CN112888143A - Circuit board - Google Patents
Circuit board Download PDFInfo
- Publication number
- CN112888143A CN112888143A CN201911199451.1A CN201911199451A CN112888143A CN 112888143 A CN112888143 A CN 112888143A CN 201911199451 A CN201911199451 A CN 201911199451A CN 112888143 A CN112888143 A CN 112888143A
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- substrate
- hole
- holes
- conducting layer
- conductive layer
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/06—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using refracting or diffracting devices, e.g. lens
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q19/00—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic
- H01Q19/10—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces
- H01Q19/104—Combinations of primary active antenna elements and units with secondary devices, e.g. with quasi-optical devices, for giving the antenna a desired directional characteristic using reflecting surfaces using a substantially flat reflector for deflecting the radiated beam, e.g. periscopic antennas
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/11—Printed elements for providing electric connections to or between printed circuits
- H05K1/115—Via connections; Lands around holes or via connections
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Structure Of Printed Boards (AREA)
Abstract
The invention relates to a circuit board which comprises a substrate, a first conducting layer and a second conducting layer, wherein the first conducting layer is arranged on the first surface of the substrate, the second conducting layer is arranged on the second surface of the substrate, a plurality of first through holes penetrating through the upper surface and the lower surface of the first conducting layer are formed in the first conducting layer, the maximum value of the distance S between any two points on the outline of the cross section of the first through holes is smaller than the wavelength lambda of electromagnetic waves incident into the first through holes, and the second conducting layer is electrically connected with the first conducting layer. The first conducting layer and the second conducting layer which are provided with the first through holes are arranged, so that the electromagnetic waves are diffracted when being incident into the first through holes and are reflected when being incident into the surface of the second conducting layer, and further the multi-directional transmission of the electromagnetic waves is realized.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a circuit board.
Background
Antennas are widely used in the fields of radio communication, television, broadcasting, and the like, and as a transmission and reception device of electromagnetic waves, antennas play an important role in radio communication. The electromagnetic wave has the physical characteristic of propagating along a straight line, and in order to meet the actual requirement of communication, the electromagnetic wave needs to be transmitted or received from all directions, and if a transmitting or receiving antenna with multiple angles is installed from an electromagnetic wave transmitting source, the size of the antenna is relatively large, so that the structure is complex, and the cost is high. Therefore, there is a need for improved optimization of the wiring board used by the existing antenna.
Disclosure of Invention
The invention aims to provide a circuit board which can diffract and reflect electromagnetic waves and realize multidirectional propagation.
In order to achieve the purpose, the invention adopts the following technical scheme:
the provided circuit board comprises a substrate, a first conducting layer arranged on a first surface of the substrate and a second conducting layer arranged on a second surface of the substrate, wherein a plurality of first through holes penetrating through the upper surface and the lower surface of the first conducting layer are formed in the first conducting layer, the maximum value of the distance S between any two points on the outline of the cross section of the first through holes is smaller than the wavelength lambda of electromagnetic waves entering the first through holes, and the second conducting layer is electrically connected with the first conducting layer.
Furthermore, the substrate is provided with a second through hole, a conductive medium is arranged in the second through hole, and the first conductive layer is electrically connected with the second conductive layer through the conductive medium.
Further, the conductive medium is one or a combination of more of copper, nickel, silver, gold, tin, zinc, lead, chromium, molybdenum, graphite, copper paste, tin paste, carbon nanotubes and graphene.
Further, the first through hole is any one or a combination of two or more of a round hole, a square hole, an elliptical hole and a special-shaped hole.
Further, the distance between any two points on the profile of the cross section of the first through hole is less than one percent of the wavelength lambda of the electromagnetic wave.
Further, the aperture ratio of the first conductive layer is 1% to 99%.
Furthermore, along at least one direction of the substrate, a plurality of first through holes are arranged in a trend that the middle part is large and the two sides are small according to the aperture size.
Furthermore, a plurality of third through holes penetrating through the upper surface and the lower surface of the substrate are formed in the substrate, and the third through holes are arranged corresponding to the first through holes.
Furthermore, the circuit board further comprises an antenna circuit for transmitting and/or receiving electromagnetic waves, and the antenna circuit is arranged on the substrate.
Furthermore, an insulating layer is arranged on one side, close to the first conducting layer, of the substrate, and the antenna circuit is located between the substrate and the insulating layer.
