CN112911817B - Manufacturing method of flexible copper clad laminate - Google Patents
Manufacturing method of flexible copper clad laminate Download PDFInfo
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- CN112911817B CN112911817B CN202110078573.6A CN202110078573A CN112911817B CN 112911817 B CN112911817 B CN 112911817B CN 202110078573 A CN202110078573 A CN 202110078573A CN 112911817 B CN112911817 B CN 112911817B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
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Abstract
本发明提供一种挠性覆铜板的制作方法，该制作方法包括在基板相背的两个表面分别形成第一铜层和第二铜层；在第一铜层背向基板的表面形成第一粗糙化膜层，和/或在第二铜层背向基板的表面形成第二粗糙化膜层；卷绕挠性覆铜板。其中，第一粗糙化膜层的表面粗糙度大于第一铜层的表面粗糙度，第二粗糙化膜层的表面粗糙度大于第二铜层的表面粗糙度，且第一粗糙化膜层和第二粗糙化膜层的表面粗糙度均大于第一铜层与第二铜层黏连的粗糙度阈值。通过在铜层上镀糙化膜层，且对粗糙化膜层的粗糙度进行控制，在卷对卷生产过程中，可以避免出现第一铜层与第二铜层表面贴合时发生黏连的现象，保护挠性覆铜板的铜箔表面不受损害。
The invention provides a manufacturing method of a flexible copper clad laminate. The manufacturing method includes forming a first copper layer and a second copper layer respectively on two opposite surfaces of a substrate; forming a first copper layer on the surface of the first copper layer facing away from the substrate. Roughening the film layer, and/or forming a second roughening film layer on the surface of the second copper layer facing away from the substrate; winding the flexible copper clad laminate. Wherein, the surface roughness of the first roughened film layer is greater than that of the first copper layer, the surface roughness of the second roughened film layer is greater than that of the second copper layer, and the first roughened film layer and The surface roughness of the second roughened film layer is all greater than the roughness threshold value of the adhesion between the first copper layer and the second copper layer. By plating a roughened film layer on the copper layer and controlling the roughness of the roughened film layer, in the roll-to-roll production process, it is possible to avoid the occurrence of adhesion when the first copper layer and the second copper layer are attached phenomenon, to protect the copper foil surface of the flexible copper clad laminate from damage.
Description
Technical Field
The invention relates to the technical field of flexible copper clad laminates, in particular to a manufacturing method of a flexible copper clad laminate.
Background
FCCL (Flexible Printed Circuit board) has the characteristics of thinness, lightness and flexibility, and is widely used in electronic products such as mobile phones, digital cameras, digital video cameras, automobile satellite direction positioning devices, liquid crystal televisions, notebook computers, and the like, using FCCL as a substrate material. Particularly, the demand and growth trend of the high-performance flexible copper clad laminate taking the PI (Polyimide) film as the base material are more prominent.
The RTR (Roll-to-Roll) technology adopts the flexible copper clad laminate to carry out FPC manufacture in a Roll-to-Roll continuous mode, is beneficial to realizing the automatic continuous production of the FPC and the continuous surface mounting of components on the FPC, not only can improve the productivity, but also has higher product qualification rate, quality and reliability. However, in the process of producing the double-sided flexible copper clad laminate by adopting the RTR technology, when the copper foil surfaces of the flexible copper clad laminate are smooth, the two smooth copper foil surfaces are easily adhered in the winding process, so that the flexible copper clad laminate is difficult to unfold, even the copper foil surfaces of the flexible copper clad laminate are damaged, and the performance of the flexible copper clad laminate is reduced.
Disclosure of Invention
The invention aims to provide a method for manufacturing a flexible copper clad laminate, which can prevent the surface of copper foil of the flexible copper clad laminate from being adhered.
In order to realize the purpose of the invention, the invention provides the following technical scheme:
the invention provides a method for manufacturing a flexible copper clad laminate, which comprises the following steps: respectively forming a first copper layer and a second copper layer on two opposite surfaces of the substrate; forming a first roughened film layer on the surface of the first copper layer facing away from the substrate and/or forming a second roughened film layer on the surface of the second copper layer facing away from the substrate; and winding the flexible copper clad laminate so that the first roughened film layer and/or the second roughened film layer is/are arranged between the first copper layer and the second copper layer. The surface roughness of the first roughened film layer is greater than that of the first copper layer, the surface roughness of the second roughened film layer is greater than that of the second copper layer, and the surface roughness of the first roughened film layer and the surface roughness of the second roughened film layer are both greater than the roughness threshold of the adhesion of the first copper layer and the second copper layer.
