CN112739037B - Manufacturing method of flexible circuit board with three copper thicknesses - Google Patents
Manufacturing method of flexible circuit board with three copper thicknesses Download PDFInfo
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- CN112739037B CN112739037B CN202011234496.0A CN202011234496A CN112739037B CN 112739037 B CN112739037 B CN 112739037B CN 202011234496 A CN202011234496 A CN 202011234496A CN 112739037 B CN112739037 B CN 112739037B
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 40
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 35
- 239000010949 copper Substances 0.000 title claims abstract description 35
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 25
- 239000000758 substrate Substances 0.000 claims abstract description 44
- 238000000034 method Methods 0.000 claims abstract description 32
- 238000009713 electroplating Methods 0.000 claims abstract description 18
- 238000011161 development Methods 0.000 claims abstract description 16
- 238000004140 cleaning Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 6
- 239000000126 substance Substances 0.000 claims abstract description 4
- 238000005520 cutting process Methods 0.000 claims abstract 4
- 238000013461 design Methods 0.000 claims description 14
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 claims description 6
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 claims description 6
- 238000001035 drying Methods 0.000 claims description 6
- 239000011889 copper foil Substances 0.000 claims description 5
- 238000005530 etching Methods 0.000 claims description 4
- 206010034972 Photosensitivity reaction Diseases 0.000 claims description 3
- 238000003486 chemical etching Methods 0.000 claims description 3
- 238000005553 drilling Methods 0.000 claims description 3
- 238000003475 lamination Methods 0.000 claims description 3
- 229920002120 photoresistant polymer Polymers 0.000 claims description 3
- 230000036211 photosensitivity Effects 0.000 claims description 3
- QPLDLSVMHZLSFG-UHFFFAOYSA-N Copper oxide Chemical compound [Cu]=O QPLDLSVMHZLSFG-UHFFFAOYSA-N 0.000 description 2
- 239000005751 Copper oxide Substances 0.000 description 2
- 239000002253 acid Substances 0.000 description 2
- 229910000431 copper oxide Inorganic materials 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 230000001681 protective effect Effects 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000010923 batch production Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/188—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by direct electroplating
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
本发明公开了一种三种铜厚柔性线路板制作方法，属于柔性电路板制作技术领域，包括以下步骤：S1、对柔性线路板的基板进行初步裁剪，进行开料；S2、对柔性线路板的基板进行钻孔；S3、对柔性线路板的基板进行整板电镀，在不同层间形成导电的通路，并实现柔性线路板的整体区域的铜厚；S4、对柔性线路板的基板进行化学清洗；S5、对柔性线路板的基板进行第一次压干膜处理；S6、对柔性线路板的基板进行第一次的曝光和显影处理。该柔性线路板制作方法，使用整板电镀、选择性电镀和选择性减铜搭配的制作方法实现，可以有效规避三种铜厚存在阶差问题，导致线路制作过程中出现压干膜不实现象，极大程度提升线路制作良率。
The invention discloses three kinds of copper-thick flexible circuit board manufacturing methods, belonging to the technical field of flexible circuit board manufacturing, comprising the following steps: S1. Preliminarily cutting and cutting the substrate of the flexible circuit board; S2. Drill holes on the substrate of the flexible circuit board; S3. Perform the whole board electroplating on the substrate of the flexible circuit board, form a conductive path between different layers, and realize the copper thickness of the overall area of the flexible circuit board; S4. Perform chemical treatment on the substrate of the flexible circuit board Cleaning; S5, performing a first dry film pressing process on the substrate of the flexible circuit board; S6, performing a first exposure and development process on the substrate of the flexible circuit board. The flexible circuit board manufacturing method is realized by using the manufacturing methods of whole board electroplating, selective electroplating and selective copper reduction, which can effectively avoid the problem of step difference in the three copper thicknesses, which leads to the phenomenon that the dry film cannot be realized during the circuit manufacturing process. , greatly improving the yield of circuit production.
Description
技术领域technical field
本发明属于柔性电路板制作技术领域，具体为一种三种铜厚柔性线路板制作方法。The invention belongs to the technical field of flexible circuit board manufacturing, in particular to a manufacturing method of three copper-thick flexible circuit boards.
