CN112731983B - Method for curing base glue of foil type resistance strain gauge - Google Patents
Method for curing base glue of foil type resistance strain gauge Download PDFInfo
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- CN112731983B CN112731983B CN202011432697.1A CN202011432697A CN112731983B CN 112731983 B CN112731983 B CN 112731983B CN 202011432697 A CN202011432697 A CN 202011432697A CN 112731983 B CN112731983 B CN 112731983B
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- 239000011888 foil Substances 0.000 title claims abstract description 56
- 239000003292 glue Substances 0.000 title claims abstract description 45
- 238000000034 method Methods 0.000 title claims abstract description 36
- 239000000853 adhesive Substances 0.000 claims abstract description 72
- 230000001070 adhesive effect Effects 0.000 claims abstract description 72
- 239000000758 substrate Substances 0.000 claims abstract description 58
- 239000011521 glass Substances 0.000 claims abstract description 24
- 239000002390 adhesive tape Substances 0.000 claims abstract description 18
- 238000005086 pumping Methods 0.000 claims abstract description 11
- 238000010438 heat treatment Methods 0.000 claims abstract description 10
- 239000002184 metal Substances 0.000 claims abstract description 10
- 230000002093 peripheral effect Effects 0.000 claims abstract description 10
- 239000002904 solvent Substances 0.000 claims abstract description 10
- 238000007664 blowing Methods 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims abstract description 3
- 238000007790 scraping Methods 0.000 claims abstract description 3
- 238000001723 curing Methods 0.000 claims description 51
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052799 carbon Inorganic materials 0.000 abstract description 6
- 230000008021 deposition Effects 0.000 abstract description 5
- 230000003647 oxidation Effects 0.000 abstract description 5
- 238000007254 oxidation reaction Methods 0.000 abstract description 5
- 230000003247 decreasing effect Effects 0.000 description 4
- 239000010410 layer Substances 0.000 description 3
- 239000012790 adhesive layer Substances 0.000 description 2
- 238000005260 corrosion Methods 0.000 description 2
- 230000007797 corrosion Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000001259 photo etching Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000003738 black carbon Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000001590 oxidative effect Effects 0.000 description 1
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Classifications
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- G—PHYSICS
- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1951—Control of temperature characterised by the use of electric means with control of the working time of a temperature controlling device
-
- C—CHEMISTRY; METALLURGY
- C03—GLASS; MINERAL OR SLAG WOOL
- C03C—CHEMICAL COMPOSITION OF GLASSES, GLAZES OR VITREOUS ENAMELS; SURFACE TREATMENT OF GLASS; SURFACE TREATMENT OF FIBRES OR FILAMENTS MADE FROM GLASS, MINERALS OR SLAGS; JOINING GLASS TO GLASS OR OTHER MATERIALS
- C03C27/00—Joining pieces of glass to pieces of other inorganic material; Joining glass to glass other than by fusing
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- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Automation & Control Theory (AREA)
- General Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Chemical Kinetics & Catalysis (AREA)
- General Chemical & Material Sciences (AREA)
- Geochemistry & Mineralogy (AREA)
- Materials Engineering (AREA)
- Organic Chemistry (AREA)
- Adhesives Or Adhesive Processes (AREA)
Abstract
The invention provides a method for curing a base adhesive of a foil type resistance strain gauge, which comprises the following steps: (S1) standing the substrate adhesive to room temperature, and then placing the substrate adhesive in a vacuum-pumping container for vacuum-pumping for later use; (S2) fixing the peripheral edges of the metal foil on a glass plate by using an adhesive tape, and keeping the foil flatly attached to the glass; pouring base glue on the foil and scraping; (S3) immediately putting the scraped substrate adhesive into a dust-free air-blowing oven, and heating for precuring to remove the solvent so as to enable the adhesive liquid to form a film; (S4) taking out the pre-cured glue solution, putting the pre-cured glue solution into a high-temperature vacuum oven, carrying out high-temperature curing after vacuumizing, and carrying out one or more times of vacuumizing. The invention can effectively prevent the occurrence of glue shrinkage and small bubbles in the glue layer, and can prevent the generation of a large amount of carbon deposition and the oxidation of the foil after the substrate glue is completely cured.
