CN112780588B - Fan with fan body - Google Patents
Fan with fan body Download PDFInfo
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- CN112780588B CN112780588B CN202010755714.9A CN202010755714A CN112780588B CN 112780588 B CN112780588 B CN 112780588B CN 202010755714 A CN202010755714 A CN 202010755714A CN 112780588 B CN112780588 B CN 112780588B
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D25/00—Pumping installations or systems
- F04D25/02—Units comprising pumps and their driving means
- F04D25/08—Units comprising pumps and their driving means the working fluid being air, e.g. for ventilation
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/40—Casings; Connections of working fluid
- F04D29/52—Casings; Connections of working fluid for axial pumps
- F04D29/522—Casings; Connections of working fluid for axial pumps especially adapted for elastic fluid pumps
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
- F04D—NON-POSITIVE-DISPLACEMENT PUMPS
- F04D29/00—Details, component parts, or accessories
- F04D29/60—Mounting; Assembling; Disassembling
- F04D29/64—Mounting; Assembling; Disassembling of axial pumps
- F04D29/644—Mounting; Assembling; Disassembling of axial pumps especially adapted for elastic fluid pumps
- F04D29/646—Mounting or removal of fans
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Abstract
本发明公开了一种风扇,该风扇包含:扇框、马达、叶轮、电路板及包覆层;扇框中心位置设有马达基座;马达装设于马达基座上,且包含转子、定子及轴承单元,定子环绕于轴承单元而设置,转子套设于定子及轴承单元上;叶轮装设于马达上;电路板套设于定子和马达基座间,且于一表面上具有多个电子元件;其中,包覆层包覆定子及电路板,以使多个电子元件上均匀布设一特定厚度的包覆层。本发明的电子元件的表面均匀覆盖一特定厚度的包覆层,进而可避免厚度不均匀产生的内部应力,并防止电子元件脱落、风扇故障等问题。
The invention discloses a fan, which comprises: a fan frame, a motor, an impeller, a circuit board and a cladding layer; a motor base is arranged at the center of the fan frame; the motor is installed on the motor base, and includes a rotor and a stator And the bearing unit, the stator is set around the bearing unit, the rotor is set on the stator and the bearing unit; the impeller is installed on the motor; the circuit board is set between the stator and the motor base, and there are multiple electronics on one surface Components; wherein, the cladding layer covers the stator and the circuit board, so that a specific thickness of the cladding layer is evenly distributed on multiple electronic components. The surface of the electronic component of the present invention is evenly covered with a cladding layer of a specific thickness, thereby avoiding internal stress caused by uneven thickness, and preventing problems such as falling off of the electronic component and fan failure.
Description
技术领域technical field
本发明涉及一种风扇,尤其涉及一种具肉厚规划以防止内部电子元件脱落的风扇。The invention relates to a fan, in particular to a fan with thick meat design to prevent internal electronic components from falling off.
背景技术Background technique
随着高科技产业的迅速发展,各种电子设备在我们的生活中变得举足轻重。众所皆知,电子设备的散热功效会影响整个系统的运作稳定性和使用寿命。为了提高电子设备的散热效率和运作稳定性,风扇通常被安装在电子设备内、或是安装在其周围环境,以冷却该电子设备,使其不会因过热而导致效能变差。With the rapid development of the high-tech industry, various electronic devices have become very important in our lives. As we all know, the heat dissipation efficiency of electronic equipment will affect the operation stability and service life of the entire system. In order to improve the heat dissipation efficiency and operation stability of the electronic equipment, fans are usually installed in the electronic equipment or in its surroundings to cool the electronic equipment so that its performance will not deteriorate due to overheating.
