CN112867272A - Manufacturing method of 5G antenna rigid-flex board - Google Patents
Manufacturing method of 5G antenna rigid-flex board Download PDFInfo
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- CN112867272A CN112867272A CN202110035244.3A CN202110035244A CN112867272A CN 112867272 A CN112867272 A CN 112867272A CN 202110035244 A CN202110035244 A CN 202110035244A CN 112867272 A CN112867272 A CN 112867272A
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 32
- 238000007639 printing Methods 0.000 claims abstract description 37
- 239000000463 material Substances 0.000 claims abstract description 27
- 238000000034 method Methods 0.000 claims abstract description 22
- 238000010030 laminating Methods 0.000 claims abstract description 10
- 239000010408 film Substances 0.000 claims description 24
- 238000003825 pressing Methods 0.000 claims description 23
- 239000002655 kraft paper Substances 0.000 claims description 9
- 229920000106 Liquid crystal polymer Polymers 0.000 claims description 3
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 claims description 3
- 239000004642 Polyimide Substances 0.000 claims description 3
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 229920000728 polyester Polymers 0.000 claims description 3
- 229920001721 polyimide Polymers 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 239000013039 cover film Substances 0.000 claims description 2
- 239000003365 glass fiber Substances 0.000 claims description 2
- 238000004891 communication Methods 0.000 abstract description 2
- 238000005520 cutting process Methods 0.000 description 7
- 230000007547 defect Effects 0.000 description 5
- 239000003292 glue Substances 0.000 description 4
- 238000010295 mobile communication Methods 0.000 description 4
- 238000005530 etching Methods 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 238000012797 qualification Methods 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical group [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000005553 drilling Methods 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- 239000000725 suspension Substances 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 210000000056 organ Anatomy 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/12—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using thick film techniques, e.g. printing techniques to apply the conductive material or similar techniques for applying conductive paste or ink patterns
- H05K3/1283—After-treatment of the printed patterns, e.g. sintering or curing methods
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0296—Conductive pattern lay-out details not covered by sub groups H05K1/02 - H05K1/0295
- H05K1/0298—Multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention relates to the field of 5G communication, and particularly discloses a method for manufacturing a 5G antenna rigid-flex board, wherein the rigid-flex board comprises a rigid board area and a flexible board area, and the manufacturing method comprises the following steps: providing an upper layer and a lower layer which both comprise an inner layer circuit pattern layer and an inner layer L2/L3 attached with a covering film layer, wherein the upper surface of the inner layer L2/L3 comprises an ink layer, and the covering film layer and the ink layer are both positioned in the area of the flexible printed circuit board; providing a bonding sheet layer windowed in the region of the flexible board; providing an outer layer L1 with one surface comprising an outer layer circuit pattern layer and the other surface being a half gong, wherein the half gong area corresponds to the printing area of the ink layer; providing an outer layer L4 comprising an outer layer circuit pattern layer on one side; and stacking and laminating the outer layer L1, the bonding sheet layer, the inner layer L2/L3, the bonding sheet layer and the outer layer L4 according to the requirement of a laminated structure. According to the invention, a semi-routing mode is adopted, the inner layer printing ink area is hollowed, and the hard board material is prevented from contacting with the inner layer printing ink when being pressed, so that the problem of oil falling of the inner layer printing ink is solved.
Description
Technical Field
The invention relates to the field of 5G communication, in particular to a method for manufacturing a 5G antenna rigid-flex board.
Background
With the continuous development of the era of mobile communication from 2G, 3G, 4G to the 5G (fifth generation mobile communication) of everything interconnection, mobile communication antennas have also undergone the development course from single-polarized antennas, dual-polarized antennas to smart antennas, MIMO antennas, and even large-scale array antennas. The position of the antenna as a sensing organ of the mobile communication network in the network is more and more complex, and the role is more and more important. At present, 4G products in the market are abundant, most 5G products are in a research and development stage, the antenna structure form mostly adopts an FPC + coaxial cable or a PCB + coaxial cable form, and in the 5G era of everything interconnection, the small-volume requirement of people on the antenna is higher.
The rigid-flex circuit board is a circuit board with FPC (flexible printed circuit) and PCB (printed circuit board) characteristics, which is formed by combining a flexible circuit board and a rigid circuit board according to relevant process requirements through procedures such as pressing and the like. The rigid-flex printed circuit board has the characteristics of both the FPC and the PCB, has a certain flexible area and a certain rigid area, and is greatly helpful for saving the internal space of a product, reducing the volume of a finished product and improving the performance of the product, so that the rigid-flex printed circuit board can be widely applied to a 5G antenna.
