CN112701048A - Method for realizing ultra-wideband hybrid integrated circuit for satellite based on copper-lined printed board technology - Google Patents
Method for realizing ultra-wideband hybrid integrated circuit for satellite based on copper-lined printed board technology Download PDFInfo
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- CN112701048A CN112701048A CN202011531131.4A CN202011531131A CN112701048A CN 112701048 A CN112701048 A CN 112701048A CN 202011531131 A CN202011531131 A CN 202011531131A CN 112701048 A CN112701048 A CN 112701048A
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- 238000000034 method Methods 0.000 title claims abstract description 46
- 238000005516 engineering process Methods 0.000 title claims abstract description 24
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 16
- 238000004806 packaging method and process Methods 0.000 claims abstract description 14
- 239000002184 metal Substances 0.000 claims abstract description 7
- 229910052751 metal Inorganic materials 0.000 claims abstract description 7
- 238000010586 diagram Methods 0.000 claims abstract description 5
- 238000012545 processing Methods 0.000 claims abstract description 4
- 238000009517 secondary packaging Methods 0.000 claims abstract description 4
- 238000012360 testing method Methods 0.000 claims abstract description 4
- 238000003466 welding Methods 0.000 claims description 14
- 238000007789 sealing Methods 0.000 claims description 4
- 239000000919 ceramic Substances 0.000 claims description 3
- 238000011056 performance test Methods 0.000 claims description 3
- 239000005022 packaging material Substances 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims description 2
- 238000013461 design Methods 0.000 abstract description 3
- 238000001914 filtration Methods 0.000 description 2
- 230000010354 integration Effects 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000003321 amplification Effects 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- JVPLOXQKFGYFMN-UHFFFAOYSA-N gold tin Chemical compound [Sn].[Au] JVPLOXQKFGYFMN-UHFFFAOYSA-N 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000009462 micro packaging Methods 0.000 description 1
- 238000003199 nucleic acid amplification method Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D89/00—Aspects of integrated devices not covered by groups H10D84/00 - H10D88/00
- H10D89/10—Integrated device layouts
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the groups H01L21/18 - H01L21/326 or H10D48/04 - H10D48/07
- H01L21/4814—Conductive parts
- H01L21/4846—Leads on or in insulating or insulated substrates, e.g. metallisation
- H01L21/4853—Connection or disconnection of other leads to or from a metallisation, e.g. pins, wires, bumps
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- Engineering & Computer Science (AREA)
- Ceramic Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Combinations Of Printed Boards (AREA)
Abstract
本发明公开了一种基于铜衬印制板技术的星用超宽带混合集成电路实现方法，使用铜衬印制板结合简单的工艺以及紧固方式完成微波电路超宽带、小型化、高可靠性实现，具体步骤如下：步骤1、根据电路功能设计电路图，选择所需的微波元器件、芯片；步骤2、微波元器件以及芯片必须保证有独立的气密封装，在星用平台情况下不允许选用塑封类器件，针对裸芯片要求厂家进行二次封装处理；步骤3、根据工作频段需要选择合适的微波电路板，其铜衬的厚度不小于0.5mm，以保证印制板的强度；步骤4、采用SMT工艺对微波电路板进行焊接，使用螺钉紧固工艺完成电路板与金属盒体的装配构成模块；步骤5、对模块进行性能测试。
The invention discloses a method for realizing an ultra-wideband hybrid integrated circuit for satellites based on a copper-lined printed board technology. The copper-lined printed board is used in combination with a simple process and a fastening method to complete the ultra-wideband, miniaturization and high reliability of microwave circuits. The specific steps are as follows: Step 1. Design the circuit diagram according to the circuit function, and select the required microwave components and chips; Step 2. The microwave components and chips must be guaranteed to have independent airtight packaging, which is not allowed in the case of a satellite platform. Select plastic packaged devices, and require manufacturers to carry out secondary packaging processing for bare chips; Step 3. Select a suitable microwave circuit board according to the needs of the working frequency band, and the thickness of the copper lining is not less than 0.5mm to ensure the strength of the printed board; Step 4 , using the SMT process to weld the microwave circuit board, and using the screw fastening process to complete the assembly of the circuit board and the metal box to form a module; step 5, perform performance testing on the module.
Description
Technical Field
The invention belongs to the field of miniaturized design of microwave circuits for satellites, and particularly relates to a method for realizing an ultra-wideband hybrid integrated circuit for a satellite based on a copper-lined printed board technology.
