CN112635374B - A method for transporting wafers after CMP cleaning - Google Patents
A method for transporting wafers after CMP cleaning Download PDFInfo
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- CN112635374B CN112635374B CN202011446726.XA CN202011446726A CN112635374B CN 112635374 B CN112635374 B CN 112635374B CN 202011446726 A CN202011446726 A CN 202011446726A CN 112635374 B CN112635374 B CN 112635374B
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- 235000012431 wafers Nutrition 0.000 title claims abstract description 200
- 238000004140 cleaning Methods 0.000 title claims abstract description 136
- 238000000034 method Methods 0.000 title claims abstract description 30
- CBENFWSGALASAD-UHFFFAOYSA-N Ozone Chemical compound [O-][O+]=O CBENFWSGALASAD-UHFFFAOYSA-N 0.000 claims description 11
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 11
- 239000003814 drug Substances 0.000 claims description 9
- 239000007788 liquid Substances 0.000 claims description 9
- 230000002378 acidificating effect Effects 0.000 claims description 5
- 238000003860 storage Methods 0.000 claims description 5
- 239000007921 spray Substances 0.000 claims description 4
- 230000001680 brushing effect Effects 0.000 claims description 2
- 238000004506 ultrasonic cleaning Methods 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 230000009977 dual effect Effects 0.000 description 5
- 239000000126 substance Substances 0.000 description 5
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 239000004065 semiconductor Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000003020 moisturizing effect Effects 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 238000005507 spraying Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
- H01L21/6704—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like for wet cleaning or washing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
本发明涉及一种晶圆CMP后清洗的搬送方法,包括如下步骤：步骤S01、交接单元接收CMP后的晶圆；步骤S02、双机械手将交接单元内的第一片晶圆搬送至第一清洗单元进行第一次清洗；步骤S03、双机械手将第一片晶圆搬送至第二清洗单元进行第二次清洗；步骤S04、双机械手将交接单元内的第二片晶圆搬送至第一清洗单元进行第一次清洗；步骤S05、第二片晶圆在第一清洗单元清洗后保湿等待，并在第一片晶圆第二次清洗完之前进入第二清洗单元；步骤S06、双机械手将第一片晶圆和第二片晶圆的位置互换，第二片晶圆在第二清洗单元内清洗，第一片晶圆送至装载台的晶圆盒内；步骤S07、重复步骤S02~步骤S06，将晶圆依次放入晶圆盒内，本发明有效的减少晶圆的搬送时间，提高了产能。
The invention relates to a wafer post-CMP cleaning conveying method, comprising the following steps: step S01, a handover unit receives a wafer after CMP; step S02, a double robot conveys a first wafer in the handover unit to a first cleaning unit for a first cleaning; step S03, the double robot conveys the first wafer to a second cleaning unit for a second cleaning; step S04, the double robot conveys a second wafer in the handover unit to the first cleaning unit for a first cleaning; step S05, the second wafer is moisturized and waits after being cleaned in the first cleaning unit, and enters the second cleaning unit before the first wafer is cleaned for the second time; step S06, the double robot swaps the positions of the first wafer and the second wafer, the second wafer is cleaned in the second cleaning unit, and the first wafer is conveyed to a wafer box on a loading platform; step S07, steps S02 to S06 are repeated to sequentially put the wafers into the wafer box. The invention effectively reduces the conveying time of the wafers and improves the production capacity.
Description
Technical Field
The invention belongs to the related technical field of wafer cleaning, and particularly relates to a conveying method for cleaning after wafer CMP.
Background
The cleaning of the wafer is an important step in the production process of the semiconductor device, and whether the cleaning is clean directly affects the performance and yield of the device, so that the wafer needs to be cleaned for multiple times in the preparation process of the semiconductor device. In the conventional semiconductor manufacturing process, a chemical mechanical polishing (Chemical MechanicalPolishing, abbreviated as CMP) method is generally used for performing the planarization process, however, a lot of residues (residues) are generated during the CMP process, so that defects (defects) are formed, and therefore, the wafer needs to be cleaned after the CMP process to reduce the defects.
