CN112543581A - Heat radiator - Google Patents
Heat radiator Download PDFInfo
- Publication number
- CN112543581A CN112543581A CN202011296154.1A CN202011296154A CN112543581A CN 112543581 A CN112543581 A CN 112543581A CN 202011296154 A CN202011296154 A CN 202011296154A CN 112543581 A CN112543581 A CN 112543581A
- Authority
- CN
- China
- Prior art keywords
- heat
- radiator
- fan
- heat sink
- heat dissipation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000017525 heat dissipation Effects 0.000 claims abstract description 25
- 238000010438 heat treatment Methods 0.000 claims abstract description 11
- 238000001816 cooling Methods 0.000 abstract description 8
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 230000000694 effects Effects 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000001788 irregular Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
本发明提供了一种散热装置，设置于一主板上，其中，包括：散热风机，设置于所述主板上；散热器，设置于所述主板上且一侧与所述主板上的发热器件贴合，所述散热器分别配置于所述风机的进风口及出风口处，使所述散热器与所述散热风机之间形成一散热排风通道。其技术方案的有益效果在于，通过散热风机的旋转，一侧空气形成负压，由于散热器的端面与风机进出口面紧贴，使得冷空气从一侧散热器端面孔中进入，通过风机，经另一侧散热器排出，带走发热元件传导到散热器上的热量，提高了散热效率，有效利用了空间。
The present invention provides a heat dissipation device, which is arranged on a mainboard, which includes: a cooling fan, arranged on the mainboard; In combination, the radiator is respectively arranged at the air inlet and the air outlet of the fan, so that a heat dissipation and exhaust air passage is formed between the radiator and the heat dissipation fan. The beneficial effect of the technical solution is that, through the rotation of the cooling fan, the air on one side forms a negative pressure, and because the end face of the radiator is closely attached to the inlet and outlet surfaces of the fan, the cold air enters from the end hole of the radiator on one side, and passes through the fan. It is discharged through the radiator on the other side to take away the heat conducted by the heating element to the radiator, which improves the heat dissipation efficiency and effectively utilizes the space.
Description
Technical Field
The invention relates to the technical field of heat dissipation of electronic equipment, in particular to a heat dissipation device.
Background
With the development of society, people have higher and higher requirements on electronic products, and the trend is that the size is small and the price is low. Generally, electronic products have heating elements therein, and the smaller the volume of the product, the higher the requirement for heat dissipation of internal elements. The prior art basically fixes a heat radiation fan at one side of a radiator as shown in figure 1, and the method has the disadvantages that: the utilization ratio of cooling fan is little, and radiating efficiency is not high, and the product is bulky, and the increase of radiator number is not directly proportional with the radiating effect in addition, and irregular arrangement can influence whole heat abstractor's radiating effect on the contrary.
Disclosure of Invention
The radiator aims at the problems that the existing radiator is not high in radiating efficiency and low in utilization rate of a radiating fan. The radiator effectively improves the utilization rate of the fan, improves the heat dissipation efficiency and effectively utilizes the space.
The method specifically comprises the following steps:
a heat dissipation device is disposed on a motherboard, comprising:
the heat dissipation fan is arranged on the main board;
the radiator is arranged on the mainboard, one side of the radiator is attached to the heating device on the mainboard, and the radiator is respectively arranged at the air inlet and the air outlet of the fan, so that a radiating and air exhausting channel is formed between the radiator and the radiating fan.
Preferably, the end faces of the inlet and outlet ports of the radiator are kept flush.
Preferably, the heat sink includes:
a body having a heat dissipation conduit;
the upper part of the body is provided with a radiating fin which protrudes outwards;
the outer side wall formed by the radiating fins and the body is attached to the heating device.
Preferably, the width of the heat dissipation fin is greater than the width of the heat generating device.
Preferably, a plurality of pipelines which are sealed at the periphery and are communicated at two ends are arranged in the body from top to bottom.
Preferably, the body is provided with a corresponding fixing hole corresponding to the fixing position of the heating device, so as to be matched with the heating device for fixing.
Preferably, the bottom of the radiator is provided with a fixing structure matched and fixed with the main board, so that the radiator is fixed on the main board.
Preferably, the cross section of the radiator is T-shaped.
Preferably, the heat sink is an integrally formed structure.
Preferably, the height of the radiator is consistent with that of the fan.
