CN112577651B - Finger sensor of mechanical hand sensor - Google Patents

Abstract

The invention discloses a finger sensor of a mechanical hand sensor, and belongs to the technical field of test equipment. The finger perceptron is a strip-shaped finger perceptron, which is formed by combining finger joint gesture recognition sensors and knuckle pressure recognition sensors at intervals, wherein each finger joint gesture recognition sensor and each knuckle pressure recognition sensor are in one-to-one correspondence with the finger joint position and the knuckle position of the finger back of the finger to which the finger joint gesture recognition sensor is mounted; the length and the width of the finger sensor are matched with the length and the width of the finger back of the finger, and the finger sensor is of a multi-layer structure and comprises a packaging positioning layer, a finger joint gesture capacitance sensing layer structure and a finger joint pressure resistance sensing layer structure; and the finger joint gesture recognition sensors and the finger joint pressure recognition sensors are respectively formed through the finger joint gesture capacitance sensing layer structure and the finger joint pressure resistance sensing layer structure which are fixedly connected with the upper silica gel encapsulation positioning layer and the lower silica gel encapsulation positioning layer. The device has the characteristics of low cost, reliable work, convenient installation and maintenance and the like.

Description

Finger sensor for manipulator sensor

technical field

The invention relates to the technical field of testing equipment.

Background technique

The sense of touch plays a crucial role in the basic sensory capabilities of human skin. It is also one of the direct forms by which most living things obtain information from the outside world. In recent years, with the rapid development of flexible electronics and artificial intelligence (AI) robotics, the need for safe and friendly interaction between humans and machines has become an important topic.

Flexible tactile sensors convert external stimuli (such as bending and pressure) into measurable or recordable signals. It can feel the external force-bearing part like the skin, and use it as a feedback signal to make a certain response to the external environment.

It is still not easy to find a simple and cheap solution to solve multi-functional sensor applications, such as relatively high development cost, low accuracy and user-friendliness are difficult to fully meet. Therefore, it is potential to develop practical flexible tactile sensors.

From the current status quo, the slow development of tactile perception can be attributed to the following challenges. First, the tactile sensor needs to be wearable and combined with an appropriately shaped surface for compatibility, durability, and wear resistance, brittle materials commonly used in the semiconductor industry (such as Si) are not feasible, which embodies the flexible The significance of sensing research and the necessity of development.

Contents of the invention

The technical problem to be solved by the present invention is to provide a finger sensor for a manipulator sensor, which has the characteristics of low cost, reliable operation, and convenient installation and maintenance.

In order to solve the problems of the technologies described above, the technical solution adopted in the present invention is:

A finger sensor for a manipulator sensor, the finger sensor is a strip-shaped finger sensor, which is formed by combining knuckle gesture recognition sensors and knuckle pressure recognition sensors at intervals, each knuckle gesture recognition sensor and knuckle pressure recognition sensor The sensor corresponds to the knuckle position and knuckle position of the back of the finger where it is installed;

The length and width of the finger sensor are adapted to the length and width of the back of the finger on which it is installed, and it is a multi-layer structure, which includes a packaging positioning layer, a knuckle gesture capacitive sensing layer structure and a knuckle piezoresistive sensing layer structure;

The knuckle gesture capacitive sensing layer structure from top to bottom is as follows: knuckle upper layer conductive silicone conductive layer, knuckle middle layer silicone dielectric layer and knuckle lower layer conductive silicone conductive layer, knuckle upper layer conductive silicone conductive layer and knuckle The conductive layer of the lower layer of conductive silicone is respectively provided with capacitive output wires to form a signal output line of the knuckle gesture recognition sensor;

The knuckle pressure resistance sensing layer structure from top to bottom is the upper knuckle conductive silicone conductive layer, the knuckle middle silicone dielectric hollow layer and the knuckle lower conductive silicone conductive layer, the knuckle middle silicone dielectric hollow layer is set The silicone dielectric layer with a hole in the middle is respectively provided with a resistance output wire on the conductive silicone conductive layer on the upper knuckle and the conductive silicone conductive layer on the lower knuckle to form a signal output line of the knuckle pressure recognition sensor;

