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CN113016055A - Sheet for processing workpiece - Google Patents

Sheet for processing workpiece Download PDF

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Publication number
CN113016055A
CN113016055A CN201980074603.7A CN201980074603A CN113016055A CN 113016055 A CN113016055 A CN 113016055A CN 201980074603 A CN201980074603 A CN 201980074603A CN 113016055 A CN113016055 A CN 113016055A
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CN
China
Prior art keywords
sheet
adhesive
active energy
energy ray
adhesive layer
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201980074603.7A
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Chinese (zh)
Inventor
高丽洋佑
佐藤明德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Lintec Corp
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Lintec Corp
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Filing date
Publication date
Application filed by Lintec Corp filed Critical Lintec Corp
Publication of CN113016055A publication Critical patent/CN113016055A/en
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    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/20—Adhesives in the form of films or foils characterised by their carriers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J133/00—Adhesives based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Adhesives based on derivatives of such polymers
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J7/00—Adhesives in the form of films or foils
    • C09J7/30—Adhesives in the form of films or foils characterised by the adhesive composition
    • C09J7/38—Pressure-sensitive adhesives [PSA]
    • C09J7/381—Pressure-sensitive adhesives [PSA] based on macromolecular compounds obtained by reactions involving only carbon-to-carbon unsaturated bonds
    • C09J7/385—Acrylic polymers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L21/6836—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2203/00—Applications of adhesives in processes or use of adhesives in the form of films or foils
    • C09J2203/326—Applications of adhesives in processes or use of adhesives in the form of films or foils for bonding electronic components such as wafers, chips or semiconductors
    • C—CHEMISTRY; METALLURGY
    • C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
    • C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
    • C09J2301/00—Additional features of adhesives in the form of films or foils
    • C09J2301/40—Additional features of adhesives in the form of films or foils characterized by the presence of essential components
    • C09J2301/416—Additional features of adhesives in the form of films or foils characterized by the presence of essential components use of irradiation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
    • H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
    • H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
    • H01L2221/68327—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

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  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Engineering & Computer Science (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Adhesives Or Adhesive Processes (AREA)
  • Adhesive Tapes (AREA)
  • Dicing (AREA)

Abstract

The present invention relates to a work processing sheet comprising a base material and an adhesive agent layer, wherein the adhesive agent layer is composed of an active energy ray-curable adhesive, and the adhesive force of the work processing sheet to a silicon wafer is F0, and when a laminate obtained by bonding the work processing sheet to a silicon wafer is heated at 150 ℃ for 1 hour, and the adhesive force of the work processing sheet to a silicon wafer after the active energy ray irradiation to the adhesive agent layer constituting the laminate is F2, the adhesive force F0 is 600mN/25mm or more and 20000mN/25mm or less, and the ratio of the adhesive force F2 to the adhesive force F0 (F2/F0) is 0.66 or less. According to the work processing sheet, it is possible to exhibit sufficient adhesion to a work during processing of the work and to separate the work from the processed work well after heat treatment.

