CN112654130A - Circuit board with waterproof and electromagnetic wave preventing functions and manufacturing method thereof - Google Patents
Circuit board with waterproof and electromagnetic wave preventing functions and manufacturing method thereof Download PDFInfo
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- CN112654130A CN112654130A CN201910963700.3A CN201910963700A CN112654130A CN 112654130 A CN112654130 A CN 112654130A CN 201910963700 A CN201910963700 A CN 201910963700A CN 112654130 A CN112654130 A CN 112654130A
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- electromagnetic wave
- waterproof insulating
- insulating layer
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 11
- 239000000758 substrate Substances 0.000 claims abstract description 32
- -1 polyethylene terephthalate Polymers 0.000 claims description 26
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 17
- 238000000034 method Methods 0.000 claims description 15
- 238000005507 spraying Methods 0.000 claims description 13
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 claims description 12
- 239000011248 coating agent Substances 0.000 claims description 12
- 238000000576 coating method Methods 0.000 claims description 12
- 239000011810 insulating material Substances 0.000 claims description 12
- 238000005516 engineering process Methods 0.000 claims description 11
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 8
- 229920002873 Polyethylenimine Polymers 0.000 claims description 8
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 8
- 229910052782 aluminium Inorganic materials 0.000 claims description 8
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 8
- 229910021393 carbon nanotube Inorganic materials 0.000 claims description 8
- 239000002041 carbon nanotube Substances 0.000 claims description 8
- 229910052802 copper Inorganic materials 0.000 claims description 8
- 239000010949 copper Substances 0.000 claims description 8
- 239000004205 dimethyl polysiloxane Substances 0.000 claims description 8
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 8
- 229910052737 gold Inorganic materials 0.000 claims description 8
- 239000010931 gold Substances 0.000 claims description 8
- AMGQUBHHOARCQH-UHFFFAOYSA-N indium;oxotin Chemical compound [In].[Sn]=O AMGQUBHHOARCQH-UHFFFAOYSA-N 0.000 claims description 8
- 229920000435 poly(dimethylsiloxane) Polymers 0.000 claims description 8
- 229920003207 poly(ethylene-2,6-naphthalate) Polymers 0.000 claims description 8
- 239000004417 polycarbonate Substances 0.000 claims description 8
- 239000011112 polyethylene naphthalate Substances 0.000 claims description 8
- 229920000139 polyethylene terephthalate Polymers 0.000 claims description 8
- 239000005020 polyethylene terephthalate Substances 0.000 claims description 8
- 239000004814 polyurethane Substances 0.000 claims description 8
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 239000004952 Polyamide Substances 0.000 claims description 7
- 239000004642 Polyimide Substances 0.000 claims description 7
- 229920002647 polyamide Polymers 0.000 claims description 7
- 229920000515 polycarbonate Polymers 0.000 claims description 7
- 229920001721 polyimide Polymers 0.000 claims description 7
- 229920000642 polymer Polymers 0.000 claims description 7
- 229920000098 polyolefin Polymers 0.000 claims description 7
- 229920002635 polyurethane Polymers 0.000 claims description 7
- 239000007888 film coating Substances 0.000 claims description 6
- 238000009501 film coating Methods 0.000 claims description 6
- 229910021389 graphene Inorganic materials 0.000 claims description 6
- 229910002804 graphite Inorganic materials 0.000 claims description 6
- 239000010439 graphite Substances 0.000 claims description 6
- 229920000058 polyacrylate Polymers 0.000 claims description 5
- 230000000712 assembly Effects 0.000 claims 2
- 238000000429 assembly Methods 0.000 claims 2
- 235000013870 dimethyl polysiloxane Nutrition 0.000 description 6
- 238000000151 deposition Methods 0.000 description 5
- 230000008021 deposition Effects 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- 239000004696 Poly ether ether ketone Substances 0.000 description 4
- 239000004695 Polyether sulfone Substances 0.000 description 4
- 230000005540 biological transmission Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229920006393 polyether sulfone Polymers 0.000 description 4
- 229920002530 polyetherether ketone Polymers 0.000 description 4
- 239000000047 product Substances 0.000 description 4
- 230000008054 signal transmission Effects 0.000 description 4
- 229920003229 poly(methyl methacrylate) Polymers 0.000 description 3
- 239000004926 polymethyl methacrylate Substances 0.000 description 3
- 238000010521 absorption reaction Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000006698 induction Effects 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 238000005240 physical vapour deposition Methods 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000008020 evaporation Effects 0.000 description 1
