CN112988431B - Reliability evaluation method and system for different exceptions of SRAM (static random Access memory) type FPGA (field programmable Gate array) - Google Patents
Reliability evaluation method and system for different exceptions of SRAM (static random Access memory) type FPGA (field programmable Gate array) Download PDFInfo
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Abstract
Description
技术领域technical field
本发明涉及电路可靠性评估领域,具体的涉及一种SRAM型FPGA不同异常的可靠性评估方法及系统。The invention relates to the field of circuit reliability evaluation, in particular to a reliability evaluation method and system for different abnormalities of an SRAM type FPGA.
背景技术Background technique
21世纪以来,在空间信号处理能力需求急剧增加和航天任务研制周期大幅缩短的背景下,空间电子仪器对高性能、短周期、低成本的处理器和大规模集成电路提出了很高的需求,其中最为关键的是解决宇航器中的半导体集成电路在充满高能粒子的空间辐射环境中可靠性工作的问题。相比于传统的宇航级器件,SRAM(Static Random Access Memory)型FPGA(Field Programmable Gate Array)具有信息密度大、性能高、开发成本较低以及可重复编程的特性,在空间领域具有的应用价值越来越大。当空间中的高能粒子辐射进入半导体器件时,会产生单粒子效应(Single Event Effect,SEE),从而导致器件功能异常,威胁着在轨航天器的正常运行。在单粒子效应中,单粒子翻转(Single Event Upset,SEU)对FPGA电路的危害最为严重。FPGA电路经过布局布线映射到FPGA底层配置单元后,使用的资源中包含了不同的配置位信息,不同配置区域发生单粒子翻转对于电路功能的作用效果也不同,因此决定了FPGA电路发生单粒子故障的程度。为了减弱甚至消除单粒子翻转对于系统可靠性的危害,至关重要的一步就是对单粒子效应的影响进行全面且高效的评估。Since the 21st century, under the background of the sharp increase in the demand for space signal processing capability and the shortening of the development cycle of space missions, space electronic instruments have put forward high demands for high-performance, short-cycle, low-cost processors and large-scale integrated circuits. Among them, the most critical is to solve the problem of reliable operation of semiconductor integrated circuits in spacecraft in the space radiation environment full of high-energy particles. Compared with traditional aerospace-grade devices, SRAM (Static Random Access Memory) type FPGA (Field Programmable Gate Array) has the characteristics of high information density, high performance, low development cost and reprogrammability, and has application value in the space field. getting bigger. When the high-energy particle radiation in space enters the semiconductor device, it will produce the Single Event Effect (SEE), which will lead to the abnormal function of the device and threaten the normal operation of the spacecraft in orbit. Among the single event effects, the single event upset (Single Event Upset, SEU) is the most serious harm to the FPGA circuit. After the FPGA circuit is mapped to the bottom configuration unit of the FPGA through the layout and wiring, the resources used contain different configuration bit information, and the single event flip in different configuration areas has different effects on the circuit function, so it is determined that the single event fault occurs in the FPGA circuit. Degree. In order to reduce or even eliminate the harm of single-event upsets to system reliability, a critical step is to conduct a comprehensive and efficient assessment of the impact of single-event effects.
