CN112940676A - UV adhesive - Google Patents
UV adhesive Download PDFInfo
- Publication number
- CN112940676A CN112940676A CN202110182513.9A CN202110182513A CN112940676A CN 112940676 A CN112940676 A CN 112940676A CN 202110182513 A CN202110182513 A CN 202110182513A CN 112940676 A CN112940676 A CN 112940676A
- Authority
- CN
- China
- Prior art keywords
- parts
- glue
- brand
- adhesive
- following components
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000000853 adhesive Substances 0.000 title claims abstract description 70
- 230000001070 adhesive effect Effects 0.000 title claims abstract description 70
- 239000000126 substance Substances 0.000 claims abstract description 56
- 239000003292 glue Substances 0.000 claims abstract description 48
- 239000011347 resin Substances 0.000 claims abstract description 37
- 229920005989 resin Polymers 0.000 claims abstract description 37
- 239000003085 diluting agent Substances 0.000 claims abstract description 22
- 239000000080 wetting agent Substances 0.000 claims abstract description 16
- 239000002318 adhesion promoter Substances 0.000 claims abstract description 15
- 239000007822 coupling agent Substances 0.000 claims abstract description 15
- 239000000945 filler Substances 0.000 claims abstract description 14
- 230000009974 thixotropic effect Effects 0.000 claims abstract description 14
- -1 4-methylthiophenyl Chemical group 0.000 claims description 12
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- PSGCQDPCAWOCSH-UHFFFAOYSA-N (4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl) prop-2-enoate Chemical compound C1CC2(C)C(OC(=O)C=C)CC1C2(C)C PSGCQDPCAWOCSH-UHFFFAOYSA-N 0.000 claims description 8
- YIJYFLXQHDOQGW-UHFFFAOYSA-N 2-[2,4,6-trioxo-3,5-bis(2-prop-2-enoyloxyethyl)-1,3,5-triazinan-1-yl]ethyl prop-2-enoate Chemical compound C=CC(=O)OCCN1C(=O)N(CCOC(=O)C=C)C(=O)N(CCOC(=O)C=C)C1=O YIJYFLXQHDOQGW-UHFFFAOYSA-N 0.000 claims description 8
- 150000001252 acrylic acid derivatives Chemical class 0.000 claims description 8
- XDLMVUHYZWKMMD-UHFFFAOYSA-N 3-trimethoxysilylpropyl 2-methylprop-2-enoate Chemical compound CO[Si](OC)(OC)CCCOC(=O)C(C)=C XDLMVUHYZWKMMD-UHFFFAOYSA-N 0.000 claims description 7
- NKSJNEHGWDZZQF-UHFFFAOYSA-N ethenyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)C=C NKSJNEHGWDZZQF-UHFFFAOYSA-N 0.000 claims description 6
- 229910002012 Aerosil® Inorganic materials 0.000 claims description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical class [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 4
- 229920004482 WACKER® Polymers 0.000 claims description 4
- 229940088644 n,n-dimethylacrylamide Drugs 0.000 claims description 4
- YLGYACDQVQQZSW-UHFFFAOYSA-N n,n-dimethylprop-2-enamide Chemical compound CN(C)C(=O)C=C YLGYACDQVQQZSW-UHFFFAOYSA-N 0.000 claims description 4
- UHFFVFAKEGKNAQ-UHFFFAOYSA-N 2-benzyl-2-(dimethylamino)-1-(4-morpholin-4-ylphenyl)butan-1-one Chemical compound C=1C=C(N2CCOCC2)C=CC=1C(=O)C(CC)(N(C)C)CC1=CC=CC=C1 UHFFVFAKEGKNAQ-UHFFFAOYSA-N 0.000 claims description 3
- BDAHDQGVJHDLHQ-UHFFFAOYSA-N [2-(1-hydroxycyclohexyl)phenyl]-phenylmethanone Chemical compound C=1C=CC=C(C(=O)C=2C=CC=CC=2)C=1C1(O)CCCCC1 BDAHDQGVJHDLHQ-UHFFFAOYSA-N 0.000 claims description 3
- GUCYFKSBFREPBC-UHFFFAOYSA-N [phenyl-(2,4,6-trimethylbenzoyl)phosphoryl]-(2,4,6-trimethylphenyl)methanone Chemical compound CC1=CC(C)=CC(C)=C1C(=O)P(=O)(C=1C=CC=CC=1)C(=O)C1=C(C)C=C(C)C=C1C GUCYFKSBFREPBC-UHFFFAOYSA-N 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 14
- 229910001868 water Inorganic materials 0.000 abstract description 13
- 230000003287 optical effect Effects 0.000 abstract description 7
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 35
- 238000012360 testing method Methods 0.000 description 18
- 230000000052 comparative effect Effects 0.000 description 17
- 238000000034 method Methods 0.000 description 17
- 238000002360 preparation method Methods 0.000 description 14
- 238000001723 curing Methods 0.000 description 10
- 239000011521 glass Substances 0.000 description 8
- 230000000694 effects Effects 0.000 description 6
- 238000003756 stirring Methods 0.000 description 6
- 238000003848 UV Light-Curing Methods 0.000 description 5
- 238000006243 chemical reaction Methods 0.000 description 5
- 230000035939 shock Effects 0.000 description 5
- GNWBLLYJQXKPIP-ZOGIJGBBSA-N (1s,3as,3bs,5ar,9ar,9bs,11as)-n,n-diethyl-6,9a,11a-trimethyl-7-oxo-2,3,3a,3b,4,5,5a,8,9,9b,10,11-dodecahydro-1h-indeno[5,4-f]quinoline-1-carboxamide Chemical compound CN([C@@H]1CC2)C(=O)CC[C@]1(C)[C@@H]1[C@@H]2[C@@H]2CC[C@H](C(=O)N(CC)CC)[C@@]2(C)CC1 GNWBLLYJQXKPIP-ZOGIJGBBSA-N 0.000 description 4
- 230000008859 change Effects 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 3
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 3
- IAXXETNIOYFMLW-GYSYKLTISA-N [(1r,3r,4r)-4,7,7-trimethyl-3-bicyclo[2.2.1]heptanyl] 2-methylprop-2-enoate Chemical compound C1C[C@@]2(C)[C@H](OC(=O)C(=C)C)C[C@@H]1C2(C)C IAXXETNIOYFMLW-GYSYKLTISA-N 0.000 description 3
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 3
- 238000005286 illumination Methods 0.000 description 3
- 230000006872 improvement Effects 0.000 description 3
- 239000010410 layer Substances 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000000047 product Substances 0.000 description 3
- PUPZLCDOIYMWBV-UHFFFAOYSA-N (+/-)-1,3-Butanediol Chemical compound CC(O)CCO PUPZLCDOIYMWBV-UHFFFAOYSA-N 0.000 description 2
- MYWOJODOMFBVCB-UHFFFAOYSA-N 1,2,6-trimethylphenanthrene Chemical compound CC1=CC=C2C3=CC(C)=CC=C3C=CC2=C1C MYWOJODOMFBVCB-UHFFFAOYSA-N 0.000 description 2
- XLPJNCYCZORXHG-UHFFFAOYSA-N 1-morpholin-4-ylprop-2-en-1-one Chemical compound C=CC(=O)N1CCOCC1 XLPJNCYCZORXHG-UHFFFAOYSA-N 0.000 description 2
- FTALTLPZDVFJSS-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl prop-2-enoate Chemical compound CCOCCOCCOC(=O)C=C FTALTLPZDVFJSS-UHFFFAOYSA-N 0.000 description 2
- GAWIXWVDTYZWAW-UHFFFAOYSA-N C[CH]O Chemical group C[CH]O GAWIXWVDTYZWAW-UHFFFAOYSA-N 0.000 description 2
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 description 2
- RDHSUTIDSFVNJL-UHFFFAOYSA-N OC(=O)C=C.CCCCCCCCCCCC(O)=O Chemical compound OC(=O)C=C.CCCCCCCCCCCC(O)=O RDHSUTIDSFVNJL-UHFFFAOYSA-N 0.000 description 2
- 239000002202 Polyethylene glycol Substances 0.000 description 2
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000002474 experimental method Methods 0.000 description 2
