CN112975947B - Component pin correction method, device, equipment and storage medium - Google Patents

Abstract

Embodiments of the present invention disclose a method, device, equipment and storage medium for correcting component pins. The correction method of the component pins includes: based on the mechanical model of the component pins deformed under the action of external force, establishing the functional relationship between the initial deformation amount of the component pins and the elastic recovery amount under the action of the external force; The position information of the solder joints to be soldered and the position information of the component pins, and according to the position information of the solder joints to be soldered and the position information of the component pins, the robot is controlled to reach the workspace around the solder joints to be soldered in the desired attitude; The position information of the solder joints to be welded and the position information of the component pins, as well as the functional relationship between the initial deformation amount and the elastic recovery amount, control the robot to correct the component pins to the desired position, so that the component pins can be moved from The desired position springs back to the position of the center of the solder joint to be welded. The technical solutions of the embodiments of the present invention can realize high-precision component pin correction.

Description

Correction method, device, equipment and storage medium for component pins

technical field

Embodiments of the present invention relate to the field of robotics, and in particular, to a method, device, device, and storage medium for correcting component pins.

Background technique

At present, automatic welding systems based on robot technology are widely used in the manufacture of integrated electronic equipment. For example, automatic welding systems that use robotic arms to support soldering pens and solder wire transmission have been successfully applied to automatic welding of in-line electronic components and special-shaped components. .

However, the actual automatic welding system production line has the problem of low welding yield, and welding defects are prone to occur. For example, due to the uncertainty of the automatic plug-in machine, it will cause the component pins to deviate from the axis of the solder joint through holes, which will affect the distribution of molten solder, resulting in uneven distribution of solder on both sides of the pins, thereby affecting the mechanical stability of the solder joints. reliability. At the same time, the deviation of the pin from the axis of the solder joint through hole also increases the probability of bridging short-circuit faults in adjacent solder joints. In addition, the component pins are generally made of flexible metal materials, so they are prone to bending deformation during transportation, storage and plug-in, which further aggravates the welding defects of the above-mentioned component pins and restricts the large-scale application of automatic welding technology. .

In order to solve the above problems, the research of the existing technology mainly focuses on the post-processing and pre-processing of the welding. The post-welding processing refers to the detection of the solder joints using machine vision after the welding is completed, and the unqualified solder joints are manually detected. Reprocess. At present, vision-based post-processing methods include solder joint defect detection technology using automatic optical inspection technology, multi-feature-based multi-class defect detection methods, and super-resolution instance reconstruction-based defect detection methods. In the prior art, the above-mentioned various automatic optical inspection methods are used to detect defective solder joints, and then deliver them to manual processing. Obviously, this method still requires labor to perform, is inefficient, and cannot solve soldering defects caused by bending and deformation of component pins.

Compared with the above post-processing method, the pre-processing method is the pre-processing method, that is, before applying the automatic welding system for batch welding, a large number of tests and debugging are carried out manually for different types of solder joints. The solder joint yield rate under the conditions is used to determine the optimal welding process parameters. However, this solution also cannot solve the welding defects caused by the bending deformation of the component pins.

SUMMARY OF THE INVENTION

Embodiments of the present invention provide a method, device, device, and storage medium for correcting component pins, so as to achieve high-precision component pin correction.

In a first aspect, an embodiment of the present invention provides a method for correcting component pins, including:

Based on the mechanical model of the deformation of the component pins under the action of external force, the functional relationship between the initial deformation of the component pins and the elastic recovery amount under the action of the external force is established;

Obtain the position information of the solder joints to be welded and the position information of the component pins, and control the robot to reach the to-be-soldered solder joints in a desired attitude according to the position information of the solder joints to be soldered and the position information of the component pins. the workspace around the point;

According to the position information of the solder joints to be welded and the position information of the component pins, as well as the functional relationship between the initial deformation amount and the elastic recovery amount, the robot is controlled to place the component pins Corrected to a desired position, so that the component lead can spring back from the desired position to the position of the center of the to-be-soldered solder joint.

Optionally, based on the mechanical model of the deformation of the component pins under the action of external force, establish a functional relationship between the initial deformation amount of the component pins and the elastic recovery amount under the action of the external force, including:

Establish a mechanical model between the external force when the component pin undergoes elastic-plastic deformation and elastic recovery motion under the action of external force, and the deformation amount of the free end of the component pin;

Determine the functional relationship between the cross-sectional position of any cross-section and the external force and the thickness ratio of the elastically deformed fiber layer in the cross-section within the elastic-plastic deformation region of the component pin when the component pin is subjected to external force ; Wherein, the section is perpendicular to the axis of the component pin;

Calculate the curvature of each point on the axis of the component lead and the external force on the free end of the component lead according to the functional relationship between the cross-section position and the external force and the thickness ratio of the elastically deformed fiber layer in the cross-section. The deflection under the action, and the micro-element method is used to solve the deflection and deflection angle of each point on the axis and the total length of the fiber layer of the component pin according to the curvature and the deflection;

Obtain multiple sets of external forces and the corresponding deflection data of the free ends of the component pins, according to the mechanical model, the deflection of each point on the axis, the deflection angle and the total length of the component pin fiber layer between The numerical relationship, and the multiple sets of external forces and their corresponding deflection data, determine the functional relationship between the initial deformation of the component pins and their elastic recovery under the action of external forces;

Wherein, the initial deformation amount and the elastic recovery amount are represented by the deflection of the free end of the component lead.

Optionally, in the elastic-plastic deformation region of the component pins, the functional relationship between the cross-sectional position of any cross-section and the external force and the ratio of the thickness of the elastically deformed fiber layer in the cross-section is expressed as:

Wherein, l is the position of the section, L is the distance between the action point of the external force and the fixed end of the pin along the axis of the component pin, _Me is the elastic limit bending moment, F is the external force, λ is the linear strengthening coefficient, and ξ(l) is the thickness ratio of the elastically deformed fiber layer;

The curvature is expressed as:

Among them, C(l) is the curvature, E is the elastic modulus, I is the moment of inertia of the section, ξ(l) is the thickness ratio of the elastically deformed fiber layer, and l _b is the elastic-plastic deformation of the component pins The lead length of the deformation area, L _W is the total length of the component lead;

The deflection of the component pins under the action of external force is expressed as:

δ=δ _L +(L _w −S) sinθ _L ;

Wherein, δ is the deflection of the component pin, δ _L is the deflection of the component pin under the action of external force, S is the total length of the fiber layer of the component pin, and θ _L is the axis The deflection angle at the point of application of the external force;

The deflection and deflection angle of each point on the axis and the total length of the fiber layer of the component pins are expressed as:

Among them, θ _l is the deflection angle of the first point on the axis, θ _l+dl is the deflection angle of the second point on the axis, and Δl is the distance between the first point and the second point on the axis difference, δ _l is the deflection produced by the first point on the axis under the action of external force, and δ _l+dl is the deflection produced by the second point on the axis under the action of the external force.

Optionally, obtain the position information of the solder joints to be welded and the position information of the component pins, and control the robot to reach the desired position according to the position information of the solder joints to be soldered and the position information of the component pins. Describe the workspace around the solder joints to be soldered, including:

Real-time acquisition of the image information of the solder joints to be welded and the free ends of the component pins to identify the position information of the solder joints to be soldered and the position information of the component pins;

Based on the position information of the solder joints to be welded, the position information of the component pins, the position constraint relationship between the end effector of the robot and its work site, and the end effector and the component lead The position constraint relationship between the feet determines the desired posture of the end effector of the robot;

According to the position information of the component pins, the radius of the solder joints to be welded, and the distance between adjacent solder joints, determine the desired area for the robot to perform pin correction;

According to the desired posture and the desired area, a workspace of the robot and a potential energy function related to the workspace are defined, and according to the potential energy function and the parameter information of the robot, the speed of the robot reaching the workspace is determined. torque, and control the robot according to the torque.

Optionally, the position constraint relationship between the end effector and the component pins is expressed as:

为坐标轴n在末端执行器坐标系的位置，^Ix_s为所述待焊接焊点的位置，

为所述元器件引脚自由端的位置，n_Z，o_Z和a_Z分别为平行于所述末端执行器坐标系的坐标轴的单位方向矢量n、o和a，在所述世界坐标系的z轴的坐标，γ为所述末端执行器与所述世界坐标系的xoy平面之间的夹角，x和y分别为所述世界坐标系的x轴和y轴，a_x，a_y和a_Z分别为所述末端执行器坐标系的坐标轴的单位方向矢量a，在所述世界坐标系的x轴、y轴和z轴的坐标；Among them, n is the representation of the unit direction vector of the coordinate axis of the end effector coordinate system in the world coordinate system,

is the position of the coordinate axis n in the end effector coordinate system, ^I x _s is the position of the welding spot to be welded,

is the position of the free end of the component pin, n _Z , o _Z and a _Z are the unit direction vectors n, o and a parallel to the coordinate axis of the end effector coordinate system, respectively, in the world coordinate system The coordinates of the z-axis, γ is the angle between the end effector and the xoy plane of the world coordinate system, x and y are the x-axis and y-axis of the world coordinate system, respectively, a _x , a _y and a _Z are respectively the unit direction vector a of the coordinate axis of the end effector coordinate system, the coordinates of the x-axis, y-axis and z-axis of the world coordinate system;

The desired region is expressed as:

Wherein, ^I x _d is the desired position, λ ₁ is a preset compensation coefficient, r ₂ is the outer diameter of the solder joint to be welded, and d _min is the distance between the solder joint to be welded and the adjacent solder joint .

