CN112541881B - Failure analysis method and system for electronic equipment - Google Patents
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- CN112541881B CN112541881B CN201910838290.XA CN201910838290A CN112541881B CN 112541881 B CN112541881 B CN 112541881B CN 201910838290 A CN201910838290 A CN 201910838290A CN 112541881 B CN112541881 B CN 112541881B
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- 238000004458 analytical method Methods 0.000 title claims abstract description 92
- 238000000034 method Methods 0.000 claims abstract description 59
- 238000012360 testing method Methods 0.000 claims abstract description 49
- 238000003384 imaging method Methods 0.000 claims abstract description 14
- 239000000463 material Substances 0.000 claims description 24
- 230000006870 function Effects 0.000 claims description 20
- 238000007689 inspection Methods 0.000 claims description 9
- 238000012795 verification Methods 0.000 claims description 7
- 230000007547 defect Effects 0.000 claims description 6
- 238000001514 detection method Methods 0.000 claims description 6
- 230000002159 abnormal effect Effects 0.000 claims description 4
- 230000005856 abnormality Effects 0.000 claims description 4
- 238000013500 data storage Methods 0.000 claims description 4
- 230000003287 optical effect Effects 0.000 claims description 3
- 238000002474 experimental method Methods 0.000 claims description 2
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 15
- 238000012790 confirmation Methods 0.000 description 6
- 230000003993 interaction Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 238000010586 diagram Methods 0.000 description 4
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- 238000012552 review Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 208000032767 Device breakage Diseases 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
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- 238000012545 processing Methods 0.000 description 1
- 238000013102 re-test Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
- G06T7/001—Industrial image inspection using an image reference approach
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/24—Arrangements for testing
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30164—Workpiece; Machine component
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Abstract
An electronic equipment failure analysis method and system are used for analyzing the functional failure reasons of electronic equipment, and the method comprises the following steps: establishing a total database, wherein the total database comprises a first database, test data of the electronic equipment to be analyzed are stored in the first database, and the test data comprise the serial numbers, test names, test instructions, related devices to be tested and failure records in the test process of the electronic equipment to be analyzed; an imaging display step, namely imaging devices related to the failure phenomenon according to test data corresponding to the failure record, and generating and displaying a corresponding first picture, wherein the first picture comprises related devices and signal receiving and transmitting conditions among the related devices; and a failure reason checking step, namely judging the failure reason of the electronic equipment to be analyzed, and displaying the device causing the failure phenomenon in the first picture according to the failure reason.
Description
Technical Field
The present invention relates to a method and a system for analyzing failure of an electronic device, and in particular, to a method and a system for analyzing failure of an electronic device based on big data and image processing.
Background
In the existing electronic devices, such as mobile phones, failure phenomena often occur in the production, manufacturing or maintenance process, for example, a touch screen, a loudspeaker, a microphone, a camera and the like fail to cause corresponding functional failures, so that a user needs to perform cause analysis on the failure phenomena of the electronic devices so as to solve the failure problem in time.
Disclosure of Invention
In view of the foregoing, it is desirable to provide an electronic device failure analysis system that can automatically check the cause of its failure.
In addition, it is necessary to provide a failure analysis method of the electronic device corresponding to the system.
A failure analysis method for analyzing a cause of a functional failure of an electronic device, the method comprising:
Establishing a total database, wherein the total database comprises a first database, test data of the electronic equipment to be analyzed are stored in the first database, and the test data comprise the serial numbers, test names, test instructions, related devices to be tested and failure records in the test process of the electronic equipment to be analyzed;
An imaging display step, namely imaging devices related to the failure phenomenon according to test data corresponding to the failure record, and generating and displaying a corresponding first picture, wherein the first picture comprises related devices and signal receiving and transmitting conditions among the related devices; and
And a failure reason checking step, namely judging the failure reason of the electronic equipment to be analyzed, and displaying a device causing the failure phenomenon in the first picture according to the failure reason.
A failure analysis system for analyzing causes of a functional failure of an electronic device, the causes of the failure including process failure, appearance failure, and other failures, the system comprising:
The system comprises a total database, a first data storage unit and a second data storage unit, wherein the total database comprises a first database, test data of electronic equipment to be analyzed is stored in the first database, and the test data comprises the serial numbers of the electronic equipment to be analyzed, test names, test instructions, related devices to be tested and failure records in the test process;
The imaging display module is used for imaging devices related to the failure phenomenon according to the test data corresponding to the failure record, and generating and displaying a corresponding first picture, wherein the first picture comprises the related devices and the signal receiving and transmitting conditions among the related devices; and
And the failure reason checking module is used for judging the failure reason of the electronic equipment to be analyzed and displaying the device causing the failure phenomenon in the first picture according to the failure reason.
