CN113015824A - Plating apparatus and plating method - Google Patents
Plating apparatus and plating method Download PDFInfo
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- CN113015824A CN113015824A CN201880099461.5A CN201880099461A CN113015824A CN 113015824 A CN113015824 A CN 113015824A CN 201880099461 A CN201880099461 A CN 201880099461A CN 113015824 A CN113015824 A CN 113015824A
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- Prior art keywords
- plating
- roll
- cathode
- sheet
- cathode roll
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- 238000007747 plating Methods 0.000 title claims abstract description 148
- 238000000034 method Methods 0.000 title claims abstract description 32
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 30
- 239000000463 material Substances 0.000 claims abstract description 18
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 15
- 238000011144 upstream manufacturing Methods 0.000 claims abstract description 13
- 239000011248 coating agent Substances 0.000 claims abstract description 9
- 238000000576 coating method Methods 0.000 claims abstract description 9
- 238000009713 electroplating Methods 0.000 claims abstract description 5
- 229910000990 Ni alloy Inorganic materials 0.000 claims description 9
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 14
- 229910052802 copper Inorganic materials 0.000 abstract description 14
- 239000010949 copper Substances 0.000 abstract description 14
- 239000002184 metal Substances 0.000 abstract description 13
- 229910052751 metal Inorganic materials 0.000 abstract description 13
- 239000010408 film Substances 0.000 abstract description 11
- 239000010409 thin film Substances 0.000 abstract description 5
- 230000005611 electricity Effects 0.000 abstract 1
- 238000004804 winding Methods 0.000 abstract 1
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 101100165186 Caenorhabditis elegans bath-34 gene Proteins 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C28/00—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D
- C23C28/02—Coating for obtaining at least two superposed coatings either by methods not provided for in a single one of groups C23C2/00 - C23C26/00 or by combinations of methods provided for in subclasses C23C and C25C or C25D only coatings only including layers of metallic material
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D21/00—Processes for servicing or operating cells for electrolytic coating
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D3/00—Electroplating: Baths therefor
- C25D3/02—Electroplating: Baths therefor from solutions
- C25D3/38—Electroplating: Baths therefor from solutions of copper
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
- C25D5/34—Pretreatment of metallic surfaces to be electroplated
-
- C—CHEMISTRY; METALLURGY
- C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
- C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
- C25D7/00—Electroplating characterised by the article coated
- C25D7/06—Wires; Strips; Foils
- C25D7/0614—Strips or foils
- C25D7/0657—Conducting rolls
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Electrochemistry (AREA)
- Mechanical Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
- Other Surface Treatments For Metallic Materials (AREA)
Abstract
本发明的课题是提供一种镀覆装置及镀覆方法，其等即使在作为被镀覆材料的长条状薄片的电阻较大的情形，亦能适当地进行镀覆处理，进一步，使铜等金属薄膜对长条状薄片表面的密着性提升，同时能获得经施以高质量镀覆处理的已生成镍金属皮膜的长条状薄片。本发明的解决方案是一种镀覆装置10，其在卷出侧辊12与卷取侧辊14之间，通过半空中的阴极辊16而维持搬送作为被镀覆材料的长条状薄片18，且同时一边使长条状薄片18以浸入镀覆液20中的状态于设有阳极22的镀覆槽24中搬送，一边由阴极辊16对长条状薄片18进行供电，借此对长条状薄片18进行电镀处理，再者，阴极辊16相对于镀覆槽24位于长条状薄片18搬送方向的上游侧，且与镀覆槽24的上游侧入口的距离设为150mm以下的范围。
An object of the present invention is to provide a plating apparatus and a plating method which can appropriately perform plating even when the electrical resistance of a long sheet as a material to be plated is large, and further, make copper The adhesion of the metal thin film to the surface of the elongated sheet is improved, and at the same time, the elongated sheet of the nickel metal film that has been subjected to high-quality plating treatment can be obtained. The solution of the present invention is a coating apparatus 10 in which a long sheet 18 serving as a material to be plated is maintained and conveyed by a cathode roll 16 in midair between the unwinding side roll 12 and the winding side roll 14 At the same time, while the elongated sheet 18 is conveyed in the plating tank 24 provided with the anode 22 in the state of being immersed in the plating solution 20, the elongated sheet 18 is supplied with electricity by the cathode roller 16. The strip sheet 18 is subjected to electroplating, and the cathode roll 16 is located on the upstream side in the conveying direction of the strip sheet 18 with respect to the coating tank 24, and the distance from the upstream side entrance of the coating tank 24 is set to a range of 150 mm or less. .
