CN112907655B - Positioning method, system, terminal equipment and computer storage medium for IC programming - Google Patents
Positioning method, system, terminal equipment and computer storage medium for IC programming Download PDFInfo
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- CN112907655B CN112907655B CN202110172804.XA CN202110172804A CN112907655B CN 112907655 B CN112907655 B CN 112907655B CN 202110172804 A CN202110172804 A CN 202110172804A CN 112907655 B CN112907655 B CN 112907655B
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Abstract
The invention discloses a positioning method and a system for IC burning, terminal equipment and a computer readable storage medium, wherein first point cloud data of an IC to be burnt and second point cloud data of a burning seat on a current burning machine are loaded; determining the corresponding position of the IC to be burned on the burning machine according to the first point cloud data and the second point cloud data; detecting the offset between the corresponding position and a preset position of the IC to be burned; and when the deviation is detected to belong to a preset allowable error range, determining the corresponding position as a fixed position of the IC to be burned on the burning machine so as to burn the IC. The method can improve the accuracy of positioning the fixed position of the IC in the IC burning process, effectively avoid the phenomenon that the IC chip obtained by automatic production does not meet the quality standard, and improve the burning efficiency of the IC chip.
Description
Technical Field
The present invention relates to the field of IC burning technologies, and in particular, to a method, a system, a terminal device, and a computer-readable storage medium for positioning IC (Integrated Circuit) burning.
Background
Along with the rapid development of intelligent science and technology, people's life can hardly be separated from electronic control-based terminal equipment. An IC chip is an indispensable component of any terminal device, and during the manufacturing process, an integrated circuit formed by a large number of microelectronic devices (transistors, resistors, capacitors, etc.) needs to be accurately burned at a corresponding position of a substrate.
However, although automatic IC burning can be realized at present, accurate positioning detection for IC burning is difficult to be realized, which often results in that the produced finished product cannot be successfully burned, thereby seriously reducing the burning efficiency of the IC chip.
In summary, the conventional automatic IC recording method is difficult to accurately record and position, resulting in low IC output efficiency.
Disclosure of Invention
The invention mainly aims to provide a positioning method and a positioning system for IC burning, IC burning equipment and a computer readable storage medium, and aims to solve the technical problem that the existing automatic IC burning mode is difficult to accurately burn and position and causes low IC burning efficiency.
In order to achieve the above object, the present invention provides a positioning method for IC burning, comprising:
loading first point cloud data of an IC to be burned and second point cloud data of a burning seat on a current burning machine;
determining the corresponding position of the IC to be burned on the burning machine according to the first point cloud data and the second point cloud data;
detecting the offset between the corresponding position and a preset position of the IC to be burned;
and when the deviation is detected to belong to a preset allowable error range, determining the corresponding position as a fixed position of the IC to be burned on the burning machine so as to burn the IC.
Further, the step of determining the corresponding position of the IC to be burned on the burner according to the first point cloud data and the second point cloud data includes:
splicing the first point cloud data in a preset area in the second point cloud data in sequence to obtain each position to be selected;
and extracting a target candidate position with the highest splicing embedding degree from all the candidate positions as a corresponding position of the IC to be burned on the burning machine.
Further, the step of detecting the offset between the corresponding position and the predetermined position of the IC to be burned includes:
extracting the effect image and detecting a first position parameter of the predetermined position;
comparing a second position parameter of the corresponding position on the IC chip with the first position parameter to determine an offset between the corresponding position and the predetermined position.
Further, the positioning method for IC burning further includes:
sequentially extracting ICs to be burned according to a preset IC burning sequence;
the step of loading the first point cloud data of the IC to be burned and the second point cloud data of the burning seat on the current burning machine comprises the following steps:
reading an identifier of an IC to be burned, and loading first point cloud data of the IC to be burned from a preset point cloud database according to the identifier;
and detecting a burning machine which is currently burning the IC and loading real-time second point cloud data of a burning seat on the burning machine.
Further, the method further comprises:
judging whether the burning of the burning machine is finished or not;
if yes, terminating IC burning;
if not, extracting the next IC to be burned according to the IC burning sequence to continue IC burning.
Further, the step of judging whether the IC chip is burned completely includes:
extracting complete point cloud data of the burner;
and comparing the second point cloud data with the complete point cloud data to determine whether the burning of the burner is finished.
Further, after the step of determining that the corresponding position is a fixed position of the IC to be burned on the burner for IC burning when the deviation is detected to belong to a preset allowable error range, the method further includes:
and scanning the burner fixed with the IC to be burned to obtain real-time second point cloud data of a burner base on the burner fixed with the IC to be burned.
In addition, in order to achieve the above object, the present invention further provides a positioning system for IC burning, comprising:
the loading module is used for loading first point cloud data of the IC to be burned and second point cloud data of a burning seat on the current burning machine;
the determining module is used for determining the corresponding position of the IC to be burned on the burning machine according to the first point cloud data and the second point cloud data;
the offset detection module is used for detecting the offset between the corresponding position and the preset position of the IC to be burned;
and the positioning burning module is used for determining the corresponding position as the fixed position of the IC to be burned on the burning machine for IC burning when the deviation is detected to belong to a preset allowable error range.
When each functional module of the positioning system for IC burning runs, the steps of the positioning method for IC burning are realized.
In addition, to achieve the above object, the present invention also provides a terminal device, including: the positioning program of IC burning is stored on the memory and can be operated on the processor, and when being executed by the processor, the positioning program of IC burning realizes the steps of the positioning method of IC burning.
In addition, to achieve the above object, the present invention further provides a computer readable storage medium, having a computer program stored thereon, where the computer program is executed by a processor to implement the steps of the positioning method for IC burning.