图1为传统风扇的剖面结构示意图。如图1所示,传统风扇1包括叶轮10、转子11、定子12、轴承单元13、扇框14和电路板16。叶轮10安装在转子11上,转子11、定子12及轴承单元13共同构成马达。定子12环绕设置于轴承单元13周围,且定子12驱动转子11和叶轮10旋转。扇框14的底部包括马达基座15,且马达基座15设置于扇框14底部的中心位置。轴承单元13对应装设于马达基座15上。电路板16设置在定子12和马达基座15之间,且电路板16的表面161上布设有多个电子元件160。FIG. 1 is a schematic cross-sectional structure diagram of a conventional fan. As shown in FIG. 1 , a
于传统风扇1中,当风扇1完成组装后,会将填充剂17填灌于电路板16与马达基座15之间的空间中,进而以保护定子12和电路板16免受外部液体和灰尘的侵蚀。如图所示,当填充剂17被填灌于风扇1的内部空间时,其虽可覆盖电路板16的表面161及其上设置的多个电子元件160,然而,由于扇框14底部设置的马达基座15的内表面151是平坦的,且于传统风扇1中,电路板16的表面161与马达基座15的内表面151之间的高度h1通常是固定的,但每一个电子元件160的尺寸和高度却是不相同的,是以当填充剂17填充包覆于电路板16的电子元件160周边时,其厚度会有不相同、且不均匀的现象。换句话说,每一电子元件160的表面所覆盖的填充剂17厚度均不相同,有的部分厚、有的部分薄,在这种情况下,当经历天候变化时,填充剂17会随之产生热膨胀或是收缩,然而其厚薄将影响热膨胀或是收缩的程度,进而导致产生不同的内部应力,并会对应地施加于电子元件160上,造成电子元件160遭受内部应力的拉扯而易松动。是以,当传统风扇1长期使用之后,电子元件160会因前述内部应力的拉扯而容易松动、或是脱离电路板16,进而造成风扇1的故障。In the
因此,如何发展一种可改善上述现有技术所遇到问题的风扇,实为重要的课题之一。Therefore, how to develop a fan that can improve the problems encountered in the prior art is one of the important issues.
发明内容Contents of the invention
本发明的一目的在于提供一种风扇,通过于扇框的马达基座进行肉厚规划,使其内表面对应于电子元件的位置及高度对应凹陷,进而于此空间填充设置包覆层,以使电子元件的表面均匀覆盖一特定厚度的包覆层,进而可避免厚度不均匀产生的内部应力,并防止电子元件脱落、风扇故障等问题。An object of the present invention is to provide a fan. By planning the thickness of the motor base of the fan frame, the inner surface corresponds to the position and height of the electronic components and the corresponding depression, and then fills the space with a coating layer, so as to The surface of the electronic component is evenly covered with a coating layer of a specific thickness, thereby avoiding internal stress caused by uneven thickness, and preventing problems such as falling off of the electronic component and fan failure.
本发明的另一目的在于提供一种风扇,通过于扇框的马达射出成型时直接进行肉厚规划,使包覆层直接成型包覆于电路板上,并使其底表面对应于电子元件的位置及高度凸出或凹陷,以使电子元件的表面均匀覆盖一特定厚度的包覆层,进而可避免厚度不均匀产生的内部应力,并防止电子元件脱落、风扇故障等问题。Another object of the present invention is to provide a fan. By directly planning the thickness of the motor during the injection molding of the fan frame, the coating layer is directly molded and coated on the circuit board, and the bottom surface corresponds to the electronic component. The position and height are protruding or concave, so that the surface of the electronic component is uniformly covered with a coating layer of a specific thickness, thereby avoiding internal stress caused by uneven thickness, and preventing problems such as falling off of electronic components and fan failure.
根据本发明的构想,本发明提供一种风扇,包含:扇框,其中心位置设有马达基座;马达,装设于马达基座上,且包含转子、定子及轴承单元,定子环绕于轴承单元而设置,转子套设于定子及轴承单元上;叶轮,装设于马达上;电路板,套设于定子和马达基座间,且于电路板的第一表面上具有多个电子元件;以及包覆层;其中,包覆层包覆定子及电路板,以使多个电子元件上均匀布设一特定厚度的包覆层。According to the conception of the present invention, the present invention provides a fan, comprising: a fan frame with a motor base at its center; a motor mounted on the motor base and including a rotor, a stator, and a bearing unit, the stator surrounding the bearing The rotor is installed on the stator and the bearing unit; the impeller is installed on the motor; the circuit board is installed between the stator and the motor base, and has a plurality of electronic components on the first surface of the circuit board; and a coating layer; wherein, the coating layer covers the stator and the circuit board, so that a specific thickness of the coating layer is evenly distributed on the plurality of electronic components.
根据本发明的构想,其中特定厚度介于0.8mm至2mm之间。According to the idea of the present invention, the specific thickness is between 0.8mm and 2mm.
