CN112735983B - Single-wafer carrier cleaning high-integration device - Google Patents
Single-wafer carrier cleaning high-integration device Download PDFInfo
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- CN112735983B CN112735983B CN202011627403.0A CN202011627403A CN112735983B CN 112735983 B CN112735983 B CN 112735983B CN 202011627403 A CN202011627403 A CN 202011627403A CN 112735983 B CN112735983 B CN 112735983B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
- H01L21/67178—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers vertical arrangement
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B08—CLEANING
- B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
- B08B3/00—Cleaning by methods involving the use or presence of liquid or steam
- B08B3/02—Cleaning by the force of jets or sprays
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
- H01L21/67051—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing using mainly spraying means, e.g. nozzles
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67253—Process monitoring, e.g. flow or thickness monitoring
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- Cleaning Or Drying Semiconductors (AREA)
Abstract
The invention discloses a single-wafer carrier cleaning highly integrated device, which relates to the technical field of semiconductors and comprises a plurality of acid supply systems, a plurality of DDI integrated bodies and a plurality of wafer cleaning modules, wherein each wafer cleaning module is connected with at least one DDI integrated body, each DDI integrated body is respectively connected with a plurality of acid supply systems, and the DDI integrated bodies are used for controlling the acid supply systems to output cleaning liquid in the acid supply systems to the wafer cleaning modules. According to the invention, the automatic control acid supply system can be realized to provide different types of cleaning liquids for the wafer cleaning module, and the cleaning of the two sides of the wafer can be realized, so that the cleaning effect and the cleanliness are improved, and the consistency of the cleaning of the two sides of the wafer is ensured.
Description
Technical Field
The invention relates to the technical field of semiconductors, in particular to a single-wafer carrier cleaning highly-integrated device.
Background
In a semiconductor cleaning process, particularly in a manufacturing process of high-level wafer products such as logic integrated circuits, memories, power devices and other related wafer products, various complicated processes such as photolithography, wet process, deposition, oxidation and the like are used for processing, however, the subsequent process at each point needs to be processed through the wet process, so that the accuracy and the reproducibility of the subsequent process yield are ensured.
Particularly, in the semiconductor wet process with related requirements, the requirement for wet cleaning of the back of the wafer is mostly applied to the practical application of single-wafer cleaning equipment, so that the establishment of an effective and complete wafer cleaning effect control capability is a key point needed to be concerned by the existing high-order semiconductor wet process, and the realization of high-efficiency and high-yield single-wafer cleaning equipment by carrying out multiple processes with single-wafer cleaning and parallel acid supply control is the most important link.
Disclosure of Invention
The invention aims to provide a single-wafer carrier cleaning highly-integrated device for solving the technical problems.
The technical scheme adopted by the invention is as follows:
a single wafer carrier cleaning highly integrated device comprises a plurality of acid supply systems, a plurality of DDI integrated bodies and a plurality of wafer cleaning modules, wherein each wafer cleaning module is connected with at least one DDI integrated body system, each DDI integrated body system is respectively connected with a plurality of acid supply systems, and the DDI integrated body systems are used for controlling the acid supply systems to output cleaning liquid in the acid supply systems to the wafer cleaning modules.
Preferably, each wafer cleaning module comprises a mounting rack and at least one wafer cleaning and recycling mechanism arranged on the mounting rack.
Preferably, a DDI integrated system is disposed at a lower side of each cleaning and recycling mechanism, and the DDI integrated system is connected to the wafer cleaning and recycling mechanism.
Preferably, each DDI integrated system includes a plurality of cleaning solution supply control systems, and each cleaning solution supply control system is connected to the wafer cleaning module.
As a further preferred feature, each of the wafer cleaning and recovering mechanisms includes:
the middle part of the cleaning liquid recovery module is provided with an accommodating cavity;
the wafer bearing platform is arranged in the accommodating cavity in a lifting manner;
the wafer positioner is arranged on the outer edge of the upper end of the wafer bearing platform;
the wafer back cleaning mechanism is arranged in the middle of the upper end of the wafer bearing platform;
the rotating shaft group is arranged at the lower end of the wafer bearing platform;
the lifting mechanism is arranged at the lower end of the wafer bearing platform and drives the rotating shaft group.
