[go: up one dir, main page]

CN112629402A - Preparation method and template for strain gauge coated with welding spot - Google Patents

Preparation method and template for strain gauge coated with welding spot Download PDF

Info

Publication number
CN112629402A
CN112629402A CN202011640015.6A CN202011640015A CN112629402A CN 112629402 A CN112629402 A CN 112629402A CN 202011640015 A CN202011640015 A CN 202011640015A CN 112629402 A CN112629402 A CN 112629402A
Authority
CN
China
Prior art keywords
strain gauge
template
solder joint
strain
preparing
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN202011640015.6A
Other languages
Chinese (zh)
Other versions
CN112629402B (en
Inventor
何志俊
刘长俊
潘成福
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Xiamen Lct Measurement And Control Co ltd
Original Assignee
Xiamen Lct Measurement And Control Co ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Xiamen Lct Measurement And Control Co ltd filed Critical Xiamen Lct Measurement And Control Co ltd
Priority to CN202210893754.9A priority Critical patent/CN115235331A/en
Priority to CN202011640015.6A priority patent/CN112629402B/en
Publication of CN112629402A publication Critical patent/CN112629402A/en
Application granted granted Critical
Publication of CN112629402B publication Critical patent/CN112629402B/en
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Images

Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B7/00—Measuring arrangements characterised by the use of electric or magnetic techniques
    • G01B7/16—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge
    • G01B7/18—Measuring arrangements characterised by the use of electric or magnetic techniques for measuring the deformation in a solid, e.g. by resistance strain gauge using change in resistance
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23P—METAL-WORKING NOT OTHERWISE PROVIDED FOR; COMBINED OPERATIONS; UNIVERSAL MACHINE TOOLS
    • B23P15/00—Making specific metal objects by operations not covered by a single other subclass or a group in this subclass
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Optics & Photonics (AREA)
  • Electromagnetism (AREA)
  • Mechanical Engineering (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • General Physics & Mathematics (AREA)
  • Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)

Abstract

The invention relates to a preparation method of a strain gauge coated with a welding spot and a template thereof, wherein the method comprises the following steps: s1, preparing a substrate composite layer: heating the metal foil coated with the substrate slurry, and curing the substrate slurry to obtain a substrate composite layer consisting of the metal foil and the substrate, wherein the substrate composite layer comprises strain gauge regions arranged in an array; s2, forming a strain gauge pattern: photoetching the metal foil through a photoetching process to obtain a strain gauge graph in each strain gauge area, wherein the strain gauge graph comprises a sensitive grid and a welding spot; s3, short-circuit strain gauge graph: short-circuiting all the strain gauge graphs through connecting lines; s4, coating a welding spot: isolating the sensitive grid, and plating a film on the welding spot through an electroplating process to obtain a strain gauge graph with the welding spot plated with the film; s5, cutting off the connecting wire; s6, setting a sensitive grid protective layer; and S7, cutting and forming.

