CN112689431A - Triaxial MEMS chip assembly quality - Google Patents
Triaxial MEMS chip assembly quality Download PDFInfo
- Publication number
- CN112689431A CN112689431A CN202011520809.9A CN202011520809A CN112689431A CN 112689431 A CN112689431 A CN 112689431A CN 202011520809 A CN202011520809 A CN 202011520809A CN 112689431 A CN112689431 A CN 112689431A
- Authority
- CN
- China
- Prior art keywords
- mems chip
- base
- triaxial
- circuit board
- triaxial mems
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 12
- 229910052802 copper Inorganic materials 0.000 claims abstract description 12
- 239000010949 copper Substances 0.000 claims abstract description 12
- 238000012545 processing Methods 0.000 claims description 11
- 238000004891 communication Methods 0.000 claims description 8
- 210000005069 ears Anatomy 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 2
- 238000003466 welding Methods 0.000 abstract description 8
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000010586 diagram Methods 0.000 description 7
- 230000001133 acceleration Effects 0.000 description 6
- 230000004044 response Effects 0.000 description 6
- 238000013461 design Methods 0.000 description 4
- 239000003822 epoxy resin Substances 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- 230000004048 modification Effects 0.000 description 3
- 229920000647 polyepoxide Polymers 0.000 description 3
- 229910000838 Al alloy Inorganic materials 0.000 description 2
- 230000007774 longterm Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 229910000831 Steel Inorganic materials 0.000 description 1
- 229910001069 Ti alloy Inorganic materials 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 238000006073 displacement reaction Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 230000036541 health Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000012544 monitoring process Methods 0.000 description 1
- 239000003973 paint Substances 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 239000010959 steel Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000013585 weight reducing agent Substances 0.000 description 1
Images
Landscapes
- Micromachines (AREA)
Abstract
The invention provides a triaxial MEMS chip assembling device, comprising: a base assembly; the triaxial MEMS chip circuit assembly is arranged on the base assembly and used for fixing the MEMS chip, wherein the base assembly is provided with a base and a pin, the base is provided with a groove corresponding to the one-to-three flexible circuit boards, and the triaxial MEMS chip circuit assembly comprises the one-to-three flexible circuit boards. The triaxial MEMS chip assembling device provided by the invention has the advantages that under the condition of ensuring the assembling precision, the assembling precision is determined by the positioning step copper pin and welding, the welding connection mode improves the connection reliability, the MEMS chip is inversely welded on the circuit board and embedded into the step inner groove of the base structure, the assembling precision is ensured by tools, the consistency is high, and the environmental adaptability is good.
Description
Technical Field
The invention belongs to the field of structural design, and particularly relates to a triaxial MEMS chip assembling device.
Background
In recent years, in the field of aviation, for example, an acceleration sensor for monitoring structural health of an engine, a piezoelectric acceleration sensor is generally selected due to high temperature of a use environment. For the use environment temperature of a cargo hold or a cabin of an airplane and the like, the MEMS acceleration sensor has the advantages of weight, volume and digitization. Some traditional MEMS acceleration sensor abroad adopt MEMS acceleration chip shell, triaxial data processing MCU shell with ceramic package's top cap and paste on the metal construction wall with epoxy, but this type of structure is except that resistant environmental vibration magnitude, and the frequency response receives structural design restriction, and the cementing connected mode makes operating temperature and life-span also receive certain restriction. Moreover, the orthogonal arrangement of the triaxial MEMS devices during the adhesive assembly process is highly demanding for the operator's skill.
Traditional MEMS acceleration chip leans on epoxy to bond chip housing top cap and base, and no mechanical connection fixed department, though sticky can solve the volume problem, nevertheless because gravity or manual operation produce easily to leak gluey, bubble or displacement, structural strength is decided by the veneer adhesion power, easily influences the frequency response scope of chip, and the connected mode of gluing reduces life and reliability easily in long-term temperature cycle moreover.
