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CN112701038B - CMP machine linkage method and system - Google Patents

CMP machine linkage method and system Download PDF

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Publication number
CN112701038B
CN112701038B CN202011543634.3A CN202011543634A CN112701038B CN 112701038 B CN112701038 B CN 112701038B CN 202011543634 A CN202011543634 A CN 202011543634A CN 112701038 B CN112701038 B CN 112701038B
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Prior art keywords
wafer
cmp
ith
buffer chamber
chamber
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CN202011543634.3A
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Chinese (zh)
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CN112701038A (en
Inventor
奚达
郭志田
瞿治军
夏金伟
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Hua Hong Semiconductor Wuxi Co Ltd
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Hua Hong Semiconductor Wuxi Co Ltd
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H01L21/32115—Planarisation
    • H01L21/3212—Planarisation by chemical mechanical polishing [CMP]
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
    • B24B37/042—Lapping machines or devices; Accessories designed for working plane surfaces operating processes therefor
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/34—Accessories
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67196—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the construction of the transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
    • H01L21/67219—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one polishing chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67276—Production flow monitoring, e.g. for increasing throughput

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Automation & Control Theory (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The application discloses a CMP (chemical mechanical polishing) machine linkage method and system, and relates to the field of semiconductor manufacturing. The CMP tool linkage system comprises at least 2 CMP tools and at least 1 buffer chamber; adjacent 2 CMP machines are connected through 1 buffer chamber; each buffer chamber comprises 2 shielding doors, one shielding door is aligned with the mechanical arm of the ith CMP machine table, and the other shielding door is aligned with the mechanical arm of the (i+1) th CMP machine table; i is an integer greater than or equal to 1; a wafer rack is arranged in the buffer cavity and is used for placing wafers; the problem that the wafer placed in the fault CMP machine table is easy to discard is solved; the wafer in the fault CMP machine table is put into a proper environment in time, and the adjacent CMP machine table is linked to process the taken wafer in time, so that the wafer is prevented from being scrapped.

