CN112582786B - Manufacturing method of antenna oscillator module, antenna oscillator module and base station antenna - Google Patents
Manufacturing method of antenna oscillator module, antenna oscillator module and base station antenna Download PDFInfo
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- CN112582786B CN112582786B CN201910947244.3A CN201910947244A CN112582786B CN 112582786 B CN112582786 B CN 112582786B CN 201910947244 A CN201910947244 A CN 201910947244A CN 112582786 B CN112582786 B CN 112582786B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 27
- 239000002184 metal Substances 0.000 claims abstract description 106
- 229910052751 metal Inorganic materials 0.000 claims abstract description 106
- 238000000034 method Methods 0.000 claims abstract description 27
- 238000010329 laser etching Methods 0.000 claims abstract description 24
- 238000001746 injection moulding Methods 0.000 claims abstract description 12
- 238000007747 plating Methods 0.000 claims description 20
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 12
- 239000010949 copper Substances 0.000 claims description 12
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical group [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 6
- 238000007788 roughening Methods 0.000 claims description 6
- 238000003754 machining Methods 0.000 claims description 5
- 229920006351 engineering plastic Polymers 0.000 claims description 4
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical group [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 3
- 229910052759 nickel Inorganic materials 0.000 claims description 3
- 238000012545 processing Methods 0.000 claims description 3
- 230000008569 process Effects 0.000 abstract description 12
- 238000009713 electroplating Methods 0.000 description 18
- 238000004891 communication Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000005488 sandblasting Methods 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 229920000106 Liquid crystal polymer Polymers 0.000 description 2
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- 239000000571 coke Substances 0.000 description 2
- 238000013461 design Methods 0.000 description 2
- 238000007772 electroless plating Methods 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 238000002347 injection Methods 0.000 description 2
- 239000007924 injection Substances 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 239000000243 solution Substances 0.000 description 2
- 239000003929 acidic solution Substances 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 238000010147 laser engraving Methods 0.000 description 1
- 238000010295 mobile communication Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000004506 ultrasonic cleaning Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/36—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith
- H01Q1/38—Structural form of radiating elements, e.g. cone, spiral, umbrella; Particular materials used therewith formed by a conductive layer on an insulating support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01Q—ANTENNAS, i.e. RADIO AERIALS
- H01Q1/00—Details of, or arrangements associated with, antennas
- H01Q1/50—Structural association of antennas with earthing switches, lead-in devices or lightning protectors
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02D—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN INFORMATION AND COMMUNICATION TECHNOLOGIES [ICT], I.E. INFORMATION AND COMMUNICATION TECHNOLOGIES AIMING AT THE REDUCTION OF THEIR OWN ENERGY USE
- Y02D30/00—Reducing energy consumption in communication networks
- Y02D30/70—Reducing energy consumption in communication networks in wireless communication networks
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- Details Of Aerials (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
A manufacturing method of an antenna element module, an antenna element module and a base station antenna. The manufacturing method comprises the following steps: an integrated antenna oscillator module body comprising an oscillator body and a feed network circuit board body is manufactured through integral injection molding; forming a first metal layer on the surface of the antenna element module body; carrying out laser etching treatment on the first metal layer, removing the first metal layer on the laser etching circuit to form a boundary line, and separating a circuit pattern area from a non-circuit pattern area, wherein the circuit pattern area comprises circuit patterns of all oscillator circuits and circuit patterns of all feed network circuits, and the oscillator circuits and the feed network circuits are directly connected through the laser etching treatment; forming a second metal layer on the surface of the first metal layer in the line pattern region; removing the first metal layer of the non-circuit pattern region; a third metal layer is formed on the surface of the second metal layer. The method can avoid complex assembly process of the antenna element and the feed network circuit board.
Description
Technical Field
The invention belongs to the technical field of communication, and particularly relates to a manufacturing method of an antenna element module, the antenna element module and a base station antenna.
Background
With the rapid development of communication technology, there is an increasing demand for wireless communication. The base station antenna is an important component of the mobile communication system, the structural design, material selection, manufacturing method and assembly process of the antenna are related to the reliability of the antenna performance and the durability of the antenna, and along with the progress of communication technology, the requirements on the base station antenna are also higher and higher.