Description

Preparation method and template for strain gauge coated with welding spot
Technical Field
The invention relates to the field of strain gauge preparation, in particular to a strain gauge preparation method for coating a welding spot and a preparation template thereof.
Background
The strain gauge is a sensor with resistance changing along with acting force; it converts physical quantities such as force, pressure, tension, weight, etc. into changes in resistance, thereby measuring the physical quantities. When an external force is applied to the fixed object, stress and strain are generated. The reaction force (to the external force) generated inside the object is the stress, and the displacement and deformation generated is the strain. Strain gauges are one of the most important sensors in electrical measurement technology, and are used for measuring mechanical quantities. As its name implies, strain gauges are used primarily for strain measurement. As a generic term, "strain" includes both tensile and compressive strain, distinguished by a positive or negative sign. Thus, a strain gauge can measure both expansion and contraction.
The strain gauge requires tin on the solder joints during the manufacturing process to connect to other circuits. However, the sensitive grid of the strain gauge is mainly made of special materials such as illion or gamma, and the materials contain aluminum, and the welding spot is small, so that the soldering difficulty is higher. Meanwhile, a corrosive soldering flux needs to be added, and uncontrollable factors exist in the reliability and stability of a soldering point.
The invention aims to provide a strain gauge preparation method for coating a welding spot and a preparation template thereof aiming at the problems in the prior art.
Disclosure of Invention
Aiming at the problems in the prior art, the invention provides a preparation method of a strain gauge with a plated film on a welding spot and a template thereof, which can effectively solve the problems in the prior art.
The technical scheme of the invention is as follows:
a preparation method of a strain gauge coated with a welding spot comprises the following steps:
s1, preparing a substrate composite layer: heating the metal foil coated with the substrate slurry, and curing the substrate slurry to obtain a substrate composite layer consisting of the metal foil and the substrate, wherein the substrate composite layer comprises strain gauge regions arranged in an array;
s2, forming a strain gauge pattern: photoetching the metal foil through a photoetching process to obtain a strain gauge graph in each strain gauge area, wherein the strain gauge graph comprises a sensitive grid and a welding spot;
s3, short-circuit strain gauge graph: short-circuiting all the strain gauge graphs through connecting lines;
s4, coating a welding spot: isolating the sensitive grid, and plating a film on the welding spot through an electroplating process to obtain a strain gauge graph with the welding spot plated with the film;
s5, cutting the connecting wire: cutting the connecting line by laser;
s6, setting a sensitive grid protective layer: arranging a sensitive grid protective layer on one surface of the strain gauge graph corresponding to the sensitive grid to obtain a strain gauge array;
s7, cutting and forming: and cutting the strain gauge array by laser to obtain the single strain gauge.
Further, the step S1 is preceded by:
s0, preparing a strain gauge template: the strain gauge template comprises strain gauge photoetching areas arranged in an array, conductive band photoetching areas and connecting line photoetching areas for connecting the strain gauge photoetching areas and the conductive band photoetching areas.
Further, step S2 is specifically:
covering the substrate composite layer with the strain gauge templates, and obtaining strain gauge patterns in each strain gauge region through the matching of a photoetching process and the strain gauge templates.
Further, step S3 is specifically:
and covering the substrate composite layer with the strain gauge templates, and matching the photoetching process with the strain gauge templates to obtain connecting wires respectively short-circuited with each strain gauge graph and conductive strips connecting all the connecting wires.
Further, in step S4, the plating the film on the solder joints by the electroplating process specifically includes:
and electrifying the conductive belt through the electroplating lead wire so as to electrify all the strain gauge patterns and further coat films on all welding spots.
Further, in step S4, the plating film is one of gold plating or tin plating.
Further, the thickness of the tin plating is 5 to 100 micrometers, and the thickness of the gold plating is 0.5 to 1 micrometer.
Further, between step S5 and step S6, the method further includes:
s5.1, resistance adjustment: and adjusting the resistance value of the sensitive grid of each strain gauge graph to a required range.
Further, the air conditioner is provided with a fan,
in step S1, the composite layer further includes strain gauge monitoring areas;
in step S2, after the metal foil is photo-etched by a photo-etching process, further obtaining a graph of a monitoring strain gauge in a plurality of monitoring areas of the strain gauge;
in step S3, the connecting line does not short the monitoring strain gauge pattern.
