CN113011237A - Optical fingerprint device and manufacturing method thereof - Google Patents
Optical fingerprint device and manufacturing method thereof Download PDFInfo
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- CN113011237A CN113011237A CN202010119435.3A CN202010119435A CN113011237A CN 113011237 A CN113011237 A CN 113011237A CN 202010119435 A CN202010119435 A CN 202010119435A CN 113011237 A CN113011237 A CN 113011237A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1324—Sensors therefor by using geometrical optics, e.g. using prisms
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Abstract
本发明提供一种光学指纹器件及其制造方法，包括提供图像传感器晶圆，所述图像传感器晶圆上形成有内部焊盘；在所述图像传感器晶圆上设置透光层；在所述透光层上设置外部焊盘，所述外部焊盘与内部焊盘电学连通；从而解决了现有技术通过刻蚀工艺打开焊盘效率低下的问题，提高了生产效率，增加了产能，降低了制造成本。
The present invention provides an optical fingerprint device and a manufacturing method thereof, including providing an image sensor wafer on which an internal pad is formed; disposing a light-transmitting layer on the image sensor wafer; An external pad is arranged on the optical layer, and the external pad is electrically connected to the internal pad; thus, the problem of low efficiency of opening the pad through the etching process in the prior art is solved, the production efficiency is improved, the production capacity is increased, and the manufacturing cost.
Description
Technical Field
The invention relates to an optical fingerprint device and a manufacturing method thereof.
Background
The current fingerprint identification schemes include optical technology, silicon technology (capacitive/radio frequency type), ultrasonic technology, etc. Among them, the optical fingerprint recognition technology has been widely used in portable electronic devices.
The optical fingerprint recognition technology adopts an optical image capturing device based on the total reflection principle (FTIR) of light. The light strikes the surface of the light-transmitting layer (such as organic or inorganic glass) pressed with a fingerprint, the reflected light is obtained by the image sensor, and the amount of the reflected light depends on the depth of ridges and valleys of the fingerprint pressed on the surface of the glass, and the grease and moisture between the skin and the glass. The light is reflected to the image sensor by the interface between the glass and the air after the light is emitted to the center of the valley through the glass, and the light emitted to the ridge is not reflected by the total reflection but is absorbed by the contact surface between the ridge and the glass or reflected to other center in a diffused manner, so that the image of the fingerprint is formed on the image sensor.
Since a microlens with a larger size is required to increase the energy of incident light and achieve higher image quality, in the prior art, it is often necessary to provide a thicker light-transmitting layer (above 50 μm) above the pixel units and a thicker light-blocking structure (for example, 15-50 μm) between the pixel units in order to solve the problem that the incident light enters the adjacent pixel units of the image sensor to cause signal crosstalk, and improve the optical performance of the optical fingerprint device. It should be noted that the light-transmitting layer and the light-blocking structure need to avoid the pad region of the image sensor, so as not to affect the electrical connection performance of the pad region.
Fig. 1 and 2 show a manufacturing method of an optical fingerprint device in the prior art, wherein a pixel unit 101 and a pad 102 are formed on an image sensor wafer 100, after a light blocking structure 103 is formed on a surface of the image sensor wafer 100, a light transmitting layer 104 is disposed on the light blocking structure 103, and the light blocking structure 103 and the light transmitting layer 104 corresponding to the pad 102 are removed by a dry etching process, so that the pad 102 is exposed, and the pad 102 is electrically connected to an external power source. However, the dry etching can only remove 5-10 μm of the thickness at one time, and each removal of 1 μm generally requires 0.5-1 minute, so the removal efficiency is low, the throughput is very limited, and the manufacturing cost is increased.
Disclosure of Invention
The invention aims to provide an optical fingerprint device and a manufacturing method thereof, which can improve the production efficiency, increase the productivity and reduce the manufacturing cost.
