CN112620947B - Laser preparation method of vein bionic surface diamond cutting tool - Google Patents

Abstract

The invention discloses a laser preparation method of a diamond cutting tool on a leaf vein bionic surface. The method includes the following steps: 1. Process a coating on the surface of the diamond tool by using a hot wire chemical vapor deposition method; Surface treatment of the obtained diamond tool; 3. Process the surface of the surface-treated tool with a laser processing method to produce a bionic microstructure of veins; 4. Clean the processed tool ultrasonically with an organic solvent and dry it with sandpaper to obtain a finished product. By improving the cutting conditions of the tool, the preparation efficiency and quality of the new diamond tool can be improved, the service life can be increased, mass production can be achieved, and the production requirements of high efficiency, high scale and high quality can be met today.

Description

A laser preparation method of diamond cutting tool with vein bionic surface

technical field

The invention relates to a preparation method of a cutting tool, in particular to a laser preparation method of a diamond cutting tool with a leaf vein bionic surface, and belongs to the technical field of diamond cutting tool processing.

Background technique

Diamond tools have excellent performance in terms of hardness, edge sharpness and thermal conductivity, so diamond tools are often used to cut high-hardness workpieces. However, the cutting performance and service life of diamond tools limit its use in the machinery industry to a certain extent. efficient use. Diamond tools are the hardest cutting tools. In recent years, it has become a research hotspot for researchers to process some microstructures with a certain order on the surface of diamond tools. However, the preparation is difficult, the preparation efficiency is low, and the precision is low. Low, traditional preparation methods are far from meeting the needs of modern industry for tool performance.

Contents of the invention

The technical problem to be solved by the present invention is to provide a laser preparation method of a diamond cutting tool with a vein bionic surface, by improving the cutting conditions of the tool, the preparation efficiency and quality of the new diamond tool can be improved, and the service life can be increased, effectively solving the problem of traditional diamond cutting tools. The problems of poor cutting performance, low processing efficiency and low grinding quality of diamond tools exist in the tool cutting process.

The technical solution of the present invention is: a laser preparation method of a diamond cutting tool on a leaf vein bionic surface, the method includes the following steps: 1. Process a coating on the surface of the diamond tool by using a hot wire chemical vapor deposition method; 2. Apply the step 1. Surface treatment is carried out on the prepared diamond tool; 3. Laser processing is used to process the surface of the surface-treated tool to produce a bionic microstructure of veins; 4. The processed tool is ultrasonically cleaned and dried with an organic solvent, and then polished with sandpaper. to get the finished product.

In the first step, the tool is pretreated, the tool is ultrasonically cleaned in an acetone solution for 8-15 minutes, the hard alloy is subjected to Co removal and carbide treatment, and ultrasonic crystal planting is performed in diamond micropowder suspension.

In the first step, the hot wire used is a tantalum wire.

In the first step, the processing equipment system needs to be evacuated, and the mixed reaction gas of CH ₄ and H ₂ is introduced. The working chamber pressure of the system is 1-3kPa, and the substrate temperature in the system is 650-850°C.

In the first step, radio frequency magnetron sputtering equipment is used to prepare a film base on the diamond coating, and the sputtering time is 25-50 minutes.

In the second step, the surface of the tool to be processed is ground and polished, and the area to be processed is cleaned with acetone solution and polished with sandpaper, ultrasonically cleaned with an organic solvent and dried, and then fixed on an ultra-precision platform.

In the third step, the parameters of the bionic microstructure of the veins are: the width of the main stem of the bionic vein is 70-90 μm, the depth is 20-30 μm, the width of the small stem is 50-60 μm, the depth is 10-20 μm, and the distance between the main stems is about 200 μm.

In the third step, the laser processing parameters are: power 1-15W, speed 100-1000μm/s, frequency 1-3kHz, and scanning times 2-5 times.

The beneficial effects of the present invention are: compared with prior art, the present invention has the following advantages:

(1) The production efficiency of laser equipment and high-precision CNC machine tools is far higher than other processing methods, and can achieve mass production, adapting to today's high-efficiency, high-scale, and high-quality production requirements. The surface of the workpiece processed by laser is not mechanically processed and does not produce residual stress and cause strain, so that the surface of the part has the original precision;

(2) The vein bionic structure processed on the rake face of the tool can significantly reduce the friction and cutting force during the cutting process, and the micro-groove can effectively store lubricant and also play a good role in chip removal and reduce cutting contact Length changes chip shape to reduce built-up edge, improve friction performance and increase life. The service life of the tool has been increased by 3-4 times, and the effect is remarkable.

