CN112981314B

CN112981314B - Evaporation plating equipment

Info

Publication number: CN112981314B
Application number: CN202110152215.5A
Authority: CN
Inventors: 何瑞亭; 李晓康
Original assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Current assignee: Wuhan China Star Optoelectronics Semiconductor Display Technology Co Ltd
Priority date: 2021-02-03
Filing date: 2021-02-03
Publication date: 2022-07-12
Anticipated expiration: 2041-02-03
Also published as: CN112981314A

Abstract

The application discloses evaporation equipment, because this evaporation equipment encloses at an evaporation source outside periphery and establishes first evaporation baffle, the clearance between first evaporation baffle and the evaporation source is very little, consequently, can reduce the area and the weight of first evaporation baffle in the evaporation equipment, the part and the installation space of first evaporation baffle have also greatly been reduced, the design can be when evaporation equipment moves like this, avoid collision or the interference between the part, improve the smoothness nature of evaporation equipment operation, also can avoid treating when the evaporation substrate is treated in the delivery, big evaporation baffle influences the machine function, it is bad to make the production evaporation seal of a government organization in old china on treating the evaporation substrate. This evaporation plating equipment has still set up the shielding part corresponding the coating by vaporization source, and the problem that the fixed point of this kind of small and exquisite light baffle design can improve the coating by vaporization equipment baffle easily damaged, and then avoids the coating by vaporization seal of a government organization in old china bad.

Description

Evaporation plating equipment

Technical Field

The application relates to the technical field of display, in particular to evaporation equipment.

Background

In the Fine Metal Mask (FMM) mode, an Organic Light-Emitting Diode (OLED) material is evaporated onto a Low-Temperature polysilicon (LTPS) backplane by a predetermined procedure, and a rgb device is formed using a pattern on the FMM.

At present, linear evaporation sources (line sources) and point evaporation sources (point sources) are commonly used in mass production. Taking a point evaporation source evaporation method as an example, the point evaporation source evaporation method is point source fixing, and an evaporation backboard is placed on the alignment assembly by a machine. During the process of carrying, carrying out and aligning the evaporation back plate by a machine, a baffle plate must be used for blocking materials evaporated from the point source, and the phenomenon that the materials are evaporated on the back plate to leave poor evaporation marks in the shape of the machine or a mask plate is avoided.

In the research and the practice process to prior art, the inventor of this application discovers that the baffle design of often adopting is in the backplate below, and the fixed point of baffle is at the coating by vaporization cavity top, and whole cavity horizontal plane all need all block, and the baffle area is great like this, and weight is big, and fixed subassembly damages easily for the baffle can not block the material, leads to the coating by vaporization seal of a government organization in old china bad.

Disclosure of Invention

The application provides an evaporation equipment can avoid producing the evaporation seal of a government organization in old china badly.

The application provides an evaporation plating apparatus, includes:

the device comprises a base platform, a vapor deposition source and a vapor deposition source, wherein the base platform is provided with the vapor deposition source;

the first evaporation baffle is arranged on the base station along a direction vertical to the base station and surrounds the periphery of the outer side of the evaporation source;

the shielding part is arranged on one side, away from the base station, of the first evaporation plate, and the shielding part covers the first evaporation plate.

Optionally, in some embodiments of the present application, the vapor deposition device further includes a first switch assembly, the first switch assembly connects the first vapor deposition baffle and the shielding portion, and the first switch assembly is used to control the shielding portion to open and close.

Optionally, in some embodiments of the present application, the apparatus further includes a first power device, the first power device is connected to the first switch assembly, and the first power device is used for electrically controlling the first switch assembly to control the opening and closing of the shielding portion.

Optionally, in some embodiments of the present application, the vapor deposition device further includes a second vapor deposition baffle and a connecting portion; the second evaporation baffle is arranged on the base station along the direction vertical to the base station and surrounds the periphery of one side of the first evaporation baffle, which is far away from the evaporation source; the connecting part is arranged on the base platform along the direction vertical to the base platform and is arranged between the first evaporation baffle and the second evaporation baffle, and the connecting part is connected with the shielding part.

Optionally, in some embodiments of the present application, the connecting portion includes a telescopic assembly, and the telescopic assembly is configured to control the shielding portion to move in a direction perpendicular to the base station and control the shielding portion to open and close.

