CN112612305B - Temperature adjusting method, device, equipment, storage medium and air conditioning system - Google Patents
Temperature adjusting method, device, equipment, storage medium and air conditioning system Download PDFInfo
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- CN112612305B CN112612305B CN202011399005.8A CN202011399005A CN112612305B CN 112612305 B CN112612305 B CN 112612305B CN 202011399005 A CN202011399005 A CN 202011399005A CN 112612305 B CN112612305 B CN 112612305B
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- 238000000034 method Methods 0.000 title claims abstract description 48
- 238000004378 air conditioning Methods 0.000 title claims abstract description 9
- 238000012360 testing method Methods 0.000 claims description 51
- 230000000630 rising effect Effects 0.000 claims description 27
- 230000008569 process Effects 0.000 claims description 11
- 238000005057 refrigeration Methods 0.000 claims description 6
- 238000010276 construction Methods 0.000 claims description 5
- 238000001816 cooling Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
- 230000006870 function Effects 0.000 description 3
- 238000003062 neural network model Methods 0.000 description 3
- 238000012549 training Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000002035 prolonged effect Effects 0.000 description 2
- 230000004075 alteration Effects 0.000 description 1
- 238000013500 data storage Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000013507 mapping Methods 0.000 description 1
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- G05—CONTROLLING; REGULATING
- G05D—SYSTEMS FOR CONTROLLING OR REGULATING NON-ELECTRIC VARIABLES
- G05D23/00—Control of temperature
- G05D23/19—Control of temperature characterised by the use of electric means
- G05D23/1927—Control of temperature characterised by the use of electric means using a plurality of sensors
- G05D23/193—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces
- G05D23/1931—Control of temperature characterised by the use of electric means using a plurality of sensors sensing the temperaure in different places in thermal relationship with one or more spaces to control the temperature of one space
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Abstract
The invention relates to the technical field of temperature control, in particular to a temperature adjusting method, a device, equipment, a storage medium and an air conditioning system.
Description
Technical Field
The invention relates to the technical field of temperature control, in particular to a temperature adjusting method, a temperature adjusting device, temperature adjusting equipment, a storage medium and an air conditioning system.
Background
Data centers are important locations for data storage and processing. Currently, temperature control for data centers is typically controlled on a room temperature basis. That is, the cooling capacity is adjusted only when the cooling device detects a change in the ambient temperature, so as to maintain the room temperature of the data center stable.
However, with the development of internet technology, there are more and more occasions where the access volume in a data center is increased for a short time, for example, when "twenty-one" people pay at zero or when people buy train tickets during spring transportation. In such a scenario where a large amount of access is generated in a short time, the load of the data center server suddenly increases greatly, and the high-load operating temperature of hardware such as a CPU therein rapidly increases.
However, the temperature of the server hardware is increased for a period of time to cause the change of the room temperature, and the server hardware is still operated at a high temperature for a period of time before the refrigerating device adjusts the refrigerating capacity, which may cause the service life to be reduced or even damaged.
Disclosure of Invention
In view of the above, the present invention provides a temperature adjustment method, apparatus, device, storage medium and air conditioning system, which may cause a problem that when the access capacity in the data center is increased for a short time, the server hardware is in a high-temperature operation state for a while before the refrigeration equipment adjusts the cooling capacity, and the service life of the server hardware may be reduced or even damaged.
In order to achieve the purpose, the invention adopts the following technical scheme:
a method of adjusting temperature, comprising:
acquiring the current visit volume of the data center;
inputting the current access quantity into a pre-constructed temperature adjustment model to obtain a temperature adjustment parameter output by the temperature adjustment model;
and adjusting the temperature according to the temperature adjusting parameters.
Further, in the above method for adjusting temperature, the method for constructing the temperature adjustment model includes:
obtaining a sample access amount and a sample temperature adjustment parameter corresponding to the sample access amount;
and establishing the temperature adjustment model according to the sample access amount and the sample temperature adjustment parameter.
