CN112768420A - Heat radiation structure, signal board subassembly and communication equipment - Google Patents
Heat radiation structure, signal board subassembly and communication equipment Download PDFInfo
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- CN112768420A CN112768420A CN201911065624.0A CN201911065624A CN112768420A CN 112768420 A CN112768420 A CN 112768420A CN 201911065624 A CN201911065624 A CN 201911065624A CN 112768420 A CN112768420 A CN 112768420A
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- 238000004891 communication Methods 0.000 title claims abstract description 26
- 230000005855 radiation Effects 0.000 title description 5
- 230000017525 heat dissipation Effects 0.000 claims abstract description 84
- 239000012530 fluid Substances 0.000 claims abstract description 22
- 230000005540 biological transmission Effects 0.000 claims abstract description 13
- 239000013529 heat transfer fluid Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 239000000758 substrate Substances 0.000 description 17
- 238000012546 transfer Methods 0.000 description 7
- 239000003921 oil Substances 0.000 description 5
- 235000019198 oils Nutrition 0.000 description 5
- 238000010586 diagram Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000009471 action Effects 0.000 description 1
- 150000004996 alkyl benzenes Chemical class 0.000 description 1
- -1 alkyl naphthalene Chemical compound 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- ZCILODAAHLISPY-UHFFFAOYSA-N biphenyl ether Natural products C1=C(CC=C)C(O)=CC(OC=2C(=CC(CC=C)=CC=2)O)=C1 ZCILODAAHLISPY-UHFFFAOYSA-N 0.000 description 1
- 230000008859 change Effects 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000000265 homogenisation Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- UFWIBTONFRDIAS-UHFFFAOYSA-N naphthalene-acid Natural products C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明实施例提供了一种用于通信设备的散热结构、信号板组件和通信设备。散热结构包括：多个散热器，所述散热器包括：基底和设置在所述基底上的散热件，所述基底用于设置在所述通信设备的待冷却件上，至少两个所述散热器的基底内设置有流道，所述至少两个散热器的流道通过传输管路连通，以在所述散热结构内形成闭环的循环流道，所述循环流道用于容纳导热流体。本发明实施例的散热结构可以适用于布局复杂的信号板，以对布局复杂的信号板进行均温和散热。
Embodiments of the present invention provide a heat dissipation structure for a communication device, a signal board assembly, and a communication device. The heat dissipation structure includes: a plurality of heat sinks, the heat sinks include: a base and a heat sink disposed on the base, the base is used to be disposed on the to-be-cooled part of the communication device, at least two of the heat sinks A flow channel is arranged in the base of the radiator, and the flow channels of the at least two radiators are communicated through a transmission pipeline to form a closed-loop circulating flow channel in the heat dissipation structure, and the circulating flow channel is used for accommodating heat-conducting fluid. The heat dissipation structure of the embodiment of the present invention can be applied to a signal board with a complex layout, so as to perform uniformity and heat dissipation on the signal board with a complex layout.
Description
Technical Field
The invention relates to the field of communication equipment, in particular to a heat dissipation structure for communication equipment, a signal board assembly and the communication equipment.
Background
With the development of the communication field, the power consumption of chips is increasing day by day, and the heat dissipation area of some areas is limited due to the limitation of the space of a signal board (such as a single board), so that the heat dissipation requirement of high-density chips cannot be met more and more by the design of a common air-cooled radiator. In some scenes, the plurality of high-power chips have uneven temperature due to different heat dissipation environments, so that the heat dissipation difficulty is further increased. At present, heat pipes are mainly used for carrying out temperature equalization among different chips, and a radiator is used for increasing the radiating area for radiating heat. However, the heat pipe can only be used for the signal plate with a simple layout, and for the signal plate with a complex layout, the heat pipe is difficult to arrange, so that the temperature equalization effect is influenced.
Disclosure of Invention
In order to solve the above technical problems, embodiments of the present invention provide a heat dissipation structure, a signal board assembly, and a communication device, so that the heat dissipation structure can be applied to a signal board with a complex layout, thereby performing temperature equalization and heat dissipation on the signal board with the complex layout.