Description

CMP machine linkage method and system
Technical Field
The present application relates to the field of semiconductor manufacturing, and in particular, to a method and system for linking a CMP tool.
Background
CMP (chemical mechanical polishing ) is a process currently used in integrated circuit fabrication to globally planarize a wafer surface. CMP processes are widely used at various stages of integrated circuit fabrication, such as STI-CMP in front-end-of-line processes, ILD-CMP in back-end-of-line processes, W-CMP, cu-CMP, and the like.
In the Cu-CMP stage, if the CMP machine has a fault alarm, the machine will stop working, and if the rinsing chamber of the machine cannot immediately resume operation, the wafer covered with Cu will be scrapped because the Cu is relatively active and the wafer is exposed for a long time.
Disclosure of Invention
In order to solve the problems in the related art, the present application provides a CMP tool linkage method and system. The technical scheme is as follows:
in a first aspect, embodiments of the present application provide a CMP tool linkage system comprising at least 2 CMP tools, at least 1 buffer chamber;
adjacent 2 CMP machines are connected through 1 buffer chamber;
wherein each buffer chamber comprises 2 shielding doors, one shielding door is aligned with the manipulator of the ith CMP machine table, and the other shielding door is aligned with the manipulator of the (i+1) th CMP machine table; i is an integer greater than or equal to 1;
the buffer chamber is provided with a wafer rack therein for placing wafers.
Optionally, a nozzle is disposed in the buffer chamber, and the nozzle is connected to a transfusion tube, and the transfusion tube is used for conveying the wafer protection liquid.
Optionally, when the structures of the adjacent 2 CMP tools are in non-mirror symmetry, a transfer device is disposed in the buffer chamber, and the transfer device is used for moving the wafer frame;
the bottom of the wafer frame is fixed on the base, and the bottom of the base is connected to the conveying device.
Optionally, in each CMP station, a robot is located between the rinse chamber and the abrasive disc chamber.
In a second aspect, embodiments of the present application provide a CMP tool linkage method, applied to the CMP tool linkage system shown in the first aspect, the method comprising:
when the ith CMP machine station has a chamber fault, a shielding door aligned to the ith CMP machine station on the buffer chamber is controlled to be opened, and a wafer in the ith CMP machine station is taken out by a manipulator of the ith CMP machine station;
the wafer is placed on the wafer holder in the buffer chamber by the robot of the ith CMP tool.
Optionally, when a wafer is placed in the buffer chamber, a nozzle in the buffer chamber is controlled to spray a wafer protection liquid onto the wafer.
Optionally, the method further comprises:
when the chamber fault of the ith CMP machine is relieved, the mechanical arm of the ith CMP machine is controlled to take out the wafer from the buffer chamber, and the taken-out wafer is sent into the ith CMP machine.
Optionally, the method further comprises:
and when the chamber fault of the ith CMP machine is not relieved, the mechanical arm of the (i+1) th CMP machine takes out the wafer from the buffer chamber and sends the taken wafer into the (i+1) th CMP machine.
Optionally, when the structures of the 2 adjacent CMP tools are non-mirror symmetrical, the method further comprises, prior to the robot of the CMP tool removing the wafer from the buffer chamber:
detecting whether the wafer rack is close to a manipulator for taking a wafer;
and if the wafer rack is detected not to be close to the manipulator for taking the wafer, the transmission device in the buffer chamber is controlled to transmit the wafer rack with the wafer to a preset position, wherein the preset position is the position close to the manipulator for taking the wafer.
The technical scheme of the application at least comprises the following advantages:
by arranging the buffer chambers between 2 adjacent CMP machines, when the CMP machines fail and stop running, the wafers in the chambers are taken out by the mechanical arm of the CMP machines and put into the buffer chambers, so that the problem that the wafers placed in the failed CMP machines are easy to discard is solved; the wafer in the fault CMP machine table is put into a proper environment in time, and the adjacent CMP machine table is linked to process the taken wafer in time, so that the wafer is prevented from being scrapped.
Drawings
In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings that are needed in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a block diagram of a CMP tool linkage system according to one embodiment of the present application;
FIG. 2 is a schematic diagram of a buffer chamber provided in an embodiment of the present application;
FIG. 3 is a schematic view of another buffer chamber provided in an embodiment of the present application;
FIG. 4 is a schematic diagram of a linkage of 2 adjacent CMP tools according to one embodiment of the present disclosure;
FIG. 5 is a schematic diagram of another embodiment of the present application for linkage of 2 adjacent CMP tools;
fig. 6 is a flow chart of a method for coupling a CMP tool in accordance with an embodiment of the present application.
Detailed Description
The following description of the embodiments of the present application will be made apparent and complete in conjunction with the accompanying drawings, in which embodiments described are some, but not all, of the embodiments of the present application. All other embodiments, which can be made by one of ordinary skill in the art based on the embodiments herein without making any inventive effort, are intended to be within the scope of the present application.
In the description of the present application, it should be noted that the directions or positional relationships indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. are based on the directions or positional relationships shown in the drawings, are merely for convenience of description of the present application and to simplify the description, and do not indicate or imply that the devices or elements referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically or electrically connected; the two components can be directly connected or indirectly connected through an intermediate medium, or can be communicated inside the two components, or can be connected wirelessly or in a wired way. The specific meaning of the terms in this application will be understood by those of ordinary skill in the art in a specific context.
In addition, the technical features described below in the different embodiments of the present application may be combined with each other as long as they do not collide with each other.
Embodiments of the present application provide a CMP tool linkage system that includes at least 2 CMP tools and at least one buffer chamber.
Adjacent 2 CMP stations are connected by a buffer chamber. Each buffer chamber includes 2 shield doors.
Each shielding door can be opened and closed.
As shown in fig. 1, a buffer chamber 13 is provided between the i-th CMP machine 11 and the i+1-th CMP machine 12. One of the shield doors of the buffer chamber 13 is aligned with the robot of the i < th > CMP station and the other shield door of the buffer chamber 13 is aligned with the robot of the i < th > +1 < th > CMP station.
i is an integer of 1 or more.
When the shielding door aligned with the ith CMP machine is opened, the manipulator of the ith CMP machine can enter the buffer cavity; when the barrier door aligned with the (i+1) th CMP station is opened, the (i+1) th CMP station robot may enter the buffer chamber.
When the mechanical arm of the CMP machine does not need to enter and exit the buffer chamber, the 2 shielding doors of the buffer chamber are normally closed, and the environment in the buffer chamber is isolated from the external environment.