The vibrator and the feed network circuit board of the base station antenna are two types of parts which are respectively used for signal transmission in the base station antenna and feed network signal transmission. In the prior art, the vibrators and the feed network are generally connected through welding and other processes, so that the assembly process is multiple, the tool design difficulty is high, the integration degree is low, and the performance of the antenna is restricted. Particularly, when the 5G base station antenna is a large-scale array antenna, the communication system has higher requirements on the size miniaturization, the light weight and the precision of the array antenna. The existing base station antenna mostly adopts integrated circuit element antennas, the existing integrated circuit element antennas are complex to assemble and produce, the assembled precision is not high, and the feed welding points are as many as more than ten, so that the consistency among antenna element units is poor. Therefore, the solution of welding and assembling the vibrator and the feed network circuit board cannot meet the precision requirement and the efficiency requirement of the communication equipment.
Disclosure of Invention
In order to solve the above technical problems, an embodiment of the present invention provides an antenna element module, a manufacturing method thereof, and a base station antenna.
According to a first aspect of the present invention, an embodiment of the present invention provides a method for manufacturing an antenna element module.
<1> a method for manufacturing an antenna element module, comprising the steps of:
s10, an integrated antenna oscillator module body comprising an oscillator body and a feed network circuit board body is manufactured through integral injection molding;
s30, forming a first metal layer on the surface of the antenna element module body;
s40, carrying out laser etching treatment on the first metal layer, removing the first metal layer on the laser etching circuit, and forming a dividing line to separate a circuit pattern area and a non-circuit pattern area, wherein the circuit pattern area comprises circuit patterns of all oscillator circuits and circuit patterns of all feed network circuits, and the oscillator circuits and the feed network circuits are directly connected through the laser etching treatment;
s50, forming a second metal layer on the surface of the first metal layer of the circuit pattern area;
s60, removing the first metal layer of the non-circuit pattern area;
and S70, forming a third metal layer on the surface of the second metal layer.
<2> the method of manufacturing as described in <1>, in step S40, when a line pattern region where the hanging point plating cannot be performed is present, the line pattern region where the hanging point plating cannot be performed and other line pattern regions where the hanging point plating can be performed are kept connected by connecting lines to form an entire region when the laser etching process is performed; and, in addition, the processing unit,
after step S70, step S80 is further included to remove the first metal layer, the second metal layer and the third metal layer on the non-line pattern area in the whole area.
<3> the method for manufacturing as described in <2>, removing the first metal layer, the second metal layer and the third metal layer on the non-wiring pattern region in the whole region by means of machining.
<4> the method for manufacturing a semiconductor device according to <2>, wherein the width of the connecting line is 0.5mm or more.
<5> the method according to <1>, further comprising, before step 30, step 20 of roughening the surface of the antenna element module body.
<6> the production method according to <1>, wherein the first metal layer is a nickel layer or a copper layer; the second metal layer is a copper layer; the third metal layer is a tin layer.
<7> the method of manufacturing as described in <1>, wherein the antenna element module body is made of a high temperature resistant engineering plastic having a dielectric loss of not more than 0.005 at 1 GHz.
According to a second aspect of the present invention, an embodiment of the present invention provides an antenna element module.
<8> an antenna element module, comprising:
the integrated antenna module body is manufactured by integral injection molding and comprises a vibrator body and a feed network circuit board body; the method comprises the steps of,
and the oscillator circuit and the feed network circuit are integrally formed on the antenna module body and electrically connected.
<9> the antenna element module according to <8>, which is manufactured according to the antenna element module manufacturing method according to one of <1> <7 >.
According to a third aspect of the present invention, an embodiment of the present invention provides a base station antenna
<10> a base station antenna comprising the antenna element module manufactured by the method of one of <1> to <7>, or comprising the antenna element module of <8> or <9 >.
The embodiment of the invention has the beneficial effects that: according to the manufacturing method of the antenna oscillator module, the oscillator body and the feed network circuit board body are integrally formed into a whole through injection molding, and then the antenna oscillator module with the integrated structure of the oscillator and the feed network circuit board is manufactured through processes of chemical plating, laser carving, electroplating and the like, so that the antenna oscillator module has the characteristics of no welding, stable performance, high precision, light weight, miniaturization, low cost and the like, and can meet the performance requirements of a 5G communication base station.
Drawings
Fig. 1 is a schematic diagram of an antenna element module including a connection circuit according to an embodiment of the present invention.