目前常规方法针对SRAM型FPGA可靠性评估主要采用的指标是翻转截面,一般通过高能粒子辐照测试获取参数。翻转截面又可以分为静态翻转截面和动态翻转截面,静态翻转截面定义为单粒子事件数与垂直入射时单位面积上入射粒子的总数的比值,表征单个粒子入射到器件单位面积上发生单粒子翻转事件的概率,其完全取决于器件本身的工艺和设计,与加载电路无关。而动态翻转截面相比于静态翻转截面,多引入了一个敏感因子,敏感因子定义为配置存储器中敏感位数与总位数的比值,说明电路的动态翻转特性不仅与器件本身的工艺和设计相关,还与上面加载的电路有关。At present, the main index used in the reliability evaluation of SRAM-type FPGAs in conventional methods is the flip cross section, and the parameters are generally obtained through high-energy particle irradiation tests. The flip cross section can be divided into static flip cross section and dynamic flip cross section. The static flip cross section is defined as the ratio of the number of single particle events to the total number of incident particles per unit area at normal incidence, indicating that single particle flip occurs when a single particle is incident on a unit area of the device. The probability of an event, which depends entirely on the process and design of the device itself, has nothing to do with the loading circuit. Compared with the static flip section, the dynamic flip section introduces an additional sensitivity factor, which is defined as the ratio of the sensitive bits to the total number of bits in the configuration memory, indicating that the dynamic flip characteristics of the circuit are not only related to the process and design of the device itself , also related to the circuit loaded above.
FPGA的配置存储器中每一个存储单元都控制着特定可编程资源的状态,因此对于任意一个基于FPGA的设计而言,并不是所有的SEU都会导致系统功能的失效,部分SEU对系统功能可能没有影响。产生这种现象的原因有以下两点:第一是设计的资源占用有限,那些没有被占用的可编程逻辑资源对应的控制位一般对系统功能没有影响,第二个是由于电路可能采取了三模冗余加固设计,一些位置上虽然发生了SEU,但是通过多数表决器后,在系统的输出端不会显现出来。这种特殊现象的存在使得基于翻转截面的评估指标无法全面准确地评估SRAM型FPGA加固设计的可靠性。Each storage unit in the configuration memory of the FPGA controls the state of a specific programmable resource. Therefore, for any FPGA-based design, not all SEUs will cause the failure of the system function, and some SEUs may not affect the system function. . There are two reasons for this phenomenon: the first is the limited resource occupation of the design, the control bits corresponding to those unoccupied programmable logic resources generally have no effect on the system function, the second is that the circuit may take three Modular redundancy reinforcement design, although SEU occurs in some positions, it will not appear at the output end of the system after passing through the majority voter. The existence of this special phenomenon makes it impossible to comprehensively and accurately evaluate the reliability of the SRAM-type FPGA ruggedized design based on the evaluation index based on the flipped cross section.
发明内容SUMMARY OF THE INVENTION
本发明旨在至少解决现有技术中存在的技术问题之一。为此,本发明提出一种SRAM型FPGA不同异常的可靠性评估方法及系统,能够全面准确地评估SRAM型FPGA加固设计的可靠性。The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the present invention proposes a reliability evaluation method and system for different anomalies of SRAM-type FPGA, which can comprehensively and accurately evaluate the reliability of SRAM-type FPGA reinforcement design.
根据本发明第一方面实施例的SRAM型FPGA不同异常的可靠性评估方法,包括以下步骤;The method for evaluating the reliability of SRAM-type FPGAs with different abnormalities according to the embodiment of the first aspect of the present invention includes the following steps;
S100、选定配置存储器位置,进行故障注错测试,统计出错地址和异常比特个数;S100, select the location of the configuration memory, perform a fault note error test, and count the error address and the number of abnormal bits;
S200、根据不同异常对系统功能造成的影响进行分类,具体为:S200. Classify according to the impact of different abnormalities on system functions, specifically:
第一类异常:系统功能中断可以通过回读刷新进行恢复;The first type of exception: system function interruption can be recovered by readback refresh;
第二类异常:系统功能中断不能通过回读刷新进行恢复,但可以通过软件复位进行恢复;The second type of exception: system function interruption cannot be recovered by readback refresh, but can be recovered by software reset;
第三类异常:系统功能中断只能通过加电和复位的方式进行恢复。The third type of exception: system function interruption can only be recovered by power-on and reset.