Optionally, according to the position information of the solder joints to be welded, the position information of the component pins, and the functional relationship between the initial deformation amount and the elastic recovery amount, the robot is controlled to The component pins are corrected to a desired position, so that the component pins can spring back from the desired position to the position of the center of the to-be-soldered solder joint, including:

Based on the position information of the solder joints to be welded and the position information of the component pins, determine the initial deformation amount of the component pins;

According to the initial deformation of the component pins and the functional relationship between the initial deformation and the elastic recovery, predict the elastic recovery of the component pins under the action of external force;

According to the position information of the to-be-soldered solder joints and the elastic recovery amount, determine the expected position of the component lead under the correction of the robot;

According to the desired position and the parameter information of the robot, the torque required by the robot to correct the component pins is determined, and the robot is controlled according to the torque.

Optionally, the desired position is expressed as:

^I x _d = ^I x _s + ^I Δx;

为所述元器件引脚的初始变形量对应的弹性回复量，L_pixel为像素当量，

为所述元器件引脚自由端的位置。Wherein, ^I x _d is the desired position, ^I x _s is the position of the solder joint to be welded, ^I Δx is the pixel distance of the elastic recovery amount in the image space,

is the elastic recovery amount corresponding to the initial deformation of the component pins, L _pixel is the pixel equivalent,

is the position of the free end of the component pins.

In a second aspect, an embodiment of the present invention also provides a device for correcting component pins, including:

The function relationship establishing module is used to establish the functional relationship between the initial deformation of the component pins and the elastic recovery amount under the external force based on the mechanical model of the component pins deformed under the action of external force;

The first control module is used to obtain the position information of the solder joints to be welded and the position information of the component pins, and according to the position information of the solder joints to be welded and the position information of the component pins, control the robot to expect The posture reaches the working space around the welding spot to be welded;

The second control module is configured to control the robot according to the position information of the solder joints to be welded, the position information of the component pins, and the functional relationship between the initial deformation amount and the elastic recovery amount The component pins are corrected to a desired position, so that the component pins can spring back from the desired position to the position of the center of the solder joint to be soldered.

In a third aspect, an embodiment of the present invention further provides an electronic device, the electronic device comprising:

one or more processors;

a storage device for storing one or more programs;

When the one or more programs are executed by the one or more processors, the one or more processors implement the method for correcting component pins as described in the first aspect.

In a fourth aspect, an embodiment of the present invention further provides a computer-readable storage medium on which a computer program is stored, and when the program is executed by a processor, implements the method for correcting component pins according to the first aspect.

The technical solution of the embodiment of the present invention is based on the mechanical model of the deformation of the component pins under the action of external force, and establishes the functional relationship between the initial deformation amount of the component pins and the elastic recovery amount under the action of the external force. The position information of the solder joints and the position information of the component pins, control the robot to reach the workspace around the solder joints to be soldered with the desired attitude, and according to the position information of the solder joints to be soldered and the position information of the component pins, as well as the initial The functional relationship between the deformation amount and the elastic recovery amount controls the robot to correct the component pins to the desired position, so that the component pins can rebound from the desired position to the position of the center of the solder joint to be welded. Compared with the prior art, this solution adds component pin correction work in the automatic welding process, realizes high-efficiency and high-precision component pin correction, and helps to fundamentally solve the problems caused by bending and deformation of component pins. It reduces the risk of bridging and short-circuiting of adjacent solder joints on the circuit board, so that the solder on both sides of the pins can be evenly distributed, thereby improving the mechanical stability and electrical reliability of the solder joints, thereby improving the yield of automated soldering production lines. Welding quality.

Description of drawings

1 is a schematic flowchart of a method for correcting component pins according to an embodiment of the present invention;

2 is a schematic diagram of the positions of a component pin in different deformation states according to an embodiment of the present invention;

3 is a schematic diagram of a function curve of an external force and a deformation amount of a component pin provided by an embodiment of the present invention;

4 is a schematic diagram of the division of the deformation area of a component pin provided by an embodiment of the present invention;

5 is a schematic diagram of a cross-section of a component lead and its stress and strain distribution provided by an embodiment of the present invention;

6 is a schematic diagram of a pin correction work site provided by an embodiment of the present invention;

7 is a detailed schematic diagram of a pin correction work site provided by an embodiment of the present invention;

8 is a schematic image diagram of a pin correction work site provided by an embodiment of the present invention;

9 is a schematic diagram of a function curve of a workspace provided by an embodiment of the present invention;

10 is a schematic diagram of a curve of a weight function provided by an embodiment of the present invention;

11 is a schematic diagram of a simulation result of component pin correction control provided by an embodiment of the present invention;

12 is a schematic diagram of another component pin correction control simulation result provided by an embodiment of the present invention;

13 is a schematic diagram of another component pin correction control simulation result provided by an embodiment of the present invention;

14 is a schematic diagram of another component pin correction control simulation result provided by an embodiment of the present invention;

15 is a schematic flowchart of another method for correcting component pins according to an embodiment of the present invention;

16 is a schematic diagram of a module structure of a device for correcting component pins provided by an embodiment of the present invention;

FIG. 17 is a schematic structural diagram of a terminal according to an embodiment of the present invention.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention, but not to limit the present invention. In addition, it should be noted that, for the convenience of description, the drawings only show some but not all structures related to the present invention.

As described in the background art, the production line of the automatic welding system has the problem of low welding yield, and welding defects are prone to occur, and the bending deformation of the component pins aggravates the welding defect problem. In the prior art, the solution of delivering manual processing of defective solder joints after automatic optical inspection still requires labor to perform, which is not only inefficient, but also cannot solve soldering defects caused by bending and deformation of component pins. The scheme of determining the welding process parameters through test debugging also cannot solve the welding defects caused by the bending deformation of the component pins.

In view of the above problems, embodiments of the present invention provide a method for correcting component pins. FIG. 1 is a schematic flowchart of a method for correcting component pins provided by an embodiment of the present invention. This embodiment can be applied to the situation of realizing high-precision component pin correction. This method can be performed by correcting component pins. The apparatus is executed, and the apparatus can be implemented in software and/or hardware. The apparatus can be configured in an electronic device, such as a server or a terminal device. Typical terminal devices include mobile terminals, including mobile phones, computers, or tablet computers. As shown in Figure 1, the method may specifically include:

S110 , establishing a functional relationship between the initial deformation amount of the component pin and the elastic recovery amount under the external force based on the mechanical model of the deformation of the component pin under the action of the external force.

The component pins refer to the pins of electronic components, such as in-line electronic components. The material of component pins is generally metal materials such as iron-nickel alloy or copper alloy. These metal materials have certain flexibility, so they are prone to bending deformation during transportation, storage and plug-in. Therefore, the above-mentioned characteristics of the component leads can be used to correct the component leads that have been bent and deformed using external force. The inventor's research found that in the process of applying external force to the component pins to correct them, when the external force is removed, the component pins will spontaneously recover elastically, which will cause errors in the correction of the component pins. .

Fig. 2 is a schematic diagram of the position of a component lead in different deformation states provided by an embodiment of the present invention. Exemplarily, as shown in The pin 10 is in the first position 10(1). During the process of applying the external force F, the component pins 10 are deformed under the action of the external force F and move to the second position 10 (2). In this stage, the component pins are deformed under the action of the external force. The microscopic level is manifested as the fiber layer inside the pin, some of which have reversible elastic deformation, and some of which have irreversible plastic deformation, that is, elasto-plastic deformation of the component pins. When the external force F is removed, the component pins 10 will spontaneously perform elastic recovery and move to the third position 10 (3). In this stage, after removing the external force, the elastically deformed part of the fiber layer returns to the original state (the macroscopic manifestation is the elastic recovery movement of the component pins), while the part of the plastically deformed fiber layer remains when the external force is removed. status. Therefore, when correcting the lead of the component, it is necessary to solve the correction error caused by the elastic recovery characteristics of the lead material.

Referring to FIG. 2 , for example, if the component pins 10 need to reach the target position before soldering, that is, the axis position of the through hole of the solder joint to be soldered, when external force is applied for pin correction, in order to improve the accuracy of pin correction , it is necessary to compensate for the elastic recovery displacement, so that after the external force is removed, the component pins are just in the target position after the spontaneous elastic recovery movement. Assuming that the third position 10 (3) is the axis position of the through hole of the solder joint to be welded, that is, the welding position of the component pin 10 under normal circumstances, after considering the compensation amount of the elastic recovery displacement, it can be determined that the component pin 10 is in the external force The second position 10 ( 2 ) that can be reached under the action of F, the second position 10 ( 2 ) should satisfy that after the external force F is removed, the component pins 10 can automatically rebound from the second position 10 ( 2 ) to the third position 10 (3).

Assuming that the component lead 10 at the first position 10(1) has an initial deformation relative to the third position 10(3) of δ ₀ , the component lead 10 rebounds from the second position 10(2) to the third position 10(2). The elastic recovery amount of the three positions 10 (3) is δ _s . Since the deformation amount of the component lead 10 under the action of the external force F has a corresponding numerical relationship with the external force F, it can be calculated based on the external force of the component lead 10 The mechanical model of deformation under the action of F, establishes the functional relationship between the initial deformation amount δ ₀ of the component pin 10 and the elastic recovery amount δ _s . In this way, when correcting the component pins, the initial deformation amount δ ₀ of the component pins 10 can be used to determine the elastic recovery amount δ _s that needs to be compensated during the correction, and then according to the initial deformation amount δ ₀ and the elastic recovery amount δ _s , determine the second position 10(2) that the component pin 10 should reach under the action of the external force F, so that after the external force F is removed, the component pin 10 can automatically rebound from the second position 10(2) to the place to be welded. The axis position of the through hole of the solder joint ensures the accuracy of the correction of the component pins.

