CN113009309B - Life aging device for light emitting device - Google Patents
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- CN113009309B CN113009309B CN202110216993.6A CN202110216993A CN113009309B CN 113009309 B CN113009309 B CN 113009309B CN 202110216993 A CN202110216993 A CN 202110216993A CN 113009309 B CN113009309 B CN 113009309B
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- 230000032683 aging Effects 0.000 title claims abstract description 59
- 230000017525 heat dissipation Effects 0.000 claims abstract description 43
- 230000007246 mechanism Effects 0.000 claims abstract description 20
- 239000004065 semiconductor Substances 0.000 claims description 28
- 239000012530 fluid Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 claims description 9
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 5
- 229910045601 alloy Inorganic materials 0.000 claims description 5
- 239000000956 alloy Substances 0.000 claims description 5
- 229910002804 graphite Inorganic materials 0.000 claims description 5
- 239000010439 graphite Substances 0.000 claims description 5
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 150000002739 metals Chemical class 0.000 claims description 4
- 238000012544 monitoring process Methods 0.000 claims description 3
- 238000007599 discharging Methods 0.000 claims description 2
- 238000009826 distribution Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000001816 cooling Methods 0.000 description 10
- 239000003507 refrigerant Substances 0.000 description 10
- 238000010586 diagram Methods 0.000 description 8
- 230000000694 effects Effects 0.000 description 4
- 238000005338 heat storage Methods 0.000 description 4
- 238000009529 body temperature measurement Methods 0.000 description 3
- 230000002349 favourable effect Effects 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000013461 design Methods 0.000 description 2
- 230000003679 aging effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000010408 film Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000005057 refrigeration Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000009827 uniform distribution Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2607—Circuits therefor
- G01R31/2632—Circuits therefor for testing diodes
- G01R31/2635—Testing light-emitting diodes, laser diodes or photodiodes
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- G—PHYSICS
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- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/26—Testing of individual semiconductor devices
- G01R31/2642—Testing semiconductor operation lifetime or reliability, e.g. by accelerated life tests
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Abstract
An embodiment of the present invention provides a lifetime aging apparatus for a light emitting device, including: a chassis for supporting a display panel including the light emitting device and absorbing heat generated from the light emitting device; and the heat dissipation mechanism is used for dissipating heat of the base. According to the life aging device provided by the embodiment of the invention, through the matching of the base and the heat dissipation mechanism, heat generated by the light emitting device can be dissipated in the life aging process of the light emitting device in the display panel supported by the base, so that the yield of the display panel is improved.
Description
Technical Field
The embodiment of the invention relates to the technical field of display, in particular to a service life aging device of a light-emitting device.
Background
In an Organic Light-Emitting Diode (OLED) display panel, the internal Light-Emitting devices usually fluctuate in brightness during the initial stage of lighting. Fig. 1 is a schematic diagram of the luminance variation of the light emitting device, as shown in fig. 1, the luminance is embodied as that the luminance is increased first, then decreased sharply, and finally naturally decayed with a nearly linear variation trend. In order to solve the problem that the color shift and color distortion of the light emitting device occur due to the brightness fluctuation of the light emitting device at the initial stage of lighting, the life-Aging (L-Aging) is usually performed on the light emitting device inside the OLED display panel before the OLED display panel leaves the factory. Specifically, the lifetime degradation is high-luminance lighting of the light emitting device at a certain temperature for a certain time and a certain current density. In general, typical temperatures for lifetime aging are room temperature, typical times are 5 to 10min, and typical current densities are 50 to 150mA/cm 2 . Fig. 2 is a diagram illustrating a luminance change of the light emitting device after the lifetime aging is completed, as shown in fig. 2, the luminance naturally decays with a nearly linear change trend. However, no matter the lifetime of the light emitting device inside the OLED display panel is aged in the Cell (Cell) stage or the Module assembly (Module) stage, a large amount of heat is generated at the power input end of the OLED display panel, which causes the overall temperature of the display panel to be too high, and affects the yield of the display panel.