The invention provides a positioning method and a system for IC burning, terminal equipment and a computer readable storage medium, wherein first point cloud data of an IC to be burned and second point cloud data of a burning seat on a current burning machine are loaded; determining the corresponding position of the IC to be burned on the burning machine according to the first point cloud data and the second point cloud data; detecting the offset between the corresponding position and a preset position of the IC to be burned; and when the deviation is detected to belong to a preset allowable error range, determining the corresponding position as a fixed position of the IC to be burned on the burning machine so as to burn the IC.
In the IC burning process, first point cloud data of an IC to be burned currently and to be burned are loaded, second point cloud data of a burning seat on a burning machine which is currently burning the IC are loaded, and then the corresponding position of the IC to be burned which should be burned on the burning machine currently is determined based on the first point cloud data and the second point cloud data; and finally, when the deviation is detected to belong to a preset allowable error range, determining that the corresponding position is a fixed position of the IC to be burned on the burning machine, and starting burning operation on the IC to be burned after the IC to be burned is fixed according to the fixed position.
Compared with the conventional automatic IC burning mode, the method has the advantages that the accuracy of positioning the fixed position during IC burning in the IC burning process is greatly improved by scanning the point cloud data of each IC to be burned and the burning machine which is burning the IC and analyzing and determining the fixed position of the IC to be burned in the burning machine based on the point cloud data, the phenomenon that the IC cannot be successfully burned in the automatic production process can be effectively avoided, and the IC burning efficiency is improved. In addition, the corresponding position obtained based on the point cloud data and the preset position of the IC to be burned on the burning machine are subjected to offset verification, so that the phenomenon that the IC to be burned with the same point cloud data causes wrong fixed positioning can be effectively avoided, and the stability and the accuracy of the IC burning process are further improved.
Drawings
Fig. 1 is a schematic structural diagram of the hardware operation of a terminal device according to an embodiment of the present invention;
FIG. 2 is a flowchart illustrating an embodiment of a positioning method for IC burning according to the present invention;
FIG. 3 is a detailed flowchart of step S100 in an embodiment of a positioning method for IC burning according to the present invention;
FIG. 4 is a flowchart illustrating a positioning method for IC burning according to another embodiment of the present invention;
FIG. 5 is a flowchart illustrating a detailed process of step B in an embodiment of a positioning method for IC programming according to the present invention;
FIG. 6 is a flowchart illustrating a positioning method for IC burning according to another embodiment of the present invention;
FIG. 7 is a block diagram of a positioning system for IC burning according to the present invention.
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
As shown in fig. 1, fig. 1 is a schematic structural diagram of a hardware operating environment related to a terminal device according to an embodiment of the present invention.
It should be noted that fig. 1 is a schematic structural diagram of a hardware operating environment of the terminal device. The terminal equipment of the embodiment of the invention can be terminal equipment such as a PC, a portable computer and the like.
As shown in fig. 1, the terminal device may include: a processor 1001, such as a CPU, a network interface 1004, a user interface 1003, a memory 1005, a communication bus 1002. Wherein a communication bus 1002 is used to enable connective communication between these components. The user interface 1003 may include a Display screen (Display), an input unit such as a Keyboard (Keyboard), and the optional user interface 1003 may also include a standard wired interface, a wireless interface. The network interface 1004 may optionally include a standard wired interface, a wireless interface (e.g., WI-FI interface). The memory 1005 may be a high-speed RAM memory or a non-volatile memory (e.g., a magnetic disk memory). The memory 1005 may alternatively be a storage device separate from the processor 1001.
Those skilled in the art will appreciate that the terminal device configuration shown in fig. 1 is not intended to be limiting of the terminal device and may include more or fewer components than those shown, or some components may be combined, or a different arrangement of components.
As shown in fig. 1, a memory 1005, which is a kind of computer storage medium, may include therein an operating system, a network communication module, a user interface module, and a distributed task processing program. Among them, the operating system is a program that manages and controls the hardware and software resources of the sample terminal device, a handler that supports distributed tasks, and the execution of other software or programs.
In the terminal apparatus shown in fig. 1, the user interface 1003 is mainly used for data communication with each terminal; the network interface 1004 is mainly used for connecting a background server and performing data communication with the background server; and the processor 1001 may be configured to call the positioning program of IC burning stored in the memory 1005, and perform the following operations:
loading first point cloud data of an IC to be burned and second point cloud data of a burning seat on a current burning machine;
determining the corresponding position of the IC to be burned on the burning machine according to the first point cloud data and the second point cloud data;
detecting the offset between the corresponding position and a preset position of the IC to be burned;
and when the deviation is detected to belong to a preset allowable error range, determining the corresponding position as a fixed position of the IC to be burned on the burning machine so as to burn the IC.
Further, the processor 1001 may call the positioning program of IC burning stored in the memory 1005, and further perform the following operations:
splicing the first point cloud data in a preset area in the second point cloud data in sequence to obtain each position to be selected;
and extracting a target candidate position with the highest splicing embedding degree from all the candidate positions as a corresponding position of the IC to be burned on the burning machine.
Further, the predetermined position is a burning seat position of the IC to be burned in the effect image of the burning machine, and the processor 1001 may call a positioning program for burning the IC stored in the memory 1005, and further perform the following operations:
extracting the effect image and detecting a first position parameter of the predetermined position;
comparing a second position parameter of the corresponding position on the IC chip with the first position parameter to determine an offset between the corresponding position and the predetermined position.
Further, the processor 1001 may call the positioning program of IC burning stored in the memory 1005, and further perform the following operations:
sequentially extracting ICs to be burned according to a preset IC burning sequence;
the processor 1001 may call the positioning program of IC burning stored in the memory 1005, and further perform the following operations:
reading an identifier of an IC to be burned, and loading first point cloud data of the IC to be burned from a preset point cloud database according to the identifier;
and detecting a burning machine which is currently burning the IC and loading real-time second point cloud data of a burning seat on the burning machine.