根据本发明的构想,其中风扇的马达基座具有第二表面,且第二表面依据相对应设置的多个电子元件进行肉厚规划。According to the idea of the present invention, the motor base of the fan has a second surface, and the thickness of the second surface is planned according to a plurality of correspondingly arranged electronic components.
根据本发明的构想,其中肉厚规划于第二表面上设置多个凹部,且多个凹部的位置及深度与多个电子元件的位置及高度相对应。According to the idea of the present invention, a plurality of recesses are arranged on the second surface according to the thickness plan, and the positions and depths of the plurality of recesses correspond to the positions and heights of the plurality of electronic components.
根据本发明的构想,其中包覆层的特定厚度由电子元件的表面至凹部的表面之间的距离所定义。According to the idea of the present invention, the specific thickness of the cladding layer is defined by the distance from the surface of the electronic component to the surface of the recess.
根据本发明的构想,其中凹部的宽度大于电子元件的宽度。According to the idea of the present invention, the width of the concave portion is greater than the width of the electronic component.
根据本发明的构想,其中电子元件的两侧各具有一溢胶空间,用以供填充材料流入凹部。According to the idea of the present invention, two sides of the electronic component each have a glue overflow space for the filling material to flow into the recess.
根据本发明的构想,其中溢胶空间的宽度介于1.0mm至1.5mm之间。According to the idea of the present invention, the width of the glue overflow space is between 1.0mm and 1.5mm.
根据本发明的构想,其中马达以射出成型的制程所制成,且马达于射出成型时直接进行肉厚规划。According to the idea of the present invention, the motor is manufactured by injection molding process, and the thickness of the motor is directly planned during injection molding.
根据本发明的构想,其中肉厚规划为使包覆层直接成型并包覆于电路板上,包覆层具有第三表面,第三表面对应于电子元件的位置及高度对应设置多个凹陷部及凸出部,以使多个电子元件上均匀布设特定厚度的该包覆层。According to the idea of the present invention, the thickness of the meat is planned to make the cladding layer be directly molded and coated on the circuit board, the cladding layer has a third surface, and the third surface is corresponding to the position and height of the electronic components and is provided with a plurality of depressions And the protruding part, so that the cladding layer with a specific thickness is evenly distributed on the plurality of electronic components.
根据本发明的构想,其中马达的转子具有一顶面,且顶面上具有多个通孔,以维持通气。According to the idea of the present invention, the rotor of the motor has a top surface, and the top surface has a plurality of through holes for maintaining ventilation.
根据本发明的构想,本发明提供一种风扇,包含:扇框,其中心位置设有马达基座;马达,装设于马达基座上,且包含转子、定子及轴承单元,定子环绕于轴承单元而设置,转子套设于定子及轴承单元上;叶轮,装设于马达上;电路板,套设于定子和马达基座间,且于电路板的第一表面上具有多个电子元件;以及其中马达基座具有第二表面,第二表面上设置多个凹部,且凹部的位置及深度与电子元件的位置及高度相对应。According to the conception of the present invention, the present invention provides a fan, comprising: a fan frame with a motor base at its center; a motor mounted on the motor base and including a rotor, a stator, and a bearing unit, the stator surrounding the bearing The rotor is installed on the stator and the bearing unit; the impeller is installed on the motor; the circuit board is installed between the stator and the motor base, and has a plurality of electronic components on the first surface of the circuit board; And wherein the motor base has a second surface, a plurality of recesses are arranged on the second surface, and the positions and depths of the recesses correspond to the positions and heights of the electronic components.
根据本发明的构想,其中多个凹部的其中之一可以对应多个电子元件的其中多个具有相同高度的电子元件。According to the idea of the present invention, one of the plurality of recesses may correspond to a plurality of the plurality of electronic components having the same height.
