CN112558418A - Photoresist coating device - Google Patents
Photoresist coating device Download PDFInfo
- Publication number
- CN112558418A CN112558418A CN202011483346.3A CN202011483346A CN112558418A CN 112558418 A CN112558418 A CN 112558418A CN 202011483346 A CN202011483346 A CN 202011483346A CN 112558418 A CN112558418 A CN 112558418A
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- China
- Prior art keywords
- photoresist
- wafer
- bearing table
- solvent
- spraying
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 229920002120 photoresistant polymer Polymers 0.000 title claims abstract description 154
- 239000011248 coating agent Substances 0.000 title claims abstract description 23
- 238000000576 coating method Methods 0.000 title claims abstract description 23
- 235000012431 wafers Nutrition 0.000 claims abstract description 135
- 239000002904 solvent Substances 0.000 claims abstract description 38
- 238000005507 spraying Methods 0.000 claims abstract description 37
- 238000000034 method Methods 0.000 claims abstract description 17
- 238000001179 sorption measurement Methods 0.000 claims abstract description 16
- 239000007921 spray Substances 0.000 claims abstract description 11
- 239000011148 porous material Substances 0.000 claims description 3
- 230000007547 defect Effects 0.000 abstract description 6
- 238000010521 absorption reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004026 adhesive bonding Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000206 photolithography Methods 0.000 description 2
- 239000004065 semiconductor Substances 0.000 description 2
- 230000002745 absorbent Effects 0.000 description 1
- 239000002250 absorbent Substances 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007688 edging Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 238000004528 spin coating Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/16—Coating processes; Apparatus therefor
- G03F7/162—Coating on a rotating support, e.g. using a whirler or a spinner
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- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Coating Apparatus (AREA)
Abstract
The invention discloses a photoresist coating device, which comprises a wafer bearing table, a driving device, a wafer accommodating device, a photoresist nozzle, a solvent nozzle and an adsorption pad, wherein the wafer bearing table is arranged on the wafer bearing table; the wafer accommodating device is used for accommodating the wafer bearing table, and the wafer bearing table is used for placing wafers; the driving device is connected with the wafer bearing table to drive the wafer bearing table to rotate; the photoresist sprayer is positioned above the wafer bearing table and used for spraying photoresist to the wafer; the solvent spray head is positioned above the wafer bearing table and used for spraying a solvent to the edge of the wafer, and the solvent is used for dissolving the photoresist; the adsorption pad is arranged on the inner wall of the wafer accommodating device and is aligned to the edge of the wafer, and the adsorption pad is used for adsorbing the splashed solvent; the device can effectively remove the bulges of the photoresist on the edge of the wafer, and effectively avoid the defects on the surface of the wafer in the removing process.
Description
Technical Field
The invention relates to the technical field of photoresist equipment, in particular to a photoresist coating device.
Background
In a semiconductor manufacturing process, a photolithography process has been considered as a key step in the integrated circuit manufacturing, and wafer coating is very important in the whole photolithography process, and the stability and reliability of the wafer coating have important influence on the quality, yield and cost of products. The photoetching process is a complex process, and is characterized by that the circuit structure can be copied into the wafer to be etched and ion-implanted in the form of pattern, firstly, a photoresist thin layer can be formed on the wafer by means of photoresist coating system, then the parallel light can be irradiated on the photoresist thin layer by means of mask plate to make it be exposed and changed, and finally, the developing process can be implemented by means of developing liquor to implement pattern transfer. In which, if the thickness of the formed photoresist thin layer is deviated, the subsequent related processes are directly affected.