背景技术Background technique
目前业界常规柔性线路板的铜厚是均一的，即一款产品仅一种铜厚要求；特殊产品因弯折需求，会以图形电镀的方式，形成两种铜厚，以此来满足产品要求。At present, the copper thickness of conventional flexible circuit boards in the industry is uniform, that is, a product has only one copper thickness requirement; due to the bending requirements of special products, two copper thicknesses will be formed by pattern electroplating to meet product requirements. .
随着产品的不断更新换代，快速发展，现有产品结构已经不能满足客户需求，经过研究及反复测试，开发出一种三种铜厚柔性线路板制作方法，满足客户的设计结构需求，可以根据客户对不同区域的铜厚要求，通过整板电镀、选择性电镀和选择性减铜搭配的制作方法实现。With the continuous upgrading and rapid development of products, the existing product structure can no longer meet the needs of customers. After research and repeated testing, three methods of manufacturing copper-thick flexible circuit boards have been developed to meet the design structure needs of customers. Customers' requirements for copper thickness in different areas are realized through the production methods of whole board electroplating, selective electroplating and selective copper reduction.
发明内容SUMMARY OF THE INVENTION
针对现有技术的不足，本发明提供了一种三种铜厚柔性线路板制作方法，以解决上述背景技术中提出的问题。In view of the deficiencies of the prior art, the present invention provides three manufacturing methods for copper-thick flexible circuit boards, so as to solve the problems raised in the above-mentioned background art.
为实现上述目的，本发明提供如下技术方案：一种三种铜厚柔性线路板制作方法，包括以下步骤：In order to achieve the above purpose, the present invention provides the following technical solutions: a method for making three kinds of copper-thick flexible circuit boards, comprising the following steps:
S1、对柔性线路板的基板进行初步裁剪，进行开料；S1. Preliminarily cut and cut the substrate of the flexible circuit board;
S2、对柔性线路板的基板进行钻孔；S2, drilling the substrate of the flexible circuit board;
S3、对柔性线路板的基板进行整板电镀，在不同层间形成导电的通路，并实现柔性线路板的整体区域的铜厚；S3, perform whole board electroplating on the substrate of the flexible circuit board, form conductive paths between different layers, and realize the copper thickness of the whole area of the flexible circuit board;
S4、对柔性线路板的基板进行化学清洗；S4, chemically cleaning the substrate of the flexible circuit board;
S5、对柔性线路板的基板进行第一次压干膜处理；S5, performing the first dry film pressing on the substrate of the flexible circuit board;
S6、对柔性线路板的基板进行第一次的曝光和显影处理；S6, perform the first exposure and development treatment on the substrate of the flexible circuit board;
S7、对柔性线路板的基板进行化学蚀刻；S7, chemically etching the substrate of the flexible circuit board;
S8、对蚀刻后的柔性线路板进行退膜处理；S8. Perform stripping treatment on the etched flexible circuit board;
S9、根据客户的结构设计要求，对柔性线路板的部分区域进行第二次压干膜处理、第二次曝光以及第二次显影处理；S9. According to the customer's structural design requirements, perform the second dry film treatment, the second exposure and the second development treatment on some areas of the flexible circuit board;
S10、根据客户的结构设计要求，在指定的区域进行选择性电镀，加大区域内的线路板铜厚；S10. According to the customer's structural design requirements, selective electroplating is performed in the designated area to increase the copper thickness of the circuit board in the area;
S11、对指定的区域的线路板进行第二次退膜处理；S11. Perform the second de-filming treatment on the circuit board in the designated area;
S12、根据客户的结构设计要求，对柔性线路板的部分区域进行第三次压干膜处理、第三次曝光以及第三次显影处理；S12. According to the customer's structural design requirements, perform the third dry film treatment, the third exposure and the third development treatment on some areas of the flexible circuit board;
S13、根据客户的结构设计要求，在指定的区域进行选择性减铜，减少区域内的线路板铜厚；S13. According to the customer's structural design requirements, selectively reduce copper in the designated area to reduce the copper thickness of the circuit board in the area;
S14、对指定的区域的线路板进行第三次退膜处理；S14, perform the third film stripping treatment on the circuit board in the designated area;
S15、完成柔性线路板的后续正常流程。S15 , the subsequent normal process of the flexible circuit board is completed.