Background
In recent years, electronic products under the application condition of satellite-borne platforms have made strict demands on miniaturization and weight reduction of microwave circuits. The contradiction between the high-density integration of microwave circuits and the high reliability requirement of circuit hardware is the difficulty and the key point of research and circuit implementation. The miniaturization of the satellite-borne microwave circuit is rapidly developed in recent years by the development of microwave components, manufacturing processes and assembling processes, and the main technical approach is realized by the mass application of microwave bare chips and multifunctional chips and the matching of conductive adhesive bonding and gold-tin welding processes. Since the bare chip itself has a very high risk of failure when exposed to air for a long time, additional hermetic sealing processes such as parallel seam welding, laser sealing, and the like are required. The realization mode of the microwave circuit bare chip can introduce a plurality of complex process links, has the risk in the aspect of reliability under the satellite-borne application scene, and has poor product testability and maintainability.
Disclosure of Invention
The invention aims to provide a method for realizing a satellite ultra-wideband hybrid integrated circuit based on a copper lining printed board technology, which effectively reduces the size and the weight of a module by adopting a copper lining board microwave multilayer board technology and effectively reduces the size and the weight of the module by adopting the copper lining board microwave multilayer board technology.
The technical solution for realizing the purpose of the invention is as follows: a method for realizing a satellite ultra-wideband hybrid integrated circuit based on a copper-lined printed board technology is characterized in that the copper-lined printed board is combined with a simple process and a fastening mode to realize ultra-wideband, miniaturization and high reliability of a microwave circuit, and the method comprises the following specific steps:
and 5, performing performance test on the module.
Compared with the prior art, the invention has the remarkable advantages that: the invention realizes the miniaturization of the broadband radio frequency module by adopting a copper-lined printed board process and a microwave device micro-packaging technology in combination with the traditional SMT welding process technology, and meets the requirements of satellite-borne equipment on high integration level, high reliability and the like of a radio frequency circuit. Fill up the vacancy of the equipment in China.
Drawings
FIG. 1 is a flow chart of the method of the present invention.
Fig. 2 is a general block diagram of a corresponding rf module according to the present invention.
Fig. 3 is a graph of an actual measurement result of the S parameter of a typical frequency band of the broadband radio frequency module.
Detailed Description
The present invention is described in further detail below with reference to the attached drawing figures.
With reference to fig. 1, a method for implementing an ultra-wideband hybrid integrated circuit for a satellite based on a copper-lined printed board technology, which uses a copper-lined printed board in combination with a simple process and a fastening mode to implement ultra-wideband, miniaturization and high reliability of a microwave circuit, includes the following specific steps:
and 2, the microwave components and the chips must be packaged independently in an airtight mode, plastic package devices are not allowed to be selected under the condition of the satellite platform, and secondary packaging treatment is required for bare chips.
The microwave components are packaged in an independent airtight mode, and the packaging needs to meet the satellite-borne airtight requirements on the basis of meeting the satellite-borne airtight requirements, comprehensively consider packaging materials, processes, volumes and irradiation resistance in various aspects, and guarantee that the satellite-borne application requirements are met on the basis of guaranteeing the electrical performance of the components. The microwave component and the chip are preferably metal ceramic packaging components.
And 3, selecting a proper microwave printed board according to the working frequency band requirement, wherein the thickness of the copper lining is not less than 0.5mm so as to ensure the strength of the printed board.
And selecting a microwave circuit board suitable for a working frequency band, wherein the thickness of a copper lining needs to ensure that the strength of the printed board can meet welding and assembling requirements, and the number of layers of the printed board needs to meet the interconnection requirements of radio frequency signals, control signals and power supply signals. The microwave plate is selected from a printed plate mark with a copper lining or entrusted to a plate making factory for copper lining plate adhesion.
And 4, welding the microwave circuit board by adopting an SMT (surface mount technology) process, and assembling the circuit board and the metal box body to form a module by adopting a traditional screw fastening mode.
The hybrid integrated circuit uses the traditional surface-mount welding process in assembly, and the independent micro airtight packaging of the device ensures the application of the satellite platform and reduces the circuit area, and simultaneously avoids the risk introduced by a larger cavity sealing welding process; the copper-lined printed board technology ensures that the circuit is suitable for SMT welding and screw fastening assembly modes, and avoids bonding and sintering processes.
And 5, performing performance test on the module.
For modules which do not meet the test requirements, the detachable circuit board performs replacement operation of individual devices until the circuit performance meets the design index.
Example 1
With reference to fig. 1, a principle frame is designed according to module requirements as shown in fig. 2, and the invention performs pre-selection frequency filtering, switch switching, low noise amplification, switch combining, numerical control attenuation and amplitude equalization processing on signals of 1.0 GHz-8.0 GHz, thereby greatly simplifying the matching process of a microwave circuit while realizing module miniaturization and improving the reliability of the module.
