CN112969345B - Heat dissipation assembly and manufacturing method thereof - Google Patents
Heat dissipation assembly and manufacturing method thereof Download PDFInfo
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- CN112969345B CN112969345B CN202110182837.2A CN202110182837A CN112969345B CN 112969345 B CN112969345 B CN 112969345B CN 202110182837 A CN202110182837 A CN 202110182837A CN 112969345 B CN112969345 B CN 112969345B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
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- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
An embodiment of the present invention provides a heat dissipation assembly, including: a plurality of heat dissipation elements arranged side by side; the heat dissipation piece comprises a substrate, a jogged part positioned at the edge of the substrate and a tongue piece bent and extended from the edge of the substrate, wherein the tongue piece comprises a connecting part connected with the edge of the substrate and a limiting part connected with the connecting part and fixed with the substrate through the connecting part; the limit part of one of the two adjacent heat dissipation parts is embedded in the embedded part of the other heat dissipation part. In addition, the embodiment of the invention also provides a manufacturing method of the heat dissipation assembly. According to the heat dissipation assembly and the manufacturing method thereof provided by the embodiment of the invention, the volume of the heat dissipation assembly is reduced while the heat dissipation efficiency of the heat dissipation assembly is not reduced, so that the space of the electronic equipment for placing the heat dissipation assembly is reduced, and the volume of the electronic equipment is reduced.
Description
Technical Field
The embodiment of the invention relates to the technical field of heat dissipation devices, in particular to a heat dissipation assembly and a manufacturing method thereof.
Background
With the development of science and technology, various electronic devices are being developed toward miniaturization, which means that the space of the housing of the electronic device for accommodating various components is to be reduced. In addition, since components located in the electronic equipment can generate a large amount of heat during operation, at present, heat dissipation efficiency is often improved by arranging a heat dissipation assembly near the components, so that damage to the components due to overhigh temperature is avoided.
The inventor finds that the existing heat dissipation assembly is mostly assembled by riveting a plurality of heat dissipation elements, when the plurality of heat dissipation elements are riveted, larger space is reserved between the adjacent heat dissipation elements to allow the rivet heads of the jig to extend into the space between the adjacent heat dissipation elements and rivet the adjacent heat dissipation elements in a pressing mode, so that larger heat dissipation element spacing is reserved to reserve space for pressing the rivet heads of the jig in manufacturing the heat dissipation assembly, further the product volume of the heat dissipation assembly cannot be reduced, and therefore the electronic equipment also needs to reserve larger space for placing the heat dissipation assembly, and the product volume of the electronic equipment cannot be reduced.
Accordingly, there is a need to provide a heat dissipating assembly and a method for manufacturing the same, which can reduce the volume of the heat dissipating assembly without reducing the heat dissipating efficiency of the heat dissipating assembly, thereby reducing the space of the electronic device for placing the heat dissipating assembly and reducing the volume of the electronic device.
Disclosure of Invention
An object of an embodiment of the present invention is to provide a heat dissipating assembly and a method for manufacturing the same, which can reduce the volume of the heat dissipating assembly without reducing the heat dissipating efficiency of the heat dissipating assembly, thereby reducing the space of an electronic device for placing the heat dissipating assembly and reducing the volume of the electronic device.
In order to solve the above problems, an embodiment of the present invention provides a heat dissipation assembly, including: a plurality of heat dissipation elements arranged side by side; the heat dissipation piece comprises a substrate, a jogged part positioned at the edge of the substrate and a tongue piece bent and extended from the edge of the substrate, wherein the tongue piece comprises a connecting part connected with the edge of the substrate and a limiting part connected with the connecting part and fixed with the substrate through the connecting part; the limit part of one of the two adjacent heat dissipation parts is embedded in the embedded part of the other heat dissipation part.
In addition, the invention also provides a manufacturing method of the heat dissipation assembly, which comprises the following steps: providing a plurality of radiating plates, wherein the radiating plates comprise a substrate, a jogged part positioned at the edge of the substrate and a tongue piece connected with the edge of the substrate, and the tongue piece comprises a connecting part connected with the edge of the substrate and a limiting part connected with the connecting part and fixed with the substrate through the connecting part; the heat dissipation plates are arranged side by side, the heat dissipation plates are bent by taking the edge of the substrate as a bending position, the substrate and the tongue piece form V-shaped bending, and the limit part of one of the two adjacent heat dissipation plates is embedded into the embedded part of the other heat dissipation plate.