In view of the above, one aspect of the present invention provides a method for manufacturing an optical fingerprint device, including the steps of: s100: providing an image sensor wafer, wherein an inner bonding pad is formed on the image sensor wafer; s200: arranging a light transmitting layer on the image sensor wafer; s300: an external bonding pad is arranged on the euphotic layer and is electrically communicated with the internal bonding pad; thereby forming the optical fingerprint device.
Preferably, a metal layer for connecting the external pad and the internal pad is formed in the light-transmitting layer.
Preferably, a contact hole is formed in the light-transmitting layer by a laser drilling method, and the metal layer is filled in the contact hole.
Preferably, the contact hole reaching the surface of the inner pad is directly formed by laser drilling.
Preferably, a contact hole with the depth not reaching the surface of the internal bonding pad is formed by adopting a laser drilling mode, and then the depth of the contact hole is enlarged by adopting an etching mode until the contact hole reaches the surface of the internal bonding pad.
Preferably, a groove is formed in the light-transmitting layer by adopting a mechanical cutting mode, and the surface of the groove is covered with the metal layer.
Preferably, the metal layer is isolated from the image sensor wafer by an insulating layer.
Preferably, a light blocking structure is arranged between the image sensor wafer and the light transmitting layer, and the metal layer penetrates through the light blocking structure.
Preferably, an infrared cut filter is arranged between the image sensor wafer and the light transmitting layer, and the metal layer penetrates through the infrared cut filter.
Preferably, the method further includes providing a microlens on the light-transmitting layer.
Another aspect of the present invention provides an optical fingerprint device, including: an image sensor wafer having an internal pad formed thereon; a light-transmitting layer arranged on the image sensor wafer; an outer pad disposed on the light transmissive layer, the outer pad in electrical communication with the inner pad.
Preferably, the optical fingerprint device further includes a metal layer formed in the light-transmissive layer for connecting the external pad and the internal pad.
Preferably, the optical fingerprint device further includes a contact hole formed in the light-transmitting layer and filled with the metal layer.
Preferably, the optical fingerprint device further includes a groove formed in the light-transmitting layer and covered with the metal layer.
Preferably, the optical fingerprint device further comprises an insulating layer for isolating the metal layer from the image sensor wafer.
Preferably, the optical fingerprint device further includes a light blocking structure disposed between the image sensor wafer and the light transmissive layer, and the metal layer passes through the light blocking structure.
Preferably, the optical fingerprint device further includes an infrared cut filter film disposed between the image sensor wafer and the light-transmitting layer, and the metal layer penetrates through the infrared cut filter film
Preferably, the optical fingerprint device further comprises a micro lens disposed on the light-transmitting layer.
The invention relates to an optical fingerprint device and a manufacturing method thereof, which comprises the steps of providing an image sensor wafer, wherein an internal bonding pad is formed on the image sensor wafer; arranging a light transmitting layer on the image sensor wafer; an external bonding pad is arranged on the euphotic layer and is electrically communicated with the internal bonding pad; therefore, the problem that the efficiency of opening the bonding pad through an etching process is low in the prior art is solved, the production efficiency is improved, the productivity is increased, and the manufacturing cost is reduced.
Drawings
Other features, objects and advantages of the present invention will become more apparent from the following detailed description of non-limiting embodiments thereof, which proceeds with reference to the accompanying drawings.
FIGS. 1-2 are process schematic diagrams of a prior art optical fingerprint device manufacturing method;
3-5 are process schematic diagrams of a method of manufacturing an optical fingerprint device according to a preferred embodiment of the present invention;
fig. 6-10 are process diagrams of a method for manufacturing an optical fingerprint device according to another preferred embodiment of the present invention.
In the drawings, like or similar reference numbers indicate like or similar devices (modules) or steps throughout the different views.
Detailed Description
In order to solve the problems in the prior art, the invention provides an optical fingerprint device and a manufacturing method thereof, wherein the optical fingerprint device comprises an image sensor wafer, an inner bonding pad and a second bonding pad, wherein the image sensor wafer is provided with the inner bonding pad; arranging a light transmitting layer on the image sensor wafer; an external bonding pad is arranged on the euphotic layer and is electrically communicated with the internal bonding pad; therefore, the problem that the efficiency of opening the bonding pad through an etching process is low in the prior art is solved, the production efficiency is improved, the productivity is increased, and the manufacturing cost is reduced.