Description
Technical Field
The present invention relates to a plating apparatus and a plating method using the plating apparatus, in which a long sheet material as a material to be plated is subjected to an electroplating treatment while being conveyed in a predetermined treatment liquid, and in particular, even when the resistance of the long sheet material is large, the plating apparatus can be suitably electroplated, and a plating method using the plating apparatus.
Background
Conventionally, a plating apparatus and a plating method are known in which a long sheet material is supplied with power by being brought into contact with a power supply roller and is subjected to plating treatment. For example, patent documents 1 and 2 disclose techniques for applying plating to a plating material in a plating solution in a plating tank by feeding the plating material in a direction along a direction in which the plating material is transported from a feeding roller provided in a half-air space ahead of the plating tank in the transport direction.
As a conventional example, in a plating apparatus shown in fig. 6, when a long sheet as a material to be plated is conveyed between a take-up side roller (not shown) and a take-up side roller (not shown) by a cathode roller 54 in a half space and the long sheet passes through each of a plurality of plating tanks 50, the long sheet is supplied with power from the cathode roller 54 to perform an electro-plating process.
The plating apparatus is provided with a conveyance roller and a cathode roller 54, and each rotating shaft extends in a direction perpendicular to the conveyance direction of the long sheet, and conveys the long sheet in the conveyance direction while contacting the surface of the long sheet. Further, each cathode roll 54 of the plating apparatus is connected to one conductor bar 52 (cathode) connected to a rectifier, and each anode 56 is connected to a corresponding rectifier.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 53-87941
Patent document 2: japanese unexamined patent publication No. 63-183192
Problems to be solved by the invention
However, the techniques disclosed in patent documents 1 and 2 have a problem that plating failure is likely to occur when the resistance of the plating material is large (for example, international publication WO 2016/143714). In the conventional plating apparatus, the cathode roll 54 is connected to one conductive rod 52 (cathode) in each plating tank, and therefore, the electric power supplied from each rectifier to the anode of each plating tank easily flows to a portion having low downstream resistance, and thus, power unevenness occurs, and a problem arises in adhesion of a metal thin film such as copper to a long sheet on which a nickel metal film has been formed.
The present invention has been made to solve the above problems, and provides a plating apparatus and a plating method that can appropriately perform a plating treatment even when the electrical resistance of a long sheet as a material to be plated is large, and can obtain a long sheet on which a nickel or nickel alloy film has been formed, which has been subjected to a high-quality plating treatment, while improving the adhesion of a metal thin film such as copper to the surface of the long sheet.
Disclosure of Invention
According to the present invention, there is provided a plating apparatus comprising 2 or more plating tanks, each plating tank being provided with a power supply connected to a return lead of a cathode roller and a power supply connected to an anode, wherein the plating tanks are configured to supply power to a long sheet as a material to be plated from the cathode roller while the long sheet is kept conveyed by the cathode roller supported by a bearing between a take-up roller and is conveyed while being immersed in a plating solution in a plating tank provided with the anode.
According to the present invention, even when the resistance of the plating material is large, the plating treatment can be appropriately performed. Further, the adhesion of the metal thin film to the surface of the long sheet on which the nickel or nickel alloy film is formed can be improved. Further, a plated material subjected to a high-quality plating treatment can be obtained.
Preferably, the cathode roller is located upstream of the plating tank in the conveyance direction of the elongated sheet, and the distance from the upstream inlet of the plating tank is 150mm or less. Preferably a plating apparatus, wherein the cathode roll has elasticity.
Preferably, the cathode roller supplies power to the long sheet in a predetermined range at both ends thereof. Preferably, the plating device is provided with a pressing mechanism for pressing the long sheet against the cathode roller to increase a contact area between the long sheet and the cathode roller. Further, it is preferable that the pressing mechanism has a pressing roller for pressing the long sheet against the cathode roller, and the pressing roller has elasticity.
Preferably, the cathode roller is rotated by a resistance force with respect to the long sheet without applying a rotational driving force to the long sheet in accordance with conveyance of the long sheet.
Further, it is preferable that the plating apparatus of the present invention is used to perform a plating process on a long sheet on which a seed layer having a film resistance value of 1 Ω/sq or more has been formed. Preferably, the plating method is a plating method for plating an elongated sheet having a nickel or nickel alloy film of 200nm or less using the plating apparatus of the present invention.
Drawings
FIG. 1 is a schematic front view showing an embodiment of a plating apparatus according to the present invention.