- 238000001914 filtration Methods 0.000 description 2
- 125000000524 functional group Chemical group 0.000 description 2
- 238000009863 impact test Methods 0.000 description 2
- 239000011229 interlayer Substances 0.000 description 2
- 229940119545 isobornyl methacrylate Drugs 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000012544 monitoring process Methods 0.000 description 2
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 2
- 239000005416 organic matter Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 229920001223 polyethylene glycol Polymers 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- 230000002265 prevention Effects 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000002834 transmittance Methods 0.000 description 2
- PCLLJCFJFOBGDE-UHFFFAOYSA-N (5-bromo-2-chlorophenyl)methanamine Chemical compound NCC1=CC(Br)=CC=C1Cl PCLLJCFJFOBGDE-UHFFFAOYSA-N 0.000 description 1
- BPXVHIRIPLPOPT-UHFFFAOYSA-N 1,3,5-tris(2-hydroxyethyl)-1,3,5-triazinane-2,4,6-trione Chemical compound OCCN1C(=O)N(CCO)C(=O)N(CCO)C1=O BPXVHIRIPLPOPT-UHFFFAOYSA-N 0.000 description 1
- WMYINDVYGQKYMI-UHFFFAOYSA-N 2-[2,2-bis(hydroxymethyl)butoxymethyl]-2-ethylpropane-1,3-diol Chemical compound CCC(CO)(CO)COCC(CC)(CO)CO WMYINDVYGQKYMI-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- 229910002016 Aerosil® 200 Inorganic materials 0.000 description 1
- 229910002018 Aerosil® 300 Inorganic materials 0.000 description 1
- 229910002019 Aerosil® 380 Inorganic materials 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- 101000720524 Gordonia sp. (strain TY-5) Acetone monooxygenase (methyl acetate-forming) Proteins 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N Nonylphenol Natural products CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- 229910019142 PO4 Inorganic materials 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- 239000006087 Silane Coupling Agent Substances 0.000 description 1
- ORLQHILJRHBSAY-UHFFFAOYSA-N [1-(hydroxymethyl)cyclohexyl]methanol Chemical compound OCC1(CO)CCCCC1 ORLQHILJRHBSAY-UHFFFAOYSA-N 0.000 description 1
- 230000005856 abnormality Effects 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000002238 attenuated effect Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 230000005587 bubbling Effects 0.000 description 1
- 235000019437 butane-1,3-diol Nutrition 0.000 description 1
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 239000001569 carbon dioxide Substances 0.000 description 1
- 229910002092 carbon dioxide Inorganic materials 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 125000000113 cyclohexyl group Chemical group [H]C1([H])C([H])([H])C([H])([H])C([H])(*)C([H])([H])C1([H])[H] 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- KPUWHANPEXNPJT-UHFFFAOYSA-N disiloxane Chemical class [SiH3]O[SiH3] KPUWHANPEXNPJT-UHFFFAOYSA-N 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000004134 energy conservation Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000003344 environmental pollutant Substances 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000013022 formulation composition Substances 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 description 1
- ACCCMOQWYVYDOT-UHFFFAOYSA-N hexane-1,1-diol Chemical compound CCCCCC(O)O ACCCMOQWYVYDOT-UHFFFAOYSA-N 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- 238000003384 imaging method Methods 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
- YDKNBNOOCSNPNS-UHFFFAOYSA-N methyl 1,3-benzoxazole-2-carboxylate Chemical compound C1=CC=C2OC(C(=O)OC)=NC2=C1 YDKNBNOOCSNPNS-UHFFFAOYSA-N 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- SNQQPOLDUKLAAF-UHFFFAOYSA-N nonylphenol Chemical compound CCCCCCCCCC1=CC=CC=C1O SNQQPOLDUKLAAF-UHFFFAOYSA-N 0.000 description 1
- OTLDLKLSNZMTTA-UHFFFAOYSA-N octahydro-1h-4,7-methanoindene-1,5-diyldimethanol Chemical compound C1C2C3C(CO)CCC3C1C(CO)C2 OTLDLKLSNZMTTA-UHFFFAOYSA-N 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 1
- 238000011056 performance test Methods 0.000 description 1
- 239000010452 phosphate Substances 0.000 description 1
- 231100000719 pollutant Toxicity 0.000 description 1
- 229920000570 polyether Polymers 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
- 239000011342 resin composition Substances 0.000 description 1
- 230000002441 reversible effect Effects 0.000 description 1
- 238000007790 scraping Methods 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 125000004079 stearyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000002195 synergetic effect Effects 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 239000013008 thixotropic agent Substances 0.000 description 1
- ZIBGPFATKBEMQZ-UHFFFAOYSA-N triethylene glycol Chemical compound OCCOCCOCCO ZIBGPFATKBEMQZ-UHFFFAOYSA-N 0.000 description 1
- 239000003039 volatile agent Substances 0.000 description 1
- 239000012855 volatile organic compound Substances 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J201/00—Adhesives based on unspecified macromolecular compounds
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J11/00—Features of adhesives not provided for in group C09J9/00, e.g. additives
- C09J11/02—Non-macromolecular additives
- C09J11/04—Non-macromolecular additives inorganic
Landscapes
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Inorganic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
In order to overcome the problems of insufficient reliability and volatilization of organic matters of the existing UV adhesive, the invention provides a UV adhesive which comprises the following components: modified photosensitive resin, reactive diluent, photoinitiator, thixotropic filler, coupling agent, adhesion promoter and wetting agent; wherein the modified photosensitive resin comprises the following components in parts by weight: nissan chemical industry Co., Ltd. brand No. UN-9200A, Japan chemical and pharmaceutical industry brand No. KEA-24 and Taiwan Changxing chemical industry Co., Ltd. brand No. DR-U299 in Taiwan area of China. The UV adhesive provided by the invention has extremely low volatility, stronger bonding force, better flexibility and impact resistance; in particular, the UV glue is greatly improved in both water resistance and air tightness, and is particularly suitable for assembling optical devices.