The buffer chamber is provided with a wafer rack therein for placing wafers.
Wafers are placed in the buffer chamber in a single-layer or multi-layer manner by using a wafer frame, and the wafers are in a horizontal state or a vertical state.
In one example, as shown in fig. 2, the wafer 23 is placed horizontally on the wafer holder 21.
In another example, as shown in fig. 3, the wafer 23 is placed vertically on a wafer holder 31.
When the chamber of the CMP machine fails, the wafer in the chamber is taken out by the manipulator of the CMP machine and put into the buffer chamber, and the nozzle 24 is provided in the buffer chamber 13 for protecting the wafer in the buffer chamber, as shown in FIGS. 2 and 3. The nozzle 24 is connected to a transfer line for delivering wafer protection fluid.
And the wafer protection liquid is sprayed to the wafer on the wafer rack through the nozzle, so that the wafer is prevented from being scrapped.
When the wafer is placed horizontally, the nozzles are positioned on the left and right sides of the wafer, as shown in fig. 2; when the wafer is placed vertically, the nozzles are located on the upper and lower sides of the wafer, as shown in fig. 3.
When the structures of the adjacent 2 CMP machines are mirror symmetrical, as shown in fig. 4, the buffer chamber 13 is the same distance as the i-th CMP machine 11 and the i+1-th CMP machine 12.
When the structures of the adjacent 2 CMP tools are in non-mirror symmetry, as shown in fig. 5, in order to facilitate the robot of the CMP tool to pick up the wafer in the buffer chamber, a transfer device is disposed in the buffer chamber, and the transfer device is used for moving the wafer rack.
As shown in fig. 2 and 3, the wafer holder 21 is fixed to the susceptor 22.
When the structures of the adjacent 2 CMP machines are in non-mirror symmetry, the bottom of the base 22 in the buffer chamber is connected to the conveying device, and the conveying device drives the wafer rack to move in the buffer chamber, so that the effect of moving the wafer is achieved.
In one example, the conveyor is a conveyor belt.
Optionally, in each CMP station, a robot is located between the rinse chamber and the abrasive disc chamber.
Referring to fig. 6, an embodiment of the present application provides a flowchart of a CMP tool linkage method, which is applied to the CMP tool linkage system shown in fig. 1, and includes at least the following steps:
and 601, when the ith CMP machine station has a chamber fault, controlling a shielding door aligned with the ith CMP machine station on the buffer chamber to be opened, and taking out the wafer in the ith CMP machine station through a mechanical arm of the ith CMP machine station.
When a chamber failure occurs in the CMP tool, the CMP tool may alert and the CMP tool may cease to operate. If the failure of the CMP tool cannot be immediately recovered, the wafer in the CMP tool may be scrapped.
When the ith CMP machine station has a chamber fault, the buffer chamber is controlled to be aligned with the shielding door of the ith CMP machine station to be opened, and meanwhile, the wafer in the ith CMP machine station is taken out through the manipulator of the ith CMP machine station.
i is an integer of 1 or more.
Optionally, when the buffer chambers are connected to the 2 sides of the ith CMP machine table, the shielding door of the buffer chamber in a non-full-load state is opened; if the 2 buffer chambers are in a non-full load state, the shielding door of any buffer chamber is opened.
In step 602, a wafer is placed on a wafer holder in a buffer chamber by a robot of an ith CMP tool.
And after the manipulator of the ith CMP machine platform puts the wafer taken out from the ith CMP machine platform on the wafer frame of the buffer chamber, the manipulator of the ith CMP machine platform withdraws from the buffer chamber, and the shielding door of the buffer chamber is closed.
When the CMP machine stops running due to faults, the wafers in the CMP machine are taken out timely through the manipulator and placed into the buffer cavity, so that the wafers can be prevented from being always in the faulty CMP machine, the wafers are prevented from being exposed in the air for a long time, or the surfaces of the wafers are prevented from being corroded easily by chemicals such as grinding liquid for a long time, and the wafer scrapping is avoided.
In an alternative embodiment based on the embodiment shown in fig. 6, a nozzle is provided on the wafer holder in the buffer chamber, the nozzle being connected to a transfer line for delivering a wafer protection liquid. When the wafer is placed in the buffer chamber, the nozzle in the buffer chamber is controlled to spray the wafer protection liquid to the wafer.
When the wafer is placed in the buffer chamber, after the chamber fault of the ith CMP machine is relieved, the manipulator of the ith CMP machine is controlled to take out the wafer from the buffer chamber, the wafer taken out is sent into the ith CMP machine, and the ith CMP machine processes the wafer according to the process flow of the machine. After the chamber failure of the CMP tool is released, the wafer that the robot of the i-th CMP tool takes out from the buffer chamber may or may not be the wafer that the i-th CMP tool has previously sent into the buffer chamber.
When the chamber fault of the ith CMP machine is not relieved, the manipulator of the (i+1) th CMP machine takes out the wafer from the buffer chamber and sends the taken-out wafer into the (i+1) th CMP machine; wafers removed from the buffer chamber are processed using the i+1th CMP tool.
When the structures of the 2 adjacent CMP machines are in non-mirror symmetry, a transmission device is arranged in the buffer chamber and is used for transmitting the wafer on the wafer frame, and before the mechanical arm of the CMP machine takes out the wafer from the buffer chamber, the method further comprises the following steps:
detecting whether the wafer rack is close to a manipulator for taking a wafer; if the wafer rack is detected not to be close to the manipulator for taking the wafer, the transmission device in the buffer cavity is controlled to transmit the wafer rack with the wafer to a preset position; if the wafer rack is detected to be close to the manipulator for taking the wafer, the buffer chamber is controlled to open the shielding door, and the manipulator of the CMP machine is controlled to take the wafer out of the buffer chamber.
The predetermined position is a position near the robot arm that is to take the wafer.
Such as: the manipulator of the (i+1) th CMP machine is about to take out the wafer from the buffer chamber, and then whether the wafer rack in the buffer chamber is close to the manipulator of the (i+1) th CMP machine is detected; if the wafer rack is not close to the manipulator of the (i+1) th CMP machine, the transmission device in the buffer chamber is controlled to transmit the wafer rack with the wafer to a preset position, wherein the preset position is the position close to the manipulator of the (i+1) th CMP machine; if the wafer rack is close to the manipulator of the (i+1) th CMP machine, the buffer chamber is controlled to be aligned with the shielding door of the (i+1) th CMP machine to be opened, and the manipulator of the (i+1) th CMP machine is controlled to enter the buffer chamber to take the wafer.
The control of the i-th CMP machine, the i+1-th CMP machine, and the buffer chamber may be automated, or may be manually controlled by an operator, or may be combined with manual control by an operator.
It is apparent that the above examples are given by way of illustration only and are not limiting of the embodiments. Other variations or modifications of the above teachings will be apparent to those of ordinary skill in the art. It is not necessary here nor is it exhaustive of all embodiments. While nevertheless, obvious variations or modifications may be made to the embodiments described herein without departing from the scope of the invention.