Further, the method for adjusting the temperature, where the obtaining of the sample access amount and the sample temperature adjustment parameter corresponding to the sample access amount includes:
in the pressure testing process of the data center, obtaining the testing access amount of the data center and obtaining the hardware temperature corresponding to the testing access amount;
if the hardware temperature is detected to be stable in the test access amount, the hardware temperature is in a rising state, and the temperature adjusting parameter is changed to adjust the hardware temperature until the rising speed of the hardware temperature is zero;
determining a corresponding temperature adjustment parameter when the rising speed is zero;
and taking the test visit amount as the sample visit amount, and taking the corresponding temperature adjustment parameter when the rising speed is zero as the sample temperature adjustment parameter.
Further, the above method for adjusting the temperature, where the obtaining of the hardware temperature corresponding to the test access amount includes:
acquiring the real-time temperature of internal hardware of the data center sent by the data center as the hardware temperature; or
And calculating the hardware temperature according to the operating parameters of the data center.
Further, in the method for adjusting temperature described above, the temperature adjustment parameter includes a refrigeration parameter.
Further, in the temperature adjustment method, the temperature adjustment model is updated every preset time period.
Further, the present invention also provides a temperature adjusting apparatus, comprising:
the acquisition module is used for acquiring the current visit amount of the data center;
the input module is used for inputting the current access amount into a pre-constructed temperature adjustment model to obtain a temperature adjustment parameter output by the temperature adjustment model;
and the adjusting module is used for adjusting the temperature according to the temperature adjusting parameters.
Further, the temperature adjusting device further comprises a building module;
the construction module is used for acquiring sample access amount and sample temperature adjustment parameters corresponding to the sample access amount; and establishing the temperature adjustment model according to the sample access amount and the sample temperature adjustment parameter.
Further, the temperature adjusting device, the building module, is configured to obtain a test visit amount of the data center during a pressure test of the data center, and obtain a hardware temperature corresponding to the test visit amount; if the hardware temperature is detected to be stable in the test access amount, the hardware temperature is in a rising state, and the temperature adjusting parameter is changed to adjust the hardware temperature until the rising speed of the hardware temperature is zero; determining a corresponding temperature adjustment parameter when the rising speed is zero; and taking the test visit amount as the sample visit amount, and taking the corresponding temperature adjustment parameter when the rising speed is zero as the sample temperature adjustment parameter.
Further, the temperature adjusting device, the building module, is configured to obtain a real-time temperature of internal hardware of the data center sent by the data center as the hardware temperature; or calculating the hardware temperature according to the operation parameters of the data center.
Further, the invention also provides a temperature adjusting device, which comprises a processor and a memory, wherein the processor is connected with the memory:
the processor is used for calling and executing the program stored in the memory;
the memory is used for storing the program, and the program is at least used for executing the temperature adjusting method in any one of the above.
Further, the invention also provides an air conditioning system which comprises the temperature adjusting device.
Further, the present invention also provides a storage medium storing a program, which when executed by a processor, implements each step of the temperature adjustment method described in any one of the above.
The method comprises the steps of obtaining the current access amount of a data center, inputting the current access amount into a pre-constructed temperature adjustment model, obtaining temperature adjustment parameters output by the temperature adjustment model, and adjusting the temperature according to the temperature adjustment parameters.
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In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
FIG. 1 is a flow chart of a method for adjusting temperature according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of an embodiment of the temperature adjustment apparatus of the present invention;
fig. 3 is a schematic structural diagram provided by an embodiment of the temperature adjustment apparatus of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the technical solutions of the present invention will be described in detail below. It is to be understood that the described embodiments are merely exemplary of the invention, and not restrictive of the full scope of the invention. All other embodiments, which can be derived by a person skilled in the art from the examples given herein without any inventive step, are within the scope of the present invention.
Fig. 1 is a flow chart of a temperature adjustment method according to an embodiment of the present invention.
As shown in fig. 1, the present embodiment may include the following steps:
s101, obtaining the current visit amount of the data center.
In this embodiment, the access state of the data center may be monitored to obtain the current access amount of the data center.
