CN112654297B - Main unit of ultrasonic equipment - Google Patents
Main unit of ultrasonic equipment Download PDFInfo
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- CN112654297B CN112654297B CN201880097319.7A CN201880097319A CN112654297B CN 112654297 B CN112654297 B CN 112654297B CN 201880097319 A CN201880097319 A CN 201880097319A CN 112654297 B CN112654297 B CN 112654297B
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- A—HUMAN NECESSITIES
- A61—MEDICAL OR VETERINARY SCIENCE; HYGIENE
- A61B—DIAGNOSIS; SURGERY; IDENTIFICATION
- A61B8/00—Diagnosis using ultrasonic, sonic or infrasonic waves
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- Ultra Sonic Daignosis Equipment (AREA)
- Measuring And Recording Apparatus For Diagnosis (AREA)
Abstract
An ultrasonic equipment host, its host motherboard is installed in main casing, it encloses into front installation cavity with the front casing, enclose into back installation cavity casing with the back casing. A part of the modules such as a circuit board, a probe switching box, a power module, an input/output interface module and a hard disk, which are provided with a control unit, in the host are arranged in the front mounting cavity, and the other part of the modules are arranged in the rear mounting cavity. The layout reasonably distributes the modules on the front side and the rear side of the motherboard of the host, each module can be independently disassembled and assembled, and when related modules are required to be maintained or replaced, the corresponding modules can be assembled and disassembled only by opening the front shell or the rear shell, so that the disassembly steps are fewer, the operation is convenient, and the maintenance efficiency is greatly improved.
Description
Technical Field
The application relates to ultrasonic equipment, in particular to layout of a main machine of the ultrasonic equipment.
Background
The internal modules of a general ultrasonic equipment host are distributed in disorder, so that during maintenance, the disassembly and assembly steps are more, and the working hours are longer. For example, when removing some of the main modules, it is often necessary to remove multiple housings, and even in some cases it is necessary to remove multiple other modules first, which can result in a very cumbersome overall maintenance operation.
Disclosure of Invention
The application mainly provides a host of ultrasonic equipment, which has different layouts and is convenient for the disassembly and assembly of each module.
An embodiment provides a host computer of ultrasonic equipment, includes casing, host computer motherboard, is equipped with circuit board, probe switching box, power module, input/output interface module, hard disk and is used for carrying out radiating fan to the host computer of control unit: the housing includes a main housing, a front housing facing a user, the front housing being mounted on a front side of the main housing, and a rear housing opposite the front housing, the rear housing being mounted on a rear side of the main housing; the main machine motherboard is arranged in the main shell, forms a front mounting cavity with the front shell, and forms a rear mounting cavity with the rear shell; and one part of the circuit board, the probe switching box, the power module, the input/output interface module and the hard disk is arranged in the front mounting cavity, and the other part of the circuit board, the probe switching box, the power module, the input/output interface module and the hard disk is arranged in the rear mounting cavity.
In one embodiment, the circuit board, the probe adapter box and the power module are positioned in the front mounting cavity and mounted on a motherboard of the host; the input/output interface module is positioned in the rear mounting cavity and is mounted on the motherboard of the host.
In one embodiment, the main housing has a cavity opening in the front and rear directions, the main motherboard is located in the middle of the cavity, and the front and rear housings cover the cavity from the openings in the front and rear directions, respectively.
In one embodiment, the fan is located at the lower part of the main housing and below the circuit board, the probe adapter box, the hard disk and the input/output interface module.
In one embodiment, the front housing includes a first front housing and a second front housing, the first front housing is located above the second front housing, the first front housing and the main housing enclose a first front mounting cavity, the probe adapter box is located in the first front mounting cavity, and the first front housing has a socket corresponding to the probe adapter box; the second front shell and the main shell enclose a second front mounting cavity, the second front mounting cavity is positioned below the first front mounting cavity, and the circuit board and the power module are positioned in the second front mounting cavity.
