CN112526810B

CN112526810B - Laser projection device

Info

Publication number: CN112526810B
Application number: CN201910888578.8A
Authority: CN
Inventors: 崔雷; 邢哲
Original assignee: Qingdao Hisense Laser Display Co Ltd
Current assignee: Qingdao Hisense Laser Display Co Ltd
Priority date: 2019-09-19
Filing date: 2019-09-19
Publication date: 2022-10-14
Anticipated expiration: 2039-09-19
Also published as: CN112526810A

Abstract

The invention provides laser projection equipment, which comprises a laser light source, an optical machine and a lens, wherein the optical machine is arranged on the laser light source; the laser light source shell is provided with a red laser component, a blue laser component and a green laser component; the back of the red laser component is attached with a cold head and radiates heat through a cold row; the back surfaces of the blue laser assembly and the green laser assembly are attached to one surface of the heat conduction cavity plate, the other surface of the heat conduction cavity plate is connected with a plurality of heat pipes, and the heat pipes extend into the heat dissipation fins; the airflow of the first fan flows through the cold air exhaust and then is blown to the optical machine and the circuit board in sequence; the airflow of the second fan blows to the lens and the circuit board in sequence after flowing through the radiating fins, and the laser projection equipment can give consideration to efficient heat dissipation and size miniaturization.

Description

Laser projection device

Technical Field

The invention relates to the technical field of laser projection display, in particular to laser projection equipment.

Background

The laser source has the advantages of good monochromaticity, high brightness, long service life and the like, and is an ideal light source. With the increase of the power of laser devices, the laser devices have been used as light sources for illumination to meet the requirements of industrial applications. For example, in recent years, a laser is used as a projection light source in a projection apparatus, instead of mercury lamp illumination, and the laser also has advantages of a small etendue and high brightness compared to an LED light source.

The laser projection display technology adopts a high-power semiconductor laser to convert electric energy into light energy, and is an optical display technology for projecting laser pictures by projecting laser onto a screen through an optical path system, a circuit system and a lens system.

In a laser light source, a semiconductor laser converts electric energy into light energy, the light power efficiency can be about 40%, and 60% of electric energy is converted into heat energy. As the temperature of the laser rises, the luminous efficiency of the laser gradually decreases, so that the temperature control of the laser is important for the normal operation of the laser.

For an RGB full-color light source, the light source is composed of lasers of three colors, and on one hand, because the thermal power of the lasers is relatively high, and on the other hand, the lasers of different colors have different temperature characteristics, and usually have different temperature control requirements, a good heat dissipation system needs to be matched. However, when a light source component in a product is designed, the light source component not only needs to meet the requirement of efficient heat dissipation, but also needs to seek the reasonability and miniaturization of the product volume layout to meet the market requirement, and the high heat dissipation efficiency usually means that a heat dissipation system needs to be large and complex, which is not favorable for realizing the miniaturization of the product structure layout. For example, if use traditional forced air cooling heat dissipation, need set up a plurality of fans to the fan gear is in the high load state for a long time, has both led to the product volume to increase, and the rotational speed of fan promotes the problem that also can bring equipment noise undoubtedly, influences and uses experience.

Disclosure of Invention

The invention provides a laser projection device which can meet the requirements of high heat dissipation and small size of the laser projection device.

The invention provides a laser projection device: the laser device comprises a whole machine shell, a laser source, an optical machine and a lens which are sequentially connected along the light beam propagation direction, wherein a red laser component is arranged on one side surface of the laser source shell, and a blue laser component and a green laser component are arranged on the other side surface which is vertical to the installation side surface of the red laser component; a cold head is attached to the back of the red laser component, and heat is dissipated through a cold row; the back surfaces of the blue laser assembly and the green laser assembly are attached to one surface of the heat conduction cavity plate, the other surface of the heat conduction cavity plate is connected with a plurality of heat pipes, and the heat pipes extend into the heat dissipation fins;

a first fan is arranged corresponding to the cold row, the airflow of the first fan is blown to the optical machine and the circuit board in sequence after flowing through the cold row,

a second fan is arranged corresponding to the radiating fins, and airflow of the second fan flows through the radiating fins and then sequentially blows to the lens and the circuit board;

furthermore, a third fan is arranged at an air outlet of the whole machine and used for discharging air flow which flows through the cold air exhauster, the optical machine and the circuit board out of the whole machine shell;

furthermore, a fourth fan is arranged at the air outlet of the whole machine and used for exhausting the airflow flowing through the radiating fins, the lens and the circuit board out of the shell of the whole machine;

furthermore, the heat conduction cavity plate is provided with an inner cavity, and evaporation ends of the plurality of heat pipes are communicated with the inner cavity of the heat conduction cavity plate;

furthermore, the heat pipes are straight heat pipes and are vertical to the connecting surface of the heat conducting cavity plate;

furthermore, the heat conducting cavity plate is provided with a first heat conducting area and a second heat conducting area, the first heat conducting area and the second heat conducting area respectively correspond to the back areas of one of the blue laser assembly and the green laser assembly and the other of the blue laser assembly and the green laser assembly, and the first heat conducting area and the second heat conducting area are both connected with a plurality of heat pipes;

furthermore, the number of the radiating fins is two, and the radiating fins comprise first radiating fins and second radiating fins which are used for inserting a plurality of heat pipes arranged corresponding to the first heat conduction area and the second heat conduction area;

further, the second fan is positioned between the first heat radiating fin and the second heat radiating fin;

furthermore, a fifth fan is arranged at an air inlet of the whole machine corresponding to the radiating fins and is positioned at the upstream of the second fan;

further, the operating temperature of the red laser assembly is not higher than 50 ℃, and/or the operating temperature of the blue laser assembly and the green laser assembly is not higher than 70 ℃.

The laser projection equipment of above-mentioned one or more embodiments adopts liquid cooling and heat pipe system that changes phase to dispel the heat to laser light source simultaneously, can satisfy the operating temperature requirement that red laser instrument subassembly and blue green laser instrument subassembly are different, and laser light source is located the upper reaches of two heat dissipation routes that parallel, the heat dissipation air current can flow to the higher part of operating temperature threshold value from the part that the operating temperature threshold value is lower, can dispel the heat for a plurality of heat source parts in each heat dissipation route in proper order, can satisfy the work heat dissipation demand of a plurality of heat source parts, the complete machine radiating efficiency is high, above-mentioned laser projection equipment overall structure layout is compact simultaneously, space utilization is high.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the description of the embodiments or the prior art will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.