Compared with the prior art, the invention has the beneficial effects that:
according to the circuit board, the first conducting layer and the second conducting layer which are provided with the first through holes are arranged, so that electromagnetic waves are diffracted when being incident into the first through holes and are reflected when being incident into the surface of the second conducting layer, and multi-directional transmission of the electromagnetic waves is further realized.
Drawings
Fig. 1 is a sectional view of a wiring board of an embodiment of the present invention.
Fig. 2 is a schematic top view of a circuit board according to an embodiment of the invention.
Fig. 3 is a schematic top view of a circuit board according to another embodiment of the present invention.
Fig. 4 is a schematic top view of a wiring board according to still another embodiment of the present invention.
Fig. 5 is a cross-sectional view of a circuit board according to an embodiment of the invention.
Fig. 6 is a cross-sectional view of a wiring board according to another embodiment of the present invention.
In the figure:
1. a substrate; 10. a first conductive layer; 101. a first through hole; 11. a second conductive layer; 12. a second through hole; 13. a third through hole; 2. an antenna line; 3. an insulating layer.
Detailed Description
In order to make the technical problems solved, the technical solutions adopted and the technical effects achieved by the present invention clearer, the technical solutions of the present invention are further described below by way of specific embodiments with reference to the accompanying drawings.
As shown in fig. 1, the circuit board provided by the present invention includes a substrate 1, a first conductive layer 10 disposed on a first surface of the substrate 1, and a second conductive layer 11 disposed on a second surface of the substrate 1, wherein the first conductive layer 10 is provided with a plurality of first through holes 101 penetrating through an upper surface and a lower surface thereof, a maximum value of a distance S between any two points on a cross-sectional profile of the first through holes 101 is smaller than a wavelength λ of an electromagnetic wave incident into the first through holes 101, and the second conductive layer 11 is electrically connected to the first conductive layer 10. It is understood that the wavelength λ of the electromagnetic wave used for communication is generally between 0.1 mm and 1 m, and the electromagnetic wave has the characteristic of straight propagation, resulting in a relatively narrow signal propagation range. The circuit board is provided with the first conducting layer 10 and the second conducting layer 11 which are provided with the first through hole 101, so that electromagnetic waves are diffracted when entering the first through hole 101 and are reflected when entering the surface of the second conducting layer 11, the propagation direction of the electromagnetic waves is changed after the electromagnetic waves are diffracted and/or reflected, and multi-directional propagation of the electromagnetic waves is further realized.
Note that the distance S between any two points on the contour of the cross section of the first through hole 101 is a straight line distance between any two points on the hole contour line of the cross section of the first through hole 101.
In this embodiment, the first surface is the upper surface of the substrate 1, and the second surface is the lower surface of the substrate 1. The second conducting layer 11 is used for grounding and reflecting electromagnetic waves, and the second conducting layer 11 is electrically connected with the first conducting layer 10, so that the lightning protection capability and the anti-interference capability of the circuit board can be improved. One side of the second conductive layer 11 close to the first conductive layer 10 is a reflection surface, and when the electromagnetic wave enters the first conductive layer 10, the electromagnetic wave passes through the first through hole 101 and is diffracted, and the propagation direction is scattered around the hole in a disordered manner. The diffracted electromagnetic wave passes through substrate 1 and enters second conductive layer 11, is reflected by the reflection surface thereof, changes its propagation direction, and propagates toward first conductive layer 10. The reflected electromagnetic wave is incident again into the first through hole 101 to be diffracted, and the electromagnetic wave is scattered in a random manner in the propagation direction and around the hole, so that the propagation range of the electromagnetic wave is expanded.
Specifically, the first conductive layer 10 and the second conductive layer 11 are required to have conductive performance and electromagnetic shielding performance. The first conductive layer 10 and the second conductive layer 11 are made of one or a combination of copper, nickel, silver, gold, tin, zinc, lead, chromium, and molybdenum, or made of a conductive rubber material, or other conductive materials. In this embodiment, the first conductive layer 10 and the second conductive layer 11 are metal layers, preferably copper foils.
Specifically, the substrate 1 is provided with a second through hole 12, a conductive medium is provided in the second through hole 12, and the first conductive layer 10 and the second conductive layer 11 are electrically connected through the conductive medium. It is understood that the conductive medium functions to conduct the first conductive layer 10 and the second conductive layer 11, and therefore, the material of the conductive medium and the connection form between the conductive medium and the first conductive layer 10 and the second conductive layer 11 can be flexibly selected according to actual situations.