In the following detailed description of the preferred embodiments, reference is made to the accompanying drawings which form a part hereof. The accompanying drawings illustrate, by way of example, specific embodiments in which the invention may be practiced. The illustrated embodiments are not intended to be exhaustive of all embodiments according to the invention. It is to be understood that other embodiments may be utilized and structural or logical changes may be made without departing from the scope of the present invention. The following detailed description, therefore, is not to be taken in a limiting sense, and the scope of the present invention is defined by the appended claims.
The present invention will be described in detail with reference to specific examples.
One aspect of the present invention provides a method of manufacturing an optical fingerprint device, including the steps of: s100: providing an image sensor wafer, wherein an inner bonding pad is formed on the image sensor wafer; s200: arranging a light transmitting layer on the image sensor wafer; s300: an external bonding pad is arranged on the euphotic layer and is electrically communicated with the internal bonding pad; thereby forming the optical fingerprint device.
Example one
Fig. 3-5 are process diagrams of a method for manufacturing an optical fingerprint device according to a preferred embodiment of the present invention.
Referring to fig. 3, an image sensor wafer 200 is provided, wherein a pixel unit 201 and an inner pad 202 are formed on the image sensor wafer 200; an optically transparent layer 204 is disposed over the image sensor wafer 200. An infrared cut filter 210 and a light blocking structure 203 are disposed between the image sensor wafer 200 and the light transmissive layer 204. Preferably, the microlenses 205 are disposed on the light-transmitting layer 204, and further preferably, a light-blocking layer (not shown) formed of, for example, a black glue material may be further formed between the microlenses 205, so as to further reduce signal interference caused by light crosstalk.
Referring to fig. 4, a contact hole 208 is formed in the light-transmitting layer 203 by laser drilling, and in a case where the infrared cut filter 210 and the light-blocking structure 203 are present between the image sensor wafer 200 and the light-transmitting layer 203, the contact hole 208 penetrates through the infrared cut filter 210 and the light-blocking structure 203. Specifically, the contact hole 208 reaching the surface of the internal pad 202 may be formed directly by laser drilling, or the contact hole 208 not reaching the surface of the internal pad 202 may be formed by laser drilling, and then the contact hole 208 may be enlarged by etching until reaching the surface of the internal pad 202.
Referring to fig. 5, a metal layer 207 (e.g., copper nickel gold) is filled in the contact hole 208 by sputtering, electroplating or chemical plating, an external pad 206 is disposed on the transparent layer 204, and the metal layer 207 passes through the infrared cut-off filter 210, the light blocking structure 203 and the transparent layer 204 to electrically connect the external pad 206 and the internal pad 202, so as to electrically connect the external pad 206 and an external power source, thereby solving the problem of low efficiency of pad opening by an etching process in the prior art, improving production efficiency, increasing productivity, and reducing manufacturing cost.
Another aspect of the present invention provides an optical fingerprint device, referring to fig. 5, including: an image sensor wafer 200, an inner pad 202 formed on the image sensor wafer 200; a transparent layer 204 disposed on the image sensor wafer 200; an outer pad 206 disposed on the optically transparent layer 204. The contact hole 208 formed in the light transmissive layer 204 is filled with a metal layer 207, and the metal layer 207 electrically connects the external pad 206 with the internal pad 202 so as to be electrically connected to an external power source through the external pad 206.
Preferably, the optical fingerprint device further includes an infrared cut filter 210 and a light blocking structure 203 disposed between the image sensor wafer 200 and the light transmissive layer 204, and the metal layer 207 passes through the infrared cut filter 210 and the light blocking structure 203.
Preferably, the optical fingerprint device further includes microlenses 205 disposed on the light transmissive layer 204 and light blocking layers (not shown) disposed between the microlenses 205.