In fig. 2, a radio frequency input signal (1.0 GHz-8.0 GHz) is switched between a frequency band and a working mode through a plurality of switches 1, each sub-frequency band is separately designed with a pre-selection frequency filter 2, after filtering, each path of signal is amplified through a low noise amplifier 3, each path of signal of the amplifier is connected with a filter 4 in series, and finally, the signals are combined through a switch 5, the combined radio frequency signal is subjected to amplitude adjustment through a numerical control attenuator 7 and an equalizer 8, switching and segmenting are performed again before output, the signals pass through a second-stage amplifier 9 and a filter 10, and the output of the radio frequency signal is finally completed after the switches are combined.
The microwave components selected by the wideband radio frequency module are bare chips, such as switches BW113D, BW121 and BW110, and amplifiers BW287, BW553 and BW 574. The method is characterized in that manufacturers are required to perform additional airtight packaging on the bare chip device, a metal ceramic packaging form is selected for packaging, the independent airtight packaging can ensure the performance reliability of the microwave device in various environments, particularly in a vacuum environment, the independent packaging can ensure that the microwave chip inside is fully protected, and the device is not required to be additionally hermetically sealed.
The microwave circuit printed board adopts a copper lining microwave board, the number of layers of the board is selected according to the interconnection complexity of radio frequency signals, power supplies, control signals and the like, the thickness of the copper lining is recommended to be not less than 0.5mm, the printed board is ensured to have enough strength to be welded and meet the requirements of traditional screw fastening assembly, in the example, an R588018 multiplied by 12HH/032BR R30105 type board is selected, and the section bar is provided with a 0.5mm copper lining.
In the example, an actual measurement curve of S parameters of a 6-8 GHz frequency band of a broadband radio frequency module product object is shown in FIG. 3, and a test result shows that all indexes of standing wave, gain and gain flatness of a module port meet use requirements, and further shows the effectiveness of the method for realizing the ultra-wideband hybrid integrated circuit based on the copper-clad printed board technology.
Claims (7)
1. A method for realizing a satellite ultra-wideband hybrid integrated circuit based on a copper-lined printed board technology is characterized in that the copper-lined printed board is combined with a simple process and a fastening mode to realize ultra-wideband, miniaturization and high reliability of a microwave circuit, and the method comprises the following specific steps:
step 1, designing a circuit diagram according to circuit functions, and selecting required microwave components and chips;
step 2, the microwave components and the chips must be guaranteed to have independent airtight packaging, plastic package type components are not allowed to be selected under the condition of a satellite platform, and secondary packaging processing is carried out on bare chips by manufacturers;
step 3, selecting a proper microwave circuit board according to the working frequency band requirement, wherein the thickness of a copper lining of the microwave circuit board is not less than 0.5mm so as to ensure the strength of the printed board;
step 4, welding the microwave circuit board by adopting an SMT (surface mount technology) process, and assembling the circuit board and the metal box body to form a module by using a screw fastening process;
and 5, performing performance test on the module.
2. The method for realizing the ultra-wideband hybrid integrated circuit for the satellite based on the copper-lined printed board technology according to claim 1, is characterized in that: the microwave components are packaged in an independent airtight mode, and the packaging needs to meet the satellite-borne airtight requirements on the basis of meeting the satellite-borne airtight requirements, comprehensively consider packaging materials, processes, volumes and irradiation resistance in various aspects, and guarantee that the satellite-borne application requirements are met on the basis of guaranteeing the electrical performance of the components.
3. The method for realizing the ultra-wideband hybrid integrated circuit for the satellite based on the copper-lined printed board technology according to claim 1, is characterized in that: and selecting a microwave circuit board suitable for a working frequency band, wherein the thickness of a copper lining needs to ensure that the strength of the printed board can meet welding and assembling requirements, and the number of layers of the printed board needs to meet the interconnection requirements of radio frequency signals, control signals and power supply signals.
4. The method for realizing the ultra-wideband hybrid integrated circuit for the satellite based on the copper-lined printed board technology according to claim 1, is characterized in that: the hybrid integrated circuit uses the traditional surface-mount welding process in assembly, and the independent micro airtight packaging of the device ensures the application of the satellite platform and reduces the circuit area, and simultaneously avoids the risk introduced by a larger cavity sealing welding process; the copper-lined printed board technology ensures that the circuit is suitable for SMT welding and screw fastening assembly modes, and avoids bonding and sintering processes.
5. The method for realizing the ultra-wideband hybrid integrated circuit for the satellite based on the copper-lined printed board technology according to claim 1, is characterized in that: in step 5, the detachable circuit board is used for replacing individual devices of the modules which do not meet the test requirements.
