CN112577971B - Detection method, system and equipment - Google Patents
Detection method, system and equipment Download PDFInfo
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- CN112577971B CN112577971B CN201910945756.6A CN201910945756A CN112577971B CN 112577971 B CN112577971 B CN 112577971B CN 201910945756 A CN201910945756 A CN 201910945756A CN 112577971 B CN112577971 B CN 112577971B
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- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
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Abstract
The detection method comprises the following steps: acquiring a first defect set to be rechecked, which is included in the object to be detected; screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the movement direction of the object to be tested to obtain a second defect set; and sorting the second defect sets according to the movement direction of the object to be detected, and rechecking the sorted defect sets by a rechecking probe so as to effectively improve the defect detection efficiency.
Description
Technical Field
The application belongs to the field of display screen detection, and particularly relates to a detection method, a detection system and detection equipment.
Background
Along with the wide use of intelligent devices, the demand for display screens is also increasing, and especially the quantity and quality of OLED demands are both higher and higher, and defect detection needs to be carried out on an OLED panel in the production process, so that the quality of the products is ensured. How to improve the detection speed and detection accuracy of OLED panels is the main research direction today.
At present, the detection step of an OLED panel is generally to carry out scanning full detection on the surface of an OLED substrate; the defects obtained by the full inspection are screened to obtain the defects to be re-inspected, and the defects to be re-inspected can be effectively re-inspected according to the detection paths of the defects to be re-inspected, but the calculation is complicated when the paths of the defects to be re-inspected are required to be determined through the re-inspection probe, so that the detection efficiency is not improved.
Disclosure of Invention
In view of the above, the embodiments of the present application provide a detection method, system and device, so as to solve the problem of low detection efficiency in the prior art.
A first aspect of an embodiment of the present application provides a detection method, and a detection apparatus for implementing the detection method includes a motion stage for carrying and moving an object to be detected, and a review probe for conducting review of the object to be detected, where the detection method includes:
acquiring a first defect set to be rechecked, which is included in the object to be detected;
Screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the movement direction of the object to be tested to obtain a second defect set;
And sorting the second defect set according to the movement direction of the object to be detected, and rechecking the sorted defect set by a rechecking probe.
With reference to the first aspect, in a first possible implementation manner of the first aspect, the detecting device includes a total detection module for performing a primary detection on an object to be detected, and the step of obtaining a first defect set to be rechecked included in the object to be detected includes:
Acquiring a third defect set determined by the full detection module;
sorting defects in the third defect set according to the defect values;
and screening out a first preset number of defects with larger defect values according to the ordered defects to generate the first defect set.
With reference to the first aspect, in a second possible implementation manner of the first aspect, the detection device includes a total detection module for performing initial detection on the object to be detected, where the first defect set is generated by defects acquired by the total detection module before a current recheck round in multiple rechecks;
or when the full inspection and the re-inspection are performed simultaneously, generating the first defect set by the defects acquired by the full inspection module before the current re-inspection round in the multi-round re-inspection, and adding the defects acquired by the full inspection in the screening process of the round in the first defect set.
With reference to the first aspect, in a third possible implementation manner of the first aspect, the step of performing a screening process on the first defect set according to a position of the first defect set, a position of a recheck probe, and a movement direction of the object to be tested, and obtaining a second defect set includes:
Acquiring a defect positioned on a first side of the rechecking probe according to the movement direction of the object to be detected, wherein the first side is the movement direction side of the rechecking probe;
A second defect set is determined from the acquired defects.
With reference to the third possible implementation manner of the first aspect, in a fourth possible implementation manner of the first aspect, determining that the first movement direction of the object to be detected is the positive direction of the X coordinate axis, and the second movement direction is the negative direction of the X coordinate axis, according to the movement direction of the object to be detected, acquiring a defect that a position is located on a first side of the recheck probe, where the first side is the movement direction side of the recheck probe includes:
when the motion direction is the first motion direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the recheck probe;
And when the movement direction is the second movement direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the recheck probe.
With reference to the third possible implementation manner of the first aspect, in a fifth possible implementation manner of the first aspect, the detection device includes a total detection module for performing primary detection on an object to be detected, the second detection probe includes a first second detection probe and a second detection probe, and the first second detection probe and the second detection probe are respectively distributed on two sides of the total detection module, and the method further includes:
determining a first re-detection area according to the detection range of the first re-detection probe, and determining a second re-detection area according to the detection range of the second re-detection probe;
And determining an overlapping area according to the first rechecking area and the second rechecking area, and distributing the defects of the overlapping area to a first rechecking probe or a second rechecking probe according to a preset distribution rule.
With reference to the fifth possible implementation manner of the first aspect, in a sixth possible implementation manner of the first aspect, the step of assigning the defect of the overlapping area to the first review probe or the second review probe according to a preset assignment rule includes:
And distributing the defects in the overlapping area to the first and second re-inspection probes according to the preset number detected by the first and second re-inspection probes in the re-inspection in combination with the number of re-inspection defects determined in the non-overlapping area.