The packaging positioning layer includes an upper silicone packaging positioning layer and a lower silicone packaging positioning layer, which are respectively located on the uppermost layer and the lowermost layer of the finger sensor. The upper surface of the silicone conductive layer and the upper surface of the knuckle upper conductive silicone conductive layer of the knuckle piezoresistive sensing layer structure are bonded together, and the upper surface of the lower silicone packaging positioning layer is bonded to the finger joint gesture capacitive sensing layer structure. The lower surface of the conductive silicone conductive layer of the joint lower layer and the lower surface of the knuckle lower conductive silicone conductive layer of the knuckle piezoresistive sensing layer structure are bonded together, so that the knuckle gesture capacitive sensing layer structure and the knuckle piezoresistive layer are bonded together. The sensing layer structure is fixedly connected together, and the knuckle gesture capacitive sensing layer structure and the knuckle piezoresistive sensing layer structure after the fixed connection of the upper silicone packaging positioning layer and the lower silicone packaging positioning layer respectively form each knuckle gesture recognition sensor and each knuckle pressure recognition sensor, so that they are respectively in the knuckle position and the knuckle position corresponding to it;

When the finger is bent, the thickness of the middle silicone dielectric layer of the knuckle gesture capacitive sensing layer structure changes with the negative correlation of the tensile force due to its flexibility, so that the upper layer of the knuckle is conductive. The distance between the conductive layer of conductive silicone and the lower layer of the knuckle changes accordingly, and then its capacitance value changes accordingly, and the signal output line of the knuckle gesture recognition sensor outputs the capacitance value corresponding to the bending angle of the finger;

When the knuckle is under pressure, the upper knuckle conductive silicone conductive layer and the lower knuckle conductive silicone conductive layer of the knuckle piezoresistive sensing layer structure (because of its flexibility, it is opened in the middle of the middle silicone dielectric hollow layer of the knuckle) The holes are close to and in contact with each other, and the size of the contact area is positively related to the pressure it receives, so that the contact resistance value changes accordingly, and the output of the signal output line of the knuckle pressure recognition sensor corresponds to the pressure on the knuckles resistance value.

The present invention is further improved in that:

The knuckle gesture capacitive sensing layer structure and the knuckle piezoresistive sensing layer structure in the finger sensor are provided with a silicone isolation layer to maintain the insulation between the adjacent knuckle gesture recognition sensor and knuckle pressure recognition sensor sex.

It also includes silicone package front sidewall, silicone package back sidewall, silicone package left sidewall and silicone package right sidewall, silicone package front sidewall, silicone package back sidewall, silicone package left sidewall and silicone package right sidewall The front end face, the rear end face, the left end face and the right end face of the finger sensor are bonded together, so as to form a finger sensor full-seal package structure of the finger sensor together with the package positioning layer, so that each finger in the finger sensor The joint gesture capacitive sensing layer structure and the knuckle pressure resistance sensing layer structure are encapsulated inside it, and the fully sealed packaging structure of the finger sensor is equipped with a knuckle gesture recognition sensor signal output line guide hole and a knuckle pressure recognition sensor signal output line The guide hole is used to lead out the signal output line of the knuckle gesture recognition sensor and the signal output line of the knuckle pressure recognition sensor.

The silica gel isolation layer includes an upper silica gel isolation layer and a lower silica gel isolation layer. The upper silica gel isolation layer is used to isolate the upper conductive silicone conductive layer 7 of the adjacent knuckle and the upper conductive silicone conductive layer of the knuckle; the lower silica gel isolation layer is used to isolate the adjacent knuckle. The conductive layer of the lower layer of the knuckle and the conductive layer of the lower layer of the knuckle; the upper silicone isolation layer and the upper silicone packaging positioning layer of the packaging positioning layer are integrated, and the lower silicone isolation layer and the lower silicone packaging positioning layer of the packaging positioning layer are One structure.

The middle silica gel dielectric layer of the knuckle and the hollow silica gel dielectric layer of the middle knuckle have an integral structure.