Fig. 1A is a schematic structural diagram of a laser projection apparatus according to an embodiment of the present invention;

FIG. 1B is a schematic view of the heat dissipation path shown in FIG. 1A;

FIG. 1C is a schematic diagram of an optical path of a laser projection apparatus according to an embodiment of the present invention;

FIG. 2A is a schematic diagram of a light source structure of the laser projection apparatus shown in FIG. 1A according to an embodiment of the present invention;

FIG. 2B is a schematic diagram of an optical path of a laser source according to an embodiment of the present invention;

FIG. 3A is a schematic diagram of an MCL laser;

FIG. 3B is a schematic view of the laser package of FIG. 3A;

FIG. 4A is a diagram of a heat dissipation system of a light source according to an embodiment of the present invention;

FIG. 4B is an exploded view of a heat dissipation system of a light source according to an embodiment of the present disclosure;

FIG. 5A is a schematic diagram of a heat dissipation system for a red laser device according to an embodiment of the present invention;

FIG. 5B is a schematic view of the cooling structure in FIG. 5A;

FIG. 6A is an exploded view of a heat removal system for blue and green laser assemblies in accordance with an embodiment of the present invention;

FIG. 6B is a cross-sectional view of a heat dissipation system according to an embodiment of the present invention;

FIG. 6C is another schematic cross-sectional view of a heat dissipation system according to an embodiment of the present invention;

fig. 7 is a schematic view of another angle of the heat dissipation path a according to the embodiment of the invention.

Description of the reference numerals:

10-a laser projection device for use in a projection system,

100-light source, 102-light source housing, 110-red laser assembly, 120-blue laser assembly, 130-green laser assembly,

1101-a collimating lens group, 1102-a metal substrate, 1103-a laser pin, 1104a, 1104b-a PCB (printed Circuit Board);

200-an optical machine;

300-a lens;

400-a circuit board;

501-a first fan, 502-a second fan, 503-a third fan, 504-a fourth fan, 505-a fifth fan;

601-cold discharge, 602-cold head, 603-pump, 604-liquid supplement device,

701 7011, 7012-radiating fins, 702, 7021, 7022-heat conducting cavity plates, 7023-outer walls and 7024-inner cavities; 703-heat pipes.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

First, the structure and operation of the laser projection apparatus according to the present embodiment will be described with reference to the laser projection apparatus shown in fig. 1A.

Fig. 1A shows a schematic structural diagram of a laser projection apparatus, where the laser projection apparatus 10 includes a whole casing (not shown), and further includes a light source 100, an optical engine 200, and a lens 300, which are assembled in the whole casing according to optical functional parts, and the optical parts are connected in sequence along a light beam propagation direction, and each optical part has a corresponding casing to wrap the optical part, so as to support the optical part and enable each optical part to meet certain sealing or airtight requirements. The optical engine 200 and the lens 300 are connected and disposed along a first direction of the whole machine, for example, the first direction may be a width direction of the whole machine, or according to a using manner, the first direction is opposite to a viewing direction of a user. The light source 100 is disposed in a space enclosed by the optical engine 200, the lens 300 and a part of the whole casing. The light source 100 is a pure three-color laser light source that emits red, blue, and green laser light. The light source 100, the optical engine 200 and the lens 300 are arranged in an L-shape.

Referring to fig. 1A, the light source 100 has a light outlet, which is a connection surface with the optical engine 200, and through the connection, the light source 100 provides an illumination beam for the optical engine 200. The optical engine 200 has a light inlet and a light outlet according to the design of the internal illumination light path of the optical engine, wherein the light inlet of the optical engine 200 is connected to the light outlet of the light source 100, and the light outlet of the optical engine 200 is connected to the lens 300. The light inlet and the light outlet of the optical machine 200 are usually located on different sides of the optical machine in a vertical relationship, where the vertical is a vertical in a spatial position relationship, and the different sides may be different sides of the housing of the rectangular solid light or different sides of the irregular three-dimensional structure.

Fig. 1C shows a schematic diagram of an optical path of a laser projection apparatus, which is shown as being divided into a light source 100, an optical engine 200, and a lens 300 according to optical functional parts. The light source 100 includes a red laser, a blue laser, a green laser, and a plurality of optical lenses for homogenizing and converging the laser beam. The light beam emitted from the light source 100 is incident to the optical engine 200, and usually the light guide is located at the front end of the optical engine 200 for firstly receiving the illumination light beam of the light source, and the light guide has the functions of mixing and homogenizing, and the outlet of the light guide is rectangular, and has a shaping effect on the light spot. The optical engine 200 further includes a plurality of lens groups, and the TIR or RTIR prism is used to form an illumination light path, and to inject the light beam to the light valve, which is a key core device, and to inject the light beam modulated by the light valve into the lens group of the lens 300 for imaging. Depending on the projection architecture, the light valve may comprise a wide variety, such as LCOS, LCD or DMD, in this example a DLP architecture is applied, the light valve being a DMD chip. In an ultra-short-focus projection apparatus, the lens 300 is an ultra-short-focus projection lens, and generally includes a refractive lens group and a reflective lens group for achieving a small projection ratio, such as less than 0.3.

And, referring to fig. 1A, a plurality of circuit boards 400 are disposed in a space enclosed by the optical engine 200, the lens 300 and another part of the whole casing, the plurality of circuit boards 400 include a power board, a TV board, a control board, a display board, etc., the plurality of circuit boards 400 are generally stacked, or a part of the plurality of circuit boards 400 may be disposed along a bottom surface of the whole casing and a part of the plurality of circuit boards 400 may be disposed along a side surface of the whole casing.

And, in the laser projection apparatus 10, a plurality of structures such as a sound, a fan, a heat dissipation system, and the like are also provided.

In the laser projection apparatus provided in the above embodiment, the optical engine 200 and the lens 300 are disposed along the first direction of the entire apparatus, and the entire apparatus is divided into two parts, one part can accommodate the light source, and the other part can accommodate the circuit board, where the two parts are respectively two parts as shown in fig. 1A. Such a division can be considered as separating the optical part and the electrical part. Although the optical part is also provided with a driver circuit in general, since the circuit parts such as the signal board, the power supply board, and the like are smaller in size and less complicated than the display board, the left half body can be considered as the optical part and the right half body as the circuit part. The different main bodies are separately arranged, so that the assembly and debugging of the whole machine are facilitated, and the respective design requirements of the optical part and the electrical part, such as heat dissipation, routing, electromagnetic testing and the like, are facilitated.

Moreover, in the laser projection apparatus provided in this example, the optical engine 200 and the lens 300 are disposed in the same direction, and a part of the lens group of the lens 300 extends into the optical engine 200, which is beneficial to reducing the volume of the optical engine and the lens after the two parts are assembled. And according to the light emitting characteristics of the reflective light valve, although the light beam of the light source 100 may be turned multiple times to finally enter the lens 300 due to different illumination light path configurations, the direction of the light beam emitted from the light outlet of the light source 100 and the direction of the light beam entering the lens 300 may be considered to have a perpendicular relationship in spatial position with respect to the direction of the optical axis of the light beam of the light source 100 and the direction of the optical axis of the lens 300. The light source 100, the optical engine 200 and the lens 300 are connected and assembled to form an L shape, which provides a structural basis for turning the optical axis of the light beam, and not only reduces the difficulty in designing the light path of the optical engine 200 incident to the lens 300. The laser projection equipment is compact in overall layout and simpler in light path architecture.