With reference to the fifth possible implementation manner of the first aspect, in a seventh possible implementation manner of the first aspect, the total detection module disposed in the middle detects an entire area of the object to be detected when the object to be detected performs the reciprocating motion.
With reference to the first aspect, in an eighth possible implementation manner of the first aspect, the step of performing a screening process on the first defect set according to a position of the first defect set, a position of a recheck probe, and a movement direction of the object to be tested, and obtaining a second defect set includes:
and screening the defects in the second defect set according to the distance between the defects in the second defect set.
With reference to the eighth possible implementation manner of the first aspect, in a ninth possible implementation manner of the first aspect, determining that a first movement direction of the object to be measured is an X coordinate axis positive direction and a second movement direction is an X coordinate axis negative direction, and the step of screening the defects in the second defect set according to a distance between the defects in the second defect set includes:
According to the ordering of the second defect set, an ith defect in the second defect set is obtained, i is a sequence ordered in the second defect set, and i is greater than or equal to 2;
If the current positions of the ith defect and the recheck probe belong to different units to be detected which are divided in advance, acquiring the theoretical Y-axis speed from the current position of the recheck probe to the ith defect according to the movement speed of the movement table;
If the theoretical Y-axis speed is greater than the current Y-axis speed of the rechecking probe, screening out the ith defect;
If the theoretical Y-axis speed is smaller than or equal to the current Y-axis speed of the rechecking probe, controlling the rechecking probe to move to the ith defect position according to the current Y-axis speed;
And repeating the steps to screen the (i+1) th defect until the defects in the second defect set are screened.
With reference to the first aspect, in a tenth possible implementation manner of the first aspect, a movement direction of the object to be measured is different from a movement direction of the review probe and is independent from the movement direction of the review probe.
With reference to the first aspect, in an eleventh possible implementation manner of the first aspect, the step of rechecking, by a rechecking probe, the sorted defect set includes:
And rechecking the defects in the second defect set according to the preset rechecking number corresponding to the current rechecking in the repeated rechecks.
A second aspect of the embodiment of the present application provides a detection system, a detection apparatus implementing the detection method includes a motion stage for carrying and moving an object to be detected, and a review probe for conducting review of the object to be detected, the detection system includes:
The first defect set acquisition unit is used for acquiring a first defect set to be rechecked, which is included in the object to be detected;
the second defect set acquisition unit is used for screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the movement direction of the object to be tested to acquire a second defect set;
and the rechecking unit is used for sequencing the second defect set according to the movement direction of the object to be tested, and rechecking the sequenced defect set through a rechecking probe.
A third aspect of an embodiment of the present application provides a detection device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that the processor implements the steps of the detection method according to any one of the first aspects when executing the computer program.
A fourth aspect of an embodiment of the present application provides a computer-readable storage medium storing a computer program which, when executed by a processor, implements the steps of the detection method according to any one of the first aspects.
Compared with the prior art, the embodiment of the application has the beneficial effects that: the first defect set to be rechecked is obtained, the second defect set corresponding to the rechecked probe is obtained according to the position of the first defect set, the position of the rechecked probe and the movement direction of the object to be tested, the second defect set is ordered according to the movement direction of the object to be tested, and rechecked is carried out on the ordered defect set by the rechecked probe, so that the path planning of the defect to be rechecked is simpler, and the defect detection efficiency is improved.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are needed in the embodiments or the description of the prior art will be briefly described below, it being obvious that the drawings in the following description are only some embodiments of the present application, and that other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic diagram of a detection system according to an embodiment of the present application;
FIG. 2 is a schematic diagram of an implementation flow of a defect detection method according to an embodiment of the present application;
FIG. 3 is a schematic flow chart of an implementation of a method for screening and updating the first defect set according to an embodiment of the present application;
FIG. 4 is a schematic flow chart of an implementation of a method for screening defects in a second defect set according to an embodiment of the present application;
FIG. 5 is a schematic diagram of a detection system according to an embodiment of the present application;
fig. 6 is a schematic diagram of a detection apparatus according to an embodiment of the present application.
Detailed Description
In the following description, for purposes of explanation and not limitation, specific details are set forth such as the particular system architecture, techniques, etc., in order to provide a thorough understanding of the embodiments of the present application. It will be apparent, however, to one skilled in the art that the present application may be practiced in other embodiments that depart from these specific details. In other instances, detailed descriptions of well-known systems, devices, circuits, and methods are omitted so as not to obscure the description of the present application with unnecessary detail.
In order to illustrate the technical scheme of the application, the following description is made by specific examples.
Fig. 1 is a schematic top view of an apparatus for implementing the defect detection method according to an embodiment of the present application, as shown in fig. 1, the detection apparatus includes a moving table 1, on which an object to be detected can be carried and moved, a total detection module 2 with a total detection probe 21 and a recheck module 3 with a recheck probe 31 are disposed above the moving table (in fig. 1, a first recheck module and a second recheck module are disposed on two sides of the total detection module, respectively).