- 238000001704 evaporation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- CXQXSVUQTKDNFP-UHFFFAOYSA-N octamethyltrisiloxane Chemical compound C[Si](C)(C)O[Si](C)(C)O[Si](C)(C)C CXQXSVUQTKDNFP-UHFFFAOYSA-N 0.000 description 1
- 230000003647 oxidation Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 238000004987 plasma desorption mass spectroscopy Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a circuit board with waterproof and electromagnetic wave preventing functions and a manufacturing method thereof, the circuit board comprises a circuit board, a waterproof insulating layer and an electromagnetic wave preventing layer, wherein a plurality of electronic components are arranged on a substrate of the circuit board, the surfaces of the substrate and the plurality of electronic components are covered with the waterproof insulating layer which is non-conductive, and the surface of at least one electronic component covered with the waterproof insulating layer is covered with the electromagnetic wave preventing layer.
Description
Technical Field
The invention relates to a circuit board with waterproof and electromagnetic wave preventing functions and a manufacturing method thereof, in particular to a circuit board with a waterproof insulating layer and an electromagnetic wave preventing layer formed on the surface of the circuit board in a covering manner, namely the circuit board has the waterproof function through the waterproof insulating layer, and the electromagnetic wave and crosstalk interference can be induced, absorbed and shielded through the electromagnetic wave preventing layer so as to improve the quality of signal transmission.
Background
Due to the rapid change of times and the gradual change of technologies, people now seek more convenient and faster life, and portable electronic devices (such as electronic products like smart phones, tablet computers or multimedia players) are also more common and more important in modern life, and have become one of indispensable products in daily life, and with the integration of networks and community websites, a portable electronic device can deal with most of things, and no matter whether communication, internet, multimedia applications (such as films or games) or various information can be easily known, used or transmitted in the portable electronic device.
However, in the present portable electronic devices, the power source is needed to start and operate, so the batteries for supplying power source are provided in the portable electronic devices, and the power source is transmitted to the internal circuit board through the batteries to supply the power source required by the operation of the circuit board, and the transmission of the power source between the batteries and the circuit board can be performed through the electric connector, but the electric connector for transmitting the power source is assembled and positioned between the base and the terminals by using the embedding and fastening and clamping method, i.e. the electric connector is directly used for transmitting the power source, and in practical application and implementation, a gap is formed between the base and the terminals, and external moisture is easy to permeate into the internal circuit board from the electric connector, thereby causing the corrosion of the pins of the plurality of contacts and various electronic components on the circuit board, and the like, The electronic device is easy to be affected by oxidation, etc. and further to be short-circuited, and when the electronic device is exposed to rain or is accidentally splashed with other liquids, the electronic device is easy to be short-circuited by moisture in the interior thereof to affect the functionality thereof, so the research on the waterproof performance of the electronic device is gradually focused.
In addition, the electronic device needs to process a large amount of signals, and therefore, in order to process a large amount of signals, the signal processing also needs to be performed at a high speed, so that electronic components inside the electronic device generate electromagnetic wave and crosstalk interference, which may interfere with other electronic devices, or cause the electronic components inside the electronic device to interfere with each other, and thus the electronic device cannot operate normally, however, in order to solve the problem of electromagnetic wave and crosstalk interference, manufacturers have to install a metal cover on a circuit board of the electronic device, so as to cover the electronic components through the metal cover, and further use the metal cover to induce and absorb and shield the electromagnetic wave and crosstalk interference, but the electronic device is currently developed towards light, thin, short and small, and the overall thickness of the electronic device is increased by installing the metal cover, and the mold opening and assembling of the metal cover also consume a lot of manufacturing time and cost, therefore, the market competitiveness of the electronic device cannot be effectively improved.