In a first aspect, an embodiment of the present invention provides a heat dissipation structure for a communication device, including: a plurality of heat sinks, the heat sinks comprising: the heat dissipation structure comprises a substrate and a heat dissipation piece arranged on the substrate, wherein the substrate is used for being arranged on a piece to be cooled of the communication equipment, flow channels are arranged in the substrates of at least two heat radiators, the flow channels of the at least two heat radiators are communicated through a transmission pipeline so as to form a closed-loop circulation flow channel in the heat dissipation structure, and the circulation flow channel is used for containing heat conduction fluid.
Optionally, the base of each heat sink is provided with the flow channel, and the flow channels of all the heat sinks are communicated with each other through the transmission pipeline to form the circulation flow channel.
Optionally, the heat dissipation structure comprises the thermally conductive fluid.
Optionally, the heat dissipation structure further includes: the power source is provided with an inlet and an outlet, the inlet and the outlet of the power source are communicated with the transmission pipeline, and the power source is used for driving the fluid in the circulating flow channel to flow.
Optionally, the power source comprises: a micropump.
Optionally, the heat dissipation member is a heat dissipation fin.
Optionally, the heat transfer fluid comprises: any one of water, fluorinated liquid and heat conducting oil.
In a second aspect, an embodiment of the present invention provides a signal plate assembly, including: the signal plate and the heat radiation structure arranged on the signal plate are arranged, and the heat radiation structure is the heat radiation structure.
Optionally, a chip is disposed on the signal board, and at least one of the heat sinks is disposed on the chip.
Optionally, the signal board has a free area, the chip is located outside the free area, and at least one of the heat sinks is disposed in the free area.
Optionally, at least one first chip and at least one second chip are arranged on the signal board, and the power consumption of the first chip is greater than that of the second chip;
the heat sink is disposed on each of the first chip and the second chip.
In a third aspect, an embodiment of the present invention provides a communication device, including the signal board assembly described above.
In the heat dissipation structure, the signal board assembly and the communication device provided by the embodiment of the invention, the substrate temperatures of the two radiators in which the circulating flow channel is located are homogenized through the circulating flow of the heat-conducting fluid in the circulating flow channel, so that the temperatures of different positions on the signal board are homogenized. The mode of this kind of samming only need the fluid flow in the runner can, the runner in transmission line and the basement all need not to reach the linear state, but can buckle according to the overall arrangement of device on the signal plate to can be applicable to the complicated signal plate of overall arrangement, carry out samming and heat dissipation to the complicated signal plate of overall arrangement.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram of a heat pipe epitaxial heat sink on a signal board in the prior art;
fig. 2 is a top view of a heat dissipation structure and a signal board provided in an embodiment of the invention;
FIG. 3 is a left side view of the heat dissipation structure and the signal board according to the embodiment of the present invention;
FIG. 4 is a second left side view of the heat dissipation structure and the signal board according to the embodiment of the present invention;
fig. 5 is a schematic view of an arrangement of an existing heat dissipation structure and a heat dissipation structure of the present invention in some application scenarios.
Detailed Description
The following detailed description of embodiments of the invention refers to the accompanying drawings. It should be understood that the detailed description and specific examples, while indicating the present invention, are given by way of illustration and explanation only, not limitation.
Fig. 1 is a schematic diagram of a heat pipe epitaxial heat sink on a signal plate in the prior art, and as shown in fig. 1, a plurality of heat sinks 11 are arranged on the signal plate 10, and a heat pipe 12/13 is arranged between adjacent heat sinks 11. The capillary structure is arranged in the heat pipe 12, and the principle of utilizing the heat pipe 12/13 to carry out temperature equalization is as follows: when the temperature of one end of the heat pipe 12/13 rises, the working medium in the pipe is gasified and condensed at the other end, and then returns to the original position under the capillary force action of the capillary structure, thereby realizing temperature homogenization. To ensure proper operation of the heat pipe 12/13, the heat pipe 12/13 is disposed on the signal plate 10 in a generally horizontal, vertical manner. When the layout on the signal plate 10 is complicated, it is difficult to arrange the heat pipe 12/13.