As a further preference, the cleaning device further comprises a wafer drying module, a first cleaning module, a second cleaning module and a third cleaning module, wherein the first cleaning module and the second cleaning module are arranged on two sides of the cleaning liquid recovery module, the third cleaning module is arranged at one end of the cleaning liquid recovery module, and the wafer drying module is arranged between the first cleaning module and the second cleaning module.
Preferably, the wafer drying module comprises a plurality of nitrogen blowing pipes, and an air outlet end of each nitrogen blowing pipe is obliquely arranged towards the wafer bearing platform.
As a further preference, the first cleaning module comprises a first mounting pipe, a second mounting pipe, a nozzle wall, a first sprayer, a backflow valve, a first infusion pipe, a second infusion pipe and a backflow pipe, wherein one end of the first mounting pipe is connected with one end of the second mounting pipe, the first mounting pipe is perpendicular to the second mounting pipe, the first infusion pipe, the second infusion pipe and the backflow pipe are arranged in the first mounting pipe and the second mounting pipe, the other end of the second mounting pipe is provided with the nozzle wall, the nozzle wall is provided with the first sprayer, the backflow valve is arranged in the first sprayer, the first infusion pipe is connected with the first sprayer, one end of the second infusion pipe is connected with the backflow valve, the backflow valve is connected with the first sprayer, and the backflow pipe is connected with one end of the second infusion pipe.
As further preferred, the inside of washing liquid recovery module is equipped with a plurality of washing liquid and retrieves the chamber, and is a plurality of the washing liquid is retrieved the chamber and is followed the axial direction setting of washing liquid recovery module, and is a plurality of the coaxial setting in chamber is retrieved to the washing liquid, and is a plurality of the middle part in chamber is retrieved to the washing liquid hold the chamber.
The technical scheme has the following advantages or beneficial effects:
according to the invention, the automatic control acid supply system can be realized to provide different types of cleaning liquids for the wafer cleaning module, and the cleaning of the two sides of the wafer can be realized, so that the cleaning effect and the cleanliness are improved, and the consistency of the cleaning of the two sides of the wafer is ensured.
Drawings
FIG. 1 is a system diagram of a single wafer carrier cleaning highly integrated apparatus of the present invention;
FIG. 2 is a schematic diagram of a wafer cleaning module according to the present invention;
FIG. 3 is a front view of the wafer cleaning and reclaiming mechanism of the present invention;
FIG. 4 is a top view of the wafer cleaning and recovery mechanism of the present invention;
FIG. 5 is a perspective view of the wafer cleaning and recovery mechanism of the present invention;
FIG. 6 is a schematic view of the mounting structure of the wafer backside cleaning mechanism and the wafer carrying platform according to the present invention;
FIG. 7 is a top view of the wafer backside cleaning mechanism of the present invention;
FIG. 8 is a schematic diagram of the internal structure of the cleaning solution recycling module of the present invention;
FIG. 9 is a schematic structural diagram of a first cleaning module according to the present invention.
In the figure: 1. an acid supply system; 2. a DDI integrated system; 21. a first cleaning liquid supply control system; 22. a second cleaning liquid supply control system; 23. a third cleaning liquid supply control system; 24. a fourth cleaning liquid supply control system; 3. a wafer cleaning module; 31. a mounting frame; 32. a wafer cleaning and recycling mechanism; 33. a cleaning liquid recovery module; 34. an accommodating chamber; 35. a wafer carrying platform; 36. a wafer positioner; 37. a rotating shaft group; 38. a wafer drying module; 39. a first cleaning module; 391. a second cleaning module; 392. a third cleaning module; 393. a first mounting tube; 394. a second mounting tube; 395. a nozzle wall; 396. a first nozzle; 397. a return valve member; 398. a first infusion tube; 399. a second infusion tube; 3910. a return pipe; 3911. a cleaning fluid recovery chamber; 3912. a wafer support tube; 3913. a first tubular housing; 3914. a liquid spraying pipe fitting; 3915. a first air jet port; 3916. a second tubular housing; 3917. a first wafer stage positioner; 3918. a second wafer support platform positioner; 4. and (5) wafer.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that, as the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. appear, their indicated orientations or positional relationships are based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention. Furthermore, the appearances of the terms "first," "second," and "third" are only used for descriptive purposes and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly stated or limited, the terms "mounted," "connected," and "connected" should be interpreted broadly, e.g., as being fixed or detachable or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in a specific case to those of ordinary skill in the art.