Description

Sheet for processing workpiece
Technical Field
The present invention relates to a workpiece processing sheet that can be suitably used for dicing.
Background
Semiconductor wafers such as silicon and gallium arsenide and various packages (hereinafter, these may be collectively referred to as "workpieces") are manufactured in a large-diameter state, then cut and separated (diced) into small device pieces (hereinafter, may be referred to as "chips") and separated (picked up) at the same time, and then transferred to a mounting process which is a subsequent process. In this case, the work such as a semiconductor wafer is cut, cleaned, dried, spread, picked up, and attached to a work processing sheet having a base material and an adhesive layer. Such a workpiece-processing sheet is required to have a property of holding a workpiece on the sheet well during processing and allowing the workpiece to be easily separated when the processed workpiece is separated from the sheet.
The chip obtained in the above manner may be subjected to a heat treatment thereafter. For example, the chip may be subjected to a process such as vapor deposition, thermal spraying, or baking for dehumidification. In addition, in the case where the chip is used under a high-temperature environment, a heating test is sometimes performed to confirm the reliability under such an environment. These heat treatments are generally performed on the obtained chip in a state of being mounted on a heating tray.
In recent years, it has been studied to perform the above-described heat treatment of the chips on the workpiece processing sheet. That is, it has been studied to cut a workpiece on a workpiece processing sheet and then heat-treat the chips mounted on the workpiece processing sheet without transferring the obtained chips to a heating tray. In this case, the process can be simplified.
Patent documents 1 to 3 disclose an adhesive sheet which is preliminarily subjected to the above-described heat treatment. In particular, the adhesive sheet disclosed in patent document 1 has a base layer and an adhesive layer made of a radiation-curable adhesive, and the adhesive layer has an adhesive force to SUS304 of 0.5N/20mm or more after bonding, and is cured by stimulus until the resin sealing step is completed, thereby forming a layer having a peel force to the package of 2.0N/20mm or less. In the adhesive sheet disclosed in patent document 2, the adhesive layer is formed from an adhesive composition containing a predetermined adhesive component and a predetermined tetrazole compound. Further, the adhesive sheet disclosed in patent document 3 has an adhesive layer formed on a heat-resistant substrate, the adhesive layer being composed of an adhesive layer-forming material containing a predetermined acrylic polymer, an energy ray-polymerizable oligomer, a predetermined polymerization initiator, and a crosslinking agent.
Documents of the prior art
Patent document
Patent document 1: japanese patent No. 5144634
Patent document 2: japanese patent No. 5555578
Patent document 3: japanese patent No. 5565173
Disclosure of Invention
Technical problem to be solved by the invention
However, when the conventional work processing sheet is subjected to the heat treatment of the chips as described above, the adhesion of the work processing sheet to the chips is increased by the heating, and as a result, there is a problem that the chips cannot be picked up from the sheet satisfactorily after the heat treatment. Such a problem cannot be sufficiently solved even by using the adhesive sheet having a predetermined heat resistance disclosed in patent documents 1 to 3.
The present invention has been made in view of the above circumstances, and an object thereof is to provide a sheet for processing a workpiece, which can exhibit sufficient adhesion to the workpiece when processing the workpiece, and which can be separated from the processed workpiece well after heat treatment.
Means for solving the problems
In order to achieve the above object, the present invention provides a work processing sheet comprising a base material and an adhesive agent layer laminated on one surface side of the base material, wherein the adhesive agent layer is made of an active energy ray-curable adhesive, the adhesive force of the work processing sheet to a silicon wafer is F0, and when a laminate obtained by bonding the work processing sheet to a silicon wafer is heated at 150 ℃ for 1 hour, and then the adhesive force of the work processing sheet to a silicon wafer after the adhesive agent layer constituting the laminate is further irradiated with an active energy ray is F2, the adhesive force F0 is 600mN/25mm or more and 20000mN/25mm or less, and the ratio of the adhesive force F2 to the adhesive force F0 (F2/F0) is 0.66 or less (invention 1).
The work processing sheet of the invention (invention 1) described above can exhibit a sufficient adhesive force to a work when the work is processed by setting the adhesive force F0 to the above range. On the other hand, since the adhesive layer is made of an active energy ray-curable adhesive and the ratio of the adhesive force (F2/F0) is in the above range, even when the workpiece-processing sheet is heated in a state in which the processed workpiece is attached, the adhesive force to the processed workpiece can be sufficiently reduced by the subsequent irradiation with the active energy ray, and the workpiece can be favorably separated from the processed workpiece.
In the above invention (invention 1), when the young's modulus at 23 ℃ of the adhesive layer after heating the sheet for workpiece processing at 150 ℃ for 1 hour is set as E1, and the young's modulus at 23 ℃ of the adhesive layer after heating the sheet for workpiece processing at 150 ℃ for 1 hour is set as E2, the ratio (E2/E1) of the young's modulus E2 to the young's modulus E1 is preferably 13 or more (invention 2).
In the above inventions (inventions 1 and 2), when the young's modulus at 23 ℃ of the adhesive layer in the work processing sheet is E0, and the young's modulus at 23 ℃ of the adhesive layer after heating the work processing sheet at 150 ℃ for 1 hour is E1, the ratio of the young's modulus E1 to the young's modulus E0 (E1/E0) is preferably 2.0 or more (invention 3).
In a second aspect, the present invention provides a work processing sheet comprising a substrate and an adhesive layer laminated on one surface side of the substrate, wherein the adhesive layer is composed of an active energy ray-curable adhesive having a glass transition temperature of-50 ℃ to 10 ℃ inclusive, the active energy ray-curable adhesive containing an acrylic copolymer containing a monomer having a polar group as a constituent monomer (invention 4).
In the above invention (invention 4), it is preferable that the acrylic copolymer has a functional group curable with active energy rays introduced into a side chain thereof (invention 5).
In the above inventions (inventions 1 to 5), the work processing sheet is preferably a dicing sheet (invention 6).
Effects of the invention
The sheet for processing a workpiece of the present invention can exhibit sufficient adhesion to a workpiece when the workpiece is processed, and can be separated from the processed workpiece well after heat treatment.
Detailed Description
Hereinafter, embodiments of the present invention will be described.
The work processing sheet of the present embodiment includes a base material and an adhesive layer laminated on one surface side of the base material. The adhesive layer is composed of an active energy ray-curable adhesive.
1. Physical Properties of sheet for processing workpiece
(1) Adhesive force
When the adhesion of the work piece processing sheet to a silicon wafer is F0, the adhesion F0 is preferably 600mN/25mm or more, particularly preferably 900mN/25mm or more, and more preferably 1200mN/25mm or more. The adhesive force F0 is preferably 20000mN/25mm or less, particularly preferably 5000mN/25mm or less, and further preferably 3000mN/25mm or less. The adhesion force F0 is an initial adhesion force obtained by measuring a work piece without being subjected to heating, irradiation with active energy rays, or the like, which will be described later.
In the work processing sheet of the present embodiment, the work can be favorably held on the work processing sheet by setting the adhesion force F0 in the above range. Therefore, even if an impact due to machining occurs during machining of the workpiece, for example, movement or falling-off of the machined workpiece can be suppressed satisfactorily. In particular, by setting the adhesive force F0 to 600mN/25mm or more, the work can be easily and satisfactorily held at the time of working. On the other hand, when the adhesion force F0 is 20000mN/25mm or less, the adhesion force to the processed workpiece is easily sufficiently reduced when the workpiece-processing sheet is irradiated with an active energy ray as described later, and thus the processed workpiece is easily separated from the workpiece-processing sheet.
In the work piece of the present embodiment, when the adhesion force of the work piece to a silicon wafer after the laminate obtained by bonding the work piece to a silicon wafer is heated at 150 ℃ for 1 hour and then the adhesive layer constituting the laminate is irradiated with an active energy ray is F2, the ratio of the adhesion force F2 to the adhesion force F0 (F2/F0) is preferably 0.66 or less, particularly preferably 0.2 or less, and further preferably 0.15 or less. By setting the ratio (F2/F0) to 0.66 or less, it becomes easy to satisfy both holding of the workpiece during machining and separation of the workpiece after irradiation with the active energy ray from the machined workpiece. In particular, even when the workpiece processing sheet is exposed to heat treatment in a state in which the processed workpiece is attached to the workpiece processing sheet, the processed workpiece can be easily separated from the workpiece processing sheet. The lower limit of the above ratio (F2/F0) is not particularly limited, but may be 0.01 or more, for example.
The above-mentioned tack force F2 of the work processing sheet of the present embodiment is preferably 1000mN/25mm or less, particularly preferably 500mN/25mm or less, and more preferably 150mN/25mm or less. Further, the adhesive force F2 is preferably 30mN/25mm or more. By setting the adhesion force F2 to the above range, it is easy to adjust the ratio (F2/F0) to the above range.
In the workpiece-processing sheet of the present embodiment, when the adhesion force of the workpiece-processing sheet to a silicon wafer after heating a laminate in which the workpiece-processing sheet is bonded to the silicon wafer at 150 ℃ for 1 hour is F1, the adhesion force F1 is preferably 1000mN/25mm or more, and particularly preferably 2300mN/25mm or more. Further, the adhesive force F1 is preferably 5000mN/25mm or less. By setting the adhesion force F1 to the above range, it is easy to adjust the ratio (F2/F0) to the above range.
The details of the methods for measuring the above-described adhesive forces F0, F1, and F2 are described in the test examples below.
(2) Young's modulus
In the sheet for workpiece processing of the present embodiment, when the young's modulus at 23 ℃ of the adhesive layer after heating the sheet for workpiece processing at 150 ℃ for 1 hour is set as E1, and the young's modulus at 23 ℃ of the adhesive layer after heating the sheet for workpiece processing at 150 ℃ for 1 hour is set as E2, the ratio of the young's modulus E2 to the young's modulus E1 (E2/E1) is preferably 13 or more, particularly preferably 15 or more, and further preferably 18 or more.
As described above, the adhesive layer in the present embodiment is composed of an active energy ray-curable adhesive. The components for achieving the active energy ray curability, which are generally present in the active energy ray-curable adhesive, are heated to cause a predetermined reaction, thereby curing the adhesive. For example, when the component is an acryloyl group, the carbon-carbon double bond in the acryloyl group may be cleaved by heating, and the polymerization reaction may proceed. In this way, when the above components are reacted by heating, even if the active energy ray is irradiated thereafter, the adhesive layer cannot be further cured satisfactorily. However, in the work processing sheet of the present embodiment, when the ratio (E2/E1) is in the above range, the adhesive force can be easily reduced by irradiation with active energy rays even after the heat treatment. This effectively suppresses occurrence of unexpected separation of the workpiece after the processing before the irradiation with the active energy ray.
The upper limit of the ratio (E2/E1) is not particularly limited, and may be, for example, 25 or less.