FIG. 2 is a schematic front view showing an embodiment of the plating apparatus of the present invention, wherein (a) is a schematic front view showing a structure including a cathode roll and the like in the vicinity of a plating tank to which copper strike plating is applied, and (b) is a schematic front view showing a structure including a cathode roll and the like in the vicinity of a plating tank to which copper plating is applied in a subsequent process.
FIG. 3 is a schematic plan view showing a cathode roll in the embodiment of the plating apparatus of the present invention.
Fig. 4 is a diagram showing the appearance of pinholes when power is supplied from the cathode roll, (a) shows the appearance of pinholes when power is supplied from a general cathode roll, and (b) shows the appearance of pinholes when power is supplied from the cathode roll in the embodiment of the plating apparatus of the present invention.
FIG. 5 is a schematic front view showing another embodiment of the plating apparatus according to the present invention, including a cathode roll and the like in the vicinity of a plating tank to which copper strike plating is applied.
FIG. 6 is a schematic plan view showing a conventional plating apparatus.
Detailed Description
Embodiments of a plating apparatus and a plating method according to the present invention will be described with reference to the drawings. FIG. 1 is a schematic front view showing an embodiment of a plating apparatus according to the present invention. FIG. 2 is a schematic front view showing an embodiment of the plating apparatus of the present invention, wherein (a) is a schematic front view showing a structure including a cathode roll and the like in the vicinity of a plating tank to which copper strike plating is applied, and (b) is a schematic front view showing a structure including a cathode roll and the like in the vicinity of a plating tank to which copper plating is applied in a subsequent process.
Fig. 3 is a schematic plan view of a cathode roll in an embodiment of the plating apparatus according to the present invention. Fig. 4 is a diagram showing the appearance of pinholes when power is supplied from the cathode roll, (a) shows the appearance of pinholes when power is supplied from a general cathode roll, and (b) shows the appearance of pinholes when power is supplied from the cathode roll in the embodiment of the plating apparatus according to the present invention. FIG. 5 is a schematic front view showing another embodiment of the plating apparatus according to the present invention, including a cathode roll in the vicinity of a plating tank to which copper strike plating is applied.
Further, with respect to the reference numeral, 10 denotes a plating apparatus, 12 denotes a take-up side roll, 14 denotes a take-up side roll, 16 denotes a cathode roll, 18 denotes an elongated sheet, 20 denotes a plating liquid, 22 denotes an anode, 24 denotes a plating tank (strike), 26 denotes a power supply, 28 denotes a power supply range, 30 denotes a pressing mechanism, 32 denotes a driven cathode roll, 34 denotes a post-process plating tank, 50 denotes a plating tank, 52 denotes a conductive rod, 54 denotes a cathode roll, 56 denotes an anode, 58 denotes a cylinder, and 60 denotes a pressing roll.
First, as shown in fig. 1, in the plating apparatus 10 of the present embodiment, while maintaining conveyance of the long sheet 18 as a material to be plated by the cathode roll 16 supported by a bearing between the take-out roll 12 and the take-up roll 14, the long sheet 18 is conveyed in a plating tank (strike) 24 provided with an anode 22 while the long sheet 18 is immersed in the plating solution 20, and power is supplied to the long sheet 18 by the cathode roll 16 to plate the long sheet 18, and the cathode roll 16 is positioned on the upstream side in the conveyance direction of the long sheet 18 with respect to the plating tank (strike) 24, and the distance from the upstream inlet of the plating tank (strike) 24 is set to a range of 150mm or less.
Next, this embodiment will be described in detail. In the present embodiment, electroless plating is used to plate the surface of a long material to be plated with nickel or a nickel alloy as a conductive metal in advance, thereby producing a long sheet 18 on which a nickel or nickel alloy film as a conductive metal seed layer has been formed. In the electroless nickel plating treatment or the electroless nickel alloy plating treatment, a seed layer of nickel or a nickel alloy having conductivity of about 10 to 300nm is generally formed, but a thin film of nickel or a nickel alloy of 200nm or less is preferable. The seed layer preferably has a film resistance value of 1 Ω/sq or more.
Next, the plating device 10 of the present embodiment conveys the long sheet 18 between the delivery-side roller 12 and the take-up-side roller 14 in the horizontal direction by the cathode roller 16 supported by a bearing. When the long sheet 18 is subjected to the copper strike plating process, the power is supplied to the long sheet 18 by the cathode roller 16 while the long sheet 18 is conveyed in a plating tank (strike) 24 in which an anode 22 is provided, while being immersed in the plating solution 20.
Thereby, the long sheet 18 can be subjected to copper strike plating treatment (electroplating treatment). In the plating apparatus 10 according to the present embodiment, as shown in fig. 1, the cathode roll 16 is positioned upstream of the plating tank (strike) 24 in the conveyance direction of the long sheet 18, and the distance from the upstream inlet of the plating tank (strike) 24 is set to be 150mm or less (preferably, 50mm to 120 mm).