The preparation template comprises a strain gauge photoetching area, a conductive belt photoetching area and a connecting wire photoetching area, wherein the strain gauge photoetching area is distributed in an array, and the connecting wire photoetching area is connected with the strain gauge photoetching area and the conductive area.
Accordingly, the present invention provides the following effects and/or advantages:
the strain gauge with the plated film on the welding spot is obtained by short-circuiting all the strain gauge graphs through the connecting line, plating the film on the welding spot through isolating the sensitive grid and an electroplating process, and finally cutting off the connecting line, setting the sensitive grid protective layer, cutting and forming and the like. The strain gauge is coated with a film, and no soldering flux is needed in the process of connecting with other circuits.
The invention uniformly short-circuits all strain gauge graphs through the connecting wires, thereby plating films on the welding spots of the strain gauge graphs, ensuring the consistency of the plated films on all the welding spots, ensuring the same coverage degree of the plated films, and ensuring that the detection head of the resistance trimming instrument only needs to be contacted with the welding spots in the subsequent resistance trimming process.
According to the invention, the strain gauge template is prepared, the strain gauge photoetching area, the conductive strip photoetching area and the connecting line photoetching area for connecting the strain gauge photoetching area and the conductive strip photoetching area are arranged on the template, so that a shielded template is provided for a subsequent photoetching process, and a strain gauge graph which is short-circuited can be obtained by one-time photoetching, and the work efficiency is high and the consistency is high.
It is to be understood that both the foregoing general description and the following detailed description of the present invention are exemplary and explanatory and are intended to provide further explanation of the invention as claimed.
Drawings
FIG. 1 is a schematic flow chart of the present invention.
FIG. 2 is a diagram illustrating a structure of a strain gauge template according to an embodiment.
Fig. 3 is an enlarged view of a portion a of fig. 2.
Detailed Description
To facilitate understanding of those skilled in the art, the structure of the present invention will now be described in further detail by way of examples in conjunction with the accompanying drawings:
referring to fig. 1, a method for manufacturing a strain gauge coated with a solder joint comprises the following steps:
s0, preparing a strain gauge template: the strain gauge template comprises strain gauge photoetching areas 1, conductive strip photoetching areas 2 and connecting line photoetching areas 3, wherein the strain gauge photoetching areas 1 are distributed in an array manner, and the connecting line photoetching areas 3 are connected with the conductive strip photoetching areas 2;
in this embodiment, referring to fig. 2-3, the conductive strip photo-etching area is located at the periphery of the strain gauge photo-etching area and extends to each strain gauge photo-etching area, wherein the width of the conductive strip photo-etching area is much larger than that of the connection line photo-etching area, and the connection line photo-etching area connects each strain gauge photo-etching area and the conductive strip photo-etching area;
s1, preparing a substrate composite layer: heating the metal foil coated with the substrate, and curing the substrate slurry to obtain a substrate composite layer consisting of the metal foil and the substrate, wherein the substrate composite layer comprises strain gauge regions arranged in an array;
in this embodiment, a single side of the metal foil is coated with a substrate slurry, the substrate slurry adopted in this embodiment is a polyimide slurry, the metal foil is israen or cama, and other materials may be adopted in other embodiments, which is not limited herein; and heating the substrate slurry to a certain temperature by an oven to solidify the substrate slurry and attach the substrate slurry and the metal foil together, wherein the metal foil is exposed on one surface of the substrate slurry to obtain a substrate composite layer. And strain gauge regions arranged in an array are planned on the substrate composite layer.
S2, forming a strain gauge pattern: photoetching the metal foil through a photoetching process to obtain a strain gauge graph in each strain gauge area, wherein the strain gauge graph comprises a sensitive grid and a welding spot; the method specifically comprises the following steps: covering the substrate composite layer with the strain gauge templates, and obtaining strain gauge patterns in each strain gauge region through the matching of a photoetching process and the strain gauge templates.
S3, short-circuit strain gauge graph: short-circuiting all the strain gauge graphs through connecting lines; the method specifically comprises the following steps: and through the matching of the photoetching process and the strain gauge template, connecting lines which are respectively short-circuited with each strain gauge pattern and conductive strips which are connected with all the connecting lines are obtained.