The existing cleaning method generally uses a mechanical arm to place the wafer after CMP on a carrying platform, and then uses the mechanical arm to sequentially convey a wafer to each cleaning mechanism for direct cleaning, so that although the wafer can be cleaned, the cleaning mode of conveying the wafer is found after long-time actual processing, the conveying efficiency is low, the conveying time is long, the cleaning productivity can not meet high requirements, and the further development of the wafer is severely restricted.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provide a method for carrying the post-CMP cleaning of the wafer, which can improve the cleaning speed of the post-CMP cleaning of the wafer and meet the requirement of wafer productivity.
In order to achieve the above purpose, the invention adopts the technical scheme that the method for carrying the wafer after CMP cleaning comprises the following steps:
Step S01, a handover unit receives the wafer after CMP and performs pre-cleaning;
Step S02, conveying a first wafer in the delivery unit to a first cleaning unit by using a double mechanical arm to perform first cleaning, wherein the time of the first cleaning is 110-130 seconds;
S03, conveying the first wafer subjected to the first cleaning to a second cleaning unit by using a double mechanical arm to perform second cleaning, wherein the second cleaning time is 170-190 seconds;
Step S04, returning the double manipulators to the delivery unit, and conveying the second wafer in the delivery unit to the first cleaning unit for first cleaning;
s05, keeping moisture of the second wafer after the first cleaning unit is cleaned, and then enabling the second wafer to enter the second cleaning unit before the second cleaning of the first wafer is completed;
S06, after the positions of the first wafer and the second wafer are exchanged by the double manipulators, the second wafer is cleaned in the second cleaning unit, and the first wafer is sent into the wafer box of the loading table by the double manipulators;
and S07, sequentially repeating the steps S02-S06, sequentially placing the wafers into the wafer boxes of the loading table, and taking the wafer boxes away by a subsequent manipulator when the number of the wafers reaches the requirement.
Furthermore, a temporary storage unit is further arranged between the second cleaning unit and the loading table and is used for temporarily storing cleaned wafers which are not placed on the loading table.
Further, in step S01, the pre-cleaning is used to soak the wafers after CMP in ozone water in groups of two wafers, and then perform ultrasonic cleaning to ensure that the wafers are in a wet state.
Further, the cleaning process of the first cleaning unit is as follows, and the wafer is brushed by the pure water and the alkaline liquid medicine in sequence when the brush rotates.
Further, the cleaning process of the second cleaning unit is as follows, the nozzle sequentially sprays ozone and acidic liquid medicine to the wafer, and finally spin-dries the wafer.
Further, two clamping jaws which are arranged up and down are arranged on the double manipulator and are used for clamping wafers in a wet state and a dry state respectively.
Due to the application of the technical scheme, compared with the prior art, the invention has the following advantages:
The wafer is clamped by the double manipulators, so that the wafer after the wafer is cleaned can be moved to the cleaning position of the wafer before the wafer is cleaned, the wafer after the wafer is interchanged in position and then is conveyed to the subsequent station, the conveying time of the wafer can be effectively shortened, the productivity is improved, the cleaning efficiency is improved, and the requirement of batch cleaning of the wafer is met.
Drawings
The technical scheme of the invention is further described below with reference to the accompanying drawings:
Fig. 1 is a schematic diagram of a state in which a dual-robot carries a first wafer after a first cleaning to a second cleaning unit in step S03;
Fig. 2 is a schematic diagram of a state in which a dual robot carries a second wafer to a first cleaning unit in step S04;
fig. 3 is a schematic diagram of a state in which the dual robots are transferring the second wafer 10 after the first cleaning to the second cleaning unit in step S05;
FIG. 4 is a schematic diagram of a carrying flow of the carrying method in the second embodiment;
1, a handover unit; 2, a first cleaning unit, 3, a second cleaning unit, 4, a double manipulator, 5, a temporary storage unit, 6, a loading unit, 10, a first wafer and 20, a second wafer.