The beneficial effects produced by adopting the above-mentioned technical scheme are:

The knuckle gesture capacitive sensing layer structure uses the conductivity of the upper conductive silicone layer of the knuckle and the lower conductive layer of the knuckle as a capacitor plate, and uses the insulation of the middle layer of the knuckle as a support between the capacitor plates. medium, using the stable elastic deformation characteristics of the silicone dielectric layer and the stable conductive characteristics of the conductive silicone, when the knuckle is bent and stretched, a thickness change that is negatively correlated with the magnitude of the stretching force occurs, so that the capacitor plate The distance between them changes accordingly, and then the capacitance value changes accordingly, the structure is simple, the cost is low, and the work is reliable;

The knuckle pressure resistance sensing layer structure utilizes the conductive layer of conductive silicone on the upper layer of the knuckle and the conductive layer of conductive silicone on the lower layer of the knuckle to have stable electrical conductivity, moderate electrical resistance, and stable elastic deformation characteristics. The openings in the middle of the silicone dielectric hollow layer in the middle of the knuckle are close to and in contact with each other, and the size of the contact area is positively related to the pressure it receives, so that the contact resistance value changes accordingly. The structure is simple, the cost is low, and the work is reliable. ;

The package positioning layer fixedly connects the knuckle gesture capacitive sensing layer structure and the knuckle piezoresistive sensing layer structure together, so that they are respectively in the corresponding knuckle position and knuckle position;

The middle silica gel dielectric layer of the knuckle and the hollow silica gel dielectric layer of the middle knuckle are of an integrated structure, which simplifies the production process and reduces the production cost.

It has the characteristics of low cost, reliable operation and easy installation and maintenance.

Description of drawings

Fig. 1 is the structural representation of manipulator perceptron;

Fig. 2 is a schematic diagram of the layer structure of the finger sensor in Fig. 1;

Fig. 3 is A-A sectional view among Fig. 2;

Fig. 4 refers to the change curve diagram of the gesture of the joint gesture recognition sensor and the relative value of the capacitance;

Fig. 5 is a curve diagram of changes in pressure and resistance value of the knuckle pressure recognition sensor.

In the attached drawings: 1. Gloves; 2. Thumb sensor; 3. Index finger sensor; 4. Middle finger sensor; 5. Ring finger sensor; 6. Little finger sensor; 8. Silicone dielectric layer in the middle layer of knuckles; 9. Conductive layer of conductive silicone in the lower layer of knuckles; 10. Capacitor output wires; 11. Conductive layer of conductive silicone in the upper layer of knuckles; 12. Silicone dielectric hollow layer in the middle layer of knuckles; 12-1 . The opening in the middle of the dielectric hollow layer of silicone in the middle layer of the knuckle; 13. The conductive layer of conductive silicone in the lower layer of the knuckle; 14. The resistance output wire; 15. The upper layer of silicone packaging positioning layer; 16. The lower layer of silicone packaging positioning layer; 17. Silicone packaging Front side wall; 18. Rear side wall of silicone package; 19. Upper silicone isolation layer; 20. Lower silicone isolation layer; 21. Right side wall of silicone package; 22. Left side wall of silicone package.

Detailed ways

The present invention will be further described in detail below in conjunction with the accompanying drawings and specific embodiments.

For the convenience of description, the present invention will be described in detail by taking the manipulator sensor as an embodiment.

The standard parts used in the present invention can be purchased from the market, and the special-shaped parts can be customized according to the instructions and the accompanying drawings. The specific connection methods of each part adopt mature bolts, rivets, welding in the prior art , pasting and other conventional means, no longer described in detail here.