In this embodiment, in steps S2 to S3, the substrate composite layer is covered with the strain gauge template, and the entire surface of each substrate composite layer is coated with photoresist by matching a photolithography process with the strain gauge template, and after exposure with the strain gauge template, the part not covered by the strain gauge template is washed away during development, and then etched to obtain a strain gauge pattern of a metal foil material having the same shape as the strain gauge template, and a composite layer to which the strain gauge pattern is attached, and at the same time, the strain gauge pattern has a connection line which short-circuits the connection line and the conductive strip of each strain gauge pattern.
S4, coating a welding spot: isolating the sensitive grid, and plating a film on the welding spot through an electroplating process to obtain a strain gauge graph with the welding spot plated with the film;
in this embodiment, the sensitive grid is attached by an adhesive tape to isolate the sensitive grid, the conductive band is electrified by an electroplating lead to electrify all the strain gauge patterns, and then all the welding spots are plated with a film, wherein the plated film is one of gold plating or tin plating, if the puppet is tin, the thickness of the tin plating is 5-100 micrometers, and if the plated film is gold, the thickness of the gold plating is 0.5-1 micrometer. Specifically, in this embodiment, the thickness of the tin is 5 micrometers, 50 micrometers or 100 micrometers, and the thickness of the gold is 0.5 micrometers, 0.8 micrometers or 1 micrometer, but in other embodiments, other thicknesses are also possible.
S5, cutting the connecting wire: cutting the connecting line by laser;
s5.1, resistance adjustment: adjusting the resistance value of the sensitive grid of each strain gauge graph to a required range;
in this embodiment, the tape needs to be removed before the resistance is adjusted. The resistance value of the strain gauge is adjusted in the prior art, the resistance of the strain gauge can be adjusted by means of polishing the sensitive grid and the like, so that the resistance value of the sensitive grid of each strain gauge graph is adjusted to a required range, a specific resistance value adjusting method is not limited, and meanwhile, the resistance value adjusting method is not specifically described.
S6, setting a sensitive grid protective layer: arranging a sensitive grid protective layer on one surface of the strain gauge graph corresponding to the sensitive grid to obtain a strain gauge array; in this embodiment, a cover layer slurry is further coated on one surface of the strain gauge pattern corresponding to the sensitive grid, and the strain gauge pattern is sent into a heating chamber to be heated and cured to obtain a sensitive grid protective layer, so that the complete strain gauge comprising the substrate, the sensitive grid and the cover layer is obtained. The method for disposing the sensitive gate protection layer is the prior art and is not specifically described herein.
S7, cutting and forming: and cutting the strain gauge array by laser to obtain the single strain gauge.
Further, referring to fig. 2-3, this embodiment provides strain gauge monitoring lithography areas on the strain gauge reticle,
in step S1, further obtaining a plurality of strain gauge monitoring areas on the composite layer through a photoetching process;
in step S2, after the metal foil is photo-etched by a photo-etching process, further obtaining a graph of a monitoring strain gauge in a plurality of monitoring areas of the strain gauge;
in step S3, the connecting line does not short the monitoring strain gauge pattern.
In the photoetching process, because all the strain gauge graphs are in short circuit through the connecting lines, the resistance value of the strain gauge graphs cannot be obtained, and the corrosion degree of the strain gauge graphs on the corrosion process cannot be accurately controlled in the photoetching process. The embodiment connects the monitoring strain gauge graph through the resistance measuring instrument, so that the resistance value of the monitoring strain gauge graph is monitored, and the parameters of the corrosion time and the like of the corrosion process of the monitoring strain gauge graph are accurately controlled.
Further, the strain gauge monitoring lithographic zones may be located at the periphery, corners or center of the strain gauge reticle.
Example two
And further providing a strain gauge preparation template for coating a welding spot, and referring to fig. 2-3, wherein the preparation template comprises strain gauge photoetching areas arranged in an array, conducting strip photoetching areas and connecting line photoetching areas for connecting the strain gauge photoetching areas and the conducting areas.
Further, the preparation of the template strain gauge monitors the photoetching area.
The working principle of the template preparation and the function and use thereof are described in detail in the first embodiment, and are not specifically described herein.
The above description is only a preferred embodiment of the present invention, and all equivalent changes and modifications made in accordance with the claims of the present invention should be covered by the present invention.