进一步优化本技术方案，所述S4中，化学清洗后采用激光清洗，清洗掉基板上面的氧化层，基板铜箔上面的氧化铜会对柔性线路板产生持续性的氧化，会损耗柔性线路板的使用寿命。This technical solution is further optimized. In the step S4, laser cleaning is used after chemical cleaning to remove the oxide layer on the substrate. The copper oxide on the copper foil of the substrate will cause continuous oxidation of the flexible circuit board, which will damage the flexible circuit board. service life.
进一步优化本技术方案，所述S5中，干膜的主要构成为PE、感光膜以及PET，其中，PE层和PET层起保护作用，在压膜前需要去掉，感光膜位于干膜的中间，所述感光膜为感光阻剂，需要具有一定的粘性和良好的感光性。This technical solution is further optimized. In the S5, the main components of the dry film are PE, photosensitive film and PET, wherein the PE layer and the PET layer play a protective role and need to be removed before lamination, and the photosensitive film is located in the middle of the dry film, The photosensitive film is a photoresist, and needs to have a certain viscosity and good photosensitivity.
进一步优化本技术方案，所述S6中，将柔性线路板的基板制作到菲林上面，在使用曝光机将菲林上面的线路曝光在贴附有感光膜的柔性线路板的基板的上面，这样就可以将线路转移到基板的铜箔上面，并滴加显影液进行显影。This technical solution is further optimized. In the step S6, the substrate of the flexible circuit board is made on the film, and the circuit on the film is exposed on the substrate of the flexible circuit board attached with the photosensitive film by using an exposure machine, so that it can be The circuit is transferred to the copper foil of the substrate, and the developer is added dropwise for development.
进一步优化本技术方案，所述S7中，使用化学蚀刻的时候，对柔性线路板是采用盐酸或者硫酸酸性溶液进行蚀刻。To further optimize the technical solution, in S7, when chemical etching is used, hydrochloric acid or sulfuric acid acid solution is used to etch the flexible circuit board.
进一步优化本技术方案，所述干膜贴在柔性线路板的基板上，经曝光后显影后，使线路基本成型，在此过程中干膜主要起到了影象转移的功能，而且在蚀刻的过程中起到保护线路的作用。This technical solution is further optimized. The dry film is attached to the substrate of the flexible circuit board, and after exposure and development, the circuit is basically formed. play a role in protecting the line.
进一步优化本技术方案，所述第二次压干膜处理、第二次曝光、第二次显影处理以及第二次退膜处理均与第一次的处理方法相同。The technical solution is further optimized, and the second drying process, the second exposure, the second developing process, and the second film stripping process are all the same as the first process.
进一步优化本技术方案，所述第三次压干膜处理、第三次曝光、第三次显影处理以及第三次退膜处理均与第一次的处理方法相同。To further optimize the technical solution, the third dry film pressing treatment, the third exposure, the third developing treatment and the third film stripping treatment are all the same as the first treatment methods.
与现有技术相比，本发明提供了一种三种铜厚柔性线路板制作方法，具备以下有益效果：Compared with the prior art, the present invention provides three methods for manufacturing copper-thick flexible circuit boards, which have the following beneficial effects:
该三种铜厚柔性线路板制作方法，通过使用整板电镀、选择性电镀和选择性减铜搭配的制作方法实现，可以有效规避三种铜厚存在阶差问题，导致线路制作过程中出现压干膜不实现象，极大程度提升线路制作良率。The three copper thickness flexible circuit board manufacturing methods are realized by using the whole board electroplating, selective electroplating and selective copper reduction matching manufacturing methods, which can effectively avoid the step difference problem of the three copper thicknesses, which leads to stress during the circuit manufacturing process. Dry film does not realize the phenomenon, which greatly improves the yield of circuit production.
附图说明Description of drawings
图1为本发明提出的一种三种铜厚柔性线路板制作方法的产品结构示意图。FIG. 1 is a schematic diagram of a product structure of three methods for manufacturing a copper-thick flexible circuit board proposed by the present invention.