Specifically, the conductive medium is one or more of copper, nickel, silver, gold, tin, zinc, lead, chromium, molybdenum, graphite, copper paste, tin paste, carbon nanotube and graphene. The conductive medium may be provided along the wall of the second via 12, or may be filled in the second via 12, for example, by filling solder paste, so that the solder paste in the via is connected to the first conductive layer 10 and the second conductive layer 11. In this embodiment, the conductive medium is a copper foil, and the copper foil is disposed on the inner wall of the second through hole 12. The copper foil is light in weight, and the overall weight of the circuit board is favorably reduced. Meanwhile, two ends of the second through hole 12 can be respectively abutted against the first conductive layer 10 and the second conductive layer 11, and the first conductive layer 10 and the second conductive layer 11 are electrically connected through a conductive medium; holes corresponding to the second through holes 12 may be formed in the first conductive layer 10 and the second conductive layer 11, respectively, and the first conductive layer 10 and the second conductive layer 11 may be electrically connected to each other through a conductive medium.
Specifically, the second through holes 12 are provided in plural, and the plural second through holes 12 are distributed at intervals on the periphery of the substrate 1. The arrangement of the second through holes 12 can increase the connection area between the conductive medium and the first conductive layer 10 and the second conductive layer 11, and improve the connection reliability between the first conductive layer 10 and the second conductive layer 11.
As shown in fig. 2, the first through hole 101 is any one or a combination of two or more of a circular hole, a square hole, an elliptical hole, and a special-shaped hole. It can be understood that the first through hole 101 can be flexibly selected according to the difficulty of processing, and only the condition that the electromagnetic wave is incident on the first through hole 101 and then is diffracted is satisfied. In the present embodiment, the maximum value of the distance S between any two points on the profile of the cross section of the first through hole 101 is smaller than the wavelength λ of the radio wave. For example, when the first through hole 101 is a circular hole, the maximum value of the distance S between any two points is the diameter of the first through hole 101; when the first through hole 101 is a rectangular hole, the maximum value of the distance S between any two points is the diagonal distance of the first through hole 101; when the first through hole 101 is a combination of a circular hole and a rectangular hole, the maximum value of the distance S between any two points is the larger of the diameter of the circular hole and the diagonal distance of the rectangular hole.
Preferably, the first through hole 101 of the present embodiment is a circular hole. The circular hole is easy to process, the hole wall is smooth, and the first conducting layer 10 is not easy to be damaged during processing.
Specifically, the distance between any two points on the profile of the cross section of the first through-hole 101 is less than one percent of the wavelength λ of the electromagnetic wave. It can be understood that the aperture of the first through hole 101 is smaller than the wavelength λ of the electromagnetic wave, which ensures that the electromagnetic wave is diffracted after being incident on the first through hole 101. Of course, in other embodiments, a suitable size range of the first through hole 101 may be selected according to an actual use environment.
Specifically, the aperture ratio of the first conductive layer 10 is 1% to 99%. It can be understood that the opening ratio is a ratio of the sum of the areas of the cross sections of the plurality of first through holes 101 on the first conductive layer 10 to the area of the first conductive layer 10. To realize the multi-directional propagation of the electromagnetic wave, it is necessary to ensure that a large amount of the electromagnetic wave passes through the first through hole 101 and is diffracted. If the total area of the first through holes 101 is too large, the remaining amount of the first conductive layer 10 is small, easily causing the first conductive layer 10 to be broken and damaged. If the total area of the first through holes 101 is too small, the diffracted electromagnetic waves are insufficient to achieve multi-azimuth coverage. Therefore, in practical applications, the area ratio of the first through holes 101 can be designed reasonably according to the application scenarios of the circuit board.
As shown in fig. 3, along at least one direction of the substrate 1, a plurality of first through holes 101 are arranged in a trend of larger middle part and smaller two sides according to the size of the aperture. It is understood that the aperture size of the first through hole 101 refers to the maximum value of the distance S between any two points on the profile of the cross section of the first through hole 101, and the first through hole 101 in the present embodiment is preferably a circular hole, and thus the size of the first through hole 101 in the present embodiment is the diameter of the circular hole. That is, the diameter of the first through hole 101 at the middle position and the diameter of the first through hole 101 at the two side positions are arranged in a trend from large to small. The sizes of the first through holes 101 are different, so that the electromagnetic waves are not uniform in intensity when being diffracted after entering the first through holes 101, and the propagation directions of the electromagnetic waves are different after passing through the first through holes 101, so that the propagation directions of the electromagnetic waves are further dispersed. In this embodiment, the size of the first through hole 101 tends to be larger in the middle and smaller in the two sides along the length direction of the substrate 1, so that the electromagnetic wave diffraction generated on the two sides is stronger than that generated on the middle position, and the electromagnetic wave intensity and the propagation range in the peripheral range of the circuit board can be selectively enhanced.