The failure analysis system and the failure analysis method can automatically check the failure reason when the electronic equipment fails, and are beneficial to quickly solving the failure problem.
Drawings
FIG. 1 is a functional block diagram of a failure analysis apparatus according to a preferred embodiment of the present invention.
FIG. 2 is a functional block diagram of a failure analysis system according to a preferred embodiment of the present invention.
Fig. 3 is a schematic diagram of a first picture according to a preferred embodiment of the invention.
Fig. 4 is a schematic diagram showing the probability of defective display device in the preferred embodiment of the present invention.
FIG. 5 is a flow chart of a failure analysis method according to a preferred embodiment of the present invention.
Description of the main reference signs
The invention will be further described in the following detailed description in conjunction with the above-described figures.
Detailed Description
Referring to fig. 1, a failure analysis apparatus 1 according to a preferred embodiment of the present invention is used for performing failure analysis on a failure phenomenon of an electronic device during production, manufacturing, or maintenance of the electronic device, so as to find a failure cause. The electronic device may be a mobile phone, and the failure phenomenon is defined as that some or some functions of the mobile phone cannot be used normally, for example, a touch screen, a loudspeaker, a microphone, a camera and the like are failed to cause corresponding functional failures. The failure analysis apparatus 1 is equipped with and operates a failure analysis system 10 (shown in fig. 2). The failure analysis apparatus 1 may be a computer. In the preferred embodiment, the failure causes include a poor process, poor appearance and other defects, where the poor process is defined as defects in the manufacturing process of the electronic device, such as empty soldering, tin connection, etc., for example, the poor appearance of the material is located as defects in the appearance of the device (such as touch screen, speaker, microphone, camera, etc.) of the electronic device, such as device breakage, functional failure of some part of the device, etc., and other defects are defined as other defects not being poor in the process and poor appearance of the material, such as software design errors, etc.
The failure analysis apparatus 1 further comprises a display 11, a memory 13 and a processor 15. The display 11 is used for displaying data or pictures during analysis. The memory 13 may be built in the failure analysis apparatus 1, or may be a separate external memory card, such as an SM card (SMART MEDIA CARD ), an SD card (Secure DIGITAL CARD, secure digital card), or the like. The memory 13 is configured to store various data and program codes, such as the failure analysis system 10, and the memory 13 further includes a total database 131, where the total database 131 includes a first database 131a, a second database 131b, a third database 131c, and a fourth database 131d. The first database 131a stores test data of the electronic device to be analyzed, where the test data includes the serial number, the test name, the test instruction, the device related to the test, and the failure record occurring in the test process of the electronic device to be analyzed. The second database 131b stores a second picture of the electronic device to be analyzed and the electronic device with normal function, which have failure phenomenon, when performing X-ray detection, where the second picture is used to display the status of tin points of the motherboard of the electronic device, for example, whether there are bad tin points, continuous tin, empty tin, and the like. The third database 131c stores third pictures taken during automatic optical detection of the electronic device to be analyzed and the electronic device with normal functions, where the third pictures are used for displaying appearance conditions of devices of the electronic device, for example, whether a display screen is damaged. The fourth database 131d stores all failure analysis data, including failure phenomena, analysis steps, and corresponding analysis results. It will be appreciated that the first database 131a, the second database 131b, the third database 131c, and the fourth database 131d may be stored in other devices, such as a server, respectively, so long as the failure analysis system 10 can access and obtain the required data. The processor 15 is configured to execute an operating system and applications in the failure analysis apparatus 1, for example, to execute the failure analysis system 10 described above.
Referring to fig. 2, the failure analysis system 10 mainly includes a failure phenomenon confirmation module 101, an imaging display module 102, a process failure checking module 103, a material appearance checking module 104, an experiment verification analysis module 105, an auxiliary analysis module 106, and an interaction module 107.
The failure phenomenon confirmation module 101 is configured to determine whether a failure phenomenon exists in the electronic device to be analyzed, obtain test data of the electronic device to be analyzed from the first database 131a, extract a failure record therein, send a corresponding test instruction to the electronic device to be analyzed according to the extracted failure record, and confirm whether the failure phenomenon exists in the electronic device to be analyzed again, and if the failure phenomenon exists again, determine that the failure phenomenon exists in the electronic device to be analyzed.