Assuming that the movement direction of the object to be measured is the X-axis direction, the object to be measured can alternately move along the first movement direction and the second movement direction of the X-axis direction. The direction perpendicular to the X-axis direction can be determined to be the Y-axis direction on the plane of the object to be measured. The review module 3 is provided with one review probe (1 in the drawing, or a plurality of review probes in practice) that can move along the Y-axis direction. The total detection probes comprise a plurality of probes and are uniformly distributed on the total detection shaft. The full detection device and the rechecking device can be performed simultaneously, namely, the rechecking device can perform rechecking analysis on the defects detected by the full detection device.
The motion platform comprises a first end and a second end, and when the object to be detected moves in a reciprocating mode, namely, the object to be detected moves from the first end to the second end, the full detection probe in the full detection module can detect all the defects of the object to be detected, and a first defect set is obtained. At this time, the second detection modules arranged at two sides of the total detection module can respectively determine the first second detection area and the second detection area according to the movement range of the object to be detected. If the first re-inspection area and the second re-inspection area are not overlapped, the first re-inspection probe can be used for re-inspecting the defects to be re-inspected in the first re-inspection area, and the second re-inspection probe can be used for re-inspecting the defects to be re-inspected in the second re-inspection area. If the first rechecking area and the second rechecking area are partially overlapped, the defects of the non-overlapped area can be distributed to the rechecking probes in the corresponding rechecking module for rechecking. For the defects in the overlapping area, the defects in the overlapping area may be allocated according to a preset allocation rule, for example, according to a preset number of defects required to be rechecked by the first rechecked probe for the present wheel and a preset number of defects required to be rechecked by the second rechecked probe for the present wheel.
In the embodiment of the present application, the movement direction of the object to be detected, that is, the first movement direction and the second movement direction, may be different from the movement direction of the recheck probe. For example, in fig. 1, the movement direction of the object to be detected is perpendicular to the movement direction of the retest probe and independent of each other. Of course, the included angle between the movement direction of the object to be detected and the movement direction of the recheck probe is not limited to this, and may be other angles.
Fig. 2 is a schematic flow chart of an implementation of a detection method based on the detection device shown in fig. 1 according to an embodiment of the present application, which is described in detail below:
in step S201, a first defect set to be rechecked included in the object to be tested is obtained;
Specifically, the test object described in the three application embodiments may have periodicity, for example: the object to be detected can be divided into a plurality of units to be detected, and the units to be detected are periodically arranged to form the object to be detected. In other embodiments, the analyte may not have periodicity.
Specifically, the object to be measured in the embodiment of the application may be an OLED (Organic Light-Emitting Diode) panel, an LCD (Liquid CRYSTAL DISPLAY ) panel, or the like. Each test object may include a plurality of test elements that may be used in an electronic product display. For example, the unit to be tested may be a screen of a smart phone, or may also be a screen of a display. The size of the unit to be tested can also be in various different sizes according to the size requirements of different electronic devices.
The defects of the object to be detected can comprise one or more of dust, pollutants, pits or protrusions on the surface of the screen.
When the defect information of the object to be detected is obtained, the object to be detected can be detected, and the detection information of the object to be detected is obtained. For example, the detection information on the surface of the object to be detected may be determined by scanning the image of the object to be detected through full detection, performing gray level analysis on the scanned image, and the like.
The detection information can comprise gray values of all pixel points of the image of the object to be detected and position information of all the points of the object to be detected.
And analyzing and processing the detection information according to a preset screening rule to obtain defects of the object to be detected, and forming a first defect set according to the obtained defects.
The analyzing and processing steps comprise: according to a first preset screening rule, carrying out cluster analysis on each pixel point of the image of the object to be detected to obtain a defect to be determined; and screening the undetermined defects according to the size of the undetermined defects and/or the gray values of the defect images according to a second preset screening rule, and obtaining the defects of the object to be detected.
The first preset screening rule comprises: and the gray value of the pixel point of the image in the region to be detected is in a first gray value range. According to different defect types, a plurality of different first gray value ranges can be determined, and the pixels of the image to be detected are clustered through the plurality of first gray value ranges, so that the undetermined defects formed by a plurality of different pixel point sets are obtained.
The second preset screening rule includes: the size of the defect to be determined is within a predetermined range; and/or the gray value of the pixel point of the undetermined defect is in a second gray value range.
The parameters determining the predetermined range may include one or more of length, width, radius, area, etc. parameters of the defect.
After the selected defects are obtained, the object to be detected can be divided into a plurality of units to be detected, the units to be detected to which the selected defects belong are determined, the defect values of the units to be detected are obtained according to the defect values of the defects included in the units to be detected, the defect values of the units to be detected are ordered according to the defect values of the units to be detected, and one or more defects with larger defect values in the units to be detected are obtained and used as the re-detection defects, and a first defect set is formed by the plurality of re-detection defects. Wherein the defect value of the defect may be determined according to the average gray value of the defect and the size of the defect. The defect of the unit under test may be the sum of defect values of all or a predetermined number of defects in the unit under test.