In the semiconductor manufacturing industry, the existing photoresist spraying technology adopts a center spraying mode, namely, only one spray nozzle of a wafer is used for spraying photoresist, the photoresist spray nozzle is arranged above the center of the wafer, and the wafer rotates to enable the photoresist to be full of the wafer after the photoresist is sprayed. During specific operation, firstly, a photoresist solvent spray head is arranged for spraying a photoresist solvent to wet the wafer, so that the photoresist on the back surface is easy to coat. And then, spraying photoresist by using another photoresist sprayer, wherein the wafer can rotate or not rotate in the spraying process, the photoresist is thrown out to the periphery by rotating the wafer at a high speed after the spraying is finished, and a photoresist solvent is fully distributed on the wafer. Meanwhile, the photoresist flows on the wafer in a star pattern mode, and finally the photoresist is uniformly coated on the surface of the wafer.
The photoresist edging is a necessary step of photoresist coating, in the photoresist spin coating process, redundant photoresist can be thrown to the edge of a wafer by centrifugal force, a raised edge is formed after solidification, a small amount of photoresist can flow to the back of the wafer along the edge under the action of surface tension to pollute the wafer, and part of photoresist is stripped to easily form defects, so that the photoresist needs to be removed immediately after the photoresist coating is finished.
Therefore, it is necessary to provide a photoresist coating apparatus, which can effectively remove the photoresist at the edge of the wafer and effectively avoid the defect on the surface of the wafer during the removal process.
Disclosure of Invention
The invention aims to provide a photoresist coating device which can effectively remove the bulge of photoresist on the edge of a wafer and effectively avoid the defect of the surface of the wafer in the removing process.
In order to achieve the above objects and other related objects, the present invention provides a photoresist coating apparatus, which is characterized in that the photoresist coating apparatus comprises a wafer carrying stage, a driving device, a wafer accommodating device, a photoresist nozzle, a solvent nozzle and an adsorption pad; the wafer accommodating device is used for accommodating the wafer bearing table, and the wafer bearing table is used for placing wafers; the driving device is connected with the wafer bearing table to drive the wafer bearing table to rotate; the photoresist sprayer is positioned above the wafer bearing table and used for spraying photoresist to the wafer; the solvent spray head is positioned above the wafer bearing table and used for spraying a solvent to the edge of the wafer, and the solvent is used for dissolving the photoresist; the adsorption pad is arranged on the inner wall of the wafer accommodating device and is aligned to the edge of the wafer, and the adsorption pad is used for adsorbing the splashed solvent.
Preferably, the wafer carrier is circular.
Preferably, the wafer bearing table vacuum-adsorbs the wafer.
Preferably, the number of the photoresist nozzles is plural.
Preferably, the photoresist nozzles are distributed along the same radius of the wafer bearing table, wherein the first photoresist nozzle is located above the center of the wafer bearing table.
Preferably, a sensor is arranged on the photoresist nozzle.
Preferably, each photoresist nozzle is in an inverted trapezoid shape, and the outlet aperture of each photoresist nozzle is 0.2 mm-0.8 mm.
Preferably, the position and the number of the photoresist nozzles can be changed according to the thickness of the photoresist and/or the size of the wafer during spraying.
Preferably, in the process that the photoresist is sprayed on the wafer by the photoresist sprayers, when the first photoresist sprayer is sprayed, the driving device drives the wafer bearing table to rotate, the wafer rotates for the first time, and the first rotating speed is lower than 3000 revolutions per minute.
Preferably, the absorbent pad is made of a porous material.
In summary, the photoresist coating apparatus provided by the invention combines the photoresist nozzle and the solvent nozzle, the photoresist nozzle is used for spraying photoresist to form a photoresist film on the surface of the wafer, and the solvent nozzle is used for spraying solvent to the edge of the wafer to dissolve the photoresist bump formed at the edge, so as to perform photoresist edge removal; in addition, a layer of adsorption material is added on the surface of the inner wall of the gluing and accommodating device and used for adsorbing the solvent splashed to the inner wall, so that the solvent is prevented from being splashed back, and the photoresist is dissolved to form defects.
Drawings
Fig. 1 is a schematic view of a photoresist coating apparatus according to an embodiment of the invention.