本发明提供的风扇,其中针对电子元件设置的位置及高度进行肉厚规划。于一实施例中,通过于扇框的马达基座进行肉厚规划,使其第二表面对应于电子元件的位置及高度对应凹陷,进而于此空间填充设置包覆层,以使电子元件的表面均匀覆盖一特定厚度的包覆层。于另一实施例中,通过于马达射出成型时直接进行肉厚规划,使包覆层直接成型包覆于电路板上,并使其第三表面对应于电子元件的位置及高度凸出或凹陷,进而使电子元件的表面均匀覆盖一特定厚度的包覆层,同时使包覆层共形于电子元件(即包覆层的第三表面的外形与电子元件的外形一致)。借前述两实施态样使包覆层保持均匀的特定厚度,且此特定厚度相较于先前技术更为轻薄,进而可避免厚度不均匀产生的内部应力,并防止电子元件脱落、风扇故障等问题。此外,通过对电路板或是马达进行的预处理程序,以增强电子元件与电路板之间的附着力,并增强了结构强度。因此,本发明的风扇不仅达到了防水防尘的目的、提高了风扇的温度承受能力,同时由于其针对电子元件的不同位置及高度进行了肉厚规划,进而减少电子元件脱落、风扇故障等情形,并延长风扇的使用寿命。In the fan provided by the present invention, the meat thickness planning is carried out for the position and height of the electronic components. In one embodiment, by planning the thickness of the motor base of the fan frame, the second surface is corresponding to the position and height of the electronic components, and then the coating layer is filled in this space, so that the electronic components The surface is uniformly covered with a cladding layer of a specific thickness. In another embodiment, by directly planning the thickness of the motor during injection molding, the cladding layer is directly molded on the circuit board, and the third surface is protruded or recessed corresponding to the position and height of the electronic components , so that the surface of the electronic component is uniformly covered with a cladding layer of a specific thickness, and at the same time, the cladding layer is conformal to the electronic component (that is, the shape of the third surface of the cladding layer is consistent with the shape of the electronic component). Using the aforementioned two implementations, the cladding layer can be kept at a uniform specific thickness, and this specific thickness is lighter and thinner than the previous technology, thereby avoiding internal stress caused by uneven thickness, and preventing electronic components from falling off, fan failures, etc. . In addition, through the pretreatment process of the circuit board or motor, the adhesion between the electronic components and the circuit board is enhanced, and the structural strength is enhanced. Therefore, the fan of the present invention not only achieves the purpose of waterproofing and dustproofing, but also improves the temperature tolerance of the fan, and at the same time, due to the thickness planning of the different positions and heights of the electronic components, the situation of falling off of electronic components and fan failures is further reduced. , and prolong the service life of the fan.
附图说明Description of drawings
图1为传统风扇的剖面结构示意图。FIG. 1 is a schematic cross-sectional structure diagram of a conventional fan.
图2为本发明较佳实施例的风扇的分解结构示意图。Fig. 2 is a schematic diagram of the exploded structure of the fan according to the preferred embodiment of the present invention.
图3为图2所示的风扇的定子及电路板的结构示意图。FIG. 3 is a structural schematic diagram of the stator and the circuit board of the fan shown in FIG. 2 .
图4为图2所示的风扇的扇框的结构示意图。FIG. 4 is a schematic structural diagram of a fan frame of the fan shown in FIG. 2 .
图5为图2所示的风扇的剖面结构示意图。FIG. 5 is a schematic cross-sectional structure diagram of the fan shown in FIG. 2 .
图6为图5所示的风扇的局部放大示意图。FIG. 6 is a partially enlarged schematic view of the fan shown in FIG. 5 .
图7为本发明另一较佳实施例的风扇的分解结构示意图。FIG. 7 is a schematic diagram of an exploded structure of a fan according to another preferred embodiment of the present invention.
图8为图7的风扇的另一分解结构示意图。FIG. 8 is a schematic diagram of another exploded structure of the fan shown in FIG. 7 .