Description
Technical Field
The invention belongs to an ultraviolet curing adhesive, and particularly relates to a UV adhesive.
Background
The UV glue has the advantages of high curing speed, low energy consumption in the curing process, no Organic Solvent (VOCs) in the glue, energy conservation, environmental protection, high efficiency and the like. Therefore, the application range and the dosage of the composition are increased year by year.
China is a large country for electronic product production and consumption, and a large amount of electronic products are produced every year, and a large amount of UV (ultraviolet) glue is needed in the process so as to meet various requirements of bonding, fixing, reinforcing, encapsulating and the like.
Among a plurality of electronic products, a series of optical devices have higher requirements on weather resistance such as water resistance, thermal shock resistance, air tightness and the like. If the used material does not meet the requirements, the performance and the reliability of the equipment are directly influenced. Therefore, the materials used need to be specifically designed for such applications to meet their specific requirements.
Generally, the UV glue is limited by the purity of materials and the formulation composition, and a part of small molecular weight organic volatile matters are generated in the curing process. The organic matters are not crosslinked and fixed through chemical reaction, and the glue can slowly volatilize after the glue is cured, and is particularly obvious when the ambient temperature rises. The organic volatiles generated by the glue can cause pollution to surrounding devices. If the glue is used for bonding and fixing the optical device, the residual organic matters after the glue is cured slowly volatilize to cause device pollution, so that the imaging performance of the optical device is reduced, the actual use effect of equipment is influenced, the quality of the equipment is reduced, and the service life of the equipment is prolonged.
Disclosure of Invention
The invention provides a UV adhesive, aiming at the problems of insufficient reliability and volatilization of organic matters of the existing UV adhesive.
The technical scheme adopted by the invention for solving the technical problems is as follows:
the invention provides UV glue which comprises the following components: modified photosensitive resin, reactive diluent, photoinitiator, thixotropic filler, coupling agent, adhesion promoter and wetting agent;
wherein the modified photosensitive resin comprises the following components in parts by weight:
nissan chemical industry Co., Ltd. brand No. UN-9200A, Japan chemical and pharmaceutical industry brand No. KEA-24 and Taiwan Changxing chemical industry Co., Ltd. brand No. DR-U299 in Taiwan area of China.
Optionally, the UV glue comprises the following components by weight:
40-60 parts of modified photosensitive resin, 30-60 parts of reactive diluent, 2-8 parts of photoinitiator, 3-10 parts of thixotropic filler, 0.5-5 parts of coupling agent, 0.5-5 parts of adhesion promoter and 0.1-0.4 part of wetting agent.
Optionally, the modified photosensitive resin comprises the following components by weight:
10-20 parts of Nissan chemical industry Co., Ltd, No. UN-9200A, 15 parts of Japan chemical and pharmaceutical industry No. KEA-245 and 40 parts of Taiwan Changxing chemical industry Co., Ltd in Taiwan.
Optionally, the reactive diluent comprises monofunctional acrylates and multifunctional acrylates.
Optionally, the reactive diluent comprises the following components by weight:
15-25 parts of isobornyl acrylate, 15-25 parts of N, N-dimethylacrylamide and 1-5 parts of tris (2-hydroxyethyl) isocyanurate triacrylate.
Optionally, the photoinitiator comprises one or more of α, α -dimethylbenzylketal, α -diethoxyacetophenone, 2-hydroxy-2-methyl-phenylacetone-1, 1-hydroxy-cyclohexylbenzophenone, 2-hydroxy-2-methyl-p-hydroxyethyl etherylphenylacetone-1, 2-methyl 1- (4-methylthiophenyl) -2-morpholinopropanone-1, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1, 2,4, 6- (trimethylbenzoyl) diphenylphosphine oxide, and bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide.
Optionally, the thixotropic filler comprises one or more of Evonik Degussa, Inc. brand AEROSIL series, WACKER brand HDK series, and CABOT, Inc. brand CAB-O-SIL series.
Optionally, the coupling agent includes one or more of Dow Corning brand Z series, Momentive (Meiji photo) brand A-151, A-171, A-186, A-187, A-189, A-174, A-1524, A-1160, and A-1230, Japanese Credit brand KBM503, KBM903, KBM603, and KBM 1003.
Optionally, the adhesion promoter comprises one or more of EM39 of Yangxing chemical, SR9050 and SR9051 of Saedoma and PM-2 of Japan chemical.
Optionally, the wetting agent includes one or more of the Digao designations TEGO Wet270 and TEGO Wet280, the German Bick designations BYK-301 and BYK-333.
According to the UV adhesive provided by the invention, a specific-brand Nissan chemical industry Co-Ltd number UN-9200A, a Japanese chemical and chemical industry brand KEA-24 and a Taiwan Changxing chemical industry Limited company number DR-U299 in the Taiwan area are adopted as modified photosensitive resins, and the modified photosensitive resins can be subjected to polymerization reaction with an active diluent, a photoinitiator, a thixotropic filler, a coupling agent, an adhesion promoter and a wetting agent under the illumination condition, so that the modified photosensitive resins of different brands are mutually bonded, and a reticular space cross-linking structure is formed on a microscale, thereby having extremely low volatility, stronger bonding force, better flexibility and impact resistance; particularly, the water resistance and the air tightness of the UV adhesive are greatly improved, so that the UV adhesive is particularly suitable for assembling optical devices, such as bonding and fixing of glass lenses, PC lenses and metal frames, and further the service life of the optical devices is prolonged, the performance and the reliability of equipment are improved, and the lenses and the like are prevented from being polluted.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more apparent, the present invention is further described in detail below with reference to the following embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The embodiment of the invention provides UV glue, which comprises the following components: modified photosensitive resin, reactive diluent, photoinitiator, thixotropic filler, coupling agent, adhesion promoter and wetting agent;
wherein the modified photosensitive resin comprises the following components in parts by weight:
nissan chemical industry Co., Ltd. brand No. UN-9200A, Japan chemical and pharmaceutical industry brand No. KEA-24 and Taiwan Changxing chemical industry Co., Ltd. brand No. DR-U299 in Taiwan area of China.