Further, the processor 1001 may call the positioning program of IC burning stored in the memory 1005, and further perform the following operations:
judging whether the burning of the burning machine is finished or not;
if yes, terminating IC burning;
if not, extracting the next IC to be burned according to the IC burning sequence to continue IC burning.
Further, the processor 1001 may call the positioning program of IC burning stored in the memory 1005, and further perform the following operations:
extracting complete point cloud data of the burner;
and comparing the second point cloud data with the complete point cloud data to determine whether the burning of the burner is finished.
Further, the processor 1001 may call a positioning program for IC burning stored in the memory 1005, and after determining that the corresponding position is a fixed position of the IC to be burned on the burner for IC burning when it is detected that the offset belongs to a preset allowable error range, further perform the following operations:
and scanning the burner fixed with the IC to be burned to obtain real-time second point cloud data of a burner base on the burner fixed with the IC to be burned.
Based on the above structure, various embodiments of the positioning method for IC burning of the invention are provided.
Referring to fig. 2, fig. 2 is a flowchart illustrating a positioning method for IC burning according to a first embodiment of the present invention.
While a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed in a different order than shown.
The positioning method for IC burning in the embodiment of the present invention is applied to a terminal device, and the terminal device in the embodiment of the present invention may be a terminal device such as a PC, a portable computer, or the like, and is not limited specifically herein.
The positioning method for IC burning of the embodiment comprises the following steps:
step S100, loading first point cloud data of an IC to be burned and second point cloud data of a burning seat on a current burning machine;
in this embodiment, in the process of automatically executing IC burning, the terminal device loads the first point cloud data of the IC to be burned currently required to be burned from the preset point cloud database, and loads the second point cloud data of the burning seat on the burner that is currently fixed to the IC to be burned for IC burning.
It should be noted that, in this embodiment, the preset point cloud database is any type of database built in or externally connected to the terminal device, and the terminal device may store the point cloud data of each IC to be burned, which is obtained by scanning in advance, in the database in an associated manner based on the identifier of each IC to be burned. It should be understood that the respective first point cloud data of each IC to be burned is obtained by scanning each IC to be burned by a scanning head that forms a spatial point cloud in advance based on a scanned object, and based on different design requirements of practical applications, in different feasible embodiments, different types of scanning heads may be adopted to scan each IC to be burned to obtain the first point cloud data.
In a feasible embodiment, the IC burning positioning method of the present invention may further include:
step A, sequentially extracting ICs to be burned according to a preset IC burning sequence;
it should be noted that, in this embodiment, the preset IC burning sequence is a worker for controlling the terminal device to automatically perform the IC burning operation, and is based on the requirement of the production design in advance, the terminal devices configured according to the respective identifier of each IC to be burned need to burn the IC's in sequence once or in batches, specifically, for example, the worker burns the terminal device to be controlled to burn automatically according to the IC1 to be burned, the IC2 to be burned and the IC3 to be burned to prepare an IC chip, the burning sequence of the three ICs to be burned can be configured as the IC to be burned 1, the IC to be burned 2 and the IC to be burned 3, therefore, the terminal device can extract the to-be-burned IC1 for burning in the process of automatically burning the three to-be-burned ICs, extract the to-be-burned IC2 for burning after the three to-be-burned ICs are completely burned, and extract the to-be-burned IC3 for burning until the burner is fixed and burning is completed.
In this embodiment, the terminal device extracts the IC to be burned arranged before the burning sequence for burning each time according to the IC burning sequence configured in advance until all the IC to be burned are fixed on the corresponding burning seats by the burning machine to complete the IC burning.
Further, referring to fig. 3, in a possible embodiment, the step S100 of loading the first point cloud data of the IC to be burned and the second point cloud data of the current IC chip may include:
step S101, reading an identifier of an IC to be burned, and loading first point cloud data of the IC to be burned from a preset point cloud database according to the identifier;
in this embodiment, each time the terminal device extracts the IC to be burned for burning, the terminal device first reads the unique identifier of the IC to be burned for burning with each other, and then loads the first point cloud data of the IC to be burned currently extracted from the point cloud database, which stores the first point cloud data of all the ICs to be burned in advance, using the identifier as an index.
Specifically, for example, in this embodiment, after completing the burning of the IC1 to be burned, the terminal device needs to perform the burning operation of the IC2 to be burned, so that the terminal device extracts the IC2 to be burned, identifies and reads the unique identifier "002" of the IC2 to be burned, and then directly indexes the first point cloud data of the identifier "002" from the point cloud database in which the respective point cloud data of all the ICs to be burned are stored in advance based on the identifier "002", and loads the first point cloud data.
Step S102, detecting a burning machine which is currently burning the IC and loading real-time second point cloud data of a burning seat on the burning machine.
It should be noted that, in this embodiment, in addition to obtaining the respective first point cloud data of each IC to be burned by the terminal device through scanning by using the scanning head in advance, the terminal device may also scan the burning seat on the burning machine that fixes the IC to be burned for IC burning in real time, so as to obtain the real-time second point cloud data of the burning seat.
In this embodiment, after loading the first point cloud data of the IC to be burned currently to be burned, the terminal device continues to detect the second point cloud data of only one burning seat or the second point cloud data of each of the plurality of burning seats on the burning machine to be fixed for IC burning to form the final finished IC chip, and loads the second point cloud data for subsequent calling.
Specifically, for example, after the terminal device completes the burning of the IC1 to be burned and continues to retrieve and load the first point cloud data of the identifier associated with "002" from the pre-point cloud database based on the identifier "002" of the currently extracted IC2 to be burned, the terminal device further detects and extracts the second point cloud data of each burning seat in real time on the burner that fixes the IC1 to be burned on the burning seat to form the IC chip a.