In the structure of a general plating apparatus, the cathode roll in the impact plating process is disposed at a position of about 200mm to 300mm before the plating tank in view of workability and maintainability, but if the cathode roll 16 is set to a range of 150mm or less (preferably, 50mm to 120 mm) as in the present embodiment, the distance from the plating tank is shorter than usual, and therefore, power can be appropriately supplied to the long sheet 18 having a large resistance and having a nickel metal film formed thereon. Further, there is no need to increase the power supply.
The cathode roll 32 in the plating treatment (copper plating range in fig. 1) in the post-process of the present embodiment is disposed at a position of about 200mm in front of the plating tank 34. This is because the electrical resistance of the long sheet 18 on which the nickel metal film has been formed is reduced by the strike plating treatment in the preceding process, and therefore the distance between the cathode roll 32 and the plating bath 34 does not need to be shortened. In addition, the structure of the plating treatment in the subsequent process is not limited in any way.
In addition, as shown in fig. 1, in the present embodiment, 2 or more plating tanks (strike) 24 are provided, and 2 or more post-process plating tanks 34 are also provided. Further, a power source 26 is disposed in each plating tank (strike) 24, and the anodes 22 are connected to return wires of the cathode rolls 16. In the post-process plating tank 34, a power supply is also provided, and the anodes are connected to return leads of the driven cathode roll 32, respectively, but are omitted in this figure. In the two cathode rolls 16 shown in the figure, the cathode roll 16 on the upstream side is not connected to the power supply 26, but is naturally connected.
As shown in fig. 6, in the conventional plating apparatus, the return leads of the cathode rolls 54 corresponding to the respective plating tanks 50 are connected to one conductive rod 52 connected to an external rectifier (not shown), and the anodes 56 are connected to the respective rectifiers. In the case of such a configuration, the electric power supplied from each rectifier to each anode 56 tends to flow to a portion having a low downstream resistance, and the electric power varies, so that various problems arise in the adhesion of copper to the long-sized sheet on which the nickel metal coating is formed upstream.
On the other hand, as in the present embodiment, since the return leads of the cathode roll 16 and the anode 22 of each plating tank (strike) 24 and post-process plating tank 34 are individually connected to the power sources 26, the appropriate power supply can be performed without generating power unevenness, and the adhesion of copper to the nickel metal film-formed long sheet 18 is improved.
Next, as shown in fig. 5, the plating device 10 according to the present embodiment is provided with a pressing mechanism 30, and the pressing mechanism 30 presses the long sheet 18 against the cathode roller 16 from the upper side and the lower side, respectively, to increase the contact area between the long sheet 18 and the cathode roller 16. By increasing the contact area between the long sheet 18 and the cathode roller 16, the power supply from the cathode roller 16 can be performed more appropriately.
Specifically, the pressing mechanism 30 is configured by a cylinder 58 and a pressing roller 60, and the upstream cathode roller 16 is configured by driving the cylinder 58 so as to press the long sheet 18 to the cathode roller 16 from above by the pressing roller 60. The downstream cathode roller 16 is driven by the cylinder 58 to press the long sheet 18 from below to the cathode roller 16 by the pressing roller 60. Further, by providing the cathode roller 16 with elasticity, the contact area between the long sheet 18 and the cathode roller 16 can be further increased, and the foreign matter involved in pressing and the scratch of the long sheet 18 due to friction can be suppressed from occurring. Further, it is preferable that the pressing roller 60 also have elasticity.
Next, as shown in fig. 2(a), the plating device 10 according to the present embodiment is a mechanism that rotates with the conveyance of the long sheet 18 due to frictional resistance between the cathode roller 16 and the long sheet 18 without applying a rotational driving force to the cathode roller 16. With this configuration, even in the extremely thin long sheet 18, the possibility of a failure occurring in the seed layer of the long sheet 18 or the underlying metal film during conveyance can be reduced to a very low level. In the plating process in the subsequent process of the present embodiment, as shown in fig. 2(b), a rotational driving force is applied to the driven cathode roller 32, which is one of the conveyance powers of the long sheet 18. In addition, the structure of the plating treatment in the subsequent process is not limited in any way.
In the plating apparatus 10 of the present embodiment, as shown in fig. 3, the cathode roller 16 is configured to supply power to the elongated sheet 18 in a predetermined range (power supply range 28) at both ends. In a general roll plating apparatus, when a long sheet is separated from a cathode roll which is mostly configured as a power supply range, sparks are generated, and a plurality of pinholes are generated in the surface of the long sheet.