According to the heat dissipation assembly and the manufacturing method thereof, the limiting part of one of the two adjacent heat dissipation members is embedded in the embedded part of the other heat dissipation member, so that the adjacent two adjacent heat dissipation members are directly fixed, and the limiting part and the embedded part of the adjacent heat dissipation members can be fixed at the position of the edge of the substrate of the adjacent heat dissipation member, so that a jig rivet does not need to be used for extending into the space between the adjacent two heat dissipation members, and a space enough for pressing the jig rivet does not need to be reserved between the adjacent two heat dissipation members when the heat dissipation assembly is manufactured, the product volume of the heat dissipation assembly can be effectively reduced, the heat dissipation efficiency of the heat dissipation assembly is not reduced, the volume of the heat dissipation assembly is reduced, and the space for placing the heat dissipation assembly by electronic equipment is reduced.
In addition, each heat dissipation piece comprises two jogged parts and two tongue pieces, two opposite edges of the base plate are respectively provided with one jogged part, and the two tongue pieces respectively bend and extend from one of the two opposite edges of the base plate; two limit parts of one of the two adjacent heat dissipation parts are embedded in two embedded parts of the other heat dissipation part. So configured, since the two tongues of one of the two adjacent heat dissipation elements are respectively located at two opposite edges of the other of the two adjacent heat dissipation elements, the two tongues of one of the two adjacent heat dissipation elements can restrict the other of the two adjacent heat dissipation elements from moving in a direction in which the one of the two tongues is directed toward the other.
In addition, the heat dissipation piece further comprises a baffle plate bent and extended from the edge of the substrate, wherein the embedded part is positioned among the baffle plate, the tongue piece and the edge of the substrate.
In addition, each heat dissipation piece is provided with four baffles and four tongues, wherein two baffles and two tongues are respectively fixed on each of two opposite edges of the substrate.
In addition, in the heat dissipation piece, the connecting portion includes fixed plate fixed with the base plate edge and the extension board that extends along the direction that is close to spacing portion from the edge that the fixed plate is close to the gomphosis portion, extension board and spacing portion fixed connection, spacing portion are located the one side that the gomphosis portion is kept away from the base plate. The limit part is positioned at one side of the embedded part far away from the substrate, and the limit part and the embedded part are sequentially arranged in the direction vertical to the substrate, so that when the limit part of one of the two adjacent heat dissipation elements is embedded in the embedded part of the other heat dissipation element, the two adjacent heat dissipation elements can be embedded without relative rotation.
In addition, two fixed plates of two tongue pieces fixed with the same edge of the substrate are connected, two extending plates of two tongue pieces fixed with the same edge of the substrate extend along the direction away from each other, and the extending directions of the two extending plates are different from the included angle of the substrate surface.
In addition, the connecting part is a connecting plate, and the included angle between the plate surface of the connecting plate and the plate surface of the substrate is 80-140 degrees.
In addition, the method for bending the heat dissipation plate by taking the edge of the substrate as a bending position, forming V-shaped bending on the substrate and the tongue piece, and embedding the limit part of one of two adjacent heat dissipation plates into the embedded part of the other heat dissipation plate comprises the following specific steps: in the process of stamping and bending the heat dissipation plates by taking the edge of the substrate as a bending position and forming V-shaped bending between the substrate and the tongue piece, the limit part of one of the two adjacent heat dissipation plates is embedded into the embedded part of the other heat dissipation plate through press riveting. Therefore, the manufacturing steps of assembling the heat dissipation piece can be reduced, and the hidden quality trouble caused by the fact that the heat dissipation plate needs to be turned over in the assembly line for a plurality of times is avoided.
In addition, a plurality of heat dissipation plates are provided, specifically including: providing a plurality of plates; the edge portion of each plate was cut out using the central portion of each plate as a base plate to form a heat dissipation plate.