In one embodiment, the front housing includes a first front housing and a second front housing, the first front housing is located above the second front housing, the first front housing and the main housing enclose a first front mounting cavity, and the circuit board and the power module are located in the first front mounting cavity; the second front shell and the main shell enclose a second front mounting cavity, the second front mounting cavity is positioned below the first front mounting cavity, the probe adapter box is positioned in the second front mounting cavity, and the second front shell is provided with a socket corresponding to the probe adapter box.
In one embodiment, the system further comprises an electrocardiogram module mounted in the front mounting cavity.
In one embodiment, the electrocardiogram module is mounted in the first front mounting cavity together with the probe pod.
In one embodiment, the front housing and the rear housing are respectively fixedly mounted on the main housing in a detachable clamping structure or a screw fastening structure.
In one embodiment, the device further comprises a communication module for communication, wherein the communication module is mounted on a motherboard of the host and is positioned in the rear mounting cavity.
In one embodiment, the communication module comprises at least one of a wifi module and a 4G module.
In one embodiment, the communication module is mounted on a lower portion of a motherboard of the host.
In one embodiment, the hard disk is mounted in the rear mounting cavity and mounted with the hard disk in a lower portion of the host motherboard.
In one embodiment, the circuit board is mounted in a chassis mounted on a motherboard of the host.
In one embodiment, the battery module is mounted in the front mounting cavity.
In one embodiment, the chassis, battery module and power module are mounted side-by-side on a host motherboard.
In one embodiment, the device further comprises a sound box mounted in the rear mounting cavity.
In one embodiment, the sound box is located in an upper portion of the rear mounting cavity.
According to the ultrasonic equipment host machine of the embodiment, the host motherboard is arranged in the main shell, and forms a front mounting cavity with the front shell and forms a rear mounting cavity with the rear shell. One part of the modules such as the chassis of the host, the probe adapter box, the power module, the input/output interface module and the hard disk is arranged in the front mounting cavity, and the other part is arranged in the rear mounting cavity. The layout reasonably distributes the modules on the front side and the rear side of the motherboard of the host, each module can be independently disassembled and assembled, and when related modules are required to be maintained or replaced, the corresponding modules can be assembled and disassembled only by opening the front shell or the rear shell, so that the disassembly steps are fewer, the operation is convenient, and the maintenance efficiency is greatly improved.
In particular, some modules with larger volumes in the host, such as a chassis with a control unit, a probe adapter box, a power module, etc., may be installed in the front mounting cavity for disassembly, while some modules with smaller volumes, such as an input/output interface module, may be installed in the rear mounting cavity.
Drawings
FIG. 1 is a schematic diagram of an ultrasonic device host according to an embodiment of the present application;
Fig. 2 is an exploded view of a host computer of an ultrasonic device according to an embodiment of the present application.
Detailed Description
The application will be described in further detail below with reference to the drawings by means of specific embodiments. Wherein like elements in different embodiments are numbered alike in association. In the following embodiments, numerous specific details are set forth in order to provide a better understanding of the present application. However, one skilled in the art will readily recognize that some of the features may be omitted, or replaced by other elements, materials, or methods in different situations. In some instances, related operations of the present application have not been shown or described in the specification in order to avoid obscuring the core portions of the present application, and may be unnecessary to persons skilled in the art from a detailed description of the related operations, which may be presented in the description and general knowledge of one skilled in the art.
Furthermore, the described features, operations, or characteristics of the description may be combined in any suitable manner in various embodiments. Also, various steps or acts in the method descriptions may be interchanged or modified in a manner apparent to those of ordinary skill in the art. Thus, the various orders in the description and drawings are for clarity of description of only certain embodiments, and are not meant to be required orders unless otherwise indicated.
The numbering of the components itself, e.g. "first", "second", etc., is used herein merely to distinguish between the described objects and does not have any sequential or technical meaning. The term "coupled" as used herein includes both direct and indirect coupling (coupling), unless otherwise indicated.