其中,附图标记:Among them, reference signs:
1、2、3:风扇1, 2, 3: Fan
10、22、32:叶轮10, 22, 32: impeller
11、23、33:转子11, 23, 33: rotor
12、24、34:定子12, 24, 34: Stator
13、25、35:轴承单元13, 25, 35: bearing unit
14、20、30:扇框14, 20, 30: fan frame
15、28、38:马达基座15, 28, 38: Motor base
151:内表面151: inner surface
16、26、36:电路板16, 26, 36: circuit board
160、260、360:电子元件160, 260, 360: electronic components
161:表面161: surface
261、361:第一表面261, 361: first surface
17:填充剂17: filler
21、31:马达21, 31: motor
221:轮毂221: hub
222:叶片222: blade
231:金属壳231: metal shell
232:磁铁232: magnet
241:定子座241: Stator seat
242:线圈242: Coil
243:扣合元件243: Fastening elements
250:转轴250: shaft
251:轴承套251: Bearing sleeve
252:轴承252: Bearing
260a:底部填充剂260a: Underfill
27、37:包覆层27, 37: cladding layer
281:环形壁281: Annular Wall
282:容置空间282: Accommodating Space
283、383:第二表面283, 383: second surface
283a:凹部283a: Recess
283b:凸部283b: Convex part
284:开口284: opening
330:顶面330: top surface
330a:通孔330a: through hole
370:第三表面370: Third Surface
370a:凹陷部370a: depressed part
370b:凸出部370b: Protrusion
h1:高度h1: height
w1、w2:宽度w1, w2: width
t:特定厚度t: specific thickness
具体实施方式Detailed ways
体现本发明特征与优点的一些典型实施例将在后段的说明中详细叙述。应理解的是本发明能够在不同的态样上具有各种的变化,其皆不脱离本发明的范围,且其中的说明及附图在本质上当作说明之用,而非限制本发明。Some typical embodiments embodying the features and advantages of the present invention will be described in detail in the description in the following paragraphs. It should be understood that the present invention can have various changes in different aspects without departing from the scope of the present invention, and the description and drawings therein are used for illustration in nature rather than limiting the present invention.
图2为本发明较佳实施例的风扇的分解结构示意图。图3为图2所示的风扇的定子及电路板的结构示意图。图4为图2所示的风扇的扇框的结构示意图。图5为图2所示的风扇的剖面结构示意图。图6为图5所示的风扇的局部放大示意图。如图2所示,本发明第一较佳实施例的风扇2包括扇框20、马达21、叶轮22、电路板26及包覆层27(如图5所示),其中扇框20的中心位置处设有马达基座28(如图4所示)。马达21装设于马达基座28上,且由转子23、定子24及轴承单元25共同构成。定子24环绕于轴承单元25而设置,而转子23则对应套设于定子24及轴承单元25上。轴承单元25还具有转轴250,转轴250连接至叶轮22的中心部位,以使叶轮22装设于马达21上。通过马达21的运作,进而驱动转子23及叶轮22转动。电路板26套设于定子24和马达基座28之间,且电路板26的第一表面261(即面对马达基座28的表面)上具有多个电子元件260。如图5及图6所示,本实施例的风扇2中还包括包覆层27,其包覆定子24及电路板26,以使电路板26的第一表面261上的多个电子元件260上均匀布设一特定厚度t的包覆层27。Fig. 2 is a schematic diagram of the exploded structure of the fan according to the preferred embodiment of the present invention. FIG. 3 is a structural schematic diagram of the stator and the circuit board of the fan shown in FIG. 2 . FIG. 4 is a schematic structural diagram of a fan frame of the fan shown in FIG. 2 . FIG. 5 is a schematic cross-sectional structure diagram of the fan shown in FIG. 2 . FIG. 6 is a partially enlarged schematic view of the fan shown in FIG. 5 . As shown in Figure 2, the