Drawings
One or more embodiments are illustrated by way of example and not limitation in the figures of the accompanying drawings, in which like references indicate similar elements, and in which the figures of the drawings are not to be taken in a limiting sense, unless otherwise indicated.
Fig. 1 is a schematic structural diagram of a heat dissipating assembly according to a first embodiment of the present invention;
fig. 2 is a schematic structural diagram of a heat dissipation device according to a first embodiment of the present invention;
Fig. 3 is a flowchart of a method for manufacturing a heat dissipating assembly according to a second embodiment of the present invention.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the embodiments of the present application more apparent, the following detailed description of the embodiments of the present application will be given with reference to the accompanying drawings. However, those of ordinary skill in the art will understand that in various embodiments of the present application, numerous technical details have been set forth in order to provide a better understanding of the present application. The claimed application may be implemented based on various changes and modifications of the following embodiments.
According to the heat dissipation assembly, the limiting part of one of the two adjacent heat dissipation elements is embedded in the embedded part of the other heat dissipation element, so that the adjacent two adjacent heat dissipation elements are directly fixed, and the limiting part and the embedded part of the adjacent heat dissipation elements can be fixed at the position of the edge of the substrate of the adjacent heat dissipation element, so that a jig rivet does not need to be used for extending into the space between the adjacent two heat dissipation elements, and a space for pressing in the jig rivet does not need to be reserved between the adjacent two heat dissipation elements when the heat dissipation assembly is manufactured, and therefore the product volume of the heat dissipation assembly can be effectively reduced, the heat dissipation efficiency of the heat dissipation assembly is not reduced, the volume of the heat dissipation assembly is reduced, and the space for placing the heat dissipation assembly by electronic equipment is reduced. The following details of the present embodiment are specifically described, and the following details are provided for the purpose of understanding only, and are not necessary for the implementation of the present embodiment.
Referring to fig. 1 and 2, a heat dissipation assembly provided in this embodiment includes: a plurality of heat dissipation elements 10 arranged side by side; the heat dissipation element 10 comprises a substrate 11, a jogged part 12 positioned at the edge of the substrate 11 and a tongue piece 13 bent and extended from the edge of the substrate 11, wherein the tongue piece 13 comprises a connecting part 131 connected with the edge of the substrate 11 and a limiting part 132 connected with the connecting part 131 and fixed with the substrate 11 through the connecting part 131; the stopper 132 of one of the two adjacent heat dissipation members 10 is fitted into the fitting portion 12 of the other.
Specifically, the heat dissipation assembly provided in this embodiment is made of a material with better thermal conductivity (such as aluminum, iron, copper, etc.), so as to improve the thermal conductivity of the heat dissipation assembly, and further improve the heat dissipation efficiency of the heat dissipation assembly. Since copper has high thermal conductivity, in this embodiment, the heat dissipation component is made of copper. In other alternative embodiments, the heat dissipating component may be made of an aluminum alloy with higher hardness and low manufacturing cost, and in addition, in order to further improve the heat dissipating efficiency of the heat dissipating component, the surface of each heat dissipating member of the heat dissipating component is further coated with a heat conducting silicone grease, so as to increase the heat conductivity of the heat dissipating component.
Preferably, the heat sink 10 further includes a baffle 14 bent and extended from the edge of the substrate 11, wherein the fitting portion 12 is located between the baffle 14, the tongue 13 and the edge of the substrate 11. In the present embodiment, the engaging portion 12 is an engaging region between the edge of the baffle 14, the edge of the tongue piece 13 and the edge of the substrate 11 for engaging the limiting portion 132; the stopper 132 of one of the two adjacent heat sinks 10 is fitted between the edge of the baffle 14, the edge of the tongue 13 and the edge of the substrate 11 of the other.
In other alternative embodiments, the engaging portion is a through hole formed in the tongue, so long as the limit portion of one of the two adjacent heat dissipation members can be engaged in the engaging portion of the other heat dissipation member.
Further, in the present embodiment, each heat dissipation element 10 is provided with four baffles 14 and four tongues 13, wherein two baffles 14 and two tongues 13 are respectively fixed on each of two opposite edges of the substrate 11, and four limiting portions 132 of one of two adjacent heat dissipation elements 10 are embedded in four embedding portions 12 of the other; so configured, since the four tabs 13 of one of the two adjacent heat sinks 10 are distributed at two opposite edges of the other of the two adjacent heat sinks 10, the four tabs 13 of one of the two adjacent heat sinks 10 can restrict movement of the other of the two adjacent heat sinks 10 in a direction (i.e., the X-direction shown) in which one of the two opposite edges of the heat sink 10 is directed toward the other.