An embodiment of the application provides a host computer of an ultrasonic device. The ultrasonic apparatus is an apparatus for performing related applications, such as medical diagnosis, using ultrasonic imaging techniques. The host is an important component of the ultrasonic equipment, and a control unit, a probe adapter and other components are usually installed on the host.
Referring to fig. 1 and 2, in one embodiment, the host includes a housing 100, a host motherboard 200, a chassis 301, a probe adapter box 302, a power module 303, an input/output interface module (IO module) 304, a hard disk 305, and a fan 306.
The housing 100 has a mounting cavity in which each module is mounted. The housing 100 includes a main housing 110, a front housing 120 facing a user, the front housing 120 being mounted on a front side of the main housing 110, and a rear housing 130 opposite the front housing 120, the rear housing 130 being mounted on a rear side of the main housing 110. The front and rear are referred to herein as the front side of the main body facing the user and the rear side of the main body facing away from the user in normal use.
Referring to fig. 1 and 2, in one embodiment, the main housing 110 has a cavity opened in a front-rear direction, and the front housing 120 and the rear housing 130 cover the cavity in the front-rear direction, respectively, to form a mounting cavity.
With continued reference to fig. 1 and 2, the host motherboard 200 is mounted within the main housing 110, which encloses a front mounting cavity with the front housing 120 and a rear mounting cavity with the rear housing 130. One part of the chassis 301, the probe adapter 302, the power module 303, the input/output interface module 304 and the hard disk 305 of the host are installed in the front installation cavity, and the other part is installed in the rear installation cavity.
The layout reasonably distributes the modules on the front side and the rear side of the motherboard of the host, each module can be independently disassembled and assembled, and when related modules are required to be maintained or replaced, the corresponding modules can be assembled and disassembled only by opening the front shell or the rear shell, so that the disassembly steps are fewer, the operation is convenient, and the maintenance efficiency is greatly improved. Each module can be split-packed in the front mounting cavity and the rear mounting cavity to form reasonable layout.
The front housing 120 and the rear housing 130 may be mounted in a detachable manner, for example, the front housing 120 and the rear housing 130 are respectively and fixedly mounted on the main housing 110 in a detachable fastening structure or a screw fastening structure, and during maintenance, the front housing 120 and the rear housing 130 may be easily detached, thereby further facilitating maintenance work.
The chassis 301 is provided with a circuit board or the like provided with a control unit including a Central Processing Unit (CPU), a memory, and the like for realizing centralized control and data processing. The chassis 301 is located in the front mounting cavity and mounted on the host motherboard 200. In addition to mounting the circuit board with the control unit in the chassis 301, the circuit board with the control unit may be directly mounted in the front mounting cavity or the rear mounting cavity, for example, directly mounted on the front side or the rear side of the host motherboard 200, so that the chassis 301 may be omitted, and the structure may be simplified.
The probe adapter box 302 is used for docking an ultrasonic probe, and is also installed in the front installation cavity with the power module 303, and can be fixed by being installed on the main motherboard 200. The chassis 301, the probe adapter box 302 and the power module 303 are relatively large in size, so that the chassis 301, the probe adapter box 302 and the power module 303 are all installed in the front installation cavity, the front installation cavity is convenient to assemble and disassemble, the host can maintain balance of force, and the front installation cavity is convenient for connection of circuits. The input/output interface module 304 is small and can be disposed in the rear mounting cavity and mounted on the host motherboard 200.
The hard disk 305 may be mounted in the chassis 301, in a front mounting cavity, or in a rear mounting cavity, as desired. In this embodiment, as shown in fig. 2, the hard disk 305 is mounted on the host motherboard 200 within the rear mounting cavity. The fan 306 is installed in the main housing 110 for heat dissipation of the host.
Further, referring to fig. 2, in one embodiment, the fan 306 is located at a lower portion of the main housing 110 and is located below the chassis 301, the probe adapter box 302, the hard disk 305, and the i/o interface module 304. The fan 306 may be disposed in either the front or rear mounting cavity, or may span both mounting cavities, which blow air upward from the bottom of the main unit to dissipate heat from the modules. The fan 306 can be fixed in a detachable manner such as a quick-release screw, and can be pulled out from the side surface directly after the quick-release screw is manually removed.