Description
Technical Field
The invention relates to a substrate adhesive curing method, in particular to a substrate adhesive curing method for a foil type resistance strain gauge.
Background
When a foil type resistance strain gauge is manufactured, in the prior art, a foil is generally fixed on a glass sheet by using an adhesive tape, and a proper amount of base glue is poured on the foil, as shown in fig. 1. And then, strickling by using a glass rod, placing on a shelf, standing for removing bubbles, and then baking in an oven at high temperature to cure the substrate adhesive. And finally, taking off the cured substrate glue and the foil, and carrying out photoetching, corrosion and the like to prepare the foil type resistance strain gauge.
However, when the base glue is cured by the above process, the glue solution is apt to shrink after standing, i.e. the peripheral glue solution shrinks towards the center, as shown in fig. 2. And the longer the standing time is, the more serious the glue shrinkage phenomenon is, the uneven thickness of the base glue layer is caused, and the performance of the strain gauge is influenced. However, if the glue solution is not left to stand after being scraped or the standing time is too short, although the glue shrinkage phenomenon can be solved, small bubbles are generated on the cured glue layer, as shown in fig. 3. In addition, after the substrate adhesive is baked and cured at a high temperature, oxidation and carbon deposition phenomena exist on the surface of the foil, and the photoetching and corrosion effects of the foil are influenced. These phenomena all have a certain adverse effect on the performance of the strain gauge.
Disclosure of Invention
The purpose of the invention is as follows: aiming at the problems in the prior art, the method for curing the substrate adhesive of the foil type resistance strain gauge is provided to solve the problems of adhesive shrinkage and generation of small bubbles during curing of the substrate adhesive and prevent generation of a large amount of carbon deposition and oxidation of a foil material.
The technical scheme is as follows: the invention relates to a method for curing substrate adhesive of a foil type resistance strain gauge. The method comprises the following steps: (S1) taking out the substrate adhesive, standing to room temperature, placing in a vacuum container, and vacuumizing to remove bubbles for later use; (S2) fixing the peripheral edges of the metal foil on a glass plate by using an adhesive tape, and keeping the foil flatly attached to the glass; pouring base glue on the foil and scraping; (S3) immediately putting the scraped substrate adhesive into a dust-free air-blowing oven, and heating for precuring to remove a large amount of solvent so as to form a film from the adhesive liquid; (S4) taking out the pre-cured glue solution, putting the pre-cured glue solution into a high-temperature vacuum oven, and performing high-temperature curing after vacuumizing.
In step (S1), the degree of vacuum after evacuation is 500 to 1000 microns.
In the step (S2), the thickness of the base adhesive after being scraped is consistent with the thickness of the adhesive tape.
In the step (S3), the pre-curing includes: raising the temperature to 35-45 ℃, then preserving heat for 1-1.5 h, raising the temperature to 55-65 ℃, and then preserving heat for 1-1.5 h.
In the step (S4), the degree of vacuum after evacuation is 200 to 400 microns before high-temperature curing. The high-temperature curing process comprises the following steps: when the temperature is increased to 40-60 ℃, 140-160 ℃, 240-260 ℃ and 290-310 ℃, the vacuum is pumped to 200-400 microns, and when the temperature is decreased to 240-260 ℃, the vacuum is pumped to 200-400 microns.
Has the advantages that: compared with the prior art, the invention has the following advantages:
1. because the vacuumizing operation is carried out before gluing and in the curing process, the contradiction that the glue shrinkage phenomenon is caused by overlong standing time and small bubbles are easy to appear due to overlong standing time is solved, the substrate glue is smoother, and the strain gauge can have better performance;
2. because a large amount of solvent is removed in the pre-curing process, and the high-temperature curing process is performed by heating, constant temperature and vacuumizing in stages, the substrate adhesive can be prevented from generating a large amount of carbon deposition and oxidizing the foil when being completely cured at high temperature.