As an implementation mode in the application, the defect weight corresponding to the defect value of the unit to be detected can be dynamically distributed according to the number of the screened re-detection defects in the unit to be detected, and the defect weight gradually decreases along with the number of the screened re-detection defects of the unit to be detected. And dynamically updating the defect values of the units to be detected according to the defect weight values, so that the sequence of the defect values of the units to be detected is updated, defects included in different units to be detected are obtained as rechecking defects, and more uniform obtaining of the defects included in the units to be detected is facilitated.
Specifically, the specific process of acquiring the first defect set may be as shown in fig. 3, including:
in step S301, a third defect set determined by the full inspection module is obtained;
The influencing factors of the defect value of the defect to be rechecked may include the size of the defect, the average gray value of the pixel point corresponding to the defect, and the like. The step of obtaining defect values for individual defects in the third set of defects comprises: and carrying out weighting treatment on the defect value influence factors of the first defect set to obtain the defect value of the defect to be rechecked.
In step S302, sorting the defects in the third defect set according to the defect values;
According to the calculated defect value of each defect to be rechecked in the third defect set, the defects can be sorted in order from large to small, so as to intercept the sorted defects to be rechecked, for example, the defects to be rechecked of the first preset number are intercepted.
In step S303, a first predetermined number of defects with larger defect values are selected according to the ordered defects to generate the first defect set.
And screening out a first preset number of defects according to the ordered defects, wherein the first preset number of defects are defects to be detected, which are sequentially intercepted from large to small, and generating a first defect set according to the intercepted defects to be re-detected of the first preset number.
In step S202, screening the first defect set according to the position of the first defect set, the position of the recheck probe and the movement direction of the object to be tested, to obtain a second defect set;
when the first defect set corresponding to the re-inspection probe is obtained, the position of the re-inspection probe, the movement direction of the object to be detected and the position of the first defect set can be collected in real time in the detection process.
When the motion direction of the object to be detected (for example, the feeding direction of the object to be detected) is taken as the X-axis direction set as the coordinate system, the rechecking probe can move in the Y-axis direction, so that the whole coverage and detection of the object to be detected in the Y-axis direction are realized. And according to the reciprocating motion of the motion platform, the coverage of part or all of the area of the X-axis direction of the object to be detected can be realized.
The moving direction of the object to be detected, that is, the conveying direction of the conveying belt on the moving table for conveying the object to be detected, may include a first moving direction and a second moving direction, which respectively correspond to the negative X-axis direction and the positive X-axis direction, as shown in the figure.
The first defect set may be generated for defects acquired by the full inspection module prior to a current review pass of a plurality of review passes. The method comprises the steps of carrying out full detection and re-detection simultaneously, generating a first defect set by defects acquired by a full detection module before the current re-detection round in the multi-round re-detection, adding defects acquired by the full detection in the screening process of the round in the first defect set, sorting the defects screened by the re-detection module of the round in the axial direction, setting the number of the defects required to be detected of the round, and planning a detection path according to the movement speed of a movement table and the movement speed of the re-detection module so that the round can detect the defects with the preset number.
The first defect set may also be a defect detected by the full detection module in the present round, which is added in the re-detection process, that is, a defect detected by the full detection module before the present round, and a defect detected by the present round in real time.
After the first defect set is determined, the defects needing rechecking in the current turn can be determined according to the movement direction of the object to be detected. Namely, according to the movement direction of the object to be detected, the defect that the position is positioned at one side of the retest probe relative to the movement direction of the object to be detected is obtained, namely: the X coordinate is about to be consistent with the X-axis coordinate of the recheck probe.
Specifically, according to the feeding direction of the object to be detected being the negative X-axis direction, the moving direction of the rechecking probe is the Y-axis direction, and the obtaining of the second defect set includes:
when the motion direction is the first motion direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the recheck probe;
And when the movement direction is the second movement direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the recheck probe.
For example, the Position RC1Position (RC 1X, RC 1Y) of the first review probe REVIEWCAMERA1 is acquired, and the Position RC2Position (RC 2X, RC 2Y) of the second review probe REVIEWCAMERA2 is acquired.