Step S200, determining the corresponding position of the IC to be burned on the burning machine according to the first point cloud data and the second point cloud data;
in this embodiment, after the terminal device loads the first point cloud data of the IC to be burned and the second point cloud data of the IC chip, which are currently required to be burned, the terminal device respectively splices the first point cloud data with the point cloud of the predetermined area in the second point cloud data to determine a corresponding position where the burner is required to fix the IC to be burned for burning.
Further, in a possible embodiment, the step S200 may include:
step S201, splicing the first point cloud data in a preset area in the second point cloud data in sequence to obtain each position to be selected;
it should be noted that, in this embodiment, the predetermined area is a position area where the IC to be burned configured in advance should be approximately fixed in each burning seat of the burner for burning. Specifically, for example, if the IC1 to be burned is set and fixed on the burning seat 1 for burning on the burner, the middle area of the burning seat in all the burning seats is the predetermined area.
In this embodiment, after loading first point cloud data of an IC to be burned and second point cloud data of a burning seat on a burner, which are currently required to be burned, of a terminal device, a predetermined area of the IC to be burned on the IC chip is determined, and then the first point cloud data is sequentially spliced with the second point cloud data in the predetermined area, so as to obtain a plurality of positions to be selected, on the IC chip, where the IC to be burned can be recorded.
Specifically, for example, in this embodiment, after the terminal device loads the first Point cloud data of the IC2 to be burned from the Point cloud database based on the unique identifier "002" of the IC2 to be burned currently, and detects and loads the second Point cloud data in real time of the burning seat where the IC2 to be burned is currently recorded, the terminal device further confirms that the predetermined area of the IC2 to be burned on the IC chip is the middle area, and then the terminal device splices the first Point cloud data and the Point cloud of the second Point cloud data in the predetermined area respectively through an ICP (Iterative Closest Point algorithm), and records the area positions where splicing can be successfully performed as the plurality of positions to be selected on the burning machine where the IC2 to be burned can be fixed.
Step S202, extracting a target candidate position with the highest splicing embedding degree from all the candidate positions as a corresponding position of the IC to be burned on the burning machine.
In this embodiment, after determining a plurality of positions to be selected, where an IC to be burned can be recorded, on an IC chip, the terminal device further detects first point cloud data of the IC to be burned, and performs splicing and embedding degrees fed back when splicing with point clouds, where real-time second point cloud data of a burning seat belongs to a predetermined area, and then performs size comparison based on the splicing and embedding degrees, and determines a target position to be selected, where the splicing and embedding degree is the largest, from among the plurality of positions to be selected, as a corresponding position where a certain burning seat of the IC to be burned is actually fixed on the burning machine.
It should be noted that, in this embodiment, the stitching and embedding degree is a numerical value calculated by the LCP algorithm in each point cloud stitching process to identify the point cloud stitching degree.
Step S300, detecting the offset between the corresponding position and the preset position of the IC to be burned;
it should be noted that, in this embodiment, the predetermined position is a position where the IC to be burned is fixed in the effect image burned by one burning seat of the burning machine, and the burning seat of the IC to be burned is fixed. It should be understood that, in the process of fixing and burning the IC in the burner, a design worker usually designs and draws an effect image for fixing the IC on the burner in advance, and based on different design requirements of practical applications, the effect images that can be utilized by the terminal device are different among different feasible implementation modes.
In this embodiment, when the terminal device initially determines the corresponding position of the burning seat where the IC to be burned needs to be fixed on the burning seat for burning by using the first point cloud data of the IC to be burned and the real-time second point cloud data of the burning seat on the burning machine, the terminal device further extracts the predetermined position of the IC to be burned, and detects the offset between the predetermined position and the determined corresponding position.
It should be noted that, in this embodiment, since the point cloud data is three-dimensional stereo data, that is, data including an x axis, a y axis, and a z axis, and when comparing the offset between the corresponding position and the predetermined position, only the offset on the two-dimensional plane needs to be considered, so that only the position area formed by enclosing the data of the x axis and the y axis of the point cloud at the corresponding position needs to be extracted, and the offset detection is performed on the position area and the predetermined position.
Further, in a possible embodiment, in the step S300, the detecting the offset between the corresponding position and the predetermined position of the IC to be burned may include:
step S301, extracting the effect image and detecting a first position parameter of the preset position;
in this embodiment, when it is preliminarily determined that the IC to be burned is fixed on a certain burning seat of the burning machine for burning and the corresponding position of the burning seat is located, the terminal device extracts an effect image that the IC is fixed on the burning seat of the burning machine for burning, and analyzes and identifies the effect image to extract a first position parameter of a predetermined position of the IC to be burned on the burning machine.
It should be noted that, in the present embodiment, the location parameter includes, but is not limited to, a center point coordinate of the area.
Specifically, for example, after the terminal device determines, from the multiple positions to be selected, the target position to be selected where the splicing and embedding degree is the largest as the corresponding position of the IC2 to be burned on the burner, the terminal device extracts an effect image of the burner from a preset database, then determines, based on a mature image processing technology, a predetermined position of the IC2 to be burned in the effect image, and extracts the area center point coordinate of the image area to which the predetermined position belongs.
Step S302, comparing the second position parameter of the corresponding position on the IC chip with the first position parameter to determine an offset between the corresponding position and the predetermined position.
In this embodiment, the terminal device extracts the first position parameter and simultaneously preprocesses the real-time image and the effect image of the recording base on the recorder synchronously so that the size parameters of the real-time image and the effect image are the same, then detects the second position parameter of the corresponding position of the IC to be recorded on the recorder in the real-time image, and calculates the offset between the corresponding position of the IC to be recorded and the predetermined position based on the second position parameter and the extracted first position parameter.