However, the inner soft board part of the existing soft and hard combined board needs screen printing solder resist ink, and after the inner layer is manufactured with the ink, the hard board material easily sticks the ink when pressing the board, and takes away the ink after uncovering, so that the defect of oil dropping appears on the appearance, the product is scrapped, and the rejection rate is high.
Disclosure of Invention
The invention aims to overcome at least one defect (deficiency) of the prior art and provides a method for manufacturing a 5G antenna rigid-flex printed circuit board, which can avoid the falling of the inner layer printing ink and improve the qualification rate of products.
The invention adopts the technical scheme that a method for manufacturing a 5G antenna rigid-flex board comprises a rigid board area and a flexible board area, and the manufacturing method comprises the following steps:
providing an upper layer and a lower layer which both comprise an inner layer circuit pattern layer and an inner layer L2/L3 attached with a covering film layer, wherein the upper surface of the inner layer L2/L3 comprises an ink layer, and the covering film layer and the ink layer are both positioned in the area of the flexible printed circuit board;
providing a bonding sheet layer windowed in the region of the flexible board;
providing an outer layer L1 with one surface comprising an outer layer circuit pattern layer and the other surface being a half gong, wherein the half gong area corresponds to the printing area of the ink layer;
providing an outer layer L4 comprising an outer layer circuit pattern layer on one side;
and stacking and laminating the outer layer L1, the bonding sheet layer, the inner layer L2/L3, the bonding sheet layer and the outer layer L4 according to the requirement of a laminated structure.
The invention provides a manufacturing method of a 5G antenna rigid-flex board, which is characterized in that a part of an area of an outer layer L1 corresponding to an ink layer is dug by adopting a semi-routing mode, and an inner ink area is dug, so that the space (particularly the height direction) of the upper part of an ink printing area is increased, and thus, a rigid board material is prevented from contacting with the inner ink when being pressed, the ink adhesion is avoided, the problem of the oil falling of the inner ink is solved, and the qualification rate of products is improved.
As a preferable technical scheme, the half gong area is larger than the printing area of the ink layer. Considering that the plate materials have the phenomena of expansion and shrinkage and alignment deviation during pressing, the half routing area in the scheme is larger than the ink printing area. However, the area of the half routing area is too large, and two defects are still existed: firstly, influence production efficiency, secondly the hang down region is too big behind half gong, and panel strength is not enough, and the stiff plate material sinks when still can taking place the clamp plate and glues even printing ink. Furthermore, the unilateral of the half routing area is 0.4-0.6 mm larger than the printing area of the printing ink layer.
As an optimal technical scheme, the half gong depth is 0.05-0.15 mm. If the half routing depth is too shallow, when the printing thickness of the printing ink is too large, the situation that the hard board material collapses and is adhered with the printing ink when the board is pressed still occurs; the depth of the half gong is too deep, the strength of the suspension area is insufficient, and the hard board material is collapsed and adhered with ink when the pressing board is still generated. Preferably, the half gong depth is 0.1 mm.
As a preferred technical solution, the method for attaching the cover film comprises: pressing a covering film on the soft board area, wherein the pressing parameters are as follows: pressing plate at 180 deg.C and 10Mpa for 100 s; curing parameters: curing at 170 ℃ for 90 min.
As a preferred technical scheme, the method for laminating the laminated plates comprises the following steps: and sequentially stacking the TPX film, the high-temperature film, the steel plate and a plurality of kraft paper from top to bottom on the plate to be laminated, and then laminating. Wherein the kraft paper is 10 layers of new kraft paper and 10 layers of old kraft paper; the TPX film is a 120um water accumulation TPX film.
The 5G antenna rigid-flex board is manufactured by the manufacturing method.
As a preferable technical proposal, comprises an outer layer L1, a bonding sheet layer, an inner layer L2/L3, a bonding sheet layer and an outer layer L4 which are pressed; the bonding sheet layer is made of PP, and the base layer of the inner layer L2/L3 is made of polyimide, polyester or liquid crystal polymer material; the outer layer L1 and the outer layer L4 are made of glass fiber-containing plates.