Therefore, how to try to solve the problems of the electronic device such as waterproof performance, electromagnetic wave resistance, and crosstalk interference, and to meet the trend of light weight, thinness, shortness, and miniaturization of the electronic device at the same time is a direction that those skilled in the art are keenly seeking to research and improve.
Disclosure of Invention
In view of the above-mentioned shortcomings, the inventor has proposed a circuit board with waterproof and electromagnetic wave-shielding functions and a manufacturing method thereof by collecting relevant data, evaluating and considering them in many ways, and continuously trying and modifying them according to years of experience accumulated in the industry.
The invention mainly aims to provide a circuit board which is provided with a substrate, a plurality of electronic components are arranged on the substrate, the surfaces of the substrate and the plurality of electronic components are covered with non-conductive waterproof insulating layers, and an electromagnetic wave preventing layer is covered on the surface of at least one electronic component covered with the waterproof insulating layers.
The secondary purpose of the invention is that the waterproof insulating layer and the electromagnetic wave preventing layer are directly covered on the surface of the circuit board, so the whole thickness can be reduced, the light, thin, short and small trends of electronic products are met, and the purposes of reducing the cost of the die and the assembly are achieved.
Another objective of the present invention is to cover the surface of the circuit board with a waterproof insulating layer and an electromagnetic wave shielding layer, so that the plurality of pins of the circuit board welded on the substrate are covered by the waterproof insulating layer and the electromagnetic wave shielding layer, so that the plurality of pins are not easily detached when the circuit board is collided or dropped, thereby achieving the purpose of improving the anti-collision and anti-falling capabilities.
Another objective of the present invention is to provide a high thermal conductivity electromagnetic shielding layer made of carbon nanotubes, silver paste, aluminum paste, copper paste, gold paste or indium tin oxide, so that when a waterproof insulating layer and an electromagnetic shielding layer are covered on the surface of a circuit board, the electromagnetic shielding layer can improve the heat dissipation effect.
Another objective of the present invention is to provide a flexible printed circuit board, wherein the plurality of pins soldered to the substrate of the electronic assembly can be covered by a waterproof insulating layer and an electromagnetic wave shielding layer, so that the plurality of pins are not easily detached when the flexible printed circuit board is bent, thereby improving the electrical conduction stability of the flexible printed circuit board.
The present invention further aims to provide a method for manufacturing a circuit board, which is capable of effectively covering the seams, the step differences, etc. between the substrate and the plurality of electronic components by spraying a waterproof insulating layer and an electromagnetic wave shielding layer on the surface of the circuit board by using a spraying technique, thereby achieving the purpose of conforming to the surface shape of the circuit board.
In order to achieve the purpose, the invention adopts the following technical means:
the invention relates to a circuit board with waterproof and electromagnetic wave preventing functions, which comprises a circuit board, a waterproof insulating layer and an electromagnetic wave preventing layer, wherein the circuit board is provided with a substrate, a plurality of electronic components are arranged on the substrate, the surfaces of the substrate of the circuit board and the plurality of electronic components are covered with the non-conductive waterproof insulating layer, and the surface of at least one electronic component covered with the waterproof insulating layer is covered with the electromagnetic wave preventing layer.
Wherein, preferably, the electronic component comprises a bluetooth module, a wireless module or an infrared module.
Among them, it is preferable that the waterproof insulating layer is polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acryl-based polymer, ether-based polymer or polyolefin.
Preferably, the electromagnetic wave shielding layer is graphite, graphene, carbon nanotubes, silver paste, aluminum paste, copper paste, gold paste or indium tin oxide.