It can be seen from the embodiments shown in Figures 1 to 3 that this embodiment includes a glove 1 and a finger sensing device arranged on the glove 1;

Finger sensing device includes thumb sensor 2, index finger sensor 3, middle finger sensor 4, ring finger sensor 5 and little finger sensor 6; thumb sensor 2, index finger sensor 3, middle finger sensor 4, ring finger sensor 5 And the little finger sensor 6 is arranged on the glove 1, and is respectively positioned at the position corresponding to the back of the thumb, the back of the index finger, the back of the middle finger, the back of the ring finger and the back of the little finger; the glove 1 has elasticity, so as to be worn on On the manipulator, attach and position the finger sensing device on the corresponding position of the finger back of the manipulator;

The thumb sensor 2, the index finger sensor 3, the middle finger sensor 4, the ring finger sensor 5 and the little finger sensor 6 are all strip-shaped finger sensors, and the finger sensors are separated by the knuckle gesture recognition sensor and the knuckle pressure recognition sensor. Combined together to form, each knuckle gesture recognition sensor and knuckle pressure recognition sensor are in one-to-one correspondence with the knuckle position and knuckle position of their respective fingers;

The length and width of the finger sensor are adapted to the length and width of the back of the corresponding finger, and it is a multi-layer structure, which includes the package positioning layer, the knuckle gesture capacitive sensing layer structure and the knuckle piezoresistive sensing layer structure;

The knuckle gesture capacitive sensing layer structure from top to bottom is as follows: knuckle upper layer conductive silicone conductive layer 7, knuckle middle layer silicone dielectric layer 8 and knuckle lower layer conductive silicone conductive layer 9, knuckle upper layer conductive silicone conductive layer 7 and the conductive layer 9 of the conductive silica gel under the knuckles are respectively provided with capacitive output wires 10 to form a knuckle gesture recognition sensor signal output line;

The knuckle pressure resistance sensing layer structure from top to bottom is the upper knuckle conductive silicone conductive layer 11, the knuckle middle silicone dielectric hollow layer 12 and the knuckle lower conductive silicone conductive layer 13, the knuckle middle silicone dielectric hollow layer 12 is the silica gel dielectric layer with the middle opening 12-1, and the conductive silica gel conductive layer 11 of the upper layer of the knuckle and the conductive silica gel conductive layer 13 of the lower layer of the knuckle are respectively provided with a resistance output wire 14 to form a knuckle pressure recognition sensor signal output line;

The encapsulation positioning layer includes an upper silica gel encapsulation positioning layer 15 and a lower silica gel encapsulation positioning layer 16, which are respectively located at the uppermost and lowermost layers of the finger sensor. The upper surface of the joint upper conductive silicone conductive layer 7 and the upper surface of the knuckle upper conductive silicone conductive layer 11 of the knuckle pressure resistance sensing layer structure are bonded together, and the upper surface of the lower silicone packaging positioning layer 16 is connected to the knuckle gesture capacitance. The lower surface of the conductive silica gel conductive layer 9 under the knuckle of the sensing layer structure and the lower surface of the conductive silica gel conductive layer 13 of the knuckle lower layer of the knuckle piezoresistive sensing layer structure are bonded together, so that each knuckle gesture capacitance is transmitted The sensing layer structure and the knuckle piezoresistive sensing layer structure are fixedly connected together, and the knuckle gesture capacitive sensing layer structure and the knuckle piezoresistive sensing layer are fixedly connected through the upper silica gel packaging positioning layer 15 and the lower silica gel packaging positioning layer 16. The layer structure respectively forms each knuckle gesture recognition sensor and each knuckle pressure recognition sensor, so that they are respectively in the corresponding knuckle position and knuckle position;

When the finger is bent, the thickness of the middle silicone dielectric layer 8 of the knuckle gesture capacitive sensing layer structure changes with the negative correlation of the tensile force received due to its flexibility, so that the upper layer of the knuckle is conductive. The distance between the layer 7 and the conductive layer 9 of the conductive silica gel under the knuckle changes accordingly, and then the capacitance value thereof changes accordingly, and the knuckle gesture recognition sensor signal output line outputs the capacitance value corresponding to the bending angle of the finger;