In one embodiment, the method for manufacturing the flexible copper clad laminate further comprises: a first bonding layer is arranged between the substrate and the first copper layer, and a second bonding layer is arranged between the substrate and the second copper layer.
In one embodiment, the first copper layer is formed on the first adhesive layer and the second copper layer is formed on the second adhesive layer by a sputtering process.
In one embodiment, an oxidation process is used to form the first roughened film layer on the surface of the first copper layer facing away from the substrate and/or to form the second roughened film layer on the surface of the second copper layer facing away from the substrate.
In one embodiment, oxygen is introduced to form the first roughened film layer and the second roughened film layer when the first copper layer and/or the second copper layer is formed by sputter coating, or oxygen is introduced to form the first roughened film layer and the second roughened film layer by heating after the first copper layer and/or the second copper layer is formed by sputter coating.
In one embodiment, the thickness of the first roughened film layer is 5nm to 100nm in a direction perpendicular to the substrate plate surface.
In one embodiment, the method for manufacturing the flexible copper clad laminate further comprises:
the flexible copper-clad plate is unfolded from a winding state, and the first roughened film layer is removed;
and forming a third copper layer on the surface of the first copper layer, which is opposite to the substrate, and forming a fourth copper layer on the surface of the second copper layer, which is opposite to the substrate.
In one embodiment, the first roughened film layer is removed using an acid wash process.
In one embodiment, the third copper layer and the fourth copper layer are formed using an electroplating process, wherein an acid solution in the electroplating process etches the first roughened film layer to remove the first roughened film layer.
In one embodiment, the thickness of the third copper layer and/or the fourth copper layer is 6um to 10um in a direction perpendicular to the substrate board surface.
By plating the first roughened film layer on the first copper layer and controlling the roughness of the first roughened film layer, the phenomenon of adhesion when the surfaces of the first copper layer and the second copper layer are attached can be avoided in the roll-to-roll production process, and the surface of the copper foil of the flexible copper clad laminate is protected from being damaged.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
FIG. 1 is a flow chart of a method for manufacturing a flexible copper clad laminate of an embodiment;
FIG. 2 is a schematic structural diagram of a flexible copper clad laminate of an embodiment;
FIG. 3 is a schematic view of a winding process of the flexible copper clad laminate of an embodiment;
fig. 4 is a schematic structural diagram of the flexible copper clad laminate of an embodiment.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention, and it is apparent that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without any inventive step based on the embodiments of the present invention, are within the scope of the present invention.
The invention provides a method for manufacturing a flexible copper clad laminate, which refers to fig. 1 to 3, and in one embodiment, the method comprises the following steps:
s1: a first copper layer 21 and a second copper layer 22 are formed on opposite surfaces of the substrate 10, respectively.
S2: a first roughened film layer 31 is formed on the surface of the first copper layer 21 facing away from the substrate 10.
S3: and winding the flexible copper clad laminate to enable the first roughened film layer 31 to be in contact with the second copper layer 22. The surface roughness of the first roughened film layer 31 is greater than the surface roughness of the first copper layer 21, and is greater than the roughness threshold of the adhesion between the first copper layer 21 and the second copper layer 22.
Further, the manufacturing method further includes S0: a substrate 10 is selected. The performance of the substrate 10 plays an important role in the flexibility, reliability and the like of the flexible copper clad laminate, the substrate 10 in the embodiment is a film made of polyimide, the polyimide film is formed by performing polycondensation and casting on pyromellitic dianhydride (PMDA) and diaminodiphenyl ether (DDE) in a strong polar solvent to form a film and then performing imidization, and the substrate has excellent high and low temperature resistance, electrical insulation, adhesion, radiation resistance and medium resistance.
Preferably, in the embodiment of the present application, the elastic modulus of the substrate 10 is 8000Mpa to 20000 Mpa. Because the flexible copper clad laminate can receive the effect of force in the process of buckling, the elastic modulus of base plate 10 determines the mechanical property of the flexible copper clad laminate, and its elastic modulus is too big, then leads to the flexible copper clad laminate not to be easily buckled even fracture, and the elastic modulus undersize then shock resistance is not enough. When the elastic modulus of the substrate 10 is 8000 Mpa-20000 Mpa, it has better bending performance and hardness. And the coefficient of thermal expansion of the material is selected to be 2 ppm/DEG C-20 ppm/DEG C, so that the reliability is higher.