FIG. 1 is a system diagram of a single wafer carrier cleaning highly integrated apparatus of the present invention; FIG. 2 is a schematic diagram of a wafer cleaning module according to the present invention; FIG. 3 is a front view of the wafer cleaning and reclaiming mechanism of the present invention; FIG. 4 is a top view of the wafer cleaning and recovery mechanism of the present invention; FIG. 5 is a perspective view of the wafer cleaning and recovery mechanism of the present invention; FIG. 6 is a schematic view of the mounting structure of the wafer backside cleaning mechanism and the wafer carrying platform according to the present invention; FIG. 7 is a top view of the wafer backside cleaning mechanism of the present invention; FIG. 8 is a schematic diagram illustrating an internal structure of the cleaning solution recycling module of the present invention; FIG. 9 is a schematic structural diagram of a first cleaning module according to the present invention. Referring to fig. 1 to 9, a preferred embodiment of a single wafer carrier cleaning highly integrated device is shown, which includes a plurality of acid supply systems 1, a plurality of DDI integrated systems 2 and a plurality of wafer cleaning modules 3, wherein each wafer cleaning module 3 is connected to at least one DDI integrated system 2, each DDI integrated system 2 is connected to a plurality of acid supply systems 1, and the DDI integrated system 2 is used to control the acid supply systems 1 to output cleaning liquid in the acid supply systems 1 to the wafer cleaning modules 3. Each acid supply system 1 in this embodiment can provide one type of cleaning solution, and the DDI integrated system 2 can receive an external supply instruction, and output a control instruction to the corresponding acid supply system 1 according to the supply instruction, so that the acid supply system 1 outputs the corresponding cleaning solution to the wafer cleaning module 3. The plurality of acid supply systems 1 in this embodiment are arranged in parallel.
Further, as a preferred embodiment, each wafer cleaning module 3 includes a mounting rack 31, and at least one wafer cleaning and recycling mechanism 32 disposed on the mounting rack 31. As shown in fig. 2, each wafer cleaning module 3 in the present embodiment includes two wafer cleaning and recycling mechanisms 32.
Further, as a preferred embodiment, a DDI integrated system 2 is disposed on the lower side of each cleaning and recycling mechanism, and the DDI integrated system 2 is connected to the wafer cleaning and recycling mechanism 32. In this embodiment, each DDI integrated system 2 is connected to one wafer cleaning and recycling mechanism 32, so that different types of cleaning solutions can be automatically provided for the wafer cleaning and recycling mechanisms 32 through the DDI integrated systems 2.
Further, as a preferred embodiment, each DDI integrated system 2 comprises a plurality of cleaning solution supply control systems, and each cleaning solution supply control system is connected to the wafer cleaning module 3. In the present embodiment, the plurality of cleaning liquid supply control systems include a first cleaning liquid supply control system 21, a second cleaning liquid supply control system 22, a third cleaning liquid supply control system 23, and a fourth cleaning liquid supply control system 24. The first cleaning liquid supply control system 21, the second cleaning liquid supply control system 22, the third cleaning liquid supply control system 23 and the fourth cleaning liquid supply control system 24 are respectively connected to the wafer cleaning and recovering mechanism 32.
Further, as a preferred embodiment, each wafer cleaning and recycling mechanism 32 includes:
the cleaning solution recovery module 33, the middle part of the cleaning solution recovery module 33 is provided with an accommodating cavity 34; in this embodiment, the cleaning liquid recovery module 33 is used for recovering the cleaning liquid after use, and the recovered cleaning liquid can be reused after being processed again.
The wafer bearing platform 35, the wafer bearing platform 35 is arranged in the accommodating cavity 34 in a lifting manner; in this embodiment, the wafer supporting platform 35 is used for supporting the wafer 4, and the cleaning operation of the wafer 4 is completed on the wafer supporting platform 35.