S300、对不同情况进行分类评估,具体为:S300, classifying and evaluating different situations, specifically:
计算FPGA第i类异常情况中内部配置结构j的配置数据异常率Pij;Calculate the configuration data exception rate P ij of the internal configuration structure j in the i-th abnormal situation of the FPGA;
查找该型号FPGA内部配置结构j在特定场景下的翻转率ej;Find the flip rate e j of the internal configuration structure j of this model FPGA in a specific scenario;
根据配置数据异常率Pij和翻转率ej计算第i类异常情况的失效率λi;Calculate the failure rate λ i of the i-th type of abnormal situation according to the abnormal rate P ij of the configuration data and the flip rate e j ;
根据失效率λi计算第i类异常情况的可靠度。According to the failure rate λ i , the reliability of the i-th type of abnormality is calculated.
根据本发明实施例的SRAM型FPGA不同异常的可靠性评估方法,至少具有如下技术效果:本发明实施方式首先通过故障注错测试,统计出错地址和异常比特个数,然后根据不同异常对系统功能造成的影响进行分类,最后在分类的配置数据异常率和翻转率的基础上,计算FPGA电路的失效率与可靠度,通过分类的测试结果来相对评估抗单粒子设计方法对系统性能的改善程度,解决了单粒子翻转对系统功能造成不同影响时的量化评估问题,为准确、全面地对抗辐照加固设计的可靠性评估提供了新的解决办法,具有较好的可行性和推广价值。通过评估各种单粒子防护设计方法及措施,为SRAM型FPGA的器件选型提供依据。The reliability evaluation method for different anomalies of an SRAM-type FPGA according to an embodiment of the present invention has at least the following technical effects: in the embodiment of the present invention, firstly, through the fault-injection test, the error addresses and the number of abnormal bits are counted, and then the system functions are evaluated according to different anomalies. Finally, based on the abnormal rate and flip rate of the classified configuration data, the failure rate and reliability of the FPGA circuit are calculated, and the degree of improvement of the system performance by the anti-single event design method is relatively evaluated through the classified test results. , which solves the problem of quantitative evaluation when single-event flipping has different effects on system functions, provides a new solution for accurate and comprehensive reliability evaluation of anti-radiation reinforcement design, and has good feasibility and promotion value. By evaluating various single-event protection design methods and measures, it provides a basis for the device selection of SRAM-type FPGAs.
根据本发明的一些实施例,所述步骤S301中配置数据异常率Pij的计算公式为According to some embodiments of the present invention, the calculation formula of the abnormality rate P ij of the configuration data in the step S301 is:
其中bij是通过故障注错测试统计得到的FPGA第i类异常情况中内部配置结构j的异常比特个数,btotal是该型号FPGA总的配置比特个数。Among them, b ij is the number of abnormal bits of the internal configuration structure j in the i-th abnormal situation of the FPGA obtained by the fault note error test statistics, and b total is the total number of configuration bits of the FPGA of this model.
根据本发明的一些实施例,所述步骤S302中失效率λi的计算公式为According to some embodiments of the present invention, the calculation formula of the failure rate λ i in the step S302 is:
根据本发明的一些实施例,所述可靠度Ri的计算公式为According to some embodiments of the present invention, the calculation formula of the reliability R i is:
其中λi(t)为失效率函数, where λ i (t) is the failure rate function,
根据本发明第二方面实施例的SRAM型FPGA不同异常的可靠性评估系统,包括:存储器,用于存储计算机程序;处理器,用于当执行所述计算机程序时,实现如上述的SRAM型FPGA不同异常的可靠性评估方法。According to the second aspect of the present invention, the SRAM-type FPGA reliability evaluation system for different anomalies includes: a memory for storing a computer program; a processor for implementing the above-mentioned SRAM-type FPGA when the computer program is executed Reliability assessment methods for different anomalies.
