CN112667043A - Server - Google Patents
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- CN112667043A CN112667043A CN202011580976.2A CN202011580976A CN112667043A CN 112667043 A CN112667043 A CN 112667043A CN 202011580976 A CN202011580976 A CN 202011580976A CN 112667043 A CN112667043 A CN 112667043A
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D10/00—Energy efficient computing, e.g. low power processors, power management or thermal management
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Abstract
本申请实施例提供了一种服务器，包括：服务器本体；连接板，连接于服务器本体；多个插口，设置在连接板上，每个插口包括散热模块识别部和电源模块识别部；散热模块，散热模块包括第一金手指；电源模块，电源模块包括第二金手指；第一金手指和第二金手指的结构相同。该服务器安装过程中，若服务器对电源功率的需求较高，则可以在插口内插接电源模块，减少散热模块的设置数量，使得服务器的连接板可以装配更多的电源模块；若服务器对电源功率需求不高，则可以在插口内插接散热模块，适当减少电源模块的设置数量，使得服务器的散热效果提升，使得电源模块和散热模块的布置方式更为灵活，可改装性得到提高，能够适用于服务器的不同需求。
An embodiment of the present application provides a server, comprising: a server body; a connection board connected to the server body; a plurality of sockets, arranged on the connection board, each socket including a heat dissipation module identification part and a power module identification part; a heat dissipation module, The heat dissipation module includes a first golden finger; the power module includes a second golden finger; the first golden finger and the second golden finger have the same structure. During the installation of the server, if the server has a high demand for power supply, you can plug a power supply module into the socket to reduce the number of cooling modules, so that the connection board of the server can be equipped with more power supply modules; If the power requirement is not high, the cooling module can be inserted into the socket to appropriately reduce the number of power modules, so that the cooling effect of the server is improved, the arrangement of power modules and cooling modules is more flexible, and the retrofitability is improved. Suitable for different needs of servers.
Description
Technical Field
The invention relates to the technical field of communication, in particular to a server.
Background
Based on different requirements for the server, in order to meet the requirements of users for the performance of the server, a high-performance server is usually equipped with a high-power processor, and in order to meet the requirements of users for cost performance, a low-power processor is usually equipped in the server. Therefore, the current servers have different requirements on power supply power, and the servers need to be assembled with different connecting plates to adapt to different numbers of power supply modules, so that server production lines with different power supply requirements cannot be compatible, the production cost of the servers is high, and the refittability is poor.
Disclosure of Invention
The present invention is directed to solving at least one of the problems of the prior art or the related art.
In view of this, according to an embodiment of the present application, there is provided a server, including: a server body; the connecting plate is connected to the server body; a plurality of sockets arranged on the connecting plate, each socket comprising a heat dissipation module identification part and a power supply module identification part; the heat dissipation module comprises a first golden finger which is used for being plugged in the socket; the power supply module comprises a second golden finger which is used for being plugged in the socket; the first golden finger and the second golden finger are identical in structure.
In a first possible implementation manner of the embodiment of the application, the first gold finger or the second gold finger includes: the heat dissipation module contact piece is inserted in the heat dissipation module identification part under the condition that the first golden finger or the second golden finger is inserted in the socket; and the power supply module contact piece is inserted in the power supply module identification part under the condition that the first golden finger or the second golden finger is inserted in the socket.
In a second possible implementation manner of the embodiment of the present application, the server further includes: the controller is connected with the server body and the jack and used for acquiring plugging information through the heat dissipation module contact piece and the power supply module contact piece; the plugging information comprises heat dissipation module plugging information and power module plugging information.
In a third possible implementation manner of the embodiment of the present application, the socket further includes: a voltage input identification part connected to the server body; and a grounding part connected to the server body.
In a fourth possible implementation manner of the embodiment of the present application, the heat dissipation module further includes: the first voltage input end is plugged in the voltage input identification part under the condition that the first golden finger is plugged in the socket; the first grounding end is inserted in the grounding part under the condition that the first golden finger is inserted in the socket; the power module further includes: the second voltage input end is plugged in the voltage input identification part under the condition that the second golden finger is plugged in the socket; the second grounding end is plugged in the grounding part under the condition that the second golden finger is plugged in the socket; the first voltage input end and the second voltage input end have the same structure, and the first grounding end and the second grounding end have the same structure.