Optionally, in some embodiments of the present application, the telescoping assembly comprises any one of a telescoping rod, a sliding rail, or a scissor fork.

Optionally, in some embodiments of the present application, a second electric device is connected to the telescopic assembly, and the second electric device is used for controlling the telescopic assembly to extend and retract.

Optionally, in some embodiments of the present application, the connecting portion includes a telescopic assembly and a second switch assembly, the telescopic assembly is configured to control the shielding portion to move in a direction perpendicular to the base station, and the second switch assembly is configured to control the shielding portion to open and close.

Optionally, in some embodiments of the present application, the second switch assembly is disposed on a side close to the shielding portion, the second switch assembly is connected to a second power device, the second power device is disposed between the first evaporation baffle and the second evaporation baffle, and the second power device is used for electrically controlling the second switch assembly to open and close the shielding portion.

Optionally, in some embodiments of the present application, the second switch component includes a first connecting piece and a transmission piece, the first connecting piece connects the shielding portion and the transmission piece, the transmission piece connects the telescopic component, and the telescopic component extends and retracts to control the transmission piece to drive the first connecting piece to move, so that the shielding portion opens and closes.

Optionally, in some embodiments of the present application, the second switch assembly includes a second connecting element and a rotating element, the second connecting element connects the rotating element and the shielding portion, and the rotating element controls the shielding portion to rotate to open and close.

Optionally, in some embodiments of the present application, the second switch component includes a semicircular gear, a gear and a third connecting piece, the third connecting piece connects the gear and the telescopic component, the gear is engaged with the semicircular gear, the semicircular gear is connected to the shielding portion, and the shielding portion is opened and closed through the gear transmission.

Optionally, in some embodiments of the present application, a first sealing baffle, a second sealing baffle, and a third sealing baffle, which have a shape corresponding to that of the first evaporation baffle, are disposed on one side of the shielding portion close to the base station along a direction perpendicular to the base station, a first gap is formed between the first sealing baffle and the second evaporation baffle, and the first evaporation baffle is embedded in the first gap; and a second gap is formed between the second sealing baffle plate and the third sealing baffle plate, and the second evaporation baffle plate is embedded into the second gap.

Optionally, in some embodiments of the present application, a side of the second sealing baffle close to the base platform is provided with a chamfer shape.

Optionally, in some embodiments of the present application, the vapor deposition device further includes a base, the base is disposed on the base, and the vapor deposition source, the first vapor deposition baffle, and the second vapor deposition baffle are disposed on the base.

Optionally, in some embodiments of the present application, the base includes a supporting portion and a lifting portion, the first evaporation plate, the second evaporation plate, the connecting portion, and the blocking portion are disposed on the supporting portion, the evaporation source is disposed on the lifting portion, and the lifting portion is configured to adjust a height of the evaporation source relative to the first evaporation plate, the second evaporation plate, the connecting portion, and the blocking portion.

Optionally, in some embodiments of the present application, the evaporation source includes a point evaporation source and a line evaporation source; when the evaporation source is a point evaporation source, the section of the first evaporation baffle and the section of the second evaporation baffle, which are parallel to the base station, are circular; when the evaporation source is a linear evaporation source, the section of the first evaporation baffle and the section of the second evaporation baffle, which are parallel to the base platform, are rectangular.

Optionally, in some embodiments of the present application, the vacuum apparatus further includes a vacuum device, where the vacuum device includes a vacuum tube and a vacuum pump, the vacuum tube connects the vacuum pump and the evaporation apparatus, and the vacuum device is configured to perform a vacuum pumping process on the evaporation apparatus.

The application provides an evaporation plating equipment, this evaporation plating equipment adopts first evaporation plating baffle, first evaporation plating baffle is along the vertically the direction setting of base station is in on the base station, and enclose and establish one evaporation plating source outside periphery. Because set up first coating by vaporization baffle in this application to every coating by vaporization source to first coating by vaporization baffle encloses to establish one coating by vaporization source outside periphery, and the clearance between first coating by vaporization baffle and the coating by vaporization source is very little, consequently can reduce the shared space of first coating by vaporization baffle in evaporation equipment. The first evaporation plating baffle that sets up like this is small and exquisite, and area occupied is little and the quality is light to can shelter from evaporation plating material completely, thereby can avoid when the evaporation plating base plate is treated in the delivery, the influence machine operation of major possession evaporation plating baffle, it is bad to make and treat to produce the evaporation plating seal of a government organization in old china on the evaporation plating base plate. Moreover, the shielding part only covers one evaporation source, and a whole shielding baffle is not required to be manufactured, so that the parts of the shielding part are not easy to damage, and the maintenance labor and financial resources can be effectively reduced.