Claims (10)

1.一种焊点镀膜的应变计制备方法，其特征在于：包含以下步骤：1. a method for preparing a strain gauge of solder joint coating, characterized in that: comprise the following steps: S1，制备基底复合层：将涂覆有基底浆料的金属箔材加热，固化基底浆料，得到金属箔材与基底组成的基底复合层，所述基底复合层包含阵列布设的应变计区；S1, preparing the base composite layer: heating the metal foil coated with the base slurry, and curing the base slurry, to obtain a base composite layer composed of the metal foil and the base, the base composite layer comprising the strain gauge area arranged in an array; S2，制作应变计图形：通过光刻工艺对所述金属箔材光刻，在每个应变计区得到应变计图形，所述应变计图形包含敏感栅和焊点；S2, making a strain gauge pattern: photolithography the metal foil material by a photolithography process, and obtain a strain gauge pattern in each strain gauge area, and the strain gauge pattern includes a sensitive grid and a solder joint; S3，短接应变计图形：通过连接线短接所有所述应变计图形；S3, short-circuit strain gauge graphics: short-circuit all the strain gauge graphics through connecting wires; S4，焊点镀膜：隔离所述敏感栅，通过电镀工艺在所述焊点镀膜，得到焊点镀有膜的应变计图形；S4, solder joint coating: isolating the sensitive grid, and coating the solder joints through an electroplating process to obtain a strain gauge pattern with a film coating on the solder joints; S5，切断连接线：通过激光将所述连接线切除；S5, cut off the connecting line: cut off the connecting line by laser; S6，设置敏感栅保护层：在所述应变计图形对应所述敏感栅的一面设置敏感栅保护层，得到应变计阵列；S6, setting a sensitive grid protective layer: a sensitive grid protective layer is provided on one side of the strain gauge pattern corresponding to the sensitive grid to obtain a strain gauge array; S7，切割成型：通过激光将所述应变计阵列切割，得到单个应变计。S7, cutting and forming: the strain gauge array is cut by a laser to obtain a single strain gauge. 2.根据权利要求1所述的一种焊点镀膜的应变计制备方法，其特征在于：所述步骤S1之前进一步包含：2. The method for preparing a strain gauge for solder joint coating according to claim 1, wherein before the step S1, the method further comprises: S0，制备应变计模版：所述应变计模版包含阵列布设的应变计光刻区，以及导电带光刻区，以及连接所述应变计光刻区和所述导电带光刻区的连接线光刻区。S0, prepare a strain gauge template: the strain gauge template includes a strain gauge lithography area arranged in an array, a conductive strip lithography area, and a connecting line light connecting the strain gauge lithography area and the conductive strip lithography area engraved area. 3.根据权利要求2所述的一种焊点镀膜的应变计制备方法，其特征在于：步骤S2具体为：3. The method for preparing a strain gauge for solder joint coating according to claim 2, wherein step S2 is specifically: 对所述基底复合层盖设所述应变计模版，通过光刻工艺和所述应变计模版的配合，在每个应变计区得到应变计图形。The strain gage template is covered on the base composite layer, and a strain gage pattern is obtained in each strain gage area through the cooperation of the photolithography process and the strain gage template. 4.根据权利要求2所述的一种焊点镀膜的应变计制备方法，其特征在于：步骤S3具体为：4. The method for preparing a strain gauge for solder joint coating according to claim 2, wherein step S3 is specifically: 对所述基底复合层盖设所述应变计模版，通过光刻工艺和所述应变计模版的配合，得到分别短接每个应变计图形的连接线，以及连接所有所述连接线的导电带。Covering the base composite layer with the strain gauge template, and through the cooperation of the photolithography process and the strain gauge template, a connection line for short-circuiting each strain gauge pattern and a conductive strip for connecting all the connection lines are obtained. . 