具体实施方式Detailed ways
下面将结合本发明的实施例，对本发明实施例中的技术方案进行清楚、完整地描述，显然，所描述的实施例仅仅是本发明一部分实施例，而不是全部的实施例。基于本发明中的实施例，本领域普通技术人员在没有做出创造性劳动前提下所获得的所有其他实施例，都属于本发明保护的范围。The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.
实施例一：Example 1:
一种三种铜厚柔性线路板制作方法，包括以下步骤：A method for making three kinds of copper-thick flexible circuit boards, comprising the following steps:
S1、对柔性线路板的基板进行初步裁剪，进行开料；S1. Preliminarily cut and cut the substrate of the flexible circuit board;
S2、对柔性线路板的基板进行钻孔；S2, drilling the substrate of the flexible circuit board;
S3、对柔性线路板的基板进行整板电镀，在不同层间形成导电的通路，并实现柔性线路板的整体区域的铜厚；S3, perform whole board electroplating on the substrate of the flexible circuit board, form conductive paths between different layers, and realize the copper thickness of the whole area of the flexible circuit board;
S4、对柔性线路板的基板进行化学清洗；S4, chemically cleaning the substrate of the flexible circuit board;
S5、对柔性线路板的基板进行第一次压干膜处理；S5, performing the first dry film pressing on the substrate of the flexible circuit board;
S6、对柔性线路板的基板进行第一次的曝光和显影处理；S6, perform the first exposure and development treatment on the substrate of the flexible circuit board;
S7、对柔性线路板的基板进行化学蚀刻；S7, chemically etching the substrate of the flexible circuit board;
S8、对蚀刻后的柔性线路板进行退膜处理；S8. Perform stripping treatment on the etched flexible circuit board;
S9、根据客户的结构设计要求，对柔性线路板的部分区域进行第二次压干膜处理、第二次曝光以及第二次显影处理；S9. According to the customer's structural design requirements, perform the second dry film treatment, the second exposure and the second development treatment on some areas of the flexible circuit board;
S10、根据客户的结构设计要求，在指定的区域进行选择性电镀，加大区域内的线路板铜厚；S10. According to the customer's structural design requirements, selective electroplating is performed in the designated area to increase the copper thickness of the circuit board in the area;
S11、对指定的区域的线路板进行第二次退膜处理；S11. Perform the second film stripping treatment on the circuit board in the designated area;
S12、根据客户的结构设计要求，对柔性线路板的部分区域进行第三次压干膜处理、第三次曝光以及第三次显影处理；S12. According to the customer's structural design requirements, perform the third dry film treatment, the third exposure and the third development treatment on some areas of the flexible circuit board;
S13、根据客户的结构设计要求，在指定的区域进行选择性减铜，减少区域内的线路板铜厚；S13. According to the customer's structural design requirements, selectively reduce copper in the designated area to reduce the copper thickness of the circuit board in the area;
S14、对指定的区域的线路板进行第三次退膜处理；S14, perform the third film stripping treatment on the circuit board in the designated area;
S15、完成柔性线路板的后续正常流程。S15 , the subsequent normal process of the flexible circuit board is completed.
具体的，所述S4中，化学清洗后采用激光清洗，清洗掉基板上面的氧化层，基板铜箔上面的氧化铜会对柔性线路板产生持续性的氧化，会损耗柔性线路板的使用寿命。Specifically, in S4, laser cleaning is used after chemical cleaning to remove the oxide layer on the substrate. The copper oxide on the copper foil of the substrate will continuously oxidize the flexible circuit board, which will consume the service life of the flexible circuit board.
具体的，所述S5中，干膜的构成为PE、感光膜以及PET，其中，PE层和PET层起保护作用，在压膜前需要去掉，感光膜位于干膜的中间，所述感光膜为感光阻剂，需要具有粘性和感光性。Specifically, in S5, the dry film is composed of PE, photosensitive film and PET, wherein the PE layer and the PET layer play a protective role and need to be removed before lamination, the photosensitive film is located in the middle of the dry film, and the photosensitive film To be a photoresist, it needs to have viscosity and photosensitivity.