In other alternative embodiments, each heat dissipation element comprises two embedded parts and two tongue pieces, wherein two opposite edges of the substrate are respectively provided with one embedded part, the two tongue pieces respectively bend and extend from one of the two opposite edges of the substrate, and two limit parts of one of the two adjacent heat dissipation elements are embedded in the two embedded parts of the other heat dissipation element; since the two tabs of one of the two adjacent heat sinks are respectively located at two opposite edges of the other of the two adjacent heat sinks, the two tabs of one of the two adjacent heat sinks can restrict the other of the two adjacent heat sinks from moving in a direction in which one of the two tabs is directed toward the other (i.e., one of the two opposite edges of the heat sink is directed toward the other).
Further, in the heat dissipation element 10, the connecting portion 131 includes a fixing plate 133 fixed to an edge of the substrate 11, and an extending plate 134 extending from an edge of the fixing plate 133 near the fitting portion 12 in a direction near the limiting portion 132, the extending plate 134 is fixedly connected to the limiting portion 132, and the limiting portion 132 is located at a side of the fitting portion 12 far from the substrate 11; in this way, the stopper 132 and the fitting portion 12 can be disposed in order in the direction perpendicular to the substrate 11 (i.e., the Y direction in the drawing), so that when the stopper 132 of one of the two adjacent heat dissipation members 10 is fitted into the fitting portion 12 of the other, the fitting can be completed without relatively rotating the two adjacent heat dissipation members 10.
Preferably, in the present embodiment, the two fixing plates 133 of the two tongues 13 fixed to the same edge of the base plate 11 are connected, and the two extending plates 134 of the two tongues 13 fixed to the same edge of the base plate 11 are extended in directions away from each other. In this way, when the limit portion 132 of one of the two adjacent heat dissipation members 10 is embedded in the embedded portion 12 of the other heat dissipation member, the two fixing plates 133 of the other of the two adjacent heat dissipation members 10 are located between the two limit portions 132 of the one of the two adjacent heat dissipation members 10 disposed on the same side.
In addition, in the present embodiment, the extending directions of the two extending plates 134 of the two tongue pieces 13 fixed to the same edge of the substrate 11 are different from the included angle of the plate surface of the substrate 11; in this way, when the limit portion 132 of one of the two adjacent heat dissipation members 10 is embedded in the embedded portion 12 of the other heat dissipation member, one of the two adjacent heat dissipation members 10 is offset relative to the other of the two adjacent heat dissipation members 10 along a direction (i.e. the illustrated Z direction) from one of the two extending plates 134 having a large angle with the board surface of the substrate 11 to one of the two extending plates 134 having a small angle with the board surface of the substrate 11, and when the heat dissipation assembly is fixed, the heat dissipation air duct formed between the substrate 11 of one of the two adjacent heat dissipation members 10 and the substrate 11 of the other of the two adjacent heat dissipation members 10 can be inclined.
Further, the connection portion 131 is a connection plate, and an included angle between a plate surface of the connection plate and a plate surface of the substrate 11 is 80 ° -140 °. In this embodiment, the angle between the plate surface of the connection plate (i.e., the connection portion 131) and the plate surface of the substrate 11 is 90 °. In another example, the angle between the plate surface of the connection plate and the plate surface of the substrate is 130 °.
In addition, when the heat dissipation assembly is fixed, the heat dissipation assembly can be fixed on the electronic device shell through a fixing mode such as welding or screw connection. In the present embodiment, the baffle 14 is fixed to the electronic device case (not shown) by welding. In other alternative embodiments, the baffle is provided with a through hole, and the baffle is fixed with the electronic device shell through screw threads.
In the second embodiment of the present invention, a method for manufacturing a heat dissipation assembly is provided, specifically, a flowchart of the method for manufacturing a heat dissipation assembly in the present embodiment is shown in fig. 3, and the method includes the steps of:
S201: a plurality of sheets is provided.