As an aspect of the present invention, the present invention provides a heat dissipation structure for a communication device, fig. 2 is a top view of the heat dissipation structure and a signal board located therein according to an embodiment of the present invention, and fig. 3 is one of a left side view of the heat dissipation structure and the signal board located therein according to the embodiment of the present invention; fig. 4 is a second left view of the heat dissipation structure and the signal board according to the embodiment of the invention. As shown in fig. 2 and 3, the heat dissipation structure is disposed on a to-be-cooled member of the communication device, wherein the to-be-cooled member may be a signal plate 20 (e.g., a single plate). The heat dissipation structure includes a plurality of heat sinks 21, and the heat sinks 21 include: the heat sink comprises a substrate 211 and a heat sink 212 arranged on the substrate 211, wherein the substrate 211 is used for being arranged on a to-be-cooled element of the communication equipment, flow channels (not shown) are arranged in the substrates 211 of at least two heat sinks 21, and the flow channels of at least two heat sinks 21 are communicated through hollow transmission pipelines 22 so as to form a closed-loop circulating flow channel in a heat dissipation structure. The circulating flow channel is used for containing flowing heat-conducting fluid.
It should be understood that the heat transfer fluid flows in the circulation flow path without a change in phase thereof.
In the embodiment of the present invention, the temperature of the substrates 211 of the two heat sinks 21 in which the circulation flow channel is located is uniformed by the circulation flow of the heat transfer fluid in the circulation flow channel, so that the temperatures of different positions on the signal plate 20 are uniformed. The temperature equalization method only needs fluid to flow in the flow channel, and the flow channels in the transmission pipeline 22 and the substrate 211 do not need to reach a linear state, but can be bent according to the layout of devices on the signal plate 20, so that the temperature equalization method can be applied to the signal plate 20 with a complex layout.
Wherein the heat dissipation structure may include a heat dissipation fluid. Alternatively, the heat transfer fluid may be a liquid. Specifically, the heat transfer fluid may include: water, a fluorinated liquid (e.g., 3M Novec 7100 electronic fluorinated liquid), a thermal oil (e.g., alkylbenzene type thermal oil, alkyl naphthalene type thermal oil, biphenyl and biphenyl ether low-melting mixture type thermal oil, etc.). Of course, other fluids capable of flowing and conducting heat may be used as the heat-conducting fluid.
The heat sink 21 is an air-cooled heat sink, and the heat sink 212 of the heat sink 21 may be a heat dissipating fin that contacts with the outside air to dissipate heat.
The processing manner and shape layout of the flow channel in the substrate 211 are not particularly limited as long as the flow channel and the transmission pipeline 22 can form a circulation flow channel, and the fluid in the circulation flow channel can flow through the substrate 211 and exchange heat with the substrate 211. The flow channels in the substrate 211 may be formed using a buried tube, milled flow channels, micro-channels, machining, and the like.
In order to improve the temperature uniformity at different positions of the signal plate 20, in one embodiment, a flow channel is disposed in the base 211 of each heat sink 21, as shown in fig. 2, the flow channels of all the heat sinks 21 are communicated with each other through a transmission pipeline 22 to form a closed circulation flow channel, so as to improve the overall temperature uniformity of the signal plate 20.
Wherein, a chip may be disposed on the signal plate 20, and a heat sink 21 may be disposed on the chip, thereby dissipating heat from the chip. As shown in fig. 2 and 3, the heat dissipation area a1 includes a plurality of first chips 26 with high power consumption, and the plurality of first chips 26 are arranged along the air duct direction. If heat dissipation is performed only by means of the heat sink 21 in the heat dissipation area a1, it is difficult to control the temperature of the first chip 26 in the case where the heat dissipation area is limited and thermal cascade exists; since the heat dissipation area a2 has available heat dissipation space, the flow paths of the heat sinks 21 are communicated with each other through the transfer pipes 22, so that part of the heat in the heat dissipation area a1 can be transferred to the heat dissipation area a2, and the heat sinks 21 in the heat dissipation area a2 can be used for auxiliary heat dissipation. On the other hand, the fluid flows and the substrate 211 of the plurality of radiators 21 is equalized, so that the problem of uneven chip temperature caused by thermal cascade or power consumption difference is solved.