Detailed Description
The present invention will be further described with reference to the accompanying drawings, wherein the invention is not limited to the specific embodiments, and common alternatives known to those skilled in the art are also included in the scope of the invention.
Example 1
Referring to fig. 1, a method for carrying a post-CMP cleaning wafer according to an embodiment of the present invention includes a transfer unit 1, a first cleaning unit 2, a second cleaning unit 3, a dual robot 4, and a loading table 6.
Specifically, the transfer unit 1 mainly performs a function of transferring wafers after CMP in a previous process, receives the wafers after CMP, and pre-cleans the wafers, wherein the pre-cleans are performed by immersing the wafers in ozone water and cleaning the wafers by ultrasonic waves, and the wafers are immersed in the ozone water in a group of two wafers, so that the wafers are in a wet state.
The cleaning process of the first cleaning unit comprises the steps that when the brush rotates, pure water and alkaline liquid medicine are sequentially used for brushing the wafer, and the cleaning process of the second cleaning unit comprises the steps that the nozzle is used for sequentially spraying ozone and acidic liquid medicine on the wafer, and finally the wafer is dried.
The double mechanical arm 4 comprises two clamping jaws which are arranged up and down, the clamping jaw positioned above is used for clamping the wafer in the dry state, the clamping jaw positioned below is used for clamping the wafer in the wet state, and the double mechanical arm 4 is used for conveying all the wafers among the delivery unit 1, the first cleaning unit 2, the second cleaning unit 3 and the loading table 6, wherein only the wafer cleaned by the second cleaning unit 3 needs to be clamped by the clamping jaw in the dry state.
The loading table 6 is located at the rear end of the second cleaning unit, and a wafer cassette is disposed on the loading table 6, for placing cleaned wafers, in this embodiment, 23 wafers can be placed on one wafer cassette, and when the wafers 23 wafers are removed by a robot in the subsequent process.
The embodiment discloses a method for carrying wafer after CMP cleaning.
Referring to fig. 1, in step S01, the handover unit receives the wafers after CMP, and the wafers are soaked in ozone water in groups of two and cleaned by ultrasonic waves to ensure that the wafers are in a wet state.
In step S02, the double robot arm conveys the first wafer 10 in the delivery unit into the first cleaning unit, and cleans the first wafer with the brush in combination with pure water and alkaline chemical solution for 110 seconds.
In step S03, the first wafer 10 after the first cleaning is carried into the second cleaning unit by the double manipulators, and is spin-dried after being spray-washed by the nozzles in combination with ozone and acidic liquid medicine, and 170 seconds are required in the process.
Please refer to fig. 2:
In step S04, the double robot returns to the transfer unit, and the second wafer 20 in the transfer unit is transferred to the first cleaning unit to be cleaned for 110 seconds for the first time, and the first wafer 10 is cleaned in the second cleaning unit.
Referring to fig. 3, in step S05, since the time for the first wafer 10 to be cleaned in the second cleaning unit is longer than the time for the second wafer 20 to be cleaned in the second cleaning unit, the second wafer 20 is continuously moisturized in the first cleaning unit after the second wafer 20 is cleaned in the first cleaning unit, and then enters the second cleaning unit before the second wafer 10 is cleaned in the second cleaning unit.
In step S06, after the positions of the first wafer and the second wafer are interchanged by the dual robots, the first wafer 10 in the second cleaning unit is taken out by the clamping jaw in the dry state, the second wafer 20 is put into the second cleaning unit by the clamping jaw in the wet state for cleaning, and the first wafer 10 is sent into the wafer box of the loading table.
Step S07, repeating the steps S02-S06 in sequence, placing the cleaned wafers into the wafer boxes of the loading table in sequence, and taking the wafer boxes filled with 23 wafers by a subsequent manipulator when the number of the wafers in the wafer boxes reaches 23.
Example two
The invention discloses a method for carrying cleaning after CMP of various wafers, which comprises the following steps:
and step S01, the delivery unit receives the wafer after the CMP to keep moisture.