The imaging display module 102 is configured to image a device related to the failure phenomenon according to test data corresponding to the failure record, and generate and display a corresponding first picture, where the first picture includes the related device and a signal receiving and transmitting condition between the related devices. In the preferred embodiment, as shown in fig. 3, the related devices are a device a, a device B and a device C, and the devices a, B and C can mutually send and receive signals. The relevant devices include all relevant physical parts of ICs, resistors, capacitors, inductors, traces of circuit boards, etc.
The process failure checking module 103 is configured to determine whether the electronic device to be analyzed has a process failure, and if so, display a device with a process failure in the first picture. In the preferred embodiment, the process failure checking module 103 obtains a second picture of the electronic device to be analyzed having a failure phenomenon from the second database 131b, compares the second picture with a second picture of the electronic device having a normal function, and determines that the electronic device to be analyzed has no process failure when the difference between the two pictures is within a preset range; when the difference between the two is beyond the preset range, judging that the electronic equipment to be analyzed has bad process. For example, when the electronic device to be analyzed has a bad tin spot, it is determined that there is a bad process, where the bad tin spot includes a tin spot size exceeding a preset size, a tin spot brightness exceeding a preset brightness, and a tin spot not being normally connected. It can be appreciated that the process failure checking module 103 can compare the second picture of the electronic device to be analyzed with the second picture of the electronic device with normal function by using the image recognition technology.
The material appearance checking module 104 is configured to determine whether the electronic device to be analyzed has a poor appearance, and if the electronic device has a poor appearance, display a device with a poor appearance in the first picture. In the preferred embodiment, the material appearance inspection module 104 obtains the third picture of the electronic device to be analyzed and the third picture of the electronic device with normal function from the third database 131c, and determines that the electronic device to be analyzed has no poor material appearance when the difference between the two pictures is within the preset range; and when the difference between the two is beyond the preset range, judging that the electronic equipment to be analyzed has poor appearance of the material. The preset range may be the number of device breaks, for example, 1. It can be appreciated that the material appearance inspection module 104 can compare the third pictures of the electronic device to be analyzed and the electronic device with normal functions by using an image recognition technology.
It can be understood that the process failure checking module 103 and the material appearance checking module 104 may be collectively referred to as a failure cause checking module, and are configured to determine a failure cause of the electronic device to be analyzed, and display a device that causes a failure phenomenon in the first picture according to the failure cause.
The experimental verification analysis module 105 is configured to calculate, when it is determined that the electronic device to be analyzed has no process failure and no appearance failure, a probability of abnormality occurrence of each device in all relevant devices according to the same failure phenomenon and the corresponding analysis result stored in the fourth database 131d, and display the probability to the first picture. The user can verify and search for the abnormal device according to the probability. Referring to fig. 4, in the preferred embodiment, the probability of failure of device a, device B, and device C is 50%, 20%, and 30%. Based on the probability of failure, the user may review device a with priority, and therefore, the experimental verification analysis module 105 may assist in manually analyzing the cause of failure.
The auxiliary analysis module 106 is configured to obtain and display analysis steps and analysis results corresponding to the same failure phenomena, which are stored in the fourth database 131d and belong to other failures, so as to provide a reference basis for analysis of the user. After the user analysis is finished, the auxiliary analysis module 106 may store the analysis result in the fourth database 131d to enrich the analysis data of the fourth database 131 d.
The interaction module 107 is configured to implement an information interaction function between the failure analysis system 10 and a user, for example, receive a number of an electronic device to be analyzed input by the user, so that the failure phenomenon confirmation module 101 obtains test data of the electronic device to be analyzed from the first database 131a according to the number, and receive an analysis result of the user.
As shown in FIG. 5, a flow chart of a preferred implementation of the failure analysis method of the present invention is shown. The method is applied to the failure analysis apparatus 1 mounted with the failure analysis system 10, and includes the following steps.
In step 301, the interaction module 107 receives a number of the electronic device to be analyzed input by a user.
In step 302, the failure phenomenon confirmation module 101 determines whether a failure phenomenon exists in the electronic device to be analyzed, the failure phenomenon confirmation module 101 obtains test data of the electronic device to be analyzed from the first database 131a according to the serial number of the electronic device to be analyzed, extracts a failure record therein, sends a corresponding test instruction to the electronic device to be analyzed according to the extracted failure record, and confirms whether the failure phenomenon appears again in the electronic device to be analyzed, if the failure phenomenon appears again, the electronic device to be analyzed is determined to have the failure phenomenon, and the step 304 is entered, and if the failure phenomenon does not appear again, the electronic device to be analyzed is determined to have the failure phenomenon, and the step 303 is entered.