Fig. 2 is a schematic diagram of an antenna element module according to an embodiment of the present invention.
Fig. 3 is a schematic diagram of a vibrator with a connection circuit according to an embodiment of the present invention.
Fig. 4 is a schematic diagram of a vibrator according to an embodiment of the present invention.
Detailed Description
The present invention will be further described in detail below with reference to specific embodiments and with reference to the accompanying drawings, in order to make the objects, technical solutions and advantages of the present invention more apparent. Those skilled in the art will recognize that the present invention is not limited to the drawings and the following examples.
Referring to fig. 1-4, an embodiment of the present invention provides a method for manufacturing an antenna element module, including the following steps:
s10, an integrated antenna oscillator module body comprising an oscillator body 10 and a feed network circuit board body 20 is manufactured through integral injection molding;
s30, forming a first metal layer on the surface of the antenna element module body;
s40, carrying out laser etching treatment on the first metal layer, removing the first metal layer on the laser etching circuit, and forming a dividing line to separate a circuit pattern area and a non-circuit pattern area, wherein the circuit pattern area comprises circuit patterns of all oscillator circuits 11 and circuit patterns of all feed network circuits 21, and the oscillator circuits 11 and the feed network circuits 21 are directly connected through the laser etching treatment;
s50, forming a second metal layer on the surface of the first metal layer of the circuit pattern area;
s60, removing the first metal layer of the non-circuit pattern area;
and S70, forming a third metal layer on the surface of the second metal layer.
Further, in step S40, when there is a line pattern region in which the hanging point plating cannot be performed, in performing the laser etching process, the line pattern region in which the hanging point plating cannot be performed and the line pattern region in which the hanging point plating can be performed are kept connected to each other by the connection line 31 to form an entire region, and the entire region is used as the line pattern region for performing the subsequent step S50; and, after step S70, step S80 is further included to remove the first metal layer, the second metal layer and the third metal layer on the non-line pattern region in the whole region.
Preferably, step 20 is further included before step 30, and roughening treatment is performed on the surface of the antenna element module body.
The method for manufacturing the antenna element module according to the embodiment of the present invention is described in further detail below.
S10, an integrated antenna oscillator module body comprising the oscillator body 10 and the feed network circuit board body 20 is manufactured through integrated injection molding.
Specifically, according to the preset structure and size of the vibrator body 10 and the feed network circuit board body 20, the vibrator body 10 and the feed network circuit board body 20 are integrally injection molded by using high temperature resistant engineering plastics through an injection mold and injection molding equipment.
The high temperature resistant engineering plastic has small dielectric loss, is not higher than 0.005 at 1GHz, and has a thermal expansion coefficient close to that of a metal plating layer, such as glass fiber reinforced polyphenylene sulfide (PPS+40% GF is preferable), liquid Crystal Polymer (LCP), polyetherimide (PEI+45% GF is preferable) and the like.
After the integrated antenna oscillator module body is manufactured through injection molding, the antenna oscillator module body can be annealed to release the internal stress of the antenna oscillator module body.
S20, roughening the surface of the antenna element module body.
And (3) carrying out mechanical roughening treatment on the surface of the antenna oscillator module body, for example, obtaining proper roughness through sand blasting treatment, and removing residual sand blasting materials on the surface of the body through ultrasonic cleaning after the sand blasting treatment. The surface of the antenna element module body may be chemically roughened, for example, by an acidic solution. The roughening treatment aims to ensure the adhesive force of the subsequent metal layer and avoid the phenomena of coating falling off, foaming and the like.
S30, forming a first metal layer on the surface of the antenna element module body.
For example, a first metal layer is deposited on the body surface using an electroless plating process. Before the electroless plating treatment, the antenna element module body can be further subjected to pretreatment steps such as activation, and the pretreatment steps are all in the prior art.
Preferably, the thickness of the first metal layer is 1 μm or less, preferably 0.5 μm to 1 μm.
Preferably, the first metal layer is a nickel layer, or the first metal layer is a copper layer.