However, if the configuration is such that the long sheet 18 is fed only in the predetermined range (feeding range 28) at both ends as in the present embodiment, sparks are not generated in important portions of the long sheet 18, and as a result, the plating process for the long sheet 18 of high quality can be performed. In the present embodiment, the power feeding ranges 28 are each set to a range of about 10mm from the end. For reference, fig. 4(a) discloses a state of pinholes occurring in the surface of a long sheet in a general roll plating apparatus, and fig. 4(b) discloses a state of pinholes occurring in the surface of a long sheet in the plating apparatus in the present embodiment.
Description of the reference numerals
10 plating device
12 roll out side roller
14 take-up side roll
16 cathode roll
18 strip-shaped sheet
20 plating solution
22 anode
24 coating tank (strike)
26 power supply
28 supply range
30 pressing mechanism
32-drive type cathode roll
34 post-process plating tank
50 plating tank
52 conductive rod
54 cathode roll
56 anode
58 cylinder
60 pressing roller shaft
Claims (8)
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2018/046486 WO2020129145A1 (en) | 2018-12-18 | 2018-12-18 | Plating apparatus and plating method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN113015824A true CN113015824A (en) | 2021-06-22 |
Family
ID=71102279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880099461.5A Pending CN113015824A (en) | 2018-12-18 | 2018-12-18 | Plating apparatus and plating method |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2020129145A1 (en) |
| KR (1) | KR20210103460A (en) |
| CN (1) | CN113015824A (en) |
| TW (1) | TW202024402A (en) |
| WO (1) | WO2020129145A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114574909A (en) * | 2022-02-24 | 2022-06-03 | 江阴纳力新材料科技有限公司 | Conductive device for coating and coating machine |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5824513B2 (en) | 1977-01-14 | 1983-05-21 | 日新製鋼株式会社 | electroplating equipment |
| US4549950A (en) * | 1984-11-13 | 1985-10-29 | Olin Corporation | Systems for producing electroplated and/or treated metal foil |
| JPH0730480B2 (en) | 1987-01-26 | 1995-04-05 | 三菱重工業株式会社 | Continuous electroplating equipment for steel strip |
| JPH093691A (en) * | 1995-06-23 | 1997-01-07 | Murata Mfg Co Ltd | Plating device |
| JP5214898B2 (en) * | 2006-03-29 | 2013-06-19 | 東レ株式会社 | FEEDING METHOD, CONTINUOUS ELECTROLYTIC PLATING APPARATUS FOR WEB, AND METHOD FOR PRODUCING PLASTIC FILM WITH PLATING FILM |
| US20070227633A1 (en) * | 2006-04-04 | 2007-10-04 | Basol Bulent M | Composition control for roll-to-roll processed photovoltaic films |
| JP5115981B2 (en) * | 2008-08-14 | 2013-01-09 | 新日鉄住金化学株式会社 | Method for manufacturing circuit wiring board |
| JP2013087324A (en) * | 2011-10-18 | 2013-05-13 | Nippon Steel & Sumikin Chemical Co Ltd | Localized surface plasmon resonance sensor unit and method for producing the same |
-
2018
- 2018-12-18 JP JP2020560671A patent/JPWO2020129145A1/en active Pending
- 2018-12-18 KR KR1020217014016A patent/KR20210103460A/en not_active Withdrawn
- 2018-12-18 CN CN201880099461.5A patent/CN113015824A/en active Pending
- 2018-12-18 WO PCT/JP2018/046486 patent/WO2020129145A1/en active Application Filing
-
2019
- 2019-12-16 TW TW108146025A patent/TW202024402A/en unknown
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114574909A (en) * | 2022-02-24 | 2022-06-03 | 江阴纳力新材料科技有限公司 | Conductive device for coating and coating machine |
| WO2023160642A1 (en) * | 2022-02-24 | 2023-08-31 | 江阴纳力新材料科技有限公司 | Conductive device for film plating and film plating machine |
| WO2023159785A1 (en) * | 2022-02-24 | 2023-08-31 | 江阴纳力新材料科技有限公司 | Conductive apparatus for coating and coating machine |
| CN114574909B (en) * | 2022-02-24 | 2025-02-14 | 江阴纳力新材料科技有限公司 | Conductive device for coating and coating machine |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20210103460A (en) | 2021-08-23 |
| TW202024402A (en) | 2020-07-01 |
| JPWO2020129145A1 (en) | 2021-11-04 |
| WO2020129145A1 (en) | 2020-06-25 |
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