A plurality of wafer positioners 36 are arranged on the outer edge of the upper end of the wafer bearing platform 35; the wafer positioner 36 is used to restrain the wafer 4 and prevent the wafer 4 from being separated from the wafer support platform 35 during the cleaning process.
The wafer back cleaning mechanism is arranged in the middle of the upper end of the wafer bearing platform 35; in this embodiment, the wafer back surface cleaning mechanism is used to clean the back surface of the wafer 4.
The rotating shaft group 37, the rotating shaft group 37 is arranged at the lower end of the wafer bearing platform 35; the set of rotation axes 37 is used to control the rotation of the wafer stage 35, so that the wafer 4 is rotated during the cleaning process.
And the lifting mechanism is arranged at the lower end of the wafer bearing platform 35 and drives the rotating shaft group 37. The lifting mechanism is used for driving the wafer bearing platform 35 to drive the wafer 4 to ascend or descend, so that the wafer 4 is opposite to the specified cleaning liquid recovery cavity 3911, and the recovery of different types of cleaning liquids is realized. The lifting mechanism in this embodiment is a cylinder or a lifting rod mechanism.
Further, as a preferred embodiment, the cleaning device further includes a wafer drying module 38, a first cleaning module 39, a second cleaning module 391 and a third cleaning module 392, wherein the first cleaning module 39 and the second cleaning module 391 are disposed at two sides of the cleaning solution recycling module 33, the third cleaning module 392 is disposed at one end of the cleaning solution recycling module 33, and the wafer drying module 38 is disposed between the first cleaning module 39 and the second cleaning module 391. In this embodiment, the first cleaning module 39, the second cleaning module 391 and the third cleaning module 392 are used for cleaning the front surface of the wafer 4, the wafer drying module 38 is used for blowing nitrogen gas to the front surface of the wafer 4, and the nitrogen gas flows along the horizontal direction of the front surface of the wafer 4.
Further, as a preferred embodiment, the wafer drying module 38 includes a plurality of nitrogen gas blowing pipes, and the gas outlet end of each nitrogen gas blowing pipe is disposed obliquely toward the wafer supporting platform 35. In this embodiment, the nitrogen gas blowing pipes include a first nitrogen gas blowing pipe, a second nitrogen gas blowing pipe and a third nitrogen gas blowing pipe, wherein the first nitrogen gas blowing pipe is used for blowing nitrogen gas, and the second nitrogen gas blowing pipe and the third nitrogen gas blowing pipe can be used for blowing nitrogen gas and spraying cleaning liquid.
Further, as a preferred embodiment, the first cleaning module 39 includes a first installation tube 393, a second installation tube 394, a nozzle wall 395, a first spray head 396, a return valve component 397, a first infusion tube 398, a second infusion tube 399 and a return tube 3910, wherein one end of the first installation tube 393 is connected with one end of the second installation tube 394, the first installation tube 393 is perpendicular to the second installation tube 394, the first infusion tube 398, the second infusion tube 399 and the return tube 3910 are all disposed in the first installation tube 393 and the second installation tube 394, the other end of the second installation tube 394 is provided with the nozzle wall 395, the nozzle wall 395 is provided with the first spray head 396, the return valve component 397 is disposed in the first spray head 396, one end of the second infusion tube 398 is connected with the first spray head 396, one end of the second infusion tube 399 is connected with the return valve component 397, the return tube 3910 is connected with one end of the second infusion tube 399. In this embodiment, as shown in fig. 9, the first mounting tube 393 and the second mounting tube 394 are connected by a connecting member, and the first mounting tube 393 and the second mounting tube 394 are connected to form a gamma-type structure, and the first infusion tube 398, the second infusion tube 399 and the return tube 3910 are all hidden in the first mounting tube 393 and the second mounting tube 394, so that the exposure of the tubes is avoided, and the use safety is improved. In this embodiment, the return valve component 397 has two inlet ports and two outlet ports, wherein the first infusion tube 398 is connected to one of the inlet ports, and the second infusion tube 399 is connected to the other inlet port. The opening or closing of the liquid inlet is controlled by a valve in the reflux valve component 397, and the two liquid inlets are independent from each other. In this embodiment, the first liquid transport tube 398 and the second liquid transport tube 399 both comprise two tube segment portions, as shown in fig. 9, one of the tube segment portions is connected with the liquid inlet, and the other tube segment portion is connected with the liquid outlet and the first nozzle 396, in this embodiment, the first liquid transport tube 398 is used for transporting the hydrogen peroxide solution, the second liquid transport tube 399 is used for transporting the sulfuric acid solution, the transported hydrogen peroxide solution and the sulfuric acid solution are mixed in the first nozzle 396 to generate the required cleaning solution, and then the cleaning solution is sprayed on the front surface of the wafer 4 by the first nozzle 396, so as to clean the front surface of the wafer 4. When the concentration of the sulfuric acid solution needs to be adjusted, the valve can be closed, and the return pipe 3910 recovers the original sulfuric acid solution in the second liquid conveying pipe 399, and the sulfuric acid solution is reused after subsequent treatment, so that the cost can be saved.