Specifically, for example, the terminal device determines a predetermined position of the IC2 to be burned in an effect image of the IC chip, extracts an area center point coordinate of an image area to which the predetermined position belongs as p1(x1, y1), detects a position parameter of a corresponding position of the IC2 to be burned on the recorder as p2(x2, y2) after a projected image of the collected real-time second point cloud data of the IC chip on a two-dimensional plane is taken as a real-time image and a size parameter of the real-time image is adjusted to be the same as the effect image, and finally obtains a corresponding position of the IC2 to be burned in a recording seat fixed by the recorder in the process of recording the IC in real time by using p2-p1, and the offset between the predetermined position of the IC2 to be burned in the effect image of the IC chip is offset x2-x1 to the left (or the right), and offset y2-y1 up or down.
And step S400, when the deviation is detected to belong to a preset allowable error range, determining the corresponding position as a fixed position of the IC to be burned on the burning machine so as to burn the IC.
It should be noted that, in this embodiment, the preset allowable error range is a maximum offset between a position where each of the independent ICs is allowed to be actually burned and a predetermined position, which is designed and configured based on actual application requirements, and the allowable error range at least includes a left-right offset range and a top-bottom offset range. It should be understood that, based on different design requirements of practical applications, the numerical size of the allowable error range of each individual IC may be designed to be different or the same in different feasible embodiments, and the positioning method for IC burning in the present invention is not limited to the specific size of the allowable error range.
In this embodiment, after determining the offset between the corresponding position of the IC to be burned on the burner and the predetermined position, the terminal device detects whether the offset exceeds the left-right offset range and the up-down offset range of the allowable error range, and when none of the offsets exceeds the allowable error range, determines that the offset belongs to the allowable error range, and then directly determines the corresponding position as the fixed position of the IC to be burned on the burner, and fixes the burner on the burner seat where the fixed position is located to perform the burning operation on the IC to be burned.
Specifically, for example, in this embodiment, assuming that the left-right deviation range of the allowable error range is a and the upper-lower deviation range is B, the terminal device determines whether the deviation belongs to the allowable error range by determining whether x2-x1 is greater than or equal to a and y2-y1 is greater than or equal to B in the deviations x2-x1 and y2-y1 between the corresponding position of the IC2 to be burned on the burner in the real-time IC burning process and the predetermined position of the IC2 to be burned in the effect image of the burner. Thus, when the terminal device detects that x2-x1 is smaller than A and y2-y1 is also smaller than B, and thus the deviation is determined to be within the allowable error range, the terminal device immediately determines that the corresponding position of the IC2 to be burned on the burner in the real-time IC burning process is the fixed position of the IC2 to be burned on the burner, controls the corresponding IC burning facility to fix the IC2 to be burned on the burning seat where the fixed position of the burner is located, and then the burner completes the IC burning operation on the IC2 to be burned on the burning seat.
It should be noted that, in this embodiment, the IC burning facility is any device capable of fixing the IC element on the burning seat, and it should be understood that, based on different design requirements of practical applications, different types of IC burning facilities may be adopted to perform specific IC burning operations in different feasible embodiments, and the positioning method for IC burning in the present invention is not limited to the specific types of the IC burning facility.
Further, in another possible embodiment, if the terminal device detects that the offset exceeds the left-right offset range and/or the up-down offset range of the allowable error range, it determines that the offset does not belong to the allowable error range, so as to stop the current IC burning operation and output a prompt message for detection.
In the embodiment, in the process of automatically executing IC burning through the terminal equipment, first point cloud data of an IC to be burned which needs to be burned currently and a second point cloud data of a burning seat on a burning machine which needs to fix the IC to be burned for IC burning currently are loaded from a preset point cloud database; after loading first point cloud data of an IC to be burned and second point cloud data of an IC chip which are required to be burned currently by a terminal device, the terminal device respectively splices the first point cloud data with point clouds in a preset area in the second point cloud data to determine a corresponding position where a burning machine needs to fix the IC to be burned for burning; the method comprises the steps that when the terminal device preliminarily utilizes first point cloud data of an IC to be burned and real-time second point cloud data of a burning seat on a burning machine, and determines that the IC to be burned is required to be fixed on the burning seat for burning, the terminal device further extracts a preset position of the IC to be burned after the burning seat is located at a corresponding position, and detects the deviation between the preset position and the determined corresponding position; after determining the offset between the corresponding position of the IC to be burned on the burning machine and the preset position, the terminal device respectively detects whether the offset exceeds the left-right offset range and the up-down offset range of the allowable error range, and when the offset does not exceed the allowable error range, the terminal device determines the corresponding position as the fixed position of the IC to be burned on the burning machine directly, and fixes the burning machine on the burning seat where the fixed position is located so as to perform burning operation on the IC to be burned.
Compared with the conventional automatic IC burning mode, the method has the advantages that the accuracy of positioning the fixed position during IC burning in the IC burning process is greatly improved by scanning the point cloud data of each IC to be burned and the burning machine which is burning the IC and analyzing and determining the fixed position of the IC to be burned in the burning machine based on the point cloud data, the phenomenon that the IC cannot be successfully burned in the automatic production process can be effectively avoided, and the IC burning efficiency is improved. In addition, the corresponding position obtained based on the point cloud data and the preset position of the IC to be burned on the burning machine are subjected to offset verification, so that the phenomenon that the IC to be burned with the same point cloud data causes wrong fixed positioning can be effectively avoided, and the stability and the accuracy of the IC burning process are further improved.
Further, based on the above first embodiment of the positioning method for IC burning of the present invention, a second embodiment of the positioning method for IC burning of the present invention is provided.