Disclosure of Invention
Therefore, there is a need to provide a lifetime aging apparatus for a light emitting device, which is used to solve the problem that the lifetime aging process of the conventional light emitting device causes a low yield of a display panel including the light emitting device.
An embodiment of the present invention provides a lifetime aging apparatus for a light emitting device, including:
a chassis for supporting a display panel including the light emitting device and absorbing heat generated from the light emitting device;
and the heat dissipation mechanism is used for dissipating heat of the base.
In some embodiments, the base comprises a first section proximate to a power input of the display panel and a second section distal to the power input; wherein the heat dissipation speed of the first section is higher than that of the second section.
In some embodiments, the material of the base is any one or a combination of metals, alloys, and graphite.
In some embodiments, the thickness of the first section is greater than the thickness of the second section.
In some embodiments, the heat dissipation mechanism is a heat dissipation layer disposed on a side of the first segment away from the light emitting device.
In some embodiments, the heat dissipation layer is a semiconductor chilling plate, and a first temperature sensor and a controller electrically connected with the first temperature sensor and the semiconductor chilling plate are arranged inside the first section; the first temperature sensor is used for monitoring the temperature of the first section and sending the temperature of the first section to the controller; the controller is used for controlling the semiconductor chilling plate to work when the temperature of the first section is larger than a first preset threshold value.
In some embodiments, the second section is internally provided with a second temperature sensor electrically connected with the controller; wherein the second temperature sensor is configured to monitor a temperature of the second section and send the temperature of the second section to the controller; the controller is further used for controlling the semiconductor chilling plate to work when the difference value between the temperature of the first section and the temperature of the second section is larger than a second preset threshold value.
In some embodiments, the heat dissipation layer is further disposed on a side of the second segment away from the light emitting device.
In some embodiments, a pipe is disposed inside the base, a head end of the pipe is configured to receive externally injected refrigerant fluid, and a tail end of the pipe is configured to discharge the refrigerant fluid, and the refrigerant fluid cools the base while flowing through the pipe.
In some embodiments, the heat dissipation mechanism further comprises a fan or an air conditioner.
The life aging device provided by the embodiment of the invention comprises a base and a heat dissipation mechanism, wherein the base is used for supporting a display panel containing the light-emitting device and absorbing heat generated by the light-emitting device, the heat dissipation mechanism is used for dissipating heat of the base, and the heat generated by the light-emitting device can be dissipated in the life aging process of the light-emitting device in the display panel supported by the base through the matching of the base and the heat dissipation mechanism, so that the yield of the display panel is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic view illustrating a variation in luminance of a light emitting device;
fig. 2 is a schematic view showing a change in luminance after the light emitting device has finished aging in lifetime;
fig. 3 is a schematic structural diagram of a lifetime aging apparatus according to an embodiment of the present invention;
FIG. 4 is a cross-sectional view of the base along line I-I of the aging apparatus shown in FIG. 3;
FIG. 5 is a sectional view of the base and the heat dissipating mechanism of the aging apparatus shown in FIG. 3, taken along line II-II;
FIG. 6 is a schematic top view of a lifetime aging apparatus according to an embodiment of the present invention;
FIG. 7 is a cross-sectional view of the life aging apparatus shown in FIG. 6 taken along the line III-III;
FIG. 8 is a schematic diagram of a lifetime aging apparatus according to another embodiment of the present invention;
FIG. 9 is a cross-sectional view of the life aging apparatus shown in FIG. 8 taken along the line IV-IV;
fig. 10 is a schematic diagram of the pipes uniformly distributed in the base of the life aging device according to the embodiment of the present invention.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention. It is to be understood that the embodiments described are only a few embodiments of the present invention, and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Fig. 3 is a schematic structural diagram of a lifetime aging apparatus according to an embodiment of the present invention, as shown in fig. 3, the lifetime aging apparatus is configured to perform high-brightness lighting on a light emitting device in a display panel to complete lifetime aging. Specifically, the life aging apparatus includes a base 10 and a heat dissipation mechanism (not shown in fig. 3). The base 10 is used for supporting a display panel including a light emitting device and absorbing heat generated by the light emitting device in the life aging process of the light emitting device, and the heat dissipation mechanism is used for dissipating heat of the base 10, so that the overall temperature of the display panel is reduced, and the yield of the display panel is improved. It should be noted that the heat dissipation mechanism may be a semiconductor cooling plate, a water cooling pipeline, a fan, an air conditioner, or the like, which is not specifically limited in this embodiment of the present invention, and hereinafter, the lifetime aging apparatus having different heat dissipation mechanisms will be specifically described separately.