Specifically, the plate is made of a material with better heat conductivity (such as aluminum, steel, copper and the like) so as to improve the heat conductivity of the heat dissipation assembly and further improve the heat dissipation efficiency of the heat dissipation assembly. In this embodiment, the plate is made of copper. In other alternative embodiments, the plate material may be an aluminum alloy with high hardness and low manufacturing cost.
S202: the edge portion of each plate was cut out using the central portion of each plate as a base plate to form a heat dissipation plate.
Specifically, in this embodiment, the plate is cut into the heat dissipation plate by punching and shearing, and the heat dissipation plate includes a substrate, a fitting portion located at an edge of the substrate, and a tongue piece connected to the edge of the substrate, where the tongue piece includes a connection portion connected to the edge of the substrate and a limiting portion connected to the connection portion and fixed to the substrate by the connection portion.
In other alternative embodiments, the plate may be cut into the heat dissipating plate by other cutting methods, which is not limited in this embodiment. In one example, the sheet material is cut into heat sinks by laser cutting.
S203: a plurality of heat dissipation plates are arranged side by side.
Specifically, the heat dissipation plate is bent at a bending position with the edge of the substrate as a bending position, the substrate and the tongue piece are bent in a V shape, and the limit part of one of the two adjacent heat dissipation plates is embedded in the embedded part of the other heat dissipation plate.
In the embodiment, in the process of stamping and bending the heat dissipation plate by taking the edge of the substrate as a bending position and bending the substrate and the tongue piece in a V shape, the limit part of one of the two adjacent heat dissipation plates is embedded into the embedded part of the other heat dissipation plate in the stamping die through press riveting. Therefore, the limiting part of one of the two adjacent radiating plates can be embedded into the embedded part of the other radiating plate through press riveting in the process of bending the radiating plates, so that the manufacturing steps of assembling radiating pieces are reduced, and the quality hidden trouble caused by the fact that the radiating plates need to be turned on a production line for multiple times is avoided.
In addition, in other alternative embodiments, only the step S203 may be provided, and in this case, the heat dissipation member may be formed by casting, so that the plate material is not required to be cut, and the manufacturing steps for manufacturing the heat dissipation assembly are further reduced.
It will be understood by those of ordinary skill in the art that the foregoing embodiments are specific examples of carrying out the invention and that various changes in form and details may be made therein without departing from the spirit and scope of the invention. Various changes and modifications may be made by one skilled in the art without departing from the spirit and scope of the invention, and the scope of the invention is therefore intended to be limited only by the appended claims.
Claims (7)
1. A heat dissipating assembly, comprising: a plurality of heat dissipation elements arranged side by side;
the heat dissipation piece comprises a substrate, a jogged part positioned at the edge of the substrate and a tongue piece bent and extended from the edge of the substrate, wherein the tongue piece comprises a connecting part connected with the edge of the substrate and a limiting part connected with the connecting part and fixed with the substrate through the connecting part;
the limit part of one of two adjacent heat dissipation elements is embedded in the embedded part of the other heat dissipation element;
The connecting part comprises a fixed plate fixed with the edge of the substrate and an extension plate extending from the edge of the fixed plate, which is close to the embedded part, along the direction, which is close to the limiting part, and the extension plate is fixedly connected with the limiting part, and the limiting part is positioned at one side, which is far away from the substrate, of the embedded part;
The two fixing plates of the two tongue pieces fixed on the same edge of the substrate are connected, the two extending plates of the two tongue pieces fixed on the same edge of the substrate extend along the direction away from each other, and the extending directions of the two extending plates are different from the included angle of the surface of the substrate;
the manufacturing method of the heat dissipation assembly comprises the following steps: providing a plurality of radiating plates, wherein each radiating plate comprises a substrate, a jogged part positioned at the edge of the substrate and a tongue piece connected with the edge of the substrate, and the tongue piece comprises a connecting part connected with the edge of the substrate and a limiting part connected with the connecting part and fixed with the substrate through the connecting part;
And arranging a plurality of radiating plates in parallel, bending the radiating plates by taking the edge of the substrate as a bending position, enabling the substrate and the tongue piece to form V-shaped bending, and embedding the limit part of one of two adjacent radiating plates into the embedded part of the other radiating plate.