The gateway can realize network interconnection above a network layer and can acquire the network flow of the data center where the gateway is located. Optionally, the embodiment may establish a connection with a gateway of the data center in a wired or wireless manner, acquire current network traffic from the gateway in a wired or wireless manner, that is, an access amount of the external network to the data center, and use the access amount of the external network to the data center as the current access amount of the embodiment.
And S102, inputting the current access quantity into a pre-constructed temperature adjustment model to obtain a temperature adjustment parameter output by the temperature adjustment model.
Optionally, in this embodiment, the current access amount may be input into a pre-constructed temperature adjustment model, a result output by the temperature adjustment model is obtained, and the result output by the temperature adjustment model is used as the temperature adjustment parameter of this embodiment.
Optionally, the temperature adjustment model is pre-constructed, and the temperature adjustment model may be constructed according to the following steps:
the method comprises the following steps: acquiring a sample access amount and a sample temperature adjustment parameter corresponding to the sample access amount;
step two: and establishing a temperature adjustment model according to the sample access amount and the sample temperature adjustment parameter.
In particular, a large number of training samples may be obtained. In this embodiment, the training sample includes a sample visit amount and a sample temperature adjustment parameter corresponding to the sample visit amount. And then establishing a temperature adjustment model according to the sample access amount and the sample temperature adjustment parameter.
Optionally, a suitable neural network model may be selected according to actual conditions, and this embodiment is not limited. The sample visit volume and the sample temperature adjustment parameters corresponding to the sample visit volume are input into the neural network model, and then the network model is trained by using a large number of sample visit volumes and the sample temperature adjustment parameters, and when the neural network model converges, the temperature adjustment model of the embodiment can be obtained.
Optionally, a suitable algorithm may be used to establish a mapping relationship model between the sample access amount and the sample temperature adjustment parameter as the temperature adjustment model according to the large amount of sample access amount and the sample temperature adjustment parameter corresponding to the sample access amount.
Optionally, the sample visit amount and the sample temperature adjustment parameter corresponding to the sample visit amount may be obtained by the following steps:
the method comprises the following steps: in the pressure testing process of the data center, obtaining the testing access amount of the data center and obtaining the hardware temperature corresponding to the testing access amount;
step two: if the hardware temperature is detected to be stable in the test access amount, the hardware temperature is in a rising state, and the temperature adjusting parameter is changed to adjust the hardware temperature until the rising speed of the hardware temperature is zero;
step three: determining a corresponding temperature adjustment parameter when the rising speed is zero;
step four: and taking the test access amount as a sample access amount, and taking the corresponding temperature adjustment parameter when the rising speed is zero as a sample temperature adjustment parameter.
Specifically, a pressure test may be actively initiated on the data center, and the sample access amount and the sample temperature adjustment parameter corresponding to the sample access amount are obtained in the actively initiated pressure test process. The sample access amount and the sample temperature adjustment parameter corresponding to the sample access amount can be obtained in the process of a stress test initiated by a tester for testing the stability of the data center.
Whether the pressure test is actively initiated on the data center or the pressure test is initiated by a tester for testing the stability of the data center, the access amount of the data center is gradually increased, and a stable time is provided when the access amount is increased every time, so that the pressure test can be divided into different test stages according to different access amounts.
In the pressure test process, the test access amount of the data center corresponding to each test stage is obtained, and the hardware temperature corresponding to the test access amount of the test stage is obtained. If the data center is detected to be stable in the corresponding test access amount in the test stage, and the hardware temperature is in a rising state, the temperature adjusting parameter can be changed to adjust the hardware temperature, so that the hardware equipment of the data center server is cooled until the rising speed of the hardware temperature is zero, namely the hardware temperature does not rise any more, the test access amount can be used as the sample access amount, and the corresponding temperature adjusting parameter when the rising speed is zero is used as the sample temperature adjusting parameter.
Optionally, the sample visit amount and the sample temperature adjustment parameter corresponding to each test stage may be collected, so as to obtain a large number of training samples.
And S103, adjusting the temperature according to the temperature adjusting parameters.