Before specifically describing the lifetime aging apparatus having different heat dissipation mechanisms, the base 10 in the lifetime aging apparatus will be described first. Fig. 4 is a cross-sectional view of the base along the line I-I in the lifetime aging apparatus shown in fig. 3, and as shown in fig. 4, the base 10 of the lifetime aging apparatus includes a first section 101 and a second section 102, wherein the first section 101 is a section of the base 10 close to the power input end of the display panel, i.e., a section corresponding to the near end of the power input end of the display panel, and the second section 102 is a section of the base 10 far away from the power input end of the display panel, i.e., a section corresponding to the far end of the power input end of the display panel. The heat dissipation speed of the first section 101 is higher than that of the second section 102.
When the life of the light emitting device is deteriorated, a large amount of heat is generated at the power input terminal of the display panel, which increases the temperature of the power input terminal. On one hand, when the temperature of the power input terminal is high (e.g. 50-100 ℃), the near end of the power input terminal and the far end of the power input terminal will generate temperature difference, for driving Thin Film Transistors (TFTs), the driving TFTs in different sections will flow large current at different temperatures, which will cause difference of threshold voltage, and when the compensation technology is not enough to compensate, the display quality of the display panel will be affected; since the aging conditions of the light emitting devices include temperature, time and current density, the aging effect of the light emitting devices in different sections at different temperatures is different, which also affects the display quality of the display panel. On the other hand, when the temperature of the power input terminal is too high (e.g., >100 ℃), the film layer near the power input terminal may be damaged, which may affect the yield of the display panel.
In order to solve the above problem, the embodiment of the invention designs two sections with different heat dissipation speeds, namely the first section 101 with the highest heat dissipation speed and the second section 102 with the second highest heat dissipation speed to form the base 10, so that the design is favorable for cooling the near end of the power input end, and is favorable for reducing the temperature difference between the near end of the power input end and the far end of the power input end, thereby improving the display quality and yield of the display panel.
In some embodiments, the material of the base 10 is any one or combination of metals, alloys, and graphite. Specifically, the metal, the alloy and the graphite are all materials with large specific heat capacities, and under the condition of the same thickness, the larger the specific heat capacity of the materials is, the better the heat storage effect is, therefore, in the embodiment of the invention, the base 10 is made of the materials with the large specific heat capacities, so that the base 10 can achieve the better heat storage effect under the condition of fixed thickness, and the heat generated by the light-emitting device can be better absorbed.
In some embodiments, as shown in fig. 4, the thickness of the first section 101 is greater than the thickness of the second section 102 in the base 10. For example, the thickness of the base 10 gradually decreases in the direction from the first section 101 to the second section 102. Specifically, in the case of the same material, the larger the thickness of the material is, the better the heat storage effect is. Therefore, the thickness of the first section 101 is greater than that of the second section 102 in the embodiment of the present invention, and under the condition that the materials of the first section 101 and the second section 102 are the same, the heat storage effect of the first section 101 is better than that of the second section 102, so that the first section 101 can better absorb the heat generated by the light emitting device at the near end of the power input end.
Fig. 5 is a cross-sectional view of the whole assembly of the base and the heat dissipation mechanism in the lifetime aging apparatus shown in fig. 3 along the line II-II, as shown in fig. 5, the heat dissipation mechanism is a heat dissipation layer 40, and the heat dissipation layer 40 is disposed on the side of the first section 101 of the base 10 away from the light emitting device.