The inventor tests the raw material modified photosensitive resin adopted by the UV glue in the field for a long time and finds that the preparation environment (such as solvent, temperature, reaction time and the like) of the resin and the component content of the raw material are different, so that the modified photosensitive resins of different brands produced by different companies have larger difference in properties (such as molecular weight range, glass transition temperature, ratio of reaction functional groups, types of auxiliary functional groups and the like), and meanwhile, the modified photosensitive resins of different brands have reaction, so that the larger difference in performance is caused to the final product in application, in order to meet the performance requirements of various aspects such as organic matter volatilization prevention, adhesive force, water resistance, air tightness and the like in the application of the UV glue on optical devices, the inventor tries to adopt various imported or domestic modified photosensitive resins of different brands to carry out substitution tests, and accidentally finds that the UV glue produced by one combination method has cold-resistant property, The water resistance and the air tightness test show excellent effects different from other combinations, meanwhile, other performances such as organic matter volatilization prevention and the like are also kept at a better level, and the formula components corresponding to the UV adhesive are found out through the reverse pushing of the experimental records, so that the applicant further determines the technical scheme for preparing the UV adhesive in the application document after carrying out multiple times of adjustment experiments: by respectively adopting the Japanese chemical industry Co., Ltd, No. UN-9200A, Japanese chemical and pharmaceutical industry No. KEA-24 and Taiwan Changxing chemical industry Co., Ltd, No. DR-U299 in Taiwan area to be mixed as the modified photosensitive resin, the UV adhesive with extremely low volatility, stronger bonding force, better flexibility and impact resistance, water resistance and air tightness is obtained.
In some embodiments, the UV glue comprises the following components by weight:
40-60 parts of modified photosensitive resin, 30-60 parts of reactive diluent, 2-8 parts of photoinitiator, 3-10 parts of thixotropic filler, 0.5-5 parts of coupling agent, 0.5-5 parts of adhesion promoter and 0.1-0.4 part of wetting agent.
In a preferred embodiment, the UV glue comprises the following components by weight:
40-45 parts of modified photosensitive resin, 40-50 parts of reactive diluent, 2.5-5.0 parts of photoinitiator, 5-8 parts of thixotropic filler, 1-3 parts of coupling agent, 1-3 parts of adhesion promoter and 0.1-0.3 part of wetting agent.
Specifically, the modified photosensitive resin can adopt the following components in parts by weight: 40 parts, 42 parts, 45 parts, 49 parts, 50 parts, 52 parts, 55 parts, 59 parts or 60 parts. The reactive diluent may employ the following components by weight: 30 parts, 32 parts, 35 parts, 39 parts, 40 parts, 42 parts, 45 parts, 49 parts, 50 parts, 52 parts, 55 parts, 59 parts or 60 parts. The photoinitiator can adopt the following components in percentage by weight: 2 parts, 3 parts, 5 parts, 6 parts or 8 parts. The thixotropic filler may be comprised of, by weight: 3 parts, 5 parts, 6 parts, 8 parts or 10 parts. The coupling agent may employ the following components by weight: 0.5 part, 1 part, 2 parts, 3 parts, 4 parts or 5 parts. The adhesion promoter comprises the following components in parts by weight: 1 part, 1.5 parts, 2 parts, 2.5 parts or 3 parts. The wetting agent may be used in a weight fraction of 0.1 parts, 0.2 parts, 0.3 parts or 0.4 parts.
In some embodiments, the modified photosensitive resin comprises the following components by weight:
10-20 parts of Nissan chemical industry Co., Ltd, No. UN-9200A, 15 parts of Japan chemical and pharmaceutical industry No. KEA-245 and 40 parts of Taiwan Changxing chemical industry Co., Ltd in Taiwan.
In a preferred embodiment, the modified photosensitive resin is composed of the following components by weight:
10-15 parts of Nissan chemical industry Co., Ltd, No. UN-9200A, 248-12 parts of Japan chemical and pharmaceutical industry No. KEA and 29925-35 parts of Taiwan Changxing chemical industry Co., Ltd in Taiwan.
It should be noted that, the chemical industry co-production company No. UN-9200A, the japanese chemical and chemical industry No. KEA-24, and the taiwan changxing chemical industry limited company No. DR-U299 in taiwan of japan need to be mixed and added in a certain range to play a mutual synergistic effect, and meanwhile, since the modified photosensitive resin composition has a certain addition amount in the UV glue, the content of the modified photosensitive resin of a single brand is too large, the content of the modified photosensitive resin of other brands is correspondingly reduced, and further the performance of the modified photosensitive resin is not obviously improved; the inventors found through a large number of experiments that the UV adhesive performance is improved when the chemical industry Co., Ltd, No. UN-9200A, the chemical industry No. KEA-24 of Japan and the chemical industry No. DR-U299 of Taiwan Changxing chemical industry Co., Ltd, in Taiwan, Japan are in the above range.
In some embodiments, the reactive diluent molecular structure contains one or several "-C ═ C-", which can participate in polymerization reactions, including one or more of monofunctional acrylates and multifunctional acrylates.
In some embodiments, the reactive diluent comprises a monofunctional acrylate and a multifunctional acrylate.
The monofunctional acrylate includes one or more of isobornyl methacrylate, 2 (2-ethoxyethoxy) ethyl acrylate, isobornyl acrylate, lauric acid acrylate, N-dimethylacrylamide, acryloylmorpholine, hydroxyethyl (meth) acrylate, hydroxypropyl (meth) acrylate, ethoxylated hydroxyethyl (meth) acrylate, propyl (meth) acrylate, butyl (meth) acrylate, N-hexyl (meth) acrylate, isooctyl (meth) acrylate, cyclohexyl (meth) acrylate, stearyl (meth) acrylate, tetrahydrofurfuryl (meth) acrylate, glycidyl (meth) acrylate, 2-phenoxyethyl (meth) acrylate, and alkoxylated nonylphenol (meth) acrylate.