Compared with the prior art, the invention has the beneficial effects that: adopt the mode of half gong, cut the inlayer printing ink district empty, avoid hard board material and inlayer printing ink contact when the clamp plate, can not produce printing ink and glue even to solve the problem that inlayer printing ink falls oily, thereby improve the qualification rate of product.
Drawings
Fig. 1 is a schematic view of a laminated rigid-flex board in the prior art.
Fig. 2 is a schematic laminated view of a rigid-flex board according to an embodiment of the present invention.
Fig. 3 is a manufacturing process of the rigid-flex board according to the embodiment of the invention.
Fig. 4 is a schematic diagram of lamination and lamination according to an embodiment of the invention.
Reference numerals: 1. an ink layer; 2. and covering the film layer.
Detailed Description
The drawings are only for purposes of illustration and are not to be construed as limiting the invention. For a better understanding of the following embodiments, certain features of the drawings may be omitted, enlarged or reduced, and do not represent the size of an actual product; it will be understood by those skilled in the art that certain well-known structures in the drawings and descriptions thereof may be omitted.
Examples
The existing soft and hard combined plate structure is shown in figure 1 and is formed by laminating an outer layer L1, an adhesive sheet layer, an inner layer L2/L3, an adhesive sheet layer and an outer layer L4 which are sequentially stacked. The inner layer soft board part of soft and hard combination board needs silk screen printing to hinder and welds printing ink, and after the printing ink had been made to the inner layer, the printing ink can be glued to the hardboard material during the clamp plate, takes away printing ink after uncapping, and the defect of just falling oil from the outward appearance leads to the product to scrap. Among the reasons that cause the ink to stick out of the hard plate material are: the hard board material covered on the soft board area can generate depression when being pressed, the soft board is pressed, and the ink is melted by the high temperature of the pressing and is adhered on the hard board material pressed on the soft board area.
For solving above-mentioned technical problem, the method of half gong is adopted to this embodiment, on the basis of current soft or hard combination board, undercuts inner layer solder mask ink district, avoids hard board material and inner layer printing ink contact when the clamp plate, therefore can not produce printing ink and glue even to solve the problem that inner layer printing ink falls oily.
Specifically, this embodiment provides a method for manufacturing a 5G antenna rigid-flex board, as shown in fig. 2, where the rigid-flex board includes a rigid board area and a flexible board area, and the manufacturing method includes the following steps:
providing an upper layer and a lower layer, wherein the upper layer and the lower layer both comprise an inner layer circuit pattern layer and an inner layer L2/L3 attached with a covering film layer, the upper surface of the inner layer L2/L3 comprises an ink layer, and the covering film layer 2 and the ink layer 1 are both positioned in a soft board area;
providing a bonding sheet layer windowed in the region of the flexible board;
providing an outer layer L1 with one surface comprising an outer layer circuit pattern layer and the other surface being half gong, wherein the half gong area corresponds to the printing area of the solder mask ink layer 1;
providing an outer layer L4 comprising an outer layer circuit pattern layer on one side;
and stacking and laminating the outer layer L1, the bonding sheet layer, the inner layer L2/L3, the bonding sheet layer and the outer layer L4 according to the requirement of a laminated structure.
Wherein, the inner layer circuit pattern layer is a copper layer; the material of the bonding sheet layer is PP; the base layer of the inner layer L2/L3 is made of polyimide, polyester or liquid crystal polymer material; FR4 board is used as the base material of the outer layer L1 and the outer layer L4.
Considering that the plate materials have the phenomena of expansion and shrinkage and alignment deviation during pressing, the half routing area in the scheme is larger than the ink printing area. However, the area of the half routing area is too large, and two defects are still existed: firstly, influence production efficiency, secondly the hang down region is too big behind half gong, and panel strength is not enough, and the stiff plate material sinks when still can taking place the clamp plate and glues even printing ink. The single edge of the half routing area is 0.4-0.6 mm larger than the printing area of the ink layer. In this embodiment, the single side of the half routing area is 0.5mm larger than the printing area of the ink layer.
Wherein, the depth of the half gong area is 0.05-0.15 mm. If the half routing depth is too shallow, when the printing thickness of the printing ink is too large, the situation that the hard board material collapses and is adhered with the printing ink when the board is pressed still occurs; the depth of the half gong is too deep, the strength of the suspension area is insufficient, and the hard board material is collapsed and adhered with ink when the pressing board is still generated. In this embodiment, the depth of the half gong area is 0.1 mm.