5.根据权利要求4所述的一种焊点镀膜的应变计制备方法，其特征在于：步骤S4中，所述通过电镀工艺在所述焊点镀膜具体为：5. The method for preparing a strain gauge for solder joint coating according to claim 4, wherein in step S4, the coating on the solder joint by an electroplating process is specifically: 通过电镀引线向对所述导电带通电，从而对所有应变计图形通电，进而在所有焊点镀膜。The conductive strips are energized by plating leads to energize all strain gage patterns, thereby plating all solder joints. 6.根据权利要求1-5任意一条所述的一种焊点镀膜的应变计制备方法，其特征在于：步骤S4中，所述镀膜为镀金或镀锡其中的一种。6 . The method for preparing a strain gauge of a solder joint coating according to claim 1 , wherein in step S4 , the coating is one of gold plating or tin plating. 7 . 7.根据权利要求6所述的一种焊点镀膜的应变计制备方法，其特征在于：所述镀锡的厚度为5-100微米，所述镀金的厚度为0.5-1微米。7 . The method for preparing a strain gauge for solder joint coating according to claim 6 , wherein the thickness of the tin plating is 5-100 μm, and the thickness of the gold plating is 0.5-1 μm. 8 . 8.根据权利要求1所述的一种焊点镀膜的应变计制备方法，其特征在于：步骤S5和步骤S6之间，进一步包含：8. The method for preparing a strain gauge for solder joint coating according to claim 1, wherein: between step S5 and step S6, further comprising: S5.1，阻值调整：将每个应变计图形的敏感栅的阻值调整到要求的范围。S5.1, resistance value adjustment: adjust the resistance value of the sensitive grid of each strain gage pattern to the required range. 9.根据权利要求1所述的一种焊点镀膜的应变计制备方法，其特征在于：9. The method for preparing a strain gauge of a solder joint coating according to claim 1, wherein: 步骤S1中，所述复合层进一步包含若干应变计监控区；In step S1, the composite layer further includes a plurality of strain gauge monitoring areas; 步骤S2中，通过光刻工艺对所述金属箔材光刻后，进一步在若干所述应变计监控区得到监控应变计图形；In step S2, after photolithography is performed on the metal foil material by a photolithography process, monitoring strain gauge patterns are further obtained in several of the strain gauge monitoring areas; 步骤S3中，所述连接线不短接所述监控应变计图形。In step S3, the connecting wire is not shorted to the monitoring strain gauge pattern. 10.一种焊点镀膜的应变计制备模版，其特征在于：所述制备模版包含阵列布设的应变计光刻区，以及导电带光刻区，以及连接所述应变计光刻区和所述导电区的连接线光刻区。10. A strain gauge preparation template for solder joint coating, characterized in that: the preparation template comprises a strain gauge lithography area arranged in an array, a conductive strip lithography area, and a connection between the strain gauge lithography area and the The connection line lithography area of the conductive area.
CN202011640015.6A 2020-12-31 2020-12-31 Preparation method and template for strain gauge coated with welding spot Active CN112629402B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN202210893754.9A CN115235331A (en) 2020-12-31 2020-12-31 A Strain Gauge Preparation Template for Solder Joint Coating
CN202011640015.6A CN112629402B (en) 2020-12-31 2020-12-31 Preparation method and template for strain gauge coated with welding spot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202011640015.6A CN112629402B (en) 2020-12-31 2020-12-31 Preparation method and template for strain gauge coated with welding spot