Drawings

In order to more clearly illustrate the technical solutions in the present application, the drawings needed to be used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 is a schematic view of a first structure of an evaporation apparatus provided in the present application;

fig. 2 is a schematic view of a second structure of an evaporation apparatus provided in the present application;

FIG. 3 is a schematic view of a third structure of an evaporation apparatus provided in the present application;

fig. 4 is a schematic diagram of a fourth structure of an evaporation apparatus provided in the present application;

fig. 5 is a schematic structural diagram of a fifth evaporation apparatus provided in the present application;

fig. 6 is a schematic diagram of a sixth structure of an evaporation apparatus provided in the present application;

fig. 7 is a schematic diagram of a seventh structure of an evaporation apparatus provided in the present application;

fig. 8 is a schematic view of an eighth structure of an evaporation apparatus provided in the present application;

fig. 9 is a schematic view of a ninth structure of an evaporation apparatus provided in the present application;

FIG. 10 is a schematic view of a portion of the second switch assembly, shield and telescoping assembly provided herein;

FIG. 11 is a partial schematic view of the connection portion and the shielding portion provided in the present application;

fig. 12 is a schematic view of a tenth structure of an evaporation apparatus provided in the present application;

fig. 13 is a schematic view of an eleventh structure of a vapor deposition apparatus provided in the present application;

fig. 14 is a schematic view of a twelfth structure of an evaporation apparatus provided in the present application.

Detailed Description

The technical solutions in the present application will be described clearly and completely with reference to the drawings in the present application, and it should be apparent that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating preferred embodiments of the present application, are given by way of illustration and explanation only, and are not intended to limit the present application. In the present application, unless indicated to the contrary, the use of the directional terms "upper" and "lower" generally refer to the upper and lower positions of the device in actual use or operation, and more particularly to the orientation of the figures of the drawings; while "inner" and "outer" are with respect to the outline of the device.

The application provides an evaporation equipment. The vapor deposition apparatus will be described in detail below.

Referring to fig. 1, fig. 1 is a schematic view of a first structure of an evaporation apparatus 10 provided in the present application. The vapor deposition apparatus 10 includes a base 101, a first vapor deposition baffle plate 103, and a shielding portion 104. The base 101 is provided with a vapor deposition source 102. The first evaporation baffle plate 103 is disposed on the base 101 along a direction perpendicular to the base 101, and surrounds an outer periphery of an evaporation source 102. The shielding portion 104 is disposed on a side of the first evaporation baffle plate 103 away from the base 101, and the shielding portion 104 covers the first evaporation baffle plate 103.

Because the evaporation is performed in a vacuum environment, side walls are further arranged around the base platform 101, the substrate to be evaporated is placed on the top surface of the evaporation equipment 10, and the base platform 101, the side walls and the top surface of the substrate to be evaporated form a cavity so as to ensure the vacuum environment. A plurality of vapor deposition sources 102 may be provided on the base 101, and the vapor deposition sources 102 may be circular crucibles or linear crucibles. And a heating wire is arranged outside the crucible to heat the crucible. When carrying out the coating by vaporization operation, the machine will treat that the coating by vaporization base plate transports to coating by vaporization equipment 10 top, and coating by vaporization source 102 is located and treats the coating by vaporization base plate below, places meticulous metal mask piece between coating by vaporization base plate and the evaporation source 102, treats that the coating by vaporization face of coating by vaporization base plate is down, treats that the coating by vaporization base plate is provided with fixed position counterpoint subassembly (Mark) all around for counterpoint with meticulous metal mask piece. Then utilize the heating wire to heat the material in the crucible, the counterpoint subassembly carries treats that the coating by vaporization base plate is together to treat that coating by vaporization base plate central point rotates as the center, and the material in the crucible is heated to volatilize the coating by vaporization to treating on the coating by vaporization base plate.

