CN112926171A - Method for realizing compactness theory deduction of nano copper powder sintered body - Google Patents
Method for realizing compactness theory deduction of nano copper powder sintered body Download PDFInfo
- Publication number
- CN112926171A CN112926171A CN201911237887.5A CN201911237887A CN112926171A CN 112926171 A CN112926171 A CN 112926171A CN 201911237887 A CN201911237887 A CN 201911237887A CN 112926171 A CN112926171 A CN 112926171A
- Authority
- CN
- China
- Prior art keywords
- sintering
- copper powder
- sintered body
- temperature
- crystal structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B33—ADDITIVE MANUFACTURING TECHNOLOGY
- B33Y—ADDITIVE MANUFACTURING, i.e. MANUFACTURING OF THREE-DIMENSIONAL [3-D] OBJECTS BY ADDITIVE DEPOSITION, ADDITIVE AGGLOMERATION OR ADDITIVE LAYERING, e.g. BY 3-D PRINTING, STEREOLITHOGRAPHY OR SELECTIVE LASER SINTERING
- B33Y50/00—Data acquisition or data processing for additive manufacturing
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P10/00—Technologies related to metal processing
- Y02P10/25—Process efficiency
Landscapes
- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Materials Engineering (AREA)
- Powder Metallurgy (AREA)
Abstract
The invention discloses a method for realizing a deduction of a density theory of a nano copper powder sintered body, which comprises the following steps of: (1) determining the initial crystal structure, shape and granularity of the laser sintering copper powder; (2) calculating the theoretical melting point of the nano copper powder by adopting a molecular dynamics material calculation method; (3) establishing a theoretical model of the copper nanoparticle particles, and digging a block body with a regular shape in the model to serve as a sintering simulation experiment object model; (4) using molecular dynamics material calculation method, at sintering temperature TSinteringCarrying out constant-temperature sintering simulation experiments under the condition of the time length t; (5) continuing to perform a cooling sintering simulation experiment on the sintered body until the sintering temperature is reduced to room temperature, and ending the simulation experiment; (6) simulation modelAfter the test is finished, obtaining a theoretical model of the sintered body; (7) and calculating the density of the sintered body according to the specified expression. The method has the advantages of reliability, reduction of experimental amount, remarkable reduction of the cost of groping the copper powder 3D printing process, and improvement of research and development efficiency.
Description
Technical Field
The invention belongs to the field of powder metallurgy, and particularly relates to a method for realizing a deduction of a density theory of a nano copper powder sintered body.
Background
The 3D printing belongs to an additive manufacturing method, and the required product is manufactured by superposing materials layer by layer in a three-dimensional printing mode. 3D printing does not require the use of molds, and has natural advantages in manufacturing personalized, non-high volume products. The 3D printed copper product can be widely applied to the fields of electronics, electric power, energy, chemical industry, automobiles, machinery, high-energy physics and the like. Laser sintering is the mainstream technological method for 3D printing of metal materials. However, the metal copper has the characteristics of high light reflection and high heat conduction, so that the 3D printing difficulty is high and the energy consumption is high.
The utilization of the size effect of the nano material is one of feasible ways for solving the problem of 3D printing of the copper powder. When the granularity of the copper powder reaches the nanometer level, the melting point is obviously reduced, and the printing energy consumption can be effectively reduced. However, the surface energy and catalytic activity of the nano copper powder are high, and the preparation experiment of the 3D printing product has the problems of high equipment requirement, high cost, high difficulty and the like, and particularly, a laser sintering process for exploring the nano copper powder needs to spend a large amount of manpower and material resources. The compactness is an important index parameter of a powder metallurgy product, and a rapid and low-cost method is found by adopting an advanced material calculation means to realize theoretical deduction, characterization and prediction of the compactness of the nano copper powder sintered body, so that the method has very important significance.