In the workpiece-processing sheet of the present embodiment, when the young's modulus at 23 ℃ of the adhesive layer in the workpiece-processing sheet is E0, the ratio of the young's modulus E1 to the young's modulus E0 (E1/E0) is preferably 2.0 or more, particularly preferably 2.3 or more, and further preferably 2.6 or more. The young's modulus E0 is an initial young's modulus measured on an adhesive layer which has not been subjected to a treatment such as heating or irradiation with an active energy ray.
In general, an adhesive softens when heated, and adhesion to an adherend tends to increase. However, in the work processing sheet of the present embodiment, if the ratio (E1/E0) is in the above range, softening of the adhesive by heating is less likely to occur, and excessive improvement in adhesion by heat treatment can be effectively suppressed. As a result, the processed work can be easily separated well after the adhesive layer is irradiated with active energy rays.
The upper limit of the ratio (E1/E0) is not particularly limited, and may be, for example, 3.5 or less.
The young's modulus E0 of the sheet for workpiece processing of the present embodiment is preferably 2.0MPa or more, particularly preferably 2.3MPa or more, and more preferably 2.5MPa or more. The Young's modulus E0 is preferably 15MPa or less, particularly preferably 10MPa or less, and further preferably 5MPa or less. By setting the Young's modulus E0 to the above range, it is easy to adjust the ratio (E1/E0) to the above range.
The young's modulus E1 of the sheet for workpiece processing of the present embodiment is preferably 5.0MPa or more, particularly preferably 6.0MPa or more, and more preferably 7.0MPa or more. The Young's modulus E1 is preferably 100MPa or less, particularly preferably 50MPa or less, and more preferably 10MPa or less. By setting the Young's modulus E1 to the above range, it is easy to adjust the ratio (E2/E1) and the ratio (E1/E0) to the above ranges, respectively.
The young's modulus E2 of the sheet for workpiece processing of the present embodiment is preferably 100MPa or more, particularly preferably 130MPa or more, and more preferably 140MPa or more. The Young's modulus E2 is preferably 300MPa or less, particularly preferably 250MPa or less, and more preferably 200MPa or less. By setting the Young's modulus E2 to the above range, the ratio (E2/E1) can be easily adjusted to the above range.
The details of the measurement methods of the young's moduli E0, E1 and E2 are as described in the test examples described below.
2. Component member of sheet for processing work
(1) Base material
In the work processing sheet of the present embodiment, the base material is not particularly limited as long as it can exhibit a desired function in the step of using the work processing sheet, and preferably can exhibit good transmittance to active energy rays irradiated for curing the adhesive layer and has specific heat resistance.
For example, the base material is preferably a resin film mainly composed of a resin material, and specific examples thereof include an ethylene-vinyl acetate copolymer film; ethylene copolymer films such as ethylene- (meth) acrylic acid copolymer films, ethylene- (meth) acrylic acid methyl ester copolymer films, and other ethylene- (meth) acrylic acid ester copolymer films; polyolefin films such as polyethylene films, polypropylene films, polybutylene films, polybutadiene films, polymethylpentene films, ethylene-norbornene copolymer films, norbornene resin films, cycloolefin resin films, and the like; polyvinyl chloride films such as polyvinyl chloride films and vinyl chloride copolymer films; polyester-based films such as polyethylene terephthalate film, polybutylene terephthalate film, polycyclohexylenedimethylene terephthalate, and polyethylene naphthalate film; a (meth) acrylate copolymer film; a polyurethane film; a polyimide film; a polystyrene film; a polycarbonate film; a fluororesin film; polyphenylene sulfide films, and the like. Examples of the polyethylene film include a Low Density Polyethylene (LDPE) film, a Linear Low Density Polyethylene (LLDPE) film, and a High Density Polyethylene (HDPE) film. Further, modified films such as crosslinked films and ionomer films of the above-described films may also be used. The substrate may be a laminated film obtained by laminating a plurality of the above-described films. In this laminated film, the materials constituting the respective layers may be the same type or different types. Among the above films, polyester-based films subjected to annealing treatment, polyester-based films having heat resistance, polycarbonate films, polyphenylene sulfide films, and cycloolefin resin films are preferably used as the substrate, from the viewpoint of excellent transparency to active energy rays and heat resistance. In the present specification, "(meth) acrylic" refers to both acrylic and methacrylic. Other similar terms are also the same.
The base material may contain various additives such as a flame retardant, a plasticizer, an antistatic agent, a lubricant, an antioxidant, a colorant, an infrared absorber, an ultraviolet absorber, and an ion scavenger. The content of these additives is not particularly limited, but is preferably within a range in which the base material can function as desired.
In order to improve the adhesion between the substrate and the adhesive layer, the surface of the substrate on which the adhesive layer is to be laminated may be subjected to surface treatment such as primer treatment (primer treatment), corona treatment, or plasma treatment.
The thickness of the base material can be appropriately set according to the method of using the workpiece processing sheet, but is usually preferably 20 μm or more, and particularly preferably 25 μm or more. The thickness is preferably 450 μm or less, and more preferably 300 μm or less.
(2) Adhesive layer
In the work processing sheet of the present embodiment, the adhesive layer is composed of an active energy ray-curable adhesive. Since the adhesive layer is composed of an active energy ray-curable adhesive, the adhesive layer can be cured by irradiation with an active energy ray, thereby reducing the adhesive force of the work processing sheet to the adherend. This makes it possible to easily separate the processed workpiece from the workpiece processing sheet.
In addition, the adhesive agent layer in the present embodiment preferably achieves the above-described adhesive force. From this viewpoint, for the adhesive agent layer in the present embodiment, it is preferable that: the glass transition temperature of the active energy ray-curable adhesive constituting the adhesive layer is-50 ℃ to 10 ℃, and the active energy ray-curable adhesive contains an acrylic copolymer containing a monomer having a polar group as a constituent monomer. By providing the adhesive layer composed of such an active energy ray-curable adhesive, the work processing sheet can easily achieve the above-described adhesive force.
The glass transition temperature is particularly preferably-20 ℃ or higher, and more preferably-15 ℃ or higher, from the viewpoint of making it easier for the work processing sheet to achieve the above-described adhesive force. From the same viewpoint, the glass transition temperature is particularly preferably 5.0 ℃ or lower, and more preferably 3.0 ℃ or lower. The details of the method for measuring the glass transition temperature are shown in the following test examples.
The active energy ray-curable adhesive constituting the adhesive layer may contain, as a main component, a polymer having active energy ray-curability, or may contain, as a main component, a mixture of a non-active energy ray-curable polymer (a polymer having no active energy ray-curability) and a monomer and/or oligomer having at least 1 or more active energy ray-curable groups.
First, a case where the active energy ray-curable adhesive contains a polymer having active energy ray-curability as a main component will be described below.
The active energy ray-curable polymer is preferably a (meth) acrylate (co) polymer (a) having a functional group curable with an active energy ray (active energy ray-curable group) introduced into a side chain thereof (hereinafter, sometimes referred to as "active energy ray-curable polymer (a)"). The active energy ray-curable polymer (a) is preferably obtained by reacting an acrylic copolymer (a1) having a functional group-containing monomer unit with an unsaturated group-containing compound (a2) having a functional group bonded to the functional group.
The functional group-containing monomer is preferably a monomer having a polymerizable double bond and a functional group such as a hydroxyl group, a carboxyl group, an amino group, an amide group, a benzyl group, or a glycidyl group in a molecule, and among them, a monomer containing a hydroxyl group as a functional group (hydroxyl group-containing monomer) is preferably used.
Examples of the hydroxyl group-containing monomer include 2-hydroxyethyl (meth) acrylate, 2-hydroxypropyl (meth) acrylate, 3-hydroxypropyl (meth) acrylate, 2-hydroxybutyl (meth) acrylate, 3-hydroxybutyl (meth) acrylate, and 4-hydroxybutyl (meth) acrylate, and among these, 2-hydroxyethyl acrylate is preferably used. These hydroxyl group-containing monomers may be used alone or in combination of two or more.
Examples of the carboxyl group-containing monomer include ethylenically unsaturated carboxylic acids such as acrylic acid, methacrylic acid, crotonic acid, maleic acid, itaconic acid, and citraconic acid. These carboxyl group-containing monomers may be used alone or in combination of two or more.
Examples of the amino group-containing monomer or amide group-containing monomer include aminoethyl (meth) acrylate, n-butylaminoethyl (meth) acrylate, and the like. These amino group-containing monomers or amide group-containing monomers may be used alone, or two or more thereof may be used in combination.
The acrylic copolymer (a1) preferably contains 1% by mass or more, particularly preferably contains 5% by mass or more, and further preferably contains 10% by mass or more of the structural unit derived from the functional group-containing monomer. Further, the acrylic copolymer (a1) preferably contains 35% by mass or less, particularly preferably contains 30% by mass or less, of the structural unit derived from the functional group-containing monomer. When the acrylic copolymer (a1) contains the functional group-containing monomer in the above range, the desired active energy ray-curable polymer (a) can be easily formed.
As described above, the acrylic copolymer (a1) preferably contains a monomer having a polar group (polar group-containing monomer) as a monomer unit constituting the polymer. This improves the polarity of the active energy ray-curable adhesive obtained, and facilitates the achievement of the above-mentioned adhesive force.
Examples of the polar group-containing monomer include acryloylmorpholine, isobornyl acrylate, methyl methacrylate, vinyl acetate, benzyl acrylate, glycidyl methacrylate, and the like, and among them, acryloylmorpholine or isobornyl acrylate is particularly preferably used.
The acrylic copolymer (a1) preferably contains 3.0% by mass or more, particularly preferably contains 5.0% by mass or more, and further preferably contains 8.0% by mass or more of the structural unit derived from the polar group-containing monomer. Further, the acrylic copolymer (a1) preferably contains 12.0% by mass or less of a structural unit derived from the above polar group-containing monomer. When the acrylic copolymer (a1) contains the polar group-containing monomer in the above range, the polarity of the obtained active energy ray-curable adhesive can be effectively improved, and the adhesive force can be easily achieved.
Further, the acrylic copolymer (a1) preferably contains a monomer (Tg adjustment monomer) for adjusting the glass transition temperature (Tg) of the active energy ray-curable adhesive as a monomer unit constituting the polymer. Thus, the obtained active energy ray-curable adhesive easily has the above glass transition temperature (Tg). Examples of preferred monomers which also serve as the Tg adjusting monomer include the above-mentioned monomers listed as examples of polar group-containing monomers, and among them, acryloyl morpholine or isobornyl acrylate is particularly preferably used.
The glass transition temperature of the Tg adjusting monomer is preferably 30 ℃ or higher, particularly preferably 50 ℃ or higher, and further preferably 90 ℃ or higher. The glass transition temperature of the Tg adjusting monomer is preferably 200 ℃ or lower, particularly preferably 180 ℃ or lower, and further preferably 150 ℃ or lower. By using a Tg adjustment monomer having a glass transition temperature in these ranges, the glass transition temperature of the active energy ray-curable adhesive can be easily adjusted to the above range. The glass transition temperature of a monomer in the present specification means a glass transition temperature measured for a homopolymer composed of only the monomer.