Claims (5)

1. A CMP tool linkage system comprising at least 2 CMP tools, at least 1 buffer chamber;
adjacent 2 CMP machines are connected through 1 buffer chamber;
wherein each buffer chamber comprises 2 shielding doors, one shielding door is aligned with the manipulator of the ith CMP machine table, and the other shielding door is aligned with the manipulator of the (i+1) th CMP machine table; i is an integer greater than or equal to 1;
a wafer rack is arranged in the buffer cavity and used for placing wafers;
wherein, in each CMP station, the robot is located between the rinse chamber and the abrasive disc chamber;
when the structures of the adjacent 2 CMP machines are in non-mirror symmetry, a conveying device is arranged in the buffer cavity and is used for moving the wafer frame;
the bottom of the wafer frame is fixed on a base, and the bottom of the base is connected to the conveying device;
the conveying device is provided with a preset position, and the preset position is a position close to the manipulator for taking the wafer.
2. The system of claim 1, wherein a nozzle is disposed within the buffer chamber, the nozzle being coupled to an infusion tube for delivering a wafer protection fluid.
3. The system of claim 2, wherein when the structure of the adjacent 2 CMP stations is non-mirror symmetrical, a transfer device is disposed within the buffer chamber, the transfer device being configured to move the wafer carrier;
the bottom of the wafer frame is fixed on the base, and the bottom of the base is connected to the conveying device.
4. A CMP tool linkage method applied to the CMP tool linkage system according to any one of claims 1 to 3, the method comprising:
when the ith CMP machine station has a chamber fault, a shielding door aligned to the ith CMP machine station on the buffer chamber is controlled to be opened, and a wafer in the ith CMP machine station is taken out by a manipulator of the ith CMP machine station;
placing the wafer on a wafer rack in the buffer cavity through a manipulator of an ith CMP machine table;
wherein, in each CMP station, the robot is located between the rinse chamber and the abrasive disc chamber;
when the chamber fault of the ith CMP machine is relieved, controlling a manipulator of the ith CMP machine to take out the wafer from the buffer chamber, and sending the taken-out wafer into the ith CMP machine; when the chamber fault of the ith CMP machine is not relieved, the manipulator of the ith CMP machine takes out the wafer from the buffer chamber and sends the wafer taken out into the ith CMP machine;
wherein when the structures of the adjacent 2 CMP tools are non-mirror symmetrical, before the robot of the CMP tool takes out the wafer from the buffer chamber, the method further comprises:
detecting whether the wafer rack is close to a manipulator for taking a wafer;
and if the wafer rack is detected not to be close to the manipulator for taking the wafer, controlling the transmission device in the buffer cavity to transmit the wafer rack with the wafer to a preset position, wherein the preset position is a position close to the manipulator for taking the wafer.
5. The method of claim 4, wherein a nozzle within the buffer chamber is controlled to spray a wafer protection liquid onto the wafer when the wafer is placed within the buffer chamber.
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US11482434B2 (en) 2016-10-18 2022-10-25 Belting E-Town Semiconductor Technology Co., Ltd Systems and methods for workpiece processing
CN113723923B (en) * 2021-08-30 2024-03-12 上海华力微电子有限公司 Monitoring method and monitoring system for linkage of machine
CN117226705A (en) * 2023-10-09 2023-12-15 北京晶亦精微科技股份有限公司 Wafer temporary storage device and wafer production line

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CN109148341A (en) * 2018-10-16 2019-01-04 杭州众硅电子科技有限公司 A kind of CMP wafer cleaning equipment
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