Specifically, the submount 10 serves to support a display panel including a light emitting device and absorb heat generated from the light emitting device during the lifetime aging of the light emitting device. The heat dissipation layer 40 has a heat transfer function, heat generated by the light emitting device at the near end of the power input end is absorbed by the first section 101 and transferred to the heat dissipation layer 40, and the heat dissipation layer 40 dissipates the heat into the air, thereby reducing the temperature at the near end of the power input end of the display panel. As the temperature near the power input is reduced, the difference between the temperature near the power input and the temperature far from the power input is also reduced. That is, the lifetime aging apparatus provided in the embodiment of the present invention can not only reduce the temperature of the near-end power input end of the display panel, but also reduce the temperature difference between the near-end power input end and the far-end power input end, thereby improving the display quality and yield of the display panel.
Fig. 6 is a schematic top view of a lifetime aging apparatus according to an embodiment of the present invention, fig. 7 is a cross-sectional view of the lifetime aging apparatus shown in fig. 6 taken along line III-III, as shown in fig. 6 and fig. 7, the heat dissipation layer 40 is a semiconductor chilling plate, the semiconductor chilling plate is disposed on a side of the first section 101 away from the light emitting device, the first section 101 is a hollow structure, and a first temperature sensor 301 and a controller 303 are disposed inside the first section 101, wherein the controller 303 is electrically connected to the first temperature sensor 301 and the semiconductor chilling plate, respectively.
It should be noted that the first temperature sensor 301 is configured to measure the temperature of the first section 101 and send the temperature of the first section 101 to the controller 303. The first temperature sensor 301 may be one or more, and if there is one first temperature sensor 301, it is preferably disposed at the center point of the first section 101; if there are a plurality of first temperature sensors 301, the plurality of first temperature sensors 301 are disposed at different positions in the first segment 101 for multi-point temperature measurement. The first temperature sensor 301 shown in fig. 6 and 7 is one.
If there is one first temperature sensor 301, the controller 303 receives the temperature of the first segment 101 sent by the first temperature sensor 301, and compares the temperature with a preset first preset threshold. It should be noted that the first preset threshold is an upper limit of the temperature at which the temperature of the near end of the power input end of the display panel does not need to be reduced, that is, if the temperature of the first segment 101 is less than or equal to the first preset threshold, it indicates that the temperature of the first segment 101 does not need to be reduced; if the temperature of the first section 101 is greater than the first preset threshold, it indicates that the first section 101 needs to be cooled, and at this time, the controller 303 controls the semiconductor chilling plate located in the first section 101 to operate to cool the first section 101, so as to cool the near end of the power input end of the display panel. Since the temperature near the power input is reduced, the difference between the temperature near the power input and the temperature far from the power input is also reduced. That is, the lifetime aging apparatus provided in the embodiment of the present invention can not only reduce the temperature of the near end of the power input end of the display panel, but also reduce the temperature difference between the near end of the power input end and the far end of the power input end, thereby improving the display quality and yield of the display panel. It should be noted that, a specific value of the first preset threshold may be set according to an actual situation, and this is not specifically limited in the embodiment of the present invention.
If there are a plurality of first temperature sensors 301, after receiving the temperatures sent by the plurality of first temperature sensors 301, the controller 303 may determine the temperature of the first segment 101 comprehensively through a preset program, for example, determine the highest value of the plurality of temperatures as the temperature of the first segment 101, or determine the average value of the plurality of temperatures as the temperature of the first segment 101, which is not particularly limited in the embodiment of the present invention. After determining the temperature of the first section 101, the controller 303 compares the temperature with a first preset threshold, and for the specific comparison process and the subsequent operations, please refer to the previous paragraph, which is not described herein again.
Fig. 8 is a schematic diagram of a lifetime aging apparatus according to another embodiment of the present invention, fig. 9 is a cross-sectional view of the lifetime aging apparatus shown in fig. 8 along a line IV-IV, as shown in fig. 8 and fig. 9, a heat dissipation layer 40 is a semiconductor chilling plate, the semiconductor chilling plate is disposed on a side of the first section 101 away from the light emitting device, the first section 101 and the second section 102 are both hollow structures, a first temperature sensor 301 and a controller 303 are disposed inside the first section 101, and a second temperature sensor 302 is disposed inside the second section 102, wherein the controller 303 is electrically connected to the first temperature sensor 301, the second temperature sensor 302 and the semiconductor chilling plate, respectively. It should be noted that in other embodiments, the controller 303 may also be disposed inside the second section 102.