S40, carrying out laser etching treatment on the first metal layer, removing the first metal layer on the laser etching circuit, and forming a dividing line to separate a circuit pattern area and a non-circuit pattern area, wherein the circuit pattern area comprises circuit patterns of all oscillator circuits 11 and circuit patterns of all feed network circuits 21, and the oscillator circuits 11 and the feed network circuits 21 are directly connected through the laser etching treatment. When a circuit pattern area incapable of being subjected to hanging point electroplating exists, the circuit pattern area incapable of being subjected to hanging point electroplating and other circuit pattern areas capable of being subjected to hanging point electroplating are kept connected through a connecting circuit 31 to form an integral area, so that the integral area comprises at least one part of a non-circuit pattern area, namely a connecting circuit area between the circuit pattern area incapable of being subjected to hanging point electroplating and the circuit pattern capable of being subjected to hanging point electroplating, and the circuit pattern area and the non-circuit pattern area in the integral area are not completely separated during the laser etching treatment; the width of the connection line 31 is 0.5mm or more.
Specifically, firstly, designing laser engraving line patterns according to preset line patterns comprising all oscillator lines 11 and all feed network lines 21; and then carrying out laser etching treatment on the first metal layer by adopting 3D laser etching equipment according to a preset laser etching circuit pattern, and ablating the first metal layer on the laser etching circuit through laser irradiation to form a dividing line.
The dividing line is used to separate a line pattern region including all the vibrator lines 11 and all the feed network lines 21 and a non-line pattern region having no vibrator lines 11 and feed network lines 21 to block a conductive path between the line pattern region and the non-line pattern region. The width of the dividing line is, for example, greater than or equal to 0.3mm, i.e., the conductive path between the two regions is blocked. It is clear that when the connection line 31 is provided, at this step, there is no said dividing line in said whole area.
And S50, forming a second metal layer on the surface of the first metal layer of the circuit pattern area.
Specifically, a second metal layer is formed on the first metal layer in the circuit pattern area by electroplating through an electroplating process. And electrifying the circuit pattern area to ensure that the circuit pattern area is positively or negatively charged, and electroplating to form a second metal layer on the circuit pattern area. Since the non-line pattern region is blocked by the decomposed line, the second metal layer cannot be formed on the non-line pattern region by electroplating, so that the second metal layer is formed on the line pattern region by electroplating selectively. Obviously, when there is a circuit pattern area where the hanging point electroplating cannot be implemented, the first metal layer on the whole area is electroplated to form the second metal layer, that is, the first metal layer on at least a part of the non-circuit pattern area (connecting circuit area) in the whole area is also electroplated to form the second metal layer.
Preferably, the thickness of the second metal layer is 9 μm or more.
Preferably, the second metal layer is a copper layer. For example, pre-copper plating, bright copper plating and coke copper plating are sequentially performed on the circuit pattern region to form a second metal layer including a pre-copper plating layer, a bright copper plating layer and a coke copper plating layer.
S60, removing the first metal layer of the non-circuit pattern area.
Specifically, the antenna element module body with the first metal layer and the second metal layer in the circuit pattern area is processed by adopting a deplating process, and the first metal layer in the non-circuit pattern area is removed. For example, the whole antenna element module body is subjected to deplating treatment, and after the first metal layer is deplated and removed, the second metal layer is correspondingly deplated and removed to be approximately the same thickness, but the thickness of the first metal layer is far smaller than that of the second metal layer, so that the second metal layer is not influenced to play a function. Obviously, when there is a line pattern area where the hanging point plating cannot be performed, this step does not remove the first metal layer of the non-line pattern area (connection line area) in the entire area.
And S70, forming a third metal layer on the surface of the second metal layer.
Specifically, a third metal layer is formed on the second metal layer in the circuit pattern area by electroplating through an electroplating process. And electrifying the circuit pattern area, and electroplating to form a third metal layer on the circuit pattern area. Obviously, when there is a circuit pattern area where the hanging point electroplating cannot be implemented, in this step, the third metal layer is also electroplated on the second metal layer of the non-circuit pattern area inside the whole area.
Preferably, the third metal layer is 8 μm or more.
Preferably, the third metal layer is a tin layer.
And S80, removing the first metal layer, the second metal layer and the third metal layer on the non-circuit pattern area in the whole area.
Specifically, the first metal layer, the second metal layer and the third metal layer on the non-line pattern area in the whole area may be removed by a machining method, such as CNC (computer numerical control precision machining) machining, so as to remove the connection line 31, thereby separating the line pattern areas connected by the connection line 31.
According to the embodiment of the invention, through the steps, the first metal layer, the second metal layer and the third metal layer are sequentially overlapped on the surface of the antenna oscillator module body through the processing of chemical plating, laser etching and electroplating in the circuit pattern area, so that the circuit patterns of all oscillator circuits 11 and the circuit patterns of all feed network circuits 21 are integrated.