It can be appreciated that the step 302 may be omitted, and it is determined whether there is a failure phenomenon directly according to the failure record obtained from the first database 131a, if there is a failure record, it is determined that there is a failure phenomenon, the step 304 is entered, and if there is no failure record, it is determined that there is no failure phenomenon, the step 303 is entered.
In step 303, the failure event confirmation module 101 displays that there is no failure event and prompts the user to retest.
In step 304, the imaging display module 102 images the devices related to the failure phenomenon according to the test data corresponding to the failure record, and generates and displays a corresponding first picture, where the first picture includes the related devices and the signal receiving and transmitting conditions between the related devices. In the preferred embodiment, as shown in fig. 3, the related devices are a device a, a device B and a device C, and the devices a, B and C can mutually send and receive signals. The relevant devices include all relevant physical parts of ICs, resistors, capacitors, inductors, traces of circuit boards, etc.
In step 305, the process failure checking module 103 determines whether the electronic device to be analyzed has a process failure, if so, the process proceeds to step 306, and if not, the process proceeds to step 307. In the preferred embodiment, the process failure checking module 103 obtains a second picture of the electronic device to be analyzed having a failure phenomenon from the second database 131b, compares the second picture with a second picture of the electronic device having a normal function, and determines that the electronic device to be analyzed has no process failure when the difference between the two pictures is within a preset range; when the difference between the two is beyond the preset range, judging that the electronic equipment to be analyzed has bad process. For example, when the electronic device to be analyzed has a bad tin spot, it is determined that there is a bad process, where the bad tin spot includes a tin spot size exceeding a preset size, a tin spot brightness exceeding a preset brightness, and a tin spot not being normally connected. It can be appreciated that the process failure checking module 103 can compare the second picture of the electronic device to be analyzed with the second picture of the electronic device with normal function by using the image recognition technology.
In step 306, the bad process check module 103 displays the device with bad process in the first picture.
In step 307, the material appearance inspection module 104 determines whether the electronic device to be analyzed has a bad appearance, if so, it proceeds to step 308, and if not, it proceeds to step 309. In the preferred embodiment, the material appearance inspection module 104 obtains the third pictures of the electronic device to be analyzed and the electronic device with normal functions from the third database 131c for comparison, and when the difference between the third pictures is within a preset range, it is determined that the electronic device to be analyzed has no poor material appearance; and when the difference between the two is beyond the preset range, judging that the electronic equipment to be analyzed has poor appearance of the material. The preset range may be the number of device breaks, for example, 1. It can be appreciated that the material appearance inspection module 104 can compare the third pictures of the electronic device to be analyzed and the electronic device with normal functions by using an image recognition technology.
In step 308, the material appearance inspection module 104 displays devices with poor appearance in the first picture.
It can be understood that the steps 304 to 308 may be collectively referred to as a failure cause checking step, determine a failure cause of the electronic device to be analyzed, and display a device causing the failure phenomenon in the first picture according to the failure cause.
In step 309, when it is determined that the electronic device to be analyzed has no process failure and no appearance failure, the experimental verification analysis module 105 calculates the probability of abnormality of each device in all relevant devices according to the same failure phenomenon and the corresponding analysis result stored in the fourth database 131 d.
In step 310, the imaging display module 102 displays the probability into the first picture. The user can verify and search for the abnormal device according to the probability. Referring to fig. 4, in the preferred embodiment, the probability of failure of device a, device B, and device C is 50%, 20%, and 30%. Based on the probability of failure, the user may review device a with priority, and therefore, the experimental verification analysis module 105 may assist in manually analyzing the cause of failure.
In step 311, the interaction module 107 receives the analysis result of the user, determines whether to find the failure reason, if not, proceeds to step 312, and if so, proceeds to step 313.
In step 312, the auxiliary analysis module 106 obtains and displays the analysis steps and analysis results corresponding to the failure reasons stored in the fourth database 131d belonging to other failures, which are the same failure phenomena, so as to provide a reference basis for the analysis of the user. After the user analysis is finished, the auxiliary analysis module 106 stores the analysis result into the fourth database 131d to enrich the analysis data of the fourth database 131 d.