Description of drawings

Fig. 1 is a schematic diagram of the preparation process of the microstructure of the present invention;

Fig. 2 is a schematic diagram of the microstructured surface of the present invention;

Fig. 3 is the laser processing schematic diagram of the present invention,

Fig. 4 is a view of the cemented carbide matrix insert of the present invention.

Detailed ways

In order to make the object, technical solution and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings of this specification.

Embodiment 1: as shown in accompanying drawing 1-4, a kind of laser preparation method of the diamond cutting tool of leaf vein bionic surface, described method comprises the following steps: 1, adopt hot wire chemical vapor deposition method to process coating on the surface of diamond tool 2. Surface treatment is carried out on the diamond tool prepared in step 1; 3. The surface of the surface-treated tool is processed by a laser processing method to produce a bionic microstructure of veins; 4. The processed tool is ultrasonically cleaned with an organic solvent and After drying, sand it with sandpaper to get the finished product.

Specific steps are as follows:

1. Diamond Coated Tool Preparation

The hot wire chemical vapor deposition (HFCVD) technology has the characteristics of simple equipment, low cost, fast film formation rate and dense coating. The steps are as follows:

1) The tool is pretreated, and the tool is ultrasonically cleaned in acetone solution for 8-15 minutes. Carbide is subjected to Co and carbide treatment, and ultrasonic crystallization is carried out in the suspension of diamond micropowder, as shown in Figure 4, which is a map of the cemented carbide matrix blade.

2) Put the tool into the HFCVD system, and install the hot wire, which uses tantalum wire.

3) evacuate the HFCVD system, and feed a certain proportion of CH ₄ and H ₂ mixed reaction gas;

4) Turn on the HFCVD system, adjust the pressure in the working chamber of the HFCVD system to 1-3kPa, and the substrate temperature in the system to 650-850°C to prepare the diamond coating;

5) Prepare the film base on the diamond coating with radio frequency magnetron sputtering equipment, and the sputtering time is 25-50min.

2. A preparation method for machining microstructures on the rake face of a diamond tool based on a femtosecond laser, comprising the following steps (as shown in the schematic diagram of the microstructure preparation process shown in Figure 1):

1) Before surface texture processing, the surface of the workpiece to be processed is ground and polished, and the area to be processed is cleaned with acetone solution and polished with 600# sandpaper. After ultrasonic cleaning and drying with organic solvents, it is fixed on an ultra-precision platform To ensure the safety and stability of the processing process and the accuracy of the results.

2) Clamp and fix the diamond tool on the CNC machine tool, so that more than 80% of the rake face is exposed, and adjust the X-Y axis to adjust the tool to the accurate processed position to ensure that the processed part is completely focused by the laser. A bionic structure parallel to the cutting edge is processed on the rake face of the tool, and the size of the microstructure is rationally selected according to the research on the bionic structure of the veins. The width of the main stem of the bionic vein is 70-90 μm, the depth is 20-30 μm, and the width of the small stem is 50-60 μm The depth is 10-20 μm, the distance between the main stems is about 200 μm, and the distance from the edge is selected to be 200 μm before processing. By controlling parameters such as laser energy and laser scanning speed, the processing of the width and depth of the microstructure can be realized. See Figure 2 for a schematic diagram of the microstructured surface of the tool.

3) Turn on the laser first, and the computer emits the laser beam to the surface of the workpiece through the laser controller to complete the laser focusing, the focus position is -2-2mm, and then adjust the rotation angle and height of the focus lens according to the Z-axis and processing angle to achieve precise laser focus to ensure The effective part of the tool is not damaged, the laser generator is turned off after the focus position is determined, and the ultra-precision platform is adjusted to determine the processing area of the workpiece.

4) When the workpiece is processed, the laser controller is turned on by the control computer. The laser controller can select the femtosecond laser in the laser generator to emit the laser beam, and then enter the surface of the workpiece through the focusing lens, and process according to the required microstructure. Turn on the auxiliary gas device, and the laser processing parameters can be adjusted online through the control computer. According to the femtosecond laser preparation microstructure processing method described in the claims, and considering the characteristics of the microstructure, the laser processing parameters used this time are power 1-15W, speed 100-1000μm/s, frequency 1-3kHz, number of scans 2-5 times, as shown in Figure 3 femtosecond laser processing schematic diagram.