It should be noted that the first temperature sensor 301 is used for measuring the temperature of the first section 101 and sending the temperature of the first section 101 to the controller 303. The first temperature sensor 301 may be one or more, and if there is one first temperature sensor 301, it is preferably disposed at the center point of the first section 101; if there are a plurality of first temperature sensors 301, the plurality of first temperature sensors 301 are disposed at different positions in the first segment 101 for multi-point temperature measurement. The second temperature sensor 302 is used to measure the temperature of the second section 102 and send the temperature of the second section 102 to the controller 303. The second temperature sensor 302 may be one or more, and if there is one second temperature sensor 302, it is preferably disposed at the center point of the second section 102; if there are a plurality of second temperature sensors 302, the plurality of second temperature sensors 302 are disposed at different positions in the second segment 102 in a distributed manner for multi-point temperature measurement. One first temperature sensor 301 and one second temperature sensor 302 are shown in fig. 8 and 9.
The first temperature sensor 301 and the second temperature sensor 302 are both described as an example:
after receiving the temperature of the first segment 101 sent by the first temperature sensor 301, the controller 303 compares the temperature with a preset first preset threshold. It should be noted that the first preset threshold is an upper limit of the temperature at which the near end of the power input end of the display panel does not need to be cooled, that is, if the temperature of the first segment 101 is less than or equal to the first preset threshold, it indicates that the first segment 101 does not need to be cooled, that is, the near end of the power input end of the display panel does not need to be cooled; if the temperature of the first section 101 is greater than the first preset threshold, it indicates that the first section 101 needs to be cooled, that is, the near end of the power input end of the display panel needs to be cooled, at this time, the controller 303 controls the semiconductor chilling plate located in the first section 101 to operate, so as to cool the first section 101, and further cool the near end of the power input end. As the temperature near the power input is reduced, the difference between the temperature near the power input and the temperature far from the power input is also reduced. That is, the lifetime aging apparatus provided in the embodiment of the present invention can not only reduce the temperature of the near-end power input end of the display panel, but also reduce the temperature difference between the near-end power input end and the far-end power input end, thereby improving the display quality and yield of the display panel. It should be noted that, the specific value of the first preset threshold may be set according to an actual situation, and the implementation of the present invention is not limited to this specific value.
After receiving the temperature of the first zone 101 sent by the first temperature sensor 301 and the temperature of the second zone 102 sent by the second temperature sensor 302, the controller 303 further compares the difference between the temperature of the first zone 101 and the temperature of the second zone 102 with a preset second preset threshold, where the difference refers to the absolute value of the difference between the temperature of the first zone 101 and the temperature of the second zone 102. It should be noted that the second preset threshold is a temperature difference upper limit value that does not need to lower the temperature of the near end of the power input end of the display panel. If the difference is smaller than or equal to the second preset threshold, it indicates that the first segment 101 does not need to be cooled, that is, the near end of the power input end of the display panel does not need to be cooled; if the difference is greater than the second preset threshold, it indicates that the first section 101 needs to be cooled, that is, the near end of the power input end of the display panel needs to be cooled, at this time, the controller 303 controls the semiconductor chilling plate located in the first section 101 to operate, so as to cool the first section 101, further cool the near end of the power input end, and reduce the temperature difference between the near end of the power input end and the far end of the power input end. It should be noted that, a specific value of the second preset threshold may be set according to an actual situation, and this is not specifically limited in the embodiment of the present invention.