When the knuckle position is under pressure, the knuckle upper layer conductive silica gel conductive layer 11 and the knuckle lower layer conductive silica gel conductive layer 13 of the knuckle pressure resistance sensing layer structure are formed by the middle layer of knuckle dielectric hollow layer 12 due to their flexibility. The opening 12-1 in the middle is close to and in contact with each other, and the size of the contact area is positively related to the size of the pressure it receives, so that the contact resistance value changes accordingly. The resistance value corresponding to the pressure received. It should be noted that the range of detection of the pressure on the knuckle is limited to the resistance change between the upper conductive silicone conductive layer 11 of the knuckle and the conductive silicone conductive layer 13 of the lower knuckle due to pressure from the beginning of contact to the maximum contact. Therefore, According to the pressure detection range, the parameters of each layer of the knuckle piezoresistive sensing layer structure and the size of the opening in the middle of the middle silica gel dielectric hollow layer of the knuckle are adjusted accordingly.

The knuckle gesture capacitive sensing layer structure and the knuckle piezoresistive sensing layer structure in the finger sensor are provided with a silicone isolation layer to maintain the insulation between the adjacent knuckle gesture recognition sensor and knuckle pressure recognition sensor sex.

It also includes a front side wall 17 of the silicone package, a rear side wall 18 of the silicone package, a left side wall 22 of the silicone package and a right side wall 21 of the silicone package, a front side wall 17 of the silicone package, a rear side wall 18 of the silicone package, and a left side wall of the silicone package 22 and the right side wall 21 of the silicone package are attached to the front face, the rear end face, the left end face and the right end face of the finger sensor respectively, so as to jointly form the finger sensor full-seal package structure of the finger sensor with the packaging positioning layer. The knuckle gesture capacitive sensing layer structure and the knuckle piezoresistive sensing layer structure in the finger sensor are encapsulated inside, and the fully sealed package structure of the finger sensor is provided with a knuckle gesture recognition sensor signal output line guide hole and The knuckle pressure recognition sensor signal output line guide hole is used to lead out the knuckle gesture recognition sensor signal output line and the knuckle pressure recognition sensor signal output line.

The silica gel isolation layer comprises an upper silica gel isolation layer 19 and a lower silica gel isolation layer 20, and the upper silica gel isolation layer 19 is used to isolate the adjacent knuckle upper conductive silicone conductive layer 7 and the knuckle upper conductive silicone conductive layer 11; the lower silica gel isolation layer 20 It is used to isolate the conductive layer 9 of the lower layer of adjacent knuckles from the conductive layer 13 of the lower layer of knuckles; the upper silicone isolation layer 19 is integrated with the upper silicone packaging positioning layer 15 of the package positioning layer, and the lower silicone isolation layer 20 and The lower silica gel encapsulation and positioning layer 16 of the encapsulation and positioning layer has an integral structure.

The middle silica gel dielectric layer 8 of the knuckle and the hollow silica gel dielectric layer 12 of the middle knuckle are integrally structured.

Experimental data

FIG. 4 is a graph showing changes in relative values of gestures and capacitances of the knuckle gesture recognition sensor of the finger sensor under the following physical parameters.

The knuckle gesture recognition sensor is 1.2 cm long and 1.2 cm wide; the conductive silicone layer 7 on the upper layer of the knuckle and the conductive layer 9 on the lower layer of the knuckle are made of conductive silicone produced by Dongguan Huayi Plastic Products Co., Ltd. [thickness: 0.05cm; density : 1.45g/cm ³ ; Shore hardness: A60 plus or minus 5]; the middle silicone dielectric layer 8 of the knuckle, the upper middle silicone packaging positioning layer 15 and the lower silicone packaging positioning layer 16 are produced by American smooth-on company Insulating silicone [model Ecoflex00-30; thickness: 0.03 cm; 100% modulus: 10psi; tensile strength: 200psi; elongation at failure: 900%; tear strength: 38pli].

Fig. 5 is a graph showing changes in pressure and resistance of the knuckle pressure recognition sensor of the finger sensor under the following physical parameters.