With continued reference to fig. 1 and 2, in one embodiment, the front housing 120 includes a first front housing 121 and a second front housing 122. The first front case 121 is located above the second front case 122. The first front housing 121 encloses a first front mounting cavity with the main housing 110. The probe pod 302 is positioned within the first front mounting cavity and the first front housing 121 has a socket corresponding to the probe pod 302. The second front housing 122 encloses a second front mounting cavity with the main housing 110. The second front mounting cavity is located below the first front mounting cavity. The chassis 301 and the power module 303 are located within the second front mounting cavity.
The front mounting cavity can be divided into at least two parts by the design of the first front housing 121 and the second front housing 122, and when the probe adapter box 302 needs to be maintained, the whole front housing 120 is not required to be disassembled, and only the first front housing 121 can be disassembled. When maintenance is required for the chassis 301, the power module 303, and the like, the second front case 122 is only required to be detached. The structure can further simplify maintenance workload and improve working efficiency.
Of course, in other embodiments, the chassis 301 (or a circuit board provided with a control unit) and the power module may also be located in the first front mounting cavity. The probe pod 302 is positioned within a second front mounting cavity and the second front housing has a socket corresponding to the probe pod 302.
Furthermore, the front housing 120 may be a unitary housing or may be separate into three or more components.
Further, in some embodiments, the host computer further includes an electrocardiogram module (ECG module) 309 for implementing an electrocardiogram drawing function. Referring to fig. 2, the electrocardiogram module 309 is installed in the front mounting cavity and can be fixed by being installed on the main body motherboard 200 or the housing 100.
More specifically, the electrocardiogram module 309 is mounted in the first front mounting cavity together with the probe pod 302 for easy disassembly and connection.
Further, in some embodiments, the host further comprises a communication module for communicating. The communication module is mounted on the host motherboard 200 within the rear mounting cavity. Referring to fig. 2, the communication module may include at least one of a wifi module 307 and a 4G module 308. Of course, the communication module may also be another form of module, such as a wired communication module. Referring to fig. 2, in one embodiment, the communication module (such as wifi module 307 and 4G module 308) may be installed at the lower portion of the host motherboard 200, so as to fully utilize the lower space of the host motherboard 200. Of course, the communication module may be mounted at the middle and upper portions of the host motherboard 200.
With continued reference to fig. 2, in one embodiment, the hard disk 305 is installed in the rear mounting cavity and is installed in the lower portion of the host motherboard 200 together with communication modules (e.g., wifi module 307 and 4G module 308), so as to facilitate centralized maintenance and management.
Further, referring to fig. 2, in some embodiments, the host further includes a battery module 310, and the battery module 310 is mounted in the front mounting cavity. The battery module 310 may be mounted on the host motherboard 200. In one example configuration, the chassis 301, battery module 310, and power module 303 are mounted side-by-side on the host motherboard 200 such that the several modules form an orderly arrangement for ease of management while maximizing the use of space in the front mounting cavity. The device can be arranged at the lower part of the front mounting cavity, namely in the second front mounting cavity, so that the space of the second front mounting cavity is fully utilized. Meanwhile, a dust screen 312 may be further installed above the cabinet 301, the battery module 310, and the power module 303 for dust prevention.
Further, referring to fig. 2, in some embodiments, the host computer further includes a sound 311, and the sound 311 is installed in the rear mounting cavity. In particular, the sound 311 may be located at an upper portion of the rear mounting cavity to facilitate sound propagation.