It should be noted that, during the process of loading, unloading and aligning the substrate to be vapor-deposited by the machine, the material vapor-deposited by the vapor deposition source 102 must be blocked by the baffle plate, so as to avoid the poor vapor deposition mark of the machine or the mask plate shape left by the material vapor-deposited on the back plate during the process.

The application provides a vapor deposition equipment 10, outside periphery at vapor deposition source 102 sets up first evaporation plating baffle 103, because first evaporation plating baffle 103 encloses to establish at an evaporation plating source 102 outside periphery, the clearance between first evaporation plating baffle 103 and the evaporation plating source 102 is very little, consequently, can reduce the area and the weight of first evaporation plating baffle 103 among vapor deposition equipment 10, the part and the installation space of first evaporation plating baffle 103 have also greatly been reduced, can be when vapor deposition equipment 10 moves, avoid collision or interference between the part, improve the smoothness nature of vapor deposition equipment 10 operation, also can treat when the vapor deposition base plate in the delivery, avoid the big piece evaporation plating baffle to influence the machine and operate, the solution treats to produce the bad problem of evaporation plating seal of a mark on the vapor deposition base plate. The first vapor deposition baffle 103 is further provided with a shielding portion 104 on the side away from the base 101, so that the vapor deposition source 102 can be shielded without shielding the entire chamber horizontal surface. The small and light baffle design can improve the problem that the fixed point of the baffle of the evaporation equipment 10 is easy to damage, and further avoid bad evaporation mark. In addition, the shielding part 104 is smaller than a horizontal baffle, and mechanical parts of the first evaporation baffle 103 and the shielding part 104 are not easy to deform or damage, so that the manpower and financial resources for maintaining equipment can be effectively reduced, and the production cost is reduced.

Referring to fig. 2, fig. 2 is a schematic view of a second structure of the evaporation apparatus 10 provided in the present application. The evaporation apparatus 10 further includes a first switch assembly 105, the first switch assembly 105 is connected to the first evaporation baffle plate 103 and the shielding portion 104, and the first switch assembly 105 is used for controlling the shielding portion 104 to open and close.

The first switch module 105 can control the shielding portion 104 to rotate in a direction parallel to the base 101, and the first switch module 105 can also control the shielding portion 104 to open and close at an angle with the plane of the base 101 in the manner shown in fig. 2. When the evaporation apparatus 10 starts evaporation operation, the shielding portion 104 is fully opened, and when the machine carries a substrate to be evaporated, the shielding portion 104 is fully closed.

Referring to fig. 3, fig. 3 is a schematic structural diagram of a third vapor deposition apparatus 10 provided in the present application. The evaporation apparatus 10 further includes a first power device 106, the first power device 106 is connected to the first switch assembly 105, and the first power device 106 is used for controlling the opening and closing of the shielding portion 104.

The first power device 106 may include a control panel and a processor, the processor is electrically connected to the first switch assembly 105 and the control panel, and the processor may control the first switch assembly 105 to drive the shielding portion 104 to open and close according to a control command input by the control panel. The control commands may include switching speed, switching angle, switching time, etc.

Referring to fig. 4, fig. 4 is a schematic structural diagram of a fourth evaporation apparatus 10 provided in the present application. The evaporation apparatus 10 further includes a second evaporation shutter 107 and a connection portion 108. The second vapor deposition baffle 107 is provided on the base 101 in a direction perpendicular to the base 101, and surrounds the periphery of the first vapor deposition baffle 103 on the side away from the vapor deposition source 102. The connecting portion 108 is provided on the base 101 in a direction perpendicular to the base 101, and is provided between the first vapor deposition baffle 103 and the second vapor deposition baffle 107, and the connecting portion 108 connects the shielding portion 104.

The second evaporation baffle 107 is used to shield the connecting portion 108 from the evaporation material in the chamber of the evaporation apparatus 10. The height of the shielding portion 104 can be adjusted by providing the connecting portion 108, so that opening and closing of the shielding portion 104 can be controlled more easily, collision and interference between components can be further reduced, and the operation of the vapor deposition device 10 can be smoother.