The knuckle pressure recognition sensor is 1.0 cm long; 1.2 cm wide; the middle opening 12-1 of the middle silica gel dielectric hollow layer 12 of the knuckle is located in the middle part, which is a square opening with a length of 0.7 cm; a width of 0.7 cm; the upper layer of the knuckle Conductive silica gel conductive layer 11 and lower knuckle conductive silica gel conductive layer 13 adopt conductive silica gel [thickness: 0.05cm; density: 1.45g/cm3; Shore hardness: A60 plus or minus 5] produced by Dongguan Huayi Plastic Products Co., Ltd.; The dielectric hollow layer 12 of the middle layer of the knuckle, the upper and middle layer of the packaging and positioning layer of the silicone packaging and positioning layer 15 and the lower layer of the silicone packaging and positioning layer 16 are made of insulating silicone produced by American smooth-on company [model Ecoflex00-30; thickness: 0.03 cm; 100% Modulus: 10psi; Tensile strength: 200psi; Elongation at failure: 900%; Tear strength: 38pli].

Tests have proved that the physical parameters of the front side wall 17 of the silicone package, the rear side wall 18 of the silicone package, the left side wall 22 of the silicone package and the right side wall 21 of the silicone package are related to the input and output responses of the knuckle gesture recognition sensor and the knuckle pressure recognition sensor. Curves have little material impact and are therefore not presented.

Claims (5)

1. A mechanical hand sensor finger sensor, characterized in that: the finger perceptron is a strip-shaped finger perceptron, and is formed by combining a finger joint gesture recognition sensor and a knuckle pressure recognition sensor together at intervals, wherein the finger joint gesture recognition sensor and the knuckle pressure recognition sensor are in one-to-one correspondence with the finger joint positions and the knuckle positions of the finger backs of the fingers on which the finger gesture recognition sensor and the knuckle pressure recognition sensor are installed;

the length and the width of the finger sensor are matched with the length and the width of the finger back of the finger, and the finger sensor is of a multi-layer structure and comprises a packaging positioning layer, a finger joint gesture capacitance sensing layer structure and a finger joint pressure resistance sensing layer structure;

the finger joint gesture capacitance sensing layer structure is that from top to bottom in proper order: the finger joint upper layer conductive silica gel conductive layer (7), the finger joint middle layer silica gel dielectric layer (8) and the finger joint lower layer conductive silica gel conductive layer (9), wherein the finger joint upper layer conductive silica gel conductive layer (7) and the finger joint lower layer conductive silica gel conductive layer (9) are respectively provided with a capacitance output wire (10) so as to form a finger joint gesture recognition sensor signal output wire;

the knuckle pressure resistance sensing layer structure sequentially comprises a knuckle upper conductive silica gel conductive layer (11), a knuckle middle silica gel dielectric hollow layer (12) and a knuckle lower conductive silica gel conductive layer (13) from top to bottom, wherein the knuckle middle silica gel dielectric hollow layer (12) is a silica gel dielectric layer with a middle opening (12-1), and the knuckle upper conductive silica gel conductive layer (11) and the knuckle lower conductive silica gel conductive layer (13) are respectively provided with a resistance output wire (14) so as to form a knuckle pressure identification sensor signal output wire;

the encapsulation positioning layer comprises an upper layer silica gel encapsulation positioning layer (15) and a lower layer silica gel encapsulation positioning layer (16), which are respectively positioned at the uppermost layer and the lowermost layer of the finger sensor, the lower surface of the upper layer silica gel encapsulation positioning layer (15) is adhered with the upper surface of the finger joint upper layer conductive silica gel conductive layer (7) of the finger joint gesture capacitance sensing layer structure and the upper surface of the finger joint upper layer conductive silica gel conductive layer (11) of the finger joint pressure resistance sensing layer structure, the upper surface of the lower layer silica gel encapsulation positioning layer (16) is adhered with the lower surface of the finger joint lower layer conductive silica gel conductive layer (9) of the finger joint gesture capacitance sensing layer structure and the lower surface of the finger joint lower layer conductive silica gel conductive layer (13) of the finger joint pressure resistance sensing layer structure, the finger joint gesture capacitance sensing layer structure and the finger joint pressure resistance sensing layer structure are fixedly connected together, and the finger joint gesture capacitance sensing layer structure and the finger joint pressure resistance sensing layer structure which are fixedly connected through the upper silica gel packaging and positioning layer (15) and the lower silica gel packaging and positioning layer (16) respectively form a finger joint gesture recognition sensor and a finger joint pressure recognition sensor, so that the finger joint gesture recognition sensor and the finger joint pressure recognition sensor are respectively positioned at finger joint positions and finger joint positions corresponding to the finger joint gesture capacitance sensing layer structure and the finger joint pressure resistance sensing layer structure;