S120: Acquire the position information of the solder joints to be welded and the position information of the component pins, and control the robot to reach the work around the solder joints to be soldered in a desired attitude according to the position information of the solder joints to be soldered and the position information of the component pins space.

Among them, before the component pins are welded, the component pin correction work is performed. When performing the component pin correction work, the position information of the solder joints to be soldered and the position information of the component pins can be obtained. The solder joints to be soldered can be solder joints on the integrated circuit board, and the component pins are the solder joints to be soldered. to the pin of the component on this solder joint. The robot can be a robot in an automated welding system, such as a robotic arm. The working space around the solder joint to be soldered refers to an area around the solder joint to be soldered, and the robot performs component pin correction work in this area. The desired posture refers to the posture of the robot when it reaches the workspace, that is, the posture of the correction work.

Exemplarily, according to the position information of the solder joints to be soldered and the position information of the component pins, the offset direction and offset amount of the component pins offset from the solder joints to be soldered can be determined. The orientation and offset can determine the specific position of the workspace that the robot needs to reach, as well as the desired attitude to perform the corrective work of the component pins. In practical applications, the visual servo control method based on the position of the workspace can be used to control the robot to reach the workspace around the solder joints to be soldered in a desired posture, so that the robot can correct the component pins in the workspace in a desired posture. . According to the position information of the solder joints to be welded and the position information of the component pins, the robot is controlled to reach the workspace around the solder joints to be soldered in a desired attitude, which is beneficial to quickly control the robot to reach around the solder joints to be soldered.

S130. According to the position information of the solder joints to be welded and the position information of the component pins, as well as the functional relationship between the initial deformation amount and the elastic recovery amount, control the robot to correct the component pins to the desired position, so that the component leads The foot can spring back from the desired position to the position of the center of the solder joint to be soldered.

Among them, the component pins can be corrected by the end effector of the robot. For example, the robot is a robotic arm, and the end effector is a welding pen clamped by the robotic arm. Component pins apply external force to correct them. The desired position refers to the position that the component pins reach under the action of the external force applied by the robot, that is, the position that the component pins reach before the robot removes the external force.

Exemplarily, after completing S120, the end effector of the robot has entered the workspace and is in the desired posture for performing pin correction. At this stage, the image-based visual servo control method can be used to control the end effector of the robot to perform Component pin correction work. Specifically, according to the position information of the solder joints to be soldered and the position information of the component pins, calculate the distance that the pins are offset from the center of the through holes of the solder joints, that is, the initial deformation amount δ ₀ of the component pins. According to the functional relationship between the initial deformation amount and the elastic recovery amount obtained in S110, the elastic recovery amount δ _s of the component pins can be predicted. By calculating the sum of the initial deformation δ ₀ and the elastic recovery δ _s , the expected position that the component pins should reach under the action of external force can be further obtained. The foot reaches the desired position. Since the above-mentioned desired position considers the elastic recovery compensation, after the robot removes the external force, the component pins can automatically rebound from the desired position to the position of the center of the solder joint to be welded, realizing the correction of the component pins. Since the size of a single solder joint on an integrated circuit board is in the order of millimeters, it is necessary to perform high-precision operations on tiny objects during automatic soldering. The application of the above solution helps control the robot to perform high-precision component pin correction operations.

The technical scheme of the embodiment of the present invention starts from the theory of elastic-plastic deformation of metal materials, and establishes the initial deformation amount of the component pins and its initial deformation under the action of external force based on the mechanical model of the deformation of the component pins under the action of external force. The functional relationship model between the elastic recovery quantities. Then, according to the operation object of the robot, a two-stage mixed pin correction method is proposed: in the first stage, according to the position information of the solder joints to be welded and the position information of the component pins, the robot is controlled to reach the solder joints to be soldered with the desired attitude The surrounding workspace, so that the robot can quickly reach the workspace; in the second stage, according to the position information of the solder joints to be welded and the position information of the component pins, as well as the functional relationship model between the initial deformation amount and the elastic recovery amount, Control the robot to correct the component pins to the desired position, so that the component pins can rebound from the desired position to the position of the center of the solder joint to be soldered, so as to realize the high-precision component pin correction operation. Compared with the prior art, this solution adds component pin correction work in the automatic welding process, realizes high-efficiency and high-precision component pin correction, and helps to fundamentally solve the problems caused by bending and deformation of component pins. It reduces the risk of bridging and short-circuiting of adjacent solder joints on the circuit board, so that the solder on both sides of the pins can be evenly distributed, thereby improving the mechanical stability and electrical reliability of the solder joints, thereby improving the yield of automated soldering production lines. Welding quality.

On the basis of the above-mentioned embodiment, the present embodiment further optimizes the method for correcting the above-mentioned component pins. Optionally, based on the mechanical model of the deformation of the component pins under the action of external force, a functional relationship between the initial deformation amount of the component pins and the elastic recovery amount under the action of the external force is established, specifically including:

S210 , establishing a mechanical model between the external force when the component pin undergoes elastic-plastic deformation and elastic recovery motion under the action of external force, and the deformation amount of the free end of the component pin.

FIG. 3 is a schematic diagram of a function curve of external force and component pin deformation provided by an embodiment of the present invention. Exemplarily, in conjunction with FIG. 2 and FIG. 3 , it is still assumed that the third position 10 ( 3 ) is the solder joint to be soldered through. The axis position of the hole, that is, the welding position of the component pins 10 under normal circumstances, the component pins 10 reach the second position 10(2) from the initial first position 10(1) under the action of the external force F, this process The middle component pins 10 undergo elastic deformation and plastic deformation (collectively referred to as elastic-plastic deformation) under the action of the external force F. The curves of OA and CA' in Fig. 3 represent the elastic deformation stage of the component pins, and the corresponding deformation of the component pins 10 is δ ₀ . The deformation of the pins at this stage can be completely recovered after removing the external force. With the increase of the deformation degree of the pin, a part of the structure of the pin material undergoes irreversible plastic deformation. The relationship between the external force and the deformation amount at this stage can be represented by the AD and A'D' segment curves. If the external force is removed when the component pin 10 reaches the second position 10(2) (corresponding to point B of the AD segment curve), the elastically deformed part of the component pin 10 will spontaneously return to its initial state, and the corresponding element The elastic recovery amount of the device pin 10 is δ _s , this stage can be represented by the BC and B'C' segment curves, the elastic recovery motion of the device pin 10 in this stage follows Hooke's law, the BC and OA segments, and The slope k of the B'C' and CA' segment curves is the same. If the elastic-plastic deformation section of the component pin under the action of external force is known, and the relationship between the external force and the amount of deformation is known, the elastic recovery motion can be used to solve the problem of any elastic-plastic deformation state after removing the external force. Elastic recovery displacement. Therefore, the mechanical model of the component pins in the elastic-plastic deformation stage can be established. Exemplarily, the above-mentioned mechanical model can be expressed as:

Among them, F represents the external force, and δ represents the deformation of the component lead. Optionally, the deformation can be expressed by the deflection of the free end of the lead, where the free end of the lead is the welding end. As shown in Figure 2, the deflection refers to the lead The displacement of the free end in the direction perpendicular to its axis (perpendicular to the l-axis). k=6EI/[L ² (3L _W -L)] is the linear relationship coefficient between the external force F and the pin deformation δ in the elastic deformation stage, where E is the elastic modulus, and L is along the axis of the component pins. , the distance between the action point of the external force F and the fixed end of the pin (the end where the pin is connected to the component), L _W is the total length of the pin, I=πR _p ⁴ /4 is the cross-sectional moment of inertia of the metal pin , R _p is the cross-sectional radius of the component lead 10 . f(δ) represents the AD and _A'D ' stages of the elastic-plastic deformation stage, the functional relationship between the external force F and the pin deformation δ, Fe represents the elastic limit load of the metal pin, and F _s represents the yield of the metal pin load.

S220. Determine the functional relationship between the cross-sectional position of any cross-section and the external force and the thickness ratio of the elastically deformed fiber layer in the cross-section within the elastic-plastic deformation region of the component pin when the component pin is subjected to an external force.

FIG. 4 is a schematic diagram of the division of the deformation area of a component lead provided by an embodiment of the present invention, and FIG. 5 is a schematic diagram of a cross-section of a component lead and its stress and strain distribution provided by an embodiment of the present invention. 4 and 5, for the convenience of analysis, the component lead 10 can be divided into a plastic deformation area 11 near the fixed end of the lead, an elastic-plastic deformation area 12, an elastic deformation area 13 and a rigid area 14 near the free end of the lead. The cross-section of the component lead in its elastic-plastic deformation region 12 refers to the cross-section perpendicular to the axis (ie, the l-axis) of the component lead, such as the cross-section 100 shown in FIG. 5, and the cross-sectional position refers to the component lead position on the axis. The ratio of the thickness of the elastically deformed fiber layer refers to the thickness of the elastically deformed fiber layer in the cross-section of the component pins in the elastic-plastic deformation region 12, which accounts for the proportion of the total fiber layer thickness of the total component pins.

Optionally, when the component pins are subjected to external force, the functional relationship between the cross-sectional position of any cross-section and the external force and the ratio of the thickness of the elastically deformed fiber layer in the cross-section within the elastic-plastic deformation region of the component pins, specifically include:

S222 , determining the numerical relationship between the internal bending moment of any section of the component pin in the elastic-plastic deformation region of the component pin and the stress in the fiber layer of the section when the component pin is subjected to an external force.