Related Child Applications (1)

Application Number Title Priority Date Filing Date
CN202210893754.9A Division CN115235331A (en) 2020-12-31 2020-12-31 A Strain Gauge Preparation Template for Solder Joint Coating

Publications (2)

Publication Number Publication Date
CN112629402A true CN112629402A (en) 2021-04-09
CN112629402B CN112629402B (en) 2022-08-23

Family

ID=75290140

Family Applications (2)

Application Number Title Priority Date Filing Date
CN202210893754.9A Pending CN115235331A (en) 2020-12-31 2020-12-31 A Strain Gauge Preparation Template for Solder Joint Coating
CN202011640015.6A Active CN112629402B (en) 2020-12-31 2020-12-31 Preparation method and template for strain gauge coated with welding spot

Family Applications Before (1)

Application Number Title Priority Date Filing Date
CN202210893754.9A Pending CN115235331A (en) 2020-12-31 2020-12-31 A Strain Gauge Preparation Template for Solder Joint Coating

Country Status (1)

Country Link
CN (2) CN115235331A (en)

Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5328551A (en) * 1992-10-28 1994-07-12 Eaton Corporation Method of making high output strain gage
JP2004117083A (en) * 2002-09-25 2004-04-15 Kyowa Electron Instr Co Ltd Weldable waterproof strain gauge and method of manufacturing the same
CN1516294A (en) * 2003-01-08 2004-07-28 炬鑫科技股份有限公司 Vertical component structure of gallium nitride base light-emitting diode and its making method
CN101614522A (en) * 2009-07-31 2009-12-30 中国航天科技集团公司第四研究院第四十四研究所 Manufacturing method of resistance strain gage based on ion beam technology
CN102636106A (en) * 2012-04-25 2012-08-15 中航电测仪器股份有限公司 Medium-temperature foil type resistance strain gauge
CN102788603A (en) * 2012-07-27 2012-11-21 华东理工大学 All-metal packaged high-temperature resistant fiber bragg grating sensor and manufacture method thereof
CN103615967A (en) * 2013-11-30 2014-03-05 中航电测仪器股份有限公司 High-temperature foil strain gauge and method for manufacturing high-temperature foil strain gauge
CN104427789A (en) * 2013-08-22 2015-03-18 富葵精密组件(深圳)有限公司 Multilayer circuit board and manufacturing method thereof
CN105908142A (en) * 2016-04-15 2016-08-31 大连交通大学 High-temperature thin film strain gauge and manufacturing method thereof
CN106370097A (en) * 2016-08-26 2017-02-01 中航电测仪器股份有限公司 Strain gauge for composite material and preparation method thereof
CN109059747A (en) * 2018-07-04 2018-12-21 北京科技大学 A kind of temporary frame work wire grid formula high temperature strain gauge and its manufacture and use method
CN209043232U (en) * 2018-12-21 2019-06-28 广东微应变传感科技有限公司 A kind of integrated foil resistance strain gauge for torque sensor
CN111006695A (en) * 2019-12-02 2020-04-14 广东微应变传感科技有限公司 Processing method of strainometer with self-adhesive
CN112912704A (en) * 2018-08-31 2021-06-04 梅特勒-托利多(常州)精密仪器有限公司 Moisture isolation type strain gage and method for isolating moisture permeation for strain gage

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE19936856C1 (en) * 1999-08-05 2000-09-28 Siemens Ag Manufacturing method for foil strain-gauge element
JP5286893B2 (en) * 2007-04-27 2013-09-11 日立化成株式会社 Connection terminal, semiconductor package using connection terminal, and method of manufacturing semiconductor package
CN103712721B (en) * 2013-12-23 2016-05-11 新会康宇测控仪器仪表工程有限公司 A kind of SOI piezoelectric strain gauge and preparation method thereof
CN111156892B (en) * 2019-12-23 2021-09-24 陕西电器研究所 Preparation improvement method of ion beam sputtering coating blocking piece sensor