As shown in fig. 2, the electrocardiogram module 309 and the probe adapter box 302 may be divided into a region, which is located in the first front mounting cavity, and only the first front housing 121 needs to be opened when maintenance is required. The chassis 301, the battery module 310, and the power module 303 may be divided into a region, which is located in the second front mounting chamber, and only the second front case 122 may be opened when maintenance is required. The sound 311, wifi module 307, 4G module 308, hard disk 305, and input/output interface module (IO module) 304 may be divided into a region, which is located in the rear mounting cavity, and when maintenance is required, only the rear housing 130 needs to be opened. The fan 306 may be divided into separate areas that may be directly removed from the bottom of the main housing 110.
The host layout structure shown in this embodiment can enable each module to be distributed on the front and rear sides of the host motherboard, and the modules can be directly operated only by dismantling the corresponding front shell or rear shell during maintenance. In addition, the structure designs the main module or the vulnerable module at a higher position convenient to maintain, so that the main module or the vulnerable module is convenient to disassemble and assemble, and the maintenance efficiency is greatly improved.
The foregoing description of the application has been presented for purposes of illustration and description, and is not intended to be limiting. Variations of the above embodiments may be made by those of ordinary skill in the art in light of the present teachings.
Claims (17)
1. The main machine of the ultrasonic equipment is characterized by comprising a shell, a main machine motherboard, a circuit board provided with a control unit, a probe adapter box, a power module, an input/output interface module, a hard disk and a fan for radiating heat of the main machine: the housing includes a main housing, a front housing facing a user, the front housing being mounted on a front side of the main housing, and a rear housing opposite the front housing, the rear housing being mounted on a rear side of the main housing; the main machine motherboard is arranged in the main shell, forms a front mounting cavity with the front shell, and forms a rear mounting cavity with the rear shell; one part of the circuit board, the probe adapter box, the power module, the input/output interface module and the hard disk is arranged in the front mounting cavity, and the other part of the circuit board, the probe adapter box, the power module, the input/output interface module and the hard disk is arranged in the rear mounting cavity;
the main shell is provided with a cavity which is opened in the front and rear directions, the main motherboard is positioned in the middle of the cavity, and the front shell and the rear shell cover the cavity from the openings in the front and rear directions respectively.
2. The host machine of claim 1, wherein the circuit board, the probe adapter box and the power module are positioned in the front mounting cavity and mounted on a motherboard of the host machine; the input/output interface module is positioned in the rear mounting cavity and is mounted on the motherboard of the host.
3. The host computer of claim 1, wherein the fan is located in a lower portion of the main housing and below the circuit board, probe adapter box, power module, hard disk, and input-output interface module.
4. The host machine of claim 1, wherein the front housing comprises a first front housing and a second front housing, the first front housing is positioned above the second front housing, the first front housing and the main housing enclose a first front mounting cavity, the probe adapter box is positioned in the first front mounting cavity, and the first front housing has a socket corresponding to the probe adapter box; the second front shell and the main shell enclose a second front mounting cavity, the second front mounting cavity is positioned below the first front mounting cavity, and the circuit board and the power module are positioned in the second front mounting cavity.
5. The host machine of claim 1, wherein the front housing comprises a first front housing and a second front housing, the first front housing being located above the second front housing, the first front housing and the main housing enclosing a first front mounting cavity, the circuit board and the power module being located within the first front mounting cavity; the second front shell and the main shell enclose a second front mounting cavity, the second front mounting cavity is positioned below the first front mounting cavity, the probe adapter box is positioned in the second front mounting cavity, and the second front shell is provided with a socket corresponding to the probe adapter box.
6. The host computer of claim 4, further comprising an electrocardiogram module, wherein the electrocardiogram module is mounted in the front mounting cavity.
7. The host computer of claim 6, wherein the electrocardiogram module is mounted in the first front mounting cavity with the probe pod.
8. The main unit according to claim 1, wherein the front housing and the rear housing are fixedly mounted on the main housing with a detachable fastening structure or a screw fastening structure, respectively.
9. The host of claim 1, further comprising a communication module for communication, the communication module mounted on a host motherboard within the rear mounting cavity.