Defect set RC1DefectCollection belonging to the first review probe REVIEWCAMERA and defect set RC2DefectCollection belonging to the second review probe REVIEWCAMERA are defined. Judging the moving direction of the object to be detected, if the object to be detected moves positively (in the X-axis negative direction), the defects in the defect set RC1DefectCollection belonging to the first re-inspection probe must satisfy that the coordinates in the X-direction are larger than the X-axis coordinates RC1X of the first re-inspection probe, and the defects in the defect set RC2DefectCollection belonging to the second re-inspection probe must satisfy that the coordinates in the X-direction are larger than the X-axis coordinates RC2X of the second re-inspection probe. Similarly, if the object to be measured moves reversely, the defects in the defect set RC1DefectCollection belonging to the first re-inspection probe must satisfy that the coordinates in the X direction are smaller than the X-axis coordinates RC1X of the first re-inspection probe, and the defects in the defect set RC2DefectCollection belonging to the second re-inspection probe must satisfy that the coordinates in the X direction are smaller than the X-axis coordinates RC2X of the second re-inspection probe.
Wherein only defects in the first review area that can be covered by the field of view of the first review probe RC1 are detected by RC 1; only defects in the second review area that can be covered by the field of view of the second review probe RC2 are detected by RC 2. And (3) for defects in the overlapping part of the view field of RC1 and the view field of RC2, distributing probes in the overlapping area, and after distributing the defects in the overlapping area, enabling the number of the defects detected by the two probes to be the preset number, wherein the screening logic of the preset number of the re-detection defects is related.
In step S203, the second defect set is sorted according to the movement direction of the object to be detected, and the sorted defect set is subjected to rechecking by a rechecking probe.
The defects in the defect set RC1DefectCollection belonging to the first recheck probe and the defects in the defect set RC2DefectCollection belonging to the second recheck probe are ordered, if the object to be tested is moving forward, the defects in the second defect set are ordered in ascending order of X direction, and if moving backward, the defects in the second defect set are ordered in descending order of X direction. If the rechecking module comprises a first rechecking module and a second rechecking module which are respectively arranged at two sides of the full-detection module, the second defect set can comprise a second left defect set and a second right defect set, and the second left defect set and the second right defect set are respectively sequenced according to the movement direction of the object to be detected.
In addition, when the defects in the second defect set are subjected to sorting and rechecking, the number of the defects in the second defect set can be determined during rechecking every round, the number of the defects required by the first rechecking probe and the second rechecking probe can be set according to the set number of the defects required by rechecking, the rechecking defects are recorded, and repeated rechecking of the defects is avoided. And defects in the first rechecking area and the second rechecking area can be selected according to the set defect number needing rechecking of the wheel.
The present application may further include a step of screening the defects in the second defect set before rechecking the ordered defects, as shown in fig. 4, including:
in step S401, according to the order of the second defect set, an ith defect in the second defect set is obtained, i is a sequence of the order in the second defect set, and i is greater than or equal to 2;
Specifically, if i=1, that is, when the first defect in the second defect set is obtained, the rechecking probe corresponding to the first defect can be directly controlled to move to the position of the first defect for rechecking. If i=2, when screening the second defect, the position corresponding to the rechecking probe is the position where the first defect is located.
If the second defect is screened out, the rechecking probe still stays at the position of the first defect, and whether the third defect needs to be screened out is judged by the rechecking probe at the position of the first defect.
If the second defect is not screened, the rechecking probe is moved to the position of the second defect for rechecking.
In step S402, if the i-th defect and the current position of the recheck probe belong to different units to be tested which are divided in advance, acquiring a theoretical Y-axis speed from the current position of the recheck probe to the i-th defect according to a movement speed of a movement table;
If the current position of the ith defect and the corresponding recheck probe belong to the same unit to be tested which is divided in advance, the ith defect is directly screened out.
If the detected units do not belong to the same unit to be detected which is divided in advance, the time from the position of the rechecking probe to the ith defect can be as follows based on the speed speedX of the X axis (namely the moving speed of the moving table): tx= |Aix-Cx|/speedX, wherein Aix is the X-axis coordinate of the ith defect, cx is the X-axis coordinate of the recheck probe, and then the theoretical Y-axis speed moving from the recheck probe position to the ith defect is calculated as follows:
TargetSpeedY＝|Ay-Cy|/Tx
Wherein TARGETSPEEDY is the theoretical Y-axis speed.
In step S403, if the theoretical Y-axis speed is greater than the current Y-axis speed of the review probe, screening out the ith defect;
in step S404, if the theoretical Y-axis speed is less than or equal to the current Y-axis speed of the review probe, controlling the review probe to move to the ith defect position according to the current Y-axis speed;
comparing the theoretical Y-axis speed with the current Y-axis speed, and screening the ith defect if the theoretical Y-axis speed is greater than the current Y-axis speed. If the theoretical Y-axis speed is less than or equal to the current Y-axis speed of the rechecking probe, controlling the rechecking probe to move to the ith defect position according to the current Y-axis speed
In step S405, the above steps are repeated to screen the i+1th defect until the defects in the second defect set are screened.
And comparing the 2 nd defects in the second defect set after sorting, and screening one by one until the N th defects in the second defect set are screened, wherein N is the number of the defects in the second defect set.
In addition, if two rechecking probes perform rechecking, the defect of screened treatment can be recorded, and the repeated detection and screening of the two rechecking probes are avoided.