Referring to fig. 5, fig. 5 is a schematic structural diagram of a fifth evaporation apparatus 10 provided in the present application. In the vapor deposition device 10 shown in fig. 5, the connection portion 108 includes a telescopic member 1081, and the telescopic member 1081 is used for controlling the movement of the shielding portion 104 in a direction perpendicular to the base 101 and controlling the opening and closing of the shielding portion 104. The telescoping assembly 1081 comprises any of a telescoping rod, a sliding rail, or a scissor.

For example, the telescoping rod includes a sleeve 10812 and a support rod 10811. The support rod 10811 is disposed within the sleeve 10812 and is coupled to the shield portion 104.

During the evaporation process, the system stops vacuuming, the support rod 10811 supports the shielding part 104 to ascend, and when the shielding part 104 leaves the first evaporation baffle plate 103 and the second evaporation baffle plate 107, the support rod 10811 rotates to drive the shielding part 104 to rotate and open, so that all the evaporation sources 102 are exposed. Then the substrate to be evaporated rotates to perform evaporation operation. After a substrate to be vapor-deposited is completely vapor-deposited, the vapor deposition device 10 is vacuumized, the support rod 10811 rotates and drives the shielding portion 104 to rotate and return, and the support rod 10811 descends and drives the shielding portion 104 to close. The machine takes away the evaporated substrate, and takes off a substrate to be evaporated to perform operations such as alignment, and so on.

Referring to fig. 6, fig. 6 is a schematic view of a sixth structure of an evaporation apparatus 10 provided in the present application. In the vapor deposition device 10 shown in fig. 6, a second power device 109 is connected to the expansion/contraction unit 1081, and the second power device 109 controls the expansion/contraction of the expansion/contraction unit 1081. Taking the telescopic assembly 1081 of the support rod 10811 and the sleeve 10812 as an example, the support rod 10811 may be connected to a mechanical motor device, and the mechanical motor device is used to control the support rod 10811 to move up and down, so as to extend and retract the telescopic assembly 1081.

Referring to fig. 7, fig. 7 is a schematic diagram of a seventh structure of the evaporation apparatus 10 provided in the present application. In the vapor deposition device 10 shown in fig. 7, the connection portion 108 includes a telescopic member for controlling the movement of the shielding portion 104 in a direction perpendicular to the base plate 101, and a second switch member 1082 for controlling the opening and closing of the shielding portion 104.

The second switch element 1082 can control the shielding portion 104 to rotate in a direction parallel to the base platform 101, and the second switch element 1082 can also control the shielding portion 104 to open and close at an angle with the plane of the base platform 101 in the manner shown in fig. 2. When the evaporation apparatus 10 starts evaporation operation, the shielding portion 104 is fully opened, and when the machine carries a substrate to be evaporated, the shielding portion 104 is fully closed.

The second switch component 1082 is disposed at a side close to the shielding portion 104, the second switch component 1082 is connected to a second power device 109, and the second power device 109 is used for controlling the second switch component 1082 to open and close the shielding portion 104.

The second power device 109 may include a control panel and a processor, the processor is electrically connected to the second switch element 1082 and the control panel, and the processor may control the second switch element 1082 to drive the shielding portion 104 to open or close according to a control instruction input by the control panel. The control commands may include switching speed, switching angle, switching time, etc.

Referring to fig. 8, fig. 8 is a schematic view of an eighth structure of an evaporation apparatus 10 provided in the present application. In the evaporation apparatus 10 shown in fig. 8, the second switch component 1082 includes a first connecting piece 10821 and a transmission piece 10822, the first connecting piece 10821 connects the shielding portion 104 and the transmission piece 10822, the transmission piece 10822 connects the telescopic component 1081, and the telescopic component 1081 extends and contracts to control the transmission piece 10822 to drive the first connecting piece 10821 to move, so that the shielding portion 104 is opened and closed.

The transmission part 10822 is used for controlling the shielding part 104 to open and close, when the shielding part 104 forms an angle of 90 degrees with the plane of the base table 101, the top of the evaporation source 102 is completely exposed, and the space occupied in the evaporation equipment 10 when the shielding part 104 is opened can be effectively reduced. Therefore, more evaporation sources 102 can be arranged in the evaporation equipment 10, so that the film layer formed by evaporation is more uniform, the waste of materials can be reduced, and the production cost can be reduced.