Drawings
FIG. 1 is a schematic structural diagram of a substrate, a foil and a glass plate during manufacturing of a foil-type resistance strain gauge in the prior art;
FIG. 2 is a schematic diagram illustrating the occurrence of glue shrinkage after the curing of the substrate glue in the fourth embodiment;
FIG. 3 is a schematic view showing small bubbles appearing in the adhesive layer after the curing of the base adhesive in the fifth embodiment;
FIG. 4 is a schematic view illustrating a cured substrate adhesive according to one embodiment;
fig. 5 is a comparison of the base glue of the first and sixth examples after curing.
Detailed Description
The present invention will be described in more detail with reference to several examples.
Example one
The method for curing the substrate adhesive of the foil type resistance strain gauge in the embodiment comprises the following steps:
s1: and standing the substrate adhesive to room temperature, putting the substrate adhesive into a vacuum-pumping container, and vacuumizing to 500 microns for later use to remove redundant bubbles in the substrate adhesive to be used.
S2: fixing the peripheral edges of the metal foil on a glass plate by using an adhesive tape, and keeping the foil flatly attached to the glass; a primer was poured over the foil and scraped flat. In the step, the thickness of the base adhesive after being scraped is consistent with that of the adhesive tape.
S3: and immediately putting the scraped substrate adhesive into a dust-free air-blowing oven, and heating for precuring to remove a large amount of solvent so as to form a film from the adhesive solution. Wherein, the process of precuring comprises the following steps: the temperature is raised to 40 ℃ and then kept for 1h, and then the temperature is raised to 60 ℃ and then kept for 1 h.
S4: and taking out the pre-cured glue solution, putting the pre-cured glue solution into a high-temperature vacuum oven, and performing high-temperature curing after vacuumizing. Wherein, before high-temperature curing, the vacuum degree after vacuumizing is 200-. The high-temperature curing process comprises the following steps: the vacuum is drawn to 300 microns when the temperature is raised to 50 deg.C, 150 deg.C, 250 deg.C, 300 deg.C, respectively, and to 300 microns when the temperature is lowered to 250 deg.C.
Example one the resulting cured base glue is shown in figure 4.
Example two
The method for curing the substrate adhesive of the foil type resistance strain gauge in the embodiment comprises the following steps:
s1: and standing the substrate adhesive to room temperature, putting the substrate adhesive into a vacuum-pumping container, and vacuumizing to 800 microns for later use to remove redundant bubbles in the substrate adhesive to be used.
S2: fixing the peripheral edges of the metal foil on a glass plate by using an adhesive tape, and keeping the foil flatly attached to the glass; a primer was poured over the foil and scraped flat. In the step, the thickness of the base adhesive after being scraped is consistent with that of the adhesive tape.
S3: and immediately putting the scraped substrate adhesive into a dust-free air-blowing oven, and heating for precuring to remove a large amount of solvent so as to form a film from the adhesive solution. Wherein, the process of precuring comprises the following steps: the temperature is raised to 45 ℃ and then is kept for 1.25h, and then the temperature is raised to 65 ℃ and then is kept for 1.25 h.
S4: and taking out the pre-cured glue solution, putting the pre-cured glue solution into a high-temperature vacuum oven, and performing high-temperature curing after vacuumizing. Wherein the vacuum degree after vacuumizing is 200 microns before high-temperature curing. The high-temperature curing process comprises the following steps: the vacuum was drawn to 400 microns at elevated temperatures of 60 deg.C, 160 deg.C, 260 deg.C, and 310 deg.C, respectively, and to 400 microns at reduced temperatures of 260 deg.C.
The morphology of the cured base rubber obtained in example two is similar to that of the example.
EXAMPLE III
The method for curing the substrate adhesive of the foil type resistance strain gauge in the embodiment comprises the following steps:
s1: and standing the substrate adhesive to room temperature, putting the substrate adhesive into a vacuum-pumping container, and vacuumizing to 1000 microns for later use to remove redundant bubbles in the substrate adhesive to be used.