请同时参阅图2、图3及图5。如图2所示,于本实施例中,叶轮22包括轮毂221和多个叶片222。叶片222围绕轮毂221的外周缘而设置。于一些实施例中,叶片222和轮毂221可为但不限为一体成型的结构,且其可由射出成型的制程所制成。如图2及图5所示,转子23包括金属壳231和多个磁铁232。磁铁232安装在金属壳231的侧壁的内表面上并面向定子24。如图3所示,定子24包括定子座241和至少一个线圈242。定子座241上还包括至少一个扣合元件243。以及,电路板26包括第一表面261和多个电子元件260,其中多个电子元件260布设于第一表面261上。于本实施例中,电路板26为中空环状的板状结构,其被套设于定子24的定子座241的下部,并通过定子座241上的扣合元件243以固定设置于定子座241上。Please refer to Figure 2, Figure 3 and Figure 5 at the same time. As shown in FIG. 2 , in this embodiment, the
于一些实施例中,电路板26可进行一预处理程序,以增强电子元件260与电路板26之间的附着力。该预处理程序可为但不限为将电路板26浸泡防潮胶、进行纳米镀层、或是于电子元件260底部填充一底部填充剂260a。如图3所示,本实施例将底部填充剂260a应用于电路板26的第一表面261上,且将其涂布于电子元件260的底部,以增强电子元件260和电路板26之间的黏着力。然此处所为的预处理程序可依照实际施作情形而任施变化,并不以本发明所示范的底部填充剂260a为限。于另一些实施例中,底部填充剂260a的材料可为但不限为环氧树脂。In some embodiments, the
请续参阅图2、图4及图5。如图4所示,扇框20为一镂空的框架结构,且其中心位置设有一马达基座28。马达基座28包括环形壁281、容置空间282和第二表面283(即面对电路板26的表面),其中容置空间282由环形壁281所限定,且第二表面283为环形壁281的底表面。于本实施例中,马达基座28包含多个凹部283a和多个凸部283b,且其形成于马达基座28的第二表面283上。由于此等高低不平的凹部283a及凸部283b等结构,使得马达基座28的第二表面283构成阶梯状的表面,但不以此为限。于一些实施例中,多个凹部283a与多个凸部283b可彼此交错设置,即,凹部283a可跨设于凸部283b之间,但不以此为限。其中,该等多个凹部283a及凸部283b设置的位置及高度均为通过一肉厚规划以预先设计之。具体而言,该马达基座28的肉厚规划依据电路板26的第一表面261上相对应的电子元件260的位置及高度以进行规划设计。以及,马达基座28还具有多个开口284,该开口284贯穿马达基座28,以使容置空间282与外界相连通。于另一些实施例中,扇框20可通过射出成型的制程以制成,但不以此为限。Please continue to refer to FIG. 2 , FIG. 4 and FIG. 5 . As shown in FIG. 4 , the
请同时参阅图2及图5,如图所示,轴承单元25包括轴承套251、轴承252以及转轴250,转轴250连接至叶轮22的中心部位。轴承套251与马达基座28连接并且位于马达基座28的中央部分。轴承252容纳在轴承套251内,转轴250穿过轴承251。定子24围绕轴承套251的外周缘而设置,且固定至轴承套251上。扇框20布设在风扇2的外部,且围绕叶轮22、转子23、定子24及轴承单元25。电路板26固定在定子24的底部,并套设于定子24和马达基座28之间。由图5可见,当风扇2的叶轮22、转子21、定子22、轴承单元23和扇框20组装完成后,电路板26对应设置于马达基座28的容置空间282中,且电路板26的第一表面261与马达基座28的第二表面283相面对。此时,以本实施例为例,将一填充材料由马达基座28的开口284填充至风扇2中,该填充材料会填满与开口284相连通的容置空间282,进而包覆定子24及电路板26,进而固化以形成本发明具有特定厚度的包覆层27,以保护定子24和电路板26免受外部液体和灰尘的侵蚀,并达到防水防尘的目的。Please refer to FIG. 2 and FIG. 5 at the same time. As shown in the figure, the bearing
于一些实施例中,包覆层27的填充材料可为但不限为具流动性的胶体,例如其可为一防水材料,且此防水材料可为但不限为环氧树脂、硅树脂或聚氨酯。于另一些实施例中,包覆层27的固化方法可为在低温下快速冷却该填充材料、或是在高温下加热来固化填充材料,且此包覆层27的固化方法可据实际施作情形而任施变化,并不以此为限。In some embodiments, the filling material of the
请同时参阅图5及图6。如图所示,由于马达基座28面对于电路板26的第二表面283上布设多个凹部283a及凸部283b,故其呈现不平坦、阶梯状的表面。然如前所述,马达基座28的第二表面283的肉厚规划依据电路板26的第一表面261上的电子元件260的位置及高度而进行相对应的规划设计。也就是,由图6可见,设置于电路板26的第一表面261上的电子元件260所对应的马达基座28的第二表面283处均设置有相对应的凹部283a,其中,多个凹部283a的位置及深度与多个电子元件260的位置及高度相对应,即使电子元件260的表面与凹部283a的表面维持一特定厚度t。于本实施例中,凹部283a的宽度w2大于电子元件260的宽度w1,如此可以使得电子元件260的左右两侧均具有一溢胶空间,用以供填充材料流入凹部283a中。于一些实施例中,该溢胶空间的宽度介于1.0mm至1.5mm之间,但不以此为限。于另一实施例中,凹部283a的其中之一可以对应多个具有相同高度的电子元件260。Please refer to Figure 5 and Figure 6 at the same time. As shown in the figure, since the
以及,如图所示,通过本发明的马达基座28的肉厚规划,使电子元件260的表面与马达基座28的凹部283a的表面维持一特定厚度t;换言之,此特定厚度t即为由电子元件260的表面至凹部283a的表面之间的距离所定义。因而,当填充材料自电子元件260两侧预留的溢胶空间流入凹部283a中,且固化形成包覆层27后,包覆层27可以特定厚度t均匀地包覆于多个电子元件260之上,即每一电子元件260上均覆盖厚度均匀的包覆层27,进而可避免因其厚度不均匀而产生的内部应力拉扯电子元件260,导致电子元件260松动、脱落等问题。于一些实施例中,此特定厚度t介于0.8mm至2mm之间的范围内,但不以此为限。借此,包覆层27不仅可达到保护电路板26、防水防尘的功效,同时通过本发明的马达基座28的第二表面283的肉厚规划,进而使其与电子元件260的表面维持均匀的特定厚度t,且此特定厚度t相较于习知技术的固定厚度较为轻薄,进而可避免由热膨胀和收缩产生的内部应力,使得电子元件260从电路板26上脱落而损坏、并导致风扇2故障等问题。And, as shown in the figure, through the thickness planning of the
