10. a first reflector; 20. a second reflector; 30. a third reflector; 40. a beam splitter; 50. a fourth mirror; 60. a first wedge mirror; 70. a second wedge mirror; 80. a lens.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It will be understood that the terms "comprises" and/or "comprising," when used in this specification and the appended claims, specify the presence of stated features, integers, steps, operations, elements, and/or components, but do not preclude the presence or addition of one or more other features, integers, steps, operations, elements, components, and/or groups thereof.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
Referring to fig. 1, fig. 1 is a schematic block diagram of a dual-beam laser rotation apparatus for manufacturing a taper-controllable micro hole according to an embodiment of the present invention, which may be applied to drilling scenes requiring taper control, such as new energy, automobiles, printing, microelectronics, etc., where a taper-controllable drilling module in the market at present needs to precisely manipulate an angle at which a single beam of incident light enters a focusing lens 80 and rotate, and this adjustment needs to be completed by cooperation of a plurality of optical reflection or transmission devices. In the embodiment, a dual beam is symmetrically incident from both sides of the optical axis of the focusing lens 80 and intersects with the surface of the sample through the focusing lens 80, and the aperture with controllable taper is realized when the aperture rotates.
The device for preparing the taper controllable micropores by rotating the double-beam laser comprises a beam processing assembly, a beam splitting assembly and a lens 80, wherein the beam processing assembly is connected with the beam splitting assembly, the beam splitting assembly and the beam processing assembly are respectively arranged above the lens 80, and the beam processing assembly is arranged above the beam splitting assembly.
In this embodiment, the beam processing assembly is used for processing the laser light source by reflection, etc., and then the beam splitting assembly splits the beam to form two symmetrical beams, i.e. two beams, and two beams in the two beams are symmetrically incident into the lens 80, and then the lens 80 focuses the beams to process the micro-hole on the sample.
In addition, the device for preparing the taper controllable micropores through the double-beam laser rotation further comprises a rotating module, wherein a workbench is arranged on the rotating module, and the taper controllable micropores can be processed through rotation of the rotating module by placing a sample on the workbench.
The laser light source vertically enters the light beam processing assembly, the optical structure is simple, and the assembly error of devices in the device is avoided. All optical elements are relatively immobile, the structure is compact, the assembly is easy, and the energy is dispersed by adopting symmetrical double beams, so that the energy utilization efficiency and the quality are prevented from being reduced due to overhigh energy of a single beam; the change in taper of the aperture can be determined by the position of the focal spot on the sample.
In one embodiment, referring to FIG. 1, the beam splitting assembly includes a beam splitter 40. Through the two beams output by the beam splitter 40, according to the processing requirement, the pulse energy of the two beams can be the same or different, so that the effect of drilling one beam and processing the other beam can be realized.
In an embodiment, referring to fig. 1, the beam splitting assembly further includes a fourth mirror 50, the beam splitting mirror 40 is connected to the beam processing assembly, and the fourth mirror 50 is connected to the beam splitting mirror 40.
The fourth mirror 50 focuses the light beam by reflecting one of the beams from the beam splitter and then directing the reflected beam to the lens 80. The size of the machined hole is determined by the distance of the dual beams from the optical axis and the focal length of the lens 80.
In one embodiment, referring to fig. 1, the beam processing assembly includes a mirror assembly.
Specifically, the mirror assembly includes a first mirror 10, a second mirror 20, and a third mirror 30 connected in sequence, and the third mirror 30 is connected to a beam splitter 40.
The light beam processing assembly adopts a conventional general optical assembly, and has the advantages of simple structure, low cost, strong universality, practicability and convenience in drilling with controllable taper.
In an embodiment, referring to fig. 1, the apparatus for manufacturing a taper-controllable micro hole by rotating a dual-beam laser further includes a laser connected to the beam processing assembly. The position of the laser is required to satisfy the requirement of the laser source vertical incidence beam processing component emitted by the laser.
In an embodiment, the laser light source emitted by the laser device has an infrared wavelength of 1030nm to 1064nm.
In an embodiment, the wavelength of the green light of the laser light source emitted by the laser is 515nm to 532 nm.
In one embodiment, the laser source emitted by the laser has an ultraviolet wavelength of 343nm to 355 nm.
Of course, in other embodiments, the laser source emitted by the laser device may have one of an infrared wavelength of 1030nm to 1064nm, a green wavelength of 515nm to 532nm, and an ultraviolet wavelength of 343nm to 355 nm.
The laser source can be used for processing different types of holes by adopting different wavelengths and different pulse widths such as nanosecond, picosecond and femtosecond.
Referring to fig. 2, fig. 2 is a schematic block diagram of an apparatus for manufacturing a taper-controllable micro via by rotating a dual-beam laser according to a second embodiment of the present invention; the beam processing assembly described above includes a first wedge mirror 60 and a second wedge mirror 70 connected in series, the second wedge mirror 70 being connected to the beam splitter mirror 40.
The light beam processing assembly adopts conventional general optical assemblies, such as a first wedge-shaped mirror 60 and a second wedge-shaped mirror 70, and has the advantages of simple structure, low cost, strong universality, practicability and convenience in drilling with controllable taper.