In step 313, the auxiliary analysis module 106 prompts the user for an end of analysis.
The failure analysis system 10 and the method can automatically check whether the failure cause is bad process and bad material appearance when the failure phenomenon occurs in the electronic equipment, and provide data for assisting in manually analyzing the failure cause when the failure cause of the electronic equipment is other bad.
Further, it will be apparent to those skilled in the art that various modifications, additions and substitutions in other forms and details can be made within the scope and spirit of the invention as disclosed in the accompanying claims. Of course, these various modifications, additions, substitutions and the like, which are made according to the spirit of the preferred embodiment of the present invention, are intended to be included in the scope of the present invention as claimed in the preferred embodiment of the present invention.
Claims (10)
1. A failure analysis method for analyzing a cause of a functional failure of an electronic device, the method comprising:
Establishing a total database, wherein the total database comprises a first database, test data of the electronic equipment to be analyzed are stored in the first database, and the test data comprise the serial numbers, test names, test instructions, related devices to be tested and failure records in the test process of the electronic equipment to be analyzed;
An imaging display step, namely imaging devices related to the failure phenomenon according to test data corresponding to the failure record, and generating and displaying a corresponding first picture, wherein the first picture comprises related devices and signal receiving and transmitting conditions among the related devices; and
A failure reason checking step, namely judging the failure reason of the electronic equipment to be analyzed, and displaying a device causing the failure phenomenon in the first picture according to the failure reason; the failure cause checking step comprises a process failure checking step, wherein the process failure checking step judges whether the electronic equipment to be analyzed has a process failure or not, and if the electronic equipment to be analyzed has the process failure, the device with the process failure in the first picture is displayed;
the total database further comprises a second database, and the second database stores second pictures of the electronic equipment to be analyzed with failure phenomenon and the electronic equipment with normal functions in X-ray detection; the process failure checking step includes:
acquiring a second picture of the electronic equipment to be analyzed, which has a failure phenomenon, from the second database, comparing the second picture with a second picture of the electronic equipment with normal functions, and judging that the electronic equipment to be analyzed has no bad process when the difference between the second picture and the second picture is within a preset range; when the difference between the two is beyond the preset range, judging that the electronic equipment to be analyzed has bad process;
The total database further comprises a fourth database, wherein the fourth database stores all failure analysis data, and the failure analysis data comprises failure phenomena and corresponding analysis results;
An experiment verification analysis step, when judging that the electronic equipment to be analyzed has no bad process and appearance, calculating the probability of abnormality of each device in all related devices according to the same failure phenomenon and the corresponding analysis result stored in the fourth database, and displaying the probability into the first picture; and
And verifying and searching for the abnormal device according to the probability.
2. The failure analysis method according to claim 1, wherein: the method further comprises, prior to the step of imagewise displaying:
And judging whether the electronic equipment to be analyzed has a failure phenomenon or not, acquiring test data of the electronic equipment to be analyzed from a first database, extracting failure records in the test data, sending a corresponding test instruction to the electronic equipment to be analyzed according to the extracted failure records, confirming whether the electronic equipment to be analyzed has the failure phenomenon again, and judging that the electronic equipment to be analyzed has the failure phenomenon if the electronic equipment to be analyzed has the failure phenomenon again.
3. The failure analysis method according to claim 1, wherein: the failure cause checking step further includes:
And a material appearance checking step, namely judging whether the electronic equipment to be analyzed has poor appearance, and if so, displaying the device with poor appearance in the first picture.
4. A failure analysis method according to claim 3, wherein: the total database further comprises a third database, and the third database stores third pictures shot when the electronic equipment to be analyzed and the electronic equipment with normal functions perform automatic optical detection; the material appearance inspection step comprises the following steps:
Obtaining third pictures of the electronic equipment to be analyzed and the electronic equipment with normal functions from the third database for comparison, and judging that the electronic equipment to be analyzed has no poor appearance of materials when the difference between the third pictures is within a preset range; and when the difference between the two is beyond the preset range, judging that the electronic equipment to be analyzed has poor appearance of the material.
5. The failure analysis method according to claim 1, wherein: the analysis data further includes an analysis step, the method further including:
And an auxiliary analysis step, namely acquiring and displaying analysis steps and analysis results corresponding to the same failure phenomena, wherein the failure reasons stored in the fourth database belong to other failures.