根据本发明实施例的SRAM型FPGA不同异常的可靠性评估系统,至少具有如下技术效果:本发明实施方式首先通过故障注错测试,统计出错地址和异常比特个数,然后根据不同异常对系统功能造成的影响进行分类,最后在分类的配置数据异常率和翻转率的基础上,计算FPGA电路的失效率与可靠度,通过分类的测试结果来相对评估抗单粒子设计方法对系统性能的改善程度,解决了单粒子翻转对系统功能造成不同影响时的量化评估问题,为准确、全面地对抗辐照加固设计的可靠性评估提供了新的解决办法,具有较好的可行性和推广价值。通过评估各种单粒子防护设计方法及措施,为SRAM型FPGA的器件选型提供依据。The reliability evaluation system for different anomalies of SRAM-type FPGAs according to the embodiment of the present invention has at least the following technical effects: the embodiment of the present invention first passes the fault-injection test, counts the error addresses and the number of abnormal bits, and then adjusts the system functions according to different anomalies. Finally, based on the abnormal rate and flip rate of the classified configuration data, the failure rate and reliability of the FPGA circuit are calculated, and the degree of improvement of the system performance by the anti-single event design method is relatively evaluated through the classified test results. , which solves the problem of quantitative evaluation when single-event flipping has different effects on system functions, provides a new solution for accurate and comprehensive reliability evaluation of anti-radiation reinforcement design, and has good feasibility and promotion value. By evaluating various single-event protection design methods and measures, it provides a basis for the device selection of SRAM-type FPGAs.
本发明的附加方面和优点将在下面的描述中部分给出,部分将从下面的描述中变得明显,或通过本发明的实践了解到。Additional aspects and advantages of the present invention will be set forth, in part, from the following description, and in part will be apparent from the following description, or may be learned by practice of the invention.
附图说明Description of drawings
本发明的上述和/或附加的方面和优点从结合下面附图对实施例的描述中将变得明显和容易理解,其中:The above and/or additional aspects and advantages of the present invention will become apparent and readily understood from the following description of embodiments taken in conjunction with the accompanying drawings, wherein:
图1为本发明实施例中SRAM型FPGA不同异常的可靠性评估方法的流程示意图;Fig. 1 is the schematic flow chart of the reliability evaluation method of different abnormality of SRAM type FPGA in the embodiment of the present invention;
图2为本发明实施例中第一类异常情况可靠度变化曲线;Fig. 2 is the variation curve of the reliability of the first type of abnormal situation in the embodiment of the present invention;
图3为本发明实施例中三模冗余注错测试平台的原理框图;3 is a schematic block diagram of a three-mode redundant error-injection test platform in an embodiment of the present invention;
图4为本发明实施例中注错测试的流程图。FIG. 4 is a flowchart of an error-injection test in an embodiment of the present invention.
具体实施方式Detailed ways
下面详细描述本发明的实施例,所述实施例的示例在附图中示出,其中自始至终相同或类似的标号表示相同或类似的元件或具有相同或类似功能的元件。下面通过参考附图描述的实施例是示例性的,仅用于解释本发明,而不能理解为对本发明的限制。The following describes in detail the embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein the same or similar reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary, only used to explain the present invention, and should not be construed as a limitation of the present invention.
在发明的描述中,需要理解的是,涉及到方位描述,例如上、下、前、后、左、右等指示的方位或位置关系为基于附图所示的方位或位置关系,仅是为了便于描述本发明和简化描述,而不是指示或暗示所指的装置或元件必须具有特定的方位、以特定的方位构造和操作,因此不能理解为对本发明的限制。In the description of the invention, it should be understood that the azimuth descriptions, such as up, down, front, rear, left, right, etc., indicate the azimuth or positional relationship based on the azimuth or positional relationship shown in the accompanying drawings, only for the purpose of It is convenient to describe the present invention and to simplify the description, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operate in a particular orientation, and therefore should not be construed as limiting the invention.