In step S02, the double robot hand conveys the first wafer 10 in the delivery unit into the first cleaning unit, and cleans the wafer with the brush and the pure water and the alkaline chemical solution for 130 seconds.
In step S03, the first wafer 10 after the first cleaning is carried into the second cleaning unit by the double manipulators, and is spin-dried after being spray-washed by the nozzles in combination with ozone and acidic liquid medicine, and 190 seconds are required in the process.
In step S04, the double robots return to the transfer unit, and the second wafer 20 in the transfer unit is transferred to the first cleaning unit for the first cleaning for 130 seconds, and the first wafer 10 is cleaned in the second cleaning unit.
In step S05, after the second wafer 20 is cleaned by the first cleaning unit, the second wafer 20 is continuously moisturized in the first cleaning unit, and then enters the second cleaning unit before the second cleaning of the first wafer 10 is completed.
In step S06, after the positions of the first wafer 10 and the second wafer 20 are interchanged by the dual robots, the first wafer 10 in the second cleaning unit is taken out by clamping the clamping jaw in the dry state, then the second wafer 20 is put into the second cleaning unit by clamping the clamping jaw in the wet state, and the first wafer 10 is sent into the wafer box of the loading table.
Step S07, repeating the steps S02-S06 in sequence, placing the cleaned wafers into the wafer boxes of the loading table in sequence, and taking the wafer boxes filled with 21 wafers by a subsequent manipulator when the number of the wafers in the wafer boxes reaches 21.
Example III
Referring to fig. 4, the difference between the present embodiment and the first embodiment is that a temporary storage unit 5 is further installed between the loading table and the second cleaning unit, for storing the wafers that are not placed after being cleaned by the second cleaning unit 4.
The invention discloses a method for carrying cleaning after CMP of various wafers, which comprises the following steps:
and step S01, the delivery unit receives the wafer after the CMP to keep moisture.
Step S02, the double manipulators convey the first wafer in the delivery unit into the first cleaning unit to clean the first wafer for 120 seconds by combining the brush with pure water and alkaline chemical.
And S03, conveying the first wafer after the first cleaning into a second cleaning unit by using a double mechanical arm to perform spin-drying after the spray nozzle is matched with the spray cleaning of ozone and acid liquid medicine, wherein 180 seconds are required in the process.
Step S04, the double manipulators return to the delivery unit, the second wafer in the delivery unit is conveyed to the first cleaning unit to be cleaned for 120 seconds for the first time, and the first wafer is cleaned in the second cleaning unit.
And step S05, after the second wafer is cleaned in the first cleaning unit, continuing to moisturize in the first cleaning unit, and then entering the second cleaning unit before the second wafer is cleaned for the second time.
And S06, after the positions of the first wafer and the second wafer are interchanged by the double manipulators, taking the first wafer out of the second cleaning unit by clamping the clamping jaw in a dry state, putting the second wafer into the second cleaning unit by clamping the clamping jaw in a wet state, and cleaning, wherein the first wafer is sent into the wafer box of the loading table.
Step S07, repeating the steps S02-S06 in sequence, placing the cleaned wafers into the wafer boxes of the loading table in sequence, and taking the wafer boxes filled with 25 wafers by a subsequent manipulator when the number of the wafers in the wafer boxes reaches 25.
And step 08, when the cleaned wafer cannot be put into the wafer box, temporarily storing the wafer in the temporary storage unit for moisturizing so as to be sent to the loading table later.
The wafer is clamped by the double manipulators, so that the wafer after the wafer is cleaned can be moved to the cleaning position of the wafer before the wafer is cleaned, the wafer after the wafer is interchanged in position and then is conveyed to the subsequent station, the conveying time of the wafer can be effectively shortened, the productivity is improved, the cleaning efficiency is improved, and the requirement of batch cleaning of the wafer is met.
The foregoing is merely a specific application example of the present invention, and the protection scope of the present invention is not limited in any way. All technical schemes formed by equivalent transformation or equivalent substitution fall within the protection scope of the invention.