Example two
Fig. 6-10 are process diagrams of a method for manufacturing an optical fingerprint device according to another preferred embodiment of the present invention.
Referring to fig. 6, an image sensor wafer 300 is provided, wherein pixel units 301 and inner pads 302 are formed on the image sensor wafer 300; a transparent layer 304 is disposed on the image sensor wafer 300. An infrared cut filter 310 and a light blocking structure 303 are disposed between the image sensor wafer 300 and the light transmissive layer 304. Preferably, the microlenses 305 are disposed on the light-transmitting layer 304, and further preferably, a light-blocking layer (not shown) formed of, for example, a black glue material may be further formed between the microlenses 305, so as to further reduce signal interference caused by light crosstalk.
Referring to fig. 7, a groove 308 is formed in the light-transmitting layer 304 in a region near a scribe line (not shown) by mechanical cutting, and in a case where the infrared cut filter 310 and the light blocking structure 303 are present between the image sensor wafer 300 and the light-transmitting layer 304, the groove 308 passes through the infrared cut filter 310 and the light blocking structure 303. Due to process limitations of mechanical dicing, the grooves 308 typically penetrate and damage the surface of the image sensor wafer 300.
Referring to fig. 8, the surface of the groove 308 is covered with an insulating layer 309.
Referring to fig. 9, the insulating layer 309 on the sidewall of the groove 308 is cut and removed by mechanical cutting, and the insulating layer 309 on the bottom of the groove 308 is remained.
Referring to fig. 10, a metal layer 307 is covered on the surface of the groove 308 by sputtering, electroplating or chemical plating, an insulating layer 309 remaining at the bottom of the groove 308 is used for isolating the metal layer 307 from the image sensor wafer 300, an external pad 306 is disposed on the light transmitting layer 304, the metal layer 307 passes through the infrared cut filter 310, the light blocking structure 303 and the light transmitting layer 304, and the external pad 306 is electrically connected to the internal pad 302 so as to be electrically connected to an external power source through the external pad 306, thereby solving the problem of low efficiency of pad opening by an etching process in the prior art, improving production efficiency, increasing productivity, and reducing manufacturing cost.
In addition, in other embodiments not shown, an insulating layer may be further covered on the metal layer 307 to protect and isolate the metal layer 307.
Another aspect of the present invention provides an optical fingerprint device, referring to fig. 10, including: an image sensor wafer 300 having internal pads 302 formed on the image sensor wafer 200; a transparent layer 304 disposed on the image sensor wafer 300; an outer pad 306 disposed on the optically transparent layer 304. The surface of the recess 308 formed in the light transmissive layer 304 is covered with a metal layer 307, the metal layer 307 is isolated from the image sensor wafer 300 by an insulating layer 309, and the metal layer 307 electrically connects the external pad 306 and the internal pad 302 so as to be electrically connected to an external power source through the external pad 306.
Preferably, the optical fingerprint device further includes an infrared cut filter 310 and a light blocking structure 303 disposed between the image sensor wafer 300 and the light transmissive layer 304, and the metal layer 307 passes through the infrared cut filter 310 and the light blocking structure 303.
Preferably, the optical fingerprint device further includes microlenses 305 disposed on the light-transmissive layer 304 and light-blocking layers (not shown) disposed between the microlenses 305.
In summary, the optical fingerprint device and the manufacturing method thereof of the present invention include providing an image sensor wafer, wherein an inner pad is formed on the image sensor wafer; arranging a light transmitting layer on the image sensor wafer; an external bonding pad is arranged on the euphotic layer and is electrically communicated with the internal bonding pad; therefore, the problem that the efficiency of opening the bonding pad through an etching process is low in the prior art is solved, the production efficiency is improved, the productivity is increased, and the manufacturing cost is reduced.