Preferably, the thickness of the substrate 10 is 5 um-50 um along the direction perpendicular to the surface of the substrate 10, so that the substrate can be suitable for roll-to-roll equipment and the flexibility of the flexible copper clad laminate is increased. The substrate 10 is a main material of a flexible copper clad laminate, and needs to have sufficient tensile strength and sufficient flexibility. When the thickness of the substrate 10 is less than 5um, the substrate 10 is too thin, and cracks are easy to appear in the winding process, and when the thickness of the substrate 10 is more than 50um, the flexibility of the copper-clad plate is insufficient due to the fact that the base material is too thick.
Preferably, a first copper layer 21 and a second copper layer 22 are respectively formed on two opposite surfaces of the substrate 10 by a sputtering coating process. Sputtering is the main method for depositing thin films on a substrate, and refers to a technique for bombarding the surface of a plating material with energetic particles in a vacuum chamber, so that the bombarded particles are deposited on the substrate. The first copper layer 21 and the second copper layer 22 formed by the sputtering coating process have the advantages of good adhesiveness, high film density and controllable thickness.
Because the surfaces of the first copper layer 21 and the second copper layer 22 are smooth, in the roll-to-roll production process, when the flexible copper clad laminate is wound, the surfaces of the first copper layer 21 and the second copper layer 22 are attached, and when the difference value of the surface roughness of the first copper layer 21 and the surface roughness of the second copper layer 22 is within a certain range, the two smooth surfaces are easy to be adhered. The difference of the roughness is within a roughness threshold when the first copper layer 21 and the second copper layer 22 are adhered, and the adhesion between the first copper layer 21 and the second copper layer 22 can be avoided when the roughness exceeds the roughness threshold. By forming the first roughened film layer 31 on the surface of the first copper layer 21 facing away from the substrate 10 so that the first roughened film layer 31 is in contact with the second copper layer 22, it is possible to function to space the first copper layer 21 and the second copper layer 22 apart. By controlling the surface roughness of the first roughened film layer 31 to be greater than the surface roughness of the first copper layer 21 and greater than the threshold value of the roughness of the adhesion between the first copper layer 21 and the second copper layer 22, the adhesion between the first roughened film layer 31 and the second copper layer 22 can be prevented, and the purpose of preventing the adhesion between the first copper layer 21 and the second copper layer 22 is finally achieved.
Through plating first roughened rete 31 on first copper layer 21, and control the roughness of first roughened rete 31, in roll-to-roll production process, can avoid appearing the phenomenon that takes place the adhesion when first copper layer 21 and the laminating of second copper layer 22 surface, the protection flexible copper-clad plate's copper foil surface is not harmd.
In another embodiment, referring to fig. 2, S2 is to form the second roughened film layer 32 on the surface of the second copper layer 22 opposite to the substrate 10. The surface roughness of the second roughened film layer 32 is greater than the surface roughness of the second copper layer 22, and the surface roughness of the second roughened film layer 32 is greater than the roughness threshold of the adhesion between the first copper layer 21 and the second copper layer 22. Similarly, it will be appreciated that the same effect can be achieved by forming the second roughened film layer 32 on the surface of the second copper layer 22 facing away from the substrate 10.
In another embodiment, referring to fig. 1 and fig. 2, S2 is to form the first roughened film 31 on the surface of the first copper layer 21 opposite to the substrate 10 and form the second roughened film 32 on the surface of the second copper layer 22 opposite to the substrate 10. The surface roughness of the first roughened film layer 31 is greater than the surface roughness of the first copper layer 21, the surface roughness of the second roughened film layer 32 is greater than the surface roughness of the second copper layer 22, and both the surface roughness of the first roughened film layer 31 and the surface roughness of the second roughened film layer 32 are greater than the roughness threshold of the adhesion of the first copper layer 21 and the second copper layer 22. When the flexible copper clad laminate is wound, the first roughening film layer 31 contacts with the second roughening film layer 32 to separate the first copper layer 21 from the second copper layer 22, so that adhesion between the surfaces of the first copper layer 21 and the second copper layer 22 is avoided. Similarly, the second roughened film layer 32 is formed by deposition on the surface of the second copper layer 22 opposite to the substrate 10 by means of sputtering, using the same manufacturing process as the first roughened film layer 31. When coiling the two-sided flexible copper-clad plate, the second roughness rete 32 that covers on the surface of second copper layer 22 laminates with the first roughness rete 31 that covers on the surface of first copper layer 21, thereby replaced the mode of the laminating of first copper layer 21 and second copper layer 22, control through the roughness of the surface to second roughness rete 32, reach the emergence of avoiding first copper layer 21 and second copper layer 22 to glue the phenomenon, and two roughness retes compare in single roughness rete, no matter what side of making the flexible copper-clad plate laminating spool coiling, the homoenergetic realizes preventing the effect that the copper foil surface from gluing even.