In a fifth possible implementation manner of the embodiment of the present application, the heat dissipation module further includes: the fan is connected to the first golden finger.
In a sixth possible implementation manner of the embodiment of the present application, the power module further includes: and the power supply is connected with the second golden finger.
In a seventh possible implementation manner of the embodiment of the present application, the server further includes: the first bayonet end is formed at the connecting side of the heat dissipation module and the power supply module; and the clamping end is arranged on the connecting plate and is positioned on the peripheral side of the socket.
In an eighth possible implementation manner of the embodiment of the present application, the server further includes: the power socket is connected with the power module.
In a ninth possible implementation manner of the embodiment of the present application, the number of the sockets is 4 to 10; and/or the heat dissipation module is a fan.
Compared with the prior art, the server provided by the embodiment of the invention at least has the following beneficial effects:
the server provided by the embodiment of the application dissipates heat through the heat dissipation module, and supplies power to the server body through the power supply module. The first golden finger used for being connected with the socket of the connecting plate on the heat dissipation module and the second golden finger used for being connected with the socket of the connecting plate on the power module are identical in structure, so that the plurality of sockets on the connecting plate can be plugged with the heat dissipation module and can also be plugged with the power module. Because the socket on the connecting plate can be applicable to heat dissipation module and power module simultaneously, consequently in server production process, the server of different power demand can be produced through same production line, can reduction in production cost. In the installation process of the power supply module of the server, if the requirement of the server on the power supply power is high, the power supply module can be inserted into the socket, so that the number of the heat dissipation modules is reduced, and more power supply modules can be assembled on a connecting plate of the server; if the server is not high in power demand, the heat dissipation modules can be inserted into the sockets in a selected mode, the number of the power modules can be reduced appropriately, the heat dissipation effect of the server is improved, the arrangement modes of the power modules and the heat dissipation modules are more flexible, refittability is improved, and the server can meet different requirements.
Drawings
The above and/or additional aspects and advantages of the present invention will become apparent and readily appreciated from the following description of the embodiments, taken in conjunction with the accompanying drawings of which:
fig. 1 is a schematic structural diagram of a server according to an embodiment of the present disclosure;
FIG. 2 is a schematic structural diagram of a server according to another embodiment of the present disclosure;
fig. 3 is a schematic structural diagram of a connection board of a server according to an embodiment of the present disclosure;
fig. 4 is a schematic structural diagram of a heat dissipation module of a server according to an embodiment of the present disclosure;
fig. 5 is a schematic structural diagram of a server according to an embodiment of the present application in an IO front outgoing line state and an AC rear outgoing line state;
fig. 6 is a schematic structural diagram of a server in an IO/AC outgoing line state according to an embodiment provided in the present application;
fig. 7 is a schematic structural diagram of a server in an IO/AC outgoing state according to an embodiment of the present application.
Wherein, the correspondence between the reference numbers and the part names in fig. 1 to 7 is:
the system comprises a server body 1, a connecting plate 2, a socket 3, a heat dissipation module 4, a power supply module 5 and a power supply socket 6;
a 401 first golden finger, a 402 first voltage input terminal, a 403 first ground terminal, a 4011 first heat dissipation module contact, a 4012 first power supply module contact;
501 a second gold finger, 502 a second voltage input terminal, 503 a second ground terminal.
Detailed Description
In order that the above objects, features and advantages of the present invention can be more clearly understood, the present invention will be described in further detail below with reference to the accompanying drawings and detailed description. It should be noted that the embodiments and features of the embodiments of the present application may be combined with each other without conflict.
In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention, however, the present invention may be practiced in other ways than those specifically described herein, and therefore the scope of the present invention is not limited by the specific embodiments disclosed below.
As shown in fig. 1, one embodiment of the present application provides a server, including: server body 1, connecting plate 2, a plurality of socket 3, heat dissipation module 4 and power module 5.
As shown in fig. 2 and 3, the connection board 2 is connected to the server body 1; a plurality of sockets 3 are arranged on the connecting plate 2, and each socket 3 comprises a heat dissipation module identification part and a power supply module identification part; the heat dissipation module 4 comprises a first golden finger 401, and the first golden finger 401 is used for being plugged in the socket 3; the power supply module 5 comprises a second golden finger 501, and the second golden finger 501 is used for being plugged in the socket 3; the first gold finger 401 and the second gold finger 501 have the same structure.