In this embodiment, a process for manufacturing the 5G antenna rigid-flex printed circuit board is specifically as shown in fig. 2 to 3:
(1) production of inner layer L2/L3
The preparation method comprises the following steps of:
A. cutting a soft board: cutting a soft board base material (PI) into sheets from a roll material according to the designed typesetting size;
B. inner layer circuit: pre-treating the cut sheet material, pressing a dry film, aligning, exposing, developing and etching the circuit, manufacturing an inner-layer circuit, and marking the discarded single piece through AOI inspection;
C. and (3) pressing a covering film: pressing a covering film on the flexible printed circuit board area to protect the flexible printed circuit board, wherein the pressing parameters are as follows: 180 ℃ is multiplied by 10Mpa for 100 seconds; curing parameters: 90 minutes at 170 ℃;
D. punching: punching out the lamination positioning holes, wherein the hole diameter tolerance is as follows: +/-0.025mm, positional tolerance: +/-0.025 mm;
E. browning and baking the board: normal production parameters are adopted, the roughness of the circuit in the hard board area is increased, and the product is ensured not to explode.
(2) Manufacturing the bonding sheet: and cutting the window by laser after cutting, and cutting away the PP in the soft board area.
(3) Preparation of outer layer L1 and outer layer L4
The double-sided board is manufactured by the following steps of (1) manufacturing a double-sided board, except for an outer L1 layer half gong, according to a conventional process:
A. cutting: cutting the plate into sheet materials required by production according to the typesetting size;
B. drilling: drilling a positioning hole, wherein the hole diameter tolerance is as follows: +/-0.025mm, positional tolerance: +/-0.025 mm;
C. single-side etching: pressing a dry film on the copper foil on one surface to be reserved, exposing, etching and finally removing the dry film;
D. cleaning the baking plate: the board is washed through the cleaning line, and the board baking parameters are as follows: 120 ℃ for 60 minutes.
(4) Manufacturing an outer layer:
after the materials are laminated, the PCB is manufactured according to normal PCB production flow parameters, which are the same as the traditional rigid-flex board and are not described again.
As shown in fig. 4, the method for pressing the laminated plate includes: and sequentially stacking the TPX film, the high-temperature film, the steel plate and a plurality of kraft paper from top to bottom on the plate to be laminated, and then laminating. And (5) performing primary pressing on the pre-pressed laminated board to obtain the multilayer board. The pressing is generally performed by a press, the press can be a voltage press or an oil press, the pressing is a heating and pressing process, and the semi-solidified insulating material is converted from a semi-solidified state to a solidified state in the process.
Wherein the kraft paper is 10 layers of new kraft paper and 10 layers of old kraft paper; the TPX film is a 120um water accumulation TPX film.
It should be understood that the above-mentioned embodiments of the present invention are only examples for clearly illustrating the technical solutions of the present invention, and are not intended to limit the specific embodiments of the present invention. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention claims should be included in the protection scope of the present invention claims.
Claims (8)
1. A manufacturing method of a 5G antenna rigid-flex board is characterized in that the rigid-flex board comprises a hard board area and a soft board area, and the manufacturing method comprises the following steps:
providing an upper layer and a lower layer which both comprise an inner layer circuit pattern layer and an inner layer L2/L3 attached with a covering film layer, wherein the upper surface of the inner layer L2/L3 comprises an ink layer, and the covering film layer and the ink layer are both positioned in the area of the flexible printed circuit board;
providing a bonding sheet layer windowed in the region of the flexible board;
providing an outer layer L1 with one surface comprising an outer layer circuit pattern layer and the other surface being a half gong, wherein the half gong area corresponds to the printing area of the ink layer;
providing an outer layer L4 comprising an outer layer circuit pattern layer on one side;
and stacking and laminating the outer layer L1, the bonding sheet layer, the inner layer L2/L3, the bonding sheet layer and the outer layer L4 according to the requirement of a laminated structure.
2. The method for manufacturing the 5G antenna rigid-flex board according to claim 1, wherein a half routing area is larger than the printing area of the ink layer.
3. The method for manufacturing the 5G antenna rigid-flex board as claimed in claim 2, wherein each side of the half routing area is 0.4-0.6 mm larger than the printing area of the ink layer.
4. The method for manufacturing the 5G antenna rigid-flex board according to claim 1, wherein the half-gong depth is 0.05-0.15 mm.