Referring to fig. 9, fig. 9 is a schematic view of a ninth structure of an evaporation apparatus 10 provided in the present application. In the vapor deposition device 10 shown in fig. 9, the second switch element 1082 includes a second connector 10823 and a rotating member 10824, the second connector 10823 connects the rotating member 10824 and the shielding portion 104, and the rotating member 10824 controls the shielding portion 104 to rotate to open and close.

The rotor 10824 is used to control the opening and closing of the shielding part 104, the shielding part 104 rotates on the plane parallel to the base 101, when the evaporation source 102 is completely exposed, the shielding part 104 does not form any additional baffle plate to shield the evaporation material perpendicular to the plane of the base 101.

Referring to fig. 10, fig. 10 is a partial structural schematic view of the second switch element 1082, the shielding portion 104 and the telescopic element 1081 provided in the present application. In the vapor deposition device 10 shown in fig. 10, the second switch module 1082 includes a semi-circular gear 10825, a gear 10826, and a third link 10827, the third link 10827 connects the gear 10826 to the telescopic module 1081, the gear 10826 engages with the semi-circular gear 10825, the semi-circular gear 10825 connects to the shutter 104, and the shutter 104 is opened and closed by transmission of the gear 10826.

In the embodiment shown in fig. 10, the second switch element 1082 includes a semi-circular gear 10825, a gear 10826 and a third connecting member 10827, when the telescopic element 1081 is telescopic, the gear 10826 is driven to rotate, the gear 10826 drives the semi-circular gear 10825 to move in the same direction, the semi-circular gear 10825 is connected to the shielding portion 104, and when the semi-circular gear 10825 rotates, the shielding portion 104 is driven to open and close.

This kind of mode is convenient for the equipment and the dismantlement of second switch module 1082, can also adjust the rotational speed of second switch module 1082 through the size of adjusting the number of teeth of gear 10826, gear 10826, makes second switch module 1082 adaptability stronger, can be applied to the not unidimensional first evaporation plating baffle 103 as required. Moreover, the turning of the shielding portion 104 is driven by the gear 10826, so that the problem of breakage or poor falling caused by multiple turning can be avoided

Referring to fig. 11, fig. 11 is a partial structural schematic view of the blocking portion 104 and the connecting portion 108 provided in the present application. A first sealing baffle 1041, a second sealing baffle 1042 and a third sealing baffle 1043 which are corresponding to the first evaporation baffle 103 in shape are arranged on one side of the shielding part 104 close to the base platform 101 along the direction vertical to the base platform 101, a first gap 104a is formed between the first sealing baffle 1041 and the second evaporation baffle 107, and the first evaporation baffle 103 is embedded into the first gap 104 a; a second gap 104b is formed between the second sealing baffle 1042 and the third sealing baffle 1043, and the second evaporation baffle 107 is embedded in the second gap 104 b.

The first sealing baffle plate 1041, the second sealing baffle plate 1042 and the third sealing baffle plate 1043 are arranged on the shielding portion 104, so that the shielding portion 104 can be more tightly embedded with the first evaporation baffle plate 103 and the second evaporation baffle plate 107, and the evaporation materials can be prevented from leaking due to the fact that the shielding portion 104 is not tightly covered. The problem of poor evaporation mark generated in the evaporation process can be better avoided by the arrangement mode.

Wherein, one side of the second seal baffle 1042 close to the base 101 is set to be chamfered. The second sealing baffle 1042 is chamfered to better accommodate the deviation of the device operation. In some embodiments, the second seal retainer 1042 may also be provided in a right angle shape.

Referring to fig. 12, fig. 12 is a schematic structural diagram of a tenth vapor deposition apparatus 10 provided in the present application. The vapor deposition device further comprises a base 110, wherein the base 110 is arranged on the base 101, and the vapor deposition source 102, the first vapor deposition baffle 103 and the second vapor deposition baffle 107 are arranged on the base 110. The setting of the base 110 can facilitate the adjustment of the positions of the evaporation source 102, the first evaporation baffle 103 and the second evaporation baffle 107 to meet different evaporation requirements, and can ensure the uniformity of evaporation under different mask patterns.

