CN112547311A - Silicon wafer cutting waste residue charge separator - Google Patents
Silicon wafer cutting waste residue charge separator Download PDFInfo
- Publication number
- CN112547311A CN112547311A CN202011468715.1A CN202011468715A CN112547311A CN 112547311 A CN112547311 A CN 112547311A CN 202011468715 A CN202011468715 A CN 202011468715A CN 112547311 A CN112547311 A CN 112547311A
- Authority
- CN
- China
- Prior art keywords
- charge separator
- cutting waste
- waste residue
- silicon wafer
- wafer cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 title claims abstract description 18
- 239000002699 waste material Substances 0.000 title claims abstract description 17
- 229910052710 silicon Inorganic materials 0.000 title claims abstract description 16
- 239000010703 silicon Substances 0.000 title claims abstract description 16
- 239000002245 particle Substances 0.000 abstract description 12
- 239000003292 glue Substances 0.000 abstract description 3
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 12
- 235000013312 flour Nutrition 0.000 description 6
- 239000008187 granular material Substances 0.000 description 6
- 239000000377 silicon dioxide Substances 0.000 description 6
- 239000000084 colloidal system Substances 0.000 description 3
- 239000002923 metal particle Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 2
- 239000000693 micelle Substances 0.000 description 2
- 238000000926 separation method Methods 0.000 description 2
- 239000011863 silicon-based powder Substances 0.000 description 2
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000005188 flotation Methods 0.000 description 1
- 238000007885 magnetic separation Methods 0.000 description 1
- 239000013528 metallic particle Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 239000002210 silicon-based material Substances 0.000 description 1
Images
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B03—SEPARATION OF SOLID MATERIALS USING LIQUIDS OR USING PNEUMATIC TABLES OR JIGS; MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C—MAGNETIC OR ELECTROSTATIC SEPARATION OF SOLID MATERIALS FROM SOLID MATERIALS OR FLUIDS; SEPARATION BY HIGH-VOLTAGE ELECTRIC FIELDS
- B03C7/00—Separating solids from solids by electrostatic effect
- B03C7/02—Separators
- B03C7/12—Separators with material falling free
Landscapes
- Electrostatic Separation (AREA)
Abstract
本发明提供了硅片切割废渣电荷分离器，其能够方便快捷分离硅片切割废渣内的胶颗粒。其包括支架，支架上安装有电荷分离器，电荷分离器顶部开有进料口，底部开有出料口，进料口、出料口之间，电荷分离器自上而下均布有两个以上电极片。
The invention provides a silicon wafer cutting waste residue charge separator, which can conveniently and quickly separate glue particles in the silicon wafer cutting waste residue. It includes a bracket, a charge separator is installed on the bracket, a feed port is opened at the top of the charge separator, and a discharge port is opened at the bottom, and the charge separator is evenly distributed from top to bottom. more than one electrode pad.
Description
Technical Field
The invention belongs to the field of processing, and particularly relates to silicon material processing.
Background
Silicon powder particles, metal particles and colloid particles are contained in the silicon wafer cutting waste residues, generally the metal particles can be removed through flotation, magnetic separation and other modes, but the colloid particles cannot be separated due to the fact that the density and the volume of the colloid particles are similar to those of the silicon powder particles, and recycling of the cutting waste residues is directly influenced.
Disclosure of Invention
In order to solve the problem that the adhesive particles in the silicon wafer cutting waste residue cannot be separated, the invention provides a silicon wafer cutting waste residue charge separator which can conveniently and quickly separate the adhesive particles in the silicon wafer cutting waste residue.
In order to achieve the purpose, the invention is realized by the following technical scheme:
silicon chip cutting waste residue charge separator, it includes the support, its characterized in that: the charge separator is arranged on the support, a feed inlet is formed in the top of the charge separator, a discharge outlet is formed in the bottom of the charge separator, and more than two electrode plates are uniformly distributed between the feed inlet and the discharge outlet from top to bottom.
It is further characterized in that:
the discharge hole is a horn mouth with a large upper part and a small lower part.
The invention has the beneficial effects that: utilize the principle that the electric charge polarity of silica flour granule and colloidal particle is different, in the slow charge separator that adds of silicon chip cutting waste residue that will dispel metal particle, silica flour can be adsorbed on the electrode piece, and colloidal particle can drop to the bottom automatically, and when the electrode slice adsorbs full, we put charge separator's electric charge in the opposite direction, and silica flour can drop automatically, and the actual operation discovery, the removal rate of micelle granule reaches 99.99%, has realized the convenient and fast glue granule in the separation silicon chip cutting waste residue.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
in the figure: 1, a bracket; 2 a charge separator; 21 a feed inlet; 22 a discharge hole; 3 electrode slice.