It should be understood that the sequence number of each step in the foregoing embodiment does not mean that the execution sequence of each process should be determined by the function and the internal logic, and should not limit the implementation process of the embodiment of the present application.
Fig. 5 is a schematic diagram of a detection system according to an embodiment of the present application, where the detection system includes:
a first defect set obtaining unit 501, configured to obtain a first defect set to be rechecked included in the object to be detected;
A second defect set obtaining unit 502, configured to perform screening processing on the first defect set according to the position of the first defect set, the position of the recheck probe, and the movement direction of the object to be tested, so as to obtain a second defect set;
And a rechecking unit 503, configured to sort the second defect set according to the movement direction of the object to be tested, and recheck the sorted defect set through a rechecking probe.
The detection system corresponds to the detection method described in fig. 2.
Fig. 6 is a schematic diagram of a detection apparatus according to an embodiment of the present application. As shown in fig. 6, the detection apparatus 6 of this embodiment includes: a processor 60, a memory 61 and a computer program 62, such as a detection program, stored in the memory 61 and executable on the processor 60. The processor 60, when executing the computer program 62, implements the steps of the various detection method embodiments described above, such as steps 101 through 103 shown in fig. 1. Or the processor 60, when executing the computer program 62, performs the functions of the modules/units of the apparatus embodiments described above, such as the functions of the modules 501-503 shown in fig. 5.
Illustratively, the computer program 62 may be partitioned into one or more modules/units that are stored in the memory 61 and executed by the processor 60 to complete the present application. The one or more modules/units may be a series of computer program instruction segments capable of performing the specified functions describing the execution of the computer program 62 in the detection device 6. For example, the computer program 62 may be partitioned into units with the following specific functions:
The first defect set acquisition unit is used for acquiring a first defect set to be rechecked, which is included in the object to be detected;
the second defect set acquisition unit is used for screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the movement direction of the object to be tested to acquire a second defect set;
and the rechecking unit is used for sequencing the second defect set according to the movement direction of the object to be tested, and rechecking the sequenced defect set through a rechecking probe.
The detection device may include, but is not limited to, a processor 60, a memory 61. It will be appreciated by those skilled in the art that fig. 6 is merely an example of the detection device 6 and does not constitute a limitation of the detection device 6, and may include more or less components than illustrated, or may combine certain components, or different components, e.g., the detection device may further include an input-output device, a network access device, a bus, etc.
The Processor 60 may be a central processing unit (Central Processing Unit, CPU), other general purpose Processor, digital signal Processor (DIGITAL SIGNAL Processor, DSP), application SPECIFIC INTEGRATED Circuit (ASIC), off-the-shelf Programmable gate array (Field-Programmable GATE ARRAY, FPGA) or other Programmable logic device, discrete gate or transistor logic device, discrete hardware components, or the like. A general purpose processor may be a microprocessor or the processor may be any conventional processor or the like.
The memory 61 may be an internal storage unit of the detection device 6, such as a hard disk or a memory of the detection device 6. The memory 61 may also be an external storage device of the detection device 6, such as a plug-in hard disk, a smart memory card (SMART MEDIA CARD, SMC), a Secure Digital (SD) card, a flash memory card (FLASH CARD) or the like, which are provided on the detection device 6. Further, the memory 61 may also include both an internal memory unit and an external memory device of the detection device 6. The memory 61 is used for storing the computer program as well as other programs and data required by the detection device. The memory 61 may also be used for temporarily storing data that has been output or is to be output.
It will be apparent to those skilled in the art that, for convenience and brevity of description, only the above-described division of the functional units and modules is illustrated, and in practical application, the above-described functional distribution may be performed by different functional units and modules according to needs, i.e. the internal structure of the apparatus is divided into different functional units or modules to perform all or part of the above-described functions. The functional units and modules in the embodiment may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit, where the integrated units may be implemented in a form of hardware or a form of a software functional unit. In addition, the specific names of the functional units and modules are only for distinguishing from each other, and are not used for limiting the protection scope of the present application. The specific working process of the units and modules in the above system may refer to the corresponding process in the foregoing method embodiment, which is not described herein again.
In the foregoing embodiments, the descriptions of the embodiments are emphasized, and in part, not described or illustrated in any particular embodiment, reference is made to the related descriptions of other embodiments.
Those of ordinary skill in the art will appreciate that the various illustrative elements and algorithm steps described in connection with the embodiments disclosed herein may be implemented as electronic hardware, or combinations of computer software and electronic hardware. Whether such functionality is implemented as hardware or software depends upon the particular application and design constraints imposed on the solution. Skilled artisans may implement the described functionality in varying ways for each particular application, but such implementation decisions should not be interpreted as causing a departure from the scope of the present application.