Exemplarily, referring to FIGS. 4 and 5 , the internal bending moment refers to the moment of the acting force generated inside the component lead 10 when the component lead 10 is deformed by an external force. In the elastic-plastic deformation region 12, the internal bending moment M _I (l) caused by the deformation of any section of the component pin can be expressed as:

Where σ(h) is the stress distribution of the fiber layer in the pin section, Figure 5 shows the stress distribution curve in the component pin section, and σ is the stress at the section boundary. H is the diameter of the component lead and h is the thickness of the fiber in the cross section.

S224 , according to the numerical relationship between the stress and the strain, and the numerical relationship between the strain and the thickness ratio of the elastically deformed fiber layer in the section, determine the numerical relationship between the inner bending moment and the thickness ratio of the elastically deformed fiber layer.

Exemplarily, the stress distribution σ(h) of the fiber layer in the pin cross-section is expressed as:

是引脚截面内的应变分布，图5示意性地示出了元器件引脚截面内的应变分布曲线，任意截面内的应变沿截面中心对称分布，且应变大小随着纤维层距离轴线的距离增大而增大，σ_e是弹性极限应力，H_e是截面100上发生弹性变形的纤维层的厚度，ε_e为截面中发生弹性变形的纤维层边界处的应变。E′是弹塑性模量，E′可表示为E′＝λE，λ是线性强化系数，E是弹性模量。弹性变形纤维层厚度占比为关于截面位置l的函数，弹性变形纤维层厚度占比可表示为

其中，H_e(l)是任意截面上发生弹性变形的纤维层的厚度，H_e(l)是关于截面位置l的函数，图4示意性地示出了H_e(l)的函数曲线。in,

is the strain distribution in the pin section. Figure 5 schematically shows the strain distribution curve in the component pin section. The strain in any section is symmetrically distributed along the center of the section, and the strain varies with the distance of the fiber layer from the axis. σ _e is the proof stress, He is the thickness of the elastically deformed fiber layer on the section 100 , and _{ε e is} the strain at the boundary of the elastically deformed fiber layer in the section. E' is the elastic-plastic modulus, E' can be expressed as E'=λE, λ is the linear strengthening coefficient, and E is the elastic modulus. The thickness ratio of the elastically deformed fiber layer is a function of the section position l, and the thickness ratio of the elastically deformed fiber layer can be expressed as

where He (l) is the thickness of the _{elastically deformed} fiber layer on any cross-section, He (l) is a function of the cross-section position l, and Fig. 4 schematically shows the function _curve of He (l).

According to the numerical relationship between the stress σ(h) and the strain ε(h), and the numerical relationship between the strain ε(h) and the thickness ratio ξ(l) of the elastically deformed fiber layer in the section, the equation (0.2) The degenerate differentiation is carried out to determine the numerical relationship between the internal bending moment M _I (l) and the thickness ratio ξ(l) of the elastically deformed fiber layer, as follows:

Among them, Me = _{Wσ e represents} the ultimate elastic moment, and W=πR _p ³ /2 represents the flexural modulus of the section.

S226, determine the external bending moment of the component pin under the action of external force.

Among them, the external bending moment is the moment of the external force F acting on the pin, and the external bending moment is a function of the external force F and the section position l. Exemplarily, under the action of external force F, the distribution of external bending moment M can be expressed as:

S227. According to the numerical relationship between the inner bending moment and the outer bending moment, and the numerical relationship between the inner bending moment and the ratio of the thickness of the elastically deformed fiber layer, determine the pin of the component in its elastic-plastic deformation area, the Section position as a function of external force and the fraction of elastically deformed fiber layer thickness within the section.

Specifically, according to the definition of internal stress, it can be known that the internal bending moment caused by it should be opposite to the external bending moment. In its elastic-plastic deformation region, the internal bending moment M _I (l) and the external bending moment M are numerically equal. Combining equations (0.4) and (0.5), it can be obtained that in the elastic-plastic deformation region of the component pins, the cross-sectional position l of any cross-section, the external force F, and the thickness ratio of the elastically deformed fiber layer in the cross-section ξ(l) functional relationship between.

Optionally, in the elastic-plastic deformation region of the component pin, the functional relationship between the cross-sectional position of any cross-section and the external force and the thickness ratio of the elastically deformed fiber layer in the cross-section is expressed as:

Among them, l is the cross-section position, L is the distance between the action point of the external force and the fixed end of the pin along the axis of the component pin, _Me is the elastic limit bending moment, F is the external force, λ is the linear strengthening coefficient, ξ(l) is the thickness ratio of elastically deformed fiber layer.

S230. Calculate the curvature of each point on the axis of the component pin and the deflection of the free end of the component pin under the action of the external force according to the functional relationship between the section position and the external force and the thickness ratio of the elastically deformed fiber layer in the section, and calculate The deflection and deflection angle of each point on the axis and the total length of the fiber layer of the component pins are solved by the micro-element method according to the curvature and deflection.

Exemplarily, according to formula (0.6), the thickness ratio of the elastically deformed fiber layer in the cross-section of the component pin in its elastic-plastic deformation region and any position can be determined. Combined with the calculation formula of the curvature, the axis of the component pin can be obtained. curvature at each point.

Optionally, the curvature of each point on the axis of the component pin is expressed as:

Among them, C(l) is the curvature, E is the elastic modulus, I is the moment of inertia of the section, ξ(l) is the thickness ratio of the elastically deformed fiber layer, see Figure 4, l _b is the component pin in the elastic-plastic deformation zone 11 pin length, L _W is the total length of the component pins.

Combined with Figure 2 and Figure 4, the deflection of the free end of the component pin under the action of external force can be divided into two parts: one part is the deflection change in the deformation zone, that is, the plastic deformation zone 11, the elastic-plastic deformation zone 12, and the elastic deformation zone 13. The deflection change; the other part is the deflection change of the rigid area, ie the deflection change of the rigid area 14 .

Optionally, the deflection of component pins under external force is expressed as:

δ=δ _L +(L _w -S) sinθ _L (0.8)

Among them, δ is the deflection of the component pin, δ _L is the deflection of the component pin under the action of external force, specifically the deflection of the component pin at the point where the external force acts, and S is the total fiber layer of the component pin. Length, specifically the total length of the natural fiber layer in the deformation zone, θ _L is the deflection angle of the axis at the point of application of the external force, which is the deflection angle accumulated by the component pins due to bending deformation.

Since the curvature of each point on the axis of the component pin is different, the discrete micro-element method can be used to solve the deflection, deflection angle of each point on the axis and the total length of the fiber layer of the component pin, which can be understood by referring to Figure 2 , where dθ in Figure 2 is the differential of the increment of the deflection angle between two points on the axis, dS is the differential of the increment of the length of the fiber layer between the two points on the axis, and dl is the two points on the axis at The derivative of the increment of the length on the l axis.

Optionally, the deflection, deflection angle of each point on the axis of the component pin and the total length of the fiber layer of the component pin are expressed as:

Among them, θ _l is the deflection angle of the first point on the axis, θ _l+dl is the deflection angle of the second point on the axis, Δl is the distance difference between the first point and the second point on the axis, and δ _l is the axis The deflection of the first point on the axis under the action of external force, δ _l+dl is the deflection of the second point on the axis under the action of external force. The first and second points on the axis can be any two points on the axis. According to formula (0.9), the deflection and deflection angle of any point on the axis of the component pins and the total length of the fiber layers of the component pins can be calculated.

S240. Acquire multiple sets of external forces and the corresponding deflection data of the free ends of the component pins, according to the numerical relationship between the mechanical model, the deflection of each point on the axis, the deflection angle, and the total length of the fiber layer of the component pins, and multiple Set the external force and the corresponding deflection data of the free end of the component pin to determine the functional relationship between the initial deformation of the component pin and its elastic recovery under the action of the external force.

Among them, the initial deformation and elastic recovery are expressed by the deflection of the free end of the component pins.

Exemplarily, when an external force F is given, the deformation amount of the pin under the action of the external force (ie the deflection of the free end of the component pin) can be obtained according to equations (0.2) to (0.9). The experiment of applying external force to the free end of the component pins can be repeated many times to obtain multiple sets of external forces and the deflection data of the corresponding free ends of the component pins, that is, the external force-deflection (F-δ) data. Then, through the method of curve fitting, for example, as shown in Figure 3, the functional relationship f(δ) between the external force F and the pin deformation δ in the AD and A'D' stages of the elastic-plastic deformation stage can be obtained. Since f(δ)=k(δ-δ ₀ ) at point B, by solving f(δ)=k(δ-δ ₀ ), the elastic recovery of the deformation state represented by each point on the curve after the external force is removed can be obtained δ _s and the remaining plastic deformation, that is, the initial deformation δ ₀ . According to these discrete δ _s -δ ₀ , the curve fitting method can also be used to obtain the initial deformation δ ₀ of the component pins, and the elastic recovery under the external force (after the external force is removed) when it is corrected. The functional relationship between the quantities δ _s . The functional relationship between the initial deformation amount δ ₀ and the elastic recovery amount δ _s can be expressed as δ _s =B(δ ₀ ).

The technical solution of this embodiment starts from the theory of elastic-plastic deformation of metal materials, and establishes the initial deformation of the component pins and their elasticity under the action of external force based on the mechanical model of the deformation of the component pins under the action of external force. The functional relationship model between the recovery amounts enables compensation for the elastic recovery amount of the component pins during the subsequent correction of the component pins, so as to achieve high-precision component pin correction operations.

This embodiment further optimizes the method for correcting the component pins. Optionally, the position information of the solder joints to be soldered and the position information of the component pins are obtained, and the position information of the solder joints to be soldered and the component pins are obtained according to the position information of the solder joints to be soldered and the component pins. position information, and control the robot to reach the workspace around the welding spot to be welded in the desired posture, including:

S310 , acquiring the image information of the solder joints to be welded and the free ends of the component pins in real time, so as to identify the position information of the solder joints to be soldered and the position information of the component pins.