And adjusting the temperature according to the temperature adjusting parameters. Optionally, the temperature adjustment parameter includes a refrigeration parameter. In this embodiment, temperature adjustment may be performed according to the refrigeration parameter.
For example, the temperature of the data center may be reduced by increasing the cooling capacity. The room temperature is reduced before the temperature of the server hardware of the data center is raised, so that the condition that the server hardware runs at high temperature due to sudden access amount rise is avoided, the service lives of the data center server and the hardware thereof are prolonged, and the reliability of the software service provided by the data center server is further ensured.
The method for adjusting the temperature comprises the steps of obtaining the current access amount of a data center, inputting the current access amount into a pre-constructed temperature adjustment model, obtaining temperature adjustment parameters output by the temperature adjustment model, and adjusting the temperature according to the temperature adjustment parameters.
Optionally, on the basis of the above embodiment, the hardware temperature corresponding to the test visit amount may be obtained through the following steps:
acquiring the real-time temperature of internal hardware of the data center sent by the data center as the hardware temperature; or calculating the hardware temperature according to the operating parameters of the data center.
In this embodiment, two ways of determining the hardware temperature are provided. One is to directly acquire the real-time temperature of the internal hardware of the data center, and the other is to acquire the operating parameters of the data center and then calculate the hardware temperature according to the operating parameters.
In a specific embodiment, if the data center server can detect the real-time temperature of the internal hardware, the real-time temperature of the internal hardware of the server sent by the data center server can be directly obtained as the hardware temperature. If the server of the data center cannot detect the real-time temperature of the internal hardware, the present embodiment may collect the operation parameters of the server, such as the CPU utilization rate and the operation frequency, the data throughput of the hard disk, and calculate the hardware temperature according to the operation parameters.
It should be noted that, if the manner of calculating the hardware temperature according to the operation parameters of the data center is adopted, the temperature may be calculated by referring to the official data of the specific hardware device, and the embodiment is not limited in this respect.
Optionally, on the basis of the above embodiment, the method may further include the following steps:
and updating the temperature adjustment model once every preset time period.
As the usage time of the data center server increases, the heat generated during the operation process of the data center server increases gradually. Therefore, the sample access amount and the sample temperature adjustment parameters can be acquired again at a certain time, and the temperature adjustment model is reconstructed, so that the temperature adjustment model can adapt to the service time of the data center server, and the condition of insufficient cooling strength is avoided.
For example, the temperature adjustment model is reconstructed once every half year or every year to achieve an update of the temperature adjustment model.
Based on a general inventive concept, the present invention further provides a temperature adjusting apparatus for implementing the above method embodiments.
Fig. 2 is a schematic structural diagram of an embodiment of the temperature adjustment apparatus according to the present invention.
As shown in fig. 2, the temperature adjusting apparatus of the present embodiment includes:
the acquisition module 11 is used for acquiring the current visit amount of the data center;
the input module 12 is configured to input the current access amount into a pre-constructed temperature adjustment model to obtain a temperature adjustment parameter output by the temperature adjustment model;
and the adjusting module 13 is configured to perform temperature adjustment according to temperature adjustment parameters, where the temperature adjustment parameters include refrigeration parameters.
According to the temperature adjusting device, the acquisition module 11 acquires the current access amount of the data center, the input module 12 inputs the current access amount into the pre-constructed temperature adjusting model to obtain the temperature adjusting parameter output by the temperature adjusting model, and the adjusting module 13 adjusts the temperature according to the temperature adjusting parameter.
Optionally, the temperature adjusting apparatus of this embodiment further includes a building module;
the construction module is used for acquiring the sample access amount and the sample temperature adjustment parameter corresponding to the sample access amount; and establishing a temperature adjustment model according to the sample access amount and the sample temperature adjustment parameter.