In another embodiment, as shown in fig. 4, the first through holes 101 are arranged along a first direction and a second direction of the substrate 1 respectively, the hole diameters of the first through holes tend to be larger at the middle and smaller at the two sides, and the first direction and the second direction are perpendicular to each other. It can be understood that the aperture size of the first through hole 101 tends to be larger in the middle and smaller in the two directions perpendicular to each other, so that the intensity distribution of the diffraction of the electromagnetic wave can form a similar circle, and the intensity and the propagation range of the electromagnetic wave in the peripheral range of the circuit board can be selectively enhanced.
As shown in fig. 5, the substrate 1 is provided with a plurality of third through holes 13 penetrating through the upper surface and the lower surface of the substrate, and the third through holes 13 are disposed corresponding to the first through holes 101. It can be understood that the substrate 1 is provided with the third through hole 13, so that the medium between the first conductive layer 10 and the second conductive layer 11 is the substrate layer and air, and the refractive indexes of the substrate layer and the air are different, so that the electromagnetic wave is refracted when passing through the substrate 1, and the propagation direction is further changed.
As shown in fig. 6, the wiring board further includes an antenna wiring 2 for transmitting and/or receiving electromagnetic waves, the antenna wiring 2 being disposed on the substrate 1. In this embodiment, the first conductive layer 10 disposed on the first surface and the second conductive layer 11 disposed on the second surface are disposed opposite to each other and located on two sides of the antenna circuit 2, the electromagnetic wave emitted from the antenna circuit 2 cannot pass through the second conductive layer 11 and is reflected on the reflective surface of the second conductive layer 11, and the electromagnetic wave reflected by the electromagnetic wave changes its propagation direction and then enters the first conductive layer 10, so that the electromagnetic wave emitted from the antenna circuit 2 is concentrated and propagated outward from the first through hole 101 of the first conductive layer 10, thereby improving the electromagnetic wave intensity in the corresponding region.
Specifically, an insulating layer 3 is disposed on a side of the substrate 1 close to the first conductive layer 10, and the antenna circuit 2 is located between the substrate 1 and the insulating layer 3. It is understood that the insulating layer 3 protects the antenna line 2. In this embodiment, the material of the substrate 1 includes, but is not limited to, a PI plate, the second conductive layer 11 is disposed on the substrate 1 by sputtering or electroplating, and the antenna circuit 2 is disposed on a side of the substrate 1 away from the second conductive layer 11 by etching. The side of the substrate 1 close to the antenna circuit 2 is also provided with a covering film which is bonded with the insulating layer 3 to protect the antenna circuit 2.
The remarkable effects of the embodiment are as follows: according to the circuit board, the first conducting layer 10 and the second conducting layer 11 which are provided with the first through hole 101 are arranged on the substrate 1, so that the electromagnetic waves are diffracted when entering the first through hole 101 and are reflected when entering the surface of the second conducting layer 11, the propagation direction is diffused, and the propagation range of the electromagnetic waves is expanded. Meanwhile, at least along one direction of the substrate 1, the first through holes 101 are arranged in a trend that the size of the aperture is large in the middle and small in the two sides, so that the intensity of electromagnetic waves is uneven when the electromagnetic waves are incident to the first through holes 101 and are diffracted, and the intensity and the propagation range of the electromagnetic waves in the peripheral range of the circuit board can be selectively enhanced.
The above description is only a preferred embodiment of the present invention, and for those skilled in the art, the present invention should not be limited by the description of the present invention, which should be interpreted as a limitation.
Claims (10)
1. The circuit board is characterized by comprising a substrate (1), a first conducting layer (10) arranged on a first surface of the substrate (1) and a second conducting layer (11) arranged on a second surface of the substrate (1), wherein a plurality of first through holes (101) penetrating through the upper surface and the lower surface of the first conducting layer (10) are formed in the first conducting layer (10), the maximum value of the distance S between any two points on the outline of the cross section of the first through holes (101) is smaller than the wavelength lambda of electromagnetic waves entering the first through holes (101), and the second conducting layer (11) is electrically connected with the first conducting layer (10).
2. The wiring board according to claim 1, wherein the substrate (1) is provided with a second through hole (12), a conductive medium is provided in the second through hole (12), and the first conductive layer (10) and the second conductive layer (11) are electrically connected through the conductive medium.