The server provided by the embodiment of the application is provided with the heat dissipation module 4, the server body is used for dissipating heat, and the power supply module 5 is used for supplying power to the server body 1. The first golden finger 401 on the heat dissipation module 4 for being connected with the socket 3 of the connection board 2 and the second golden finger 501 on the power module 5 for being connected with the socket 3 of the connection board 2 have the same structure, so that the plurality of sockets 3 on the connection board 2 can be plugged with both the heat dissipation module 4 and the power module 5. Because socket 3 on the connecting plate 2 can be applicable to heat dissipation module 4 and power module 5, consequently in server production process, the server of different mains power demands can be produced through same production line, can reduction in production cost.
According to the server provided by the embodiment of the application, in the installation process of the server, if the demand of the server on power supply power is high, the power supply modules 5 can be inserted into the sockets 3, so that the number of the heat dissipation modules 4 is reduced, and more power supply modules 5 can be assembled on the connecting plate 2 of the server; if the server is not high in power demand, the heat dissipation module 4 can be inserted into the socket 3, the number of the power modules 5 can be reduced appropriately, the heat dissipation effect of the server is improved, the arrangement modes of the power modules 5 and the heat dissipation module 4 are more flexible, the refittability is improved, and the server can meet different requirements.
In some examples, the heat dissipation module 4 may include a fan connected to the first gold finger 401, and the power module 5 may include a power supply connected to the second gold finger 501.
In some examples, the first gold finger 401 or the second gold finger 501 includes: the heat dissipation module contact piece is inserted in the heat dissipation module identification part under the condition that the first golden finger 401 or the second golden finger 501 is inserted in the jack 3; and the power module contact is plugged in the power module identification part under the condition that the first golden finger 401 or the second golden finger 501 is plugged in the jack 3.
As shown in fig. 4, a specific structure of the first golden finger 401 or the second golden finger 501 is provided in this example, the first golden finger 401 includes a first heat dissipation module contact 4011 and a first power module contact 4012, when the heat dissipation module 4 is connected to the socket 3, the first heat dissipation module contact 4011 is plugged in the heat dissipation module identification portion, the first power module contact 4012 is plugged in the power module identification portion, the first heat dissipation module contact 4011 can supply power to the heat dissipation module 4, and the temperature of the server can be lowered through the heat dissipation module 4.
In some examples, as shown in fig. 4, the first thermal module contact 4011 includes two metal contacts capable of ensuring a stable connection between the thermal module 4 and the socket 3, and the first power module contact includes seven metal contacts capable of ensuring a stable connection between the power module 5 and the socket 3, wherein the metal contacts are formed with metal layers on the front and back surfaces, and the two surfaces of the metal contacts have the same structure.
In this example, a specific structure of the first golden finger 401 or the second golden finger 501 is provided, the second golden finger 501 includes a second heat dissipation module contact and a second power module contact, when the power module 5 is connected to the jack 3, the second heat dissipation module contact is plugged into the heat dissipation module identification portion, the second power module contact is plugged into the power module identification portion, the second heat dissipation module contact can supply power to the power module 5, and the server body can be supplied with power through the power module 5.
In some examples, the server further comprises: the controller is connected with the server body 1 and the jack 3 and is used for acquiring plugging information through the heat dissipation module contact and the power supply module contact; the plugging information comprises heat dissipation module plugging information and power module plugging information.
In this embodiment, through the setting of the controller, the specific type of the plug-in unit inserted in the socket 3 of the connection board 2 can be identified, so that the server body 1 drives the heat dissipation module 4 or the power supply module 5 to work. Under the condition that the heat dissipation module 4 is plugged in the socket 3, the controller establishes a connection relation with the heat dissipation module 4 through the heat dissipation module contact piece, the controller can acquire plugging information of the heat dissipation module, and the server body 1 can determine that the heat dissipation module 4 is plugged in the socket 3. Under the condition that the power module 5 is plugged in the socket 3, the controller establishes a connection relation with the power module 5 through the power module contact piece, the controller can acquire power module plugging information, and the server body 1 can determine that the power module 5 is plugged in the socket 3.