Optionally, the temperature adjusting apparatus of this embodiment includes a building module, which is specifically configured to obtain a test visit amount of the data center during a pressure test process of the data center, and obtain a hardware temperature corresponding to the test visit amount; if the hardware temperature is detected to be stable in the test access amount, the hardware temperature is in a rising state, and the temperature adjusting parameter is changed to adjust the hardware temperature until the rising speed of the hardware temperature is zero; determining a corresponding temperature adjustment parameter when the rising speed is zero; and taking the test access amount as a sample access amount, and taking the corresponding temperature adjustment parameter when the rising speed is zero as a sample temperature adjustment parameter.
Optionally, the temperature adjusting apparatus of this embodiment is configured to construct a module, and specifically configured to obtain a real-time internal hardware temperature of the data center, which is sent by the data center, as the hardware temperature; or calculating the hardware temperature according to the operating parameters of the data center.
Optionally, the temperature adjusting apparatus of this embodiment further includes an updating module;
and the updating module is used for updating the temperature adjusting model once every preset time period.
With regard to the apparatus in the above-described embodiment, the specific manner in which each module performs the operation has been described in detail in the embodiment related to the method, and will not be elaborated here.
Based on a general inventive concept, the present invention further provides a temperature adjustment apparatus for implementing the above method embodiments.
Fig. 3 is a schematic structural diagram provided by an embodiment of the temperature adjustment apparatus of the present invention.
As shown in fig. 3, the temperature adjustment device of the present embodiment includes a processor 21 and a memory 22, and the processor 21 is connected to the memory 22.
The processor 21 is used to call and execute the program stored in the memory 22. The memory 22 is used to store a program, and the program stored in the memory 22 is used at least to execute the temperature adjustment method in the above embodiment.
The temperature adjusting device of the embodiment can monitor the access amount of the data center, adjust the temperature of the data center according to the access amount, and start to reduce the room temperature before the temperature of the server hardware of the data center is raised, so that the condition that the server hardware runs at a high temperature due to sudden access amount rise is avoided, the service lives of the data center server and the server hardware are prolonged, and the reliability of software services provided by the data center server is ensured.
Based on one general inventive concept, the present invention also provides an air conditioning system including the temperature adjusting apparatus of any one of the above embodiments.
Optionally, the air conditioning system of this embodiment may be applied to a computer room of a data center, so as to avoid a situation that a sudden access amount increases to cause high-temperature operation of server hardware, and prolong service lives of the data center server and the hardware thereof.
Based on one general inventive concept, the present invention also provides a storage medium storing a program, which when executed by a processor, implements the steps of the temperature adjustment method of any one of the above embodiments.
It is understood that the same or similar parts in the above embodiments may be mutually referred to, and the same or similar parts in other embodiments may be referred to for the content which is not described in detail in some embodiments.
It should be noted that the terms "first," "second," and the like in the description of the present invention are used for descriptive purposes only and are not to be construed as indicating or implying relative importance. Further, in the description of the present invention, the meaning of "a plurality" means at least two unless otherwise specified.
Any process or method descriptions in flow charts or otherwise described herein may be understood as representing modules, segments, or portions of code which include one or more executable instructions for implementing specific logical functions or steps of the process, and alternate implementations are included within the scope of the preferred embodiment of the present invention in which functions may be executed out of order from that shown or discussed, including substantially concurrently or in reverse order, depending on the functionality involved, as would be understood by those reasonably skilled in the art of the present invention.
It should be understood that portions of the present invention may be implemented in hardware, software, firmware, or a combination thereof. In the above embodiments, the various steps or methods may be implemented in software or firmware stored in memory and executed by a suitable instruction execution system. For example, if implemented in hardware, as in another embodiment, any one or combination of the following techniques, which are known in the art, may be used: a discrete logic circuit having a logic gate circuit for implementing a logic function on a data signal, an application specific integrated circuit having an appropriate combinational logic gate circuit, a Programmable Gate Array (PGA), a Field Programmable Gate Array (FPGA), or the like.
It will be understood by those skilled in the art that all or part of the steps carried by the method for implementing the above embodiments may be implemented by hardware related to instructions of a program, which may be stored in a computer readable storage medium, and when the program is executed, the program includes one or a combination of the steps of the method embodiments.