Further, as a preferred implementation, the inside of washing liquid recovery module 33 is equipped with a plurality of washing liquid and retrieves chamber 3911, and a plurality of washing liquid retrieve chamber 3911 and set up along the axial direction of washing liquid recovery module 33, and a plurality of washing liquid retrieve chamber 3911 coaxial setting, and the middle part of a plurality of washing liquid retrieve chamber 3911 is for holding chamber 34. In this embodiment, as shown in fig. 8, the cleaning solution recycling chambers 3911 are sequentially arranged from top to bottom, and the structures of the cleaning solution recycling chambers 3911 may be the same or different, so that the cleaning solution can be collected. And the wafer bearing platform 35 is arranged in the accommodating cavity 34, and the wafer bearing platform 35 can move up and down in the accommodating cavity 34 under the action of the lifting mechanism, so that the position of the wafer bearing platform 35 can be adjusted. In this embodiment, each cleaning solution recycling chamber 3911 can recycle one type of cleaning solution, when the cleaning solution needs to be replaced, the lifting mechanism can drive the wafer bearing platform 35 to drive the wafer 4 thereon to move, and the position of the wafer 4 is adjusted, so that the wafer 4 is opposite to the corresponding cleaning solution recycling chamber 3911, and then the first cleaning module 39, the second cleaning module 391, the third cleaning module 392 or the wafer back cleaning mechanism is started to clean the front and back of the wafer 4 at the same time. The cleaning liquid recovery chamber 3911 in this embodiment is in communication with the accommodating chamber 34.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the scope and the embodiments of the present invention.
The present invention has the following preferred embodiments based on the above-described embodiments.
Further, as a preferred embodiment, each acid supply system 1 includes a mounting frame 31, and at least two solution tanks and at least two pumps disposed in the mounting frame 31, and the solution tanks are disposed in parallel to form at least two liquid supply systems, the types of the cleaning liquids in the solution tanks are the same, and the pumps are used for outputting the cleaning liquids in the solution tanks to the wafer cleaning and recycling mechanism 32. In the embodiment, the arrangement of the at least two solution tanks can prevent the interruption of the supply of the cleaning solution caused by the failure of one liquid supply system, reduce the generation of bubbles and improve the cleaning effect. It is known that sulfuric acid and hydrogen peroxide cleaning solution are prone to generate bubbles, and if the solution is supplied again after being interrupted in the infusion process, a large amount of bubbles are generated, and the cleaning effect is seriously affected.
Further, as a preferred embodiment, the wafer backside cleaning mechanism includes a wafer support tube 3912, a first tube housing 3913 and a liquid spraying tube 3914, wherein the wafer support tube 3912 penetrates the rotation axis set 37 along the axial direction of the rotation axis set 37, and one end of the wafer support tube 3912 penetrates the wafer stage 35 and extends to the upper side of the wafer stage 35. In this embodiment, the wafer support tube 3912 is configured to inject nitrogen gas, such that a vacuum region is formed between one end of the wafer support tube 3912 and the wafer 4, and the nitrogen gas is blown. In this embodiment, the nitrogen blown by the wafer support tube 3912 diffuses from the middle of the back surface of the wafer 4 to the periphery of the wafer 4, so that the contamination and water drops on the back surface of the wafer 4 can be effectively removed, and the back surface of the wafer 4 can be dried. First tube housing 3913 is disposed at an outer edge of one end of wafer support tube 3912, a first air nozzle 3915 is disposed at an outer edge of a middle portion of first tube housing 3913, first air nozzle 3915 is used for blowing nitrogen, and nitrogen blown by first air nozzle 3915 is obliquely sprayed, so that dirt adhered to a back surface of a wafer can be taken away. Liquid ejection tube 3914 is disposed on the upper end of first tube housing 3913, and each liquid ejection tube 3914 can eject a cleaning liquid, and the number of liquid ejection tubes 3914 can be configured as required. The cleaning liquid sprayed from the liquid spraying pipe 3914 can be used to clean the backside of the wafer from contamination.