In the present example, the light source 100 is used to provide light source illumination for the light engine 200, and specifically, the light source 100 provides illumination beams for the light engine 200 by outputting three primary color illumination beams in a timed and synchronous manner.

The light source 100 may also be output in a non-time-sequential manner, and there are superimposed output periods of different primary colors, for example, red and green have superimposed output periods, which increases the proportion of yellow in a light beam period, and is beneficial to improving the brightness of an image, or red, green, and blue are simultaneously lit up in a part of periods, and three colors are superimposed to form white, so that the brightness of a white field can be improved.

And when other types of light modulation components are applied, in order to match with the three-piece type LCD liquid crystal light valve, the three primary colors of light in the light source part can be simultaneously lightened to output mixed white light. In this example, although the light source unit 100 outputs primary color lights of three colors in a time sequence, human eyes cannot distinguish colors of lights at a certain time according to the principle of mixing three colors, and still perceive mixed white light. The output of the light source section 100 is also commonly referred to as mixed white light.

In a laser projection apparatus, a light source is a main heat generating source, and a high-density energy beam of a laser irradiated on the surface of an optical lens also generates heat. The DMD chip has an area of a fraction of an inch, but is required to withstand the beam energy required for the entire projected image, and the heat generation is very high. On the one hand, the laser has the operating temperature who sets for, forms stable light output, compromises life and performance, and simultaneously, equipment is inside to contain a plurality of precision optical lens, and especially ultrashort burnt camera lens contains a plurality of lenses, if whole equipment inside high temperature, the heat gathering can cause the lens to take place "the temperature and float" the phenomenon in the camera lens, and imaging quality can seriously descend. And components such as circuit board devices are driven by electric signals, certain heat is generated, and each electronic device has a set working temperature. Therefore, good heat dissipation and temperature control are very important guarantees for proper operation of the laser projection device.

The above-mentioned complete machine part is provided with a liquid cooling circulation system in addition to the light source 100, the optical machine 200 and the lens 300, and includes a cold head, a water pump, a cold row 601 and a pipeline, and a phase change heat dissipation system, which includes a heat pipe, a heat dissipation fin 701, and a first fan 501, a second fan 502, a third fan 503 and a fourth fan 504 located at the air inlet of the complete machine. The liquid cooling circulation system and the phase change heat dissipation system are located in a space enclosed by the light source 100, the optical machine 200 and the lens 300.

Referring to fig. 1B, fig. 1B illustrates a heat dissipation path based on the laser projection device configuration provided in fig. 1A. The light source 100, specifically, a first fan 501 and a cold row 601 which are stacked are further disposed between a side of the light source housing where the red laser is installed and the whole housing. A second fan 502 is disposed in a heat dissipation path of the heat dissipation fin 701, and the second fan 502 and the first fan 501 are respectively located in different heat dissipation paths in the heat dissipation system of the whole machine along a first direction of the whole machine in parallel.

The optical engine 200, the lens 300, the third fan 503 and the fourth fan 504 enclose a space in which a plurality of circuit boards 400 are arranged.

As shown in fig. 1B, the laser projection apparatus of the present example has two main heat dissipation paths, path a and path B, depending on the air flow direction. The heat dissipation path a is mainly formed by heat dissipation of a red laser, an optical machine and a part of the circuit board in the light source, and the heat dissipation path b is mainly formed by heat dissipation of a blue laser, a green laser, a lens and a part of the circuit board.

The heat dissipation path a and the heat dissipation path b are two substantially parallel paths, in the above laser projection apparatus, the light source 100 is disposed at the left side of the whole apparatus, the optical engine 200 and the lens 300 are located at the middle of the apparatus, and the circuit board is disposed at the right side of the apparatus. The air flow is from left to right along both path a and path b. On the whole, blow to the flow direction mode of ray apparatus or camera lens and circuit board from the light source, can reach effectually carry out the rapid cooling heat dissipation to the light source, satisfy the microthermal control by temperature change requirement of laser light source, still compromise the heat dissipation to the lower part of control by temperature change requirement simultaneously, the air current that carries laser heat source heat capacity has carried on can also continue to blow to ray apparatus or camera lens, because the air current temperature is less than the temperature of ray apparatus or camera lens part, still can carry out the temperature exchange, dispel the heat to ray apparatus and camera lens, the circuit board region that the final flow direction is close to whole machine gas flow export orientation, carry away the regional heat of circuit board, discharge from the air outlet of complete machine.

In the heat dissipation path a, a first fan 501 is disposed at the air inlet of the whole machine, and a third fan 503 is correspondingly disposed at the air outlet of the whole machine, so as to guide the air flow of the heat dissipation path a, and the air flow flows through the heat dissipation device of a part of light sources, the optical engine and a part of circuit boards from upstream to downstream, and is finally discharged out of the housing.

In the heat dissipation path b, a second fan 502 is disposed near the air inlet of the whole machine, and a fourth fan 504 is correspondingly disposed at the air outlet of the whole machine, so as to guide the airflow of the heat dissipation path b, and finally discharge the airflow out of the housing after passing through the heat dissipation device, the lens, and a part of the circuit board from upstream to downstream.

Having multiple heat source components inside a laser projection device, the need for heat dissipation varies from component to component. For example, the laser light source, the DMD chip, and the lens, the circuit board, wherein the laser light source is the main source that generates heat of whole laser projection equipment, and the control requirement to the temperature is the highest. In this example, the light source 100 is a laser light source, and the included laser components of different colors have different operating temperature requirements. Wherein the working temperature of the red laser assembly is not higher than 50 ℃, and the working temperature of the blue laser assembly and the green laser assembly is not higher than 65 ℃. The working temperature of the DMD chip in the optical machine is usually controlled to be about 70 ℃, and the temperature of the lens part is usually controlled to be below 85 ℃. And the temperature control of different electronic devices is different for the circuit board part, and is usually between 80 ℃ and 120 ℃. Therefore, because the tolerance values of the optical component and the circuit part in the equipment to the temperature are different, and the working temperature tolerance value of the optical part is generally lower than that of the circuit part, the airflow is blown to the circuit part from the optical part, so that the two parts can achieve the purpose of heat dissipation and maintain the normal work of the two parts.

The structure of the three-color laser light source will be described with reference to the accompanying drawings, wherein fig. 2A is a schematic structural diagram of the light source 100 in fig. 1A.

As shown in fig. 2A, the light source 100 includes a light source housing 102, and a red laser assembly 110, a blue laser assembly 120, and a green laser assembly 130 mounted on different sides of the light source housing 102 to emit red laser light, blue laser light, and green laser light, respectively. The blue laser component 120 and the green laser component 130 are mounted in parallel on the same side surface, and are both perpendicular to the red laser component 110 in spatial position, that is, the side surface of the light source housing where the blue laser component 120 and the green laser component 130 are located is perpendicular to the side surface of the light source housing where the red laser component 130 is located, and both the side surfaces are perpendicular to the bottom surface of the light source housing 102 or the bottom surface of the whole housing 101. The mounting positions of the blue laser and the green laser are not limited to these, and the positions may be switched.