Disclosure of Invention
In order to solve the above problems, an object of the present invention is to provide a triaxial MEMS chip mounting apparatus, which has very important engineering application values and meanings for improving the vibration resistance, frequency response, long-term service life reliability, and mounting operability of a triaxial MEMS device. The method solves the problems of compact mechanical fixed connection of the MEMS device chip, and realizes detachable welding, high structural strength, wide frequency response range and compact structure by the way that the MEMS chip is inversely welded on the circuit board and embedded into the step inner groove of the base structure and the step copper pin joint.
The invention provides a triaxial MEMS chip assembling device, comprising:
a base assembly;
a triaxial MEMS chip circuit assembly disposed on the base assembly for fixing the MEMS chip,
wherein the base component is provided with a base and a pin, the base is provided with a groove corresponding to the one-to-three flexible circuit board,
the triaxial MEMS chip circuit assembly comprises a one-to-three flexible circuit board.
The triaxial MEMS chip assembling device provided by the invention is also characterized in that the base is provided with two mounting lugs, and mounting holes are formed in the center of the base and the mounting lugs.
The triaxial MEMS chip assembling device provided by the invention is also characterized in that the pin is a copper pin, and the copper pin is a step pin.
The triaxial MEMS chip assembling device provided by the invention is also characterized in that 3 MEMS chips are fixed on the one-to-three flexible circuit board through welding of the bonding pads.
The triaxial MEMS chip assembling device provided by the invention is also characterized in that the one-driving-three flexible circuit board is provided with an MCU signal processing module for processing information obtained by the MEMS chip.
The triaxial MEMS chip assembling device provided by the invention is also characterized in that the MCU signal processing module and the MEMS chip are respectively arranged on two sides of the one-to-three flexible circuit board.
The triaxial MEMS chip assembling device provided by the invention is also characterized in that a power supply communication interface board used in a relatively long distance or complex environment is arranged on the one-to-three flexible circuit board.
The triaxial MEMS chip assembling device provided by the invention is also characterized in that the power supply communication interface board and the one-to-three flexible circuit board are welded and fixed through the support columns.
The triaxial MEMS chip assembling device provided by the invention is also characterized in that a cavity formed by the one-to-three flexible circuit boards is filled with epoxy resin.
The triaxial MEMS chip assembly device provided by the invention is also characterized in that the device separates the ground wire of the shell structure from the product cable shield through the product socket output through a circuit.
Advantageous effects
The triaxial MEMS chip assembling device provided by the invention has the advantages that under the condition of ensuring the assembling precision, the assembling precision is determined by the positioning step copper pin and welding, the welding connection mode improves the connection reliability, the MEMS chip is inversely welded on the circuit board and embedded into the step inner groove of the base structure, the assembling precision is ensured by tools, the consistency is high, and the environmental adaptability is good.
Drawings
FIG. 1 is a cross-sectional view of a triaxial MEMS chip mounting apparatus provided in accordance with the present invention;
FIG. 2 is a schematic structural diagram of a base assembly according to an embodiment of the present invention;
FIG. 3 is a schematic structural diagram of a three-axis MEMS chip circuit assembly according to an embodiment of the present invention;
fig. 4 is a schematic structural diagram of a base according to an embodiment of the present invention;
FIG. 5 is a schematic structural diagram of a stepped copper pin according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a pillar according to an embodiment of the present invention;
fig. 7 is a schematic structural diagram of a one-to-three flexible circuit board according to an embodiment of the present invention;
fig. 8 is a schematic structural diagram of a power supply communication interface board according to an embodiment of the invention;
fig. 9 is an assembly view of a triaxial chip mounting apparatus according to an embodiment of the present invention.
Detailed Description
The present invention is further described in detail with reference to the drawings and examples, but it should be understood that these embodiments are not intended to limit the present invention, and those skilled in the art should understand that the functional, methodological, or structural equivalents of these embodiments or substitutions may be included in the scope of the present invention.
In the description of the embodiments of the present invention, it should be understood that the terms "central", "longitudinal", "lateral", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only used for convenience in describing and simplifying the description of the present invention, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first," "second," "third," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicit to a number of indicated technical features. Thus, a feature defined as "first," "second," etc. may explicitly or implicitly include one or more of that feature. In the description of the invention, the meaning of "a plurality" is two or more unless otherwise specified.