In some embodiments, the heat dissipation layer 40 is disposed not only on the side of the first segment 101 away from the light emitting device, but also on the side of the second segment 102 away from the light emitting device. In the embodiment of the present invention, the heat dissipation layer 40 is preferably a semiconductor chilling plate, and it should be noted that the semiconductor chilling plate located in the first section 101 and the semiconductor chilling plate located in the second section 102 may cover the whole surface of the side of the base 10 away from the light emitting device, or may not cover the whole surface; the semiconductor cooling plate located in the first section 101 may be integrally designed with the semiconductor cooling plate located in the second section 102, or may not be integrally designed, which is not particularly limited in the embodiment of the present invention. It should be noted that the controller 303 can respectively and independently control the semiconductor chilling plates located in the first section 101 and the semiconductor chilling plates located in the second section 102, for example, currents of different magnitudes are input to the semiconductor chilling plates located in different sections, or currents are input to the semiconductor chilling plates located in different sections within time periods of different durations, so as to respectively and independently control the power of the semiconductor chilling plates located in different sections, thereby achieving different degrees of cooling for different sections, further achieving different degrees of cooling for the near end of the power input end and the far end of the power input end, and being more beneficial to temperature balance between the near end of the power input end and the far end of the power input end.
In some embodiments, the base 10 of the life-time aging device is provided with a pipe 50 inside, the head end of the pipe 50 is used for receiving externally injected refrigerant fluid, the tail end of the pipe 50 is used for discharging the refrigerant fluid, and the refrigerant fluid exchanges heat with the base 10 during flowing through the pipe 50 so as to dissipate heat.
Specifically, the pipes 50 may be uniformly distributed inside the base 10, fig. 10 is a schematic diagram of the pipes provided by the embodiment of the present invention, where the pipes are uniformly distributed in the base of the lifetime aging apparatus, part (a) and part (B) in fig. 10 respectively show two uniform distribution manners of the pipes 50, a head end (point a) of the pipe 50 is used to receive externally injected refrigerant liquid, the refrigerant liquid is used to uniformly refrigerate the base 10 during passing through the pipe 50, so as to uniformly cool a display panel supported by the base 10, and a tail end (point B) of the pipe 50 is used to discharge the refrigerant liquid.
In other embodiments, the tubes 50 may also be uniformly distributed in the first section 101 and the second section 102, respectively, and the distribution density in the first section 101 is greater than that in the second section 102, so that refrigeration in the two sections at different degrees can be realized, cooling in different degrees can be realized, and further cooling in different degrees can be realized for the near end and the far end of the power input end, which is more favorable for temperature balance between the near end and the far end of the power input end.
In some embodiments, as shown in fig. 3, the lifetime aging apparatus further includes a side plate 20 disposed around the periphery of the base 10, and a region of the side plate 20 near the first section 101 is provided with a connection terminal 200 matched with a power input terminal of the display panel.
Specifically, the lifetime aging apparatus shown in fig. 3 has a rectangular parallelepiped structure, and includes a rectangular base 10 and four rectangular side plates 20 vertically connected to the periphery of the base 10, wherein a region of the four side plates 20 close to the first segment 101 (i.e., only one side plate 20 close to the first segment 101) is provided with a connection terminal 200, and the connection terminal 200 is matched with a power input terminal of the display panel to access a signal line to the power input terminal. In order to more effectively cool the proximal end of the power input end, the side plate 20 may also be designed as the same as the first section 101, for example, the side plate 20 is designed to have a structure with different thicknesses in each region, a heat dissipation layer is attached to the surface of the side plate 20, the side plate 20 is configured to have a hollow structure and a temperature sensor is disposed inside the hollow structure, a pipe is introduced inside the side plate 20 to convey a refrigerant for cooling the side plate 20, the side plate 20 is made of any one or a combination of metals, alloys, and graphite, and the like, which is not particularly limited in the embodiment of the present invention.
In some embodiments, the heat dissipation mechanism further comprises a fan or an air conditioner.