In the embodiments provided in the present application, it should be understood that the disclosed apparatus/terminal device and method may be implemented in other manners. For example, the apparatus/terminal device embodiments described above are merely illustrative, e.g., the division of the modules or units is merely a logical function division, and there may be additional divisions in actual implementation, e.g., multiple units or components may be combined or integrated into another system, or some features may be omitted or not performed. Alternatively, the coupling or direct coupling or communication connection shown or discussed may be an indirect coupling or communication connection via interfaces, devices or units, which may be in electrical, mechanical or other forms.
The units described as separate units may or may not be physically separate, and units shown as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.
In addition, each functional unit in the embodiments of the present application may be integrated in one processing unit, or each unit may exist alone physically, or two or more units may be integrated in one unit. The integrated units may be implemented in hardware or in software functional units.
The integrated modules/units, if implemented in the form of software functional units and sold or used as stand-alone products, may be stored in a computer readable storage medium. Based on such understanding, the present application may implement all or part of the flow of the method of the above embodiment, or may be implemented by a computer program to instruct related hardware, where the computer program may be stored in a computer readable storage medium, and when the computer program is executed by a processor, the computer program may implement the steps of each of the method embodiments described above. . Wherein the computer program comprises computer program code which may be in source code form, object code form, executable file or some intermediate form etc. The computer readable medium may include: any entity or device capable of carrying the computer program code, a recording medium, a U disk, a removable hard disk, a magnetic disk, an optical disk, a computer Memory, a Read-Only Memory (ROM), a random access Memory (RAM, random Access Memory), an electrical carrier signal, a telecommunications signal, a software distribution medium, and so forth. It should be noted that the computer readable medium may include content that is subject to appropriate increases and decreases as required by jurisdictions in which such content is subject to legislation and patent practice, such as in certain jurisdictions in which such content is not included as electrical carrier signals and telecommunication signals.
The above embodiments are only for illustrating the technical solution of the present application, and not for limiting the same; although the application has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present application, and are intended to be included in the scope of the present application.
Claims (15)
1. The detection method is characterized in that detection equipment for implementing the detection method comprises a motion platform for bearing and moving an object to be detected, a re-detection module provided with a re-detection probe for re-detecting the object to be detected, and a full-detection module provided with a full-detection probe, wherein both sides of the full-detection module are respectively provided with a first re-detection module and a second re-detection module, the re-detection probe comprises a first re-detection probe and a second re-detection probe, and the detection method comprises the following steps:
acquiring a first defect set to be rechecked, which is included in the object to be detected;
Screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the movement direction of the object to be tested to obtain a second defect set;
Sorting the second defect set according to the movement direction of the object to be detected, and rechecking the sorted defect set through a rechecking probe, wherein the rechecking modules are arranged at two sides of the full-detection module when the object to be detected reciprocates, respectively determining a first rechecking area and a second rechecking area according to the movement range of the object to be detected, acquiring the defect positioned at one side of the rechecking probe relative to the movement direction of the object to be detected according to the movement direction of the object to be detected, rechecking the defect to be rechecked in the first rechecking area through the first rechecking probe, and rechecking the defect to be rechecked in the second rechecking area through the second rechecking probe.
2. The method according to claim 1, wherein the inspection apparatus includes a total inspection module for performing a primary inspection on an object to be inspected, and the step of acquiring a first defect set to be retested included in the object to be inspected includes:
Acquiring a third defect set determined by the full detection module;
Sorting defects in the third defect set according to defect values;
and screening out a first preset number of defects with larger defect values according to the ordered defects to generate the first defect set.
3. The inspection method according to claim 1, wherein the inspection apparatus includes a total inspection module for performing a primary inspection of the object to be inspected, the first defect set being generated by defects acquired by the total inspection module before a current rechecking round of a plurality of rechecks;
or when the full inspection and the re-inspection are performed simultaneously, generating the first defect set by the defects acquired by the full inspection module before the current re-inspection round in the multi-round re-inspection, and adding the defects acquired by the full inspection in the screening process of the round in the first defect set.
4. The method according to claim 1, wherein the step of screening the first defect set according to the position of the first defect set, the position of the review probe, and the movement direction of the object to be tested, and obtaining the second defect set includes:
Acquiring a defect positioned on a first side of the rechecking probe according to the movement direction of the object to be detected, wherein the first side is the movement direction side of the rechecking probe;
A second defect set is determined from the acquired defects.
5. The method according to claim 4, wherein the step of determining that the first movement direction of the object to be detected is positive X-axis direction and the second movement direction is negative X-axis direction, and the step of acquiring the defect located on the first side of the recheck probe, the first side being the movement direction side of the recheck probe, according to the movement direction of the object to be detected, includes:
when the motion direction is the first motion direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the recheck probe;
And when the movement direction is the second movement direction, acquiring the defect that the X-axis coordinate value is smaller than the X-axis coordinate of the recheck probe.
6. The method of detecting according to claim 4, further comprising:
determining a first re-detection area according to the detection range of the first re-detection probe, and determining a second re-detection area according to the detection range of the second re-detection probe;
And determining an overlapping area according to the first rechecking area and the second rechecking area, and distributing the defects of the overlapping area to a first rechecking probe or a second rechecking probe according to a preset distribution rule.