6. A failure analysis system for analyzing a cause of a functional failure of an electronic device, the system comprising:
The system comprises a total database, a first data storage unit and a second data storage unit, wherein the total database comprises a first database, test data of electronic equipment to be analyzed is stored in the first database, and the test data comprises the serial numbers of the electronic equipment to be analyzed, test names, test instructions, related devices to be tested and failure records in the test process;
The imaging display module is used for imaging devices related to the failure phenomenon according to the test data corresponding to the failure record, and generating and displaying a corresponding first picture, wherein the first picture comprises related devices and signal receiving and transmitting conditions among the related devices; and
The failure reason checking module is used for judging the failure reason of the electronic equipment to be analyzed and displaying a device causing the failure phenomenon in the first picture according to the failure reason;
The defect checking module is used for judging whether the electronic equipment to be analyzed has poor process, and if so, displaying a device with poor process in the first picture;
The total database further comprises a second database, and the second database stores second pictures of the electronic equipment to be analyzed with failure phenomenon and the electronic equipment with normal functions in X-ray detection; the process failure checking module is used for acquiring a first picture of the electronic equipment to be analyzed with failure phenomenon from the second database, comparing the first picture with a first picture of the electronic equipment with normal functions, and judging that the electronic equipment to be analyzed has no process failure when the difference between the first picture and the first picture is within a preset range; when the difference between the two is beyond the preset range, judging that the electronic equipment to be analyzed has bad process;
The total database further comprises a fourth database, wherein the fourth database stores all failure analysis data, and the failure analysis data comprises failure phenomena and corresponding analysis results;
The experimental verification analysis module is used for calculating the probability of abnormality of each device in all related devices according to the same failure phenomenon and the corresponding analysis result stored in the fourth database when judging that the electronic equipment to be analyzed is not poor in process and poor in appearance, and displaying the probability into the first picture; and
And verifying and searching for the abnormal device according to the probability.
7. The failure analysis system of claim 6, wherein: the system further comprises:
The failure phenomenon confirming module is used for obtaining test data of the electronic equipment to be analyzed from the first database, extracting failure records in the test data, sending corresponding test instructions to the electronic equipment to be analyzed according to the extracted failure records, confirming whether the electronic equipment to be analyzed has the failure phenomenon again, and judging that the electronic equipment to be analyzed has the failure phenomenon if the failure phenomenon occurs again.
8. The failure analysis system of claim 6, wherein: the failure cause inspection module further includes:
And the material appearance checking module is used for judging whether the electronic equipment to be analyzed has poor appearance, and if so, displaying the device with poor appearance in the first picture.
9. The failure analysis system of claim 8, wherein: the total database further comprises a third database, and the third database stores third pictures shot when the electronic equipment to be analyzed and the electronic equipment with normal functions perform automatic optical detection; the material appearance inspection module acquires a third picture of the electronic equipment to be analyzed and the electronic equipment with normal functions from the third database for comparison, and judges that the electronic equipment to be analyzed has no poor material appearance when the difference between the electronic equipment to be analyzed and the third picture is within a preset range; and when the difference between the two is beyond the preset range, judging that the electronic equipment to be analyzed has poor appearance of the material.
10. The failure analysis system of claim 6, wherein: the analysis data further includes an analysis step, the system further including:
The auxiliary analysis module is used for acquiring and displaying analysis steps and analysis results corresponding to failure reasons stored in the fourth database and other failures and the same failure phenomena.
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| CN201910838290.XA CN112541881B (en) | 2019-09-05 | 2019-09-05 | Failure analysis method and system for electronic equipment |
| TW108140845A TWI816932B (en) | 2019-09-05 | 2019-11-11 | Failure analyzing method and system for electronic device |
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| CN201910838290.XA CN112541881B (en) | 2019-09-05 | 2019-09-05 | Failure analysis method and system for electronic equipment |
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| EP2434453A2 (en) * | 2010-09-24 | 2012-03-28 | Renesas Electronics Corporation | Method, apparatus and program for processing a contrast picture image of a semiconductor element |
| CN109239577A (en) * | 2018-09-06 | 2019-01-18 | 国营芜湖机械厂 | A kind of on-board circuitry plate Fault Quick Diagnosis method |
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| EP2434453A2 (en) * | 2010-09-24 | 2012-03-28 | Renesas Electronics Corporation | Method, apparatus and program for processing a contrast picture image of a semiconductor element |
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Also Published As
| Publication number | Publication date |
|---|---|
| TWI816932B (en) | 2023-10-01 |
| TW202111530A (en) | 2021-03-16 |
| CN112541881A (en) | 2021-03-23 |
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