Referring to fig. 13, fig. 13 is a schematic diagram of an eleventh structure of an evaporation apparatus 10 provided in the present application. The base 110 includes a support 1101 and an elevating section 1102, the first vapor deposition baffle plate 103, the second vapor deposition baffle plate 107, the connecting section 108, and the shielding section 104 are provided on the support 1101, the vapor deposition source 102 is provided on the elevating section 1102, and the elevating section 1102 is used to adjust the height of the vapor deposition source 102 with respect to the first vapor deposition baffle plate 103, the second vapor deposition baffle plate 107, the connecting section 108, and the shielding section 104.

Carry out the lift operation to evaporation coating source 102, can adjust the evaporation coating scope of evaporation coating source 102 to adjust the density and the homogeneity that highly can treat the evaporation coating layer on the evaporation coating base plate of evaporation coating source 102, can reduce material cost on the one hand, on the other hand can guarantee the rete quality, and then improve the quality of the display panel who adopts evaporation coating equipment 10 to make.

The evaporation source 102 includes a dot evaporation source and a line evaporation source. When the vapor deposition source 102 is a point vapor deposition source, the cross section of the first vapor deposition baffle 103 and the second vapor deposition baffle 107 parallel to the base 101 is circular. When the vapor deposition source 102 is a linear vapor deposition source, the first vapor deposition baffle plate 103 and the second vapor deposition baffle plate 107 have a rectangular cross section parallel to the base 101.

Wherein, the point evaporation source is commonly used for evaporating metal materials, and the line evaporation source is commonly used for evaporating organic materials. The evaporation equipment 10 provided by the application can be suitable for different evaporation sources 102, so that materials which can be evaporated by the evaporation equipment 10 are wider, and the evaporation equipment 10 provided by the application is suitable for different evaporation requirements.

Referring to fig. 14, fig. 14 is a schematic diagram of a twelfth structure of an evaporation apparatus 10 provided in the present application. The vapor deposition device 10 shown in fig. 14 further includes a vacuum unit 111, the vacuum unit 111 includes a vacuum pipe 1111 and a vacuum pump 1112, the vacuum pipe 1111 connects the vacuum pump 1112 and the vapor deposition device 10, and the vacuum unit 111 is used for performing vacuum evacuation processing on the vapor deposition device 10.

It should be noted that the vacuum pipe 1111 shown in fig. 14 is connected to the region surrounded by the first vapor deposition baffle plate 103, and actually, the vacuum pipe 1111 may be provided outside the region surrounded by the first vapor deposition baffle plate 103, as long as it is connected to the chamber of the vapor deposition apparatus 10 and can perform the vacuum pumping operation on the vapor deposition apparatus 10.

The evaporation apparatus 10 provided in the present application can be used in a manufacturing process of a display panel, and the display panel can be an Active light emitting display panel, such as an Organic light-emitting diode (OLED) display panel, an Active matrix Organic light-emitting diode (AMOLED) display panel, a Passive matrix Organic light-emitting diode (PMOLED) display panel, a Quantum dot Organic light-emitting diode (QLED) display panel, a Micro light-emitting diode (Micro-LED) display panel, and a sub-millimeter light-emitting diode (Mini-LED) display panel; the display panel may be a passive emission type display panel such as a Liquid Crystal Display (LCD).

The evaporation equipment provided by the application is described in detail above, and the principle and the implementation mode of the application are explained by applying specific examples, and the description of the above examples is only used for helping understanding the method and the core idea of the application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. An evaporation apparatus, comprising:

the shielding part is arranged on one side, far away from the base station, of the first evaporation baffle plate, and the shielding part is covered with the first evaporation baffle plate;

a second evaporation baffle and a connecting part; the second evaporation baffle is arranged on the base platform along the direction vertical to the base platform and is arranged on the periphery of one side of the first evaporation baffle, which is far away from the evaporation source; the connecting part is arranged on the base platform along a direction vertical to the base platform and is arranged between the first evaporation baffle and the second evaporation baffle, and the connecting part is connected with the shielding part; the connecting partForThe height of the shielding part is adjusted.