The above monofunctional acrylates are all commercially available, for example, isobornyl methacrylate is available from SARTOMER brand SR 423; 2 (2-ethoxyethoxy) ethyl acrylate is available from SARTOMER brand SR 256; isobornyl acrylate is available from osaka, japan under the organic chemical designation IBXA; lauric acid acrylates are available from taiwan changxing chemical industry ltd, taiwan, china under the designation EM 215; n, N-dimethylacrylamide is available from Nippon Kyowa Kabushiki Kaisha under the brand name DMAA; acryloylmorpholine is available from Nippon Konji Chemicals (KJ Chemicals) brand ACMO.
The multifunctional acrylate includes tris (2-hydroxyethyl) isocyanurate triacrylate, pentaerythritol tetraacrylate, ethylene glycol di (meth) acrylic acid, diethylene glycol di (meth) acrylic acid, triethylene glycol di (meth) acrylic acid, cyclohexanedimethanol diacrylate, alkoxylated hexanediol di (meth) acrylate, alkoxylated cyclohexanedimethanol di (meth) acrylate, alkoxylated neopentyl glycol di (meth) acrylate, 1, 3-butanediol di (meth) acrylate, 1, 4-butanediol di (meth) acrylate, 1, 6-hexanediol di (meth) acrylate, neopentyl glycol diacrylate, polyethylene glycol (200) di (meth) acrylate, polyethylene glycol (400) di (meth) acrylate, ethoxylated bisphenol A di (meth) acrylate, ethylene oxide, propylene oxide, and the like, One or more of tricyclodecane dimethanol di (meth) acrylate, propoxylated neopentyl glycol di (meth) acrylate, trimethylolpropane tri (meth) acrylate, tris (2-hydroxyethyl) isocyanurate tri (meth) acrylate, ethoxylated trimethylolpropane tri (meth) acrylate, propoxylated trimethylolpropane tri (meth) acrylate, pentaerythritol tri (meth) acrylate, dipentaerythritol penta/hexa (meth) acrylate, ditrimethylolpropane tetra (meth) acrylate.
The above multifunctional acrylates are commercially available, for example, tris (2-hydroxyethyl) isocyanurate triacrylate is available under the SARTOMER brand SR368 NS; pentaerythritol tetraacrylate is commercially available from taiwan chang chemical industry ltd, taiwan, china under the designation EM 241.
In a preferred embodiment, the reactive diluent comprises the following components by weight:
20-25 parts of isobornyl acrylate (obtained from Osaka, Japan, organic chemical trade name IBXA), 20-25 parts of N, N-dimethylacrylamide (obtained from Nippon and Kabushiki Kaisha, brand DMAA) and 3-5 parts of tris (2-hydroxyethyl) isocyanurate triacrylate (obtained from SARTOMER, USA, brand SR368 NS).
The invention adopts three different reactive diluents of isobornyl acrylate, N-dimethylacrylamide and tris (2-hydroxyethyl) isocyanurate triacrylate to mix, and the various reactive diluents have certain overlap in function, but the action mechanism and the crosslinking sites are different, and the different reactive diluents can mutually promote, so that the crosslinking density of a reaction product is improved to the maximum extent, the UV adhesive has better flexibility and impact resistance, and meanwhile, the water resistance and the air tightness of the UV adhesive are also ensured.
In some embodiments, the photoinitiator comprises one or more of α, α -dimethylbenzyl ketal, α -diethoxyacetophenone, 2-hydroxy-2-methyl-phenylacetone-1, 1-hydroxy-cyclohexylbenzophenone, 2-hydroxy-2-methyl-p-hydroxyethyl etherylphenylacetone-1, 2-methyl 1- (4-methylthiophenyl) -2-morpholinoacetone-1, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1, 2,4, 6- (trimethylbenzoyl) diphenylphosphine oxide, and bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide.
In some embodiments, the thixotropic filler is selected from gas phase carbon dioxide.
In a preferred embodiment, the thixotropic filler comprises one or more of Evonik Degussa, Inc. brand AEROSIL series, WACKER brand HDK series, and CABOT, Inc. brand CAB-O-SIL series.
The Aerosil series of the Evonik Degussa comprises one or more of AEROSIL380, AEROSIL 300, AEROSIL 200, AEROSIL R8200, AEROSIL R812, AEROSIL R202, AEROSIL R972 and AEROSIL R974.
The WACKER brand HDK series includes one or more of H13, H15, H20, N20, V15, C10, T30 and T4.
The CABOT series includes one or more of TS-530, TS-610, TS-720, LM-150, M-5, and EH-5.
In some embodiments, the coupling agent is selected from silane coupling agents.
In a preferred embodiment, the coupling agent comprises one or more of the Dow Corning brand Z series, Momentive (Meiji photo USA) brands A-151, A-171, A-186, A-187, A-189, A-174, A-1524, A-1160 and A-1230, and Japanese messenger brands KBM503, KBM903, KBM603 and KBM 1003.
The Dow Corning brand Z series includes one or more of Z-6011, Z-6043, Z-6030, Z-6040 and Z-6518.
In some embodiments, the adhesion promoter is selected from phosphate ester promoters.
In a preferred embodiment, the adhesion promoter comprises one or more of EM39 of Yangxing chemical, SR9050 and SR9051 of Saedoma and PM-2 of Japan chemical.
In some embodiments, the wetting agent is selected from polyether siloxane based wetting agents.
In a preferred embodiment, the wetting agent comprises one or more of the Digao designations TEGO Wet270 and TEGO Wet280, the German Bick designations BYK-301 and BYK-333.
Another embodiment of the present invention provides a method for preparing the UV glue, which comprises the following steps:
drying the active diluent to remove water for later use; controlling the ambient temperature to be 25 ℃ and the relative humidity to be less than or equal to 50%; selecting a reaction kettle with a high-speed dispersing device and a constant-temperature interlayer, adding the modified photosensitive resin and the reactive diluent, and stirring at constant temperature of 40 ℃ until the modified photosensitive resin is completely dissolved; then adding the wetting agent, the coupling agent and the adhesion promoter and stirring uniformly; keeping the temperature to 30 ℃, adding the thixotropic agent, dispersing for 2 hours at a high speed, and ensuring that the edge linear velocity of the high-speed disperser reaches 10 m/S; adding a photoinitiator, and stirring until the photoinitiator is completely dissolved; vacuumizing (the vacuum degree is more than 0.095MPa) until air bubbles in the glue completely disappear; and (6) detecting, filtering and packaging.