Patent Citations (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5328551A (en) * 1992-10-28 1994-07-12 Eaton Corporation Method of making high output strain gage
JP2004117083A (en) * 2002-09-25 2004-04-15 Kyowa Electron Instr Co Ltd Weldable waterproof strain gauge and method of manufacturing the same
CN1516294A (en) * 2003-01-08 2004-07-28 炬鑫科技股份有限公司 Vertical component structure of gallium nitride base light-emitting diode and its making method
CN101614522A (en) * 2009-07-31 2009-12-30 中国航天科技集团公司第四研究院第四十四研究所 Manufacturing method of resistance strain gage based on ion beam technology
CN102636106A (en) * 2012-04-25 2012-08-15 中航电测仪器股份有限公司 Medium-temperature foil type resistance strain gauge
CN102788603A (en) * 2012-07-27 2012-11-21 华东理工大学 All-metal packaged high-temperature resistant fiber bragg grating sensor and manufacture method thereof
CN104427789A (en) * 2013-08-22 2015-03-18 富葵精密组件(深圳)有限公司 Multilayer circuit board and manufacturing method thereof
CN103615967A (en) * 2013-11-30 2014-03-05 中航电测仪器股份有限公司 High-temperature foil strain gauge and method for manufacturing high-temperature foil strain gauge
CN105908142A (en) * 2016-04-15 2016-08-31 大连交通大学 High-temperature thin film strain gauge and manufacturing method thereof
CN106370097A (en) * 2016-08-26 2017-02-01 中航电测仪器股份有限公司 Strain gauge for composite material and preparation method thereof
CN109059747A (en) * 2018-07-04 2018-12-21 北京科技大学 A kind of temporary frame work wire grid formula high temperature strain gauge and its manufacture and use method
CN112912704A (en) * 2018-08-31 2021-06-04 梅特勒-托利多(常州)精密仪器有限公司 Moisture isolation type strain gage and method for isolating moisture permeation for strain gage
CN209043232U (en) * 2018-12-21 2019-06-28 广东微应变传感科技有限公司 A kind of integrated foil resistance strain gauge for torque sensor
CN111006695A (en) * 2019-12-02 2020-04-14 广东微应变传感科技有限公司 Processing method of strainometer with self-adhesive

Also Published As

Publication number Publication date
CN115235331A (en) 2022-10-25
CN112629402B (en) 2022-08-23

Similar Documents

Publication Publication Date Title
US5328551A (en) Method of making high output strain gage
US8640549B2 (en) Strain gage and manufacturing method thereof
CN103615967B (en) A kind of high temperature foil strain gauge and manufacture method thereof
JPH0744320B2 (en) Resin circuit board and manufacturing method thereof
CN112629402B (en) Preparation method and template for strain gauge coated with welding spot
US4309687A (en) Resistance strain gauge
JPS6140330B2 (en)
JP2000146511A (en) Strain gauge
CN110191590B (en) Elastic circuit board preparation method and elastic circuit board
US2386879A (en) Strain gauge and method of producing it
JP2992857B2 (en) Strain gauge with temperature measurement function
GB2174241A (en) Transducer devices
JP2014202607A (en) Resistor foil strain gauge
CN211978184U (en) Ring strain gauge with self-heat dissipation and self-positioning functions
SU586319A1 (en) Method of manufacturing foil-type resistance strain-gauge
JP2833152B2 (en) Semiconductor device
KR101915545B1 (en) Strain inspection device and manufacture method thereof
JP2722080B2 (en) Free filament strain gauge and its manufacturing method
JPH0582596A (en) Lead frame
JPH0362542A (en) Semiconductor device and manufacture thereof
JPS61155929A (en) Method for adjusting creep of load cell and creep adjusted load cell
JP2777425B2 (en) Method of manufacturing pin grid array having multi-stage bonding terminal structure, apparatus for cutting out inner layer terminal thereof, and multilayer substrate for pin grid array
CN108692670B (en) Strain monitoring method for curved surface fitting
JPS6259767B2 (en)
JPH05149796A (en) Temperature sensor

Legal Events

Date Code Title Description
PB01 Publication
PB01 Publication
SE01 Entry into force of request for substantive examination
SE01 Entry into force of request for substantive examination
GR01 Patent grant
GR01 Patent grant