In one embodiment, referring to fig. 1 and fig. 2, the method for manufacturing a flexible copper clad laminate further includes: a first adhesive layer 41 is provided between the substrate 10 and the first copper layer 21 and a second adhesive layer 42 is provided between the substrate 10 and the second copper layer 22. Specifically, in the embodiment of the present application, a first adhesion layer 41 and a second adhesion layer 42 are plated using nickel-chromium alloy (NiCr) as a raw material, and are formed on the surface of the substrate 10 facing the first copper layer 21 by a sputtering plating method. In addition, different target ratios have a significant effect on the performance of the coating, where the target is the material bombarded by the high-velocity energetic particles. In the embodiment of the application, the target ratio of the nickel-chromium alloy is 50: 50-90: 10, wherein the target ratio represents the ratio of the Cr element to the Ni element in the nickel-chromium alloy. When the target ratio is less than 50: at 50 hours, the peeling force of the first copper layer 21 and the substrate 10 is small, and the separation phenomenon occurs when the chip is welded at high temperature; when the target ratio is more than 90: 10, the chromium content is high, and after heat treatment, chromium ions are embedded into the substrate 10 too deeply, so that incomplete etching is caused, and poor functions are easy to occur during reliability test.
Preferably, the thickness of the first adhesive layer 41 and the second adhesive layer 42 obtained by sputtering plating in the direction perpendicular to the plate surface of the substrate 10 is 10nm to 40 nm. The thicknesses of the first bonding layer 41 and the second bonding layer 42 play an important role in the bonding strength between the first copper layer 21 and the substrate 10 and between the second copper layer 22 and the substrate 10, when the thicknesses of the first bonding layer 41 and the second bonding layer 42 in the direction perpendicular to the surface of the substrate 10 are less than 10nm, the peeling force is too small, the adhesion between the first copper layer 21 and the substrate 10 and between the second copper layer 22 and the substrate 10 are not enough, and the separation phenomenon is easy to occur when a chip is welded at high temperature, so that the flexible circuit board is damaged; when the thickness of the first adhesive layer 41 and the second adhesive layer 42 in the direction perpendicular to the plate surface of the substrate 10 is greater than 40nm, the thickness is too thick, so that incomplete etching is likely to occur, and malfunction is likely to occur during reliability testing. The first bonding layer 41 is arranged between the first copper layer 21 and the substrate 10, the second bonding layer 22 is arranged between the second copper layer 22 and the substrate 10, and the target proportion, the thickness and the like of the bonding layers are reasonably configured, so that the first copper layer 21 and the substrate 10 and the second copper layer 22 and the substrate 10 can be effectively bonded, and meanwhile, the performance of the flexible copper clad laminate is effectively improved.
In an embodiment, referring to fig. 1 and fig. 2, the method for manufacturing a flexible copper clad laminate further includes S5: a first copper layer 21 is formed on the first adhesive layer 41 using a sputtering coating process. Preferably, the sputter coating process is stopped when the thickness of the first copper layer 21 in the direction perpendicular to the plate surface of the substrate 10 is 100nm to 500 nm. When the thickness of the first copper layer 21 is less than 100nm, poor copper biting is easy to occur when thick copper grows in the subsequent electroplating process, so that the copper cannot grow on the material; when the thickness of the first copper layer 21 and the second copper layer 22 in the direction perpendicular to the surface of the substrate 10 is greater than 500nm, the coating cost is increased, and the heat generated during coating is high and is prone to wrinkling, resulting in low material utilization. Similarly, the second copper layer 22 is also deposited on the second adhesion layer 42 by a sputtering process, and the thickness of the second copper layer 22 in the direction perpendicular to the surface of the substrate 10 is 100 nm-500 nm.