In some examples, the socket 3 further comprises: a voltage input recognition unit connected to the server body 1; and a grounding part connected to the server body 1.
In this embodiment, a voltage may be applied to the heat dissipation module 4 or the power module 5 by the setting of the voltage input recognition portion, which facilitates the normal operation of the heat dissipation module 4 and the voltage module. The grounding part can be used for grounding the heat dissipation module 4 or the power supply module 5, so that the safe operation of the server is ensured.
As shown in fig. 2, in some examples, the heat dissipation module 4 further includes: a first voltage input terminal 402, the first voltage input terminal 402 being plugged into the voltage input identification portion when the first gold finger 401 is plugged into the socket 3; a first grounding terminal 403, wherein the first grounding terminal 403 is plugged in the grounding part under the condition that the first golden finger 401 is plugged in the socket 3; the power supply module 5 further includes: a second voltage input terminal 502, wherein the second voltage input terminal 502 is plugged into the voltage input identification part when the second golden finger 501 is plugged into the socket 3; a second grounding terminal 503, wherein the second grounding terminal 503 is plugged in the grounding part under the condition that the second golden finger 501 is plugged in the socket 3; the first voltage input terminal 402 and the second voltage input terminal 502 have the same structure, and the first ground terminal 403 and the second ground terminal 503 have the same structure.
In this embodiment, when the heat dissipation module 4 is plugged into the socket 3, the first voltage input terminal 402 is plugged into the voltage input identification portion, the server body 1 can supply power to the heat dissipation module 4, and the heat dissipation module 4 can dissipate heat for the server; the first grounding terminal 403 is plugged into the grounding portion, so that grounding processing can be performed on the heat dissipation module 4, and safe operation of the heat dissipation module 4 can be guaranteed.
In this embodiment, when the voltage module is plugged into the socket 3, the second voltage input terminal 502 is plugged into the voltage input identification portion, and the server body 1 can power on the voltage module; the second grounding end 503 is plugged in the grounding portion to perform grounding processing for the voltage module, which can ensure the safe operation of the power module 5.
In some examples, the heat dissipation module 4 further includes: the fan is connected to the first golden finger 401.
In this embodiment, the heat dissipation module 4 includes a fan, which can reduce the cost of the heat dissipation module 4 and ensure the heat dissipation effect of the server body 1.
In some examples, the power module 5 further comprises: a power supply connected to the second gold finger 501.
In this embodiment, the power module 5 includes a power supply, which can prolong the service life of the power module 5 and ensure the stability of power supply for the server body 1.
In some examples, the server further comprises: the first bayonet end is formed at the connecting side of the heat dissipation module 4 and the power supply module 5; and the buckling end is arranged on the connecting plate 2 and is positioned on the periphery of the socket.
In this embodiment, further include first bayonet socket end and buckle end, under the condition that thermal module 4 or power module 5 peg graft on socket 3, first bayonet socket end can with buckle end joint, can improve the fixed stability of thermal module 4 and power module 5.
In some examples, the server further comprises: the power socket 6 is connected to the power module 5.
In this embodiment, the power module 7 is connected to the power socket 6, and can supply power to the power module 5, thereby ensuring normal operation of the server body 1.
As shown in fig. 5-7, in some examples, the server further comprises: the data interaction end is connected to the server body 1; and a power socket 6 connected to the power module 5.
In the embodiment, the data interaction terminal is arranged to facilitate the server to send or receive data. Through the arrangement of the power socket 6, the power module 5 is convenient to power on.
As shown in fig. 5 to 7, in some examples, the data interaction end is located on one side of the server body 1, and the connection board 2 is located on the other side of the server body 1.
In this embodiment, a data interaction end is arranged on one side of the server body 1, and a connection board 2 is arranged on the other side of the server body, so that the wiring layout of the server is facilitated. Through the setting of data interaction end, the server body 1 of being convenient for receives and dispatches signal and data.
As shown in fig. 5, in some examples, the power receptacle 6 is located on one side of the connection plate 2.