The present invention will be further illustrated by the following examples.
Example 1
This embodiment is used to illustrate the UV adhesive and the preparation method thereof disclosed in the present invention, and the UV curable adhesive is prepared according to the following components by weight:
the preparation method of the ultraviolet curing adhesive comprises the following steps: selecting a reaction kettle with a high-speed dispersing device and a constant-temperature interlayer, adding the component A and the component B, and stirring at constant temperature of 40 ℃ until the component A is completely dissolved; then adding the component D, the component E and the component G, and stirring uniformly; keeping the temperature to 30 ℃, adding the component F, dispersing for 2 hours at a high speed, and ensuring that the edge linear velocity of the high-speed disperser reaches 10 m/S; adding the component C, and stirring for 30 minutes until the component C is completely dissolved; vacuumizing for 15 minutes, and ensuring that the vacuum degree is less than 0.01MPa until bubbles disappear; detecting, filtering with 200 mesh filter screen, and packaging according to required specification.
Example 2
This embodiment is used to illustrate the UV adhesive and the preparation method thereof disclosed in the present invention, and the UV curable adhesive is prepared according to the following components by weight:
the photocurable adhesive was prepared according to the method of example 1.
Example 3
This embodiment is used to illustrate the UV adhesive and the preparation method thereof disclosed in the present invention, and the UV curable adhesive is prepared according to the following components by weight:
the photocurable adhesive was prepared according to the method of example 1.
Example 4
This embodiment is used to illustrate the UV adhesive and the preparation method thereof disclosed in the present invention, and the UV curable adhesive is prepared according to the following components by weight:
the photocurable adhesive was prepared according to the method of example 1.
Example 5
This embodiment is used to illustrate the UV adhesive and the preparation method thereof disclosed in the present invention, and the UV curable adhesive is prepared according to the following components by weight:
the photocurable adhesive was prepared according to the method of example 1.
Example 6
This embodiment is used to illustrate the UV adhesive and the preparation method thereof disclosed in the present invention, and the UV curable adhesive is prepared according to the following components by weight:
the photocurable adhesive was prepared according to the method of example 1.
Example 7
This embodiment is used to illustrate the UV adhesive and the preparation method thereof disclosed in the present invention, and the UV curable adhesive is prepared according to the following components by weight:
the photocurable adhesive was prepared according to the method of example 1.
Example 8
This embodiment is used to illustrate the UV adhesive and the preparation method thereof disclosed in the present invention, and the UV curable adhesive is prepared according to the following components by weight:
the photocurable adhesive was prepared according to the method of example 1.
Comparative example 1
The comparative example is used for comparative explanation of the UV adhesive and the preparation method thereof disclosed by the invention, and the UV curing adhesive is prepared according to the following components by weight:
wherein the modified photosensitive resin having the designation CNUVE151NS was purchased from SARTOMER USA.
The photocurable adhesive was prepared according to the method of example 1.
Comparative example 2
The comparative example is used for comparative explanation of the UV adhesive and the preparation method thereof disclosed by the invention, and the UV curing adhesive is prepared according to the following components by weight:
the photocurable adhesive was prepared according to the method of example 1.
Comparative example 3
The comparative example is used for comparative explanation of the UV adhesive and the preparation method thereof disclosed by the invention, and the UV curing adhesive is prepared according to the following components by weight:
the photocurable adhesive was prepared according to the method of example 1.
Comparative example 4
The comparative example is used for comparative explanation of the UV adhesive and the preparation method thereof disclosed by the invention, and the UV curing adhesive is prepared according to the following components by weight:
the photocurable adhesive was prepared according to the method of example 1.
Performance testing
The UV adhesives prepared in the above examples 1-8 and comparative examples 1-4 were subjected to the following performance tests:
measuring the viscosity of the ultraviolet curing adhesive:
reference standard: ASTM D3795-2000a (2012)
A detection instrument: american BROOKFIELD laminar viscometer, CAP2000+
And (3) testing conditions are as follows: temperature 25 deg.C, gauge number 6#, and rotation speed 5RPM
And (3) measuring the hardness of the cured adhesive:
pouring an adhesive into a mold by using the mold with a groove with the diameter of 50mm and the depth of 3mm, scraping redundant glue, putting the mold into a UV curing machine for 900mJ energy curing, standing the prepared sample piece at 23 ℃ for 4 hours at room temperature with the relative humidity of 50%, overlapping the two pieces (the thickness is larger than or equal to 6mm), and measuring the hardness by using a Shore D hardness tester.
And (3) measuring the bonding strength of the cured adhesive:
cutting a transparent PC board with the thickness of 0.5mm into square sheets with the thickness of 5 multiplied by 5 mm; coating the glue on the glass slide, wherein the coating thickness is 0.1 mm; placing a PC sheet, wherein the bonding area is 5 multiplied by 5mm, and the thickness of a glue layer is 0.1 mm; the illumination intensity is 100mW/cm2Irradiating the ultraviolet light wave band by a mercury lamp with the wavelength of 200 nm-450 nm for 9 seconds, and accumulating the curing energy to 900mJ/cm2(ii) a And standing the solidified sample wafer for 2 hours at the room temperature of 25 ℃ to be tested.
A multifunctional push-pull force tester (Nordson Dage, United kingdom, manufacturer, model DAGE 4000) is used for pushing the PC sheet from the direction parallel to the bonding surface at the room temperature of 25 ℃ at the speed of 2mm/min until the PC sheet is broken and falls off, and the bonding strength (unit MPa) of the glue is detected.
And (3) determining the volatility of the adhesive:
solidifying the glue into a sample strip with the thickness of 10 multiplied by 2 multiplied by 1mm, weighing the sample strip with the total weight of about 2g, placing the sample strip into a 100ml conical flask, and cleaning a glass slide on a bottle cap; placing the conical flask on a heating plate, setting the heating temperature to be 90 ℃ and the heating time to be 48 hours; and after heating is finished, observing whether the bottle mouth glass slide has obvious pollutants or not, and if so, judging that the result is NG.