As shown in fig. 3, the heat dissipation area a2 may also have a second chip 25 with low power consumption, and the heat sink 21 in the heat dissipation area a2 may be disposed on the second chip 25; of course, as shown in fig. 4, the heat sink 21 in the heat dissipation area a2 may be directly disposed on the signal board 20 without disposing a chip in the heat dissipation area a 2.
In order to enable the fluid in the circulation flow channel to circulate, as shown in fig. 2 and 3, the heat dissipation structure further includes: a power source 23, the power source 23 having an inlet and an outlet, the inlet and the outlet of the power source 23 both being in communication with the transfer line 22.
Wherein, the transmission pipeline 22 can be directly installed on the power source 23 and directly communicated with the inlet and the outlet of the power source 23; or may communicate with the inlet and outlet of power source 23 via connection 24.
The embodiment of the present invention does not limit the specific form of the power source 23, as long as it can provide power for the flow of the fluid. In one embodiment of the present invention, the power source 23 is a micro pump.
With the heat dissipation structure in fig. 1, since the heat pipe has a limited heat transfer distance, when the distance between the two heat sinks 11 is long, the heat pipe 13 between the two heat sinks cannot effectively conduct heat uniformly between the two heat sinks 11. In the present invention, under the driving of the power source 23, the heat-conducting fluid can be transmitted in the circulating flow channel for a long distance, so as to ensure the heat-conducting effect and improve the uniformity of the temperature at different positions on the signal plate 20.
Fig. 5 is a schematic view of an existing heat dissipation structure and an arrangement of the heat dissipation structure of the present invention in some application scenarios, as shown in fig. 5, in some application scenarios, the signal plate 10 and the signal plate 20 are arranged upright in the communication device, and the air duct direction (shown by an arrow in the figure) of the position where the signal plate 10 and the signal plate 20 are located is from bottom to top. In this application scenario, for the heat dissipation structure in the prior art (right diagram in fig. 5), the upper portion of the heat pipe 12 is a high temperature region (evaporation region), and the lower portion thereof is a low temperature region (condensation region), and when the working medium returns to the upper portion of the heat pipe 12 after being condensed, gravity needs to be overcome, thereby causing deterioration of heat transfer performance. For the heat dissipation structure in the embodiment of the present invention, the power source 23 provides a driving force to ensure the heat transfer fluid to circularly flow in the circulation flow channel, so that the heat dissipation structure is not limited by the application scenario.
As another aspect of the present invention, there is provided a signal board assembly, as shown in fig. 2 to 4, including a signal board 20 and a heat dissipation structure provided on the signal board 20, the heat dissipation structure being the above-described heat dissipation structure.
Wherein a chip may be disposed on the signal plate 20, and at least one heat sink 21 is disposed on the chip. The number of the chips can be multiple, in this case, the heat sink can be arranged on only one of the chips; a heat sink may also be provided on each chip. When the heat radiator is arranged on the chip, the number of the heat radiators on the chip is one.
Specifically, at least one first chip 26 and at least one second chip 25 may be disposed on the signal board 20, wherein the power consumption of the first chip 26 is greater than that of the second chip, that is, the first chip 26 is a high power consumption chip, and the second chip 25 is a low power consumption chip.
In a specific embodiment, as shown in fig. 2 and 3, a plurality of first chips 26 are disposed in the heat dissipation area a1, and a plurality of second chips 25 are disposed in the heat dissipation area a 2; each of the first chip 26 and the second chip 25 is provided with a heat sink 21, so that heat in a high heat region is transferred to a low heat region through a heat dissipation structure, thereby realizing heat transfer. Wherein the heat sink 21 may be mounted on the first chip 26/the second chip 25 by means of an interface material.
In another embodiment, the signal plate 20 has a free area, which is an area where no chip is disposed on the signal plate 20. I.e. the chip is located outside the free area. At least one heat sink 21 is provided in the vacant area. Specifically, as shown in fig. 2 and 4, the heat sink in the heat dissipation area a1 is mounted on the first chip 26 through an interface material, the chip is not disposed in the heat dissipation area a2 (i.e., the vacant area), and the heat sink 21 in the heat dissipation area a2 is directly disposed on the back plate 20. This way, the heat in the high heat area can be transferred to the vacant area, and the space on the signal plate 20 is fully utilized to realize the heat transfer.