It will be evident to those skilled in the art that the invention is not limited to the details of the foregoing illustrative embodiments, and that the present invention may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are, therefore, to be considered in all respects as illustrative and not restrictive. Furthermore, it will be obvious that the word "comprising" does not exclude other elements or steps, and the word "a" or "an" does not exclude a plurality. Several elements recited in the apparatus claims may also be implemented by one element. The terms first, second, etc. are used to denote names, but not any particular order.
Claims (18)
1. A method of manufacturing an optical fingerprint device, comprising the steps of:
s100: providing an image sensor wafer, wherein an inner bonding pad is formed on the image sensor wafer;
s200: arranging a light transmitting layer on the image sensor wafer;
s300: an external bonding pad is arranged on the euphotic layer and is electrically communicated with the internal bonding pad;
thereby forming the optical fingerprint device.
2. The method of manufacturing an optical fingerprint device according to claim 1, wherein a metal layer for connecting the external pad and the internal pad is formed in the light transmissive layer.
3. The method of claim 2, wherein a contact hole is formed in the light-transmissive layer by laser drilling, and the metal layer is filled in the contact hole.
4. The method of claim 3, wherein the contact hole is formed directly to a depth reaching the surface of the inner pad by laser drilling.
5. The method of claim 3, wherein the contact hole is formed by laser drilling to a depth not reaching the surface of the inner pad, and then the contact hole is etched to a depth that reaches the surface of the inner pad.
6. The method for manufacturing the optical fingerprint device according to claim 2, wherein a groove is formed in the light-transmitting layer by mechanical cutting, and the surface of the groove is covered with the metal layer.
7. The method of claim 6, wherein the metal layer is separated from the image sensor wafer by an insulating layer.
8. The method of claim 2, wherein a light blocking structure is disposed between the image sensor wafer and the light transmissive layer, and the metal layer passes through the light blocking structure.
9. The method of claim 2, wherein an infrared cut filter is disposed between the image sensor wafer and the light transmissive layer, and the metal layer passes through the infrared cut filter.
10. The method of claim 1, further comprising disposing a microlens on the light transmissive layer.
11. An optical fingerprint device, comprising:
an image sensor wafer having an internal pad formed thereon;
a light-transmitting layer arranged on the image sensor wafer;
an outer pad disposed on the light transmissive layer, the outer pad in electrical communication with the inner pad.
12. The optical fingerprint device of claim 11, further comprising a metal layer formed in the optically transmissive layer for connecting the external pad and the internal pad.
13. The optical fingerprint device of claim 12, further comprising a contact hole formed in the light transmissive layer and filled with the metal layer.
14. The optical fingerprint device of claim 12, further comprising a groove formed in the light transmissive layer and covered with the metal layer.
15. The optical fingerprint device of claim 14, further comprising an insulating layer to isolate the metal layer from the image sensor wafer.
16. The optical fingerprint device of claim 12, further comprising a light blocking structure disposed between the image sensor wafer and the light transmissive layer, the metal layer passing through the light blocking structure.
17. The optical fingerprint device of claim 12, further comprising an infrared cut filter disposed between the image sensor wafer and the light transmissive layer, the metal layer passing through the infrared cut filter.
18. The optical fingerprint device of claim 11, further comprising a microlens disposed on the light transmissive layer.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911314195 | 2019-12-19 | ||
| CN2019113141956 | 2019-12-19 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN113011237A true CN113011237A (en) | 2021-06-22 |
| CN113011237B CN113011237B (en) | 2025-04-18 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113128279A (en) * | 2019-12-31 | 2021-07-16 | 格科微电子（上海）有限公司 | Optical fingerprint device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100832895B1 (en) * | 2006-12-05 | 2008-05-28 | 삼성전기주식회사 | Chip on glass package, method of manufacturing the same, and a camera module including the same |
| US20090309179A1 (en) * | 2008-06-13 | 2009-12-17 | Phoenix Precision Technology Corporation | Package substrate having embedded photosensitive semiconductor chip and fabrication method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113128279A (en) * | 2019-12-31 | 2021-07-16 | 格科微电子（上海）有限公司 | Optical fingerprint device |
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