FIG. 6 is a schematic diagram of a pin correction work site provided by an embodiment of the present invention; FIG. 7 is a detailed schematic diagram of a pin correction work site provided by an embodiment of the present invention. The component pins 10, the end effector 20 of the robot and the solder joints 30 to be welded in the pin correction work site are shown; FIG. 8 is a schematic image diagram of a pin correction work site provided by an embodiment of the present invention, and FIG. 8 is a schematic diagram of The images of the component pins 10 , the end effector 20 of the robot, and the solder joints 30 to be soldered, which are captured by the camera 40 in FIG. 6 are schematically shown. Exemplarily, as shown in FIG. 6 to FIG. 8 , the pin correction work site is the automatic welding production site. For the component pins 10 to be welded and the solder joints 30 to be welded, the camera 40 can capture images of the work site in real time. , and extract the position information of the solder joints to be welded and the position information of the component pins in the original image by means of image processing.

S320, based on the position information of the solder joints to be welded, the position information of the component pins, the position constraint relationship between the end effector of the robot and its work site, and the position constraint relationship between the end effector and the component pins, Determine the desired pose of the robot's end effector.

其中，待焊接焊点的位置^Ix_s和为元器件引脚自由端的位置

均表示图像空间中的像素点。机器人的末端执行器20可以是夹持焊笔的机械臂，在机器人的末端执行器20执行元器件引脚矫正工作之前，需要确保末端执行器20进入相机40的视场，并以期望姿态到达待焊接焊点30周围的工作空间，因此可采用基于位置的视觉伺服方法对末端执行器20进行控制。Exemplarily, with reference to FIG. 6 to FIG. 8 , according to the image information of the solder joints 30 to be soldered and the free ends of the component pins 10 , the position information of the solder joints to be soldered and the position information of the component pins can be identified, and then the position information of the solder joints to be soldered and the position information of the component pins can be identified. The position of the solder joint ^I x _s and the position of the free end of the component pins

Among them, the position ^I x _s of the solder joint to be welded and the position of the free end of the component pin

Both represent pixels in image space. The end effector 20 of the robot can be a robotic arm that holds a welding pen. Before the end effector 20 of the robot performs component pin correction, it needs to ensure that the end effector 20 enters the field of view of the camera 40 and arrives at the desired attitude The working space around the welding spot 30 to be welded, therefore, the position-based visual servoing method can be used to control the end effector 20 .

可确定元器件引偏移待焊接焊点位置的信息

即元器件引脚的初始变形量，据此可确定机器人的末端执行器20到达待焊接焊点周围的期望区域和期望位置。末端执行器20的姿态矩阵R_e可表示如下：According to the position ^I x _s of the solder joint to be soldered and the position of the free end of the component pins

Information that can determine the position of the component lead offset to be soldered

That is, the initial deformation amount of the component pins, according to which it can be determined that the end effector 20 of the robot reaches a desired area and a desired position around the solder joint to be welded. The attitude matrix _Re of the end effector 20 can be expressed as follows:

Among them, for the convenience of control, the coordinate system of the end effector 20 and the coordinate system of the pin correction work site can be established respectively, and the coordinate system can be the world coordinate system, see FIG. Unit direction vector of the axes of the actuator coordinate system. n _x , o _x and a _x , are the coordinates of the unit direction vectors n, o and a on the x-axis of the world coordinate system, respectively. n _y , o _y and a _y are the coordinates of the unit direction vectors n, o and a on the y-axis of the world coordinate system, respectively. n _Z , o _Z and a _Z , are the coordinates of the unit direction vectors n, o and a on the z-axis of the world coordinate system, respectively.

The position constraint relationship between the end effector of the robot and its work site refers to the constraint relationship of the unit direction vectors n, o and a parallel to the coordinate axis of the end effector coordinate system in the world coordinate system, which can be It is expressed as follows:

In order to solve the desired attitude matrix _Re of the end effector 20 , the position constraint relationship between the end effector and the component pins is also required. For example, referring to FIG. 7 and FIG. 8 , the constraint relationship may be: a unit direction vector The projection of n in the xoy plane of the world coordinate system is antiparallel to the direction in which the component pins 10 are offset from the solder joints 30 to be welded, and the angle between the end effector and the xoy plane of the world coordinate system should be the predetermined Set the angle to perform pin correction work. Optionally, the position constraint relationship between the end effector and the component pins is expressed as:

为坐标轴n在末端执行器坐标系的位置，^Ix_s为待焊接焊点的位置，

为元器件引脚自由端的位置，n_Z，o_Z和a_Z分别为平行于末端执行器坐标系的坐标轴的单位方向矢量n、o和a，在世界坐标系的z轴的坐标，γ为末端执行器与世界坐标系的xoy平面之间的夹角，x和y分别为世界坐标系的x轴和y轴，a_x，a_y和a_Z分别为末端执行器坐标系的坐标轴的单位方向矢量a，在世界坐标系的x轴、y轴和z轴的坐标。式(0.12)示意性地示出了γ大于等于45°且小于等于75°的情况。Among them, n is the representation of the unit direction vector of the coordinate axis of the end effector coordinate system in the world coordinate system,

is the position of the coordinate axis n in the end effector coordinate system, ^I x _s is the position of the welding spot to be welded,

is the position of the free end of the component pin, n _Z , o _Z and a _Z are the unit direction vectors n, o and a parallel to the coordinate axis of the end effector coordinate system, respectively, the coordinates of the z axis in the world coordinate system, γ is the angle between the end effector and the xoy plane of the world coordinate system, x and y are the x-axis and y-axis of the world coordinate system, respectively, a _x , a _y and a _Z are the coordinate axes of the end-effector coordinate system The unit direction vector a, the coordinates of the x-axis, y-axis and z-axis of the world coordinate system. Equation (0.12) schematically shows the case where γ is 45° or more and 75° or less.

Simultaneous equations (0.10) to (0.12), according to the attitude matrix _Re of the end effector 20, the position constraint relationship between the end effector of the robot and its work site, and the relationship between the end effector and the component pins. The position constraint relationship can determine the desired attitude of the end effector of the robot, and obtain the desired attitude matrix R _d . To facilitate subsequent calculations, the desired pose matrix R _d (R _d ∈ R ^3×3 ) can be converted into the form of rotation vector f _d (f _d ∈ R ^3×1 ).

S330 , according to the position information of the component pins, the radius of the solder joints to be soldered, and the distance between adjacent solder joints, determine a desired area for the robot to perform pin correction.

Exemplarily, the desired area for the robot to perform pin correction refers to its spatial position in the world coordinate system when the end effector performs pin correction. This solution can use linear compensation for pin correction. Therefore, when the end effector performs pin correction, it should be in a certain position away from the pin, and the end effector should not block the pin in the image space. , the desired area for the robot to perform pin correction can be expressed as:

Among them, ^I x _d is the desired position, λ ₁ is the preset compensation coefficient, and the preset compensation coefficient λ ₁ can be set according to requirements, see Figure 8, r ₂ is the outer diameter of the welding spot to be welded, and d _min is the welding spot to be welded. The distance between the point and the adjacent solder point.

S340 , define the working space of the robot and the potential energy function about the working space according to the desired posture and the desired area, determine the torque of the robot reaching the working space according to the potential energy function and the parameter information of the robot, and control the robot according to the torque.

Exemplarily, the position X _d of the desired position ^I x _d in the world coordinate system can be obtained by coordinate transformation:

表示图像空间中的像素点到世界坐标系中的笛卡尔坐标的变化。根据期望位置^Ix_d在世界坐标系中的位置X_d，以及期望姿态矩阵的旋转矢量形式f_d，可得到机器人末端执行器的广义位置矢量p_d，具体可表示为：in,

Represents the change from a pixel in image space to Cartesian coordinates in the world coordinate system. According to the position X _d of the desired position ^I x _d in the world coordinate system, and the rotation vector form f _d of the desired attitude matrix, the generalized position vector p _d of the robot end effector can be obtained, which can be specifically expressed as:

Among them, x _d , y _d and z _d are the coordinates of the position X _d of the desired position ^I x _d in the world coordinate system, respectively, and f _xd , f _yd and f _zd are the coordinates of the rotation vector form f _d of the desired attitude matrix, respectively .

In order to detect the arrival state of the robot, a workspace f(p|p _d ) can be defined near the desired area, which can be expressed as follows:

Among them, n is the order of the workspace and n≥2, ri ( _i =1, 2, 3, 4, 5, 6) are all positive constants, by modifying the parameters _n and ri, the corresponding workspace can be The shape and size of the area.

In order to judge whether the robot has reached the workspace, a potential energy function P _p (p) can be defined according to the workspace f(p|p _d ), which can be expressed as follows:

where k _p is a positive constant. FIG. 9 is a schematic diagram of a function curve of a workspace provided by an embodiment of the present invention. Referring to FIG. 9, it can be known by combining equations (0.16) and (0.17) that it can be determined whether the end effector of the robot reaches the workspace: the end effector of the robot Outside the workspace, that is, when t<t ₀ (assuming t ₀ is the moment when the end effector of the robot reaches the workspace), f(p|p _d )>0, and the potential energy function P _p (p)>0; When the end effector of the robot reaches the workspace, f(p|p _d )≤0, and the potential energy function

P _p (p)=0.

Exemplarily, continue to take the partial derivative of the potential energy function P _p (p) with respect to the generalized position vector p to obtain Δξ, which is specifically expressed as:

Since the workspace f(p|p _d ) is a continuous function, Δξ is continuous.