The solubility parameter (SP value) of the Tg adjustment monomer is preferably 9.8 or more, particularly preferably 9.9 or more, and more preferably 10.0 or more. By setting the SP value of the Tg adjusting monomer to 9.8 or more, the adhesion of the work processing sheet, particularly the initial adhesion F0, can be easily adjusted to the above range. This makes it easy to hold the workpiece on the workpiece processing piece during processing. The upper limit of the solubility parameter (SP value) is not particularly limited, and may be, for example, 11 or less.
The acrylic copolymer (a1) preferably contains 3.0% by mass or more, particularly preferably contains 5.0% by mass or more, and further preferably contains 8.0% by mass or more of the structural unit derived from the above-mentioned Tg adjusting monomer. Further, the acrylic copolymer (a1) preferably contains 12.0 mass% or less of a structural unit derived from the above-mentioned Tg adjusting monomer. When the acrylic copolymer (a1) contains a Tg adjusting monomer in the above range, the glass transition temperature of the obtained active energy ray-curable adhesive can be easily adjusted to the above range.
The acrylic copolymer (a1) preferably uses an alkyl (meth) acrylate monomer having an alkyl group with 1 to 20 carbon atoms as a monomer unit constituting the polymer. The alkyl (meth) acrylate monomer is preferably an alkyl (meth) acrylate monomer having an alkyl group with 1 to 18 carbon atoms. In addition, an alkyl (meth) acrylate monomer having an alkyl group with 8 or more carbon atoms is preferable from the viewpoint of easily obtaining an adhesive having excellent heat resistance. Preferred examples of the alkyl (meth) acrylate monomer having an alkyl group with 1 to 20 carbon atoms include methyl methacrylate, ethyl (meth) acrylate, propyl (meth) acrylate, n-butyl (meth) acrylate, and 2-ethylhexyl (meth) acrylate. These alkyl (meth) acrylate monomers may be used alone or in combination of two or more.
The acrylic copolymer (a1) preferably contains 50% by mass or more, particularly preferably 60% by mass or more, and more preferably 70% by mass or more of a structural unit derived from an alkyl (meth) acrylate monomer having 1 to 20 carbon atoms and an alkyl group as described above. The acrylic copolymer (a1) preferably contains 99% by mass or less, particularly preferably 95% by mass or less, and further preferably 90% by mass or less of a structural unit derived from an alkyl (meth) acrylate monomer having 1 to 20 carbon atoms and an alkyl group as described above.
The acrylic copolymer (a1) is preferably obtained by copolymerizing the monomers or derivatives thereof described above by a conventional method, but monomers having an alicyclic structure in the molecule (alicyclic structure-containing monomers), dimethylacrylamide, vinyl formate, styrene, and the like may be copolymerized in addition to the above monomers.
Examples of the alicyclic structure-containing monomer include cyclohexyl (meth) acrylate, dicyclopentanyl (meth) acrylate, adamantyl (meth) acrylate, isobornyl (meth) acrylate, dicyclopentenyl (meth) acrylate, and dicyclopentenyloxyethyl (meth) acrylate. These alicyclic structure-containing monomers may be used alone or in combination of two or more.
The active energy ray-curable polymer (a) can be obtained by reacting the acrylic copolymer (a1) having a functional group-containing monomer unit with an unsaturated group-containing compound (a2) having a functional group bonded to the functional group.
The functional group of the unsaturated group-containing compound (a2) can be appropriately selected depending on the kind of functional group of the functional group-containing monomer unit of the acrylic copolymer (a 1). For example, when the functional group of the acrylic copolymer (a1) is a hydroxyl group, an amino group, or an amide group, the functional group of the unsaturated group-containing compound (a2) is preferably an isocyanate group or an epoxy group; when the functional group of the acrylic copolymer (a1) is a glycidyl group, the functional group of the unsaturated group-containing compound (a2) is preferably an amino group, a carboxyl group, or an aziridine group.
The unsaturated group-containing compound (a2) contains at least 1, preferably 1 to 6, and more preferably 1 to 4 active energy ray-polymerizable carbon-carbon double bonds in 1 molecule. Specific examples of such unsaturated group-containing compounds (a2) include 2-methacryloyloxyethyl isocyanate, m-isopropenyl- α, α -dimethylbenzyl isocyanate, methacryloyl isocyanate, allyl isocyanate, 1- (bisacryloxymethyl) ethyl isocyanate; an acryloyl monoisocyanate compound obtained by the reaction of a diisocyanate compound or a polyisocyanate compound with hydroxyethyl (meth) acrylate; an acryloyl group monoisocyanate compound obtained by the reaction of a diisocyanate compound or a polyisocyanate compound with a polyol compound and hydroxyethyl (meth) acrylate; glycidyl (meth) acrylate; (meth) acrylic acid, 2- (1-aziridinyl) ethyl (meth) acrylate, 2-vinyl-2-oxazoline, 2-isopropenyl-2-oxazoline, and the like.
The unsaturated group-containing compound (a2) is used in a proportion of preferably 50 mol% or more, particularly preferably 60 mol% or more, and further preferably 70 mol% or more, based on the number of moles of the functional group-containing monomer in the acrylic copolymer (a 1). The unsaturated group-containing compound (a2) is used preferably at 95 mol% or less, particularly preferably at 93 mol% or less, and more preferably at 90 mol% or less, based on the number of moles of the functional group-containing monomer in the acrylic copolymer (a 1).
In the reaction of the acrylic copolymer (a1) and the unsaturated group-containing compound (a2), the reaction temperature, pressure, solvent, time, presence or absence of a catalyst, and the type of a catalyst can be appropriately selected depending on the combination of the functional group of the acrylic copolymer (a1) and the functional group of the unsaturated group-containing compound (a 2). As a result, the functional group present in the acrylic copolymer (a1) reacts with the functional group in the unsaturated group-containing compound (a2), and an unsaturated group is introduced into the side chain of the acrylic copolymer (a1), whereby the active energy ray-curable polymer (a) is obtained.
The weight average molecular weight (Mw) of the active energy ray-curable polymer (a) obtained in this manner is preferably 1 ten thousand or more, particularly preferably 15 ten thousand or more, and further preferably 20 ten thousand or more. The weight average molecular weight (Mw) is preferably 150 ten thousand or less, and particularly preferably 100 ten thousand or less. The weight average molecular weight (Mw) in the present specification is a value in terms of standard polystyrene measured by Gel Permeation Chromatography (GPC).
The active energy ray-curable adhesive may further contain an active energy ray-curable monomer and/or oligomer (B), even when the active energy ray-curable adhesive contains, as a main component, a polymer having an active energy ray-curable property, such as the active energy ray-curable polymer (a).
As the active energy ray-curable monomer and/or oligomer (B), for example, an ester of a polyhydric alcohol and (meth) acrylic acid can be used.
Examples of the active energy ray-curable monomer and/or oligomer (B) include monofunctional acrylates such as cyclohexyl (meth) acrylate and isobornyl (meth) acrylate; polyfunctional acrylates such as trimethylolpropane tri (meth) acrylate, pentaerythritol tetra (meth) acrylate, dipentaerythritol hexa (meth) acrylate, 1, 4-butanediol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, polyethylene glycol di (meth) acrylate, and dimethylol tricyclodecane di (meth) acrylate; polyester oligo (meth) acrylates, polyurethane oligo (meth) acrylates, and the like.
When the active energy ray-curable monomer and/or oligomer (B) is blended with the active energy ray-curable polymer (a), the content of the active energy ray-curable monomer and/or oligomer (B) in the active energy ray-curable adhesive is preferably more than 0 part by mass, and particularly preferably 60 parts by mass or more, with respect to 100 parts by mass of the active energy ray-curable polymer (a). The content is preferably 250 parts by mass or less, and particularly preferably 200 parts by mass or less, based on 100 parts by mass of the active energy ray-curable polymer (a).
Here, when ultraviolet rays are used as the active energy rays for curing the active energy ray-curable adhesive, it is preferable to add a photopolymerization initiator (C), and by using the photopolymerization initiator (C), the polymerization curing time and the amount of light irradiation can be reduced.
The 5% weight loss temperature of the photopolymerization initiator (C) in the present embodiment is preferably 200 ℃ or higher, particularly preferably 210 ℃ or higher, and further preferably 220 ℃ or higher. By using the photopolymerization initiator (C) exhibiting a 5% weight loss temperature of 200 ℃ or higher, the adhesive force of the work processing sheet, particularly the adhesive force F2 after heating and irradiation with active energy rays, can be easily adjusted to the above range. Thus, even after the heat treatment, the processed workpiece can be easily separated from the workpiece processing sheet. The upper limit of the 5% weight loss temperature is not particularly limited, but is, for example, preferably 300 ℃ or lower, particularly preferably 280 ℃ or lower, and further preferably 250 ℃ or lower. The details of the method for measuring the 5% weight loss temperature are shown in the following examples.
Specific examples of the photopolymerization initiator (C) include benzophenone, acetophenone, benzoin methyl ether, benzoin ethyl ether, benzoin isopropyl ether, benzoin isobutyl ether, benzoin benzoic acid, benzoin methyl benzoate, benzoin dimethyl ketal, 2, 4-diethylthioxanthone, 1-hydroxycyclohexyl phenyl ketone, benzyl diphenyl sulfide, tetramethylthiuram monosulfide, azobisisobutyronitrile, benzil, diacetyl, beta-chloroanthraquinone, (2,4, 6-trimethylbenzyldiphenyl) phosphine oxide, N-diethyldithiocarbamate-2-benzothiazolyl ester, oligo { 2-hydroxy-2-methyl-1- [4- (1-propenyl) phenyl ] acetone }, 2-dimethoxy-1, 2-diphenylethan-1-one, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl ] phenyl } -2-methyl-propan-1-one, and the like. Among the above, 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl ] phenyl } -2-methyl-propan-1-one is preferably used. These photopolymerization initiators (C) may be used alone or in combination of two or more.
The photopolymerization initiator (C) is preferably used in an amount of 0.1 part by mass or more, particularly preferably 0.5 part by mass or more, based on 100 parts by mass of the active energy ray-curable polymer (a) (when the active energy ray-curable monomer and/or oligomer (B) is blended, the total amount of the active energy ray-curable polymer (a) and the active energy ray-curable monomer and/or oligomer (B) is 100 parts by mass). The photopolymerization initiator (C) is preferably used in an amount of 10 parts by mass or less, particularly preferably 6 parts by mass or less, based on 100 parts by mass of the active energy ray-curable polymer (a) (when the active energy ray-curable monomer and/or oligomer (B) is blended, the total amount of the active energy ray-curable polymer (a) and the active energy ray-curable monomer and/or oligomer (B) is 100 parts by mass).
In addition to the above components, other components may be appropriately blended in the active energy ray-curable adhesive. Examples of the other components include an actinic-energy-ray-curable polymer component or oligomer component (D), and a crosslinking agent (E).
Examples of the non-active energy ray-curable polymer component or oligomer component (D) include polyacrylates, polyesters, polyurethanes, polycarbonates, and polyolefins, and polymers or oligomers having a weight average molecular weight (Mw) of 3000 to 250 ten thousand are preferable. By blending the component (D) in the active energy ray-curable adhesive, the adhesiveness and releasability before curing, the strength after curing, the adhesiveness to other layers, the storage stability and the like can be improved. The blending amount of the component (D) is not particularly limited, and may be appropriately determined within a range of more than 0 part by mass and 50 parts by mass or less with respect to 100 parts by mass of the active energy ray-curable polymer (a).
As the crosslinking agent (E), a polyfunctional compound reactive with a functional group of the active energy ray-curable polymer (a) or the like can be used. Examples of such polyfunctional compounds include isocyanate compounds, epoxy compounds, amine compounds, melamine compounds, aziridine compounds, hydrazine compounds, aldehyde compounds, oxazoline compounds, metal alkoxide compounds, metal chelate compounds, metal salts, ammonium salts, reactive phenol resins, and the like.