Disclosure of Invention
The invention aims to provide a method for realizing theoretical deduction of density of a nano copper powder sintered body, which can realize theoretical deduction, characterization and prediction of the density of the nano copper powder sintered body quickly and at low cost, obviously reduce the cost of groping the copper powder 3D printing process and improve the research and development efficiency.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method for realizing the deduction of the density theory of a nano copper powder sintered body comprises the following steps:
(1) determining the initial crystal structure, shape and granularity of the laser sintering nano copper powder;
(2) aiming at the nano copper powder parameters determined in the step (1), calculating the theoretical melting point T of the nano copper powder by adopting a molecular dynamics material calculation methodMelting Point;
(3) Establishing a theoretical model of the copper nanoparticle particles, and digging a block body with a regular shape in the model to serve as a sintering simulation experiment object model;
(4) adopting a molecular dynamics material calculation method to simulate the sintering simulation experiment object in the step (3) at the sintering temperature TSinteringCarrying out constant-temperature sintering simulation experiments under the condition of the time length t;
(5) continuing to perform a cooling sintering simulation experiment on the sintered body until the sintering temperature is from T after the constant-temperature sintering simulation in the step (4)SinteringCooling to room temperature TAt room temperatureAnd finishing the sintering simulation experiment;
(6) after the simulation experiment is finished, obtaining a theoretical model of the sintered body;
(7) according to the theoretical model of the sintered body in the step (6), according to the expressionCalculating to obtain the density of the sintered body, wherein V refers to the total volume of the sintered body model after the sintering simulation experiment is finished, and V isiRefers to the volume obtained by arranging all atoms of the ith crystal structure in a sintered body, and n represents atoms with n crystal structures.
In the method, the initial crystal structure of the copper powder in the step (1) is face-centered cubic, the shape of the initial crystal structure is a sphere, a cube or a polyhedron, and the particle size range of the copper powder is less than 100 nanometers.
In the method, the method for calculating the melting point of the nano copper powder in the step (2) mainly comprises a solid-liquid two-phase method, an energy-temperature method and a volume-temperature method.
In the method of the present invention, the molecular dynamics calculations in steps (2), (4), (5) are all performed under constant pressure conditions.
In the method, the theoretical model of the nano copper powder is established in the step (3), and the nano copper powder particles are closely packed to minimize pores among the particles.
In the method of the present invention, the number of copper powder particles contained in the sintering simulation test object model in step (3) is greater than 2.
In the method of the present invention, the bulk dug out inside the mold in step (3) is cubic, and must be completely filled with the copper powder particles in a periodic regular arrangement.
In the method of the present invention, the sintering temperature T in the step (4)SinteringThe theoretical melting point T of the nano copper powder with the same granularity calculated in the step (2) is lower thanMelting Point。
In the method of the present invention, in the step (7), all atoms of the i-th crystal structure are extracted according to the calculation result and arranged into a regular shape, such as a cube or a cuboid, and then the corresponding volume V is calculatedi。
In the method of the present invention, the n-crystal structure includes face-centered cubic, body-centered cubic, hexagonal close-packed, disordered structures.
In the method of the present invention, in step (7), the volume V is obtained by a calculation simulation program, and the volume V is obtained by a calculation simulation programiBy the formula Vi=Vi0×(Ni÷Ni0) To obtain wherein Vi0Unit cell volume, N, of the metallic copper ith crystal structureiTo calculate the number of copper atoms in the ith crystal structure in the system, Ni0The number of copper atoms in the i-th crystal structure unit cell.
The invention has the beneficial effects that:
(1) the method for setting the process parameters of the invention applies advanced material calculation simulation means and mature algorithm, and has reliability from the essential characteristics of the material.
(2) The method can greatly reduce the experimental amount, remarkably reduce the cost of groping the copper powder 3D printing process and improve the research and development efficiency.
Drawings
Fig. 1 is a theoretical model of the close-packed copper nanoparticle particles established in example 1.
FIG. 2 is a model of a sintering simulation subject in example 1.
Fig. 3 is a theoretical model of the sintered body obtained after the end of the simulation experiment in example 1.
Detailed Description
The invention is further illustrated with reference to the following figures and examples. It should be emphasized that the following description is merely exemplary in nature and is not intended to limit the scope of the invention or its application.
Example 1
In this embodiment, the theoretical deductive process of the density of the sintered body of the nano copper powder is as follows:
(1) determining the initial crystal structure, shape and granularity of the laser sintering nano copper powder as follows: face centered cubic, spherical and 2 nm;
(2) aiming at the nano copper powder parameters determined in the step (1), calculating the melting point of 2nm copper powder particles by adopting a molecular dynamics method, and obtaining a theoretical melting point T by an energy-temperature methodMelting Point=942K。
(3) A theoretical model of the copper nanoparticle particles is established as shown in fig. 1, a block body with a regular shape is dug in the model to be used as a sintering simulation experiment object model, the object model is shown in fig. 2, and the number of the copper nanoparticle particles is 4.