The terms "mounted," "connected," and "coupled" are to be construed broadly and may, for example, be fixedly coupled, detachably coupled, or integrally coupled; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the creation of the present invention can be understood by those of ordinary skill in the art through specific situations.
As shown in fig. 1 to 9, the present embodiment provides a triaxial MEMS chip mounting apparatus including: a base 1; a base assembly; the triaxial MEMS chip circuit assembly is arranged on the base assembly and used for fixing the MEMS chip, wherein the base assembly is provided with a base 1 and a pin 2, a groove corresponding to the one-driving-three flexible circuit board 4 is formed in the base 1, and the triaxial MEMS chip circuit assembly comprises the one-driving-three flexible circuit board 4. The groove is used for matching with the one-to-three flexible circuit board 4.
In the embodiment, the one-to-three flexible circuit board 4 is welded with the pin 2 which is pinned on the base 1 through interference fit, the structural rigidity is high, the strength is high, and the product can work at a higher temperature through high-temperature soldering tin. The one-to-three flexible circuit board 4 is welded and pin-jointed with the base, so that the frequency response range is wide, and the frequency response of the chip can be fully displayed. All the components are connected by welding or pin joint without cementation, and the structure has good temperature stability and long service life.
In some embodiments, the base 1 is provided with two mounting ears, and mounting holes are formed in the center of the base 1 and at the mounting ears. The base 1 is an aluminum alloy or titanium alloy structural part, and is a bottom threaded hole and two-side mounting lug internal thread mechanical interface, the aluminum alloy material can be provided with a steel wire thread sleeve to improve the strength of a threaded structure, two-side mounting lugs can be omitted as required, four-side step grooves of a central mounting seat of the base 1 are convenient to embed an MEMS chip device, and the fourth groove is used for weight reduction design. The MEMS chip 3 is inversely welded on the one-driving-three flexible circuit board 4 and is embedded into the step inner groove of the base 1, and the MEMS chip is simple and compact in structure and light in weight. The mechanical connection mode of the base 1 not only reduces the weight, but also expands the installation mode.
In some embodiments, the pin is a copper pin, and the copper pin 2 is a stepped pin. The design of step round pin is beaten base 1 through interference fit and is flushed with 1 face of base. The pin hitting acting force acts on the step surface of the step pin, the deformation of the end part of the pin is prevented, and the fit between the flexible circuit board 4 with one drive three and the base 1 can be improved. The pin joint structure of the step copper pin 2 can lead the circuit of the MEMS chip 3 to be led into the ground wire of the shell structure, or lead the inner layer shield to be connected with the ground wire of the shell structure after the double-layer shield is led in, thus realizing high anti-interference capability. All devices are of an assembly type structure, no glue joint is formed, and assembly consistency is high.
In some embodiments, 3 pieces of MEMS chips 3 are fixed on the one-to-three flexible circuit board 4 by pad bonding. And the one-to-three flexible circuit board 4 is provided with an MCU signal processing module for processing information obtained by the MEMS chip 3. The MCU signal processing module and the MEMS chip 3 are respectively arranged on two sides of the one-to-three flexible circuit board 4. The flexible circuit board 4 with three is provided with a power supply communication interface board 5 used in relatively long distance or complex environment. The power supply communication interface board 5 and the one-to-three flexible circuit board 4 are welded and fixed through the support 6. The MEMS chip 3 is inverted and embedded into the step inner groove of the base 1, the MUC signal processing module device can be positively installed or inversely welded according to requirements, and the power supply communication interface board 5 is welded and fixed with the one-driving-three flexible circuit board 4 through the supporting column 6 to form a triaxial MEMS chip circuit assembly. The MEMS chip circuit component is connected in a welding mode, can be detached and is high in maintainability.
In some embodiments, the cavity surrounded by the one-to-three flexible circuit board 4 is filled with epoxy resin. The device separates the ground wire of the housing structure from the product cable shield through the product socket output by the circuit. According to the requirement of the triaxial measurement vector direction, the triaxial MEMS chip circuit component is assembled on the step copper pin 2 of the base 1 and is flatly welded and fixed, epoxy resin and the like are filled in the cavity of the triaxial MEMS chip 3 to be further fixed according to the requirement, and finally three-proofing paint is sprayed to improve the three-proofing capability.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention. The above description is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, several modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be regarded as the protection scope of the present invention.