As a further aspect of the present invention, a communication device is provided, which includes the signal board assembly provided in the embodiment of the present invention. The communication device may be a router or the like.
As can be seen from the above description of the heat dissipation structure, the signal board assembly, and the communication device provided in the embodiment of the present invention, in the heat dissipation structure provided in the embodiment of the present invention, the heat-conducting fluid flows in the circulation channel to perform temperature balance on different areas of the signal board, and this heat-conducting manner has no requirement on the shape of the circulation channel, so that the heat dissipation structure is no longer affected by the space of the signal board, and the heat dissipation problem of the high heat flux chip is solved. And the heat conducting fluid flows among the substrates of the radiators, so that the temperatures of the radiators are balanced, and the temperature of the chip with the highest temperature is effectively reduced. In addition, the heat-conducting fluid can flow in a long distance by the driving of the power source, so that the disadvantages of long heat transmission distance and influence of scenes in the prior art are solved, and the adaptability is good; and the space on the signal plate can be fully utilized to realize heat transfer. Therefore, the signal board assembly with the heat dissipation structure and the communication equipment can achieve a good heat dissipation effect.
It will be understood that the above embodiments are merely exemplary embodiments taken to illustrate the principles of the present invention, which is not limited thereto. It will be apparent to those skilled in the art that various modifications and improvements can be made without departing from the spirit and substance of the invention, and these modifications and improvements are also considered to be within the scope of the invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911065624.0A CN112768420A (en) | 2019-11-04 | 2019-11-04 | Heat radiation structure, signal board subassembly and communication equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201911065624.0A CN112768420A (en) | 2019-11-04 | 2019-11-04 | Heat radiation structure, signal board subassembly and communication equipment |
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| Publication Number | Publication Date |
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| CN112768420A true CN112768420A (en) | 2021-05-07 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201911065624.0A Pending CN112768420A (en) | 2019-11-04 | 2019-11-04 | Heat radiation structure, signal board subassembly and communication equipment |
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Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101796635A (en) * | 2007-09-07 | 2010-08-04 | 国际商业机器公司 | Method and apparatus for cooling heat-generating components |
| CN103676033A (en) * | 2012-09-03 | 2014-03-26 | 日立金属株式会社 | Communication module-cooling structure and communication device |
| US20160165755A1 (en) * | 2014-12-05 | 2016-06-09 | International Business Machines Corporation | Cooling structure for electronic boards |
| CN106158788A (en) * | 2015-04-28 | 2016-11-23 | 中兴通讯股份有限公司 | Liquid cooling heat radiator and electronic equipment |
| CN106470537A (en) * | 2015-08-14 | 2017-03-01 | 中兴通讯股份有限公司 | Veneer liquid cooling heat radiation system and rack |
| CN107105596A (en) * | 2016-02-23 | 2017-08-29 | 中兴通讯股份有限公司 | Radiating subassembly |
-
2019
- 2019-11-04 CN CN201911065624.0A patent/CN112768420A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101796635A (en) * | 2007-09-07 | 2010-08-04 | 国际商业机器公司 | Method and apparatus for cooling heat-generating components |
| CN103676033A (en) * | 2012-09-03 | 2014-03-26 | 日立金属株式会社 | Communication module-cooling structure and communication device |
| US20160165755A1 (en) * | 2014-12-05 | 2016-06-09 | International Business Machines Corporation | Cooling structure for electronic boards |
| CN106158788A (en) * | 2015-04-28 | 2016-11-23 | 中兴通讯股份有限公司 | Liquid cooling heat radiator and electronic equipment |
| CN106470537A (en) * | 2015-08-14 | 2017-03-01 | 中兴通讯股份有限公司 | Veneer liquid cooling heat radiation system and rack |
| CN107105596A (en) * | 2016-02-23 | 2017-08-29 | 中兴通讯股份有限公司 | Radiating subassembly |
Non-Patent Citations (1)
| Title |
|---|
| 刘一兵;: "计算机CPU芯片散热技术", 低温与超导, no. 06, 24 June 2008 (2008-06-24), pages 81 - 85 * |
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