(4) Sintering simulation experiment objects shown in FIG. 2 are subjected to a sintering temperature (T) by adopting a molecular dynamics material calculation methodSintering) The constant temperature sintering simulation experiment is carried out under the conditions of 373.15K and the sintering time (t) of 200 ps.
(5) Continuing to perform a temperature-reducing sintering simulation experiment on the sintered body at the rate of 1K/ps after the constant-temperature sintering simulation in the step (4) until the sintering temperature is 373.15K (T)Sintering) Cooling to room temperature to 300K (T)At room temperature) And the sintering simulation experiment is finished.
(6) After the simulation was completed, a theoretical model of the sintered body was obtained, as shown in fig. 3.
(7) According to the theoretical model of the sintered body in the step (6), according to the expressionAnd (6) calculating the density. Wherein the system after sintering has 2 atoms with crystal structure, namely n is 2. Total volume of sintered bodyDirectly output by a molecular dynamics calculation program. The 1 st crystal structure is face centered cubic according to formula Vi=Vi0×(Ni+Ni0),N1Is 1219, N10Is 4, V1047.046, volume thereof The 2 nd crystal structure is a hexagonal close-packed structure, N2Is 257, N20Is 6, V20Is composed ofVolume thereofThe final calculated density of the sintered body was about 94%.
Claims (10)
1. A realization method of a density theory deduction of a nano copper powder sintered body is characterized by comprising the following steps:
(1) determining the initial crystal structure, shape and granularity of the laser sintering nano copper powder;
(2) aiming at the nano copper powder parameters determined in the step (1), calculating the theoretical melting point T of the nano copper powder by adopting a molecular dynamics material calculation methodMelting Point;
(3) Establishing a theoretical model of the copper nanoparticle particles, and digging a block body with a regular shape in the model to serve as a sintering simulation experiment object model;
(4) adopting a molecular dynamics material calculation method to simulate the sintering simulation experiment object in the step (3) at the sintering temperature TSinteringCarrying out constant-temperature sintering simulation experiments under the condition of the time length t;
(5) continuing to perform a cooling sintering simulation experiment on the sintered body until the sintering temperature is from T after the constant-temperature sintering simulation in the step (4)SinteringCooling to room temperature TAt room temperatureAnd finishing the sintering simulation experiment;
(6) after the simulation experiment is finished, obtaining a theoretical model of the sintered body;
(7) according to the theoretical model of the sintered body in the step (6), according to the expressionCalculating to obtain the density of the sintered body, wherein V refers to the total volume of the sintered body model after the sintering simulation experiment is finished, and V isiRefers to the volume obtained by arranging all atoms of the ith crystal structure in a sintered body, and n represents atoms with n crystal structures.
2. The method of claim 1 wherein said copper powder primary crystal structure in step (1) is face centered cubic in shape of spheres, cubes or polyhedrons and the copper powder particles have a size range of 100 nanometers or less.
3. The method as claimed in claim 1, wherein the melting point of the nano copper powder in the step (2) is calculated by a solid-liquid two-phase method, an energy-temperature method or a volume-temperature method.
4. The method of claim 1, wherein the molecular dynamics calculations in steps (2), (4), (5) are performed under constant pressure.
5. The method of claim 1, wherein the number of copper powder particles contained in the sintering simulation subject model in step (3) is greater than 2.
6. The method of claim 1, wherein the mass dug out inside the mold in step (3) is cubic and must be completely filled with the periodic regular arrangement of copper powder particles.
7. The method of claim 1, wherein the sintering temperature T in step (4)SinteringThe theoretical melting point T of the nano copper powder with the same granularity calculated in the step (2) is lower thanMelting Point。
8. The method as claimed in claim 1, characterized in that all atoms of the i-th crystal structure are extracted according to the calculation result, arranged into a regular shape, and then calculated to obtain a corresponding volume Vi; the regular shape is a cube or cuboid.