The parameter information of the robot includes the speed loop feedback gain matrix of the robot, the gravity compensation term of the robot and the transpose matrix of the Jacobian matrix of the robot, the partial derivative Δξ to the generalized position vector p according to the potential energy function P _p (p), and the above-mentioned robot The parameter information can determine the control logic for the robot to reach the workspace. Optionally, the control logic for the robot to reach the workspace is expressed as:

为机器人的雅可比矩阵的转置矩阵，Δξ为机器人到达工作空间的势能函数对于工作空间的位置矢量的偏导。Among them, τ _r is the torque that controls the robot to reach the workspace, K _P is the speed loop feedback gain matrix of the robot, g(q) is the gravity compensation term of the robot,

is the transpose matrix of the Jacobian matrix of the robot, and Δξ is the partial derivative of the potential energy function of the robot reaching the workspace to the position vector of the workspace.

In the technical solution of this embodiment, the position information of the solder joints to be soldered and the position information of the component pins are determined through image recognition, so as to determine the initial deformation amount of the component pins offset from the solder joints to be soldered. The coordinate transformation relationship in Cartesian space and the constraints of the robot end effector for pin correction determine the desired position and desired posture of the end effector for pin correction. According to the desired posture and desired area, construct the robot's workspace and the potential energy function about the workspace, and determine the torque that controls the robot to reach the workspace based on the potential energy function. points and component pins.

This embodiment further optimizes the method for correcting the component pins. Control the robot to correct the component pins to the desired position, so that the component pins can rebound from the desired position to the position of the center of the solder joint to be soldered, including:

S410, based on the position information of the solder joints to be welded and the position information of the component pins, determine the initial deformation amount of the component pins.

可确定元器件引偏移待焊接焊点位置的信息

即元器件引脚的初始变形量δ₀。Exemplarily, based on the position ^I x _s of the solder joint to be soldered and the position of the free end of the component lead

Information that can determine the position of the component lead offset to be soldered

That is, the initial deformation amount δ ₀ of the component pins.

S420 , predicting the elastic recovery amount of the component pins under the action of external force according to the initial deformation amount of the component pins and the functional relationship between the initial deformation amount and the elastic recovery amount.

以及初始变形量δ₀与弹性回复量δ_s之间的函数关系可表示为δ_s＝B(δ₀)，可预测元器件引脚在外力作用下的弹性回复量δ_s。Exemplarily, the initial deformation amount δ ₀ of the component pins is

And the functional relationship between the initial deformation δ ₀ and the elastic recovery amount δ _s can be expressed as δ _s =B(δ ₀ ), which can predict the elastic recovery amount δ _s of the component pins under the action of external force.

S430 , according to the position information and the elastic recovery amount of the solder joint to be welded, determine the expected position of the component lead under the correction of the robot.

6 to 8 , after the end effector of the robot reaches the workspace with the desired attitude, the end effector enters the field of view of the camera (FIG. 6 shows that the end effector 20 is located in the field of view of the camera 40). case), the image-based visual servoing method can be used to control the end effector for high-precision active pin correction tasks. Since the pin correction of the components should be performed after the end effector reaches the workspace, a weight function can be established, and the state of the robot's end effector can be determined according to the value of the weight function. The weight function ω(t) can be specifically expressed as:

ω(t)=u(tt ₀ ) (0.20)

Among them, u(t) represents a step function, and t ₀ is the time for the end effector to reach the workspace. FIG. 10 is a schematic diagram of a weight function provided by an embodiment of the present invention. As shown in FIG. 10 , when the end effector does not enter the workspace, the weight function ω(t) remains 0. After the end effector reaches the workspace , the weight function ω(t) becomes 1.

According to the weight function ω(t), a composite vector ^I x _c describing the position of the component pins is constructed, and the composite vector ^I x _c can be expressed as:

Among them, ^I x _d represents the expected position of the component lead under the correction of the robot, and the expected position takes into account the elastic recovery of the component lead.

Alternatively, the desired position ^I x _d is expressed as:

^I x _d = ^I x _s + ^I Δx (0.22)

为元器件引脚偏移待焊接焊点位置的信息，即元器件引脚的初始变形量，

为元器件引脚的初始变形量对应的弹性回复量，L_pixel为像素当量，

为元器件引脚自由端的位置。据此，可控制机器人将元器件引脚矫正至期望位置^Ix_d。Among them, ^I x _d is the desired position, ^I x _s is the position of the solder joint to be welded, ^I Δx is the pixel distance of the elastic recovery amount in the image space,

It is the information that the component pins are offset from the position of the solder joints to be soldered, that is, the initial deformation of the component pins,

is the elastic recovery amount corresponding to the initial deformation of the component pins, L _pixel is the pixel equivalent,

is the position of the free end of the component pins. Accordingly, the robot can be controlled to correct the component pins to the desired position ^I x _d .

S440: Determine the torque required by the robot to correct the component pins according to the desired position and the parameter information of the robot, and control the robot according to the torque.

Exemplarily, referring to FIG. 6 , after determining the desired position ^I x _d of the component lead correction, high-precision lead correction control can be completed under the monitoring of the camera 40 . Optionally, the control logic for the robot to correct the component pins is expressed as:

τ _a = -K _a s _a +g(q) (0.24)

为机器人的末端执行器的速度矢量，

J_P ⁺(q)为机器人的雅可比矩阵的伪逆，

Among them, τ _a is the moment that the control robot corrects the component pins, and Ka is _{a positive definite matrix as the coefficient of s a ,} which is used to represent the control gain. The matrix can be set according to the needs of the user, and s _a is a The synovial vector, specifically expressed as

is the velocity vector of the robot's end-effector,

J _P ⁺ (q) is the pseudo-inverse of the robot's Jacobian matrix,

To sum up, according to the control logic of the robot reaching the workspace in the first control stage, and the control logic of the robot correcting the component pins in the second control stage, the simultaneous formula (0.19) and formula ( 0.24), the control logic of the robot in the whole control stage can be expressed as:

τ=(1-ω(t))τ _r +ω(t)τ _a (0.26)

In the technical solution of this embodiment, after the end effector of the robot has entered the field of view and has been in the working space for performing pin correction with a desired attitude, the image-based visual servo control method is used to operate the robot end to perform the pin correction task: Determine the initial deformation of the component pins according to the offset of the component pins in the image information from the position of the solder joint to be welded, and substitute the initial deformation into the pre-established functional relationship between the initial deformation and the elastic recovery , predict the elastic recovery amount of the component pins under the action of external force, and determine the expected position of the component pins under the correction of the robot according to the position information and elastic recovery amount of the solder joints to be welded, and according to the expected position and the robot's desired position Parameter information, determine the torque required by the robot to correct the component pins, and control the robot according to the torque, so as to achieve high-precision component pin correction control in the image space. The beneficial effect of this setting is that the error of pin correction control has nothing to do with the calibration error and function modeling error of the system, but is only related to the pixel equivalent of the image.

FIG. 11 is a schematic diagram of a simulation result of a component pin correction control provided by an embodiment of the present invention. The point set on the left side of the solder joint 30 to be welded in FIG. 11 represents the stage when the control robot reaches the workspace, and the position of the end effector changes. , it can be seen that this stage realizes the rapid control of the robot to reach the workspace; the point set on the right side of the solder joint 30 to be welded represents the stage of the control robot to correct the pins of the components, and the position of the end effector changes, which can be seen in this stage Realize the control of the robot to perform high-precision pin correction work.

12 is a schematic diagram of another component pin correction control simulation result provided by an embodiment of the present invention. As shown in FIG. 12 , the abscissa t represents time, the ordinate e represents error, and t _r represents the moment when the robot reaches the workspace, (0s-t _r s) is the stage of controlling the robot to reach the workspace, (t _r s-3.5s) is the stage of controlling the robot to correct the pins of the components, the two curves in Figure 12 represent the two stages of the robot respectively The position controls, the z-axis of the world coordinate system, and the errors on the x- and y-axes. It can be seen that the stage of controlling the robot to correct the pins of the components achieves high-precision control.

13 is a schematic diagram of another component pin correction control simulation result provided by an embodiment of the present invention. As shown in FIG. 13 , the abscissa t represents time, the ordinate e represents error, and the error is the error in the image space, t _r represents the moment when the robot reaches the workspace, (0s-t _rs ) is the stage of controlling the robot to reach the workspace, and (t _r s-3.5s) is the stage of controlling the robot to correct the pins of the components. The curve in Figure 13 represents the error between the component pins and the solder joints to be soldered, that is, the offset (initial deformation). It can be seen that when the control robot reaches the workspace, since the correction work has not started, the error value of the component pins maintains the initial offset, and the control robot corrects the component pins at the stage, the error value of the component pins. Gradually shrink to 0, realizing high-precision component pin correction.

FIG. 14 is a schematic diagram of another component pin correction control simulation result provided by an embodiment of the present invention. FIG. 14 shows three sets of comparative experimental results of pin correction considering the elastic recovery amount and without considering the elastic recovery amount, where the ordinate is D represents the distance between the free end of the pin and the axis of the through hole of the solder joint to be soldered. As shown in Figure 14, the results of three sets of comparative experiments show that the pin correction accuracy of adding pin elastic recovery compensation in the design of the controller is significantly improved compared to the pin correction accuracy without compensation.

specific embodiment

On the basis of the above-mentioned embodiment, the present embodiment further optimizes the method for correcting the above-mentioned component pins. FIG. 15 is a schematic flowchart of another method for correcting component pins according to an embodiment of the present invention. As shown in FIG. 15 , the method specifically includes:

S510, determining the mechanical model of the bending deformation of the lead of the component.