The blending amount of the crosslinking agent (E) is preferably 0.01 part by mass or more, and particularly preferably 1 part by mass or more, relative to 100 parts by mass of the active energy ray-curable polymer (a). The amount of the crosslinking agent (E) to be blended is preferably 20 parts by mass or less, and particularly preferably 17 parts by mass or less, per 100 parts by mass of the active energy ray-curable polymer (a).
Next, a case where the active energy ray-curable adhesive contains a mixture of an inactive energy ray-curable polymer component and a monomer and/or oligomer having at least 1 or more active energy ray-curable groups as main components will be described below.
As the non-active energy ray-curable polymer component, for example, the same components as those of the acrylic copolymer (a1) can be used.
The same component as the component (B) can be selected as the monomer and/or oligomer having at least 1 or more active energy ray-curable groups. Regarding the blending ratio of the non-active energy ray-curable polymer component to the monomer and/or oligomer having at least 1 or more active energy ray-curable groups, the monomer and/or oligomer having at least 1 or more active energy ray-curable groups is preferably 1 part by mass or more, and particularly preferably 60 parts by mass or more, relative to 100 parts by mass of the non-active energy ray-curable polymer component. In addition, regarding the blending ratio, the monomer and/or oligomer having at least 1 or more active energy ray-curable groups is preferably 200 parts by mass or less, and particularly preferably 160 parts by mass or less, with respect to 100 parts by mass of the inactive energy ray-curable polymer component.
In this case, the photopolymerization initiator (C) or the crosslinking agent (E) can be appropriately blended as described above.
The thickness of the adhesive layer is preferably 1 μm or more, and more preferably 5 μm or more. The thickness is preferably 50 μm or less, and more preferably 40 μm or less. By setting the thickness of the adhesive agent layer to the above range, the above adhesive force can be easily achieved.
(3) Release sheet
In the work processing sheet of the present embodiment, for the purpose of protecting the surface of the adhesive layer opposite to the substrate (hereinafter, sometimes referred to as "adhesive surface"), a release sheet may be laminated on the surface until the surface is attached to the work. The release sheet may be of any configuration, and examples thereof include those obtained by peeling a plastic film with a peeling agent or the like. Specific examples of the plastic film include polyester films such as polyethylene terephthalate, polybutylene terephthalate, and polyethylene naphthalate; and polyolefin films such as polypropylene and polyethylene. As the release agent, silicones, fluorines, long chain alkyl groups and the like can be used, and among them, silicones which are inexpensive and can obtain stable performance are preferable. The thickness of the release sheet is not particularly limited, but is usually 20 μm to 250 μm.
(4) Other structural elements
In the work processing sheet of the present embodiment, a pressure-sensitive adhesive layer may be laminated on the pressure-sensitive adhesive surface of the pressure-sensitive adhesive layer. At this time, since the work processing sheet of the present embodiment is provided with the above-described adhesive layer, it can be used as a dicing/die bonding sheet. In such a work processing sheet, a work is attached to the surface of the pressure-sensitive adhesive layer opposite to the pressure-sensitive adhesive layer, and the work and the pressure-sensitive adhesive layer are cut at the same time, whereby a chip in which a singulated (singulated) pressure-sensitive adhesive layer is laminated can be obtained. The chip can be easily fixed to an object on which the chip is mounted by the singulated adhesive layer. As a material constituting the pressure-sensitive adhesive layer, a material containing a thermoplastic resin and a low-molecular-weight thermosetting pressure-sensitive adhesive component, a material containing a B-stage (semi-cured) thermosetting pressure-sensitive adhesive component, or the like is preferably used.
In the work processing sheet of the present embodiment, a protective film forming layer may be laminated on the adhesive surface of the adhesive layer. In this case, the work processing sheet of the present embodiment can be used as a protective film forming and cutting sheet. The work piece is attached to the surface of the protective film forming layer of the work piece processing sheet opposite to the adhesive layer, and the work piece and the protective film forming layer are cut simultaneously, so that a chip in which the protective film forming layer is formed in a single piece is obtained. In this case, a protective film forming layer is generally laminated on the surface opposite to the surface on which the circuit is formed. By curing the singulated protective film forming layer at a predetermined timing, a protective film having sufficient durability can be formed on the chip. Preferably, the protective film forming layer is composed of an uncured curable adhesive.
In addition, the work processing sheet of the present embodiment preferably satisfies the above-mentioned conditions concerning the adhesive force, and when the pressure-sensitive adhesive layer or the protective film-forming layer is laminated on the adhesive agent layer, the adhesive agent layer before laminating these layers may satisfy the above-mentioned adhesive force.
3. Method for manufacturing sheet for processing workpiece
The method for producing the workpiece-processing sheet of the present embodiment is not particularly limited, and the workpiece-processing sheet of the present embodiment is preferably produced by laminating an adhesive layer on one surface side of a base material.
The adhesive layer can be laminated on one surface side of the base material by a known method. For example, the adhesive layer formed on the release sheet is preferably transferred onto one side of the substrate. In this case, a coating liquid containing an adhesive composition constituting the adhesive layer and a solvent or a dispersion solvent as required is prepared, and the coating liquid is applied to a surface of the release sheet subjected to the release treatment (hereinafter, sometimes referred to as "release surface") by a die coater, a curtain coater, a spray coater, a slit coater, a blade coater, or the like to form a coating film, and the coating film is dried, whereby the adhesive layer can be formed. The coating liquid is not particularly limited as long as it can be applied, and components for forming the adhesive agent layer may be contained as a solute or a dispersion medium. The release sheet in the laminate can be released as a process material, and can also be used to protect the adhesive surface of the adhesive layer until the work processing sheet is attached to the work.
When the coating liquid for forming the adhesive layer contains a crosslinking agent, the active energy ray-curable polymer (a) or the non-active energy ray-curable polymer in the coating film may be subjected to a crosslinking reaction with the crosslinking agent by changing the above-mentioned drying conditions (temperature, time, etc.) or by separately providing a heating treatment, so that a crosslinked structure is formed in the adhesive layer at a desired existing density. In order to sufficiently progress the crosslinking reaction, the adhesive layer may be laminated on the substrate by the above-mentioned method or the like, and then the obtained work processing sheet may be aged by standing for several days at 23 ℃ under an environment of a relative humidity of 50%, for example.
Instead of transferring the adhesive layer formed on the release sheet to one surface of the substrate as described above, the adhesive layer may be directly formed on the substrate. At this time, a coating liquid for forming the above adhesive layer is applied on one side of the substrate to form a coating film, and the coating film is dried, thereby forming the adhesive layer.
4. Method for using sheet for processing workpiece
The workpiece-processing sheet of the present embodiment can be used for processing a workpiece. That is, after the adhesive surface of the workpiece processing sheet of the present embodiment is attached to a workpiece, the workpiece processing can be performed on the workpiece processing sheet. The sheet for workpiece processing of the present embodiment can be used as a back grinding sheet, a cutting sheet, an expanding sheet, a picking sheet, and the like according to the processing. Examples of the work include semiconductor members such as semiconductor wafers and semiconductor packages; glass members such as glass plates.
Further, when the sheet for work processing of the present embodiment is provided with the above-described adhesive layer, the sheet for work processing can be used as a dicing-fixing wafer. Further, when the work processing sheet of the present embodiment is provided with the above-described protective film forming layer, the work processing sheet can be used as a protective film forming and cutting sheet.
When the work processing is completed on the work processing sheet of the present embodiment and the processed work is separated from the work processing sheet, it is preferable to irradiate the adhesive layer in the work processing sheet with an active energy ray before the separation. This cures the adhesive layer, thereby reducing the adhesive force of the work processing sheet to the processed work satisfactorily, and facilitating separation of the processed work.
As the active energy ray, for example, an electromagnetic wave or a ray having an energy quantum in a charged particle beam, specifically, an ultraviolet ray or an electron beam can be used. Ultraviolet rays which are easy to handle are particularly preferable. The ultraviolet ray irradiation may be carried out using a high-pressure mercury lamp, xenon lamp, LED, or the like, and the irradiation amount of the ultraviolet ray is preferably 50mW/cm in illuminance meter2Above 1000mW/cm2The following. Further, the light amount is preferably 50mJ/cm2Above, 80mJ/cm is particularly preferable2The concentration is more preferably 200mJ/cm2The above. Further, the light amount is preferably 10000mJ/cm2The concentration is preferably 5000mJ/cm or less2More preferably 2000mJ/cm2The following. On the other hand, the electron beam irradiation may be performed using an electron beam accelerator or the like, and the irradiation amount of the electron beam is preferably 10krad to 1000 krad.
By setting the adhesive force F0 of the work processing sheet of the present embodiment to the above range, it is possible to exhibit sufficient adhesive force to the work when processing the work, and also possible to favorably suppress troubles such as movement and falling-off of the work or the work after processing. Further, by making the adhesive agent layer be composed of an active energy ray-curable adhesive and making the ratio of adhesive force F2/F0 within the above range, even when the workpiece-processing sheet is heated in a state in which the processed workpiece is attached, the adhesive force to the processed workpiece can be sufficiently reduced by irradiating with active energy rays thereafter, and the processed workpiece can be picked up well. Therefore, the work processing sheet of the present embodiment is suitably used in applications in which the work processing sheet is exposed to a high-temperature environment in a state in which a work or a processed work is attached to the work processing sheet. In particular, the workpiece processing sheet of the present embodiment is suitable for use in applications in which the workpiece processing sheet is diced from a silicon wafer or the like, and the obtained chips are heat-treated on the workpiece processing sheet.
When the work processing sheet of the present embodiment is used as a dicing sheet and is used for an application in which a heat treatment is performed after dicing in a state in which a chip is attached to the work processing sheet, the heating temperature is preferably 40 ℃ or higher, particularly preferably 80 ℃ or higher, and further preferably 100 ℃ or higher, for example. The heating temperature is preferably 150 ℃ or lower, particularly preferably 130 ℃ or lower, and further preferably 120 ℃ or lower. Further, for example, the heating time is preferably 3 minutes or more, particularly preferably 10 minutes or more, and further preferably 30 minutes or more. The heating time is preferably 60 minutes or less, particularly preferably 50 minutes or less, and further preferably 40 minutes or less. Even when the workpiece processing sheet of the present embodiment is heated under the above-described conditions, chips can be separated well.