6. The method for realizing the ultra-wideband hybrid integrated circuit for the satellite based on the copper-lined printed board technology according to claim 1 or 2, is characterized in that: the microwave component and the chip are preferably metal ceramic packaging components.
7. The method for realizing the ultra-wideband hybrid integrated circuit for the satellite based on the copper-lined printed board technology according to the claim 1 or 3, is characterized in that: the microwave plate is selected from a printed plate mark with a copper lining or entrusted to a plate making factory for copper lining plate adhesion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011531131.4A CN112701048A (en) | 2020-12-22 | 2020-12-22 | Method for realizing ultra-wideband hybrid integrated circuit for satellite based on copper-lined printed board technology |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202011531131.4A CN112701048A (en) | 2020-12-22 | 2020-12-22 | Method for realizing ultra-wideband hybrid integrated circuit for satellite based on copper-lined printed board technology |
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| Publication Number | Publication Date |
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| CN112701048A true CN112701048A (en) | 2021-04-23 |
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| CN202011531131.4A Pending CN112701048A (en) | 2020-12-22 | 2020-12-22 | Method for realizing ultra-wideband hybrid integrated circuit for satellite based on copper-lined printed board technology |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113257702A (en) * | 2021-05-12 | 2021-08-13 | 西安微电子技术研究所 | Method for improving standardized module application reliability based on PoP technology |
| CN114630511A (en) * | 2022-03-04 | 2022-06-14 | 中国航天科工集团八五一一研究所 | Implementation method of bidirectional frequency conversion integrated assembly |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050029546A1 (en) * | 2002-11-12 | 2005-02-10 | Masafumi Shigaki | Mounting structure |
| CN1774959A (en) * | 2003-04-15 | 2006-05-17 | 波零公司 | EMI shielding for printed circuit boards |
| CN101436581A (en) * | 2007-11-14 | 2009-05-20 | 泉州波园射频新技术研究中心 | Microwave low-waveband submicron hybrid integrated circuit and preparation technique thereof |
| CN203205400U (en) * | 2013-04-27 | 2013-09-18 | 华中科技大学 | Air-tight metal case for surface mounting |
| CN103632984A (en) * | 2013-12-19 | 2014-03-12 | 贵州振华风光半导体有限公司 | Integration method of leadless planar surface mounting type thick film hybrid integrated circuit |
| CN104485324A (en) * | 2014-12-15 | 2015-04-01 | 贵州振华风光半导体有限公司 | Lead-less ball foot surface adhesion type microwave film hybrid integrated circuit and integration method thereof |
| CN109755715A (en) * | 2018-12-25 | 2019-05-14 | 上海思彼安德智能系统有限公司 | The production method of the airtight grade microwave switch module of Ka full frequency band |
-
2020
- 2020-12-22 CN CN202011531131.4A patent/CN112701048A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20050029546A1 (en) * | 2002-11-12 | 2005-02-10 | Masafumi Shigaki | Mounting structure |
| CN1774959A (en) * | 2003-04-15 | 2006-05-17 | 波零公司 | EMI shielding for printed circuit boards |
| CN101436581A (en) * | 2007-11-14 | 2009-05-20 | 泉州波园射频新技术研究中心 | Microwave low-waveband submicron hybrid integrated circuit and preparation technique thereof |
| CN203205400U (en) * | 2013-04-27 | 2013-09-18 | 华中科技大学 | Air-tight metal case for surface mounting |
| CN103632984A (en) * | 2013-12-19 | 2014-03-12 | 贵州振华风光半导体有限公司 | Integration method of leadless planar surface mounting type thick film hybrid integrated circuit |
| CN104485324A (en) * | 2014-12-15 | 2015-04-01 | 贵州振华风光半导体有限公司 | Lead-less ball foot surface adhesion type microwave film hybrid integrated circuit and integration method thereof |
| CN109755715A (en) * | 2018-12-25 | 2019-05-14 | 上海思彼安德智能系统有限公司 | The production method of the airtight grade microwave switch module of Ka full frequency band |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113257702A (en) * | 2021-05-12 | 2021-08-13 | 西安微电子技术研究所 | Method for improving standardized module application reliability based on PoP technology |
| CN113257702B (en) * | 2021-05-12 | 2023-06-02 | 西安微电子技术研究所 | Method for improving application reliability of standardized module based on PoP process |
| CN114630511A (en) * | 2022-03-04 | 2022-06-14 | 中国航天科工集团八五一一研究所 | Implementation method of bidirectional frequency conversion integrated assembly |
| CN114630511B (en) * | 2022-03-04 | 2024-03-19 | 中国航天科工集团八五一一研究所 | Implementation method of bidirectional frequency conversion integrated assembly |
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