The technical scheme has the following advantages or beneficial effects: through cooling fan's rotation, one side air forms the negative pressure, because the terminal surface of radiator is imported and exported the face with the fan and is hugged closely for cold air gets into from one side radiator end face hole, through the fan, discharges through opposite side radiator, takes away the heat that heating element conducted on the radiator, has improved the radiating efficiency, has effectively utilized the space.
Drawings
FIG. 1 is a schematic diagram of a prior art heat sink of the background art of the present invention;
FIG. 2 is a schematic structural diagram of an embodiment of a heat dissipation device in the present invention;
fig. 3 is an exploded view of an embodiment of a heat dissipation device of the present invention.
The above reference numerals denote:
1. a main board; 3. a heat radiation fan; 2. a heat sink; 4. a heat generating device; 21. a body; 22. a heat dissipating fin; 23. a heat dissipation pipeline.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the embodiments and features of the embodiments may be combined with each other without conflict.
The invention is further described with reference to the following drawings and specific examples, which are not intended to be limiting.
The method specifically comprises the following steps:
as shown in fig. 2, an embodiment of a heat dissipation device is disposed on a motherboard 1, and includes:
the cooling fan 3 is arranged on the mainboard 1;
the radiator 2 is arranged on the mainboard 1, one side of the radiator is attached to the heating device 4 on the mainboard 1, and the radiator 2 is respectively arranged at the air inlet and the air outlet of the fan, so that a radiating and air exhausting channel is formed between the radiator 2 and the radiating fan 3.
Aiming at the problems that the heat dissipation efficiency of the heat dissipaters 2 in the prior art is not high in actual work, and the number of the heat dissipaters 2 is simply increased and the heat dissipation efficiency is not in direct proportion, a plurality of heat dissipaters 2 are configured, so that the problem that the heat dissipation is interfered mutually and the heat dissipation effect is reduced is solved.
According to the technical scheme, the radiators 2 are respectively arranged on the end faces of the air inlets and the air outlets of the radiating fans 3, when the equipment works, air on one side forms negative pressure through rotation of the radiating fans 3, and cold air enters from the end face holes of the radiators 2 on one side and is exhausted from the radiators 2 on the other side through the fans due to the fact that the end faces of the radiators 2 are tightly attached to the inlet and the outlet faces of the fans, so that heat conducted to the radiators 2 by heating elements is taken away through the fans, radiating efficiency is improved, space is effectively utilized, and even if the number of the radiators 2 is increased, as long as an air exhaust channel is formed between the radiators 2 and the radiating fans 3, stable improvement of radiating effect can be guaranteed, and the.
In a preferred embodiment, the end faces of the inlet and outlet ports of the radiator 2 are kept flush.
Among the above-mentioned technical scheme, keep keeping closely laminating that can guarantee radiator 2 and cooling fan 3 through the terminal surface to make the ventilation efficiency of heat dissipation exhaust passage higher, thereby further improve the radiating efficiency of real equipment.
In a preferred embodiment, as shown in fig. 3, the heat sink 2 comprises:
a body 21 having a heat dissipation duct 23;
heat radiating fins 22 protruding outwards are arranged at the upper part of the body 21, wherein the heat radiating fins 22 are arranged at two opposite sides of the body;
the outer side wall formed by the heat radiating fin 22 and the body 21 is attached to the heat generating device 4.
In a preferred embodiment, the width of the heat-dissipating fins 22 is greater than the width of the heat-generating device 4.
In a preferred embodiment, a plurality of pipes with closed periphery and two communicated ends are arranged in the body 21 from top to bottom.
In a preferred embodiment, the body 21 is provided with corresponding fixing holes corresponding to the fixing positions of the heat generating device 4, so as to be fixed by matching with the heat generating device 4.
In a preferred embodiment, the bottom of the heat sink 2 is provided with a fixing structure for fixing the heat sink 2 to the motherboard 1.
In the above technical solution, the heat sink 2 can be made of metal material, such as aluminum or copper material.
In a preferred embodiment, the cross-section of the heat sink 2 is T-shaped.
In a preferred embodiment, the heat sink 2 is of one-piece construction.
In a preferred embodiment, the height of the radiator 2 is equal to the height of the fan.
Among the above-mentioned technical scheme, radiator 2 can dispose a plurality ofly on mainboard 1, only need to guarantee to form the heat dissipation air exhaust passageway between radiator 2 and the cooling blower 3, can be in order to guarantee whole cooling system's high efficiency operation.
While the invention has been described with reference to a preferred embodiment, it will be understood by those skilled in the art that various changes in form and detail may be made therein without departing from the spirit and scope of the invention.