10. The host of claim 9, wherein the communication module comprises at least one of a wifi module and a 4G module.
11. The host of claim 9, wherein the communication module is mounted on a lower portion of a motherboard of the host.
12. The host machine of claim 11, wherein the hard disk is mounted in the rear mounting chamber and mounted together with the hard disk at a lower portion of the host motherboard.
13. The host of claim 1, further comprising a chassis, the circuit board mounted within the chassis, the chassis mounted on a motherboard of the host.
14. The host computer of claim 13, further comprising a battery module mounted within the front mounting cavity.
15. The host machine of claim 14, wherein the chassis, battery module and power module are mounted side-by-side on a host motherboard.
16. The host computer of any one of claims 1-15, further comprising a sound device mounted within the rear mounting cavity.
17. The host computer of claim 16, wherein the sound is located in an upper portion of the rear mounting cavity.
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2018/123799 WO2020132925A1 (en) | 2018-12-26 | 2018-12-26 | Main device for ultrasonic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112654297A CN112654297A (en) | 2021-04-13 |
| CN112654297B true CN112654297B (en) | 2024-10-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201880097319.7A Active CN112654297B (en) | 2018-12-26 | 2018-12-26 | Main unit of ultrasonic equipment |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN112654297B (en) |
| WO (1) | WO2020132925A1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN213850767U (en) * | 2020-10-20 | 2021-08-03 | 深圳邦健生物医疗设备股份有限公司 | Color ultrasonic instrument |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106551706A (en) * | 2015-09-30 | 2017-04-05 | 无锡祥生医学影像有限责任公司 | The diasonographs of easy disassembly |
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| DE4010545A1 (en) * | 1990-04-02 | 1991-10-10 | Tes Tappert Gmbh | Modular computer housing - has basic housing into which are inserted individual modules which can be tested discretely, e.g. CPU, ventilator unit modules |
| JP2007282957A (en) * | 2006-04-19 | 2007-11-01 | Aloka Co Ltd | Wireless ultrasonograph |
| CN2935239Y (en) * | 2006-08-10 | 2007-08-15 | 原亮 | Reconfigurable compact flat computer |
| CN202283259U (en) * | 2011-03-21 | 2012-06-27 | 深圳市蓝韵实业有限公司 | Case module structure of B ultrasonic equipment |
| CN103006257B (en) * | 2011-09-27 | 2015-09-16 | 深圳迈瑞生物医疗电子股份有限公司 | A kind of display equipment supporting device and diasonograph thereof |
| CN202619694U (en) * | 2012-04-28 | 2012-12-26 | 深圳市开立科技有限公司 | Convenient-detachable modular structure, host and ultrasonic system |
| CN102973294A (en) * | 2012-12-17 | 2013-03-20 | 深圳市海曼医疗设备有限公司 | Ultrasonic diagnosis instrument chassis |
| US10709418B2 (en) * | 2015-03-10 | 2020-07-14 | Chison Medical Technologies Co., Ltd. | Ultrasound diagnostic apparatus with easy assembly and disassembly |
| CN204719642U (en) * | 2015-06-25 | 2015-10-21 | 广州七喜医疗设备有限公司 | A kind of cabinet assembly structure of easy disassembly |
| CN207571643U (en) * | 2017-11-02 | 2018-07-03 | 泰科电子(上海)有限公司 | data center equipment |
| CN107647884A (en) * | 2017-11-13 | 2018-02-02 | 无锡祥生医疗科技股份有限公司 | Medical ultrasound mainframe box, medical ultrasound imaging apparatus and system |
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2018
- 2018-12-26 WO PCT/CN2018/123799 patent/WO2020132925A1/en active Application Filing
- 2018-12-26 CN CN201880097319.7A patent/CN112654297B/en active Active
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN106551706A (en) * | 2015-09-30 | 2017-04-05 | 无锡祥生医学影像有限责任公司 | The diasonographs of easy disassembly |
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| Publication number | Publication date |
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| WO2020132925A1 (en) | 2020-07-02 |
| CN112654297A (en) | 2021-04-13 |
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