The embodiments described above are described for easy understanding of the present invention, and are not described for limiting the present invention. Therefore, the elements disclosed in the above embodiments also cover all the design changes and equivalents that fall within the technical scope of the present invention.
For example, another layer may be provided between the base material and the adhesive layer, or on the surface of the base material opposite to the adhesive layer.
Examples
The present invention will be described in more detail with reference to examples and the like, but the scope of the present invention is not limited to these examples and the like.
[ example 1]
(1) Preparation of adhesive composition
An active energy ray-curable polymer was obtained by copolymerizing 70 parts by mass of 2-ethylhexyl acrylate, 10 parts by mass of acryloylmorpholine and 20 parts by mass of 2-hydroxyethyl acrylate, and reacting the resulting acrylic copolymer with 90 mol% of methacryloyloxyethyl isocyanate (MOI) based on the number of moles of 2-hydroxyethyl acrylate in the acrylic copolymer. The weight average molecular weight (Mw) of the active energy ray-curable polymer was measured by the method described below, and found to be 83 ten thousand.
100 parts by mass (in terms of solid content, the same applies hereinafter) of the obtained active energy ray-curable polymer, 1.2 parts by mass of an aliphatic isocyanate having hexamethylene diisocyanate as a crosslinking agent (product name "Coronate HX" manufactured by Nippon Polyurethane Industry Co., Ltd.), 1.2 parts by mass of 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl ] phenyl } -2-methyl-propane-1-one (product name "Omnirad 127" manufactured by Past) as a photopolymerization initiator, 5% weight loss temperature: 220 ℃ were mixed with a solvent to obtain an adhesive composition. In addition, the 5% weight loss temperature of the photopolymerization initiator was measured by heating from room temperature to 300 ℃ at a temperature rising rate of 5 ℃/min using a differential thermal-thermogravimetric synchronous analyzer (manufactured by SHIMADZU CORPORATION, product name "DTG-60").
(2) Formation of adhesive layer
The adhesive composition was applied to the release surface of a release sheet (product name "SP-PET 381031", manufactured by linec CORPORATION) in which a silicone-based release agent layer was formed on one surface of a polyethylene terephthalate film having a thickness of 38 μm, dried by heating, and then aged at 23 ℃ and 50% RH for 7 days, thereby forming an adhesive layer having a thickness of 5 μm on the release sheet.
(3) Production of sheet for workpiece processing
The surface of the adhesive layer formed in the step (2) opposite to the release sheet was bonded to one surface of a heat-resistant polyester film (product name "Torcena" manufactured by kurabao INDUSTRIES ltd.) having a thickness of 75 μm as a base material, to obtain a sheet for processing a workpiece.
The weight average molecular weight (Mw) is a weight average molecular weight in terms of standard polystyrene measured by Gel Permeation Chromatography (GPC).
Examples 2 to 8 and comparative examples 1 to 4
A sheet for workpiece processing was produced in the same manner as in example 1, except that the composition and the weight average molecular weight of the acrylic copolymer were changed to those shown in table 1, and the composition of the adhesive composition was changed to those shown in table 2.
[ test example 1] (measurement of glass transition temperature of adhesive)
The adhesive layers of the work processing sheets produced in the examples and comparative examples were laminated to produce a laminate of adhesive layers having a thickness of 800 μm. Then, a test sample was obtained by punching a circular shape having a diameter of 10mm in the laminate of the adhesive layer. With respect to the sample for measurement, tan δ was measured using a dynamic viscoelasticity measuring apparatus (product name "ARES" manufactured by tas instruments) under the conditions of a frequency of 1Hz, a measurement temperature range of-50 to 150 ℃, a temperature rise rate of 3 ℃/min, and the highest temperature thereof was designated Tg. The results are shown in Table 3.
[ test example 2] (measurement of adhesive force)
The work processing pieces produced in examples and comparative examples were cut into strips having a width of 25 mm. The release sheet was peeled from the obtained strip-shaped workpiece processing sheet to expose the adhesive surface of the adhesive layer, and the adhesive surface was attached to the mirror surface of the mirror-finished silicon wafer using a 2kg rubber roller in an environment of 23 ℃ and 50% relative humidity, and left standing for 20 minutes to prepare a sample for measurement.
The obtained measurement sample was peeled from the silicon wafer at a peeling speed of 300 mm/min and a peeling angle of 180 ° using a universal tensile tester (product name "TENSILON UTM-4-100" manufactured by ORIENTEC CORPORATION), and the adhesion force (mN/25mm) to the silicon wafer was measured by a 180 ° peeling method based on JIS 0237: 2009. The adhesion thus obtained is denoted as adhesion F0 and is shown in table 3.
Further, the measurement sample obtained in the same manner as described above was heated at 150 ℃ for 1 hour using an oven. The adhesion (mN/25mm) of the heated measurement sample to a silicon wafer was measured in the same manner as described above. The adhesion thus obtained is denoted as adhesion F1 and is shown in table 3.
Further, the measurement sample obtained in the same manner as described above was heated at 150 ℃ for 1 hour using an oven. Further, the adhesive layer was irradiated with ultraviolet rays through the substrate under the following conditions. The adhesion (mN/25mm) of the sample for measurement to a silicon wafer was measured in the same manner as described above. The adhesion thus obtained is denoted as adhesion F2 and is shown in table 3.
< ultraviolet irradiation conditions >
Using high-pressure mercury lamps
Illuminance 230mW/cm2Light quantity 190mJ/cm2
UV illuminance/photometer Using "UVPF-A1" manufactured by Eye graphics Co., Ltd "
Further, from the 3 kinds of adhesion obtained in the above manner, the ratio of the adhesion F2 to the adhesion F0 (F2/F0) and the ratio of the adhesion F0 to the adhesion F1 (F0/F1) were calculated, respectively. The results are shown in Table 3.
[ test example 3] (measurement of Young's modulus of adhesive)
For each of the examples and comparative examples, a plurality of laminates of the adhesive layer and the release sheet prepared in the same manner as in the step (2) of example 1 were prepared. Then, a predetermined number of adhesive layers in the laminate were laminated to prepare a sample of an adhesive layer for measurement composed of an adhesive layer having a thickness of 200 μm.
The Young's modulus (MPa) was determined from the stress-strain curve obtained by stretching the obtained adhesive layer sample for measurement at a chuck spacing of 30mm and a speed of 200 mm/min at 23 ℃ using a universal tensile tester (manufactured by Shimadzu Corporation, product name "AUTOGRAPH AG-IS"). The results thus obtained are described as Young's modulus E0 and are shown in Table 3.
Further, the adhesive agent layer sample for measurement obtained in the same manner as described above was heated at 150 ℃ for 1 hour using an oven. The Young's modulus (MPa) of the heated sample of the adhesive agent layer for measurement was determined in the same manner as described above. The results thus obtained are described as Young's modulus E1 and are shown in Table 3.
Further, the adhesive agent layer sample for measurement obtained in the same manner as described above was heated at 150 ℃ for 1 hour using an oven. The heated sample of the adhesive agent layer for measurement was further irradiated with ultraviolet rays under the following conditions. The Young's modulus (MPa) of the sample of the adhesive agent layer for measurement was determined in the same manner as described above. The results thus obtained are described as Young's modulus E2 and are shown in Table 3.
< ultraviolet irradiation conditions >
Using high-pressure mercury lamps
Illuminance 230mW/cm2Light quantity 580mJ/cm2
UV illuminance/photometer Using "UVPF-A1" manufactured by Eye graphics Co., Ltd "
Further, from the 3 kinds of Young's moduli obtained in the above manner, the ratio of Young's modulus E1 to Young's modulus E0 (E1/E0) and the ratio of Young's modulus E2 to Young's modulus E1 (E2/E1) were calculated, respectively. The results are shown in Table 3.
[ test example 4] (evaluation of initial tackiness)
The release sheet was peeled from the work processing sheets produced in examples and comparative examples, and the exposed surface of the exposed adhesive layer was attached to the polished surface of a 6-inch silicon wafer (thickness: 350 μm) subjected to #2000 polishing using a tape bonding apparatus (product name "advill RAD2500 m/12", produced by LINTEC CORPORATION). Then, dicing was performed using a dicing apparatus (manufactured by DISCO Corporation, product name "DFD-6362") under the following dicing conditions to cut the wafer from the 6-inch silicon wafer side while supplying running water to the dicing section.
< cutting conditions >
A cutting device: DFD-6362 manufactured by DISCO Corporation
Blade: NBC-2H 205027 HECC manufactured by DISCO Corporation
Blade width: 0.025 to 0.030mm
Blade extension: 0.640-0.760 mm
Blade rotation speed: 50000rpm
Cutting speed: 20 mm/sec
Incision depth: cutting 20 μm into the base material from the surface of the adhesive layer side of the sheet for processing work
Flow rate: 1.0L/min
Temperature of running water: at room temperature
Cut size: 2mm
Then, the work piece with the chips attached thereto obtained in the dicing step was visually observed, the number of chips detached from the work piece in the dicing step was counted, and the number of cuts in the dicing step was divided by the number of chips to obtain the chip detachment ratio (unit:%). Based on the calculation results, the initial tack was evaluated according to the following criteria. The evaluation results are shown in table 3.
O: the chip detachment rate is less than 10%.
X: the chip detachment rate is more than 10%.
[ test example 5] (evaluation of suitability for pickup)
Cutting was performed in the same manner as in test example 4 except that the workpiece processing sheets manufactured in examples and comparative examples were used and the cutting size was changed to 10mm × 10 mm.
After the dicing, the workpiece processing sheet with the chips mounted thereon was put into an oven and heated at 150 ℃ for 1 hour. Then, the adhesive layer in the work processing sheet was irradiated with ultraviolet rays under the following conditions through the base material.
< ultraviolet irradiation conditions >
Using high-pressure mercury lamps
Illuminance 230mW/cm2Light quantity 190mJ/cm2
UV illuminance/photometer Using "UVPF-A1" manufactured by Eye graphics Co., Ltd "
The 100 chips were picked up from the workpiece processing sheet after the ultraviolet irradiation, and the suitability for pickup was evaluated according to the following criteria. The results are shown in Table 3.
Very good: the number of chips that can be picked up well out of 100 is 95 or more.
O: the number of chips that can be picked up well is less than 95 and 80 or more out of 100.
X: of the 100, the number of chips that can be picked up well is less than 80.
The details of the abbreviations and the like shown in tables 1 and 2 are as follows.
[ composition of active energy ray-curable Polymer ]
2 EHA: 2-ethylhexyl acrylate
BA: acrylic acid butyl ester
ACMO: acryloylmorpholine (SP value: 10.1, glass transition temperature: 145 ℃ C.)
MMA: methyl methacrylate (SP value: 9.5, glass transition temperature: 105 ℃ C.)
IBXA: isobornyl acrylate (SP value: 10.2, glass transition temperature: 94 ℃ C.)
HEA: 2-Hydroxyethyl acrylate
MOI: methacryloyloxyethyl isocyanate
[ photopolymerization initiator ]
Omnirad 127: 2-hydroxy-1- {4- [4- (2-hydroxy-2-methyl-propionyl) -benzyl ] phenyl } -2-methyl-propan-1-one (manufactured by BASF corporation, product name "Omnirad 127", 5% weight loss temperature: 220 ℃ C.)
Omnirad TPO: 2,4, 6-trimethylbenzoyldiphenylphosphine oxide (product name "Omnirad TPO" manufactured by BASF corporation, 5% weight loss temperature: 225 ℃ C.)
[ Table 1]
Figure BDA0003062100800000251
[ Table 2]
Figure BDA0003062100800000261
[ Table 3]
Figure BDA0003062100800000262
As is clear from table 3, the workpiece-processing sheets obtained in the examples are excellent in initial adhesiveness, and can hold a workpiece on the sheet well when processing the workpiece. Further, the work processing sheet obtained in the examples was excellent in the pick-up suitability, which suggests that the adhesion to the processed work was reduced well at the time of pick-up.
Industrial applicability
The sheet for processing a workpiece of the present invention can be suitably used for cutting.