Furthermore, the invention also provides a manufacturing method of the circuit board with waterproof and electromagnetic wave preventing functions, which comprises the following steps:
(A) the film coating device covers a waterproof insulating material on a circuit board by a film coating technology so as to form a waterproof insulating layer on the surfaces of a substrate of the circuit board and a plurality of electronic components on the substrate;
(B) and covering the electromagnetic wave preventing material on the surface of at least one electronic component of the circuit board by using a film coating device so as to form an electromagnetic wave preventing layer on the waterproof insulating layer covered on the surface of at least one electronic component.
Preferably, the circuit board is a printed circuit board or a flexible circuit board.
Among them, the waterproof insulating material and the waterproof insulating layer in the step (a) are preferably polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin.
Preferably, the electromagnetic wave shielding material and the electromagnetic wave shielding layer in step (B) are graphite, graphene, carbon nanotubes, silver paste, aluminum paste, copper paste, gold paste or indium tin oxide.
Preferably, the coating device is a spraying device, and the coating technology is a spraying technology, so that the waterproof insulating material and the electromagnetic wave preventing material are sprayed on the surface of the circuit board through the spraying technology, and the waterproof insulating layer and the electromagnetic wave preventing layer are sprayed on the surface of the circuit board.
Preferably, a default circuit layout is arranged inside the substrate of the circuit board, so that the electronic component with the radio frequency function utilizes the default circuit layout to prevent the radio frequency signal from being emitted outwards from the position covered by the electromagnetic wave preventing layer.
Drawings
FIG. 1 is a flow chart of the present invention;
FIG. 2 is a schematic illustration of the present invention with a waterproof insulating layer deposited;
FIG. 3 is a schematic view of the deposition of the electromagnetic shielding layer according to the present invention;
FIG. 4 is a schematic diagram of the electromagnetic shielding layer of the present invention after deposition.
Description of the symbols:
1. circuit board
11. Substrate
12. Electronic assembly
2. Waterproof insulating layer
20. Waterproof insulating material
3. Electromagnetic wave shielding layer
30. Electromagnetic wave preventing material
Detailed Description
To achieve the above objects and advantages, the present invention provides a technical solution and a structure thereof, which are described in detail with reference to the preferred embodiments of the present invention, and the features and functions thereof are fully understood.
Referring to fig. 1, 2, 3 and 4, which are a flow chart of the present invention, a schematic diagram of a waterproof insulating layer during deposition, a schematic diagram of an electromagnetic wave preventing layer during deposition and a schematic diagram of the electromagnetic wave preventing layer after deposition, as can be clearly seen from the drawings, the circuit board with waterproof and electromagnetic wave preventing functions of the present invention includes a circuit board 1, a waterproof insulating layer 2 and an electromagnetic wave preventing layer 3, wherein the circuit board 1 has a substrate 11, a plurality of electronic components 12 are disposed on the substrate 11, the surfaces of the substrate 11 and the plurality of electronic components 12 of the circuit board 1 are covered with a non-conductive waterproof insulating layer 2, and the surface of at least one electronic component 12 covered with the waterproof insulating layer 2 is covered with the electromagnetic wave preventing layer 3.
The circuit board 1 may be a printed circuit board or a flexible circuit board, and the electronic components 12 of the circuit board 1 may be a Central Processing Unit (CPU), a capacitor, a resistor, an antenna module (e.g., radio frequency components such as 3G, 4G, 5G, bluetooth module, wireless module, or infrared module), or other electronic components 12 such as parts, chips, or modules on the circuit board 1.
Further, the above-mentioned waterproof insulating layer 2 is made of polyurethane (polyurethane; PU), polyimide (polyimide; PI), polycarbonate (polycarbonate; PC), polyamide (polyamide; PA), polyethylene terephthalate (polyethylene terephthalate; PET), polyethylene naphthalate (polyethylene naphthalate; PEN), polyethyleneimine (polyethyleneimine; PEI), polydimethylsiloxane (polydimethylsiloxane; PDMS), acrylic polymer (such as: polymethyl methacrylate (PMMA), etc.), ether based (ethr) polymers [ such as: polyethersulfone (polyethersulfone; PES) or polyetheretherketone (polyetheretherketone; polyetheretherketone), polyalkene (polyolefin) or other materials with waterproof and insulating functions.