5) After the processing is completed, turn off the equipment to remove the workpiece, ultrasonically clean and dry it with an organic solvent, and then polish it with 600# sandpaper to obtain the finished product.

The laser processing system includes a laser controller, a laser generator, an optical path switching module, a focusing module, an air blowing auxiliary device and an ultra-precision three-axis X-Y-Z machine tool. The auxiliary gas includes nitrogen and argon; the solvent includes acetone and alcohol.

This method adopts femtosecond laser preparation. Femtosecond laser processing technology refers to a laser with a pulse width of femtosecond level (1fs=10 ^-15 s), which can form microstructures with micron or even nanometer-sized and high-precision microstructures, and has the advantages of small processing heat-affected zone and high material removal efficiency. It is a clean and pollution-free processing method, and it is a green, energy-saving and efficient surface processing technology. Moreover, the femtosecond laser processing process is non-contact and does not generate surface stress, which has the obvious advantage of removing materials without abrasion. During laser processing, the high-intensity laser beam is focused on the surface of the workpiece through an optical lens, heating, melting, and vaporizing the processed material, as shown in Figure 2. Laser processing schematic diagram. Combining femtosecond laser processing with advanced computer technology, it can process complex structures, which are suitable for high-automation, precision processing of special tissues, and can also make tools have special cutting performance. The choice of laser preparation and parameter selection greatly affects the performance and life of the tool. Because of the particularity of diamond tools, laser can cause thermal defects such as microcracks and fractures. Therefore, it is particularly important to choose reasonable processing parameters.

The parts of the present invention that are not described in detail are known technologies of those skilled in the art. Finally, it is noted that the above embodiments are only used to illustrate the technical solutions of the present invention without limitation. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be carried out Modifications or equivalent replacements without departing from the spirit and scope of the technical solution of the present invention shall be covered by the claims of the present invention.

Claims (7)

1. A laser preparation method of a vein bionic surface diamond cutting tool is characterized by comprising the following steps: the method comprises the following steps: 1. processing a coating on the surface of the diamond cutter by a hot wire chemical vapor deposition method; 2. carrying out surface treatment on the diamond cutter prepared in the step one; 3. processing the surface-treated cutter surface by adopting a laser processing method to obtain a vein bionic microstructure, wherein the vein bionic microstructure is a bionic structure parallel to a cutting edge, and comprises a strip-shaped main groove and oblique branch grooves arranged on two sides of the strip-shaped main groove; parameters of the vein bionic microstructure are as follows: fourthly, ultrasonically cleaning the machined cutter by using an organic solvent, drying and then grinding the cutter by using sand paper to obtain a finished product, wherein the width of a main stem of the bionic leaf vein is 70-90 mu m, the depth is 20-30 mu m, the width of a small stem is 50-60 mu m, the depth is 10-20 mu m, and the distance between the main stems is 200 mu m.

2. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: in the first step, the cutter is pretreated, the cutter is ultrasonically cleaned in an acetone solution for 8-15min, co and carbide removal treatment is carried out on the hard alloy, and ultrasonic crystal implantation is carried out in a diamond micro powder suspension.

3. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: in the first step, the adopted hot wire is a tantalum wire.

4. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: in the step one, the processing equipment system needs to be vacuumized, and CH is introduced ₄ And H ₂ The pressure of the working chamber of the system is 1-3kPa, and the temperature of the substrate in the system is 650-850 ℃.

5. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized by comprising the following steps: in the first step, a film substrate is prepared on the diamond coating by adopting radio frequency magnetron sputtering equipment, and the sputtering time is 25-50min.

6. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: and in the second step, grinding and polishing the surface of the tool to be processed, cleaning the area to be processed by using an acetone solution, polishing the area by using sand paper, ultrasonically cleaning by using an organic solvent, drying and fixing the area on the ultra-precise platform.

7. The laser preparation method of the vein bionic surface diamond cutting tool according to claim 1, characterized in that: in the third step, the laser processing technological parameters are as follows: power 1-15W, speed 100-1000 μm/s, frequency 1-3kHz, and scanning times 2-5.

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