Wherein the reference numerals are as follows:
10-wafer, 20-wafer containing device, 30-driving device, 30 a-wafer bearing table, 40-photoresist nozzle, 50-solvent nozzle and 60-adsorption pad.
Detailed Description
The following describes in more detail embodiments of the present invention with reference to the schematic drawings. The advantages and features of the present invention will become more apparent from the following description. It is to be noted that the drawings are in a very simplified form and are not to precise scale, which is merely for the purpose of facilitating and distinctly claiming the embodiments of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.
Fig. 1 is a schematic view of a photoresist coating apparatus according to an embodiment of the present invention, and referring to fig. 1, the photoresist coating apparatus according to the embodiment includes a wafer stage 30a, a driving device 30, a wafer accommodating device 20, a photoresist nozzle 40, a solvent nozzle 50, and an adsorption pad 60; the wafer accommodating device 20 is used for accommodating the wafer bearing table 30a, and the wafer bearing table 30a is used for placing the wafer 10; the driving device 30 is connected to the wafer carrying stage 30a to drive the wafer carrying stage 30a to rotate; the photoresist nozzle 40 is positioned above the wafer bearing table 30a and is used for spraying photoresist on the wafer 10; the solvent spray head 50 is located above the wafer bearing table 30a, and is used for spraying a solvent to the edge of the wafer 10, wherein the solvent is used for dissolving the photoresist; the adsorption pad 60 is disposed on an inner wall of the wafer accommodating device 20 and aligned with an edge of the wafer 10, and the adsorption pad 60 is used for adsorbing the sputtered solvent.
In this embodiment, the wafer carrier 30a is circular.
In this embodiment, the wafer stage 30a vacuum-adsorbs the wafer 10. The center position of the wafer 10 corresponds to the center position of the wafer carrying table 30a, and the radius of the suction area of the wafer carrying table 30a for sucking the wafer 10 is 1/3 of the radius of the wafer 10.
In the embodiment of the present invention, the number of the photoresist nozzles 40 is generally plural, and a plurality of the photoresist nozzles 40 are distributed along the same radius of the wafer bearing table 30a, wherein a first photoresist nozzle 40 is located above the center of the wafer bearing table 30a, for example, as shown in fig. 1, three photoresist nozzles 40 are distributed along the same radius of the wafer bearing table 30a, wherein the first photoresist nozzle 40 is located above the center of the wafer bearing table 30 a. If the photoresist is used to place the wafer 10 on the susceptor 30a, three photoresist nozzles 40 can be distributed along the same radius of the wafer 10, wherein the first photoresist nozzle 40 is located above the center of the wafer 10.
In the embodiment of the present application, each of the photoresist nozzles 40 is provided with a sensor, which can sense the position of the photoresist flowing on the wafer 10.
In the embodiment of the application, each photoresist nozzle 40 is in an inverted trapezoid shape, the outlet aperture of each photoresist nozzle 40 is 0.2 mm-0.8 mm, each photoresist nozzle 40 is in an inverted trapezoid shape, the spraying amount of the photoresist outlet can be reduced, the outlet aperture is 0.2 mm-0.8 mm, the size of each photoresist nozzle 40 is large or small, the spraying amount is large or small, and the photoresist nozzles 40 can be selected according to different wafers 10 needing spraying at each time.
In the embodiment of the present application, the position and the number of the photoresist nozzles 40 can be changed according to the thickness of the photoresist and/or the wafer size during spraying. The apertures of the photoresist nozzles 40 are different, the spraying amount of each photoresist nozzle 40 is different, and the total usage amount of the photoresist is determined by the thickness of the photoresist and the size of the wafer 10, so that the number of the photoresist nozzles to be used can be determined according to the thickness of the photoresist and the size of the wafer 10, and the position of the photoresist nozzle 40 can also be determined.