9. The method of claim 1, wherein the n-crystal structure comprises a face centered cubic, body centered cubic, hexagonal close packed, disordered structure.
10. The method according to claim 1, wherein the volume V in step (7) is obtained by a computational simulation program, and the volume V is obtained by a computational simulation programiBy the formula Vi=Vi0×(Ni÷Ni0) To obtain wherein Vi0Unit cell volume, N, of the metallic copper ith crystal structureiTo calculate the number of copper atoms in the ith crystal structure in the system, Ni0The number of copper atoms in the i-th crystal structure unit cell.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911237887.5A CN112926171B (en) | 2019-12-05 | 2019-12-05 | Implementation method for nano copper powder sintered compact density theoretical deduction |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201911237887.5A CN112926171B (en) | 2019-12-05 | 2019-12-05 | Implementation method for nano copper powder sintered compact density theoretical deduction |
Publications (2)
Publication Number | Publication Date |
---|---|
CN112926171A true CN112926171A (en) | 2021-06-08 |
CN112926171B CN112926171B (en) | 2024-05-31 |
Family
ID=76161377
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201911237887.5A Active CN112926171B (en) | 2019-12-05 | 2019-12-05 | Implementation method for nano copper powder sintered compact density theoretical deduction |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN112926171B (en) |
Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160097140A1 (en) * | 2014-10-02 | 2016-04-07 | Cornell University | Enhanced conductivity metal-chalcogenide films via post elecrophoretic deposition (epd) treatment |
CN106148756A (en) * | 2016-08-17 | 2016-11-23 | 中国科学院长春应用化学研究所 | The preparation method of one Albatra metal |
CN106886615A (en) * | 2015-12-10 | 2017-06-23 | 南京理工大学 | A kind of analogy method of RDX Quito component containing energy compound |
US10116000B1 (en) * | 2015-10-20 | 2018-10-30 | New Jersey Institute Of Technology | Fabrication of flexible conductive items and batteries using modified inks |
CN109332691A (en) * | 2018-10-31 | 2019-02-15 | 有研工程技术研究院有限公司 | A kind of laser sintered parameter determination method of copper nanoparticle 3D printing |
CN109926577A (en) * | 2019-05-05 | 2019-06-25 | 深圳第三代半导体研究院 | It is a kind of can low temperature and high-density sintered copper cream |
CN110014153A (en) * | 2019-04-24 | 2019-07-16 | 同济大学 | A method for preparing periodic aluminum alloy lattice structures by 3D printing |
-
2019
- 2019-12-05 CN CN201911237887.5A patent/CN112926171B/en active Active
Patent Citations (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US20160097140A1 (en) * | 2014-10-02 | 2016-04-07 | Cornell University | Enhanced conductivity metal-chalcogenide films via post elecrophoretic deposition (epd) treatment |
US10116000B1 (en) * | 2015-10-20 | 2018-10-30 | New Jersey Institute Of Technology | Fabrication of flexible conductive items and batteries using modified inks |
CN106886615A (en) * | 2015-12-10 | 2017-06-23 | 南京理工大学 | A kind of analogy method of RDX Quito component containing energy compound |
CN106148756A (en) * | 2016-08-17 | 2016-11-23 | 中国科学院长春应用化学研究所 | The preparation method of one Albatra metal |
CN109332691A (en) * | 2018-10-31 | 2019-02-15 | 有研工程技术研究院有限公司 | A kind of laser sintered parameter determination method of copper nanoparticle 3D printing |
CN110014153A (en) * | 2019-04-24 | 2019-07-16 | 同济大学 | A method for preparing periodic aluminum alloy lattice structures by 3D printing |
CN109926577A (en) * | 2019-05-05 | 2019-06-25 | 深圳第三代半导体研究院 | It is a kind of can low temperature and high-density sintered copper cream |
Non-Patent Citations (4)
Title |
---|
施静敏: "3D打印用纳米铜粉的调控制备与激光烧结模拟", 《中国优秀硕士学位论文全文数据库》, 31 August 2019 (2019-08-31), pages 020 - 287 * |
曾昭锋;: "多元陶瓷增强Cu基复合材料的导热性能研究", 粉末冶金工业, no. 01, 10 February 2017 (2017-02-10), pages 42 - 47 * |
王东里;凤仪;李庶;李京徽;陈淑娴;解育娟;: "Al_2O_3弥散强化铜基复合材料的制备及性能研究", 金属功能材料, vol. 16, no. 02, 15 April 2009 (2009-04-15), pages 1 - 5 * |