请参阅图7及图8。图7本发明另一较佳实施例的风扇的分解结构示意图。图8为图7的风扇的另一分解结构示意图。如图所示,本实施例的风扇3同样包括扇框30、马达31、叶轮32、电路板36及包覆层37(如图8所示),其中马达31由转子33、定子34及轴承单元35共同构成,以及电路板36的第一表面361上同样布设有多个电子元件360。于此实施例中,叶轮32、定子34、轴承单元35及电路板36的细部结构及设置位置均与前述实施例相同,故于此不再赘述。于本实施例中,其与前述实施例的差别在于本实施例针对电路板36的第一表面361上的电子元件360的肉厚规划与前述实施例不同。换言之,本实施例的肉厚规划并非设置于扇框30的马达基座38上。而是于马达31组装完成后,直接将马达31进行低压射出成型,使包覆层37直接成型于马达31上,并包覆定子34及电路板36。也就是,本实施例在马达31于射出成型时直接进行一肉厚规划。以及,于本实施例中,转子33的顶面330上具有多个通孔330a,此通孔330a用以使马达31于填入填充材料时可维持通气的作用,进而可降低电路板36上方的应力,以避免困气。再者,如图8所示,本实施例的风扇3为将填充材料填入马达31内部后,再通过射出成型的制程以制成具备肉厚规划的马达31。如图所示,包覆层37包覆电路板36的第一表面361及其上的电子元件360,以及,包覆层37的第三表面370(即面对马达基座38的表面)为不平整、阶梯状的表面,其上布设多个凹陷部370a及凸出部370b,且此多个凹陷部370a及凸出部370b均为对应于电子元件360的位置及高度而设置。换言之,于本实施例中,当马达31进行射出成型时,即已进行电子元件360的肉厚规划,故其成型后的包覆层37具有不平整的阶梯状表面,且其仍是维持在多个电子元件360上均匀设置特定厚度t的包覆层37。当然,与前述实施例相同,特定厚度t介于0.8mm至2mm之间的范围内,但不以此为限。且为了使电子元件360周边不产生拉扯的内部应力,其周边亦具有与前述实施例相仿的溢胶空间的宽度,且此宽度亦介于1.0mm至1.5mm之间,但不以此为限。Please refer to Figure 7 and Figure 8. Fig. 7 is a schematic exploded structure diagram of a fan according to another preferred embodiment of the present invention. FIG. 8 is a schematic diagram of another exploded structure of the fan shown in FIG. 7 . As shown in the figure, the
又于本实施例中,马达31也可进行预处理程序,且该预处理程序同样可为但不限为浸泡防潮胶、进行纳米镀层、或是于电子元件360底部填充一底部填充剂,以增强电子元件360与电路板36之间的附着力,且不以此为限。Also in this embodiment, the
综上所述,本发明提供了一种风扇,其中针对电子元件设置的位置及高度进行肉厚规划。于一实施例中,通过于扇框的马达基座进行肉厚规划,使其第二表面对应于电子元件的位置及高度对应凹陷,进而于此空间填充设置包覆层,以使电子元件的表面均匀覆盖一特定厚度的包覆层。于另一实施例中,通过于马达射出成型时直接进行肉厚规划,使包覆层直接成型包覆于电路板上,并使其第三表面对应于电子元件的位置及高度凸出或凹陷,进而使电子元件的表面均匀覆盖一特定厚度的包覆层,同时使包覆层共形于电子元件(即包覆层的第三表面的外形与电子元件的外形一致)。借前述两实施态样使包覆层保持均匀的特定厚度,且此特定厚度相较于先前技术更为轻薄,进而可避免厚度不均匀产生的内部应力,并防止电子元件脱落、风扇故障等问题。此外,通过对电路板或是马达进行的预处理程序,以增强电子元件与电路板之间的附着力,并增强了结构强度。因此,本发明的风扇不仅达到了防水防尘的目的、提高了风扇的温度承受能力,同时由于其针对电子元件的不同位置及高度进行了肉厚规划,进而减少电子元件脱落、风扇故障等情形,并延长风扇的使用寿命。To sum up, the present invention provides a fan, in which the meat thickness is planned for the position and height of the electronic components. In one embodiment, by planning the thickness of the motor base of the fan frame, the second surface is corresponding to the position and height of the electronic components, and then the coating layer is filled in this space, so that the electronic components The surface is uniformly covered with a cladding layer of a specific thickness. In another embodiment, by directly planning the thickness of the motor during injection molding, the cladding layer is directly molded on the circuit board, and the third surface is protruded or recessed corresponding to the position and height of the electronic components , so that the surface of the electronic component is