In the specific implementation process, in the process of spraying the photoresist on the wafer 10 by the photoresist sprayers 40, when the first photoresist sprayer 40 is sprayed, the driving device 30 drives the wafer bearing table 30a to rotate, the wafer 10 rotates for the first time, and the first rotating speed is lower than 3000 r/min. The first photoresist nozzle 40 starts to rotate when spraying, other photoresist nozzles 40 distributed along the radius of the wafer 10 are sprayed in sequence, the spraying process is increased and still rotates at the first rotating speed, and after the last photoresist nozzle 40 is sprayed, the photoresist nozzles continue to rotate at the first rotating speed until the wafer is full of photoresist.
According to fig. 1, in the embodiment of the present application, during the process of spraying the photoresist on the wafer 10 by the plurality of photoresist nozzles 40, after the first photoresist nozzle 40 sprays the photoresist, the photoresist 40 flows around the wafer 10 in the shape of a star pattern, when the sensor on the next photoresist nozzle 40 monitors that the photoresist sprayed from the previous nozzle flows to the lower side, the photoresist nozzle 40 sprays the photoresist, the sprayed photoresist can increase the inner angle of the star pattern of the photoresist flowing on the wafer, so that the photoresist is more easily spread on the wafer, and the wafer 10 keeps rotating at the first rotation speed during the spraying of the plurality of photoresist nozzles 40.
When the photoresist nozzle 40 sprays photoresist, the solvent nozzle 50 is opened, the solvent nozzle 50 sprays solvent to the far side of the wafer 10 to dissolve the photoresist at the edge of the wafer 10, the sprayed solvent is absorbed by the absorption pad 60, and the absorption pad 60 is generally made of porous material which is beneficial to absorption.
The photoresist coating device provided by the invention has the advantages that through the combination of the photoresist sprayer and the solvent sprayer, the photoresist sprayer is used for spraying photoresist to form a photoresist film on the surface of a wafer, and the solvent sprayer is used for spraying solvent to the edge of the wafer to dissolve photoresist bumps formed on the edge, so that photoresist edge removal is carried out; in addition, a layer of adsorption material is added on the surface of the inner wall of the gluing and accommodating device and used for adsorbing the solvent splashed to the inner wall, so that the solvent is prevented from being splashed back, and the photoresist is dissolved to form defects.
The above description is only a preferred embodiment of the present invention, and does not limit the present invention in any way. It will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the invention as defined by the appended claims.
Claims (10)
1. A photoresist coating device is characterized in that the photoresist spraying device comprises a wafer bearing table, a driving device, a wafer containing device, a photoresist nozzle, a solvent nozzle and an adsorption pad; the wafer accommodating device is used for accommodating the wafer bearing table, and the wafer bearing table is used for placing wafers; the driving device is connected with the wafer bearing table to drive the wafer bearing table to rotate; the photoresist sprayer is positioned above the wafer bearing table and used for spraying photoresist to the wafer; the solvent spray head is positioned above the wafer bearing table and used for spraying a solvent to the edge of the wafer, and the solvent is used for dissolving the photoresist; the adsorption pad is arranged on the inner wall of the wafer accommodating device and is aligned to the edge of the wafer, and the adsorption pad is used for adsorbing the splashed solvent.
2. The photoresist spraying apparatus of claim 1, wherein the wafer stage is circular.
3. The photoresist spraying apparatus of claim 2, wherein the wafer stage vacuum adsorbs the wafer.
4. The photoresist spraying apparatus of claim 3, wherein the number of the photoresist nozzles is plural.
5. The apparatus of claim 4, wherein a plurality of the photoresist nozzles are distributed along a same radius of the wafer stage, wherein a first one of the photoresist nozzles is located above a center of the wafer stage.
6. The photoresist spraying apparatus of claim 1, wherein a sensor is disposed on the photoresist sprayer.
7. The apparatus according to claim 4, wherein each of the photoresist nozzles has an inverted trapezoidal shape, and an outlet aperture of each of the photoresist nozzles is 0.2mm to 0.8 mm.
8. The photoresist spraying apparatus of claim 7, wherein the position and number of the photoresist nozzles can be changed according to the thickness of the photoresist and/or the wafer size at the time of spraying.