Referring to fig. 2B, which is a schematic diagram of an optical path of the light source 100, as shown in fig. 2B, the blue laser assembly 120 and the green laser assembly 130 are arranged in parallel, wherein the blue laser assembly 120 is disposed close to the red laser assembly 110, and the green laser assembly 130 is disposed far from the red laser assembly 110. The light emitting surface of the red laser element 110 faces the light outlet of the light source, i.e., the light beam emitted by the red laser element 110 can be directly output to the light outlet of the light source 100 without turning the light path.

The light beam emitted by the green laser component is emitted from the light outlet after three times of reflection, and the light beam emitted by the blue laser component is emitted from the light outlet after one time of transmission and one time of reflection. It can be seen that, in the schematic diagram of the above optical path principle, the optical path through which the red laser passes is the shortest, the optical path through which the green laser passes is the longest, and the reflection times through which the green laser passes are the greatest.

Referring to fig. 2A, the laser assemblies of any color output rectangular spots, and are vertically mounted on the side surface of the light source housing 102 along the long side direction of the respective rectangular spots.

The light source housing 102 includes a plurality of sides, a bottom surface and a top cover, and the plurality of optical lenses of the light source 100 are disposed on the bottom surface of the light source housing 102. In order to increase the heat dissipation area, the top cover of the light source housing 102 is fin-shaped. A plurality of windows are opened on the side surface of the light source housing 102 so as to mount the plurality of laser assemblies, and light beams emitted by the laser assemblies of any color are incident into the internal cavity of the light source 100 from the corresponding mounting windows, and form a light transmission path through a plurality of optical lenses.

Since the assembly structure of each of the three-color laser modules and the light source housing is substantially the same, for the sake of convenience of description of the connection relationship between the laser modules and the light source housing, the assembly structure of any one of the color laser modules will be described as an example.

The three-color Laser assembly is an MCL (Multi Chip Laser) type Laser assembly, that is, a plurality of light emitting chips are packaged on one substrate to form surface light source output. As shown in fig. 3A and fig. 3B, the MCL-type laser includes a metal substrate 1102, and a plurality of light emitting chips (not shown) are packaged on the metal substrate 1102, and the light emitting chips may be connected in series or may be driven in parallel according to rows or columns. The plurality of light emitting chips may be arranged in a 4X6 array, or may be arranged in other arrays, such as a 3X5 array, a 2X7 array, a 2X6 array, or a 4X5 array, where the overall light emitting power of the lasers in different numbers of arrays is different. Pins 1103 extend from both sides of the metal substrate 1102, and the pins are electrically connected to drive the light emitting chip to emit light. Covering the light-emitting face of the MCL laser, there is also provided a collimating lens group 1101, the collimating lens group 1101 being fixed, typically by gluing. The collimating lens set 1101 includes a plurality of collimating lenses, which generally correspond to the light emitting positions of the light emitting chips one by one to collimate the laser beams correspondingly.

As shown in fig. 3B, the MCL-type laser assembly further includes

PCB boards

1104a and 1104b disposed at the outer periphery of the MCL laser, and the

PCB boards

1104a and 1104b are parallel to or in the same plane as the light emitting surface of the laser, so as to drive the laser pins 1103 and provide driving signals for the laser. As shown in the figure, the circuit board is a flat structure, the two sides of the laser have pins 1103, the pins 1103 are respectively welded or plugged on the

circuit boards

1104a and 1104b on the side which is almost parallel to the plane where the laser is located, wherein the

pins

1104a and 1104b can be integrally formed and surround the outer side of the laser component substrate 1102, or the

pins

1104a and 1104b can also be two independent circuit boards, and the two circuit boards surround the laser component. Based on the design, the back of the laser component is a relatively flat copper substrate surface (heat sink) to form a heat dissipation and heat conduction surface, which is beneficial to contact with a heat dissipation or heat conduction structure with a relatively large contact area.

Referring to fig. 1A and 1B, a light source 100 is disposed near one side of the whole body housing, and a plurality of lasers of different colors are installed on the side of the housing 102. Wherein, the heat dissipation mode that the laser instrument of different colours adopted is different. Fig. 4A shows a schematic diagram of a heat dissipation system of a light source, and specifically, as shown in fig. 4A, a liquid cooling circulation system including a cold row 601 is disposed on one side surface of a light source housing 102, and a first fan 501 is disposed to cool the cold row by air cooling. On the other side surface of the light source housing 102, which is perpendicular to the side surface, a heat conducting cavity plate 702 and heat dissipating fins 701 are disposed, and the second fan 502 is used to conduct heat conduction and dissipate heat from the side surface of the light source housing.

Fig. 4B is an exploded view of fig. 4A. Specifically, referring to fig. 4B, in the present example, a red laser assembly 110 is mounted on a side surface of the light source housing opposite to the light outlet of the light source 100, and a blue laser assembly 120 and a blue laser assembly 130 are mounted on the other side surface perpendicular to the side surface on which the red laser is mounted.

Wherein, the back of the red laser 110 is attached with a cold head 602, and heat exchange is carried out through a liquid cooling circulation system. The blue laser 120 and the green laser 130 conduct heat and dissipate heat through the heat pipes, the back surfaces of the blue laser 120 and the green laser 130 are both attached to one surface of the heat conducting cavity plate 602, the other surface of the heat conducting cavity plate 602 is connected with a plurality of heat pipes 603, the condensation ends of the plurality of heat pipes 603 are communicated with the inner cavity of the heat conducting cavity plate 602, and the hot ends of the plurality of heat pipes 603 extend into the heat dissipation fins 701. Namely, the red laser adopts a liquid cooling heat dissipation mode, and the blue laser and the green laser adopt a phase change heat pipe heat dissipation mode.

Referring to the light source heat dissipation system shown in fig. 4B and the liquid cooling circulation system shown in fig. 5A, specifically, the red laser assembly 110 is connected to the cold head 602 for heat dissipation by liquid cooling. A first fan 501 and a cold row 601 which are stacked are further arranged between one side face of the light source shell, where the red laser is installed, and the whole machine shell, in a liquid cooling circulation system, the cold head 602 takes away heat of the heat source part and flows back to the cold row 601, the cold row is cooled, and cooled coolant, such as water which is commonly used, flows back to the cold head again, and then heat conduction is performed on the heat source in a circulation mode. In the liquid cooling circulation system, a pump 603 is further included for driving the cooling liquid in the liquid cooling circulation system to keep flowing.

And, in the liquid cooling circulation system of the laser projection apparatus of this example, the liquid replenishing device 604 is further included for replenishing liquid to the liquid cooling circulation system, so that the liquid pressure in the whole liquid cooling circulation system is greater than the external pressure of the system, and thus external air does not enter the inside of the circulation system due to volatilization of the cooling liquid or poor tightness of the pipe joint, which causes internal noise of the circulation system, and even causes cavitation to damage the device.