Referring to fig. 6, in the second embodiment of the positioning method for IC programming according to the present invention, in step S400, when it is detected that the offset belongs to the preset allowable error range, after determining the corresponding position as the programming position of the IC to be programmed on the IC chip for IC programming, the positioning method for IC programming according to the present invention may further include:
step S500, scanning is carried out aiming at the burning machine for fixing the IC to be burnt to obtain real-time second point cloud data of a burning seat on the burning machine for fixing the IC to be burnt.
In this embodiment, after the terminal device determines that the corresponding position of the IC to be burned on the burner is a fixed position and fixes the IC to be burned on the burner seat where the fixed position is located on the burner for burning, the terminal device controls to scan the burner after the IC to be burned is fixed, so as to generate the real-time second point cloud data of the burner seat on the burner after the IC to be burned is fixed.
Specifically, for example, the terminal device fixes the IC2 to be burned at a position corresponding to a certain burning seat on the burner, determines the position of the IC2 to be burned at the fixed position on the burner, controls the corresponding IC burning facility to fix the IC2 to be burned at the burning seat where the fixed position is located on the burner, and then, after the burner performs IC burning operation on the IC2 to be burned on the burning seat, the terminal device immediately controls the scanning head that scans the spatial object to generate corresponding spatial point cloud data to scan the burner that has currently fixed the IC2 to be burned, so as to generate the real-time second point cloud data of the burner on the burner, so that the terminal device can perform positioning and fixing in the burning process on the next IC to be burned.
Further, referring to fig. 4, in a possible embodiment, the positioning method for IC burning of the present invention may further include:
and B, judging whether the burning of the burner is finished.
In this embodiment, after the terminal device scans the burner to which the IC to be burned is fixed to obtain the real-time second point cloud data of the burner holder on the burner, the terminal device immediately detects the second point cloud data to determine whether the operation of fixedly burning all the ICs to be burned by the burner after the current burning operation is completed.
Further, referring to fig. 5, in a possible embodiment, the step B may include:
step B1, extracting complete point cloud data of the burner;
step B2, comparing the second point cloud data with the complete point cloud data to determine whether the burning of the burner is completed.
It should be noted that, in this embodiment, the complete point cloud data is spatial point cloud data generated by scanning a burning machine after all the independent ICs to be burned are fixed on a burning seat of the burning machine for burning. It should be understood that in the burning method of controlling the fixing of the independent ICs in sequence for burning production or controlling the batch burning of the same ICs for fixing and burning, it is usually required that a worker pre-provides an effect image of the burning machine for fixing burning of the ICs, so that the complete point cloud data can be obtained by pre-scanning the effect image.
In this embodiment, after scanning the burner to which the IC to be burned has been fixed, the terminal device immediately extracts the complete point cloud data of the burner after generating the real-time second point cloud data of the burner, and compares and detects the similarity between the second point cloud data and the complete point cloud data, so that when detecting that the similarity belongs to the allowable error range, it is determined that the operation of fixedly burning all the ICs to be burned by the burner has been completed, otherwise, when detecting that the similarity does not belong to the allowable error range, it is determined that the operation of fixedly burning all the ICs to be burned has not been completed.
Step C, if yes, IC burning is stopped;
in this embodiment, when the terminal device determines that the operation of fixedly burning all the ICs to be burned by the burner has been completed by detecting the real-time second point cloud data of the burning seat on the burner, it immediately terminates the current IC burning process and outputs a prompt message to identify that the fixed burning process of the current IC has been completed.
And D, if not, extracting the next IC to be burned according to the IC burning sequence to continue IC burning.
In this embodiment, the terminal device detects the real-time second point cloud data of the burning seat on the burner, thereby determining that the operation of fixedly burning all the ICs to be burned has not been completed, that is, when the burner fixes and burns the current IC to be burned and then the remaining ICs to be burned need to be fixed and burned, immediately controlling the corresponding IC burning facilities to extract the next IC to be burned from the IC library to be burned and not burning, according to the IC burning sequence configured in advance, and executing the fixed IC burning process according to the first embodiment of the positioning method for IC burning of the present invention for the IC to be burned.
In this embodiment, after the terminal device determines that the corresponding position of the IC to be burned on the burner is a fixed position and fixes the IC to be burned on the burner seat where the fixed position is located on the burner for burning operation, the terminal device controls to scan the burner after the IC to be burned is fixed, so as to generate real-time second point cloud data of the burner seat on the burner after the IC to be burned is fixed; and after the terminal device scans the burner after the IC to be burned is fixed to obtain the real-time second point cloud data of the burner seat on the burner, the terminal device detects the second point cloud data to judge whether the operation of fixedly burning all the ICs to be burned by the burner after the current burning operation is finished, and when the terminal device detects the real-time second point cloud data of the burner seat on the burner to determine that the operation of fixedly burning all the ICs to be burned by the burner is finished, the terminal device stops the current IC burning process and outputs prompt information to mark that the fixed burning process of the current IC is finished, otherwise, the terminal device detects the real-time second point cloud data of the burner seat on the burner to determine that the operation of fixedly burning all the ICs to be burned is not finished, namely, the burner has the remaining ICs to be burned after the current ICs to be burned are fixed and burned, and the remaining ICs to be burned need to be fixed and burned During recording, the corresponding IC recording facilities are immediately controlled to extract the next IC to be recorded from the IC library to be recorded which is not recorded, according to the pre-configured IC recording sequence, and the fixed IC to be recorded is subjected to the recording process according to the first embodiment of the IC recording positioning method. The intelligent control system not only improves the intelligence of controlling the automatic fixed IC to burn, but also further improves the burning efficiency of the IC chip.