在发明的描述中,若干的含义是一个或者多个,多个的含义是两个以上,大于、小于、超过等理解为不包括本数,以上、以下、以内等理解为包括本数。如果有描述到第一、第二只是用于区分技术特征为目的,而不能理解为指示或暗示相对重要性或者隐含指明所指示的技术特征的数量或者隐含指明所指示的技术特征的先后关系。In the description of the invention, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including this number, above, below, within, etc. are understood as including this number. If it is described that the first and the second are only for the purpose of distinguishing technical features, it cannot be understood as indicating or implying relative importance, or indicating the number of the indicated technical features or the order of the indicated technical features. relation.
本发明的描述中,除非另有明确的限定,设置、安装、连接等词语应做广义理解,所属技术领域技术人员可以结合技术方案的具体内容合理确定上述词语在本发明中的具体含义。In the description of the present invention, unless otherwise clearly defined, words such as setting, installation, connection should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in the present invention in combination with the specific content of the technical solution.
参考图1,一种SRAM型FPGA不同异常的可靠性评估方法,包括以下步骤Referring to Figure 1, a reliability evaluation method for different anomalies of SRAM-type FPGAs includes the following steps
S100、选定配置存储器位置,进行故障注错测试,统计出错地址和异常比特个数;S100, select the location of the configuration memory, perform a fault note error test, and count the error address and the number of abnormal bits;
S200、根据不同异常对系统功能造成的影响进行分类,具体分为以下三类异常;S200. Classify according to the impact of different anomalies on system functions, and specifically divide them into the following three types of anomalies;
第一类异常:系统功能中断可以通过回读刷新进行恢复;The first type of exception: system function interruption can be recovered by readback refresh;
第二类异常:系统功能中断不能通过回读刷新进行恢复,但可以通过软件复位进行恢复;The second type of exception: system function interruption cannot be recovered by readback refresh, but can be recovered by software reset;
第三类异常:系统功能中断只能通过加电和复位的方式进行恢复;The third type of exception: system function interruption can only be recovered by power-on and reset;
S300、对不同情况进行分类评估,具体如下:S300, classifying and evaluating different situations, as follows:
S301、计算FPGA第i类异常情况中内部配置结构j的配置数据异常率Pij,配置数据异常率Pij的计算公式为:S301. Calculate the configuration data abnormality rate P ij of the internal configuration structure j in the i-th abnormal situation of the FPGA, and the calculation formula of the configuration data abnormal rate P ij is:
其中,bij是通过故障注错测试统计得到的FPGA第i类异常情况中内部配置结构j的异常比特个数,btotal是该型号FPGA总的配置比特个数,数据参照对应型号的芯片数据手册。Among them, b ij is the number of abnormal bits of the internal configuration structure j in the i-th abnormal situation of the FPGA obtained by the fault note error test statistics, b total is the total number of configuration bits of the FPGA of this model, and the data refer to the chip data of the corresponding model manual.
S302、在芯片数据手册上查找该型号FPGA内部配置结构j在特定场景下的翻转率ej,其单位为h/(device·upset);S302 , look up the flip rate e j of the internal configuration structure j of the FPGA of this model in a specific scenario on the chip data sheet, and the unit is h/(device·upset);
S303、计算第i类异常情况的失效率λi,其单位为1/year(单位统一换算为年),失效率λi的计算公式为:S303. Calculate the failure rate λ i of the i-th type of abnormal situation, and its unit is 1/year (units are uniformly converted into years), and the calculation formula of the failure rate λ i is:
S304、计算第i类异常情况的可靠度Ri,计算方式如下S304. Calculate the reliability R i of the i-th type of abnormal situation, and the calculation method is as follows
定义失效率函数λi(t)为:The failure rate function λ i (t) is defined as:
可得 Available
其中,Qi(t)表示第i类异常情况的故障概率,Ri表示第i类异常情况的可靠度,t表示时间。Among them, Q i (t) represents the failure probability of the i-th type of abnormal situation, R i represents the reliability of the i-th type of abnormal situation, and t represents the time.