In addition, functional units in the embodiments of the present invention may be integrated into one processing module, or each unit may exist alone physically, or two or more units are integrated into one module. The integrated module can be realized in a hardware mode, and can also be realized in a software functional module mode. The integrated module, if implemented in the form of a software functional module and sold or used as a stand-alone product, may also be stored in a computer readable storage medium.
The storage medium mentioned above may be a read-only memory, a magnetic or optical disk, etc.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Although embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and should not be construed as limiting the present invention, and that variations, modifications, substitutions and alterations can be made to the above embodiments by those of ordinary skill in the art within the scope of the present invention.
Claims (9)
1. A method for adjusting temperature, comprising:
acquiring the current visit volume of the data center;
inputting the current access quantity into a pre-constructed temperature adjustment model to obtain a temperature adjustment parameter output by the temperature adjustment model;
adjusting the temperature according to the temperature adjusting parameters;
the construction method of the temperature adjustment model comprises the following steps:
obtaining a sample access amount and a sample temperature adjustment parameter corresponding to the sample access amount;
establishing the temperature adjustment model according to the sample access amount and the sample temperature adjustment parameter;
the obtaining of the sample access amount and the sample temperature adjustment parameter corresponding to the sample access amount include:
in the pressure testing process of the data center, obtaining the testing access amount of the data center and obtaining the hardware temperature corresponding to the testing access amount;
if the hardware temperature is detected to be stable in the test access amount, the hardware temperature is in a rising state, and the temperature adjusting parameter is changed to adjust the hardware temperature until the rising speed of the hardware temperature is zero;
determining a corresponding temperature adjustment parameter when the rising speed is zero;
and taking the test visit amount as the sample visit amount, and taking the corresponding temperature adjustment parameter when the rising speed is zero as the sample temperature adjustment parameter.
2. The method according to claim 1, wherein the obtaining the hardware temperature corresponding to the test access amount includes:
acquiring the real-time temperature of internal hardware of the data center sent by the data center as the hardware temperature; or
And calculating the hardware temperature according to the operating parameters of the data center.
3. The method of claim 1, wherein the temperature adjustment parameter comprises a refrigeration parameter.
4. The method according to claim 1, wherein the temperature adjustment model is updated every predetermined period of time.
5. A temperature adjustment device, comprising:
the acquisition module is used for acquiring the current visit amount of the data center;
the input module is used for inputting the current access amount into a pre-constructed temperature adjustment model to obtain a temperature adjustment parameter output by the temperature adjustment model;
the adjusting module is used for adjusting the temperature according to the temperature adjusting parameters;
the device comprises a construction module, a temperature adjustment module and a temperature adjustment module, wherein the construction module is used for acquiring sample access amount and sample temperature adjustment parameters corresponding to the sample access amount; establishing the temperature adjustment model according to the sample access amount and the sample temperature adjustment parameter;
the building module is specifically used for acquiring the test visit volume of the data center and acquiring the hardware temperature corresponding to the test visit volume in the pressure test process of the data center; if the hardware temperature is detected to be stable in the test access amount, the hardware temperature is in a rising state, and the temperature adjusting parameter is changed to adjust the hardware temperature until the rising speed of the hardware temperature is zero; determining a corresponding temperature adjustment parameter when the rising speed is zero; and taking the test visit amount as the sample visit amount, and taking the corresponding temperature adjustment parameter when the rising speed is zero as the sample temperature adjustment parameter.
6. The temperature adjusting apparatus according to claim 5, wherein the building module is configured to obtain a real-time internal hardware temperature of the data center sent by the data center as the hardware temperature; or calculating the hardware temperature according to the operation parameters of the data center.
7. A temperature adjustment device, comprising a processor and a memory, the processor being connected to the memory:
the processor is used for calling and executing the program stored in the memory;
the memory is used for storing the program, and the program is at least used for executing the temperature adjusting method of any one of claims 1-4.
8. An air conditioning system characterized by comprising the temperature adjustment device of claim 7.
9. A storage medium, characterized in that the storage medium stores a program which, when executed by a processor, implements the steps of the temperature adjustment method according to any one of claims 1 to 4.
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