In addition, referring to fig. 7, an embodiment of the present invention further provides a positioning system for IC burning, where the positioning system for IC burning includes:
the loading module is used for loading first point cloud data of the IC to be burned and second point cloud data of a burning seat on the current burning machine;
the determining module is used for determining the corresponding position of the IC to be burned on the burning machine according to the first point cloud data and the second point cloud data;
the offset detection module is used for detecting the offset between the corresponding position and the preset position of the IC to be burned;
and the positioning burning module is used for determining the corresponding position as the fixed position of the IC to be burned on the burning machine for IC burning when the deviation is detected to belong to a preset allowable error range.
Preferably, the determining module includes:
the point cloud splicing unit is used for sequentially splicing the first point cloud data into a preset area in the second point cloud data to obtain each position to be selected;
and the determining unit is used for extracting a target candidate position with the highest splicing embedding degree from all the candidate positions as a corresponding position of the IC to be burned on the burning machine.
Preferably, the predetermined position is a position of a recording seat of the IC to be recorded in the effect image of the recorder, and the offset detection module includes:
a first extraction unit configured to extract the effect image and detect a first position parameter of the predetermined position;
the detection unit is used for comparing a second position parameter of the corresponding position on the IC chip with the first position parameter so as to determine the offset between the corresponding position and the preset position.
Preferably, the IC burning positioning system further includes:
the burning module is used for sequentially extracting the ICs to be burned according to a preset IC burning sequence;
the loading module comprises:
the device comprises a first loading unit, a second loading unit and a control unit, wherein the first loading unit is used for reading an identifier of an IC to be burned and loading first point cloud data of the IC to be burned from a preset point cloud database according to the identifier;
and the second loading unit is used for detecting the current burning machine for IC burning and loading the real-time second point cloud data of the burning seat on the burning machine.
Preferably, the IC burning positioning system further includes:
the progress judging module is used for judging whether the burning of the burning machine is finished or not;
the termination module is used for terminating IC burning;
the burning module is also used for extracting the next IC to be burned according to the IC burning sequence to continue IC burning.
Preferably, the progress judging module includes:
the second extraction unit is used for extracting complete point cloud data of the burning machine;
and the judging unit is used for comparing the second point cloud data with the complete point cloud data to determine whether the burning of the burning machine is finished.
Preferably, the IC burning positioning system further includes:
and the point cloud scanning module is used for scanning the burner fixed with the IC to be burned to obtain real-time second point cloud data of the burning seat on the burner fixed with the IC to be burned.
The steps implemented by the functional modules of the positioning system for IC burning in the present invention during operation can refer to the above embodiments of the positioning method for IC burning in the present invention, and are not described herein again.
In addition, an embodiment of the present invention further provides a terminal device, where the terminal device includes: the positioning program of the IC burning is executed by the processor to realize the steps of the positioning method of the IC burning.
The steps implemented when the positioning program for IC programming executed on the processor is executed may refer to various embodiments of the positioning method for IC programming of the present invention, and are not described herein again.
In addition, an embodiment of the present invention further provides a storage medium applied to a computer, where the storage medium may be a non-volatile computer-readable storage medium, and the storage medium stores a positioning program for IC burning, and when the positioning program for IC burning is executed by a processor, the steps of the positioning method for IC burning described above are implemented.
The steps implemented when the positioning program for IC programming executed on the processor is executed may refer to various embodiments of the positioning method for IC programming of the present invention, and are not described herein again.
It should be noted that, in this document, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or system. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or system that comprises the element.
The above-mentioned serial numbers of the embodiments of the present invention are merely for description and do not represent the merits of the embodiments.
Through the above description of the embodiments, those skilled in the art will clearly understand that the method of the above embodiments can be implemented by software plus a necessary general hardware platform, and certainly can also be implemented by hardware, but in many cases, the former is a better implementation manner. Based on such understanding, the technical solutions of the present invention may be embodied in the form of a software product, which is stored in a storage medium (such as ROM/RAM, magnetic disk, optical disk) and includes instructions for enabling a terminal device (such as a mobile phone, a computer, a server, an air conditioner, or a network device) to execute the method according to the embodiments of the present invention.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications of equivalent structures and equivalent processes, which are made by using the contents of the present specification and the accompanying drawings, or directly or indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (9)
1. A positioning method for IC burning is characterized in that the positioning method for IC burning comprises the following steps:
loading first point cloud data of an IC to be burned and second point cloud data of a burning seat on a current burning machine;
determining the corresponding position of the IC to be burned on the burning machine according to the first point cloud data and the second point cloud data;
detecting the offset between the corresponding position and a preset position of the IC to be burned, wherein the preset position is as follows: the IC to be burned is fixed in an effect image burned on a burning machine, the position of a burning seat of the IC to be burned is fixed, and the effect image is as follows: designing and drawing an effect image of fixing the IC on the burning machine for burning by a design worker in advance;
when the deviation is detected to belong to a preset allowable error range, determining the corresponding position as a fixed position of the IC to be burned on the burning machine so as to burn the IC;
wherein the step of determining the corresponding position of the IC to be burned on the burner according to the first point cloud data and the second point cloud data comprises the following steps:
splicing the first point cloud data in a preset area in the second point cloud data in sequence to obtain each position to be selected;
and extracting a target candidate position with the highest splicing embedding degree from all the candidate positions as a corresponding position of the IC to be burned on the burning machine.
2. The method as claimed in claim 1, wherein the predetermined position is a recording seat position of the IC to be recorded in an effect image of the recorder, and the step of detecting the offset between the corresponding position and the predetermined position of the IC to be recorded comprises:
extracting the effect image and detecting a first position parameter of the predetermined position;
and comparing a second position parameter of the corresponding position on the IC chip with the first position parameter to determine the offset between the corresponding position and the preset position.
3. The IC burning positioning method of claim 1, further comprising:
sequentially extracting ICs to be burned according to a preset IC burning sequence;
the step of loading the first point cloud data of the IC to be burned and the second point cloud data of the burning seat on the current burning machine comprises the following steps:
reading an identifier of an IC to be burned, and loading first point cloud data of the IC to be burned from a preset point cloud database according to the identifier;
and detecting a burning machine which is currently burning the IC and loading real-time second point cloud data of a burning seat on the burning machine.