In one embodiment, referring to fig. 1 and fig. 2, step S2 includes: a first roughened film layer 31 is formed on the surface of the first copper layer 21 by an oxidation process. Preferably, the first roughened film layer 31 is formed by introducing oxygen gas during the formation of the first copper layer 21 by sputtering coating, the energetic particles are in an active state during the sputtering coating and are easily combined with the oxygen gas to form copper oxide, and the CuOx layer can have an anti-adhesion effect because the surface of CuOx is rougher than Cu, so in this embodiment, the first roughened film layer 31 is a CuOx layer. Alternatively, after the first copper layer 21 is formed by sputtering, heating and introducing oxygen may be performed, and the heating may promote oxidation of copper on the surface of the first copper layer 21 to form a CuOx layer, i.e., the first roughened film layer 31. The CuOx layer is directly generated on the surface of the first copper layer 21 through an oxidation process to serve as the first roughened film layer 31, the manufacturing process is simple, other materials do not need to be introduced, and the reduction of film impurities is facilitated. Wherein x represents the oxygen content in the copper oxide, and the oxygen content is not limited because it can be adjusted according to the degree of roughening required. It is understood that the second roughened film layer 32 is fabricated by a method similar to the first roughened film layer 31, i.e. oxygen is introduced into the second roughened film layer 32 during the formation of the second copper layer 22 by sputter coating, or oxygen is introduced into the second copper layer 22 by heating after the formation of the second copper layer 22 by sputter coating.
In one embodiment, referring to fig. 1 and fig. 2, the method for manufacturing a flexible copper clad laminate further includes:
s4: the flexible copper clad laminate is unfolded from the winding state, and the first roughening film layer 31 is removed;
s5: a third copper layer 51 is formed on the surface of the first copper layer 21 facing away from the substrate 10, and a fourth copper layer 52 is formed on the surface of the second copper layer 22 facing away from the substrate 10.
Specifically, before the copper electroplating, the flexible copper clad laminate is in a rolling state, and when the flexible copper clad laminate is unfolded to grow the third copper layer 51 and the fourth copper layer 52, the first roughening film layer 31 may affect the formation of the third copper layer 51 and the fourth copper layer 52, so that the first roughening film layer 31 needs to be removed first to expose the first copper layer 21, and further, the third copper layer 51 is formed on the first copper layer 21. In this embodiment, since CuOx is dissolved by the acid solution during the acid cleaning process, the acid cleaning process is used to remove the first roughened film layer 31, and the acid solution may be hydrochloric acid, sulfuric acid, or the like. Then, the surface residue of the first copper layer 30 is removed by water washing, and finally, a copper foil is deposited to a desired thickness on the outer surface of the first copper layer 21 by an electrochemical method.
In one embodiment, referring to fig. 2, the thickness of the first roughened film 31 is 5nm to 100nm along a direction perpendicular to the surface of the substrate 10. Specifically, in the sputtering of the first roughened film layer 31, the sputtering process is stopped when the thickness of the first roughened film layer 31 in the direction perpendicular to the plate surface of the substrate 10 is 5nm to 100 nm. When the thickness of the first roughened film 31 along the direction perpendicular to the substrate 10 is greater than 100nm, the etching process cannot be performed due to the low acid concentration during the acid cleaning process, CuOx remains on the surface of the first copper layer 21, which affects the continuous copper growth on the surface of the first copper layer 21, and finally results in poor function. When the thickness of the first roughened film layer 31 is less than 5nm, the anti-blocking effect is not significant. Therefore, when the thickness of the roughened film layer 31 along the direction perpendicular to the surface of the substrate 10 is 5 nm-100 nm, the roughened film layer has a good anti-adhesion effect, and can be etched cleanly by acid in the electroplating process, so that the influence on the performance of the flexible copper clad laminate is avoided.
It is understood that the thickness ranges of the second roughened film layer 32 and the first roughened film layer 31 are the same, and the method of removing the second roughened film layer 32 is the same as the method of removing the first roughened film layer 31.