Claims (10)
1. A triaxial MEMS chip mounting apparatus comprising:
a base assembly;
a triaxial MEMS chip circuit assembly disposed on the base assembly for fixing the MEMS chip,
wherein the base component is provided with a base and a pin, the base is provided with a groove corresponding to the one-to-three flexible circuit board,
the triaxial MEMS chip circuit assembly comprises a one-to-three flexible circuit board.
2. The triaxial MEMS chip mounting apparatus of claim 1, wherein the base has two mounting ears, and the base has mounting holes at the center and the mounting ears.
3. The triaxial MEMS chip mounting apparatus of claim 1, wherein the pin is a copper pin, the copper pin being a stepped pin.
4. The triaxial MEMS chip mounting apparatus of claim 1, wherein 3 MEMS chips are fixed to the one-to-three flexible printed circuit board by pad bonding.
5. The triaxial MEMS chip mounting apparatus of claim 1, wherein the one-to-three flexible printed circuit board is provided with an MCU signal processing module for processing information obtained by the MEMS chip.
6. The triaxial MEMS chip assembly device of claim 5, wherein the MCU signal processing module and the MEMS chip are respectively disposed on two sides of a one-to-three flexible circuit board.
7. The triaxial MEMS chip mounting apparatus of claim 1, wherein the one-to-three flexible printed circuit board is provided with a power communication interface board for use in relatively long distance or complex environments.
8. The triaxial MEMS die attachment apparatus of claim 7, wherein the power communication interface board and the one-to-three flexible printed circuit board are fixed by soldering via posts.
9. The triaxial MEMS chip mounting apparatus of claim 1, wherein a cavity defined by the one-to-three flex circuit boards is filled with epoxy.
10. The triaxial MEMS die attach apparatus of claim 1 wherein the apparatus electrically isolates a ground line of the housing structure from a product cable shield through a product socket output.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011520809.9A CN112689431A (en) | 2020-12-21 | 2020-12-21 | Triaxial MEMS chip assembly quality |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011520809.9A CN112689431A (en) | 2020-12-21 | 2020-12-21 | Triaxial MEMS chip assembly quality |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112689431A true CN112689431A (en) | 2021-04-20 |
Family
ID=75450033
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011520809.9A Pending CN112689431A (en) | 2020-12-21 | 2020-12-21 | Triaxial MEMS chip assembly quality |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112689431A (en) |
Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102121829A (en) * | 2010-08-09 | 2011-07-13 | 汪滔 | Miniature inertia measurement system |
| CN106959138A (en) * | 2017-04-26 | 2017-07-18 | 苏州捷研芯纳米科技有限公司 | Differential pressure flow transducer and its processing method based on MEMS technology |
| CN107618191A (en) * | 2017-08-30 | 2018-01-23 | 江西昌河航空工业有限公司 | A kind of honeycomb shapes positioner |
| CN207289509U (en) * | 2017-08-16 | 2018-05-01 | 歌尔科技有限公司 | A kind of clamping device |
| CN108692723A (en) * | 2018-04-02 | 2018-10-23 | 中国兵器工业集团第二四研究所苏州研发中心 | A kind of micro-inertia measuring modular construction of anti high overload |
| US20180362331A1 (en) * | 2016-11-22 | 2018-12-20 | Goertek Inc. | Method for forming filter net on mems sensor and mems sensor |
| CN110440798A (en) * | 2019-07-16 | 2019-11-12 | 北京自动化控制设备研究所 | Integrated micro inertial measurement unit and inertial navigation system in high precision |
| CN110793520A (en) * | 2019-11-04 | 2020-02-14 | 中国兵器工业集团第二一四研究所苏州研发中心 | Micro-inertia assembly suitable for high-dynamic severe environment |