In this embodiment, power socket 6 is located one side of connecting plate 2, and when the user had the demand of outgoing line before IO, the outgoing line behind the AC to the server, set up the server in the rack, the server is provided with the place ahead of data interaction end orientation rack. The data interaction end of the server can be connected with a lead wire on one side of the server, and a power supply module 5 which is positioned on the other side of the server and is plugged on the connecting board 2 can be directly connected with a power supply socket 6.
Wherein, IO refers to the signal input end and the signal output end of the data interaction end, and AC refers to the wiring end.
In some examples, the power socket 6 is located at one side of the data interaction end, and the power socket 6 is connected to the power module 5 through a cable.
In this embodiment, as shown in fig. 6, when a user has an IO/AC outgoing line demand for the server, the server is disposed in the cabinet, and a side of the server where the data interaction end is disposed faces the front of the cabinet. The lead of the data interaction end of the server can be directly led out, and the power socket 6 is connected with the power module 5 positioned on the other side of the server body 1 through a cable. In some examples, cables are threaded within the server body 1.
In this embodiment, as shown in fig. 7, when a user has an IO/AC outgoing line demand for a server, the server is disposed in the cabinet, and the side of the server where the connection board 2 is disposed faces the front of the cabinet. The lead of the data interaction end of the server can be directly led out, and the power socket 6 is connected with the power module 5 positioned on the other side of the server body 1 through a cable. In some examples, cables are threaded within the server body 1.
In some examples, the number of sockets 3 is 4 to 10; and/or the heat dissipation module 4 is a fan.
In this embodiment, the number of the sockets 3 is 4 to 10, and the requirements of different servers for power supply and heat dissipation can be met by arranging 4 to 10 sockets 3.
In this embodiment, the heat dissipation module 4 is a fan, which can reduce the cost of the heat dissipation module 4 and ensure the heat dissipation effect of the server body 1.
In the description of the present invention, the terms "plurality" or "a plurality" refer to two or more, and unless otherwise specifically limited, the terms "upper", "lower", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are merely for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention; the terms "connected," "mounted," "secured," and the like are to be construed broadly and include, for example, fixed connections, removable connections, or integral connections; may be directly connected or indirectly connected through an intermediate. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the description of the present invention, the description of the terms "one embodiment," "some embodiments," "specific embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In the present invention, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011580976.2A CN112667043A (en) | 2020-12-28 | 2020-12-28 | Server |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011580976.2A CN112667043A (en) | 2020-12-28 | 2020-12-28 | Server |
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| CN112667043A true CN112667043A (en) | 2021-04-16 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202011580976.2A Pending CN112667043A (en) | 2020-12-28 | 2020-12-28 | Server |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN118732805A (en) * | 2024-08-30 | 2024-10-01 | 苏州元脑智能科技有限公司 | Server power supply equipment and server |
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| US20160217088A1 (en) * | 2013-10-09 | 2016-07-28 | Pilz Gmbh & Co. Kg | Control apparatus with load monitoring |
| CN210895182U (en) * | 2019-12-09 | 2020-06-30 | 深圳金语科技有限公司 | Vehicle-mounted terminal device based on normalized interface |
| CN111381641A (en) * | 2020-04-29 | 2020-07-07 | 加弘科技咨询(上海)有限公司 | Chassis and electronic device for its application |
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2020
- 2020-12-28 CN CN202011580976.2A patent/CN112667043A/en active Pending
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US20110273836A1 (en) * | 2010-05-07 | 2011-11-10 | Inventec Corporation | Rack server |
| CN102411502A (en) * | 2011-09-09 | 2012-04-11 | 南京西奥仪表测控有限公司 | Component sensing node and construction method thereof |
| US20160217088A1 (en) * | 2013-10-09 | 2016-07-28 | Pilz Gmbh & Co. Kg | Control apparatus with load monitoring |
| CN103889195A (en) * | 2014-04-10 | 2014-06-25 | 华为技术有限公司 | Heat radiation structure of electronic device and communication device provided with heat radiation structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN118732805A (en) * | 2024-08-30 | 2024-10-01 | 苏州元脑智能科技有限公司 | Server power supply equipment and server |
| CN118732805B (en) * | 2024-08-30 | 2025-01-03 | 苏州元脑智能科技有限公司 | Server power supply equipment and server |
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