下面以Xilinx XQR2V3000型号的FPGA来进行具体说明:The following is a detailed description of the Xilinx XQR2V3000 FPGA:
通过内部配置访问端口(ICAP)故障注入测试得到其配置逻辑块(CLB)中有104个异常比特,表1为芯片手册提供的Virtex-Ⅱ器件帧数、帧长度、配置比特总数。Through the internal configuration access port (ICAP) fault injection test, there are 104 abnormal bits in the configuration logic block (CLB). Table 1 provides the Virtex-Ⅱ device frame number, frame length and total number of configuration bits provided by the chip manual.
表1Table 1
通过表1计算可知该型号FPGA总配置比特个数为9582848,属于第一类异常情况,故配置数据异常率p11计算如下:According to the calculation in Table 1, it can be seen that the total number of configuration bits of this type of FPGA is 9582848, which belongs to the first type of abnormal situation. Therefore, the configuration data abnormality rate p 11 is calculated as follows:
如表2为芯片手册提供的XQR2V6000型号FPGA在地球同步轨道工作场景下的翻转率。As shown in Table 2, the flip rate of the XQR2V6000 FPGA in the geosynchronous orbit working scenario provided by the chip manual.
表2Table 2
由于XQR2V6000型号FPGA与XQR2V3000型号FPGA的架构类似,由表2可知XQR2V6000型号FPGA的CLB在地球同步轨道(GEO)的翻转率为1.8h/(device·upset),则XQR2V3000型号FPGA的CLB失效率λ1计算如下:Since the architecture of the XQR2V6000 FPGA is similar to that of the XQR2V3000 FPGA, it can be seen from Table 2 that the CLB turnover rate of the XQR2V6000 FPGA in the geosynchronous orbit (GEO) is 1.8h/(device·upset), then the CLB failure rate of the XQR2V3000 FPGA is λ 1 is calculated as follows:
因此可得第一类异常情况的可靠度R1为:Therefore, the reliability R 1 of the first type of abnormal situation can be obtained as:
R1=e-0.023t R 1 =e -0.023t
如图2所示,根据实验结果,得到XQR2V3000型号FPGA的CLB在地球同步轨道工作的场景下,其失效率大约为0.023(1/year),说明该方法可用于基于软件的抗辐照加固设计方法可靠性的相对评估。As shown in Figure 2, according to the experimental results, the failure rate of the CLB of the XQR2V3000 FPGA in the geosynchronous orbit is about 0.023 (1/year), indicating that this method can be used for software-based radiation hardening design Relative assessment of method reliability.
三模冗余注错测试平台的原理框图和测试流程图分别如图3和图4所示,其中FPGA1作为逐位翻转的注错对象,主要负责运行三模冗余加固原型FPGA程序,FPGA2运行单模FPGA程序,FPGA3则负责比对FPGA1和FPGA2的功能差异。一旦因为故障注错导致功能出现异常,等待一定时间后,若功能对比结果仍不一致,则给DSP输出功能异常中断,此时认为故障注入错误不可恢复,故障注错生效;若功能对比结果一致,则认为故障注入的错误可逆,此时故障注错不生效。FPGA4为加载FPGA芯片,其主要负责控制Slave SelectMap接口对FPGA1-3进行全局加载,另外还要实现对采用三模冗余设计的FPGA1的局部动态刷新及注错。DSP控制和配置FPGA1、FPGA2的功能启动和停止,通过串口输出比对结果和调试信息,并通过FPGA4来控制FPGA1动态刷新的开始,遍历除BRAM资源外的故障注入自动测试。一旦DSP检测到功能异常中断即停止功能比对,锁定当前自动注错帧位置并赋给自动注错起始帧地址,下次故障注入前对FPGA1进行全局刷新,将所有除BRAM外资源刷入正确的配置帧数据。然后从上次报错位置重新开始注错,如此循环往复,直到除BRAM外的资源全部遍历完为止。The principle block diagram and test flow chart of the three-mode redundancy error-injection test platform are shown in Figure 3 and Figure 4, respectively, in which FPGA1, as the error-injection object of bit-by-bit flipping, is mainly responsible for running the three-mode redundancy reinforcement prototype FPGA program, and FPGA2 runs For single-mode FPGA programs, FPGA3 is responsible for comparing the functional differences between FPGA1 and FPGA2. Once the function is abnormal due to fault injection, after waiting for a certain period of time, if the function comparison results are still inconsistent, the output function to the DSP will be abnormally interrupted. At this time, the fault injection error is considered unrecoverable, and the fault injection will take effect; if the function comparison results are consistent, The fault injection error is considered to be