Further, as a preferred embodiment, the wafer backside cleaning mechanism further includes a second tube enclosure 3916, the outer edge of one end of the wafer support tube 3912 is further sleeved with the second tube enclosure 3916, the second tube enclosure 3916 is disposed at the lower end of the first tube enclosure 3913, and the lower end of the second tube enclosure 3916 is embedded in the wafer platform 35. In this embodiment, form a second air vent between first pipe fitting housing 3913 and the second pipe fitting housing 3916, the second air vent that sets up is used for blowing nitrogen gas, and the nitrogen gas that the second air vent blown cooperatees at the back of wafer 4 with the nitrogen gas that first air vent 3915 blown forms the air current circulation, can take away dirty effectively, can place dirty and pile up on the surface of first pipe fitting housing 3913 and second pipe fitting housing 3916.
Further, as a preferred embodiment, the wafer backside cleaning mechanism further includes a first wafer stage positioner 3917 and a second wafer stage positioner 3918, the first wafer stage positioner 3917 is disposed at the lower end of the wafer stage 35, the second wafer stage positioner 3918 is disposed at the lower end of the first wafer stage positioner 3917, and the rotating shaft set 37 penetrates through the first wafer stage positioner 3917 and the second wafer stage positioner 3918 and is connected to the wafer stage 35.
Further, as a preferred embodiment, the wafer backside cleaning mechanism further includes a plurality of hoses, wherein the plurality of hoses pass through the second tube housing 3916 and the first tube housing 3913 and are connected to the spray tube 3914, the first gas nozzle 3915 and the second gas nozzle for delivering the cleaning solution and the nitrogen gas, and the lifting/lowering action of the wafer platform 35 is not affected by the flexible property of the hoses.
Further, as a preferred embodiment, the third cleaning module 392 includes a first cleaning mechanism, a second cleaning mechanism and a third cleaning mechanism, which are arranged side by side, wherein the first cleaning mechanism, the second cleaning mechanism and the third cleaning mechanism are all used for spraying cleaning liquid to the front surface of the wafer 4. The second cleaning mechanism is positioned between the first cleaning mechanism and the third cleaning mechanism.
Further, as a preferred embodiment, the first cleaning liquid supply control system 21 is used for ultrapure water supply control, the second cleaning liquid supply control system 22 is used for supply control of ammonia water, hydrogen peroxide and hydrofluoric acid solution, the third cleaning liquid supply control system 23 is used for high temperature supply control of sulfuric acid and hydrogen peroxide, and the fourth cleaning liquid supply control system 24 is used for organic liquid supply control. The first cleaning liquid supply control system 21 is configured to control the acid supply system 1 to supply an ultrapure aqueous solution to the second nitrogen blowing pipe, the third nitrogen blowing pipe, and the first cleaning mechanism, the second cleaning liquid supply control system 22 is configured to control the acid supply system 1 to supply an ammonia water and a hydrogen peroxide aqueous solution to the second cleaning module 391, the second cleaning liquid supply control system 22 is configured to control the acid supply system 1 to supply a hydrofluoric acid solution to the second cleaning mechanism, the third cleaning liquid supply control system 23 is configured to control the acid supply system 1 to supply a sulfuric acid and a hydrogen peroxide aqueous solution to the first cleaning module 39, and the fourth cleaning liquid supply control system 24 is configured to control the acid supply system 1 to supply an organic liquid solution to the third cleaning mechanism.
Further, as a preferred embodiment, the cleaning device further includes liquid draining pipelines, wherein each liquid draining pipeline is connected to one cleaning liquid recycling chamber 3911, respectively, and is used for timely draining the cleaning liquid in the cleaning liquid recycling chamber 3911.