Detailed Description
For the purpose of enhancing the understanding of the present invention, the present invention will be described in further detail with reference to the accompanying drawings and examples, which are provided for the purpose of illustration only and are not intended to limit the scope of the present invention.
The silicon wafer cutting waste residue charge separator comprises a support 1, wherein a charge separator 2 is mounted on the support 1, a feed inlet 21 is formed in the top of the charge separator 2, a discharge outlet 22 is formed in the bottom of the charge separator 2, and more than two electrode plates 3 are uniformly distributed between the feed inlet 21 and the discharge outlet 22 from top to bottom in the charge separator 2. The discharge port 22 is a bell mouth with a large upper part and a small lower part.
The invention has the beneficial effects that: utilize the principle that the electric charge polarity of silica flour granule and colloidal particle is different, in slowly adding charge separator 2 of silicon chip cutting waste residue that will dispel metallic particle, silica flour can be adsorbed on electrode slice 3, and colloidal particle can drop to the bottom automatically, and when electrode slice 3 adsorbs fully, we put charge separator 2's electric charge in reverse, and silica flour can drop automatically, and the actual operation is found, and the rate of dispelling of micelle granule reaches 99.99%, has realized the convenient and fast glue granule in the separation silicon chip cutting waste residue.
Claims (2)
1. Silicon chip cutting waste residue charge separator, it includes the support, its characterized in that: the charge separator is arranged on the support, a feed inlet is formed in the top of the charge separator, a discharge outlet is formed in the bottom of the charge separator, and more than two electrode plates are uniformly distributed between the feed inlet and the discharge outlet from top to bottom.
2. The silicon wafer cutting waste residue charge separator according to claim 1, characterized in that: the discharge hole is a horn mouth with a large upper part and a small lower part.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011468715.1A CN112547311A (en) | 2020-12-15 | 2020-12-15 | Silicon wafer cutting waste residue charge separator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011468715.1A CN112547311A (en) | 2020-12-15 | 2020-12-15 | Silicon wafer cutting waste residue charge separator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN112547311A true CN112547311A (en) | 2021-03-26 |
Family
ID=75064592
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011468715.1A Pending CN112547311A (en) | 2020-12-15 | 2020-12-15 | Silicon wafer cutting waste residue charge separator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112547311A (en) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA686304A (en) * | 1964-05-12 | Milton Lebaron I. | Electrostatic separation | |
| US5161696A (en) * | 1991-04-19 | 1992-11-10 | Washington Mills Electro Minerals Corp. | Method and apparatus for separating shapes of abrasive grains |
| US5944875A (en) * | 1996-10-22 | 1999-08-31 | University Of Kentucky Research Foundation | Triboelectric separator with mixing chamber and pre-separator |
| WO2002028537A1 (en) * | 2000-10-05 | 2002-04-11 | Evans Deakin Pty Ltd | Electro-static separation apparatus and method |
| CN103817010A (en) * | 2014-02-20 | 2014-05-28 | 广州市冠誉铝箔包装材料有限公司 | Device for separating medicinal blister aluminum plastic by using high voltage electrostatic way, and separation method |
| CN214160053U (en) * | 2020-12-15 | 2021-09-10 | 无锡宝德金装备科技有限公司 | Silicon wafer cutting waste residue charge separator |
-
2020
- 2020-12-15 CN CN202011468715.1A patent/CN112547311A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CA686304A (en) * | 1964-05-12 | Milton Lebaron I. | Electrostatic separation | |
| US5161696A (en) * | 1991-04-19 | 1992-11-10 | Washington Mills Electro Minerals Corp. | Method and apparatus for separating shapes of abrasive grains |
| US5944875A (en) * | 1996-10-22 | 1999-08-31 | University Of Kentucky Research Foundation | Triboelectric separator with mixing chamber and pre-separator |
| WO2002028537A1 (en) * | 2000-10-05 | 2002-04-11 | Evans Deakin Pty Ltd | Electro-static separation apparatus and method |
| CN103817010A (en) * | 2014-02-20 | 2014-05-28 | 广州市冠誉铝箔包装材料有限公司 | Device for separating medicinal blister aluminum plastic by using high voltage electrostatic way, and separation method |
| CN214160053U (en) * | 2020-12-15 | 2021-09-10 | 无锡宝德金装备科技有限公司 | Silicon wafer cutting waste residue charge separator |
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| SE01 | Entry into force of request for substantive examination | ||
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