2. The evaporation apparatus according to claim 1, further comprising a first switch assembly, wherein the first switch assembly connects the first evaporation baffle plate and the shielding portion, and the first switch assembly is configured to control the shielding portion to open and close.

3. The evaporation apparatus according to claim 2, further comprising a first power device, wherein the first power device is connected to the first switch assembly, and the first power device is used for electrically controlling the first switch assembly to control the opening and closing of the shielding portion.

4. The evaporation apparatus according to claim 1, wherein the connecting portion comprises a telescopic assembly for controlling the shielding portion to move in a direction perpendicular to the base station and controlling the shielding portion to open and close.

5. The vapor deposition apparatus according to claim 4, wherein the telescoping assembly is any one of a telescoping rod, a sliding rail, or a scissor fork.

6. The evaporation apparatus according to claim 4, wherein a second power device is connected to the retractable assembly, the second power device is disposed between the first evaporation baffle and the second evaporation baffle, and the second power device is used for controlling the retractable assembly to retract.

7. The evaporation equipment according to claim 1, wherein the connecting portion comprises a telescopic assembly and a second switch assembly, the telescopic assembly is connected with the second switch assembly, the telescopic assembly is used for controlling the shielding portion to move in a direction perpendicular to the base station, and the second switch assembly is used for controlling the shielding portion to open and close.

8. The vapor deposition apparatus according to claim 7, wherein the second switch assembly is disposed on a side close to the shielding portion, and a second power device is connected to the second switch assembly and electrically controls the second switch assembly to open and close the shielding portion.

9. The evaporation apparatus according to claim 8, wherein the second switch assembly comprises a first connecting member and a driving member, the first connecting member connects the shielding portion and the driving member, the driving member connects the retractable assembly, and the retractable assembly extends and retracts to control the driving member to drive the first connecting member to move, so that the shielding portion opens and closes.

10. The evaporation apparatus according to claim 8, wherein the second switch assembly comprises a second connecting member and a rotating member, the second connecting member connects the rotating member and the shielding portion, and the rotating member controls the shielding portion to open and close in a rotating manner.

11. The evaporation equipment according to claim 8, wherein the second switch assembly comprises a semicircular gear, a gear and a third connecting piece, the third connecting piece is connected with the gear and the telescopic assembly, the gear is engaged with the semicircular gear, the semicircular gear is connected with the shielding portion, and the shielding portion is opened and closed through the gear transmission.

12. The evaporation equipment according to claim 1, wherein a first sealing baffle plate, a second sealing baffle plate and a third sealing baffle plate which correspond to the first evaporation baffle plate in shape are arranged on one side of the shielding part close to the base station along a direction perpendicular to the base station, a first gap is formed between the first sealing baffle plate and the second evaporation baffle plate, and the first evaporation baffle plate is embedded in the first gap; and a second gap is formed between the second sealing baffle and the third sealing baffle, and the second evaporation baffle is embedded into the second gap.

13. The vapor deposition apparatus according to claim 12, wherein a side of the second sealing shutter adjacent to the base is chamfered.

14. The evaporation apparatus according to claim 1, further comprising a base provided on the base, wherein the evaporation source, the first evaporation baffle, and the second evaporation baffle are provided on the base.

15. The evaporation apparatus according to claim 14, wherein the base includes a support portion and a lifting portion, the first evaporation plate, the second evaporation plate, the connecting portion, and the shielding portion are provided on the support portion, the evaporation source is provided on the lifting portion, and the lifting portion is configured to adjust a height of the evaporation source with respect to the first evaporation plate, the second evaporation plate, the connecting portion, and the shielding portion.

16. The evaporation apparatus according to claim 1, wherein the evaporation source comprises a point evaporation source and a line evaporation source; when the evaporation source is a point evaporation source, the section of the first evaporation baffle and the section of the second evaporation baffle, which are parallel to the base platform, are circular; when the evaporation source is a linear evaporation source, the section of the first evaporation baffle and the section of the second evaporation baffle, which are parallel to the base station, are rectangular.

17. The evaporation apparatus according to claim 1, further comprising a vacuum device, wherein the vacuum device comprises a vacuum tube and a vacuum pump, the vacuum tube connects the vacuum pump and the evaporation apparatus, and the vacuum device is used for performing vacuum pumping treatment on the evaporation apparatus.