2. The heat dissipating assembly of claim 1, wherein each heat dissipating member comprises two engaging portions and two tongue pieces, wherein two opposite edges of the substrate are respectively provided with one engaging portion, and the two tongue pieces respectively extend from one of the two opposite edges of the substrate in a bending manner;
The two limit parts of one of the two adjacent heat dissipation parts are embedded in the two embedded parts of the other heat dissipation part.
3. The heat dissipating assembly of claim 1, wherein the heat dissipating member further comprises a baffle extending from the edge of the substrate, wherein the fitting portion is located between the baffle, the tongue, and the edge of the substrate.
4. A heat sink assembly in accordance with claim 3, wherein each of said heat sinks is provided with four of said baffles and four of said tabs, wherein two of said baffles and two of said tabs are respectively secured to each of two opposite edges of said base plate.
5. The heat dissipating assembly of any of claims 1-4, wherein said connection is a connection plate having a plate surface at an angle of 80 ° to 140 ° to a plate surface of said substrate.
6. The heat dissipating assembly of claim 1, wherein bending the heat dissipating plate with the edge of the substrate as a bending position, forming a V-shaped bend between the substrate and the tongue, and embedding the limit portion of one of the two adjacent heat dissipating plates into the fitting portion of the other heat dissipating plate comprises:
And in the process of stamping and bending the heat dissipation plate by taking the edge of the substrate as a bending position and forming V-shaped bending between the substrate and the tongue piece, the limit part of one of the two adjacent heat dissipation plates is embedded into the embedded part of the other heat dissipation plate through press riveting.
7. The method of manufacturing a heat dissipating assembly of claim 1, wherein said providing a plurality of heat dissipating plates comprises:
Providing a plurality of plates;
And cutting edge parts of each plate material to form the heat dissipation plate by taking the central part of each plate material as a base plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110182837.2A CN112969345B (en) | 2021-02-07 | 2021-02-07 | Heat dissipation assembly and manufacturing method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110182837.2A CN112969345B (en) | 2021-02-07 | 2021-02-07 | Heat dissipation assembly and manufacturing method thereof |
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| CN112969345A CN112969345A (en) | 2021-06-15 |
| CN112969345B true CN112969345B (en) | 2024-08-30 |
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| CN202110182837.2A Active CN112969345B (en) | 2021-02-07 | 2021-02-07 | Heat dissipation assembly and manufacturing method thereof |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2632853Y (en) * | 2003-07-02 | 2004-08-11 | 奇鋐科技股份有限公司 | Laminated combined heat sink |
| CN201171257Y (en) * | 2008-02-02 | 2008-12-24 | 国格金属科技股份有限公司 | Heat sink fin assembly structure |
| CN214228759U (en) * | 2021-02-07 | 2021-09-17 | 宁波兴瑞电子科技股份有限公司 | Heat radiation assembly |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWM315470U (en) * | 2006-12-29 | 2007-07-11 | Shr-Ming Chen | Locking structure of heat dissipating fins |
| CN201188739Y (en) * | 2008-05-06 | 2009-01-28 | 中山复盛机电有限公司 | Radiating fin structure and combined radiator |
| CN102770003B (en) * | 2011-05-06 | 2016-09-07 | 富瑞精密组件（昆山）有限公司 | Heat abstractor |
| JP6360198B2 (en) * | 2014-12-18 | 2018-07-18 | 株式会社カネカ | Graphite laminate, method for producing graphite laminate, heat transport structure, and rod-shaped heat transport body |
-
2021
- 2021-02-07 CN CN202110182837.2A patent/CN112969345B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2632853Y (en) * | 2003-07-02 | 2004-08-11 | 奇鋐科技股份有限公司 | Laminated combined heat sink |
| CN201171257Y (en) * | 2008-02-02 | 2008-12-24 | 国格金属科技股份有限公司 | Heat sink fin assembly structure |
| CN214228759U (en) * | 2021-02-07 | 2021-09-17 | 宁波兴瑞电子科技股份有限公司 | Heat radiation assembly |
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| CN112969345A (en) | 2021-06-15 |
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