Testing the adhesive reliability:
cutting a transparent PC board having a thickness of 1.5mm into a sheet having a thickness of 100mm × 25mmA rectangular sheet; coating glue on one end of a PC sheet, and lapping the PC sheet by using the other PC sheet, wherein the bonding area is 25mm multiplied by 12.5mm, and the thickness of a glue layer is 0.1 mm; the illumination intensity is 100mW/cm2Irradiating the ultraviolet light wave band by a mercury lamp with the wavelength of 200 nm-450 nm for 9 seconds, and accumulating the curing energy to 900mJ/cm2. And (3) placing the solidified sample wafer in a cold-hot impact test box, setting the temperature of minus 40 ℃/1 hour to 80 ℃/1 hour as a cycle, and testing for 50 cycles. The change in shear strength is detected and the result is NG if there is a change.
And (3) immersing the solidified sample wafer into deionized water, soaking at the room temperature of 25 ℃ for 240 hours, observing whether the glue layer cracks or falls off, and detecting the change of the shear strength by using an electronic universal tensile machine (manufacturer LABSANS, model LD23-104), wherein the shear strength is attenuated by more than 40 percent, and the result is NG.
The test results obtained are filled in Table 1.
TABLE 1
Comparing the test results of examples 1 to 5 and comparative examples 1 to 4 in table 1, it can be seen that the UV glue prepared by using a specific brand of japanese chemical industry co, No. UN-9200A, japanese chemical and pharmaceutical industry No. KEA-24 and taiwan chang chemical industry limited company, No. DR-U299 as the modified photosensitive resin has high viscosity, hardness and bonding strength and good reliability, and effectively inhibits the volatilization of organic matters of the UV glue, and the test results of comparative documents 1 to 4 show that the absence of any one of the modified photosensitive resins preferably selected in the present invention can cause the deficiency of the UV glue in various aspects, thereby failing to produce good application effect.
Comparing the test results of examples 5-8 in table 1, it can be seen that, on the basis of the modified photosensitive resin provided by the present invention, the co-addition of isobornyl acrylate (osaka, japan organic chemical trade mark IBXA), N-dimethylacrylamide (japan, and japan, ltd. do., trade mark DMAA), and tris (2-hydroxyethyl) isocyanurate triacrylate (american, SARTOMER trade mark SR368NS) has a better auxiliary effect on the improvement of the volatility resistance and reliability of the UV adhesive.
The UV adhesives prepared in the embodiments 1-8 and the comparative examples 1-4 are respectively applied to the assembly of a monitoring camera, and the specific implementation method is as follows:
UV glue is dispensed at the corresponding position of the metal outer frame of the monitoring camera, the outer diameter of the glue groove is 37mm, the inner diameter is 30mm, the dispensing width is 3.5mm, the glue consumption of a single point is controlled to be 0.08-0.10 g, and the dispensing height is about 0.5 mm;
placing the glass lens or the PC lens at a corresponding dispensing position to ensure that the lens and the PC lens are in complete contact with the adhesive and no gap or air bubble exists;
primarily fixing the device by using a UV-LED light source with dominant wavelength of 365nm, wherein the irradiation power of UV lamp light is 200mW/cm2Irradiation time 3S, irradiation energy 600mJ/cm2;
Using a UV mercury lamp with the dominant wavelength of 365nm to carry out secondary curing on the device, wherein the irradiation power of UV lamplight is 100mW/cm2The irradiation time is 5S, and the irradiation energy is 500mJ/cm2;
The appearance of the cured sample piece is visually checked to see whether the sample piece has the abnormality or not, and whether the adhesive has the bubbling, cracking or falling-off or not. If the appearance is normal, the volatility, the adhesive strength, the water resistance, the cold and hot shock resistance and the air tightness are tested according to the following test methods, and the test results are shown in Table 2.
Determination of volatility:
and placing the manufactured sample piece in a 90 ℃ oven, continuously baking for 48H, and detecting the change of the light transmittance of the glass lens. And if the light transmittance is reduced by more than 5%, judging the test result to be NG.
Measurement of adhesion:
placing the manufactured sample piece on a thrust machine, and applying thrust on the glass lens, wherein the thrust is more than 20
Kg-f, the result is OK, and if it is less than 20Kg-f, the result is NG.
Determination of Water resistance:
and placing the prepared sample piece into deionized water at 25 ℃, continuously soaking for 10 days (240H), and detecting the bonding force of the glass lens, wherein if the bonding force is less than 10Kg-f, the result is NG.
Determination of thermal shock resistance:
placing the manufactured sample piece in a cold-hot impact test box, setting-40 ℃/1 hour to 80 ℃/1 hour as a cycle, and testing for 50 cycles; if the adhesive layer is whitened, cracked, bubbled, or the adhesive force is less than 10Kg-f, the result is NG.
Measurement of airtightness:
and (3) carrying out underwater closed inflation on the sample piece which passes the water resistance and cold and hot shock tests, wherein the air pressure is 0.1MPa, observing whether the glue bonding part has air leakage or not, and judging the air tightness test result NG if air leakage exists.
TABLE 2
Comparing the test results of examples 1-5 and comparative examples 1-4 in table 2, it can be seen that when the UV glue prepared by the modified photosensitive resin with a specific mark provided by the invention is applied to camera assembly, the UV glue has high bonding force, good water resistance and thermal shock resistance, and meanwhile, the volatilization of organic matters of the UV glue is effectively inhibited, and the pollution to the camera lens is avoided.
Comparing the test results of examples 5-8 in table 2, it can be seen that, on the basis of the modified photosensitive resin provided by the present invention, the co-addition of isobornyl acrylate (osaka, japan organic chemical trade mark IBXA), N-dimethylacrylamide (japan and japan co., ltd. mark DMAA), and tris (2-hydroxyethyl) isocyanurate triacrylate (american SARTOMER trade mark SR368NS) has a better auxiliary effect on the improvement of the performance of the UV adhesive.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.
Claims (10)
1. The UV adhesive is characterized by comprising the following components:
modified photosensitive resin, reactive diluent, photoinitiator, thixotropic filler, coupling agent, adhesion promoter and wetting agent;
wherein the modified photosensitive resin comprises the following components in parts by weight:
nissan chemical industry Co., Ltd. brand No. UN-9200A, Japan chemical and pharmaceutical industry brand No. KEA-24 and Taiwan Changxing chemical industry Co., Ltd. brand No. DR-U299 in Taiwan area of China.
2. The UV glue of claim 1, wherein the UV glue comprises the following components by weight:
40-60 parts of modified photosensitive resin, 30-60 parts of reactive diluent, 2-8 parts of photoinitiator, 3-10 parts of thixotropic filler, 0.5-5 parts of coupling agent, 0.5-5 parts of adhesion promoter and 0.1-0.4 part of wetting agent.