| CN110987217A (en) * | 2019-11-27 | 2020-04-10 | 苏州长风航空电子有限公司 | Temperature measurement clothes and temperature sensor |
| CN111157153A (en) * | 2018-11-07 | 2020-05-15 | 广州智工控制技术有限公司 | Intelligent high-precision force-sensitive sensor |
| CN211205616U (en) * | 2020-02-24 | 2020-08-07 | 南京新力感电子科技有限公司 | MEMS pressure sensor device |
-
2020
- 2020-12-21 CN CN202011520809.9A patent/CN112689431A/en active Pending
Patent Citations (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102121829A (en) * | 2010-08-09 | 2011-07-13 | 汪滔 | Miniature inertia measurement system |
| US20180362331A1 (en) * | 2016-11-22 | 2018-12-20 | Goertek Inc. | Method for forming filter net on mems sensor and mems sensor |
| CN106959138A (en) * | 2017-04-26 | 2017-07-18 | 苏州捷研芯纳米科技有限公司 | Differential pressure flow transducer and its processing method based on MEMS technology |
| CN207289509U (en) * | 2017-08-16 | 2018-05-01 | 歌尔科技有限公司 | A kind of clamping device |
| CN107618191A (en) * | 2017-08-30 | 2018-01-23 | 江西昌河航空工业有限公司 | A kind of honeycomb shapes positioner |
| CN108692723A (en) * | 2018-04-02 | 2018-10-23 | 中国兵器工业集团第二四研究所苏州研发中心 | A kind of micro-inertia measuring modular construction of anti high overload |
| CN111157153A (en) * | 2018-11-07 | 2020-05-15 | 广州智工控制技术有限公司 | Intelligent high-precision force-sensitive sensor |
| CN110440798A (en) * | 2019-07-16 | 2019-11-12 | 北京自动化控制设备研究所 | Integrated micro inertial measurement unit and inertial navigation system in high precision |
| CN110793520A (en) * | 2019-11-04 | 2020-02-14 | 中国兵器工业集团第二一四研究所苏州研发中心 | Micro-inertia assembly suitable for high-dynamic severe environment |
| CN110987217A (en) * | 2019-11-27 | 2020-04-10 | 苏州长风航空电子有限公司 | Temperature measurement clothes and temperature sensor |
| CN211205616U (en) * | 2020-02-24 | 2020-08-07 | 南京新力感电子科技有限公司 | MEMS pressure sensor device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP1192419B1 (en) | Integrated and multi-axis sensor assembly and packaging | |
| CN106946213B (en) | A kind of pressure sensor and preparation method thereof | |
| KR101200837B1 (en) | Pressure senser structure body for car and mothod of packaging | |
| CN102132136A (en) | Sensor device packaging and method | |
| CN103852109A (en) | Method of integrating a temperature sensing element | |
| CN108990259A (en) | A kind of PCB circuit board | |
| CN211205616U (en) | MEMS pressure sensor device | |
| CN103943573A (en) | Novel integrated circuit internal packaging method | |
| CN109855789B (en) | Sensor for monitoring surface pressure of underwater small-sized vehicle | |
| CN112689431A (en) | Triaxial MEMS chip assembly quality | |
| CN214308873U (en) | Sensor with a sensor element | |
| US7152473B1 (en) | Integrated and multi-axis sensor assembly and packaging | |
| CN219416504U (en) | Novel force sensor | |
| CN205653159U (en) | Multiaxis MEMS sensor module | |
| CN214224204U (en) | Vibration temperature composite sensor | |
| CN212363530U (en) | Gas common mode pressure measuring device | |
| CN214200477U (en) | Array pressure sensor for measuring multipoint pressure of rudder surface of seaplane | |
| CN105800544B (en) | Multi-axis MEMS sensor module and vertical assembling method thereof | |
| CN111157153A (en) | Intelligent high-precision force-sensitive sensor | |
| CN211205612U (en) | Pressure sensor | |
| CN211668575U (en) | Target type flowmeter with target surface anti-collision function | |
| KR20150139173A (en) | Strain gauge pressure sensor | |
| CN220041879U (en) | Improved photoelectric device packaging structure | |
| CN216361659U (en) | High-precision static three-dimensional force sensor | |
| CN217255806U (en) | Hanging piece testing tool |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20210420 |