The electromagnetic wave shielding layer 3 may be graphite, graphene, carbon nanotubes, silver paste, aluminum paste, copper paste, gold paste, Indium Tin Oxide (ITO) or other materials with electromagnetic wave shielding function.
However, if the electronic component 12 of the circuit board 1 is a 3G, 4G, 5G, bluetooth module, wireless module or infrared module or other electronic component 12 with radio frequency function, the substrate 11 of the circuit board 1 may have a default circuit layout inside, so that the default circuit layout is used to prevent the radio frequency signal emitted by the electronic component 12 with radio frequency function from being emitted from the surface covered by the electromagnetic wave shielding layer 3 (e.g. from the bottom surface or side surface of the substrate 11 of the circuit board 1), i.e. from being affected by the electromagnetic wave shielding layer 3, and therefore the surface of the electronic component 12 emitting radio frequency signal can be covered by the electromagnetic wave shielding layer 3.
When the present invention is actually manufactured, it can be manufactured according to the following manufacturing method, and the manufacturing method includes the following steps:
(A) the coating device 4 can cover the circuit board 1 with the waterproof insulating material 20 by a coating technique, so that the substrate 11 of the circuit board 1 and the surfaces of the plurality of electronic components 12 on the substrate 11 are covered with the waterproof insulating layer 2.
(B) Then, the anti-electromagnetic wave material 30 is covered on the surface of at least one electronic component 12 of the circuit board 1 by the coating device 4, so that the anti-electromagnetic wave layer 3 is formed on the waterproof insulating layer 2 covered on the surface of at least one electronic component 12.
The coating device 4 may be a spraying device, and the coating technology may preferably be a spraying technology, so that the waterproof insulating material 20 and the electromagnetic wave shielding material 30 can be sprayed on the surface of the circuit board 1 by the spraying technology, and further the waterproof insulating layer 2 and the electromagnetic wave shielding layer 3 can be sprayed on the surface of the circuit board 1, but in practical application, the coating device 4 may also be an evaporation device or other devices capable of covering the waterproof insulating material 20 and the electromagnetic wave shielding material 30 on the surface of the circuit board 1, so that the waterproof insulating layer 2 and the electromagnetic wave shielding layer 3 can be formed on the surface of the circuit board 1 by a Physical Vapor Deposition (PVD) or other film forming methods.
Furthermore, the waterproof insulating material 20 in the step (A) may be solid or liquid polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer (e.g., polymethyl methacrylate, etc.), ether polymer (e.g., polyether sulfone or polyether ether ketone, etc.), polyolefin or other material with waterproof insulating function.
The electromagnetic wave shielding material 30 in the step (B) may be graphite, graphene, carbon nanotubes, silver paste, aluminum paste, copper paste, gold paste, Indium Tin Oxide (ITO), or other materials with electromagnetic wave shielding function.
However, the substrate 11 of the circuit board 1 is provided with a default circuit layout, so that the electronic component 12 with rf function can utilize the default circuit layout to prevent the rf signal from being emitted from the surface covered by the electromagnetic shielding layer 3.
After the waterproof insulating material 20 is formed on the surface of the circuit board 1 by the coating device 4, the surface of the circuit board 1 is covered with the waterproof insulating layer 2, so that the circuit board 1 has a waterproof effect, and the electromagnetic wave shielding material 30 is formed on the surface of at least one electronic component 12 of the circuit board 1 by the coating device 4, so that the electromagnetic wave shielding layer 3 is formed on the waterproof insulating layer 2 on the surface of the at least one electronic component 12, so that when the circuit board 1 performs high-frequency transmission (such as 3G, 4G or 5G high-frequency signals) to generate electromagnetic wave interference (EMI) and crosstalk interference, the electromagnetic wave shielding layer 3 can perform induction absorption and shielding to effectively suppress the electromagnetic wave and crosstalk interference generated during the transmission of the high-frequency signals, and further the quality of the signal transmission of the circuit board 1 achieves a more stable and reliable effect.