Foretell rotatory preparation micropore device of controllable tapering of two beam laser, through setting up light beam processing subassembly, beam splitting subassembly and lens 80, by laser light source vertical incidence to light beam processing subassembly of laser instrument transmission, handle the back via light beam processing subassembly, after carrying out the beam splitting by beam splitting subassembly and forming two light beams, carry out the processing in hole on the surface at the sample behind lens 80 focus, adopt conventional general optical element, realize simple structure, with low costs, the commonality is strong, practical convenient drilling that the tapering is controllable.
In one embodiment, a method for processing a device for manufacturing a taper-controllable micro hole by rotating a dual-beam laser is further provided, which includes:
after the laser light source vertically irradiates into the light beam processing assembly, the light beam is split by the beam splitting assembly to form symmetrical double light beams, and the symmetrical double light beams are focused by the lens 80 to process holes on a product.
It should be noted that, as will be clearly understood by those skilled in the art, the specific implementation process of the processing method of the apparatus for manufacturing a taper-controllable micro hole by rotating a dual-beam laser may refer to the corresponding description in the embodiment of the apparatus for manufacturing a taper-controllable micro hole by rotating a dual-beam laser, and is not repeated herein for the convenience and brevity of description.
While the invention has been described with reference to specific embodiments, the invention is not limited thereto, and various equivalent modifications and substitutions can be easily made by those skilled in the art within the technical scope of the invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.
Claims (11)
1. The device for preparing the taper controllable micropores by rotating the double-beam laser is characterized by comprising a beam processing assembly, a beam splitting assembly and a lens, wherein the beam processing assembly is connected with the beam splitting assembly, the beam splitting assembly and the beam processing assembly are respectively arranged above the lens, and the beam processing assembly is arranged above the beam splitting assembly.
2. The apparatus for fabricating taper controllable micro-holes by dual-beam laser rotation according to claim 1, wherein the beam splitting assembly comprises a beam splitter.
3. The apparatus for preparing a taper-controllable micro via by rotating a dual-beam laser according to claim 2, wherein the beam splitting assembly further comprises a fourth mirror, the beam splitting mirror is connected to the beam processing assembly, and the fourth mirror is connected to the beam splitting mirror.
4. The apparatus for preparing taper controllable micro via by rotating dual-beam laser according to any one of claims 1 to 3, wherein the beam processing component comprises a mirror component.
5. The apparatus for preparing taper-controllable micro via by rotating dual-beam laser according to claim 4, wherein the mirror assembly comprises a first mirror, a second mirror and a third mirror connected in sequence, and the third mirror is connected to the beam splitter.
6. The apparatus for manufacturing a taper-controllable micro hole by rotating a dual-beam laser according to any one of claims 1 to 3, wherein the beam processing assembly comprises a first wedge-shaped mirror and a second wedge-shaped mirror which are connected in sequence, and the second wedge-shaped mirror is connected with the beam splitter.
7. The apparatus of claim 1 further comprising a laser coupled to the beam processing assembly.
8. The apparatus for preparing taper-controllable micro via by rotating dual-beam laser according to claim 7, wherein the laser emits laser light with an infrared wavelength of 1030nm to 1064nm.
9. The apparatus for preparing taper controllable micro hole by rotating double-beam laser according to claim 7, wherein the laser emits green light with wavelength of 515nm to 532 nm.
10. The apparatus for preparing taper-controllable micro via by rotating dual-beam laser according to claim 7, wherein the laser emits a laser light source with an ultraviolet wavelength of 343nm to 355 nm.
11. The processing method of the device for preparing the taper controllable micropores by rotating the double-beam laser is characterized by comprising the following steps of:
after a laser light source vertically irradiates into the light beam processing assembly, light beam splitting is carried out through the light beam splitting assembly to form symmetrical double light beams, and holes are processed on a product after the symmetrical double light beams are focused through the lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110466702.9A CN113020821A (en) | 2021-04-27 | 2021-04-27 | Device for preparing taper-controllable micropores by double-beam laser rotation and processing method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110466702.9A CN113020821A (en) | 2021-04-27 | 2021-04-27 | Device for preparing taper-controllable micropores by double-beam laser rotation and processing method |
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| CN113020821A true CN113020821A (en) | 2021-06-25 |
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| CN202110466702.9A Pending CN113020821A (en) | 2021-04-27 | 2021-04-27 | Device for preparing taper-controllable micropores by double-beam laser rotation and processing method |
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| WO2018184934A1 (en) * | 2017-04-06 | 2018-10-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Optical arrangement for laser-interference structuring of a specimen |
| CN110026694A (en) * | 2019-05-07 | 2019-07-19 | 英诺激光科技股份有限公司 | Two-beam double-sided laser system of processing and method |
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| CN215545921U (en) * | 2021-04-27 | 2022-01-18 | 英诺激光科技股份有限公司 | Device for preparing taper controllable micropores by double-beam laser rotation |
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2021
- 2021-04-27 CN CN202110466702.9A patent/CN113020821A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN1911588A (en) * | 2005-08-12 | 2007-02-14 | 北京国科世纪激光技术有限公司 | Method and device for grooving on silicon photoelectric battery surface |
| CN201516540U (en) * | 2009-09-16 | 2010-06-30 | 苏州德龙激光有限公司 | Novel LED wafer three-beam laser scribing apparatus |
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| WO2018184934A1 (en) * | 2017-04-06 | 2018-10-11 | Fraunhofer-Gesellschaft zur Förderung der angewandten Forschung e.V. | Optical arrangement for laser-interference structuring of a specimen |
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