具体的，所述S6中，将柔性线路板的基板制作到菲林上面，在使用曝光机将菲林上面的线路曝光在贴附有感光膜的柔性线路板的基板的上面，这样就可以将线路转移到基板的铜箔上面，并滴加显影液进行显影。Specifically, in S6, the substrate of the flexible circuit board is made on the film, and the circuit on the film is exposed on the substrate of the flexible circuit board with the photosensitive film by using an exposure machine, so that the circuit can be transferred. onto the copper foil of the substrate, and drip developer solution for development.
具体的，所述S7中，使用化学蚀刻的时候，对柔性线路板是采用盐酸或者硫酸酸性溶液进行蚀刻。Specifically, in S7, when chemical etching is used, hydrochloric acid or sulfuric acid acid solution is used to etch the flexible circuit board.
具体的，所述干膜贴在柔性线路板的基板上，经曝光后显影后，使线路基本成型，在此过程中干膜主要起到了影象转移的功能，而且在蚀刻的过程中起到保护线路的作用。Specifically, the dry film is attached to the substrate of the flexible circuit board. After exposure and development, the circuit is basically formed. During this process, the dry film mainly plays the function of image transfer, and also plays a role in the etching process. The role of protection lines.
具体的，所述第二次压干膜处理、第二次曝光、第二次显影处理以及第二次退膜处理均与第一次的处理方法相同。Specifically, the second dry film treatment, the second exposure, the second development treatment, and the second film stripping treatment are all the same as the first treatment method.
具体的，所述第三次压干膜处理、第三次曝光、第三次显影处理以及第三次退膜处理均与第一次的处理方法相同。Specifically, the third pressing-drying treatment, the third exposure, the third developing treatment and the third film stripping treatment are all the same as the first treatment.
实施例二：Embodiment 2:
请参阅图1，三种铜厚要求厚度顺序依次为B区≥A区≥C区，通过整板电镀进行第一次处理实现A区铜厚，通过选择性电镀进行第二次处理实现B区铜厚，再通过选择性减铜进行第三次处理实现C区铜厚，即通过一加一减的制作方法最终实现三种铜厚要求，使得A区的铜厚为35um，B区的铜厚为55um，A区的铜厚为20um。同时，并已通过采用此制作方法，实现了产品的批量制作，满足了客户的结构设计要求。Please refer to Figure 1. The order of thickness of the three copper thicknesses is B area ≥ A area ≥ C area. The copper thickness of A area is realized by the first treatment of the whole plate electroplating, and the B area is realized by the second treatment of selective electroplating. Copper thickness, and then selectively reduce copper for the third treatment to achieve the copper thickness in the C area, that is, the three copper thickness requirements are finally achieved through the one-plus-one-subtraction manufacturing method, so that the copper thickness of the A area is 35um, and the copper thickness of the B area is 35um. The thickness is 55um, and the copper thickness of the A area is 20um. At the same time, by adopting this production method, the batch production of products has been realized, and the structural design requirements of customers have been met.
两个实施例的试验结果表明：该三种铜厚柔性线路板制作方法，通过使用整板电镀、选择性电镀和选择性减铜搭配的制作方法实现，可以有效规避三种铜厚存在阶差问题，导致线路制作过程中出现压干膜不实现象，极大程度提升线路制作良率。The test results of the two embodiments show that the three copper-thickness flexible circuit board manufacturing methods are realized by using the manufacturing methods of whole-board electroplating, selective electroplating and selective copper-reduction matching, which can effectively avoid the level difference of the three copper thicknesses The problem leads to the phenomenon that the dry film is not realized during the circuit manufacturing process, which greatly improves the circuit manufacturing yield.
尽管已经示出和描述了本发明的实施例，对于本领域的普通技术人员而言，可以理解在不脱离本发明的原理和精神的情况下可以对这些实施例进行多种变化、修改、替换和变型，本发明的范围由所附权利要求及其等同物限定。Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, and substitutions can be made in these embodiments without departing from the principle and spirit of the invention and modifications, the scope of the invention is defined by the appended claims and their equivalents.
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