Compared with an air cooling heat dissipation system, the liquid cooling circulation system is flexible, the volume of the cold head and the cold row is smaller than that of the traditional heat dissipation fin, and the selection of the shape and the structure position of the liquid cooling circulation system is more diversified. Because the cold head and the cold row are communicated through the pipeline and are a circulating system all the time, the cold row can be arranged close to the cold head and also can have other relative position relations, and the space of the laser projection equipment determines the cold row.

Because in the liquid cooling circulation system, the cold row is the main heat dissipation part, its volume is also great usually, in this example, the cold row sets up in a department of complete machine casing, and parts such as pump, fluid infusion ware are less relatively, and the position that can place is nimble relatively, can save more spaces and place the fan. For example, as shown in fig. 5A, a fifth fan 505 is provided in parallel with the cold row 601, and the fifth fan 505 is located in the heat radiation path b.

The liquid cooling heat dissipation is that heat is transferred by the contact of a cold head and a heat source, the heat is transferred back to the cold row by cooling liquid, and the cooling liquid is circulated to the cold head after being cooled by the cold row, so the heat absorption performance of the cold head is very important for the working efficiency of a liquid cooling heat dissipation system.

In this example, a cold head structure is provided having good heat absorption properties. As shown in fig. 5B, the inside of the cold head is schematically illustrated, a cover (not shown) is provided outside the cold head, after the cover is disassembled, the cold head has a heat conducting plate 6021, one surface of the heat conducting plate 6021 contacts with the back surface of the red laser, the other surface of the heat conducting plate 6022 is provided with a dense fin 6022, and a flow channel of cooling liquid is provided inside the fin 6022, so that the flow path of the cooling liquid can be increased, thereby increasing the heat absorbed by the cold head, facilitating the heat at the red laser to be taken away, and rapidly cooling the cold head. Generally, the height-to-width ratio of the fin is not higher than or equal to 10, such as in a specific implementation, the thickness is not higher than or equal to 0.4 mm, and the height of the fin is 4 mm.

In this example, the operating temperature of the red laser is not higher than 50 ℃, and due to the liquid cooling heat dissipation mode, compared with the traditional air cooling heat dissipation mode, the temperature can be rapidly controlled at 50 ℃, for example, about 45 ℃, so that the good working performance of the red laser is ensured.

For the blue laser and the green laser arranged at the other side of the light source housing, referring to fig. 4a,4b and 6A, a phase-change heat pipe heat dissipation system is used for heat dissipation.

As shown in fig. 4A, the heat dissipation structure of the light source is schematically illustrated, the blue laser assembly 120 and the green laser assembly 130 are disposed side by side on one side of the light source housing, and the back surfaces of the blue laser assembly and the green laser assembly are connected to the heat conducting cavity plate 702 for heat conduction. The heat radiation fins 601 are disposed opposite to the sides of the blue laser module and the green laser module mounted on the light source housing. Referring to the exploded view of the light source heat dissipation structure shown in fig. 4B, specifically, the blue laser assembly 120 and the green laser assembly 130 are connected to the heat dissipation fins 701 through the heat pipe 703, so as to conduct heat to the heat dissipation fins 701. As shown in fig. 4B, the heat dissipation fins 701 include two first

heat dissipation fins

7011,7012, which are respectively used for inserting two sets of heat pipes, and the two sets of heat pipes respectively conduct heat of the blue laser component and the green laser component to the heat dissipation fins.

In one embodiment, as shown in fig. 6A, the heat conducting cavity plate 702 includes a first heat conducting area 7021 and a second heat conducting area 7022 corresponding to the back areas of one and the other of the blue laser module 120 and the green laser module 130, respectively, specifically, one side of the first heat conducting area 7021 is in contact with the back of the blue laser module 120, and the other side thereof is connected to a plurality of heat pipes 703, the plurality of heat pipes 703 are inserted into the first heat dissipating fins 7011, and similarly, one side of the second heat conducting area 7022 is in contact with the back of the green laser module 130, and the other side thereof is connected to the plurality of heat pipes 703, and the plurality of heat pipes 703 are inserted into the second heat dissipating fins 7012. Thus, the first

heat dissipation fins

7011 and 7012 are used to dissipate heat from the blue laser assembly 120 and the green laser assembly 130, respectively.

In one implementation, the number of heat pipes plugged into the first heat sink fins 7011 is the same as the number of heat pipes plugged into the second heat sink fins 7012. The first heat conduction area 7021 and the second heat conduction area 7022 on the heat conduction cavity plate are also respectively communicated with the same number of heat pipes. In this example, the number of the heat pipes inserted into the first

heat dissipation fins

7011,7012 is 6, and the number of the heat pipes may also be adjusted according to different heat dissipation requirements, which is not limited herein. And the diameter of the heat pipe 703 is 5 to 8mm, and the length is 80 to 110mm. In this example, the operating temperature control of the blue laser assembly and the green laser assembly is the same, and the arrangement of the heat pipes and the corresponding heat dissipation fins is the same.

As shown in fig. 6A, the heat pipe 703 is a straight heat pipe, and the heat pipe 703 is vertically connected to the heat conducting cavity plate 702. Specifically, the heat pipe is welded to the heat conducting cavity plate by friction welding. In this example, the heat conducting cavity plate 702 is a hollow cavity, and can be made of copper substrate C1100. Fig. 6C shows a schematic cross-sectional view of an angle of the heat conducting cavity plate. As can be seen, the thermally conductive cavity plate 702 is comprised of an outer wall 7023 and an inner cavity 7024. In specific implementation, the thickness of the heat conducting cavity plate can be selected to be larger than 3mm, and the thickness of the inner wall is larger than or equal to 1mm. In specific implementation, the thickness of the inner cavity is 0.8mm to 1.5mm.

Because the heat pipe is a closed system with liquid inside, heat conduction is realized through liquid gas-liquid change. As shown in fig. 6B, a cross-sectional view of an assembly structure of heat dissipation fins, heat pipes and heat conduction cavity plates is provided, wherein a plurality of through holes are formed in the heat dissipation fins for inserting a plurality of heat pipes. Radiating fin 701 is close to blue laser subassembly and green laser subassembly setting, and many heat pipes can not buckle, and during the disect insertion radiating fin, straight type heat pipe does benefit to the reduction of transmission resistance among the inside gas-liquid change of heat pipe, does benefit to and improves heat conduction efficiency.

A plurality of heat pipes 703 are directly inserted into the heat dissipation fins 701, and evaporation ends of the heat pipes 703 are communicated with the inner cavity 7024, so that the inner cavity of the heat conduction cavity plate 702 is communicated with the evaporation ends of the heat pipes 703, a flat evaporation cavity is formed inside the heat conduction cavity plate, and the phase change material circulating in the heat pipes 703 can also enter the inner cavity 7024. When entering the heat exchange, become gas by liquid behind the liquid absorption laser instrument subassembly of inner chamber 7024 inside the heat, transmit to the condensation end of heat pipe 703, the condensation end of heat pipe 703 is connected through the welding mode with

first radiating fin

7011 or 7012, the inside gas of heat pipe 703 condensation end is refrigerated and is become liquid, capillary force through the inside pipeline of heat pipe, liquid gets back to in the intercommunication cavity that evaporating end and inner chamber 7024 formed once more, change through liquid gas once more and carry out thermal absorption, carry out circulating cooling like this to blue laser instrument subassembly and green laser instrument subassembly.