S2: fixing the peripheral edges of the metal foil on a glass plate by using an adhesive tape, and keeping the foil flatly attached to the glass; a primer was poured over the foil and scraped flat. The thickness of the base adhesive after being scraped in the step is consistent with that of the adhesive tape.
S3: and immediately putting the scraped substrate adhesive into a dust-free air-blowing oven, and heating for precuring to remove a large amount of solvent so as to form a film from the adhesive solution. Wherein, the process of precuring comprises the following steps: the temperature is raised to 35 ℃ and then is kept for 1.5h, and then the temperature is raised to 55 ℃ and then is kept for 1.5 h.
S4: and taking out the pre-cured glue solution, putting the pre-cured glue solution into a high-temperature vacuum oven, and performing high-temperature curing after vacuumizing. Wherein the vacuum degree after vacuumizing is 400 microns before high-temperature curing. The high-temperature curing process comprises the following steps: the vacuum was drawn to 200 microns at a temperature of 40 deg.C, 140 deg.C, 240 deg.C, 290 deg.C, respectively, and to 200 microns at a temperature of 240 deg.C.
The morphology of the cured base rubber obtained in example three is similar to that of the example.
Example four
The method for curing the substrate adhesive of the foil type resistance strain gauge in the embodiment comprises the following steps:
s1: standing the substrate adhesive to room temperature, fixing the peripheral edges of the metal foil on a glass plate by using an adhesive tape, and keeping the foil flatly attached to the glass; a primer was poured over the foil and scraped flat. The thickness of the base adhesive after being scraped in the step is consistent with that of the adhesive tape.
S2: and (3) standing the scraped substrate adhesive for 10min, putting the substrate adhesive into a dust-free air-blowing oven, and heating for precuring to remove a large amount of solvent so as to form a film from the adhesive solution. Wherein, the process of precuring comprises the following steps: the temperature is raised to 40 ℃ and then kept for 1h, and then the temperature is raised to 60 ℃ and then kept for 1 h.
S3: and taking out the pre-cured glue solution, putting the pre-cured glue solution into a high-temperature vacuum oven, and performing high-temperature curing. Wherein, the high-temperature curing process comprises the following steps: the temperature is gradually increased to 300 ℃ and then gradually decreased.
The cured base rubber obtained in example four showed a phenomenon of rubber shrinkage as shown in fig. 2.
EXAMPLE five
The method for curing the substrate adhesive of the foil type resistance strain gauge in the embodiment comprises the following steps:
s1: standing the substrate adhesive to room temperature, fixing the peripheral edges of the metal foil on a glass plate by using an adhesive tape, and keeping the foil flatly attached to the glass; a primer was poured over the foil and scraped flat. The thickness of the base adhesive after being scraped in the step is consistent with that of the adhesive tape.
S2: and immediately putting the scraped substrate adhesive into a dust-free air-blowing oven, and heating for precuring to remove a large amount of solvent so as to form a film from the adhesive solution. Wherein, the process of precuring comprises the following steps: the temperature is raised to 40 ℃ and then kept for 1h, and then the temperature is raised to 60 ℃ and then kept for 1 h.
S3: and taking out the pre-cured glue solution, and putting the pre-cured glue solution into a high-temperature vacuum oven for high-temperature curing. Wherein, the high-temperature curing process comprises the following steps: the temperature is gradually increased to 300 ℃ and then gradually decreased.
The cured base rubber obtained in example five was shown in fig. 3, and although no rubber shrinkage occurred, small bubbles appeared in the rubber layer.
EXAMPLE six
The method for curing the substrate adhesive of the foil type resistance strain gauge in the embodiment comprises the following steps:
s1: and standing the substrate adhesive to room temperature, putting the substrate adhesive into a vacuum-pumping container, and vacuumizing to 500 microns for later use to remove redundant bubbles in the substrate adhesive to be used.
S2: fixing the peripheral edges of the metal foil on a glass plate by using an adhesive tape, and keeping the foil flatly attached to the glass; a primer was poured over the foil and scraped flat. In the step, the thickness of the base adhesive after being scraped is consistent with that of the adhesive tape.