reversible, and the fault injection error does not take effect at this time. FPGA4 is to load the FPGA chip, it is mainly responsible for controlling the Slave SelectMap interface to load FPGA1-3 globally, and also realizes the local dynamic refresh and error note for FPGA1 which adopts the three-mode redundancy design. DSP controls and configures the function start and stop of FPGA1 and FPGA2, outputs comparison results and debugging information through the serial port, and controls the start of dynamic refresh of FPGA1 through FPGA4, and traverses the automatic test of fault injection except BRAM resources. Once the DSP detects that the function is abnormally interrupted, it stops the function comparison, locks the current automatic error injection frame position and assigns the automatic error injection start frame address, and refreshes FPGA1 globally before the next fault injection, and refreshes all resources except BRAM. Correct configuration frame data. Then restart the error injection from the last error report position, and so on, until all resources except BRAM are traversed.
本发明实施例还涉及一种SRAM型FPGA不同异常的可靠性评估系统,包括:存储器,用于存储计算机程序;处理器,用于当执行所述计算机程序时,实现如上述的SRAM型FPGA不同异常的可靠性评估方法。The embodiment of the present invention also relates to a reliability evaluation system for different anomalies of an SRAM-type FPGA, including: a memory for storing a computer program; and a processor for implementing the above-mentioned SRAM-type FPGA different when executing the computer program Exceptional reliability assessment methods.
综上所述,本发明实施例的优点在于:To sum up, the advantages of the embodiments of the present invention are:
(1)解决了单粒子翻转对系统功能造成不同影响时的量化评估问题,为准确、全面地对基于软件的抗辐照加固设计方法的可靠性评估提供了新的解决思路;(1) Solve the problem of quantitative evaluation when the single event flip has different effects on the system function, and provides a new solution for the accurate and comprehensive reliability evaluation of the software-based radiation hardening design method;
(2)根据不同异常对系统功能造成的影响,提出了一个新的分类标准;(2) According to the influence of different anomalies on the system function, a new classification standard is proposed;
(3)从失效率函数的定义着手,推导出了可靠度与失效率的关系;(3) Starting from the definition of failure rate function, the relationship between reliability and failure rate is deduced;
(4)通过程序加载以及故障注入,直接对FPGA配置数据进行修改,可以实现故障注入并在芯片上运行测试,模拟空间中单粒子效应;(4) By directly modifying the FPGA configuration data through program loading and fault injection, fault injection can be implemented and tests can be run on the chip to simulate single event effects in space;
(5)可以得到配置结构中异常比特的个数和具体位置;(5) The number and specific positions of abnormal bits in the configuration structure can be obtained;
(6)通过评估各种单粒子防护设计方法及措施,为SRAM型FPGA的器件选型提供参考和借鉴。(6) By evaluating various single-event protection design methods and measures, it provides reference and reference for the device selection of SRAM-type FPGAs.
上面结合附图对本发明实施例作了详细说明,但是本发明不限于上述实施例,在所述技术领域普通技术人员所具备的知识范围内,还可以在不脱离本发明宗旨的前提下作出各种变化。The embodiments of the present invention have been described in detail above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned embodiments. Within the scope of knowledge possessed by those of ordinary skill in the technical field, various modifications can be made without departing from the purpose of the present invention. kind of change.
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