郭颖利;易健宏;罗述东;彭元东;李丽娅;: "W-Cu触头材料的微波烧结", 中南大学学报(自然科学版), no. 03, 26 June 2009 (2009-06-26), pages 670 - 675 * |
Also Published As
Publication number | Publication date |
---|---|
CN112926171B (en) | 2024-05-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
Zhang et al. | Sintering phenomena and mechanical strength of nickel based materials in direct metal laser sintering process—a molecular dynamics study | |
Li et al. | Mechanical behaviors and failure modes of additive manufactured Ti6Al4V lattice structures under compressive load | |
CN109332691B (en) | Method for determining nano copper powder 3D printing laser sintering parameters | |
Zou et al. | Investigation of densification behavior of tungsten powders during hot isostatic pressing with a 3D multi-particle FEM approach | |
Yan et al. | Research on influencing factors and its optimization of metal powder injection molding without mold via an innovative 3D printing method | |
Isaenkova et al. | Deformation behavior modelling of lattice structures manufactured by a selective laser melting of 316L steel powder | |
CN102398043A (en) | Method for preparing metal nanomaterial with simulated cell structure | |
Jia et al. | Compaction and solid-state sintering of tungsten powders: MPFEM simulation and experimental verification | |
Li et al. | Multi-particle FEM modeling on hot isostatic pressing of Ti6Al4V powders | |
Gafner et al. | Molecular-dynamics simulation of the heat capacity for nickel and copper clusters: Shape and size effects | |
Li et al. | 3D particulate-scale numerical investigation on hot isostatic pressing of W-Cu composites | |
Caputo et al. | Electron microscopy investigation of binder saturation and microstructural defects in functional parts made by additive manufacturing | |
Senturk Dalgic | Size dependent properties of hollow gold nanoparticles: a theoretical investigation | |
Zou et al. | Three-dimensional MPFEM modelling on isostatic pressing and solid phase sintering of tungsten powders | |
CN112926171A (en) | Method for realizing compactness theory deduction of nano copper powder sintered body | |
Cui et al. | Laser shock dynamic compaction of aluminum–copper (Al–Cu) composite metal powder | |
Zhang et al. | Study on the melting and sintering behavior of Cu-Fe mixed nanoparticles based on molecular dynamics simulations | |
Xie et al. | Mechanical responses of triply periodic minimal surface gyroid lattice structures fabricated by binder jetting additive manufacturing | |
Gou et al. | CFD-DEM simulations of densification of tetrahedron particles under air impact | |
Shuai et al. | Phase field crystal simulation of the structure evolution between the hexagonal and square phases at elevated pressures | |
US20230045680A1 (en) | Isostatic pressure spark plasma sintering (ip-sps) net shaping of components using nanostructured materials | |
CN119479932A (en) | A multi-particle finite element simulation method for the densification process of NdFeB powder | |
Wang et al. | A multi-scale study of Inconel 625 powders HIP process and construction of HIP maps | |
Zhu et al. | Wrinkles-assisted nanocrystalline formation and mechanical properties of wrinkled graphene/aluminum matrix composites | |
Wu et al. | Molecular dynamics simulation of sintering of Cu and Au nanoparticles |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
PB01 | Publication | ||
PB01 | Publication | ||
SE01 | Entry into force of request for substantive examination | ||
SE01 | Entry into force of request for substantive examination | ||
CB02 | Change of applicant information |
Address after: 100088 No.2 xinwai street, Xicheng District, Beijing Applicant after: China Youyan Technology Group Co.,Ltd. Applicant after: YOUYAN ENGINEERING TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. Address before: 100088 No.2 xinwai street, Xicheng District, Beijing Applicant before: Youyan Technology Group Co.,Ltd. Applicant before: YOUYAN ENGINEERING TECHNOLOGY RESEARCH INSTITUTE Co.,Ltd. |
|
CB02 | Change of applicant information | ||
GR01 | Patent grant | ||
GR01 | Patent grant |