uniformly covered with a cladding layer of a specific thickness, and at the same time, the cladding layer is conformal to the electronic component (that is, the shape of the third surface of the cladding layer is consistent with the shape of the electronic component). Using the aforementioned two implementations, the cladding layer can be kept at a uniform specific thickness, and this specific thickness is lighter and thinner than the previous technology, thereby avoiding internal stress caused by uneven thickness, and preventing electronic components from falling off, fan failures, etc. . In addition, through the pretreatment process of the circuit board or motor, the adhesion between the electronic components and the circuit board is enhanced, and the structural strength is enhanced. Therefore, the fan of the present invention not only achieves the purpose of waterproofing and dustproofing, but also improves the temperature tolerance of the fan, and at the same time, due to the thickness planning of the different positions and heights of the electronic components, the situation of falling off of electronic components and fan failures is further reduced. , and prolong the service life of the fan.
当然,本发明还可有其它多种实施例,在不背离本发明精神及其实质的情况下,熟悉本领域的技术人员当可根据本发明作出各种相应的改变和变形,但这些相应的改变和变形都应属于本发明所附的权利要求书所界定的保护范围。Certainly, the present invention also can have other multiple embodiments, without departing from the spirit and essence of the present invention, those skilled in the art can make various corresponding changes and deformations according to the present invention, but these corresponding Changes and deformations should belong to the scope of protection defined by the appended claims of the present invention.
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US16/908,163 US12098726B2 (en) | 2019-11-08 | 2020-06-22 | Fan |
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US5264748A (en) * | 1990-05-24 | 1993-11-23 | Matsushita Electric Industrial Co., Ltd. | Axial-flow fan motor |
JP4108488B2 (en) * | 2003-01-17 | 2008-06-25 | 山洋電気株式会社 | Waterproof brushless fan motor |
TW200835120A (en) * | 2007-02-02 | 2008-08-16 | Yen Sun Technology Corp | Waterproof motor stator and method of making the same |
TW200928107A (en) * | 2007-12-19 | 2009-07-01 | Delta Electronics Inc | Fan and stator base thereof |
US8912252B2 (en) * | 2010-07-20 | 2014-12-16 | Silberline Manufacturing Company, Inc. | Film-forming pigments and coating system including the same |
CN202118000U (en) * | 2010-11-23 | 2012-01-18 | 奇鋐科技股份有限公司 | Motor cooling structure and fan device with waterproof and dustproof functions |
DE102015216335A1 (en) * | 2015-08-26 | 2017-03-02 | Mahle International Gmbh | Fan for a radiator assembly |
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