Claims (3)
1. The method for carrying the wafer after CMP cleaning is characterized by comprising the following steps:
Step S01, a handover unit receives the wafer after CMP and performs pre-cleaning;
Step S02, conveying a first wafer in the delivery unit to a first cleaning unit by using a double mechanical arm to perform first cleaning, wherein the time of the first cleaning is 110-130 seconds;
S03, conveying the first wafer subjected to the first cleaning to a second cleaning unit by using a double mechanical arm to perform second cleaning, wherein the second cleaning time is 170-190 seconds;
Step S04, returning the double manipulators to the delivery unit, and conveying the second wafer in the delivery unit to the first cleaning unit for first cleaning;
s05, keeping moisture of the second wafer after the first cleaning unit is cleaned, and then enabling the second wafer to enter the second cleaning unit before the second cleaning of the first wafer is completed;
S06, after the positions of the first wafer and the second wafer are exchanged by the double manipulators, the second wafer is cleaned in the second cleaning unit, and the first wafer is sent into the wafer box of the loading table by the double manipulators;
Step S07, sequentially repeating the steps S02-S06, sequentially placing the wafers into the wafer boxes of the loading table, and taking the wafer boxes away by a subsequent manipulator when the number of the wafers reaches the requirement;
The cleaning process of the first cleaning unit comprises the steps that when the brush rotates, pure water and alkaline liquid medicine are sequentially used for brushing a wafer, the cleaning process of the second cleaning unit comprises the steps that the nozzle sequentially sprays ozone and acidic liquid medicine on the wafer, and finally the wafer is spin-dried, and two clamping jaws which are arranged up and down are arranged on the double-manipulator and are respectively used for clamping the wafer in a wet state and a dry state.
2. The method for post-CMP cleaning and transporting a wafer according to claim 1, wherein a temporary storage unit for temporarily storing the cleaned wafer which is not placed on the loading table is further provided between the second cleaning unit and the loading table.
3. The method for post-CMP cleaning and transporting a wafer according to claim 1, wherein in step S01, the pre-cleaning is performed by immersing the post-CMP wafer in ozone water in a group of two wafers, and then performing ultrasonic cleaning to ensure that the wafer is in a wet state.
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| CN202011446726.XA CN112635374B (en) | 2020-12-09 | 2020-12-09 | A method for transporting wafers after CMP cleaning |
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| CN202011446726.XA CN112635374B (en) | 2020-12-09 | 2020-12-09 | A method for transporting wafers after CMP cleaning |
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| CN112635374B true CN112635374B (en) | 2025-01-10 |
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| CN109148341A (en) * | 2018-10-16 | 2019-01-04 | 杭州众硅电子科技有限公司 | A kind of CMP wafer cleaning equipment |
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| TW402756B (en) * | 1997-09-29 | 2000-08-21 | Applied Materials Inc | Method and apparatus for polishing and cleaning semiconductor wafers |
| CN105810618B (en) * | 2016-05-31 | 2018-08-10 | 北京七星华创电子股份有限公司 | Improve the system and method for wafer transfer efficiency |
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| CN109148341A (en) * | 2018-10-16 | 2019-01-04 | 杭州众硅电子科技有限公司 | A kind of CMP wafer cleaning equipment |
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Effective date of registration: 20220817 Address after: Room 101, building 4, northwest Suzhou nano City, 99 Jinjihu Avenue, Suzhou Industrial Park, 215000, Jiangsu Province Applicant after: RUOMINGXIN SEMICONDUCTOR TECHNOLOGY (SUZHOU) Co.,Ltd. Applicant after: Rumingxin equipment (Suzhou) Co.,Ltd. Address before: Room 101, building 4, northwest Suzhou nano City, 99 Jinjihu Avenue, Suzhou Industrial Park, 215000, Jiangsu Province Applicant before: RUOMINGXIN SEMICONDUCTOR TECHNOLOGY (SUZHOU) Co.,Ltd. |
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