3. The UV glue of claim 1, wherein the modified photosensitive resin comprises the following components in parts by weight:
10-20 parts of Nissan chemical industry Co., Ltd, No. UN-9200A, 15 parts of Japan chemical and pharmaceutical industry No. KEA-245 and 40 parts of Taiwan Changxing chemical industry Co., Ltd in Taiwan.
4. The UV glue of claim 1, wherein the reactive diluent comprises monofunctional acrylates and multifunctional acrylates.
5. The UV glue of claim 4, wherein the reactive diluent comprises the following components in parts by weight:
15-25 parts of isobornyl acrylate, 15-25 parts of N, N-dimethylacrylamide and 1-5 parts of tris (2-hydroxyethyl) isocyanurate triacrylate.
6. The UV glue of claim 1, wherein the photoinitiator comprises one or more of α, α -dimethylbenzyl ketal, α -diethoxyacetophenone, 2-hydroxy-2-methyl-phenylacetone-1, 1-hydroxy-cyclohexylbenzophenone, 2-hydroxy-2-methyl-p-hydroxyethyl etherylphenylacetone-1, 2-methyl 1- (4-methylthiophenyl) -2-morpholinoacetone-1, 2-benzyl-2-dimethylamino-1- (4-morpholinophenyl) butanone-1, 2,4, 6- (trimethylbenzoyl) diphenylphosphine oxide, and bis (2,4, 6-trimethylbenzoyl) phenylphosphine oxide.
7. The UV glue of claim 1, wherein the thixotropic filler comprises one or more of the Evonik Degussa series of trademarks AEROSIL, WACKER HDK, and CABOT CAB-O-SIL series.
8. The UV glue of claim 1, wherein the coupling agent comprises one or more of Dow Corning brand Z series, Momentive (Meyer's Patents) brand A-151, A-171, A-186, A-187, A-189, A-174, A-1524, A-1160, and A-1230, Japanese Trust KBM503, KBM903, KBM603, and KBM 1003.
9. The UV glue of claim 1, wherein the adhesion promoter comprises one or more of EM39 of Yangxing chemical, SR9050 of Saedoma, SR9051 and PM-2 of Japan chemical.
10. The UV glue of claim 1, wherein the wetting agent comprises one or more of dikao brand TEGO Wet270 and TEGO Wet280, and german birk brand BYK-301 and BYK-333.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110182513.9A CN112940676B (en) | 2021-02-08 | 2021-02-08 | UV adhesive |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN202110182513.9A CN112940676B (en) | 2021-02-08 | 2021-02-08 | UV adhesive |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112940676A true CN112940676A (en) | 2021-06-11 |
CN112940676B CN112940676B (en) | 2023-09-15 |
Family
ID=76245331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN202110182513.9A Active CN112940676B (en) | 2021-02-08 | 2021-02-08 | UV adhesive |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112940676B (en) |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006342222A (en) * | 2005-06-08 | 2006-12-21 | Mitsuyoshi Sato | Light-curable resin composition |
CN105820794A (en) * | 2016-05-30 | 2016-08-03 | 三友(天津)高分子技术有限公司 | Inorganic filler modified ultraviolet curing adhesive |
CN106281052A (en) * | 2015-05-20 | 2017-01-04 | 北京鼎材科技有限公司 | A kind of photocuring Adhesive composition |
CN111234712A (en) * | 2019-12-23 | 2020-06-05 | 深圳日高胶带新材料有限公司 | UV-cured optical pressure-sensitive adhesive and preparation method thereof |
-
2021
- 2021-02-08 CN CN202110182513.9A patent/CN112940676B/en active Active
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2006342222A (en) * | 2005-06-08 | 2006-12-21 | Mitsuyoshi Sato | Light-curable resin composition |
CN106281052A (en) * | 2015-05-20 | 2017-01-04 | 北京鼎材科技有限公司 | A kind of photocuring Adhesive composition |
CN105820794A (en) * | 2016-05-30 | 2016-08-03 | 三友(天津)高分子技术有限公司 | Inorganic filler modified ultraviolet curing adhesive |
CN111234712A (en) * | 2019-12-23 | 2020-06-05 | 深圳日高胶带新材料有限公司 | UV-cured optical pressure-sensitive adhesive and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN112940676B (en) | 2023-09-15 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
ES2839457T3 (en) | Optically Clear Curable Pressure Sensitive Adhesives and Uses Thereof | |
CN106459695B (en) | Transparent adhesive sheet | |
CN102574951B (en) | (meth)Acrylic resin composition | |
CN104271697A (en) | Adhesive composition | |
JP6359996B2 (en) | Ultraviolet curable liquid organopolysiloxane composition for image display device, adhesive for image display device containing the composition, image display device using the adhesive, and bonding method using the adhesive | |
KR102206665B1 (en) | Photocurable resin composition | |
JP2021004373A (en) | Photocurable adhesive sheet laminate, method for producing photocurable adhesive sheet laminate, and method for manufacturing image display panel laminate | |
JP5297163B2 (en) | UV curable resin composition and bonding method using the same | |
KR101436274B1 (en) | Adhesive for bonding front plate for display devices, adhesive set for bonding front plate for display devices, method for manufacturing display device, and display device | |
JP6262684B2 (en) | Ultraviolet curable liquid organopolysiloxane composition for image display device, adhesive for image display device containing the composition, image display device using the adhesive, and bonding method using the adhesive | |
WO2018038221A1 (en) | Curable resin composition, image display device and manufacturing method of image display device | |
KR20170134441A (en) | Photo-curable adhesive composition | |
CN103459445A (en) | Curable composition | |
JP2019085488A (en) | Method of bonding substrates | |
JP6557041B2 (en) | Laminate comprising light or thermosetting resin composition | |
JP2017145293A (en) | Photocurable resin composition | |
CN110930864B (en) | Method for manufacturing image display device | |
JP2003238904A (en) | Photocuring adhesive composition for optical use | |
JP2016160342A (en) | Light or thermosetting resin composition, cured product and laminate | |
CN112940676A (en) | UV adhesive | |
JP2019085489A (en) | Method of bonding substrates | |
CN102265212A (en) | Photocurable composition for liquid crystal display panel sealing and liquid crystal display panel | |
WO2016104525A1 (en) | Photocurable resin composition, and image display device and method for manufacturing same | |
JP2017113943A (en) | Transfer film | |
JP5588197B2 (en) | Photo-curable resin composition for touch panel and touch panel |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
GR01 | Patent grant | ||
GR01 | Patent grant |