S3: and immediately putting the scraped substrate adhesive into a dust-free air-blowing oven, and heating for precuring to remove a large amount of solvent so as to form a film from the adhesive solution. Wherein, the process of precuring comprises the following steps: the temperature is raised to 40 ℃ and then kept for 1h, and then the temperature is raised to 60 ℃ and then kept for 1 h.
S4: and taking out the pre-cured glue solution, putting the pre-cured glue solution into a high-temperature vacuum oven, and performing high-temperature curing. Wherein, the high-temperature curing process comprises the following steps: the temperature is gradually increased to 300 ℃ and then gradually decreased.
The two plates on the left side of fig. 5 are the cured base glue obtained in the sixth example and the glass plate cut from the base glue, and the sixth example is not vacuumized for many times in the high temperature curing process. The two plates on the right side of fig. 5 are the glass plate obtained by cutting the substrate adhesive and the substrate adhesive obtained by curing in the first embodiment, and in the first embodiment, vacuum pumping is performed for multiple times in the high-temperature curing process. As shown in fig. 5, the glass is almost black carbon after being cut, and as the first embodiment is vacuumized for many times before and during high-temperature curing, the formation of carbon can be prevented, the air content in the furnace chamber is reduced to the minimum, and the metal foil is prevented from being oxidized at high temperature to form a dense oxidation film on the surface. As can be seen from fig. 5, the constantly evacuated embodiment also cuts out a corresponding foil material more brightly.
After comparing the first to sixth embodiments, it can be found that the cured substrate adhesive has a smooth and flat surface, no shrinking phenomenon occurs, no small bubbles occur in the adhesive layer, and no generation of a large amount of carbon deposition and oxidation of the foil are found after the substrate adhesive is completely cured. Therefore, the method can well realize the curing of the substrate adhesive and promote the strain gauge to have better performance.
Claims (4)
1. A method for curing base glue of a foil type resistance strain gauge is characterized by comprising the following steps:
(S1) standing the substrate adhesive to room temperature, and then placing the substrate adhesive in a vacuum-pumping container for vacuum-pumping for later use;
(S2) fixing the peripheral edges of the metal foil on a glass plate by using an adhesive tape, and keeping the foil flatly attached to the glass; pouring base glue on the foil and scraping;
(S3) immediately putting the scraped substrate adhesive into a dust-free air-blowing oven, and heating for precuring to remove the solvent so as to enable the adhesive liquid to form a film; the pre-curing comprises: raising the temperature to 35-45 ℃, then preserving heat for 1-1.5 h, raising the temperature to 55-65 ℃, and then preserving heat for 1-1.5 h;
(S4) taking out the pre-cured glue solution, putting the pre-cured glue solution into a high-temperature vacuum oven, performing high-temperature curing after vacuumizing, and performing vacuumizing for many times in the high-temperature curing process; the high-temperature curing process comprises the following steps: when the temperature is increased to 40-60 ℃, 140-160 ℃, 240-260 ℃ and 290-310 ℃, the vacuum is pumped to 200-400 microns, and when the temperature is reduced to 240-260 ℃, the vacuum is pumped to 200-400 microns.
2. The curing method for the substrate adhesive of the foil type electric resistance strain gauge according to claim 1, wherein in the step (S1), the vacuum degree after vacuum pumping is 500-1000 microns.
3. The method for curing the substrate adhesive of the foil-type electrical resistance strain gauge according to claim 1, wherein in the step (S2), the thickness of the substrate adhesive after being scraped is consistent with the thickness of the adhesive tape.
4. The curing method for the substrate adhesive of the foil type electric resistance strain gauge according to claim 1, wherein in the step (S4), before the high-temperature curing is performed, the vacuum degree after the vacuum pumping is 200-400 microns.
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| CN202011432697.1A CN112731983B (en) | 2020-12-09 | 2020-12-09 | Method for curing base glue of foil type resistance strain gauge |
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| CN202011432697.1A CN112731983B (en) | 2020-12-09 | 2020-12-09 | Method for curing base glue of foil type resistance strain gauge |
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| CN112731983B true CN112731983B (en) | 2022-04-29 |
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