Claims (6)

1. A sheet for processing a workpiece, comprising a base material and an adhesive layer laminated on one surface side of the base material,
the adhesive layer is composed of an active energy ray-curable adhesive,
the adhesion force of the work piece processing sheet to the silicon wafer was set to F0,
when a laminate obtained by bonding the work processing sheet to a silicon wafer is heated at 150 ℃ for 1 hour, and the adhesive force of the work processing sheet to the silicon wafer after the adhesive agent layer constituting the laminate is irradiated with an active energy ray is F2,
the adhesive force F0 is 600mN/25mm to 20000mN/25mm,
the ratio of the adhesion force F2 to the adhesion force F0 (F2/F0) is 0.66 or less.
2. The sheet for processing a workpiece according to claim 1,
the Young's modulus at 23 ℃ of the adhesive layer obtained by heating the work processing sheet at 150 ℃ for 1 hour was E1,
when the adhesive layer is heated at 150 ℃ for 1 hour and then the adhesive layer constituting the work processing sheet is irradiated with active energy rays, the Young's modulus at 23 ℃ of the adhesive layer is E2,
the ratio (E2/E1) of the Young's modulus E2 to the Young's modulus E1 is 13 or more.
3. The sheet for processing a workpiece according to claim 1 or 2,
the Young's modulus at 23 ℃ of the adhesive layer in the work processing sheet was E0,
when the Young's modulus at 23 ℃ of the adhesive layer obtained by heating the work processing sheet at 150 ℃ for 1 hour is E1,
the ratio of the Young's modulus E1 to the Young's modulus E0 (E1/E0) is 2.0 or more.
4. A sheet for processing a workpiece, comprising a base material and an adhesive layer laminated on one surface side of the base material,
the adhesive layer is composed of an active energy ray-curable adhesive,
the glass transition temperature of the active energy ray-curable adhesive is-50 ℃ to 10 ℃,
the active energy ray-curable adhesive contains an acrylic copolymer containing a monomer having a polar group as a structural monomer.
5. The sheet for processing a workpiece according to claim 4, wherein a functional group having an active energy ray-curability is introduced into a side chain of the acrylic copolymer.
6. A sheet for processing a workpiece according to any one of claims 1 to 5, which is a dicing sheet.
CN201980074603.7A 2018-11-12 2019-10-11 Sheet for processing workpiece Pending CN113016055A (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112063328A (en) * 2019-06-10 2020-12-11 琳得科株式会社 Adhesive sheet and laminate