In the above embodiment, compare in traditional use heat pipe and heat conduction piece be connected, the mode that heat conduction piece and laser instrument subassembly or laser instrument subassembly's heat sink are connected, this technical scheme adopts heat conduction chamber board, and the inner chamber of heat conduction chamber board communicates with the evaporation end of heat pipe, forms the evaporation end of a big plane, greatly increased the area of evaporation end, accelerated the thermal absorption rate in the liquid-gas change, can be quick absorb away the heat, to laser instrument subassembly rapid cooling. In the mode, the number of the heating pipes and the volume of the heat conducting cavity plate are not required to be increased, and the purposes of efficient heat dissipation and small volume are achieved.

And, in this embodiment, the heat pipe is straight heat pipe, and is perpendicular with the heat conduction cavity plate surface, also inserts in the radiating fin perpendicularly, can carry out the transmission of heat with the shortest route almost, reduces the heat evaporation to the environment, and quick, send almost all absorbed heat to the cold junction and cool off, also improved radiating efficiency greatly. And because the straight heat pipe is more directly connected and assembled with the radiating fins and the heat conducting cavity plate, compared with the traditional heat pipe with bending and angle conditions, the assembled volume of the heat pipe is more compact.

In specific implementation, the single-chip thickness of the first

heat dissipation fins

7011 and 7012 is 0.4 to 0.6mm, and the fin pitch is 1.5 to 2.5mm, so that airflow can pass through the fins to take away heat.

The second fan 502 may be located upstream of the heat dissipation fins 701, or located downstream of the heat dissipation fins 701, so as to achieve the purpose of making the airflow flow through the whole heat dissipation fins 701.

In this example, the second fan 502 is located between the first heat dissipation fin 7011 and the second heat dissipation fin 7012, and blows wind to the heat dissipation fins to take away heat from the heat dissipation fins, thereby cooling the blue laser and the green laser. Because the first

heat dissipation fins

7011 and 7012 are respectively disposed corresponding to the blue laser assembly 120 and the green laser assembly 130, the blue laser assembly 120 and the green laser assembly 130 also have a distance therebetween when mounted on the light source housing, and the thickness of the second fan 502 may be not greater than or equal to the distance therebetween, so as to enable the heat conduction area on the back side of the laser assembly to be thermally conductive corresponding to the heat pipe, and the distance area therebetween corresponds to the non-heat pipe disposition area of the heat conduction cavity plate 702, and since no heat conduction is performed, a gap may be left for disposing the thin fan.

In specific implementation, the thickness of the second fan is from 20mm to 40mm.

The second fan 502 is located upstream of the heat dissipation path b. The airflow generated by the second fan 502 is perpendicular to the insertion direction of the heat pipe, and the airflow is blown from the first heat dissipation fins 7011 to the second heat dissipation fins 7012. Because the second fan is located between the first

heat dissipation fins

7011 and 7012, compared with the fan that is disposed on one side of the two heat dissipation fins, the difference between the air volume and the air speed obtained by each heat dissipation fin is small, the heat dissipation amounts of the two heat dissipation fins are basically equal, and a uniform heat dissipation effect is easily obtained. And if the fan sets up in one side of two radiating fin, for example upper reaches or low reaches, can have whole radiating fin thicker, when wind blows to radiating fin, the wind pressure can reduce relatively obviously for the radiating fin part's that is located the downstream side heat dissipation efficiency reduces, and radiating efficiency on the whole can reduce.

In this embodiment, the temperature control requirements of the blue laser component and the green laser component are the same, the temperature is required to be controlled below 70 ℃, the corresponding heat pipes and the corresponding heat dissipation fins are respectively arranged on the blue laser component and the green laser component, and the fan is arranged between the two heat dissipation fins, so that the provision of a relatively balanced heat dissipation air volume and air pressure is facilitated, and the requirement of heat dissipation with two equivalent temperature control requirements is also satisfied.

In one implementation, the area of the heat conducting cavity plate 702 is larger than the sum of the contact areas with the back surfaces of the blue laser assembly and the green laser assembly, so that the heat conducting cavity plate 702 is a flat plate-shaped evaporation end, the contact area with the laser assembly as a heat source is larger, and the heat exchange area is also larger.

In one implementation, as shown in fig. 4B and fig. 5A, a fifth fan 505 is further disposed upstream of the second fan 502, the fifth fan 505 is disposed on one side of the whole machine in parallel with the cold air exhaust and fan of the liquid cooling heat dissipation system, and the fifth fan 505, the second fan 502 and the fourth fan 504 are located in the heat dissipation path B together, so that the wind pressure flowing through the heat dissipation fins 701 and other parts in the heat dissipation path B can be increased, and the wind volume can be increased. The fifth fan 505 blows air from the air inlet of the complete machine to the first heat dissipation fins 7011 first and then to the second heat dissipation fins 7012, and the second fan 502 is an air suction fan for the first heat dissipation fins 7011 and an air blowing fan for the second heat dissipation fins 7012. The heat of the first heat dissipation fin 7011 and the second heat dissipation fin 7012 is taken away under the action of the fifth fan 505 and the second fan 502, blown to the lens and a part of the circuit board of the whole projection apparatus, and finally discharged outside the whole projection apparatus through the fourth fan.

For the heat dissipation path a, as shown in fig. 1B, the first fan 501 cools the cold air discharge 601 and blows an air flow carrying a certain amount of heat to the optical machine 200. The light valve is the primary heat source component in the light engine 200. As mentioned above, since the temperature of the red laser component is controlled between 45 ℃ and 50 ℃, for example, when the temperature is controlled to be 45 ℃, a liquid cooling heat dissipation manner is used, the difference between the surface temperature of the cold row and the surface temperature of the cold head is controlled to be 1~2 ℃, that is, if the surface temperature of the cold head is 45 ℃, the surface temperature of the cold row is 43 ℃ to 44 ℃, wherein the surface temperature of the cold head refers to the temperature of the contact surface between the cold head and the laser component heat sink. Specifically, the first fan 501 sucks in air at an ambient temperature, the ambient temperature is usually 20 to 25 ℃, the cold air is cooled and radiated to the cold row, and the surface temperature of the cold row is reduced to 43 ℃. Therefore, the temperature of the hot air flowing from the light source part to the optical machine part is not higher than 60 ℃ and is still lower than the working temperature required by the light valve, and for the radiator of the light valve, the air flow is still cold air flow and can be used for radiating.