5. The method for manufacturing the 5G antenna rigid-flex board as claimed in any one of claims 1 to 4, wherein the method for attaching the cover film comprises the following steps: pressing a covering film on the soft board area, wherein the pressing parameters are as follows: pressing plate at 180 deg.C and 10Mpa for 100 s; curing parameters: curing at 170 ℃ for 90 min.
6. The method for manufacturing the 5G antenna rigid-flex board as claimed in any one of claims 1 to 4, wherein the method for laminating the boards specifically comprises the following steps: and sequentially stacking the TPX film, the high-temperature film, the steel plate and a plurality of kraft paper from top to bottom on the plate to be laminated, and then laminating.
7. A5G antenna rigid-flex board, characterized by being manufactured by the manufacturing method according to claims 1-6.
8. The 5G antenna rigid-flex board as claimed in claim 7, which comprises a laminated outer layer L1, a bonding sheet layer, an inner layer L2/L3, a bonding sheet layer and an outer layer L4; the bonding sheet layer is made of PP, and the base layer of the inner layer L2/L3 is made of polyimide, polyester or liquid crystal polymer material; the outer layer L1 and the outer layer L4 are made of glass fiber-containing plates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110035244.3A CN112867272A (en) | 2021-01-12 | 2021-01-12 | Manufacturing method of 5G antenna rigid-flex board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110035244.3A CN112867272A (en) | 2021-01-12 | 2021-01-12 | Manufacturing method of 5G antenna rigid-flex board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543531A (en) * | 2021-06-25 | 2021-10-22 | 江西红板科技股份有限公司 | Method for processing soft and hard combined board with multiple surface treatment processes in soft board area |
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|---|---|---|---|---|
| US20010010303A1 (en) * | 1997-02-14 | 2001-08-02 | A. Roland Caron | Multilayer combined rigid/flex printed circuit board containing flexible soldermask |
| CN102595807A (en) * | 2012-02-29 | 2012-07-18 | 博罗县精汇电子科技有限公司 | Production technology of soft and hard combination circuit board |
| CN102946687A (en) * | 2012-10-31 | 2013-02-27 | 深圳崇达多层线路板有限公司 | Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof |
| CN106231820A (en) * | 2016-07-29 | 2016-12-14 | 台山市精诚达电路有限公司 | Rigid Flex processing method |
| CN107548242A (en) * | 2017-08-28 | 2018-01-05 | 苏州福莱盈电子有限公司 | A kind of production technology for reducing Rigid Flex internal layer ink and coming off |
| CN107846791A (en) * | 2017-10-30 | 2018-03-27 | 高德（江苏）电子科技有限公司 | Uncapped before a kind of Rigid Flex and protect the production method of soft board |
| CN209949560U (en) * | 2019-04-17 | 2020-01-14 | 深圳市隽美泰和电子科技有限公司 | Soft-hard combined board capable of preventing inner layer printing ink of uncovering from falling off |
-
2021
- 2021-01-12 CN CN202110035244.3A patent/CN112867272A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20010010303A1 (en) * | 1997-02-14 | 2001-08-02 | A. Roland Caron | Multilayer combined rigid/flex printed circuit board containing flexible soldermask |
| CN102595807A (en) * | 2012-02-29 | 2012-07-18 | 博罗县精汇电子科技有限公司 | Production technology of soft and hard combination circuit board |
| CN102946687A (en) * | 2012-10-31 | 2013-02-27 | 深圳崇达多层线路板有限公司 | Local-fitting hole-avoiding flex-rigid combined board and manufacturing method thereof |
| CN106231820A (en) * | 2016-07-29 | 2016-12-14 | 台山市精诚达电路有限公司 | Rigid Flex processing method |
| CN107548242A (en) * | 2017-08-28 | 2018-01-05 | 苏州福莱盈电子有限公司 | A kind of production technology for reducing Rigid Flex internal layer ink and coming off |
| CN107846791A (en) * | 2017-10-30 | 2018-03-27 | 高德（江苏）电子科技有限公司 | Uncapped before a kind of Rigid Flex and protect the production method of soft board |
| CN209949560U (en) * | 2019-04-17 | 2020-01-14 | 深圳市隽美泰和电子科技有限公司 | Soft-hard combined board capable of preventing inner layer printing ink of uncovering from falling off |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113543531A (en) * | 2021-06-25 | 2021-10-22 | 江西红板科技股份有限公司 | Method for processing soft and hard combined board with multiple surface treatment processes in soft board area |
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