Claims (10)
1. The utility model provides a heat abstractor, sets up on a mainboard, its characterized in that includes:
the heat dissipation fan is arranged on the main board;
the radiator is arranged on the mainboard, one side of the radiator is attached to the heating device on the mainboard, and the radiator is respectively arranged at the air inlet and the air outlet of the fan, so that a radiating and air exhausting channel is formed between the radiator and the radiating fan.
2. The heat dissipating device of claim 1, wherein the end faces of the inlet and outlet ports of the heat sink are flush.
3. The heat sink of claim 1, wherein the heat sink comprises:
a body having a heat dissipation conduit;
the upper part of the body is provided with a radiating fin which protrudes outwards;
the outer side wall formed by the radiating fins and the body is attached to the heating device.
4. The heat dissipating device according to claim 3, wherein the width of the heat dissipating fin is larger than the width of the heat generating component.
5. The heat dissipating device of claim 3, wherein the body has a plurality of ducts from top to bottom, the ducts being closed at the periphery and communicating at the two ends.
6. The heat sink as claimed in claim 3, wherein the body has a corresponding fixing hole corresponding to the fixing position of the heat generating device for fixing with the heat generating device.
7. The heat dissipating device of claim 1, wherein the bottom of the heat sink is provided with a fixing structure for fixing the heat sink to the motherboard.
8. The heat dissipating device of claim 1, wherein the cross-section of the heat sink is T-shaped.
9. The heat dissipating device of claim 1, wherein the heat sink is a unitary structure.
10. The heat dissipating device of claim 1, wherein the height of the heat sink is consistent with the height of the fan.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011296154.1A CN112543581B (en) | 2020-11-18 | 2020-11-18 | A heat dissipation device |
| PCT/CN2021/110159 WO2022105305A1 (en) | 2020-11-18 | 2021-08-02 | Heat dissipation apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011296154.1A CN112543581B (en) | 2020-11-18 | 2020-11-18 | A heat dissipation device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112543581A true CN112543581A (en) | 2021-03-23 |
| CN112543581B CN112543581B (en) | 2025-02-25 |
Family
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011296154.1A Active CN112543581B (en) | 2020-11-18 | 2020-11-18 | A heat dissipation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112543581B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022105305A1 (en) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技（上海）有限公司 | Heat dissipation apparatus |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102684524A (en) * | 2011-11-08 | 2012-09-19 | 纽福克斯光电科技（上海）有限公司 | High-efficiency inversion device |
| CN203504446U (en) * | 2013-09-03 | 2014-03-26 | 特变电工新疆新能源股份有限公司 | Novel heat radiation structure of photovoltaic inverter |
| CN203537217U (en) * | 2013-09-13 | 2014-04-09 | 特变电工新疆新能源股份有限公司 | Heat dissipation structure of outdoor inverter cabinet |
| US20150245536A1 (en) * | 2014-02-21 | 2015-08-27 | Lenovo (Beijing) Co., Ltd. | Heat Dissipating Device And Electronic Apparatus |
| CN214206198U (en) * | 2020-11-18 | 2021-09-14 | 纽福克斯光电科技（上海）有限公司 | Heat radiator |
-
2020
- 2020-11-18 CN CN202011296154.1A patent/CN112543581B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102684524A (en) * | 2011-11-08 | 2012-09-19 | 纽福克斯光电科技（上海）有限公司 | High-efficiency inversion device |
| CN203504446U (en) * | 2013-09-03 | 2014-03-26 | 特变电工新疆新能源股份有限公司 | Novel heat radiation structure of photovoltaic inverter |
| CN203537217U (en) * | 2013-09-13 | 2014-04-09 | 特变电工新疆新能源股份有限公司 | Heat dissipation structure of outdoor inverter cabinet |
| US20150245536A1 (en) * | 2014-02-21 | 2015-08-27 | Lenovo (Beijing) Co., Ltd. | Heat Dissipating Device And Electronic Apparatus |
| CN214206198U (en) * | 2020-11-18 | 2021-09-14 | 纽福克斯光电科技（上海）有限公司 | Heat radiator |
Non-Patent Citations (1)
| Title |
|---|
| 孟祥冬;: "一种新型半导体散热装置的设计", 科技视界, no. 08, 15 March 2018 (2018-03-15) * |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022105305A1 (en) * | 2020-11-18 | 2022-05-27 | 纽福克斯光电科技（上海）有限公司 | Heat dissipation apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112543581B (en) | 2025-02-25 |
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