Specifically, as shown in fig. 7, the light valve DMD chip dissipates heat through a heat sink, the heat sink may be disposed at the illustrated position C1 or C2, and after the airflow from the upstream first fan 501 flows through the heat sink, the heat on the heat sink is taken away, so as to cool the light valve. The airflow continues to flow through a part of the circuit board along the path a, and is finally exhausted outside the whole housing under the combined action of the first fan 501 and the third fan 503 at the air outlet.

For path B, in the laser projection apparatus shown in fig. 1B, a fifth fan 505 (not shown in fig. 1B) may be disposed upstream of the heat dissipation fins 701, and the lens 300 may be disposed downstream of the heat dissipation fins 701. Because the working temperature of the blue laser component and the green laser component is below 65 ℃, the temperature of the heat dissipation fins 701 needs to be 62-63 ℃, and the temperature difference between the temperature of the heat dissipation fins and the heat sink of the laser component is 2~3 ℃. The heat dissipation fins 701 have multiple sets of parallel air channels, the first air flow passes through the surfaces of the heat dissipation fins and the internal air channels to form a second air flow, the second air flow is blown to the lens 300, and the second air flow can flow through the space around the lens 300 shell and the bottom of the lens 300 shell to take away heat on the surface of the lens shell.

Similarly, because the working temperature of the lens is controlled to be 85 ℃, the temperature of the radiating fins is 63 ℃, and is still lower than the working temperature of the lens, the second air flow flowing through the radiating fins is still cold air flow relative to the lens, and heat dissipation can be utilized. The working temperature of the circuit board is generally higher than the working control temperature of the lens, so that the airflow after the heat dissipation of the lens is still cold airflow relative to most of the circuit boards, and can still continuously flow through the circuit boards for heat dissipation.

In the heat dissipation path a or the heat dissipation path b, the airflow basically flows in a linear shape and rarely has roundabouts and turns, which can reduce the resistance of the airflow flow, facilitate the airflow to quickly flow away at a faster flow speed after carrying heat, and facilitate the heat dissipation of the heat source component.

In this example, in the heat dissipation path a, the cold row, the light valve, and the circuit board have gradually-raised working temperature thresholds, and in the heat dissipation path b, the heat dissipation fins, the lens, and the circuit board have gradually-raised working temperature thresholds.

In another embodiment, the heat dissipation fins can increase the heat dissipation capacity by performing structural modification on the fin surface to increase the heat dissipation area or increase the flow velocity of wind in order to increase the heat transfer coefficient.

In the laser projection apparatuses provided in the above embodiments, the emission power of the red laser package may range from 24w to 56w, the emission power of the blue laser package may range from 48w to 115w, and the emission power of the green laser package may range from 12w to 28w. Preferably, the red laser assembly has an emission power of 48W, the blue laser assembly has an emission power of 82W, and the green laser assembly has an emission power of 24W. The three-color laser adopts the MCL type laser assembly, and compared with the BANK type laser, the three-color laser has the advantage that the volume is greatly reduced under the condition of outputting the same luminous power.

As described above, in the laser projection apparatus, the heat dissipation requirement of the light source 100 is the most strict, and is a portion of the entire apparatus where the operating temperature is relatively low. Specifically, the operating temperature of the red laser assembly is lower than the operating temperatures of the blue and green laser assemblies, which is determined by the light emission principle of the red laser. The blue laser and the green laser are generated by using a gallium arsenide light emitting material, and the red laser is generated by using a gallium nitride light emitting material. The red laser has low light emission efficiency and high heat generation. The temperature requirements of the red laser luminescent material are also more severe. Therefore, when the light source component composed of the three-color laser is radiated, different radiating structures are required to be arranged according to the temperature requirements of different laser assemblies, the laser of each color can be ensured to work in a better state, the service life of the laser assemblies is prolonged, and the light emitting efficiency is more stable.

The air cooling heat dissipation mode can control the temperature difference between the hot end and the cold end of the heat source to be about 3 ℃, and the temperature difference control of the liquid cooling heat dissipation can be more accurate and smaller in range, such as 1~2 ℃. The red laser component with the lower working temperature threshold value adopts a liquid cooling heat dissipation mode, the blue laser component with the relatively higher working temperature threshold value and the red laser component adopt an air cooling heat dissipation mode, the red laser component can be cooled by lower heat dissipation cost under the condition of meeting the requirement of the working temperature of the red laser, and the requirement on the rotating speed of the fan can be reduced by meeting the requirement on the smaller temperature difference. But the cost of the components of the liquid cooling heat dissipation method is higher than that of the air cooling heat dissipation method.

Therefore, in the laser projection device in the example, the mode of liquid cooling and air cooling mixed heat dissipation is adopted for the heat dissipation of the light source, so that the working temperature control of different laser assemblies can be met, and the laser projection device is economical and reasonable.

Through above-mentioned combination heat radiation structure, can carry out high-efficient heat dissipation to the light source part to guarantee the normal work of the laser instrument subassembly homoenergetic of every colour in the three-colour laser light source part. The light source emits three-color laser, provides high-quality illuminating light beams, and projects to form a projection image with high brightness and good color.

In the laser projection apparatus provided in this embodiment, as shown in the schematic diagram of the light path principle of the light source shown in fig. 2B, the green laser light emitted by the green laser assembly 130 is reflected by the first light combining mirror 106 and then enters the second light combining mirror 107, the blue laser light emitted by the blue laser assembly 120 is transmitted through the second light combining mirror 107, and the green laser light is reflected by the second light combining mirror 107 and output, so that the blue laser light and the green laser light can be combined and output through the second light combining mirror 107.

The output direction of the blue laser and the green laser combined and output by the second light combining mirror 107 is perpendicular to the output direction of the red laser emitted by the red laser assembly 110, and has a junction, a third light combining mirror 108 is arranged at the junction of the three light beams, and the third light combining mirror 108 transmits the red laser and reflects the green laser and the blue laser. After passing through the third light combining mirror 108, the three-color laser beams are combined to form a light beam, which is incident to the homogenizing element 109, and is emitted from the light source light outlet after the light spot is reduced by the converging lens assembly 111.

The first light-combining mirror is a reflector, the second light-combining mirror and the third light-combining mirror are dichroic sheets.

As shown in the schematic optical path diagram of fig. 2B, the light emitting surface of the red laser assembly 110 faces the light outlet of the light source, and the red laser light is output along the light emitting surface of the red laser assembly, passes through the homogenizing element 109 and the converging lens group 111, and then exits from the light outlet. For the blue laser, the blue laser is transmitted once, and then enters the homogenizing element 109 and the focusing lens group 111 after being reflected once, and then exits from the light outlet, and the green laser enters the homogenizing element 109 and the focusing lens group 111 after being reflected three times, and then exits from the light outlet. It can be seen that the light paths of the red laser light are shorter than those of the blue laser light and the green laser light before being output from the light source light outlet, so that the light loss generated by the red laser light during the light path transmission can be reduced. And, under the condition that the influence of the optical path on the optical loss is not considered, after the red laser passes through the third light combining mirror, the light energy can reach about 97% × 1=97%, and it should be noted that, in the calculation of the light energy efficiency of the red laser, the influence of the transmittance and the reflectance of the optical lens is only considered when the divergence angle of the red laser is large and the large-angle light loss exists.