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* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW202424059A (en) * 2022-09-12 2024-06-16 日商力森諾科股份有限公司 Resin material and resin composition

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006328160A (en) * 2005-05-24 2006-12-07 Emulsion Technology Co Ltd Adhesive resin composition, pressure-sensitive adhesive sheet and method for manufacturing the same
JP2017082196A (en) * 2015-10-29 2017-05-18 日本合成化学工業株式会社 Pressure-sensitive adhesive composition, peelable pressure-sensitive adhesive obtained using the same, peelable pressure-sensitive adhesive sheet, and method of using the peelable pressure-sensitive adhesive sheet

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5144634B1 (en) 1970-03-03 1976-11-30
JPS5555578U (en) 1978-10-11 1980-04-15
JP2004119780A (en) 2002-09-27 2004-04-15 Nitto Denko Corp Working method of semiconductor wafer
JP4970863B2 (en) 2006-07-13 2012-07-11 日東電工株式会社 Workpiece processing method
JP4781185B2 (en) 2006-07-18 2011-09-28 日東電工株式会社 Heat-resistant dicing tape or sheet
JP5144634B2 (en) 2009-12-22 2013-02-13 日東電工株式会社 Heat-resistant adhesive sheet for substrate-less semiconductor package manufacturing, and substrate-less semiconductor package manufacturing method using the adhesive sheet
JP5565173B2 (en) 2010-07-30 2014-08-06 大日本印刷株式会社 Heat-resistant temporary adhesive tape
JP5555578B2 (en) 2010-09-14 2014-07-23 積水化学工業株式会社 Adhesive composition and adhesive tape

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006328160A (en) * 2005-05-24 2006-12-07 Emulsion Technology Co Ltd Adhesive resin composition, pressure-sensitive adhesive sheet and method for manufacturing the same
JP2017082196A (en) * 2015-10-29 2017-05-18 日本合成化学工業株式会社 Pressure-sensitive adhesive composition, peelable pressure-sensitive adhesive obtained using the same, peelable pressure-sensitive adhesive sheet, and method of using the peelable pressure-sensitive adhesive sheet

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112063328A (en) * 2019-06-10 2020-12-11 琳得科株式会社 Adhesive sheet and laminate

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