The invention has the following advantages:
the surface of the circuit board 1 is covered with a waterproof insulating layer 2 and an electromagnetic wave shielding layer 3, so that the circuit board 1 has a waterproof function through the waterproof insulating layer 2, and when the circuit board 1 performs high-frequency transmission to generate electromagnetic wave interference (EMI) and crosstalk interference, the electromagnetic wave shielding layer 3 can perform induction absorption and shielding to effectively suppress the electromagnetic wave and crosstalk interference generated during high-frequency signal transmission, and further the signal transmission quality of the circuit board 1 achieves more stable and reliable effect.
The waterproof insulating layer 2 and the electromagnetic wave preventing layer 3 are directly covered on the surface of the circuit board 1, so that the whole thickness can be reduced without additionally arranging members, thereby meeting the trend of light weight, thinness, shortness and miniaturization of electronic products, and reducing the cost of moulds and assembling.
And thirdly, the surface of the circuit board 1 is covered with a waterproof insulating layer 2 and an electromagnetic wave preventing layer 3, so that a plurality of pins (not shown in the figure) of the circuit board 1, which are welded on the substrate 11, can be covered by the waterproof insulating layer 2 and the electromagnetic wave preventing layer 3, so that when the circuit board 1 is collided or dropped, the plurality of pins are not easy to be detached, and the capabilities of collision resistance and falling resistance are improved.
And (IV) the material of the anti-electromagnetic wave layer 3 is carbon nanotubes, silver paste, aluminum paste, copper paste, gold paste or indium tin oxide, which has the characteristic of high heat conduction, so that when the surface of the circuit board 1 is covered with the waterproof insulating layer 2 and the anti-electromagnetic wave layer 3, the heat dissipation effect can be improved through the anti-electromagnetic wave layer 3.
When the circuit board 1 is a flexible circuit board, since the surface of the circuit board 1 is covered with the waterproof insulating layer 2 and the electromagnetic wave preventing layer 3, the plurality of electronic components 12 of the circuit board 1 are welded to the plurality of pins (not shown in the figure) on the substrate 11 and then are covered by the waterproof insulating layer 2 and the electromagnetic wave preventing layer 3, so that when the flexible circuit board is bent, the plurality of pins are not easy to be detached, and the electrical conduction stability of the flexible circuit board during use is improved.
Sixthly, the surface of the circuit board 1 is preferably sprayed with the waterproof insulating layer 2 and the electromagnetic wave shielding layer 3 by using a spraying technology, and the waterproof insulating layer and the electromagnetic wave shielding layer can effectively cover the slit, the step difference and the like between the substrate 11 and the plurality of electronic components 12 by using the spraying technology, thereby really conforming to the surface shape of the circuit board 1.
It should be understood that the above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, so that the present invention is not limited by the above description and the accompanying drawings.
Claims (10)
1. A circuit board with waterproof and electromagnetic wave preventing functions is characterized by comprising a circuit board, a waterproof insulating layer and an electromagnetic wave preventing layer, wherein the circuit board is provided with a substrate, a plurality of electronic assemblies are arranged on the substrate, the surfaces of the substrate and the electronic assemblies of the circuit board are covered with the waterproof insulating layer which is non-conductive, and the surface of at least one electronic assembly covered with the waterproof insulating layer is covered with the electromagnetic wave preventing layer.
2. The circuit board of claim 1, wherein the electronic component comprises a bluetooth module, a wireless module or an infrared module.
3. The circuit board of claim 1, wherein the waterproof insulating layer is polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin.
4. The circuit board of claim 1, wherein the electromagnetic shielding layer is made of graphite, graphene, carbon nanotubes, silver paste, aluminum paste, copper paste, gold paste or indium tin oxide.