7. The inspection method according to claim 6, wherein the step of assigning defects of the overlapping area to the first review probe or the second review probe according to a preset assignment rule comprises:
And distributing the defects in the overlapping area to the first and second re-inspection probes according to the preset number detected by the first and second re-inspection probes in the re-inspection in combination with the number of re-inspection defects determined in the non-overlapping area.
8. The detecting method according to claim 6, wherein the detecting device includes a full detection module for performing initial detection of the object to be detected, and the full detection module provided in the middle detects the entire area of the object to be detected while the object to be detected reciprocates.
9. The method according to claim 1, wherein the step of screening the first defect set according to the position of the first defect set, the position of the review probe, and the movement direction of the object to be tested, and obtaining the second defect set includes:
and screening the defects in the second defect set according to the distance between the defects in the second defect set.
10. The method according to claim 9, wherein the step of determining that the first movement direction of the object to be detected is the positive direction of the X-axis and the movement direction of the review probe is the Y-axis, and the step of screening the defects in the second defect set according to the distance between the defects in the second defect set includes:
According to the ordering of the second defect set, an ith defect in the second defect set is obtained, i is a sequence ordered in the second defect set, and i is greater than or equal to 2;
If the current positions of the ith defect and the recheck probe belong to different units to be detected which are divided in advance, acquiring the theoretical Y-axis speed from the current position of the recheck probe to the ith defect according to the movement speed of the movement table;
If the theoretical Y-axis speed is greater than the current Y-axis speed of the rechecking probe, screening out the ith defect;
If the theoretical Y-axis speed is smaller than or equal to the current Y-axis speed of the rechecking probe, controlling the rechecking probe to move to the ith defect position according to the current Y-axis speed;
And repeating the steps to screen the (i+1) th defect until the defects in the second defect set are screened.
11. The method according to claim 1, wherein the movement direction of the object to be measured is different from the movement direction of the review probe and independent of each other.
12. The inspection method of claim 1, wherein the step of rechecking the ordered defect set with a rechecking probe comprises:
And rechecking the defects in the second defect set according to the preset rechecking number corresponding to the current rechecking in the repeated rechecks.
13. The utility model provides a detecting system, its characterized in that, the check out test set who implements detecting system includes the motion platform that is used for bearing and remove the thing that awaits measuring, is provided with the retest module that is used for carrying out the retest probe to the thing that awaits measuring, and is provided with the total module that examines of examining the probe entirely, the both sides of total module that examine are provided with first retest module and second retest module respectively, the retest probe includes first retest probe and second retest probe, detecting system includes:
The first defect set acquisition unit is used for acquiring a first defect set to be rechecked, which is included in the object to be detected;
the second defect set acquisition unit is used for screening the first defect set according to the position of the first defect set, the position of the rechecking probe and the movement direction of the object to be tested to acquire a second defect set;
The second detection unit is used for sequencing the second defect set according to the movement direction of the object to be detected, the sequenced defect set is subjected to the second detection through the second detection probe, the second detection modules are arranged on two sides of the total detection module when the object to be detected moves in a reciprocating mode, a first detection area and a second detection area are respectively determined according to the movement range of the object to be detected, the defect positioned on one side of the movement direction of the object to be detected relative to the movement direction of the object to be detected is obtained according to the movement direction of the object to be detected, the first detection probe carries out the second detection on the defect to be detected in the first detection area, and the second detection probe carries out the second detection on the defect to be detected in the second detection area.
14. A detection device comprising a memory, a processor and a computer program stored in the memory and executable on the processor, characterized in that the processor implements the steps of the detection method according to any one of claims 1 to 11 when the computer program is executed by the processor.
15. A computer readable storage medium storing a computer program, characterized in that the computer program when executed by a processor implements the steps of the detection method according to any one of claims 1 to 11.
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| FI20065063A0 (en) * | 2006-01-30 | 2006-01-30 | Visicamet Oy | Method and measuring device for measuring the displacement of a surface |
| JP4866141B2 (en) * | 2006-05-11 | 2012-02-01 | 株式会社日立ハイテクノロジーズ | Defect review method using SEM review device and SEM defect review device |
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| JP2013024666A (en) * | 2011-07-20 | 2013-02-04 | Panasonic Corp | Defect detection method and defect detection device |
| US9535010B2 (en) * | 2014-05-15 | 2017-01-03 | Kla-Tencor Corp. | Defect sampling for electron beam review based on defect attributes from optical inspection and optical review |
| US10190991B2 (en) * | 2016-11-03 | 2019-01-29 | Applied Materials Israel Ltd. | Method for adaptive sampling in examining an object and system thereof |
| KR20190014214A (en) * | 2017-07-28 | 2019-02-12 | 디아이티 주식회사 | Defect review device for glass substrate and method thereof |
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