9. The photoresist coating apparatus of claim 8, wherein during the process of coating photoresist on the wafer by the plurality of photoresist nozzles, when a first photoresist nozzle is used for coating, the driving device drives the wafer bearing table to rotate, the wafer rotates for the first time, and the first rotation speed is lower than 3000 rpm.
10. The photoresist coating apparatus of claim 1, wherein the adsorption pad is made of a porous material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011483346.3A CN112558418A (en) | 2020-12-16 | 2020-12-16 | Photoresist coating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011483346.3A CN112558418A (en) | 2020-12-16 | 2020-12-16 | Photoresist coating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112558418A true CN112558418A (en) | 2021-03-26 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011483346.3A Pending CN112558418A (en) | 2020-12-16 | 2020-12-16 | Photoresist coating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112558418A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114171449A (en) * | 2021-12-02 | 2022-03-11 | 华海清科股份有限公司 | Wafer fixing device and wafer drying device |
| CN115576172A (en) * | 2022-10-31 | 2023-01-06 | 上海华力微电子有限公司 | A kind of photoresist spraying device and photoresist spraying method |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102527574A (en) * | 2010-12-08 | 2012-07-04 | 无锡华润上华科技有限公司 | Device and method for spraying photoresist |
| CN102709175A (en) * | 2012-05-23 | 2012-10-03 | 上海宏力半导体制造有限公司 | Forming method of photoresist layer in deep groove process |
| CN103365075A (en) * | 2012-03-26 | 2013-10-23 | 上海宏力半导体制造有限公司 | Photolithographic process method for eliminating lathe work on surface of wafer |
| CN105772323A (en) * | 2014-12-18 | 2016-07-20 | 沈阳芯源微电子设备有限公司 | Semiconductor made thick photoresist film coating device and application method thereof |
| CN107930917A (en) * | 2017-12-21 | 2018-04-20 | 上海华力微电子有限公司 | A kind of photoresist coating system and method |
| CN208126101U (en) * | 2018-05-10 | 2018-11-20 | 德淮半导体有限公司 | Photoetching gum coating apparatus |
| CN208705657U (en) * | 2018-09-11 | 2019-04-05 | 长鑫存储技术有限公司 | Scan-type photoresist coating system |
-
2020
- 2020-12-16 CN CN202011483346.3A patent/CN112558418A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102527574A (en) * | 2010-12-08 | 2012-07-04 | 无锡华润上华科技有限公司 | Device and method for spraying photoresist |
| CN103365075A (en) * | 2012-03-26 | 2013-10-23 | 上海宏力半导体制造有限公司 | Photolithographic process method for eliminating lathe work on surface of wafer |
| CN102709175A (en) * | 2012-05-23 | 2012-10-03 | 上海宏力半导体制造有限公司 | Forming method of photoresist layer in deep groove process |
| CN105772323A (en) * | 2014-12-18 | 2016-07-20 | 沈阳芯源微电子设备有限公司 | Semiconductor made thick photoresist film coating device and application method thereof |
| CN107930917A (en) * | 2017-12-21 | 2018-04-20 | 上海华力微电子有限公司 | A kind of photoresist coating system and method |
| CN208126101U (en) * | 2018-05-10 | 2018-11-20 | 德淮半导体有限公司 | Photoetching gum coating apparatus |
| CN208705657U (en) * | 2018-09-11 | 2019-04-05 | 长鑫存储技术有限公司 | Scan-type photoresist coating system |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114171449A (en) * | 2021-12-02 | 2022-03-11 | 华海清科股份有限公司 | Wafer fixing device and wafer drying device |
| CN115576172A (en) * | 2022-10-31 | 2023-01-06 | 上海华力微电子有限公司 | A kind of photoresist spraying device and photoresist spraying method |
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Application publication date: 20210326 |
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| RJ01 | Rejection of invention patent application after publication |