Through the arrangement of the three-color laser assemblies, heat dissipation is favorably carried out according to different heat dissipation requirements of the red laser assemblies, the blue laser assemblies and the green laser assemblies. The red laser component is sensitive to temperature, the working temperature is usually controlled below 50 ℃, the working temperature of the blue laser component and the working temperature of the green laser component are higher than that of the red laser component, the blue laser component and the green laser component have obvious temperature difference and are usually controlled below 65 ℃, and therefore, the blue laser component and the green laser component which have the same temperature control requirement are arranged together, and heat dissipation is facilitated through a shared heat dissipation structure. And the red laser assembly is independently arranged at other positions of the light source shell and is separated from the blue laser assembly and the green laser assembly by a certain distance, so that the heat radiation of the blue laser assembly and the green laser assembly serving as high-temperature heat sources to the red laser assembly serving as a low-temperature heat source can be reduced, and the heat burden of the red laser assembly is reduced.

The laser assemblies all adopt MCL type laser assemblies, and compared with the traditional BANK type laser assemblies, the MCL type laser assemblies are obviously smaller in size, so that in the embodiment, as shown in the figure 1A, the light source of the laser projection equipment is obviously reduced in structural size compared with the traditional BANK type laser assemblies, more space can be reserved near the light source, convenience is brought to heat dissipation design, for example, a radiator is provided, the placement of a fan is more flexible in position selection, and structures such as a circuit board can be arranged, and the length of the whole machine structure in a certain direction or the size of the whole machine can be favorably reduced.

In one or more embodiments, the laser light source is cooled by the liquid cooling and phase change heat pipe system, so that different working temperature requirements of the red laser component and the blue-green laser component can be met; and the laser light source is positioned at the upstream of the two parallel heat dissipation paths, the heat dissipation airflow can respectively flow from the part with the lower working temperature threshold value to the part with the higher working temperature threshold value, the heat dissipation of the heat source parts can be sequentially performed in each heat dissipation path, the working heat dissipation requirements of the heat source parts can be met, the heat dissipation efficiency of the whole laser projection equipment is high, and meanwhile, the whole laser projection equipment is compact in structural layout and high in space utilization rate.

Specifically, the red laser component and the laser components of other two colors in the light source are respectively located in two heat dissipation paths, and can respectively dissipate heat of the laser components with different temperature control requirements in the light source, so that the heat dissipation efficiency of the laser components is improved, the temperature control of the laser components with different colors is facilitated, a plurality of projection equipment components located in different heat dissipation paths can be enabled to have independent heat dissipation paths, and the heat dissipation efficiency is also improved.

In a plurality of above-mentioned embodiments, liquid cooling system and phase transition heat pipe cooling system set up in the space that light source, ray apparatus, camera lens three enclose, cooperate with projection system's optical function part, and the overall arrangement is compact, and space utilization is high, when realizing high-efficient heat dissipation, can also realize the miniaturization of structure.

In the phase change heat pipe cooling system for cooling the blue laser component and the green laser component, the traditional heat conducting plate is improved to form a heat conducting cavity plate communicated with the heat pipe, so that the area of the evaporation end of the heat pipe is increased, the heat absorption capacity and the heat exchange efficiency of the heat pipe are greatly increased, the volume of a heat radiating fin is not required to be increased, higher cooling efficiency can be achieved, the rapid temperature control is facilitated, and the volume of the cooling system can be smaller. And the heat pipe and the heat dissipation fins are respectively arranged corresponding to the blue laser component and the green laser component, so that the blue laser component and the green laser component can be respectively subjected to heat dissipation, and the fan is arranged between the respective heat dissipation fins of the blue laser component and the green laser component, so that the contribution degrees of the fan to the two heat dissipation fins are equivalent, the consistent heat dissipation effect is convenient to achieve, and the temperature control levels of the blue laser component and the green laser component are basically consistent.

Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the invention has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and these modifications or substitutions do not depart from the spirit of the corresponding technical solutions of the embodiments of the present invention.

Claims

1. A laser projection device is characterized by comprising a laser source, an optical machine and a lens which are sequentially connected along a light beam transmission direction in a whole machine shell, wherein a red laser component is arranged on one side surface of the laser source shell, and a blue laser component and a green laser component are arranged on the other side surface which is vertical to the installation side surface of the red laser component;

the back of the red laser component is attached with a cold head and radiates heat through a cold row;

the back surfaces of the blue laser assembly and the green laser assembly are attached to one surface of a heat conduction cavity plate, the other surface of the heat conduction cavity plate is connected with a plurality of heat pipes, and the heat pipes extend into the heat dissipation fins;

a first fan is arranged corresponding to the cold row, the airflow of the first fan flows through the cold row and then is blown to the optical machine and the circuit board in sequence,

and second fans are arranged corresponding to the radiating fins, and airflow of the second fans flows through the radiating fins and then sequentially blows towards the lens and the circuit board.

2. The laser projection device as claimed in claim 1, wherein a third fan is disposed at the air outlet of the whole device for exhausting the air flow passing through the cold air exhaust, the optical engine and the circuit board out of the whole device housing.

3. The laser projection device as claimed in claim 1, wherein a fourth fan is disposed at the air outlet of the whole device for exhausting the air flow passing through the heat dissipating fins, the lens and the circuit board out of the whole device housing.

4. The laser projection device of claim 1, wherein the heat conducting cavity plate has an inner cavity, and the evaporation ends of the plurality of heat pipes communicate with the inner cavity of the heat conducting cavity plate.

5. The laser projection device of claim 1, wherein the plurality of heat pipes are straight heat pipes and are perpendicular to a connection surface of the thermally conductive cavity plate.

6. The laser projection device of claim 1, wherein the thermally conductive cavity plate has a first thermally conductive area and a second thermally conductive area corresponding to a back area of one and the other of the blue laser assembly and the green laser assembly, respectively, the first and second thermally conductive areas each having a plurality of heat pipes connected thereto.

7. The laser projection device of claim 6, wherein the number of the heat dissipation fins is two, and the two heat dissipation fins include a first heat dissipation fin and a second heat dissipation fin, and the first heat dissipation fin and the second heat dissipation fin are used for plugging a plurality of heat pipes arranged corresponding to the first heat conduction area and the second heat conduction area.

8. The laser projection device of claim 7, wherein the second fan is located between the first and second heat fins.

9. The laser projection device as claimed in claim 6, wherein a fifth fan is disposed at the air inlet of the whole device corresponding to the heat dissipation fin, and the fifth fan is located upstream of the second fan.

10. The laser projection device of any one of claims 1 to 9, wherein the laser projection device satisfies at least one of:

the working temperature of the red laser component is not higher than 50 ℃;

the operating temperature of the blue laser assembly and the green laser assembly is not higher than 70 ℃.