Specifically, when the lifetime aging apparatus performs lifetime aging on the light emitting devices in the display panel, a fan, an air conditioner, or the like may be provided around the lifetime aging apparatus to increase convection, thereby removing heat generated by the display devices. It should be noted that the air outlets of the fan and the air conditioner may be disposed only corresponding to the first section 101 of the base 10 of the life aging apparatus, so as to effectively reduce the temperature of the near end of the power input end of the display panel supported by the fan and the air conditioner, and reduce the temperature difference between the near end of the power input end and the far end of the power input end.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (9)
1. A life time aging apparatus of a light emitting device, comprising:
the base is used for supporting a display panel containing the light-emitting device and absorbing heat generated by the light-emitting device, the base comprises a first section close to a power supply input end of the display panel and a second section far away from the power supply input end, a pipeline is arranged inside the base, the head end of the pipeline is used for receiving externally injected refrigerating fluid, the tail end of the pipeline is used for discharging the refrigerating fluid, the refrigerating fluid refrigerates the base in the process of flowing through the pipeline, the pipelines are respectively and uniformly distributed inside the first section and the second section, and the distribution density of the pipelines in the first section is greater than that in the second section;
and the heat dissipation mechanism is used for dissipating heat of the base.
2. The life aging device of claim 1, wherein a heat dissipation rate of the first section is higher than a heat dissipation rate of the second section.
3. The life aging device of claim 2, wherein the material of the base is any one or a combination of metals, alloys, and graphite.
4. The life aging device of claim 3, wherein a thickness of the first section is greater than a thickness of the second section.
5. The lifetime aging apparatus according to claim 3, wherein the heat dissipation mechanism is a heat dissipation layer, and the heat dissipation layer is disposed on a side of the first section away from the light emitting device.
6. The life aging device of claim 5, wherein the heat dissipation layer is a semiconductor chilling plate, a first temperature sensor and a controller are arranged inside the first section, and the controller is electrically connected with the first temperature sensor and the semiconductor chilling plate respectively; the first temperature sensor is used for monitoring the temperature of the first section and sending the temperature of the first section to the controller; the controller is used for controlling the semiconductor refrigerating sheet to work when the temperature of the first section is larger than a first preset threshold value.
7. The life aging device of claim 6, wherein the second section is internally provided with a second temperature sensor electrically connected to the controller; the second temperature sensor is used for monitoring the temperature of the second section and sending the temperature of the second section to the controller; the controller is further used for controlling the semiconductor chilling plate to work when the difference value between the temperature of the first section and the temperature of the second section is larger than a second preset threshold value.
8. The lifetime aging apparatus of claim 5, wherein the heat dissipation layer is further disposed on a side of the second segment away from the light emitting device.
9. The life aging device of any one of claims 1 to 8, wherein the heat dissipation mechanism further comprises a fan or an air conditioner.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110216993.6A CN113009309B (en) | 2021-02-26 | 2021-02-26 | Life aging device for light emitting device |
Applications Claiming Priority (1)
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| US6744269B1 (en) * | 1997-10-07 | 2004-06-01 | Reliability Incorporated | Burn-in board with adaptable heat sink device |
| TWM395118U (en) * | 2008-04-23 | 2010-12-21 | Sheng Yih Technologies Co Ltd | Heat dissipation gain structure of array type LED lamp |
| CN201739945U (en) * | 2010-08-16 | 2011-02-09 | 颜旭利 | An improved heat dissipation structure of an LED lamp |
| CN204922896U (en) * | 2015-08-26 | 2015-12-30 | 深圳市斯迈得光电子有限公司 | LED lamp pearl radiator that ages |
| CN206114876U (en) * | 2016-11-01 | 2017-04-19 | 厦门多彩光电子科技有限公司 | LED lamp pearl aging device |
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| US6744269B1 (en) * | 1997-10-07 | 2004-06-01 | Reliability Incorporated | Burn-in board with adaptable heat sink device |
| TWM395118U (en) * | 2008-04-23 | 2010-12-21 | Sheng Yih Technologies Co Ltd | Heat dissipation gain structure of array type LED lamp |
| CN201739945U (en) * | 2010-08-16 | 2011-02-09 | 颜旭利 | An improved heat dissipation structure of an LED lamp |
| CN204922896U (en) * | 2015-08-26 | 2015-12-30 | 深圳市斯迈得光电子有限公司 | LED lamp pearl radiator that ages |
| CN206114876U (en) * | 2016-11-01 | 2017-04-19 | 厦门多彩光电子科技有限公司 | LED lamp pearl aging device |
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