In one embodiment, referring to fig. 1 and 2, the third copper layer 51 and the fourth copper layer 52 are formed by an electroplating process, wherein an acid solution in the electroplating process etches the first roughened film 31 to remove the first roughened film 31. Specifically, the electroplating process further comprises water washing, wherein after the first roughened film layer 31 is removed by corroding the first roughened film layer 31 through an acid solution in the acid washing process, the flexible copper-clad plate is placed in a water washing tank, and an acid solution on the surface of the first copper layer 21 and compounds generated by other chemical reactions are removed, so that the surface of the first copper layer 21 is absolutely pure, and the subsequent growth of the third copper layer 51 is facilitated. Then, the washed flexible copper clad laminate is placed in electrolyte, a thick copper layer, namely a third copper layer 51, is deposited on the surface of the first copper layer 21 through an electroplating process, and the thickness of the second copper layer 51 can be controlled by controlling the electrolysis time. As shown in FIG. 4, the flexible copper clad laminate produced by the electroplating process has the advantages that the first roughened film layer 31 and the second roughened film layer 32 do not exist in the final structure of the flexible copper clad laminate obtained by the manufacturing method provided by the invention, so that the anti-adhesion effect is achieved by forming the first roughened film layer 31 and the second roughened film layer 32, and the performance of the flexible copper clad laminate is not influenced.
Preferably, when the sum of the thicknesses of the third copper layer 51 and the first copper layer 21 in the direction perpendicular to the plate surface of the substrate 10 is in the thickness range of 5um to 10um during the electroplating process, the electroplating process is stopped. When the sum of the thicknesses of the third copper layer 51 and the first copper layer 21 in the direction perpendicular to the surface of the substrate 10 is less than 5um, the copper foil is too thin, which easily causes the flexible circuit board to break when circuit patterns are etched, and when the sum of the thicknesses of the third copper layer 51 and the first copper layer 21 in the direction perpendicular to the surface of the substrate 10 is more than 10um, the flexible circuit board is too large in size, and does not meet the requirements of lightness, thinness and miniaturization. Particularly, when the sum of the thicknesses of the third copper layer 51 and the first copper layer 21 in the direction perpendicular to the surface of the substrate 10 is 8.5um, the etching requirement of the circuit pattern can be met, and the advantages of lightness and thinness are achieved.
It can be understood that the fourth copper layer 52 and the third copper layer 51 are similar in manufacturing method and structure, that is, the second roughened film layer 32 is etched by acid cleaning, and then the flexible copper clad laminate is placed in a rinsing bath to remove the acid solution and other chemical reaction-generated compounds on the surface of the second copper layer 22, so that the surface of the second copper layer 22 is absolutely pure, and the fourth copper layer 52 is convenient to grow subsequently. Then, the washed flexible copper clad laminate is placed in an electrolyte, a thick copper layer, namely the fourth copper layer 52, is deposited on the surface of the second copper layer 22 through an electroplating process, and the thickness of the fourth copper layer 52 can be controlled by controlling the length of electrolysis time. Preferably, the sum of the thicknesses of the fourth copper layer 52 and the second copper layer 22 in the direction perpendicular to the plate surface of the substrate 10 is 5um to 10 um.
In one embodiment, referring to fig. 4, the thickness of the third copper layer 51 is 6um to 10um along the direction perpendicular to the surface of the substrate 10. Specifically, when the third copper layer 51 is 6um or less, the thickness of the third copper layer 51 is too thin, uniformity in the manufacturing process is difficult to control, and conductivity is insufficient. When the thickness of the third copper layer 51 is greater than 10um, the thickness of the electroplated copper is increased, so that the contact conductivity can be improved, but the interface stress in the system is increased along with the increase of the thickness of the plating layer, so that the bonding force of the system is reduced. By making the thickness of the third copper layer 51 be 6 um-10 um, the third copper layer 51 can have very good conductivity and can be tightly bonded to the substrate.
In another embodiment, referring to fig. 4, the thickness of the fourth copper layer 52 is 6um to 10 um. It will be appreciated that the same technical effect as the third copper layer 51 can be achieved by making the thickness of the fourth copper layer 52 from 6um to 10 um.
In another embodiment, the thickness of the third copper layer 51 and the fourth copper layer 52 is 6um to 10um in a direction perpendicular to the surface of the substrate 10. It will be appreciated that the same technical effect can be achieved by making the thickness of the third copper layer 51 and the fourth copper layer 52 only 6 um-10 um.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention as defined by the appended claims.
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| CN101148509A (en) * | 2007-09-06 | 2008-03-26 | 湖北省化学研究院 | Preparation of polyimide thermosetting resin and application thereof in two-layer method flexibility coat copper plate |
| CN104247576A (en) * | 2012-04-24 | 2014-12-24 | 住友金属矿山株式会社 | Two-layered flexible wiring substrate, flexible wiring board, and methods for producing same |
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