Further, as a preferred embodiment, the wafer loading apparatus further includes a driving mechanism, and the driving mechanism is disposed in the accommodating cavity 34 and is used for driving the rotating shaft group 37 to rotate, so that the rotating shaft group 37 drives the wafer loading platform 35 to rotate. The driving mechanism in this embodiment is a motor, an electric motor, or the like.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (5)
1. A single wafer carrier cleaning highly integrated device is characterized by comprising a plurality of acid supply systems, a plurality of DDI integrated bodies and a plurality of wafer cleaning modules, wherein each wafer cleaning module is connected with at least one DDI integrated body system, each DDI integrated body system is respectively connected with a plurality of acid supply systems, and the DDI integrated bodies are used for controlling the acid supply systems to output cleaning liquid in the acid supply systems to the wafer cleaning modules;
each wafer cleaning module comprises a mounting rack and at least one wafer cleaning and recycling mechanism arranged on the mounting rack;
each wafer cleaning and recycling mechanism comprises:
the cleaning solution recovery module is provided with an accommodating cavity in the middle;
the wafer bearing platform is arranged in the accommodating cavity in a lifting manner;
the wafer positioner is arranged on the outer edge of the upper end of the wafer bearing platform;
the wafer back cleaning mechanism is arranged in the middle of the upper end of the wafer bearing platform;
the rotating shaft group is arranged at the lower end of the wafer bearing platform;
the lifting mechanism is arranged at the lower end of the wafer bearing platform and drives the rotating shaft group;
the cleaning device comprises a cleaning solution recovery module, a wafer drying module, a first cleaning module, a second cleaning module and a third cleaning module, wherein the first cleaning module and the second cleaning module are arranged on two sides of the cleaning solution recovery module, the third cleaning module is arranged at one end of the cleaning solution recovery module, and the wafer drying module is arranged between the first cleaning module and the second cleaning module;
first washing module includes first installation pipe, second installation pipe, nozzle wall, first shower nozzle, backward flow valve member, first transfer line, second transfer line and back flow, wherein, the one end of first installation pipe with the one end of second installation pipe is connected, just first installation pipe with the second installation pipe is perpendicular, first transfer line the second transfer line with the back flow is all located first installation pipe with in the second installation, the other end of second installation pipe is equipped with the nozzle wall, be equipped with on the nozzle wall first shower nozzle, backward flow valve member locates in the first shower nozzle, first transfer line is connected first shower nozzle, the one end of second transfer line is connected backward flow valve member, backward flow valve member connects first shower nozzle, the back flow is connected the one end of second transfer line.
2. The single wafer carrier cleaning highly integrated apparatus as claimed in claim 1, wherein each of said cleaning and recovery mechanisms has a respective DDI integrated system on its underside, and said DDI integrated systems are connected to said wafer cleaning and recovery mechanisms.
3. The single wafer carrier cleaning highly integrated apparatus as claimed in claim 1, wherein each DDI integrated system comprises a plurality of cleaning solution supply control systems, and each cleaning solution supply control system is connected to the wafer cleaning module.
4. The single wafer carrier cleaning highly integrated apparatus as claimed in claim 1, wherein the wafer drying module comprises a plurality of nitrogen gas blowing pipes, and an outlet end of each nitrogen gas blowing pipe is disposed to be inclined toward the wafer supporting platform.
5. The single wafer carrier cleaning highly integrated device as claimed in claim 1, wherein a plurality of cleaning solution recovery chambers are provided inside the cleaning solution recovery module, a plurality of cleaning solution recovery chambers are provided along an axial direction of the cleaning solution recovery module, and a plurality of cleaning solution recovery chambers are provided coaxially, and a middle portion of the plurality of cleaning solution recovery chambers is the accommodating chamber.
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| CN114054234A (en) * | 2021-11-04 | 2022-02-18 | 至微半导体(上海)有限公司 | Multifunctional spray head mechanism for SPM cleaning process |
| CN115274409A (en) * | 2022-09-26 | 2022-11-01 | 广州粤芯半导体技术有限公司 | Method for cleaning semiconductor structure and method for manufacturing semiconductor structure |
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