4. The IC burn positioning method of claim 3, further comprising:
judging whether the burning of the burning machine is finished or not;
if yes, terminating IC burning;
if not, extracting the next IC to be burned according to the IC burning sequence to continue IC burning.
5. The method as claimed in claim 4, wherein the step of determining whether the burn-in of the burner is completed comprises:
extracting complete point cloud data of the burner;
and comparing the second point cloud data with the complete point cloud data to determine whether the burning of the burner is finished.
6. The method as claimed in claim 1, wherein after the step of determining the corresponding position as a fixed position of the IC to be burned on the burner for IC burning when the deviation is detected to belong to a preset allowable error range, the method further comprises:
and scanning the burner fixed with the IC to be burned to obtain real-time second point cloud data of a burner base on the burner fixed with the IC to be burned.
7. A positioning system for IC burning is characterized in that the positioning system for IC burning comprises:
the loading module is used for loading first point cloud data of the IC to be burned and second point cloud data of a burning seat on the current burning machine;
the determining module is used for determining the corresponding position of the IC to be burned on the burning machine according to the first point cloud data and the second point cloud data;
an offset detection module, configured to detect an offset between the corresponding location and a predetermined location of the IC to be burned, where the predetermined location is: the IC to be burned is fixed in an effect image burned on a burning machine, the position of a burning seat of the IC to be burned is fixed, and the effect image is as follows: designing and drawing an effect image of fixing the IC on the burning machine for burning by a design worker in advance;
the positioning burning module is used for determining the corresponding position as a fixed position of the IC to be burned on the burning machine for IC burning when the deviation is detected to belong to a preset allowable error range;
wherein the determining module comprises:
the point cloud splicing unit is used for sequentially splicing the first point cloud data into a preset area in the second point cloud data to obtain each position to be selected;
and the determining unit is used for extracting a target candidate position with the highest splicing embedding degree from all the candidate positions as a corresponding position of the IC to be burned on the burning machine.
8. A terminal device, characterized in that the terminal device comprises: memory, processor and an IC-burned positioning program stored on the memory and executable on the processor, the IC-burned positioning program when executed by the processor implementing the steps of the IC-burned positioning method as claimed in any one of claims 1 to 6.
9. A computer-readable storage medium, having stored thereon a computer program which, when being executed by a processor, carries out the steps of the IC-burn positioning method according to any one of claims 1 to 6.
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5294776A (en) * | 1989-06-30 | 1994-03-15 | Kabushiki Kaisha Toshiba | Method of burning in a semiconductor device |
| US5897728A (en) * | 1989-02-03 | 1999-04-27 | Lockheed Martin Corporation | Integrated circuit test structure and test process |
| CN202601215U (en) * | 2012-06-14 | 2012-12-12 | 中山市三藏电子科技有限公司 | Automatic burner |
| CN206431609U (en) * | 2017-01-03 | 2017-08-22 | 苏州艾玮斯电子科技有限公司 | A kind of burning chip machine |
| CN107298304A (en) * | 2016-04-14 | 2017-10-27 | 科思通自动化设备（苏州）有限公司 | One discharge plate fills the full-automatic CD writers of IC |
| CN108715343A (en) * | 2018-06-04 | 2018-10-30 | 深圳市汉匠自动化科技有限公司 | A kind of full-automatic IC CD writers |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TW200741651A (en) * | 2006-04-25 | 2007-11-01 | Lite On It Corp | Method of track control on the label side of a special optical disc |
| CN103280237A (en) * | 2013-04-28 | 2013-09-04 | 浦创电子科技（苏州）有限公司 | Blank IC placement method of automatic IC burning device |
-
2021
- 2021-02-08 CN CN202110172804.XA patent/CN112907655B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5897728A (en) * | 1989-02-03 | 1999-04-27 | Lockheed Martin Corporation | Integrated circuit test structure and test process |
| US5294776A (en) * | 1989-06-30 | 1994-03-15 | Kabushiki Kaisha Toshiba | Method of burning in a semiconductor device |
| CN202601215U (en) * | 2012-06-14 | 2012-12-12 | 中山市三藏电子科技有限公司 | Automatic burner |
| CN107298304A (en) * | 2016-04-14 | 2017-10-27 | 科思通自动化设备（苏州）有限公司 | One discharge plate fills the full-automatic CD writers of IC |
| CN206431609U (en) * | 2017-01-03 | 2017-08-22 | 苏州艾玮斯电子科技有限公司 | A kind of burning chip machine |
| CN108715343A (en) * | 2018-06-04 | 2018-10-30 | 深圳市汉匠自动化科技有限公司 | A kind of full-automatic IC CD writers |
Non-Patent Citations (2)
| Title |
|---|
| 《Improving Effciency of IC Burn-In Testing》;Yong Han Ng et.al;《IEEE》;20080630;全文 * |
| 《一种可实现对四个产品同时工作的自动烧录机》;伍贤洪，蒙贵添;《装备制造技术》;20190315;全文 * |
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Effective date of registration: 20250312 Address after: 518000 3 / F-1, building 6, Sanyuan, Xinsheng Science Park, Xianxiang Road, Xinsheng community, Longgang street, Longgang District, Shenzhen City, Guangdong Province Patentee after: SHENZHEN HUAYUAN AUTOMATION EQUIPMENT Co.,Ltd. Country or region after: China Address before: 518000 no.2188 Longxiang Avenue, Longcheng street, Longgang District, Shenzhen City, Guangdong Province Patentee before: SHENZHEN INSTITUTE OF INFORMATION TECHNOLOGY Country or region before: China |