According to the manufacturing method of the antenna oscillator module, the oscillator circuit 11 and the feed network circuit 21 are selectively formed integrally in the circuit pattern area on the antenna oscillator module body formed through integral injection molding, chemical plating, laser etching and electroplating, so that complex assembly processes of the antenna oscillator and the feed network circuit board are avoided, the production efficiency is high, the cost is low, the weight is light, and the reliability and the stability of the antenna performance of the base station and the durability of the antenna are improved.
According to a second aspect of the present invention, an embodiment of the present invention further provides an antenna element module, including:
the integrated antenna module body which is manufactured by integral injection molding and comprises a vibrator body 10 and a feed network circuit board body 20; the method comprises the steps of,
an antenna element line 11 and a feed network line 21 are integrally formed on the antenna module body and electrically connected.
Further, the antenna element module is manufactured according to the manufacturing method of the antenna element module.
According to a third aspect of the present invention, an embodiment of the present invention further provides a base station antenna, where the base station antenna includes any one of the antenna element modules described above.
The embodiments of the present invention have been described above. However, the present invention is not limited to the above embodiment. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (8)
1. The manufacturing method of the antenna element module is characterized by comprising the following steps:
s10, an integrated antenna oscillator module body comprising an oscillator body and a feed network circuit board body is manufactured through integral injection molding;
s30, forming a first metal layer on the surface of the antenna element module body;
s40, carrying out laser etching treatment on the first metal layer, removing the first metal layer on the laser etching circuit, and forming a dividing line to separate a circuit pattern area and a non-circuit pattern area, wherein the circuit pattern area comprises circuit patterns of all oscillator circuits and circuit patterns of all feed network circuits, and the oscillator circuits and the feed network circuits are directly connected through the laser etching treatment;
s50, forming a second metal layer on the surface of the first metal layer of the circuit pattern area;
s60, removing the first metal layer of the non-circuit pattern area;
s70, forming a third metal layer on the surface of the second metal layer;
in step S40, when there is a line pattern area where the hanging point plating cannot be performed, the line pattern area where the hanging point plating cannot be performed and other line pattern areas where the hanging point plating can be performed are kept connected by connecting lines to form an integral area; and, in addition, the processing unit,
after step S70, step S80 is further included to remove the first metal layer, the second metal layer and the third metal layer on the non-line pattern area in the whole area.
2. The method of manufacturing according to claim 1, wherein the first metal layer, the second metal layer, and the third metal layer on the non-wiring pattern region in the overall region are removed by machining.
3. The method of manufacturing according to claim 1, wherein the width of the connection line is 0.5mm or more.
4. The method of claim 1, further comprising a step S20 of roughening the surface of the antenna element module body before the step S30.
5. The method of manufacturing of claim 1, wherein the first metal layer is a nickel layer or a copper layer; the second metal layer is a copper layer; the third metal layer is a tin layer.
6. The manufacturing method of claim 1, wherein the antenna element module body is made of a high temperature resistant engineering plastic having a dielectric loss of not more than 0.005 at 1 GHz.
7. An antenna element module, comprising:
the integrated antenna oscillator module body is manufactured by integral injection molding and comprises an oscillator body and a feed network circuit board body; the method comprises the steps of,
an electrically connected oscillator circuit and a feed network circuit are integrally formed on the antenna oscillator module body; the antenna element module is manufactured according to the method of manufacturing an antenna element module according to one of claims 1-6.
8. A base station antenna, characterized in that it comprises an antenna element module manufactured by the method according to one of claims 1-6, or in that it comprises an antenna element module according to claim 7.
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| CN201910947244.3A CN112582786B (en) | 2019-09-30 | 2019-09-30 | Manufacturing method of antenna oscillator module, antenna oscillator module and base station antenna |
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| CN201910947244.3A CN112582786B (en) | 2019-09-30 | 2019-09-30 | Manufacturing method of antenna oscillator module, antenna oscillator module and base station antenna |
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| CN112582786B true CN112582786B (en) | 2023-08-25 |
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| CN109640539A (en) * | 2019-01-03 | 2019-04-16 | 深圳市飞荣达科技股份有限公司 | Oscillator and its manufacturing method |
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