S520 , establishing a prediction model of the elastic recovery amount of the component pins according to the mechanical model of the bending deformation of the component pins.

S530 , acquiring image information of solder joints to be soldered and component pins, and performing machine vision processing to determine solder joint position information and pin offset information.

S540, according to the position information of the solder joints and the pin offset information, calculate the expected posture and working space of the robot end effector for pin correction.

S550. Execute the position-based workspace arrival control, so that the robot end effector enters the workspace with a desired attitude.

S560: Calculate the expected position that the pin should reach when the robot end effector performs pin correction according to the solder joint position information and the pin offset information.

S570. Perform image-based pin correction control, so that the robot end effector corrects the component pins.

The technical solution of this embodiment starts from the theory of elastic-plastic deformation of metal materials, and establishes the initial deformation of the component pins and its deformation under the action of external force based on the mechanical model of the deformation of the component pins under the action of external force. Model of the functional relationship between elastic recoveries. Then, according to the operation object of the robot, a two-stage mixed pin correction method is proposed: in the first stage, according to the position information of the solder joints to be welded and the position information of the component pins, the robot is controlled to reach the solder joints to be soldered with the desired attitude The surrounding workspace, so that the robot can quickly reach the workspace; in the second stage, according to the position information of the solder joints to be welded and the position information of the component pins, as well as the functional relationship model between the initial deformation amount and the elastic recovery amount, Control the robot to correct the component pins to the desired position, so that the component pins can rebound from the desired position to the position of the center of the solder joint to be soldered, so as to realize the high-precision component pin correction operation. Through simulation and experimental verification, it is shown that the active pin correction technical solution proposed in this embodiment has a good effect, which is helpful to improve the yield rate and welding quality of the automatic welding production line.

Embodiment 2

FIG. 16 is a schematic diagram of a module structure of a device for correcting component pins according to an embodiment of the present invention. This embodiment can be applied to the case of realizing high-precision component pin correction. The device for correcting component pins provided by the embodiment of the present invention can execute the correcting method for component pins provided by any embodiment of the present invention, and has functional modules and beneficial effects corresponding to the execution method.

The apparatus specifically includes a functional relationship establishing module 610, a first control module 620 and a second control module 630, wherein:

The functional relationship establishing module 610 is used to establish a functional relationship between the initial deformation of the component pins and the elastic recovery amount under the external force based on the mechanical model of the deformation of the component pins under the action of external force;

The first control module 620 is used to obtain the position information of the solder joints to be welded and the position information of the component pins, and control the robot to arrive at the to-be-welded with the desired attitude according to the position information of the solder joints to be welded and the position information of the component pins. work space around the solder joint;

The second control module 630 is configured to control the robot to correct the component pins to the desired position according to the position information of the solder joints to be welded and the position information of the component pins, as well as the functional relationship between the initial deformation amount and the elastic recovery amount, So that the component pins can spring back from the desired position to the position of the center of the solder joint to be soldered.

The device for correcting component pins provided by the embodiment of the present invention can perform the correcting method for component pins provided by any embodiment of the present invention, and has functional modules and beneficial effects corresponding to the execution method.

Embodiment 3

FIG. 17 is a schematic structural diagram of a terminal according to an embodiment of the present invention. Figure 17 shows a block diagram of an exemplary apparatus 412 suitable for use in implementing embodiments of the present invention. The device 412 shown in FIG. 17 is only an example, and should not impose any limitation on the function and scope of use of the embodiments of the present invention.

As shown in FIG. 17, device 412 is represented as a generic device. Components of device 412 may include, but are not limited to, one or more processors 416, storage 428, and a bus 418 connecting various system components including storage 428 and processor 416.

Bus 418 represents one or more of several types of bus structures, including a storage device bus or storage device controller, a peripheral bus, a graphics acceleration port, a processor, or a local bus using any of a variety of bus structures. For example, these architectures include, but are not limited to, Industry Subversive Alliance (ISA) bus, Micro Channel Architecture (MAC) bus, enhanced ISA bus, Video Electronics Standards Association (Video Electronics Standards Association) , VESA) local bus and peripheral component interconnect (Peripheral Component Interconnect, PCI) bus.

Device 412 typically includes a variety of computer system readable media. These media can be any available media that can be accessed by device 412, including volatile and non-volatile media, removable and non-removable media.

Storage 428 may include computer system readable media in the form of volatile memory, such as random access memory (RAM) 430 and/or cache memory 432 . Device 412 may further include other removable/non-removable, volatile/non-volatile computer system storage media. For example only, storage system 434 may be used to read and write to non-removable, non-volatile magnetic media (not shown in Figure 17, commonly referred to as "hard disk drives"). Although not shown in Figure 17, a magnetic disk drive for reading and writing to removable non-volatile magnetic disks (eg "floppy disks") and removable non-volatile optical disks such as Compact Disc Read -Only Memory, CD-ROM), digital video disc (Digital Video Disc-Read Only Memory, DVD-ROM) or other optical media) CD-ROM drive for reading and writing. In these cases, each drive may be connected to bus 418 through one or more data media interfaces. Storage 428 may include at least one program product having a set (eg, at least one) of program modules configured to perform the functions of various embodiments of the present invention.

A program/utility 440 having a set (at least one) of program modules 442, which may be stored, for example, in storage device 428, such program modules 442 including, but not limited to, an operating system, one or more application programs, other program modules, and programs Data, each or some combination of these examples may include an implementation of a network environment. Program modules 442 generally perform the functions and/or methods of the described embodiments of the present invention.

Device 412 may also communicate with one or more external devices 414 (eg, a keyboard, pointing terminal, display 424, etc.), may also communicate with one or more terminals that enable a user to interact with the device 412, and/or communicate with the device 412. Device 412 can communicate with any terminal (eg, network card, modem, etc.) that communicates with one or more other computing terminals. Such communication may take place through input/output (I/O) interface 422 . Also, device 412 may communicate with one or more networks (eg, Local Area Network (LAN), Wide Area Network (WAN), and/or public networks, such as the Internet) through network adapter 420 . As shown in FIG. 17 , network adapter 420 communicates with other modules of device 412 via bus 418 . It should be understood that, although not shown, other hardware and/or software modules may be used in conjunction with device 412, including but not limited to: microcode, terminal drivers, redundant processors, external disk drive arrays, Redundant Arrays of disks Independent Disks, RAID) systems, tape drives and data backup storage systems.

The processor 416 executes various functional applications and data processing by running the programs stored in the storage device 428, for example, implementing the method for correcting component pins provided by the embodiments of the present invention, and the method includes:

Based on the mechanical model of the deformation of the component pins under the action of external force, the functional relationship between the initial deformation of the component pins and the elastic recovery amount under the action of the external force is established;

Obtain the position information of the solder joints to be welded and the position information of the component pins, and control the robot to reach the to-be-soldered solder joints in a desired attitude according to the position information of the solder joints to be soldered and the position information of the component pins. the workspace around the point;

According to the position information of the solder joints to be welded and the position information of the component pins, as well as the functional relationship between the initial deformation amount and the elastic recovery amount, the robot is controlled to place the component pins Corrected to a desired position, so that the component lead can spring back from the desired position to the position of the center of the to-be-soldered solder joint.

Embodiment 4

The embodiment of the present invention also provides a computer-readable storage medium, on which a computer program is stored, and when the program is executed by a processor, the method for correcting component pins provided by the embodiment of the present invention is implemented, and the method includes:

Based on the mechanical model of the deformation of the component pins under the action of external force, the functional relationship between the initial deformation of the component pins and the elastic recovery amount under the action of the external force is established;

Obtain the position information of the solder joints to be welded and the position information of the component pins, and control the robot to reach the to-be-soldered solder joints in a desired attitude according to the position information of the solder joints to be soldered and the position information of the component pins. the workspace around the point;

According to the position information of the solder joints to be welded and the position information of the component pins, as well as the functional relationship between the initial deformation amount and the elastic recovery amount, the robot is controlled to place the component pins Corrected to a desired position, so that the component lead can spring back from the desired position to the position of the center of the to-be-soldered solder joint.

The computer storage medium in the embodiments of the present invention may adopt any combination of one or more computer-readable mediums. The computer-readable medium may be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus or device, or a combination of any of the above. More specific examples (a non-exhaustive list) of computer readable storage media include: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read only memory (ROM), Erasable programmable read only memory (EPROM or flash memory), optical fiber, portable compact disk read only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination of the above. In this document, a computer-readable storage medium can be any tangible medium that contains or stores a program that can be used by or in conjunction with an instruction execution system, apparatus, or device.

A computer-readable signal medium may include a propagated data signal in baseband or as part of a carrier wave, with computer-readable program code embodied thereon. Such propagated data signals may take a variety of forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination of the foregoing. A computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium that can transmit, propagate, or transport the program for use by or in connection with the instruction execution system, apparatus, or device .

Program code embodied on a computer readable medium may be transmitted using any suitable medium, including - but not limited to wireless, wireline, optical fiber cable, RF, etc., or any suitable combination of the foregoing.

Computer program code for carrying out operations of the present invention may be written in one or more programming languages, including object-oriented programming languages—such as Java, Smalltalk, C++, but also conventional Procedural programming language - such as the "C" language or similar programming language. The program code may execute entirely on the user's computer, partly on the user's computer, as a stand-alone software package, partly on the user's computer and partly on a remote computer, or entirely on the remote computer or terminal. In the case of a remote computer, the remote computer may be connected to the user's computer through any kind of network, including a local area network (LAN) or a wide area network (WAN), or may be connected to an external computer (eg, using an Internet service provider through Internet connection).