when a finger is bent, the thickness change of the middle-layer silica gel dielectric layer (8) of the finger joint gesture capacitance sensing layer structure is inversely related to the magnitude of the tensile force, so that the distance between the upper-layer conductive silica gel conductive layer (7) of the finger joint and the lower-layer conductive silica gel conductive layer (9) of the finger joint is correspondingly changed, the capacitance value of the finger joint gesture capacitance sensing layer structure is correspondingly changed, and the capacitance value corresponding to the bending angle of the finger is output by the signal output line of the finger joint gesture recognition sensor;

when the knuckle part is stressed, the knuckle upper conductive silica gel conductive layer (11) and the knuckle lower conductive silica gel conductive layer (13) of the knuckle pressure resistance sensing layer structure are close to and contacted with each other by the middle opening (12-1) of the knuckle middle silica gel dielectric hollow layer (12) due to the flexibility characteristic of the knuckle upper conductive silica gel conductive layer and the knuckle lower conductive silica gel conductive layer, the contact area is positively correlated with the stressed pressure, so that the contact resistance value is correspondingly changed, and the knuckle pressure identification sensor signal output line outputs a resistance value corresponding to the stressed pressure of the knuckle part.

2. A mechanical hand sensor finger sensor according to claim 1, wherein: a silica gel isolation layer is arranged between the finger joint gesture capacitance sensing layer structure and the finger joint pressure resistance sensing layer structure in the finger sensor so as to keep the insulativity between the adjacent finger joint gesture recognition sensor and the finger joint pressure recognition sensor.

3. A mechanical hand sensor finger sensor according to claim 2, characterized in that: the finger sensor comprises a finger sensor, a finger sensor and a finger sensor positioning layer, and is characterized by further comprising a front silica gel packaging side wall (17), a rear silica gel packaging side wall (18), a left silica gel packaging side wall (22) and a right silica gel packaging side wall (21), wherein the front silica gel packaging side wall (17), the rear silica gel packaging side wall (18), the left silica gel packaging side wall (22) and the right silica gel packaging side wall (21) are respectively attached to the front end face, the rear end face and the left end face of the finger sensor, so that the finger sensor and the finger sensor positioning layer jointly form a finger sensor full-sealing packaging structure of the finger sensor so as to seal each finger sensor finger gesture capacitance sensing layer structure and finger joint pressure resistance sensing layer structure in the finger sensor inside the finger sensor full-sealing packaging structure, and the finger sensor full-sealing packaging structure is provided with a finger gesture recognition sensor signal output line guide hole and a finger joint pressure recognition sensor signal output line.

4. A mechanical hand sensor finger sensor according to claim 3, wherein: the silica gel isolation layer comprises an upper silica gel isolation layer (19) and a lower silica gel isolation layer (20), wherein the upper silica gel isolation layer (19) is used for isolating the adjacent upper conductive silica gel conductive layer (7) of the knuckle and the upper conductive silica gel conductive layer (11) of the knuckle; the lower silica gel isolation layer (20) is used for isolating the adjacent conductive silica gel conductive layer (9) at the lower layer of the knuckle and the conductive silica gel conductive layer (13) at the lower layer of the knuckle; the upper silica gel isolation layer (19) and the upper silica gel packaging and positioning layer (15) of the packaging and positioning layer are of an integrated structure, and the lower silica gel isolation layer (20) and the lower silica gel packaging and positioning layer (16) of the packaging and positioning layer are of an integrated structure.

5. A mechanical hand sensor finger sensor according to claim 4, wherein: the middle layer silica gel dielectric layer (8) of the knuckle and the middle layer silica gel dielectric hollow layer (12) of the knuckle are of an integrated structure.

Images