3. The wiring board of claim 2, wherein the conductive medium is one or more of copper, nickel, silver, gold, tin, zinc, lead, chromium, molybdenum, graphite, copper paste, tin paste, carbon nanotubes, and graphene.
4. The wiring board according to claim 1, wherein the first through hole (101) is any one or a combination of two or more of a circular hole, a square hole, an elliptical hole and a special-shaped hole.
5. The wiring board according to claim 1, characterized in that the distance between any two points on the profile of the cross section of the first via (101) is less than one percent of the wavelength λ of the electromagnetic wave.
6. The wiring board according to claim 1, wherein the first conductive layer (10) has an open area ratio of 1% to 99%.
7. The wiring board according to claim 1, wherein along at least one direction of the substrate (1), a plurality of the first through holes (101) are arranged in a way that the size of the hole diameter is larger at the middle part and smaller at the two sides.
8. The wiring board of claim 1, wherein the substrate (1) is provided with a plurality of third through holes (13) penetrating through the upper surface and the lower surface of the substrate, and the third through holes (13) are arranged corresponding to the first through holes (101).
9. The wiring board according to claim 1, characterized in that it further comprises an antenna line (2) for transmitting and/or receiving electromagnetic waves, said antenna line (2) being arranged on said substrate (1).
10. The wiring board according to claim 9, characterized in that the side of the substrate (1) adjacent to the first conductive layer (10) is provided with an insulating layer (3), and the antenna circuit (2) is located between the substrate (1) and the insulating layer (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911199451.1A CN112888143A (en) | 2019-11-29 | 2019-11-29 | Circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911199451.1A CN112888143A (en) | 2019-11-29 | 2019-11-29 | Circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112888143A true CN112888143A (en) | 2021-06-01 |
Family
ID=76038473
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201911199451.1A Pending CN112888143A (en) | 2019-11-29 | 2019-11-29 | Circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112888143A (en) |
Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004140560A (en) * | 2002-10-17 | 2004-05-13 | Denso Corp | Shielding material for antenna and its designing method |
| CN101653053A (en) * | 2008-01-25 | 2010-02-17 | 揖斐电株式会社 | Multilayer wiring board and its manufacturing method |
| CN101867094A (en) * | 2010-05-02 | 2010-10-20 | 兰州大学 | A Focused Panel Antenna |
| DE102011005767A1 (en) * | 2010-03-29 | 2011-09-29 | Infineon Technologies Ag | An integrated circuit package comprising a waveguide |
| CN102760955A (en) * | 2011-04-29 | 2012-10-31 | 深圳光启高等理工研究院 | Metamaterial capable of diffusing electromagnetic wave |
| TWM528022U (en) * | 2016-03-31 | 2016-09-01 | 道安達股份有限公司 | Dual slot siw antenna unit and array module thereof |
| CN208224517U (en) * | 2018-05-30 | 2018-12-11 | 深圳通感微电子有限公司 | A kind of electromagnetic wave collimating structure |
| CN211509409U (en) * | 2019-11-29 | 2020-09-15 | 广州方邦电子股份有限公司 | Circuit board |
-
2019
- 2019-11-29 CN CN201911199451.1A patent/CN112888143A/en active Pending
Patent Citations (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2004140560A (en) * | 2002-10-17 | 2004-05-13 | Denso Corp | Shielding material for antenna and its designing method |
| CN101653053A (en) * | 2008-01-25 | 2010-02-17 | 揖斐电株式会社 | Multilayer wiring board and its manufacturing method |
| DE102011005767A1 (en) * | 2010-03-29 | 2011-09-29 | Infineon Technologies Ag | An integrated circuit package comprising a waveguide |
| CN101867094A (en) * | 2010-05-02 | 2010-10-20 | 兰州大学 | A Focused Panel Antenna |
| CN102760955A (en) * | 2011-04-29 | 2012-10-31 | 深圳光启高等理工研究院 | Metamaterial capable of diffusing electromagnetic wave |
| TWM528022U (en) * | 2016-03-31 | 2016-09-01 | 道安達股份有限公司 | Dual slot siw antenna unit and array module thereof |
| CN208224517U (en) * | 2018-05-30 | 2018-12-11 | 深圳通感微电子有限公司 | A kind of electromagnetic wave collimating structure |
| CN211509409U (en) * | 2019-11-29 | 2020-09-15 | 广州方邦电子股份有限公司 | Circuit board |
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