5. A manufacturing method of a circuit board with waterproof and electromagnetic wave preventing functions is characterized by comprising the following steps:
(A) the film coating device covers a waterproof insulating material on a circuit board by a film coating technology so as to form a waterproof insulating layer on the surfaces of a substrate of the circuit board and a plurality of electronic components on the substrate;
(B) and covering the electromagnetic wave preventing material on the surface of at least one electronic component of the circuit board by using a film coating device so as to form an electromagnetic wave preventing layer on the waterproof insulating layer covered on the surface of at least one electronic component.
6. The method as claimed in claim 5, wherein the circuit board is a printed circuit board or a flexible circuit board.
7. The method according to claim 5, wherein the waterproof insulating material and the waterproof insulating layer in step (A) are polyurethane, polyimide, polycarbonate, polyamide, polyethylene terephthalate, polyethylene naphthalate, polyethyleneimine, polydimethylsiloxane, acrylic polymer, ether polymer or polyolefin.
8. The method according to claim 5, wherein the electromagnetic shielding material and the electromagnetic shielding layer in step (B) are graphite, graphene, carbon nanotubes, silver paste, aluminum paste, copper paste, gold paste or indium tin oxide.
9. The method according to claim 5, wherein the coating device is a spraying device and the coating technique is a spraying technique, such that the waterproof insulating material and the electromagnetic wave shielding material are sprayed on the surface of the circuit board by the spraying technique, and the waterproof insulating layer and the electromagnetic wave shielding layer are sprayed on the surface of the circuit board.
10. The method as claimed in claim 5, wherein a default circuit layout is provided inside the substrate of the circuit board, such that the electronic device with RF function utilizes the default circuit layout to prevent RF signals from being emitted from the surface covered by the EMI shielding layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910963700.3A CN112654130A (en) | 2019-10-11 | 2019-10-11 | Circuit board with waterproof and electromagnetic wave preventing functions and manufacturing method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910963700.3A CN112654130A (en) | 2019-10-11 | 2019-10-11 | Circuit board with waterproof and electromagnetic wave preventing functions and manufacturing method thereof |
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| Publication Number | Publication Date |
|---|---|
| CN112654130A true CN112654130A (en) | 2021-04-13 |
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| CN201910963700.3A Pending CN112654130A (en) | 2019-10-11 | 2019-10-11 | Circuit board with waterproof and electromagnetic wave preventing functions and manufacturing method thereof |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023028719A1 (en) * | 2021-08-30 | 2023-03-09 | 苏宪强 | Circuit board structure with shielding and heat dissipation functions, and manufacturing method therefor |
| WO2024168459A1 (en) * | 2023-02-13 | 2024-08-22 | 苏宪强 | Wireless circuit module capable of insulating and suppressing electromagnetic waves and manufacturing method |
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2019
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| TW201601915A (en) * | 2014-07-07 | 2016-01-16 | 聯茂電子股份有限公司 | Electromagnetic interference shielding film |
| CN107690248A (en) * | 2016-08-04 | 2018-02-13 | 苏政纬 | Waterproof process method for portable electronic device |
| CN108117757A (en) * | 2016-11-28 | 2018-06-05 | 天迈科技股份有限公司 | Multifunctional colloid with conductive and waterproof characteristics |
| CN207531161U (en) * | 2017-09-21 | 2018-06-22 | 红板（江西）有限公司 | A kind of novel rigid-flexible combined circuit board |
| CN108617084A (en) * | 2018-06-19 | 2018-10-02 | 信利光电股份有限公司 | A kind of electromagnetism interference flexible circuit board and production method |
| CN209184859U (en) * | 2018-09-25 | 2019-07-30 | 广东合通建业科技股份有限公司 | A waterproof impedance circuit board |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
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| WO2023028719A1 (en) * | 2021-08-30 | 2023-03-09 | 苏宪强 | Circuit board structure with shielding and heat dissipation functions, and manufacturing method therefor |
| WO2024168459A1 (en) * | 2023-02-13 | 2024-08-22 | 苏宪强 | Wireless circuit module capable of insulating and suppressing electromagnetic waves and manufacturing method |
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