Note that the above are only preferred embodiments of the present invention and applied technical principles. Those skilled in the art will understand that the present invention is not limited to the specific embodiments described herein, and various obvious changes, readjustments and substitutions can be made by those skilled in the art without departing from the protection scope of the present invention. Therefore, although the present invention has been described in detail through the above embodiments, the present invention is not limited to the above embodiments, and can also include more other equivalent embodiments without departing from the concept of the present invention. The scope is determined by the scope of the appended claims.

Claims (10)

1. a correction method of component pins, is characterized in that, comprises: Based on the mechanical model of the deformation of the component pins under the action of external force, the functional relationship between the initial deformation of the component pins and the elastic recovery amount under the action of the external force is established; Obtain the position information of the solder joints to be welded and the position information of the component pins, and control the robot to reach the to-be-soldered solder joints in a desired attitude according to the position information of the solder joints to be soldered and the position information of the component pins. the workspace around the point; According to the position information of the solder joints to be welded and the position information of the component pins, as well as the functional relationship between the initial deformation amount and the elastic recovery amount, the robot is controlled to place the component pins Correcting to a desired position, so that the component pins can spring back from the desired position to the position of the center of the to-be-soldered solder joint; Based on the position information of the solder joints to be welded and the position information of the component pins, the initial deformation amount of the component pins is determined; according to the initial deformation amount of the component pins, and the initial deformation The functional relationship between the amount and the elastic recovery amount is used to predict the elastic recovery amount of the component pins under the action of external force; according to the position information of the solder joint to be welded and the elastic recovery amount, determine the element The desired position of the device pin under the correction of the robot; according to the desired position and the parameter information of the robot, determine the torque required by the robot to correct the component pin, and according to the The torque controls the robot. 2. The method according to claim 1, wherein, based on the mechanical model of the deformation of the component pins under the action of external force, the initial deformation amount of the component pins and the elastic recovery thereof under the action of the external force are established The functional relationship between quantities, including: Establish a mechanical model between the external force when the component pin undergoes elastic-plastic deformation and elastic recovery motion under the action of external force, and the deformation amount of the free end of the component pin; Determine the functional relationship between the cross-sectional position of any cross-section and the external force and the thickness ratio of the elastically deformed fiber layer in the cross-section within the elastic-plastic deformation region of the component pin when the component pin is subjected to external force ; Wherein, the section is perpendicular to the axis of the component pin; Calculate the curvature of each point on the axis of the component lead and the external force on the free end of the component lead according to the functional relationship between the cross-section position and the external force and the thickness ratio of the elastically deformed fiber layer in the cross-section. The deflection under the action, and the micro-element method is used to solve the deflection and deflection angle of each point on the axis and the total length of the fiber layer of the component pin according to the curvature and the deflection; Obtain multiple sets of external forces and the corresponding deflection data of the free ends of the component pins, according to the mechanical model, the deflection of each point on the axis, the deflection angle and the total length of the component pin fiber layer between The numerical relationship, and the multiple sets of external forces and their corresponding deflection data, determine the functional relationship between the initial deformation of the component pins and their elastic recovery under the action of external forces; Wherein, the initial deformation amount and the elastic recovery amount are represented by the deflection of the free end of the component lead. 3. The method according to claim 2, wherein, in the elastic-plastic deformation region of the component pins, the cross-sectional position of any cross-section is proportional to the external force and the thickness of the elastically deformed fiber layer in the cross-section. The functional relationship between is expressed as:

Wherein, l is the position of the section, L is the distance between the action point of the external force and the fixed end of the pin along the axis of the component pin, _Me is the elastic limit bending moment, F is the external force, λ is the linear strengthening coefficient, and ξ(l) is the thickness ratio of the elastically deformed fiber layer; The curvature is expressed as:

Among them, C(l) is the curvature, E is the elastic modulus, I is the moment of inertia of the section, ξ(l) is the thickness ratio of the elastically deformed fiber layer, and l _b is the elastic-plastic deformation of the component pins The lead length of the deformation area, L _W is the total length of the component lead; The deflection of the component pins under the action of external force is expressed as: δ=δ _L +(L _w −S) sinθ _L ; Wherein, δ is the deflection of the component pin, δ _L is the deflection of the component pin under the action of external force, S is the total length of the fiber layer of the component pin, and θ _L is the axis The deflection angle at the point of application of the external force; The deflection and deflection angle of each point on the axis and the total length of the fiber layer of the component pins are expressed as:

Among them, θ _l is the deflection angle of the first point on the axis, θ _l+dl is the deflection angle of the second point on the axis, and Δl is the distance between the first point and the second point on the axis difference, δ _l is the deflection produced by the first point on the axis under the action of external force, and δ _l+dl is the deflection produced by the second point on the axis under the action of the external force. 4. The method according to claim 1, wherein the position information of the solder joints to be soldered and the position information of the component pins are obtained, and the position information of the solder joints to be soldered and the component pins are obtained according to the position information of the solder joints to be soldered and the component pins. position information, control the robot to reach the workspace around the welding spot to be welded in a desired attitude, including: Real-time acquisition of the image information of the solder joints to be welded and the free ends of the component pins to identify the position information of the solder joints to be soldered and the position information of the component pins; Based on the position information of the solder joints to be welded, the position information of the component pins, the position constraint relationship between the end effector of the robot and its work site, and the end effector and the component lead The position constraint relationship between the feet determines the desired posture of the end effector of the robot; According to the position information of the component pins, the radius of the solder joints to be welded, and the distance between adjacent solder joints, determine the desired area for the robot to perform pin correction; According to the desired posture and the desired area, a workspace of the robot and a potential energy function related to the workspace are defined, and according to the potential energy function and the parameter information of the robot, the speed of the robot reaching the workspace is determined. torque, and control the robot according to the torque. 5. The method according to claim 4, wherein the position constraint relationship between the end effector and the component pins is expressed as:

Among them, n is the representation of the unit direction vector of the coordinate axis of the end effector coordinate system in the world coordinate system,

is the position of the coordinate axis n in the end effector coordinate system, ^I x _s is the position of the welding spot to be welded,

is the position of the free end of the component pin, n _Z , o _Z and a _Z are the unit direction vectors n, o and a parallel to the coordinate axis of the end effector coordinate system, respectively, in the world coordinate system The coordinates of the z-axis, γ is the angle between the end effector and the xoy plane of the world coordinate system, x and y are the x-axis and y-axis of the world coordinate system, respectively, a _x , a _y and a _Z are respectively the unit direction vector a of the coordinate axis of the end effector coordinate system, the coordinates of the x-axis, y-axis and z-axis of the world coordinate system; The desired region is expressed as:

Wherein, ^I x _d is the desired position, λ ₁ is a preset compensation coefficient, r ₂ is the outer diameter of the solder joint to be welded, and d _min is the distance between the solder joint to be welded and the adjacent solder joint . 6. The method according to claim 1, characterized in that, according to the position information of the solder joints to be welded and the position information of the component pins, and the difference between the initial deformation amount and the elastic recovery amount The functional relationship of , controlling the robot to correct the component pins to the desired position, so that the component pins can rebound from the desired position to the position of the center of the solder joint to be welded, including: Based on the position information of the solder joints to be welded and the position information of the component pins, determine the initial deformation amount of the component pins; According to the initial deformation of the component pins and the functional relationship between the initial deformation and the elastic recovery, predict the elastic recovery of the component pins under the action of external force; According to the position information of the to-be-soldered solder joints and the elastic recovery amount, determine the expected position of the component lead under the correction of the robot; According to the desired position and the parameter information of the robot, the torque required by the robot to correct the component pins is determined, and the robot is controlled according to the torque. 7. The method according to claim 6, wherein the desired position is expressed as: ^I x _d = ^I x _s + ^I Δx;

Wherein, ^I x _d is the desired position, ^I x _s is the position of the solder joint to be welded, ^I Δx is the pixel distance of the elastic recovery amount in the image space,

is the elastic recovery amount corresponding to the initial deformation of the component pins, L _pixel is the pixel equivalent,

is the position of the free end of the component pins. 8. A correction device for component pins, characterized in that, comprising: The function relationship establishing module is used to establish the functional relationship between the initial deformation of the component pins and the elastic recovery amount under the external force based on the mechanical model of the component pins deformed under the action of external force; The first control module is used to obtain the position information of the solder joints to be welded and the position information of the component pins, and according to the position information of the solder joints to be welded and the position information of the component pins, control the robot to expect The posture reaches the working space around the welding spot to be welded; The second control module is configured to control the robot according to the position information of the solder joints to be welded, the position information of the component pins, and the functional relationship between the initial deformation amount and the elastic recovery amount Correcting the component pins to a desired position, so that the component pins can rebound from the desired position to the position of the center of the solder joint to be welded; The second control module is specifically configured to determine the initial deformation amount of the component pins based on the position information of the solder joints to be welded and the position information of the component pins; according to the component pins and the functional relationship between the initial deformation amount and the elastic recovery amount, predict the elastic recovery amount of the component pins under the action of external force; according to the position information of the solder joints to be welded and The elastic recovery amount determines the desired position of the component pins under the correction of the robot; according to the desired position and the parameter information of the robot, it is determined that the robot performs the component pins on the component pins. The required torque is corrected and the robot is controlled according to the torque. 9. An electronic device, characterized in that the electronic device comprises: one or more processors; a storage device for storing one or more programs; When the one or more programs are executed by the one or more processors, the one or more processors implement the method for correcting component pins according to any one of claims 1-7. 10. A computer-readable storage medium on which a computer program is stored, characterized in that, when the program is executed by a processor, the method for correcting component pins according to any one of claims 1-7 is implemented.

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